Three-layer indirect evaporative cooling elastic intelligent calculation center
By using indirect evaporative cooling air conditioners to dissipate heat in each layer in the three-layer indirect evaporative cooling layout of the data center, the problem of large number and complex layout of the traditional data center is solved, and more efficient refrigeration effect and energy saving are achieved.
Patent Information
- Application Number
- CN202411558014.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-04
- Publication Date
- 2025-03-25
AI Technical Summary
The evaporative cooling units in traditional data centers are large in number and complex in layout, resulting in poor refrigeration results and serious energy waste.
A three-layer indirect evaporative cooling layout is adopted, including a first-layer computer room, a second-layer power room and a third-layer computer room. Indirect evaporative cooling air conditioning is used to dissipate heat on each layer, reducing the energy transfer between the external circulating hot air and the cold air.
It achieves a more efficient refrigeration effect, reduces energy consumption, and has a low building area occupies a single cabinet, which is better than traditional solutions.
Smart Images
Figure CN119697939A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of data center process layout, and in particular to a three-layer indirect evaporative cooling elastic intelligent computing center. Background Art
[0002] The process layout of a data center involves the building form. For example, how to deal with the relationship between data center process equipment (servers, switches, storage devices, etc.) and power equipment (power supply and distribution equipment, air-conditioning equipment, etc.), the relationship between equipment operation and personnel and logistics, and how to save energy while meeting production needs are the main issues that need to be addressed in the process layout of a data center.
[0003] At the same time, the equipment in the data center generates a lot of heat when it is running. In order to ensure the normal operation of the equipment, the room needs to be cooled to keep it working at a stable temperature and humidity. The cooling capacity of the evaporative cooling unit used in the data center is usually 200-300kw. In order to meet the cooling requirements of the data center, a data center with 3,000 cabinets often needs to be equipped with more than 100 evaporative cooling units with a cooling capacity of 200-300kw. Such a large number of evaporative cooling units puts high demands on their process layout and installation.
[0004] In the traditional data center structure design, the external circulating hot air exhausted by the air-conditioning unit can easily transfer energy with the external circulating cold air, thereby increasing the temperature of the external circulating cold air, which should be at a lower temperature, and causing the air conditioning cooling effect to decrease. This not only wastes energy but also has a poor cooling effect. Summary of the invention
[0005] In order to solve or partially solve the problems existing in the related art, the present application provides a three-layer indirect evaporative cooling elastic intelligent computing center.
[0006] A three-story indirect evaporative cooling elastic intelligent computing center in the present application includes a room body, which includes a first-story computer room, a second-story power room, and a third-story computer room from bottom to top; the first-story computer room and the third-story computer room both include cabinets; the indirect evaporative cooling air conditioners for dissipating heat emitted by the cabinets in the first-story computer room are arranged on both sides of the outside of the first-story computer room, and the indirect evaporative cooling air conditioners for dissipating heat emitted by the cabinets in the third-story computer room are arranged on the outside of the top of the third-story computer room; the second-story power room is provided with a number of small power battery rooms and high and low voltage distribution rooms.
[0007] Furthermore, the first-floor machine room, the second-floor power room, and the third-floor machine room are connected by a staircase walkway.
[0008] Furthermore, the power battery room and the high-voltage distribution room in the second-floor power room both use fluorine pump air conditioners.
[0009] Furthermore, part of the indirect evaporative cooling air conditioners for dissipating heat emitted by the cabinets in the three-story computer room are replaced by dry coolers and liquid cooling.
[0010] Furthermore, the three-story machine room includes a transmission machine room.
[0011] Beneficial effects of this application:
[0012] 1. The single cabinet in this application occupies a building area of less than 7 square meters, which is at the national leading technical level.
[0013] 2. The three-layer indirect evaporative cooling unit structure does not require an outdoor unit platform, which improves the heat exchange efficiency of the outdoor unit and has a better energy-saving effect.
[0014] 3. The structure of the power room sandwiched between the upper and lower machine rooms ensures the shortest power supply route and the lowest voltage drop.
[0015] 4. The overall cost is the best, lower than traditional water-cooled air conditioners and other indirect evaporative cooling layout solutions. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The above and other objects, features and advantages of the present application will become more apparent through a more detailed description of exemplary embodiments of the present application in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments of the present application.
[0017] Figure 1 It is a schematic diagram of the first floor plan of the data center in this application;
[0018] Figure 2 This is a schematic diagram of the second floor of the data center in this application;
[0019] Figure 3 This is a three-story floor plan diagram of the data center in this application;
[0020] Figure 4 It is a schematic diagram of the rooftop floor plan of the data center in this application;
[0021] Figure 5 It is a schematic diagram of the facade structure of the data center in this application. DETAILED DESCRIPTION
[0022] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.
[0023] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.
[0024] Example
[0025] like Figure 5 As shown, a three-story indirect evaporative cooling elastic intelligent computing center in the present application includes a room body, and the room body is composed of a first-story computer room, a second-story power room, and a third-story computer room from bottom to top; the first-story computer room and the third-story computer room both include cabinets; the indirect evaporative cooling air conditioners corresponding to the heat dissipation of the cabinets in the first-story computer room are arranged on both sides of the outside of the first-story computer room, and the indirect evaporative cooling air conditioners corresponding to the heat dissipation of the cabinets in the third-story computer room are arranged on the outside of the top of the third-story computer room; a number of small power battery rooms and high and low voltage distribution rooms are arranged in the second-story power room.
[0026] Furthermore, the first-floor machine room, the second-floor power room, and the third-floor machine room are connected by a staircase walkway.
[0027] Furthermore, part of the indirect evaporative cooling air conditioners for dissipating heat emitted by the cabinets in the three-story computer room are replaced by dry coolers and liquid cooling.
[0028] Furthermore, the three-story machine room includes a transmission machine room.
[0029] Specifically, Figure 1 Shown is a schematic diagram of the first floor plan of the data center in this application (673 computer rooms, to be put into use in the future). The communication computer rooms all use wind-side indirect evaporative cooling air conditioning. The self-use computer room is designed as a 7KW general computing room, which has a larger power reserve than the actual operating power. The total designed power of the computer building has a power reserve of about 40% compared to the current operating power.
[0030] Specifically, Figure 2 The figure shows the second floor plan of the data center under application. Both the power battery room and the high-voltage distribution room use fluorine pump air conditioners. The main load of external city electricity is about 14,000 KW, and the maximum access capacity is 26,000 KVA. The total capacity meets the expansion needs of the intelligent computing center.
[0031] like Figure 3The figure shows the three-story plan of the data center in this application; there are 1,083 racks in the computer room, of which 626 racks have been put into use recently), 304 transmission computer room uses fluorine pump air conditioning, and other communication computer rooms use wind-side indirect evaporative cooling air conditioning. The self-use computer room and transmission computer room are designed as 7KW general computing computer rooms. The long-term computer room on the west side can be transformed into a thousand-calorie intelligent computing center according to the needs of intelligent computing, providing about 220-457 cabinets (cabinet layout adjustment is carried out according to the networking architecture of the intelligent computing center).
[0032] Figure 4 It is a schematic diagram of the rooftop floor plan of the data center in this application;
[0033] Figure 5 It is a schematic diagram of the facade structure of the data center in this application.
[0034] Finally, it should be noted that, in this article, relationships such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms include, include or any other variations are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0035] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.
Claims
1. A three-layer indirect evaporative cooling elastic intelligent computing center, characterized by: It includes a room body, which is composed of a first-floor machine room, a second-floor power room, and a third-floor machine room from bottom to top; the first-floor machine room and the third-floor machine room both include cabinets; indirect evaporative cooling air conditioners for dissipating heat emitted by the cabinets in the first-floor machine room are arranged on both sides of the outside of the first-floor machine room, and indirect evaporative cooling air conditioners for dissipating heat emitted by the cabinets in the third-floor machine room are arranged on the outside of the top of the third-floor machine room; a number of small power battery rooms and high and low voltage distribution rooms are arranged in the second-floor power room.
2. The three-layer indirect evaporative cooling elastic intelligent computing center according to claim 1 is characterized by: The first-floor machine room, the second-floor power room, and the third-floor machine room are connected by staircases and corridors.
3. The three-layer indirect evaporative cooling elastic intelligent computing center according to claim 1 is characterized by: The power battery room and high-voltage distribution room in the second-floor power room both use fluorine pump air conditioners.
4. The three-layer indirect evaporative cooling elastic intelligent computing center according to claim 1 is characterized by: Part of the indirect evaporative cooling air conditioning that dissipates heat from the cabinets in the three-story computer room is replaced by dry coolers and liquid cooling.
5. The three-layer indirect evaporative cooling elastic intelligent computing center according to claim 1 is characterized by: The three-story machine room includes a transmission machine room.