Assembly method of power module

Abstract

The invention discloses an assembling method of a power module, which is used for assembling the power module comprising an outer frame, a capacitor assembly, a power assembly and a busbar assembly, and comprises the following steps in sequence: cleaning, assembling the outer frame, assembling the capacitor assembly, assembling the power assembly, assembling the busbar assembly and assembling residual parts. According to the invention, a proper assembly process method is formulated, so that the assembly quality of the power module is ensured.

Description

Technical Field

[0001] The invention belongs to the field of assembly technology, and in particular relates to an assembly method of a power module. Background Art

[0002] The power module is a power electronic device that is encapsulated into a module according to a certain functional combination. The power module is mainly composed of an outer frame, a water-cooled plate, a power component, a capacitor component, a busbar component, a PCB board, etc.

[0003] As power modules develop towards miniaturization and thin-walledness, the internal installation space of the power modules becomes more compact, and higher requirements are placed on the assembly of the power modules.

[0004] In order to solve the power module assembly problem, a suitable assembly process method needs to be adopted to ensure the assembly quality of the power module. Summary of the invention

[0005] In view of this, the present invention provides a method for assembling a power module to ensure the assembly quality of the power module.

[0006] The technical solution adopted by the present invention to solve the technical problem is: a method for assembling a power module, which is used to assemble a power module including an outer frame, a capacitor assembly, a power assembly and a busbar assembly, wherein the capacitor assembly is composed of a capacitor support plate shock-absorbing rubber strip and a connecting contact, and the power assembly is composed of a water cooling plate, a water joint, an IGBT and a PCB board; the steps are as follows: S1, cleaning: flush the water inlet of the water cooling plate with clean water to ensure that the water flow at the water outlet is free of impurities. After flushing, use compressed air to blow dry the remaining water stains inside the water cooling plate and seal the water inlet and outlet for protection; S2, assembling the outer frame: assembling the outer frame into shape using fasteners; S3, assembly of capacitor assembly: assemble the capacitor support plate onto the outer frame, install the capacitor onto the outer frame bottom plate through the capacitor support plate, use four short shock-absorbing rubber strips to fix the capacitor and the capacitor support plate, and fine-tune the adjustment nut at the bottom of the capacitor so that the connection contacts at the top of each capacitor are in the same plane; S4, assembly of power components: install the water connector into the threaded hole of the water cooling plate; first clean the contact surface between the IGBT and the water cooling plate with anhydrous alcohol, then evenly apply thermal grease on the IGBT installation surface, place the coated IGBT on the water cooling plate, pre-tighten it diagonally with a torque of 0.5N•m, and finally tighten it in the same order with a torque of 3~5N•m; apply thread sealant on the mounting screws of the PCB board, and install the PCB board on the IGBT with a torque of 1.8~2.1N•m; S5, assembly of busbar assembly: Assemble the busbar assembly to the capacitor assembly and the power assembly respectively, using a torque of 4-5 N•m for M6 screws and a torque of 8-10 N•m for M8 screws to install the busbar assembly; S6, install the remaining parts to complete the assembly of the power module.

[0007] Furthermore, in step S4, thread sealant is first applied to the first two to three threads of the thread of the water connector, and then the water connector is installed to the water cooling plate with a wrench.

[0008] Furthermore, in step S4, the IGBT and the water cooling plate are tightened for one hour and then tightened again with the same torque and sequence.

[0009] Furthermore, in step S5, the connection contacts of the capacitor assembly are adjusted to be in full contact with the busbar assembly by adjusting the nut at the bottom of the capacitor assembly.

[0010] The beneficial effect of the present invention is that the assembly process method of the power module of the present invention formulates a suitable assembly process method, thereby ensuring the assembly quality of the power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a flow chart of the assembly process of the power module of the present invention; Figure 2 is a schematic structural diagram of a power module of the present invention; Figure 3 It is a schematic diagram of the structure of the power module without the outer frame; Figure 4 It is a schematic diagram of the assembled outer frame structure; Figure 5 It is a schematic diagram of the structure of the capacitor component; Figure 6 It is a schematic diagram of the structure of the power component; The figures are marked as follows: 1—outer frame, 2—capacitor assembly, 21—capacitor support plate, 22—shock-absorbing rubber strip, 23—connection contact, 3—power assembly, 31—water cooling plate, 32—water joint, 33—IGBT, 34—PCB board, 4—busbar assembly. DETAILED DESCRIPTION

[0012] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0013] Before describing the embodiments of the present invention in detail, the application environment of the present invention is described first. The technology of the present invention is mainly applied to the assembly process of power modules. The power module plays a core role in the equipment, but the internal installation space of the power module is compact and the requirements for assembly are high. Therefore, in order to solve the problem of power module assembly, a suitable assembly process method is formulated to ensure the assembly quality of the power module.

[0014] like Figure 1 As shown, the present invention implements a disclosed method for assembling a power module, comprising: S1, cleaning; S2, outer frame assembly; S3, capacitor assembly; S4, power assembly; S5, busbar assembly; S6, remaining parts assembly.

[0015] like Figure 2 , Figure 3 As shown, the power module assembled by the method of the present invention includes an outer frame 1, a capacitor component 2, a power component 3, a busbar component 4 and other components. Figure 5 As shown, the capacitor assembly 2 is composed of a capacitor support plate 21, a shock-absorbing rubber strip 22, and a connecting contact 23. Figure 6 As shown, the power component 3 is composed of a water cooling plate 31 , a water joint 32 , an IGBT 33 and a PCB board 34 .

[0016] The power module assembly process is described in detail in this embodiment as follows.

[0017] S1, clean up.

[0018] The components to be assembled, outsourced and purchased parts, auxiliary materials, etc. are counted and sorted; the water inlet of the water-cooling plate 31 is rinsed with clean water to ensure that the water flow at the water outlet is free of impurities. After the rinse is completed, the remaining water stains inside the water-cooling plate 31 are blown dry with compressed air and the water inlet and outlet are sealed for protection.

[0019] S2, outer frame assembly.

[0020] The outer frame 1 is assembled and formed using fasteners. Figure 4 shown.

[0021] S3, assembly of capacitor assembly 2.

[0022] Assemble the capacitor support plate 21 onto the outer frame 1, and install the capacitor onto the bottom plate of the outer frame 1 through the capacitor support plate 21. Use four short shock-absorbing rubber strips 22 to fix the capacitor and the capacitor support plate 21 for shock absorption. Fine-tune the adjusting nut at the bottom of the capacitor so that the connecting contacts 23 at the top of each capacitor are in the same plane.

[0023] S4, assembly of power component 3.

[0024] a) Apply thread sealant to the first two to three threads of the water connector 32, and install it into the threaded hole of the water cooling plate 31 with a wrench.

[0025] b) First, clean the contact surface between IGBT 33 and water-cooling plate 31 with cotton gauze dipped in anhydrous alcohol. Then, use a coating tool and a special coating mesh to evenly coat the thermal grease on the mounting surface of IGBT 33. Place the coated IGBT 33 on the water-cooling plate 31. Pre-tighten it diagonally with a torque of 0.5 N•m. Then, tighten it in the same order with a torque of 3 to 5 N•m. After one hour, tighten it again with the same torque and sequence.

[0026] c) Apply thread sealant to the mounting screws of the PCB board 34 and install the PCB board 34 onto the IGBT 33 with a torque of 1.8 to 2.1 N•m.

[0027] S5, assembly of the busbar assembly 4.

[0028] Assemble the busbar assembly 4 to the capacitor assembly 2 and the power assembly 3 respectively, and adjust the connection contacts 23 of the capacitor assembly 2 to fully contact with the busbar assembly 4 through the adjusting nut at the bottom of the capacitor assembly 2. Install the busbar assembly 4 with a torque of 4 to 5 N•m for M6 screws and 8 to 10 N•m for M8 screws.

[0029] S6, install the remaining parts to complete the assembly of the power module.

[0030] In summary, the power module assembly process method of the present invention formulates a suitable assembly process method, thereby ensuring the assembly quality of the power module.

[0031] Those skilled in the art can intuitively understand other advantages and effects of the present invention from the contents described in this specification. The details of this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

Claims

1. A method for assembling a power module, for assembling a power module comprising an outer frame (1), a capacitor assembly (2), a power assembly (3) and a busbar assembly (4), wherein the capacitor assembly (2) is composed of a capacitor support plate (21), a shock-absorbing rubber strip (22) and a capacitor and its connecting contacts (23), and the power assembly (3) is composed of a water cooling plate (31), a water connector (32), an IGBT (33) and a PCB board (34); characterized in that: The steps are as follows S1, cleaning: flushing the water inlet of the water cooling plate (31) with clean water to ensure that the water flow at the water outlet is free of impurities. After the flushing is completed, use compressed air to blow dry the remaining water stains inside the water cooling plate (31) and seal the water inlet and outlet for protection; S2, assembling the outer frame (1): assembling the outer frame (1) into shape using fasteners; S3, assembling the capacitor assembly (2): assembling the capacitor support plate (21) onto the outer frame (1), installing the capacitor through the capacitor support plate (21) onto the outer frame (1), and using a shock-absorbing rubber strip (22) to dampen and fix the capacitor and the capacitor support plate (21) so that the connection contacts (23) at the top of each capacitor are in the same plane; S4, assembly of the power component (3): install the water connector (32) into the threaded hole of the water cooling plate (31); first, clean the contact surface between the IGBT (33) and the water cooling plate (31) with anhydrous alcohol, then evenly apply thermal conductive silicone grease on the mounting surface of the IGBT (33) and place it on the water cooling plate (31), pre-tighten it diagonally with a torque of 0.5 N•m, and finally tighten it in the same order with a torque of 3 to 5 N•m; apply thread sealant to the mounting screws of the PCB board (34), and install the PCB board (34) onto the IGBT (33) with a torque of 1.8 to 2.1 N•m; S5, assembling the busbar assembly (4): assemble the busbar assembly (4) onto the capacitor assembly (2) and the power assembly (3) respectively, and install the busbar assembly (4) using a torque of 4 to 5 N·m for M6 screws and a torque of 8 to 10 N·m for M8 screws; S6, install the remaining parts to complete the assembly of the power module.

2. The method for assembling a power module according to claim 1, characterized in that: In the step S4, thread sealant is first applied to the first two to three threads of the thread of the water joint (32), and then the water joint (32) is mounted on the water cooling plate (31) using a wrench.

3. A method for assembling a power module according to claim 2, characterized in that: In the step S4, the IGBT (33) and the water cooling plate (31) are tightened for one hour and then tightened again using the same torque and sequence.

4. A method for assembling a power module according to claim 1, 2 or 3, characterized in that: In step S5, the connection contact (23) of the capacitor assembly (2) is adjusted to be in full contact with the busbar assembly (4) by adjusting the nut at the bottom of the capacitor assembly (2).

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