A cooling module and a cooling system

Abstract

This invention discloses a cooling module and a cooling system, relating to the field of cold plate liquid cooling technology. The cooling module includes a second cold plate module and at least two first cold plate modules connected in parallel. Each first cold plate module includes a first cold plate structure and a cold head embedded within it. The first cold plate structure has an inlet channel and an outlet channel. Cooling medium enters the cold head through the inlet channel and exits through the outlet channel to cool first heat-generating components on both sides of the motherboard of the first cold plate structure. The second cold plate module is connected in parallel with each of the first cold plate modules. The second cold plate module includes a second cold plate structure with cooling channels for the flow of cooling medium to cool second heat-generating components on both sides of the motherboard of the second cold plate structure. This cooling module can significantly increase the deployment density of GPU modules within a server chassis while meeting the stable and reliable heat dissipation requirements of the GPU modules.

Description

Technical Field

[0001] This invention relates to the field of cold plate liquid cooling technology, and particularly to a cooling module and cooling system. Background Technology

[0002] Currently, cold plate liquid cooling dominates the data center liquid cooling market due to its superior heat dissipation performance and excellent compatibility.

[0003] In existing systems, GPU (Graphics Processing Unit) servers need to meet ever-increasing computing demands within the limited height of server racks, typically placing eight GPU modules in a 2U space. To address heat dissipation, current solutions primarily employ a single-plate liquid cooling structure for GPU cold plate heatsinks. This structure includes a support frame, a GPU water-cooling module composed of multiple independent water-cooling plate components, a switching water-cooling plate component, inlet pipes, outlet pipes, distribution pipes, a water-cooling circulation system, and a collector. The support frame is positioned above the GPU water-cooling module, with one side movably connected to the collector. The water-cooling circulation system connects multiple independent water-cooling plate components in series, with their internal cavities interconnected. One end of the circulation pipe communicates with the internal cavity of the switching water-cooling plate component, while the other end communicates with the collector. Multiple outlets of the distribution pipes are connected to the switching water-cooling plate component, and the inlets of the distribution pipes are connected to the inlet pipes. However, the aforementioned cold plate structure breaks down the entire GPU cold plate into multiple independent single GPU cold plate heat sinks. The GPU cold plates and piping occupy too much space in the height direction of the chassis, which limits the improvement of the overall power density of the rack. At the same time, the entire cold plate assembly has a lot of flexible tubing connected to the cold plate, which poses a high risk of leakage. Once leakage occurs, it will cause damage to the server. Summary of the Invention

[0004] The purpose of this invention is to provide a cooling module and cooling system that can significantly increase the deployment density of GPU modules in a server chassis while meeting the stable and reliable heat dissipation requirements of the GPU modules.

[0005] To achieve the above objectives, the present invention provides a cooling module for clamping between two motherboards to cool the two motherboards, comprising:

[0006] At least two parallel first cold plate modules, each first cold plate module includes a first cold plate structure and a cold head embedded in the first cold plate structure. The first cold plate structure is provided with an inlet flow channel and an outlet flow channel. The cooling medium enters the cold head through the inlet flow channel and flows out of the cold head through the outlet flow channel to cool the first heating components on both sides of the main board of the first cold plate structure.

[0007] The second cold plate module is connected in parallel with each of the first cold plate modules. The second cold plate module includes a second cold plate structure. The second cold plate structure is provided with a cooling channel for the flow of cooling medium to cool the second heat-generating components on both sides of the main board of the second cold plate structure.

[0008] In some aspects, the cold head includes an upper shell and a lower shell, which are separated by a partition. The upper shell has an upper cold cavity for introducing a cooling medium to cool the first heat-generating component of the main board on the upper side of the cold head. The lower shell has a lower cold cavity for introducing a cooling medium to cool the first heat-generating component of the main board on the lower side of the cold head.

[0009] In other aspects, the cold head is provided with a first through hole and a second through hole, both of which are located between the upper shell and the lower shell. A partition is located between the first through hole and the second through hole. The liquid inlet channel is connected to the first through hole, the first through hole is connected to the upper cold cavity and the lower cold cavity, the liquid outlet channel is connected to the second through hole, and the second through hole is connected to the upper cold cavity and the lower cold cavity.

[0010] In other aspects, the first cold plate module also includes an inlet pipe and an outlet pipe. The inlet pipe is provided with an inlet flow channel, and the outlet pipe is provided with an outlet flow channel. Both the inlet pipe and the outlet pipe are embedded in the first cold plate structure. The end of the inlet pipe near the cold head is embedded in the first through hole, and the end of the outlet pipe near the cold head is embedded in the second through hole.

[0011] In other respects, the upper shell protrudes from the upper surface of the first cold plate structure, such that the upper shell abuts against the central heating element of the first heating component on the upper motherboard, and the upper surface of the first cold plate structure abuts against the outer peripheral heating element of the first heating component on the upper motherboard.

[0012] The lower housing protrudes from the lower surface of the first cold plate structure, such that the lower housing abuts against the central heating element of the first heating component on the lower motherboard, and the lower surface of the first cold plate structure abuts against the outer peripheral heating element of the first heating component on the lower motherboard.

[0013] In other respects, the number of cold heads on the first cold plate structure is at least two, and each cold head is arranged in series on the first cold plate structure;

[0014] Both the upper and lower shells are equipped with heat dissipation fins.

[0015] In other aspects, the cooling module also includes:

[0016] The distributor has a first liquid inlet, a second liquid outlet and at least two first liquid outlets. The first liquid inlet is used to introduce cooling medium into the distributor. The first liquid outlet is connected to the corresponding liquid inlet channel. The second liquid outlet is connected to one end of the cooling channel.

[0017] The collector, along with the distributor, is located on the same side of the second cold plate module and each of the first cold plate modules. The collector has a third liquid outlet, a third liquid inlet, and at least two second liquid inlets. The third liquid outlet is used to allow the cooling medium to flow out of the collector. The second liquid inlets are connected to the corresponding liquid outlet channel, and the third liquid inlet is connected to the other end of the cooling channel.

[0018] In other respects, cooling channels include:

[0019] The first channel, with one end of the first channel near the distributor connected to the second outlet;

[0020] Two second channels are connected to the end of the first channel furthest from the splitter, and the two second channels are respectively located on both sides of the first channel;

[0021] Two third channels, each connected to the end of one of the two second channels furthest from the first channel;

[0022] The fourth channel is connected to the two third channels at the end furthest from the distributor, and to the third inlet at the end closest to the distributor.

[0023] In other respects, the second cold plate structure includes an upper cold plate body and a lower cold plate body, which are combined to form a T-shaped cold plate structure.

[0024] The second cold plate module also includes a first cooling pipe, two second cooling pipes, two third cooling pipes and a fourth cooling pipe. The first cooling pipe is provided with a first channel, the second cooling pipe is provided with a second channel, the third cooling pipe is provided with a third channel and the fourth cooling pipe is provided with a fourth channel.

[0025] The first cooling pipe and two second cooling pipes are embedded in the upper cold plate body, and the fourth cooling pipe and two third cooling pipes are embedded in the lower cold plate body.

[0026] The first and fourth cooling pipes both extend along the first direction, and the fourth cooling pipe is located directly below the first cooling pipe. The two second cooling pipes and the two third cooling pipes both extend along the second direction perpendicular to the first direction. The third cooling pipe is located directly below the corresponding second cooling pipe. The third cooling pipe and the corresponding second cooling pipe are connected by a connecting pipe.

[0027] The cooling medium distributed by the second outlet of the distributor flows through the first cooling pipe to the two second cooling pipes, then through the two second cooling pipes to the two third cooling pipes, and then through the two third cooling pipes to the fourth cooling pipe before flowing into the collector from the third inlet, so as to cool the second heating components on both sides of the second cold plate structure.

[0028] The present invention also provides a cooling system comprising the cooling module of any of the above.

[0029] Compared to the aforementioned background technology, the cooling module provided in this embodiment of the invention is used to clamp between two motherboards for cooling the two motherboards. The cooling module includes a second cold plate module and at least two first cold plate modules connected in parallel. Each first cold plate module includes a first cold plate structure and a cold head embedded in the first cold plate structure. The first cold plate structure has an inlet channel and an outlet channel. Cooling medium enters the cold head through the inlet channel and exits the cold head through the outlet channel to cool the first heat-generating components on both sides of the motherboards of the first cold plate structure. The second cold plate module is connected in parallel with each of the first cold plate modules. The second cold plate module includes a second cold plate structure with a cooling channel for the flow of cooling medium to cool the second heat-generating components on both sides of the motherboards of the second cold plate structure.

[0030] As can be seen, the cooling module provided in this embodiment of the invention can be used to cool two motherboards placed vertically opposite each other. Specifically, the two motherboards placed vertically opposite each other sandwich the cooling module in the middle, and the cooling module can simultaneously cool and dissipate heat from the motherboards on both the upper and lower sides. During operation, the first cold plate module is used to cool the first heat-generating components on both the upper and lower motherboards. The cooling medium enters the cold head through the inlet channel and flows out of the cold head through the outlet channel. In this way, the cooling medium flows through the inlet channel, the cold head, and the outlet channel in succession to cool the first heat-generating components on both sides of the first cold plate structure. Considering that there are at least two sets of first heat-generating components on the motherboard, at least two first cold plate modules connected in parallel are provided to complete the cooling of all the first heat-generating components on the upper and lower motherboards. The second cold plate module is used to cool the second heat-generating components on both the upper and lower motherboards. The cooling medium flows along the cooling channel to cool the second heat-generating components on both the upper and lower motherboards.

[0031] The advantages of this cooling module configuration mainly include: the cooling module provided in this embodiment of the invention can maximize GPU deployment density and provide effective heat dissipation within the limited height space of a server chassis. For example, in a configuration where two motherboards with a total of 16 GPU modules are placed within a 1.5U chassis height space, the cooling module is sandwiched between the two motherboards. Each first cold plate module is used to cool the corresponding first heat-generating components (GPU modules) on the upper and lower motherboards, and the second cold plate module is used to cool the second heat-generating components (switching modules, optical modules, and network modules, etc.) on the upper and lower motherboards. In other words, the above-mentioned cooling module can significantly increase the GPU module deployment density within the server chassis while meeting the stable and reliable heat dissipation requirements of GPU modules, switching modules, optical modules, and network modules. This not only significantly increases the GPU module deployment density within the server chassis but also effectively reduces the risk of system leakage. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the overall structure of the cooling module in an embodiment of the present invention;

[0034] Figure 2 for Figure 1 A schematic diagram of the structure of the first cold plate module in the cooling module shown;

[0035] Figure 3 for Figure 2 The diagram shows the structure of the cold head in the first cold plate module.

[0036] Figure 4 for Figure 3 The diagram shows another angle of the cold head's structure;

[0037] Figure 5 This is a schematic diagram showing the flow direction of the cooling medium in the cooling module in an embodiment of the present invention;

[0038] Figure 6 This is a schematic diagram of the flow path architecture of the cooling module in an embodiment of the present invention;

[0039] Figure 7 This is a schematic diagram of the assembly of the cooling module and the upper and lower motherboards in an embodiment of the present invention;

[0040] Figure 8 for Figure 7 A schematic diagram of the motherboard structure.

[0041] in:

[0042] 10-Cooling module;

[0043] 11-First cold plate module;

[0044] 111 - First cold plate structure;

[0045] 112-Cold head, 1121-Upper shell, 1122-Lower shell, 1123-Baffle, 1124-First through hole, 11241-First channel, 1125-Second through hole, 11251-Second channel, 1126-Heat dissipation fins;

[0046] 113 - Liquid inlet pipe, 1131 - Liquid inlet flow channel;

[0047] 114 - Liquid outlet pipe, 1141 - Liquid outlet flow channel;

[0048] 12-Second cold plate module;

[0049] 121-Second cold plate structure, 1211-Upper cold plate body, 1212-Lower cold plate body;

[0050] 122-Cooling channel, 1221-First cooling pipe, 12211-First channel, 1222-Second cooling pipe, 12221-Second channel, 1223-Third cooling pipe, 12231-Third channel, 1224-Fourth cooling pipe, 12241-Fourth channel;

[0051] 13-Splitter;

[0052] 14-Current collector;

[0053] 20-Motherboard;

[0054] 21-First heating element, 211-Central heating element, 212-Peripheral heating element;

[0055] 22-Second heating element, 221-Intermediate heating element, 222-Edge heating element. Detailed Implementation

[0056] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0057] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0058] It should be noted that the directional terms such as "upper end," "lower end," "left side," and "right side" mentioned below are defined based on the accompanying drawings in the instruction manual.

[0059] Please see Figure 1 and Figure 7 The cooling module 10 provided in this embodiment of the invention is used to clamp between two motherboards 20 to cool the two motherboards 20. The cooling module 10 includes a second cold plate module 12 and at least two first cold plate modules 11 connected in parallel.

[0060] The first cold plate module 11 includes a first cold plate structure 111 and a cold head 112 embedded in the first cold plate structure 111. The first cold plate structure 111 is provided with an inlet channel 1131 and an outlet channel 1141. The cooling medium enters the cold head 112 through the inlet channel 1131 and flows out of the cold head 112 through the outlet channel 1141 to cool the first heating components 21 on the main boards 20 on both sides of the first cold plate structure 111.

[0061] It should be noted that the first heating component 21 on the motherboard 20 mainly includes a central heating device 211 and a peripheral heating device 212. The peripheral heating component refers to the heating device located around the central heating device 211. For example, the first heating component 21 is a GPU module. The heating device of the GPU module includes two main parts: a central main heating device and a peripheral low-power device.

[0062] The cold head 112 on the first cold plate structure 111 provides heat dissipation for the central main heat-generating device of the GPU module. The low-power devices of the GPU module will conduct heat to the cover plate of the GPU module and then to the first cold plate structure 111, and finally be carried away by the cooling medium flowing in the first cold plate structure 111.

[0063] The second cold plate module 12 is connected in parallel with each of the first cold plate modules 11. The second cold plate module 12 includes a second cold plate structure 121. The second cold plate structure 121 is provided with a cooling channel 122. The cooling channel 122 is used for the flow of cooling medium to cool the second heat-generating components 22 on the main boards 20 on both sides of the second cold plate structure 121.

[0064] It should be noted that the second heat-generating component 22 on the motherboard 20 mainly includes a central heat-generating device 221 and an edge heat-generating device 222. The central heat-generating device 221 refers to a heat-generating device located in the middle of the motherboard 20, such as a switching module, while the edge heat-generating device 222 refers to a heat-generating device located at the edge of the motherboard 20, such as an optical module and a network module.

[0065] The path of the cooling channel 122 is used to extend along the location of the second heat-generating component 22 on the motherboard 20. As the cooling medium flows along the cooling channel 122 on the second cold plate structure 121, it carries away the heat generated by the switching module, optical module and network module on the motherboard 20.

[0066] As can be seen, the cooling module 10 provided in this embodiment of the invention can be used to cool two motherboards 20 placed vertically opposite each other. Specifically, the two motherboards 20 placed vertically opposite each other sandwich the cooling module 10 in the middle, and the cooling module 10 can cool and dissipate heat from the motherboards 20 on both the upper and lower sides at the same time.

[0067] During operation, the first cold plate module 11 is used to cool the first heating components 21 of the upper and lower mainboards 20. The cooling medium enters the cold head 112 through the liquid inlet channel 1131 and flows out of the cold head 112 through the liquid outlet channel 1141. In this way, the cooling medium flows through the liquid inlet channel 1131, the cold head 112 and the liquid outlet channel 1141 in succession to cool the first heating components 21 on both sides of the first cold plate structure 111. Considering that there are at least two sets of first heating components 21 on the mainboard 20, at least two first cold plate modules 11 connected in parallel are set to complete the cooling of all the first heating components 21 on the upper and lower mainboards 20. The second cold plate module 12 is used to cool the second heating components 22 of the upper and lower mainboards 20. The cooling medium flows along the cooling channel 122 to cool the second heating components 22 of the upper and lower mainboards 20.

[0068] The cooling module 10 provided in this embodiment of the invention can maximize GPU deployment density and provide effective heat dissipation within the limited height space of a server chassis. For example, in a configuration where two motherboards 20 with a total of 16 GPU modules are placed within a 1.5U chassis height space, the cooling module 10 is sandwiched between the two motherboards 20. Each first cold plate module 11 is used to cool the corresponding first heat-generating components 21 (GPU modules) on the upper and lower motherboards 20, and the second cold plate module 12 is used to cool the second heat-generating components 22 (switching modules, optical modules, and network modules, etc.) on the upper and lower motherboards 20. In other words, the cooling module 10 can significantly increase the GPU module deployment density within the server chassis while meeting the stable and reliable heat dissipation requirements of GPU modules, switching modules, optical modules, and network modules. This not only significantly increases the GPU module deployment density within the server chassis but also effectively reduces the risk of system leakage.

[0069] Please refer to the following: Figure 2 , Figure 3 and Figure 4 The cold head 112 includes an upper shell 1121 and a lower shell 1122, which are separated by a partition 1123. The upper shell 1121 is used to abut against the first heating element 21 of the upper motherboard 20. The upper shell 1121 is provided with an upper cold cavity, which is a liquid cooling channel. The upper cold cavity is used to introduce a cooling medium to cool the first heating element 21 of the upper motherboard 20 of the cold head 112. The lower shell 1122 is provided with a lower cold cavity, which is a liquid cooling channel. The lower cold cavity is used to introduce a cooling medium to cool the first heating element 21 of the lower motherboard 20 of the cold head 112.

[0070] As can be seen, the cold head 112 abuts against the first heating element 21 of the upper motherboard 20 and the first heating element 21 of the lower motherboard 20 through the upper shell 1121 and the lower shell 1122 respectively. When the cooling medium flows through the upper cold cavity and the lower cold cavity, the cooling medium of the upper cold cavity can carry away the heat generated by the first heating element 21 of the upper motherboard 20, and the cooling medium of the lower cold cavity can carry away the heat generated by the first heating element 21 of the lower motherboard 20, thereby completing the cooling work of the first heating element 21 on the upper and lower motherboards 20.

[0071] To facilitate the flow of cooling medium into and out of the upper and lower cold chambers, the cold head 112 is provided with a first through hole 1124 and a second through hole 1125. Both the first through hole 1124 and the second through hole 1125 are located between the upper shell 1121 and the lower shell 1122. A partition plate 1123 is located between the first through hole 1124 and the second through hole 1125. The liquid inlet channel 1131 communicates with the first through hole 1124, and the first through hole 1124 contains two first channels 112. 41. The first through hole 1124 is connected to the upper cold cavity through the upper first channel 11241 and the lower cold cavity through the lower first channel 11241. The liquid outlet channel 1141 is connected to the second through hole 1125. The second through hole 1125 is provided with two second channels 11251. The second through hole 1125 is connected to the upper cold cavity through the upper second channel 11251 and the lower cold cavity through the lower second channel 11251.

[0072] With this configuration, the cooling medium in the inlet channel 1131 is diverted into the upper and lower cold chambers through the two first channels 11241 in the first through hole 1124, so as to cool the first heat-generating components 21 on the upper and lower motherboards 20 respectively. Afterwards, the cooling medium in the upper and lower cold chambers is diverted into the outlet channel 1141 through the two second channels 11251 in the second through hole 1125, so as to flow out of the upper and lower cold chambers.

[0073] In some embodiments, the first cold plate module 11 further includes an inlet pipe 113 and an outlet pipe 114. The inlet pipe 113 is provided with an inlet flow channel 1131, and the outlet pipe 114 is provided with an outlet flow channel 1141. Both the inlet pipe 113 and the outlet pipe 114 are embedded in the first cold plate structure 111. One end of the inlet pipe 113 near the cold head 112 is embedded in the first through hole 1124, and the other end of the outlet pipe 114 near the cold head 112 is embedded in the second through hole 1125.

[0074] Specifically, the first through hole 1124 can be located at the left end of the cold head 112, and the second through hole 1125 can be located at the right end of the cold head 112. Both the first through hole 1124 and the second through hole 1125 penetrate the cold head 112. The structures of the first through hole 1124 and the second through hole 1125 are adapted to the structures of the liquid inlet pipe 113 and the liquid outlet pipe 114, respectively. The end of the liquid inlet pipe 113 near the cold head 112 is sealed and fitted into the first through hole 1124 to ensure that the liquid inlet... The cooling medium in the liquid pipe 113 is diverted into the upper cold cavity and the lower cold cavity through two first channels 11241 to cool the first heating component 21 on the upper and lower motherboards 20 respectively. The end of the liquid outlet pipe 114 near the cold head 112 is embedded in the second through hole 1125. The cooling medium in the upper cold cavity and the lower cold cavity flows into the liquid outlet channel 1141 through two second channels 11251, and then flows out of the upper cold cavity and the lower cold cavity.

[0075] To facilitate heat dissipation for the first heating components 21 on the upper and lower motherboards 20, the upper shell 1121 protrudes from the upper surface of the first cold plate structure 111, such that the upper shell 1121 abuts against the central heating element 211 of the first heating component 21 on the upper motherboard 20, and the upper surface of the first cold plate structure 111 abuts against the outer peripheral heating element 212 of the first heating component 21 on the upper motherboard 20; the lower shell 1122 protrudes from the lower surface of the first cold plate structure 111, such that the lower shell 1122 abuts against the central heating element 211 of the first heating component 21 on the lower motherboard 20, and the lower surface of the first cold plate structure 111 abuts against the outer peripheral heating element 212 of the first heating component 21 on the lower motherboard 20.

[0076] Please refer to the following: Figure 8 The components required for heat dissipation in a GPU module consist of two main parts: the central main heat-generating device located in the central recess, and the low-power devices such as VR located around the central main heat-generating device. These low-power devices conduct heat to the cover plate of the GPU module.

[0077] Therefore, the upper shell 1121 is configured to protrude from the upper surface of the first cold plate structure 111, so that the upper shell 1121 can abut against the central heating element 211 of the first heating component 21 on the upper motherboard 20, and the upper surface of the first cold plate structure 111 can abut against the outer peripheral heating element 212 of the first heating component 21 on the upper motherboard 20. The lower shell 1122 is configured to protrude from the lower surface of the first cold plate structure 111, so that the lower shell 1122 can abut against the central heating element 211 of the first heating component 21 on the lower motherboard 20, and the lower surface of the first cold plate structure 111 can abut against the outer peripheral heating element 212 of the first heating component 21 on the lower motherboard 20.

[0078] In this way, the upper shell 1121 and the lower shell 1122 of the cold head 112 abut against the central heating device 211 of the first heating component 21 on the upper motherboard 20 and the central heating device 211 of the first heating component 21 on the lower motherboard 20, respectively, thereby providing heat dissipation for the central heating devices 211 of the first heating components 21 on both motherboards 20. Furthermore, the peripheral heating devices 212 of the first heating components 21 on both motherboards 20 will conduct heat to the cover plate of the GPU module, and then to the first cold plate structure 111, and finally be carried away by the cooling medium flowing in the first cold plate structure 111.

[0079] Of course, depending on actual needs, the first cold plate structure 111 can be an aluminum substrate, and the liquid inlet pipe 113 and the liquid outlet pipe 114 are both copper pipes. The copper pipes are embedded in the aluminum substrate. When there is a cooling medium flowing in the copper pipes, the heat of low-power devices such as VR is conducted to the aluminum substrate, and then the heat is carried away by the cooling medium in the copper pipes.

[0080] In some embodiments, the number of cold heads 112 on the first cold plate structure 111 is at least two, and each cold head 112 is arranged in series on the first cold plate structure 111.

[0081] Please refer to the following: Figure 5 , Figure 6 and Figure 8 For a single motherboard 20, there are 8 GPU modules arranged in 4 columns (each column contains 2 GPU modules). To achieve this, there are 4 first cold plate modules 11 connected in parallel. The first cold plate modules 11 can dissipate heat for the corresponding single-column GPU modules on the upper and lower sides of the motherboard 20. Furthermore, each first cold plate module 11 has two series-connected cold heads 112 on its first cold plate structure 111, which provide heat dissipation for the single-column GPU modules.

[0082] Specifically, one end of the first cold head 112 is provided with an inlet pipe 113 and an outlet pipe 114 to realize the flow of cooling medium in the first cold head 112. The second cold head 112 is connected to the first cold head 112 through the inlet pipe 113 and the outlet pipe 114 to realize the flow of cooling medium in the second cold head 112.

[0083] In this way, part of the cooling medium in the inlet pipe 113 corresponding to the first cold head 112 is diverted into the upper and lower cold chambers of the first cold head 112, and the other part flows out of the first through hole 1124 of the first cold head 112 through the inlet pipe 113 corresponding to the second cold head 112 and flows into the second cold head 112. The structure of the second cold head 112 is the same as that of the first cold head 112. The cooling medium enters the upper and lower cold chambers of the second cold head 112 through the left first through hole 1124 and flows out of the second cold head 112 through the right second through hole 1125. The cooling medium in both cold heads 112 flows out of the cold head 112 through the right second through hole 1125 and collects in the copper pipe and flows out of the first cold plate structure 111.

[0084] To enhance heat dissipation, fins can be designed on the cold head 112 to increase the heat dissipation area. For example, heat dissipation fins 1126 are provided on the end faces of both the upper shell 1121 and the lower shell 1122.

[0085] Based on the above, the cooling module 10 also includes a water distribution manifold, which includes a distributor 13 and a collector 14. The distributor 13 and the collector 14 can be configured as an integrated structure, wherein the second cold plate module 12 and at least two first cold plate modules 11 are connected in parallel on the distributor 13 and the collector 14.

[0086] Specifically, the distributor 13 is provided with a first liquid inlet, a second liquid outlet, and at least two first liquid outlets (the number of first liquid outlets is the same as the number of first cold plate modules 11). The first liquid inlet is used to introduce cooling medium into the distributor 13, the first liquid outlet is connected to the liquid inlet channel 1131 of the corresponding first cold plate module 11, and the second liquid outlet is connected to one end of the cooling channel 122 of the second cold plate module 12. The collector 14 and the distributor 13 are disposed on the second cold plate module 12 and each first cold plate module. On the same side of block 11 (for example, the distributor 13 is fixedly connected to the upper end face of the collector 14), the collector 14 is provided with a third liquid outlet, a third liquid inlet and at least two second liquid inlets (the number of second liquid inlets is the same as the number of first cold plate modules 11). The third liquid outlet is used to supply cooling medium to flow out of the collector 14. The second liquid inlets are connected to the liquid outlet channel 1141 of the corresponding first cold plate module 11. The third liquid inlet is connected to the other end of the cooling channel 122 of the second cold plate module 12.

[0087] In this way, a portion of the cooling medium distributed by the distributor 13 can flow into the corresponding first cold plate module 11 through the corresponding first outlet, and the cooling medium after heat dissipation can then flow into the collector 14 through the corresponding second inlet. Another portion of the cooling medium distributed by the distributor 13 can flow into the second cold plate module 12 through the second outlet, and the cooling medium after heat dissipation can then flow into the collector 14 through the corresponding third inlet.

[0088] In some embodiments, the cooling channel 122 includes a first channel 12211, two second channels 12221, two third channels 12231, and a fourth channel 12241. The first channel 12211 is connected to a second liquid outlet at one end near the distributor 13. Both second channels 12221 are connected to the ends of the first channel 12211 away from the distributor 13, and are respectively located on both sides of the first channel 12211. The two third channels 12231 are respectively connected to the ends of the two second channels 12221 away from the first channel 12211. The fourth channel 12241 is connected to the two third channels 12231 at one end away from the distributor 13, and is connected to a third liquid inlet at one end near the distributor 13.

[0089] Considering that the second heat-generating component 22 on the motherboard 20 is generally distributed in a T-shape, the second cold plate structure 121 includes an upper cold plate body 1211 and a lower cold plate body 1212, which are combined to form a T-shaped cold plate structure.

[0090] Furthermore, the second cold plate module 12 also includes a first cooling pipe 1221, two second cooling pipes 1222, two third cooling pipes 1223, and a fourth cooling pipe 1224. The first cooling pipe 1221 has a first channel 12211, the second cooling pipe 1222 has a second channel 12221, the third cooling pipe 1223 has a third channel 12231, and the fourth cooling pipe 1224 has a fourth channel 12241. The first cooling pipe 1221 and the two second cooling pipes 1222 are embedded in the upper cold plate body 1211, and the fourth cooling pipe 1224 and the two third cooling pipes 1223 are embedded in the lower cold plate body 1212. Of course, the first cooling pipe 1221, the second cooling pipe 1222, the third cooling pipe 1223, and the fourth cooling pipe 1224 are all copper pipes embedded in the second cold plate structure 121.

[0091] Furthermore, both the first cooling pipe 1221 and the fourth cooling pipe 1224 extend along the first direction, and the fourth cooling pipe 1224 is located directly below the first cooling pipe 1221. Both the two second cooling pipes 1222 and the two third cooling pipes 1223 extend along the second direction perpendicular to the first direction. The third cooling pipe 1223 is located directly below the corresponding second cooling pipe 1222. The third cooling pipe 1223 and the corresponding second cooling pipe 1222 are connected by a connecting pipe.

[0092] It should be noted that the first direction mentioned above can be as follows: Figure 1 The X-axis direction is shown, and the second direction can be as follows: Figure 1 The Y-axis direction is shown.

[0093] In this way, the cooling medium distributed by the second outlet of the distributor 13 flows through the first cooling pipe 1221 to the two second cooling pipes 1222 respectively, and then through the two second cooling pipes 1222 to the two third cooling pipes 1223 respectively. After flowing through the two third cooling pipes 1223, it converges into the fourth cooling pipe 1224 and then flows into the collector 14 from the third inlet, so as to cool the second heating components 22 on both sides of the second cold plate structure 121.

[0094] Understandably, when the cooling medium flows in the first cooling pipe 1221, it can carry away the heat generated by the switching module on the upper motherboard 20. After flowing out of the first cooling pipe 1221, the cooling medium splits into two and enters the second cooling pipes 1222 on both sides. When the cooling medium flows in the two second cooling pipes 1222, it can carry away the heat generated by the optical module and network module on the upper motherboard 20. Then, the cooling medium flows into the two third cooling pipes 1223. When the cooling medium flows in the two third cooling pipes 1223, it can carry away the heat generated by the optical module and network module on the lower motherboard 20. Finally, the cooling medium in the two third cooling pipes 1223 merges into the fourth cooling pipe 1224. When the cooling medium flows in the fourth cooling pipe 1224, it can carry away the heat generated by the switching module on the lower motherboard 20.

[0095] In other words, the cooling medium enters the copper pipe of the upper cold plate body 1211 through the splitter 13, flows through the switching module in the middle of the upper motherboard 20 to provide heat dissipation for the switching module, and then splits into two to dissipate heat for the optical module and network module at the rear of the upper motherboard 20, and then flows into the lower cold plate body 1212. The upper cold plate body 1211 and the lower cold plate body 1212 are connected by copper pipes. The lower cold plate body 1212 first dissipates heat for the optical module and network module of the lower motherboard 20, and then converges in the middle to dissipate heat for the switching module of the lower motherboard 20 before flowing into the collector 14.

[0096] In some embodiments, connecting pipes can be provided between each of the first cold plate modules 11 and the distributor 13, and between the second cold plate module 12 and the distributor 13. Solenoid valves for controlling the flow rate of the cooling medium are provided on the connecting pipes. Further, the cooling module 10 also includes a control module and a temperature detection module. The temperature detection module is used to detect the real-time temperature of the heat-generating components on the motherboard 20. The control module is communicatively connected to the temperature detection module and each solenoid valve. The control module is used to control the opening degree of the corresponding solenoid valve according to the temperature data detected by the temperature detection module, thereby accurately controlling the flow rate of the cooling medium distributed by the distributor 13 to the first cold plate module 11 and the second cold plate module 12.

[0097] With this configuration, the control module of the cooling module 10 is connected to the temperature detection module and each solenoid valve, so that the control module can accurately control the opening of the corresponding control valve according to the temperature of the heat-generating components on the motherboard 20, thereby ensuring that the cooling medium flow in the first cold plate module 11 and the second cold plate module 12 is split as needed.

[0098] Compared to traditional methods that cannot adjust the cooling medium flow rate according to changes in device temperature, the cooling module 10 provided by this invention can precisely control the cooling medium flow rate in the first cold plate module 11 and the second cold plate module 12 according to the temperature of each heat-generating device on the motherboard 20. This ensures that high-heat-generating devices can be effectively cooled and low-heat-generating devices can operate normally, thereby achieving uniform heat dissipation for each heat-generating device on the motherboard 20 and saving cooling medium flow rate and reducing power consumption.

[0099] The beneficial effects of using the above-mentioned cooling module 10 include:

[0100] Firstly, the cooling module 10 provided by this invention is sandwiched between two motherboards 20 to form a sandwich structure cooling solution. For a configuration where two motherboards 20 with a total of 16 GPU modules are placed in a 1.5U chassis height space, the cooling module 10 is sandwiched between the two motherboards 20. Each first cold plate module 11 is used to cool the corresponding first heat-generating components 21 (GPU modules) on the upper and lower motherboards 20, and the second cold plate module 12 is used to cool the second heat-generating components 22 (switching modules, optical modules, and network modules, etc.) on the upper and lower motherboards 20. This can effectively improve the utilization rate of the internal space of the chassis, increase the overall rack deployment density of the GPU server, and ensure the heat dissipation effect.

[0101] Secondly, the cooling module 10 provided by the present invention eliminates the original hose connection between cold plates or between cold plates and manifold, which improves reliability, effectively reduces the risk of system leakage, and ensures the stable and reliable operation of the cooling module 10.

[0102] The present invention provides a cooling system including the cooling module described in the above specific embodiments; other parts of the cooling system can be referred to in related technologies, and will not be elaborated here.

[0103] It should be noted that in this specification, relational terms such as first and second are used only to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.

[0104] The cooling module and cooling system provided by this invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the embodiments above are only for the purpose of helping to understand the solution and core ideas of this invention. It should be noted that those skilled in the art can make several improvements and modifications to this invention without departing from the principles of this invention, and these improvements and modifications also fall within the protection scope of this invention.

Claims

1. A cooling module for clamping between two mainboards to cool the two mainboards, characterized in that, The application relates to a cooling module. The cooling module comprises at least two parallel first cold plate modules, each of which comprises a first cold plate structure and a cold head embedded in the first cold plate structure, the first cold plate structure is provided with an inlet flow channel and an outlet flow channel, cooling medium enters the cold head from the inlet flow channel and flows out of the cold head from the outlet flow channel to cool first heat generating components on the mainboards on both sides of the first cold plate structure; a second cold plate module is parallel to each of the first cold plate modules, the second cold plate module comprises a second cold plate structure, the second cold plate structure is provided with a cooling channel for flowing cooling medium to cool second heat generating components on the mainboards on both sides of the second cold plate structure; the cold head comprises an upper shell and a lower shell, the upper shell and the lower shell are separated by a partition, the upper shell is provided with an upper cold cavity for flowing cooling medium to cool the first heat generating components on the upper mainboard of the cold head, and the lower shell is provided with a lower cold cavity for flowing cooling medium to cool the first heat generating components on the lower mainboard of the cold head; the cold head is provided with a first through hole and a second through hole, the first through hole and the second through hole are arranged between the upper shell and the lower shell, the partition is located between the first through hole and the second through hole, the inlet flow channel is communicated with the first through hole, the first through hole is communicated with the upper cold cavity and the lower cold cavity, the outlet flow channel is communicated with the second through hole, and the second through hole is communicated with the upper cold cavity and the lower cold cavity. The first cold plate module further comprises an inlet pipe and an outlet pipe, the inlet pipe is provided with the inlet flow channel, the outlet pipe is provided with the outlet flow channel, the inlet pipe and the outlet pipe are embedded on the first cold plate structure, one end of the inlet pipe close to the cold head is embedded in the first through hole, and one end of the outlet pipe close to the cold head is embedded in the second through hole. The upper shell protrudes from the upper surface of the first cold plate structure, so that the upper shell abuts against the central heat generating device of the first heat generating components on the upper mainboard and the upper surface of the first cold plate structure abuts against the peripheral heat generating device of the first heat generating components on the upper mainboard; The lower shell protrudes from the lower surface of the first cold plate structure, so that the lower shell abuts against the central heat generating device of the first heat generating components on the lower mainboard and the lower surface of the first cold plate structure abuts against the peripheral heat generating device of the first heat generating components on the lower mainboard.

2. The cooling module of claim 1, wherein, The number of the cold heads on the first cold plate structure is at least two, and each of the cold heads is arranged in series on the first cold plate structure.

3. The cooling module of claim 1, wherein, The upper shell and the lower shell are both provided with heat dissipation fins. The cooling module further comprises a flow divider, the flow divider is provided with a first inlet, a second outlet and at least two first outlets, the first inlet is used for flowing cooling medium into the flow divider, the first outlet is communicated with the corresponding inlet flow channel, and the second outlet is communicated with one end of the cooling channel.

4. The cooling module of claim 2, wherein, ​ ​ 5. Cooling module according to any of claims 1-4, characterized in that ​ ​ A collector is arranged on the same side of the second cold plate module and each of the first cold plate modules as the flow divider, and the collector is provided with a third liquid outlet, a third liquid inlet and at least two second liquid inlets. The third liquid outlet is used for the cooling medium to flow out of the collector. The second liquid inlets are in communication with the corresponding liquid outlet flow channels. The third liquid inlet is in communication with the other end of the cooling channel.

6. The cooling module of claim 5, wherein, The cooling channel comprises: A first channel, which is in communication with the second liquid outlet at one end close to the flow divider; Two second channels, which are both in communication with one end of the first channel away from the flow divider, and the two second channels are arranged on two sides of the first channel respectively; Two third channels, which are respectively in communication with one end of the two second channels away from the first channel; A fourth channel, which is in communication with the two third channels at one end away from the flow divider, and in communication with the third liquid inlet at one end close to the flow divider.

7. The cooling module of claim 6, wherein, The second cold plate structure comprises an upper cold plate body and a lower cold plate body, and the upper cold plate body and the lower cold plate body combine to form a T-shaped cold plate structure; The second cold plate module further comprises a first cooling pipe, two second cooling pipes, two third cooling pipes and a fourth cooling pipe. The first cooling pipe is provided with the first channel, the second cooling pipe is provided with the second channel, the third cooling pipe is provided with the third channel, and the fourth cooling pipe is provided with the fourth channel; The first cooling pipe and the two second cooling pipes are embedded in the upper cold plate body, and the fourth cooling pipe and the two third cooling pipes are embedded in the lower cold plate body; The first cooling pipe and the fourth cooling pipe both extend along a first direction, and the fourth cooling pipe is located directly below the first cooling pipe. The two second cooling pipes and the two third cooling pipes both extend along a second direction perpendicular to the first direction, and the third cooling pipe is located directly below the corresponding second cooling pipe. The third cooling pipe and the corresponding second cooling pipe are in communication through a communication pipe; The cooling medium distributed by the second liquid outlet of the flow divider flows through the first cooling pipe to the two second cooling pipes respectively, and then flows through the two second cooling pipes to the two third cooling pipes respectively. The cooling medium then flows through the two third cooling pipes to the fourth cooling pipe, and then flows into the collector through the third liquid inlet, so as to cool the second heat generating components on both sides of the second cold plate structure.

8. A cooling system characterized by, The cooling module comprises the cold plate module as claimed in any one of claims 1-7.

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