Surface mounting mechanism and die bonder

Abstract

The invention relates to the technical field of semiconductor processing, and discloses a mounting mechanism, which comprises a main body assembly, a suction nozzle assembly and a connecting assembly, the main body assembly comprises a mounting seat and a first electrifying part; the suction nozzle assembly comprises a base body, a heater, a first conductive part and an adsorption part; according to the suction nozzle assembly, the first conductive part and the first electrifying part are arranged, so that the heater can be electrically connected in a contact conductive manner, and on the basis, the heater is integrated on the base body of the suction nozzle assembly, so that when the suction nozzle assembly and the main body assembly are disassembled and assembled through the connecting assembly, the heater can be electrically connected in a contact conductive manner; the heater and the base body can be assembled and disassembled together, and the assembly and disassembly of the base body cannot be influenced by the arrangement of the heater, so that the suction nozzle assembly can be replaced conveniently on the basis of heating the suction nozzle assembly, and the working efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a mounting mechanism and a crystal bonding machine. Background Art

[0002] Eutectic bonding technology is a bonding technology that fuses metal to metal. It uses various heating methods to melt the alloy layer between eutectic chips, eutectic chips and bases or lead frames, thereby forming a stable metal-to-metal molten bond. Compared with traditional bonding methods, metal-to-metal bonding improves bonding strength, reduces bonding impedance, and improves thermal conductivity.

[0003] At present, when performing a eutectic process, eutectic is usually achieved by substrate heating or nozzle assembly heating. When substrate heating is used, since the chips need to be eutectic on the top of the substrate in sequence, the chips on the top of the substrate will be heated multiple times, causing the eutectic parts of the previously installed chips and the substrate to melt again, affecting the eutectic quality. Although the nozzle assembly heating method can avoid repeated heating of the chip and the substrate at the corresponding position, the existing device integrates the heating structure in the mounting mechanism, which not only causes the structure of the mounting mechanism to be bloated, but also interferes with the disassembly and assembly of the nozzle assembly, making it impossible to adjust the specifications of the nozzle assembly in time according to the needs of the chip, resulting in a decrease in work efficiency. Summary of the invention

[0004] The purpose of the present invention is to provide a mounting mechanism and a die bonding machine, which can conveniently complete the replacement of the nozzle assembly on the basis of heating the nozzle assembly, thereby improving the working efficiency of the device.

[0005] In order to achieve the above-mentioned purpose, the present invention provides a mounting mechanism, comprising: a main body component, a nozzle component and a connecting component; the main body component comprises a mounting seat and a first power-carrying member, the mounting seat has a mounting surface, the first power-carrying member is arranged on the mounting seat, the first power-carrying member has a first power-carrying end, and the first power-carrying end is located on the mounting surface; the nozzle component comprises a substrate, a heater, a first conductive member and an adsorption member, the substrate is detachably mounted on the mounting surface through the connecting component, the heater is arranged on a side of the substrate away from the mounting surface, the first conductive member is arranged on the substrate and electrically connected to the heater, the first conductive member has a first conductive end, and the first conductive end is located on a side of the substrate facing the mounting surface, the adsorption member is arranged on the substrate, the adsorption member has an adsorption end, the adsorption end passes through the substrate and is arranged on the heater, the adsorption end is used to adsorb chips, and as the substrate is mounted on the mounting surface, the first conductive end can be electrically connected to the first power-carrying end.

[0006] Optionally, the mounting surface has a first mounting hole, and the side of the base facing the mounting surface has a protrusion, the protrusion is arranged corresponding to the first mounting hole, and the protrusion is adapted to the first mounting hole, and as the base is installed on the mounting surface, the protrusion can be inserted into the first mounting hole.

[0007] Optionally, the main body component also includes a suction piece, which is arranged in the first mounting hole, and the side of the protrusion facing the mounting surface has a second mounting hole, and the second mounting hole passes through the mounting seat, and the adsorption piece is arranged in the second mounting hole. As the base is installed on the mounting surface, the protrusion can be inserted into the first mounting hole to connect the adsorption piece with the suction piece.

[0008] Optionally, the suction nozzle assembly also includes an elastic member, the inner side wall of the second mounting hole has a convex edge extending inward, the outer side wall of the adsorption member has a flange, the elastic member is arranged on the side of the convex edge facing the mounting surface, the flange of the adsorption member overlaps the side of the elastic member facing the mounting surface, and as the base is installed on the mounting surface, the adsorption member can contact the suction member and compress the elastic member.

[0009] Optionally, the mounting surface is provided with a limiting portion, which extends along the outer peripheral side wall of the mounting seat in a direction away from the mounting surface, and the limiting portion and the mounting surface are combined to form a limiting groove, and the inner peripheral side surface of the limiting portion has a card slot, and the outer peripheral side surface of the base is also provided with a card strip, and the shapes of the card strip and the card slot are adapted, and as the card strip is docked with the card slot, the base can slide along the limiting groove until it is in contact with the mounting surface.

[0010] Optionally, the interior of the substrate is hollow, and the side of the substrate facing away from the mounting surface is open. The heater is installed on the side of the substrate facing away from the mounting surface, and together with the substrate, forms a cavity. The outer peripheral side surface of the substrate has a plurality of hollow holes. The first conductive member is arranged on the side of the substrate facing the mounting surface, and extends through the cavity toward the heater to be electrically connected to the heater. The adsorption member is arranged on the side of the substrate facing the mounting surface, and extends through the cavity toward the heater to pass through the heater.

[0011] Optionally, the substrate is made of ceramic material.

[0012] Optionally, the connecting component includes a magnetic attraction component and a magnetic component, the magnetic attraction component is arranged on the mounting surface, and the magnetic component is arranged on a side of the base facing the mounting surface.

[0013] Optionally, the connecting component includes a plurality of magnetic parts, which are arranged at circumferential intervals along the mounting surface, the magnetic part is annular and corresponds to the plurality of magnetic parts, the base has a mounting groove on the side facing the mounting surface, the magnetic part is arranged in the mounting groove, and the magnetic part has a third mounting hole on the side facing the mounting surface, a fourth mounting hole is provided at a position on the base corresponding to the third mounting hole, the first conductive part passes through the third mounting hole and the fourth mounting hole in sequence to the interior of the base, and passes through the interior of the base to be connected to the heater, and a gap is left between the third mounting hole and the first conductive end.

[0014] Optionally, the main body component includes a plurality of the first power-carrying parts, and the plurality of the first power-carrying ends are arranged at circumferential intervals along the mounting surface; the nozzle assembly includes a plurality of the first conductive parts, and the plurality of the first conductive ends are respectively arranged in one-to-one correspondence with the plurality of the first power-carrying ends.

[0015] Optionally, the nozzle assembly also includes a sensor and a second conductive member, the sensor is arranged in the heater, the main body assembly also includes a second conductive member, the second conductive member has a second conductive end, the second conductive member is arranged on the mounting seat, and the second conductive end is located on the mounting surface and is spaced apart from the first conductive end, the second conductive member is arranged on the substrate and is electrically connected to the sensor, the second conductive member has a second conductive end, the second conductive end is arranged on a side of the substrate facing the mounting surface, and as the substrate is installed on the mounting surface, the second conductive end can be electrically connected to the second conductive end.

[0016] Optionally, the first conductive member includes a conductive contact and a wire, the conductive contact is arranged on a side of the base facing the mounting seat, and the end of the conductive contact facing the mounting surface is the first conductive end, the wire is arranged inside the base, and one end is electrically connected to the conductive contact, and the other end is electrically connected to the heater.

[0017] Optionally, the nozzle assembly also includes a heat conductive member, one side of the heat conductive member has an adsorption hole, the heat conductive member is sleeved on the adsorption end through the adsorption hole, and the adsorption hole passes through the side of the heat conductive member facing away from the heater, the side of the heat conductive member facing the heater is in contact with the heater, and the side of the heat conductive member facing away from the heater is a heating surface, which is used to heat the chip.

[0018] In order to achieve the same purpose, the present application also provides a die bonding machine, including the mounting mechanism as described above.

[0019] Compared with the prior art, the mounting mechanism and the die bonding machine of the embodiment of the present invention have the following beneficial effects: the present application sets a first conductive member and a first energizing member so that the heater can be electrically connected in a contact conductive manner. Specifically, after the nozzle assembly is installed to the main assembly, the first conductive end of the first conductive member can contact the first energizing end of the first energizing member, and the first energizing member transmits current to the heater through the first conductive member to energize the heater. On this basis, the present application integrates the heater on the substrate of the nozzle assembly so that when the nozzle assembly and the main assembly are disassembled and assembled through the connecting assembly, The heater and the base can be disassembled and assembled together, and the setting of the heater will not affect the disassembly and assembly of the base, so that the present application can not only heat the nozzle assembly, but also conveniently complete the replacement of the nozzle assembly, thereby improving work efficiency. In addition, since the present application sets the heater on the side of the mounting surface away from the nozzle and contacts the adsorption end of the adsorption part, the adsorption end can be heated more directly, which improves the eutectic effect while not directly transferring heat to the main component. During this period, the base of the nozzle assembly will also buffer the heat dissipation to reduce the impact on the service life of the main component. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] exist Figure 1 is a structural schematic diagram of the mounting mechanism according to an embodiment of the present invention;

[0021] Figure 2 is a schematic structural diagram of the main body assembly of an embodiment of the present invention;

[0022] Figure 3 The embodiment of the present invention Figure 2 A magnified image of point A;

[0023] Figure 4 is a schematic structural diagram of the nozzle assembly according to an embodiment of the present invention;

[0024] Figure 5 is a schematic diagram of the connection structure of the main body assembly and the nozzle assembly in an embodiment of the present invention;

[0025] Figure 6 is a schematic diagram of a connection structure between the first current-carrying member and the first conductive member according to an embodiment of the present invention;

[0026] Figure 7 The embodiment of the present invention Figure 6 The enlarged view of point B;

[0027] Figure 8 is a top view of the nozzle assembly according to an embodiment of the present invention;

[0028] Fig. 9 The embodiment of the present invention Figure 8Cross-sectional view in CC direction;

[0029] Fig.10 is a schematic diagram of the internal structure of the nozzle assembly according to an embodiment of the present invention;

[0030] Fig.11 is a schematic structural diagram of the substrate according to an embodiment of the present invention;

[0031] Fig.12 is a schematic structural diagram of the fixing plate according to an embodiment of the present invention;

[0032] Fig.13 4 is a bottom view of the suction nozzle assembly according to an embodiment of the present invention.

[0033] In the figure, 1, main body assembly; 11, mounting seat; 111, mounting surface; 1111, first mounting hole; 112, limiting portion; 1121, slot; 113, limiting slot; 12, first power supply member; 121, first power supply end; 13, suction member; 14, second power supply member; 141, second power supply end; 2, nozzle assembly; 21, base; 211, protrusion; 2111, second mounting hole; 2112, protruding edge; 212, hollow hole; 213, mounting slot; 214, fourth mounting hole; 2141, abutment portion ; 215, card strip; 22, heater; 23, first conductive member; 231, conductive contact; 2311, first conductive end; 2312, abutment block; 232, wire; 24, adsorption member; 241, flange; 25, elastic member; 26, sensor; 27, second conductive member; 271, second conductive end; 28, fixing plate; 281, fifth mounting hole; 29, heat-conducting member; 291, adsorption hole; 292, heating surface; 3, connecting component; 31, magnetic member; 32, magnetic member; 321, third mounting hole. DETAILED DESCRIPTION

[0034] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0035] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0036] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0038] like Figure 1-Figure 7 As shown, a mounting mechanism according to an embodiment of the present invention comprises: a main body component 1, a nozzle component 2 and a connecting component 3; the main body component 1 comprises a mounting seat 11 and a first conducting member 12, the mounting seat 11 has a mounting surface 111, the first conducting member 12 is arranged on the mounting seat 11, the first conducting member 12 has a first conducting end 121, and the first conducting end 121 is located on the mounting surface 111; the nozzle component 2 comprises a base 21, a heater 22, a first conductive member 23 and an adsorbent 24, the base 21 is detachably mounted on the mounting surface 111 through the connecting component 3, the heater 2 2 is arranged on a side of the substrate 21 away from the mounting surface 111, the first conductive member 23 is arranged on the substrate 21 and is electrically connected to the heater 22, the first conductive member 23 has a first conductive end 2311, the first conductive end 2311 is located on a side of the substrate 21 facing the mounting surface 111, the adsorption member 24 is arranged on the substrate 21, the adsorption member 24 has an adsorption end, the adsorption end passes through the substrate 21 and is arranged on the heater 22, the adsorption end is used to adsorb the chip, and when the substrate 21 is installed on the mounting surface 111, the first conductive end 2311 can be electrically connected to the first power-on end 121.

[0039] Based on the above scheme, the present application sets a first conductive member 23 and a first energizing member 12 so that the heater 22 can be electrically connected in a contact conductive manner. Specifically, after the nozzle assembly 2 is installed to the main assembly 1, the first conductive end 2311 of the first conductive member 23 can contact the first energizing end 121 of the first energizing member 12, and the first energizing member 12 transmits current to the heater 22 through the first conductive member 23 to energize the heater 22. On this basis, the present application integrates the heater 22 on the base 21 of the nozzle assembly 2 so that when the nozzle assembly 2 and the main assembly 1 are disassembled and assembled through the connecting assembly 3, the heater 22 and The base 21 can be disassembled and assembled together, and the setting of the heater 22 will not affect the disassembly and assembly of the base 21, so that the present application can not only heat the suction nozzle assembly 2, but also conveniently complete the replacement of the suction nozzle assembly 2, thereby improving work efficiency. In addition, since the present application sets the heater 22 on the side of the mounting surface 111 away from the suction nozzle, and contacts the adsorption end of the adsorption member 24, it can heat the adsorption end more directly, thereby improving the eutectic effect, and will not directly transfer heat to the main component 1. During this period, the base 21 of the suction nozzle assembly 2 will also buffer the heat dissipation, thereby reducing the impact on the service life of the main component 1.

[0040] like Figure 3-Figure 5 As shown, in order to facilitate the positioning of the base 21 relative to the mounting seat 11 and the docking positioning of the first power-carrying end 121 and the first conductive end 2311, the mounting surface 111 has a first mounting hole 1111, and the side of the base 21 facing the mounting surface 111 has a protrusion 211, the protrusion 211 is arranged corresponding to the first mounting hole 1111, and the protrusion 211 is adapted to the first mounting hole 1111. As the base 21 is installed on the mounting surface 111, the protrusion 211 can be inserted into the first mounting hole 1111, and the positioning of the base 21 relative to the mounting seat 11 is achieved through the cooperation of the protrusion 211 and the first mounting hole 1111, and the docking of the first power-carrying end 121 and the first conductive end 2311 can be achieved.

[0041] like Figure 3-Figure 5As shown, in order to achieve the connectivity of the adsorption member 24, the main body component 1 also includes a suction member 13, and the suction member 13 is arranged in the first mounting hole 1111. The protrusion 211 has a second mounting hole 2111 on the side facing the mounting surface 111, and the second mounting hole 2111 passes through the mounting seat 11, and the adsorption member 24 is arranged in the second mounting hole 2111. As the base 21 is installed on the mounting surface 111, the protrusion 211 can be inserted into the first mounting hole 1111 to connect the adsorption member 24 with the suction member 13. By setting the adsorption member 24 in the first mounting hole 1111 and the suction member 13 in the second mounting hole 2111, the correspondence between the adsorption member 24 and the suction member 13 can be achieved by utilizing the cooperation of the protrusion 211 and the first mounting hole 1111. Such a setting not only achieves the connectivity of the adsorption member 24, but also reduces the setting of the corresponding structures for the suction member 13 and the adsorption member 24, making the structure simpler.

[0042] like Figure 8 and Fig. 9 As shown, in order to facilitate the connection between the adsorption member 24 and the suction member 13, the suction nozzle assembly 2 also includes an elastic member 25, the inner peripheral side wall of the second mounting hole 2111 has an inwardly extending convex edge 2112, the outer peripheral side wall of the adsorption member 24 has a flange 241, the elastic member 25 is arranged on the side of the convex edge 2112 facing the mounting surface 111, the flange 241 of the adsorption member 24 overlaps the side of the elastic member 25 facing the mounting surface 111, as the base 21 is installed on the mounting surface 111, the adsorption member 24 can contact with the suction member 13, and then the flange 241 and the convex edge 2112 squeeze the elastic member 25, and the elastic member 25 is provided to provide a buffer for the contact between the adsorption member 24 and the suction member 13, thereby avoiding damage to the adsorption member 24 and the suction member 13 during docking.

[0043] like Figure 2-Figure 5 As shown, in order to facilitate the positioning of the base 21 relative to the mounting seat 11 and the docking of the first power-carrying end 121 and the first conductive end 2311, the mounting surface 111 is provided with a limiting portion 112, the limiting portion 112 extends along the outer peripheral side wall of the mounting seat 11 in a direction away from the mounting surface 111, the limiting portion 112 and the mounting surface 111 are enclosed to form a limiting groove 113, the inner peripheral side surface of the limiting portion 112 has a card groove 1121, and the outer peripheral side surface of the base 21 A clamping strip 215 is also provided, and the shapes of the clamping strip 215 and the clamping slot 1121 are adapted to each other. As the clamping strip 215 is docked with the clamping slot 1121, the base 21 can slide along the limiting groove 113 until it is in contact with the mounting surface 111. The positioning of the base 21 relative to the mounting seat 11 is achieved through the cooperation between the limiting groove 113 and the base 21, and the cooperation between the clamping strip 215 and the clamping slot 1121, and the docking of the first power-on end 121 and the first conductive end 2311 can be achieved.

[0044] like Figure 2-Figure 5As shown, the protrusion 211 is cylindrical, the base 21 is truncated cone, and the side with a larger diameter is arranged toward the side of the mounting surface 111, the limiting groove 113 and the base 21 are adapted to each other, and the first mounting hole 1111 is adapted to the protrusion 211, that is, the axial direction of the suction nozzle assembly 2 is limited by the limiting groove 113 and the first mounting hole 1111, and the circumferential direction of the suction nozzle assembly 2 is limited by the cooperation of the clamping strip 215 and the clamping groove 1121, thereby ensuring the docking of the first conductive member 23 and the first current-carrying member 12.

[0045] like Figure 4 , Fig.10 and Fig.11 As shown, in order to improve the heat dissipation capacity of the base 21, the interior of the base 21 is hollow, and the side of the base 21 facing away from the mounting surface 111 is open. The heater 22 is installed on the side of the base 21 facing away from the mounting surface 111, and together with the base 21, a cavity is enclosed. The outer peripheral side of the base 21 has a plurality of hollow holes 212. The first conductive member 23 is arranged on the side of the base 21 facing the mounting surface 111, and extends through the cavity to the heater 22 to be electrically connected to the heater 22. The adsorption member 24 is arranged on the side of the base 21 facing the mounting surface 111, and extends through the cavity to the heater 22 to pass through the heater 22. The present application sets the interior of the base 21 to a hollow state, and opens a plurality of hollow holes 212 on the outer peripheral side of the base 21 to dissipate heat to the first conductive member 23 and the heater 22, thereby reducing the heat transferred to the main component 1.

[0046] Optionally, in order to improve the heat dissipation capability and reduce the deformation of the structure, the substrate 21 is made of ceramic material.

[0047] like Figure 2-Figure 5 As shown, in order to facilitate the disassembly and assembly of the main assembly 1 and the nozzle assembly 2, the connecting assembly 3 includes a magnetic component 31 and a magnetic component 32. The magnetic component 31 is arranged on the mounting surface 111, and the magnetic component 32 is arranged on the side of the base 21 facing the mounting surface 111.

[0048] like Figure 3 , Figure 4 , Figure 8 , Fig.10 and Fig.11As shown, in order to ensure the stability of magnetic attraction, the connecting component 3 includes a plurality of magnetic members 31, and the plurality of magnetic members 31 are arranged at intervals along the circumference of the mounting surface 111. The magnetic member 32 is annular and corresponds to the plurality of magnetic members 31. The base 21 has a mounting groove 213 on the side facing the mounting surface 111, and the magnetic member 32 is arranged in the mounting groove 213. The magnetic member 32 has a third mounting hole 321 on the side facing the mounting surface 111, and a fourth mounting hole 21 is provided on the base 21 at a position corresponding to the third mounting hole 321. 4. The first conductive member 23 passes through the third mounting hole 321 and the fourth mounting hole 214 in sequence to the inside of the base 21, and passes through the inside of the base 21 to be connected with the heater 22, and a gap is left between the third mounting hole 321 and the first conductive end 2311. The uniformity and magnitude of the magnetic force are ensured by arranging the annular magnetic member 32 and the plurality of magnetic attracting members 31, and the gap between the third mounting hole 321 and the first conductive end 2311 is used to prevent the magnetic member 32 and the first conductive end 2311 from being connected to cause a short circuit.

[0049] like Figure 5 , Fig. 9 and Fig.10 As shown, the side of the magnetic member 32 facing the mounting surface 111 is received in the mounting groove 213. When the base 21 is mounted on the mounting surface 111 through the cooperation of the magnetic member 32 and the magnetic attraction member 31, the side of the base 21 facing the mounting surface 111 abuts against the mounting surface 111, and a space is left between the magnetic member 32 and the magnetic attraction member 31 provided on the mounting surface 111. In the present application, the magnetic member 32 is arranged to be received in the mounting groove 213, and a closed space is formed by the mounting groove 213 and the mounting surface 111 to avoid the external environment from affecting the contact electrical connection between the first conductive end 2311 and the first power-on end 121 during the use of the heater 22, and the space left between the magnetic member 32 and the magnetic attraction member 31 is used for heat dissipation of the electrical connection between the first conductive end 2311 and the first power-on end 121.

[0050] In some embodiments, the elastic member 25 is an elastic sealing ring, which can prevent the external air from passing through the space between the adsorption member 24 and the second mounting hole 2111 and affecting the contact electrical connection between the first conductive end 2311 and the first power-on end 121 while achieving a buffering effect.

[0051] like Figure 3 , Figure 4 and Figure 6As shown, in order to increase the input power to the heater 22, the main body component 1 includes a plurality of first power-carrying parts 12, and a plurality of first power-carrying ends 121 are arranged at circumferential intervals along the mounting surface 111. The nozzle component 2 includes a plurality of first conductive parts 23, and a plurality of first conductive ends 2311 are arranged one-to-one with the plurality of first power-carrying ends 121, respectively. By arranging a plurality of first power-carrying parts 12 and a plurality of first conductive parts 23, the input power to the heater 22 is increased, and the heater 22 is quickly heated up. Moreover, compared with the method of supplying power by a wiring harness, the method of supplying power jointly by the plurality of first power-carrying parts 12 and the plurality of first conductive parts 23 can also reduce the heat generated during the transmission of the current.

[0052] like Figure 3 , Figure 4 and Fig.11 As shown, in order to facilitate real-time detection and control of the temperature of the heater 22, the nozzle assembly 2 also includes a sensor 26 and a second conductive member 27, the sensor 26 is arranged in the heater 22, the main assembly 1 also includes a second conductive member 14, the second conductive member 14 has a second conductive end 141, the second conductive member 14 is arranged on the mounting seat 11, and the second conductive end 141 is located on the mounting surface 111 and is spaced apart from the first conductive end 121, the second conductive member 27 is arranged on the substrate 21, and is electrically connected to the sensor 26, and the second conductive member 27 has a second conductive end 271, and the second conductive end 271 is arranged on the side of the base 21 facing the mounting surface 111. When the base 21 is installed on the mounting surface 111, the second conductive end 271 can be electrically connected to the second power-on end 141. The temperature of the heater 22 is detected by setting the sensor 26. In addition, by setting the second power-on member 14 and the second conductive member 27, the sensor 26 can also be integrated on the nozzle assembly 2 in a contact conductive manner, thereby avoiding affecting the disassembly and assembly of the nozzle assembly 2.

[0053] like Figure 3 and Figure 4 As shown, for ease of assembly, the first current-carrying member 12 and the second current-carrying member 14 have the same structure, the first conductive end 2311 of the first conductive member 23 and the second conductive end 271 of the second conductive member 27 have the same structure, and the first current-carrying member 12 and the second current-carrying member 14 are arranged along the circumference of the mounting surface 111.

[0054] like Figure 8 and Fig.11 As shown, for ease of use, the first conductive member 23 includes a conductive contact 231 and a wire 232. The conductive contact 231 is disposed on the side of the base 21 facing the mounting seat 11, and the end of the conductive contact 231 facing the mounting surface 111 is a first conductive end 2311. The wire 232 is disposed inside the base 21, and one end is electrically connected to the conductive contact 231, and the other end is electrically connected to the heater 22.

[0055] like Figure 7 , Fig.10 , Fig.11 and Fig.12 As shown, in order to facilitate assembly, the conductive contact 231 and the wire 232 are detachably connected. In combination with the above technical solution, the nozzle assembly 2 also includes a fixing plate 28, which is located inside the base 21, and the fixing plate 28 has a plurality of fifth mounting holes 281. The plurality of fifth mounting holes 281 and the plurality of fourth mounting holes 214 are arranged one by one. The inner peripheral side wall of the fourth mounting hole 214 has an abutment portion 2141 extending inwardly, and the outer peripheral side wall of the conductive contact 231 has an abutment block 2312 extending outwardly. The conductive contact 231 is sequentially penetrated in the third mounting hole 321, the fourth mounting hole 214, and the conductive contact 231 is sequentially penetrated in the third mounting hole 321, the fourth mounting hole 214, and the conductive contact 231 is sequentially penetrated in the third mounting hole 321, the fourth mounting hole 214, and the conductive contact 231 is sequentially penetrated in the third mounting hole 321, the fourth mounting hole 214, and the conductive contact 231 is sequentially penetrated in the third mounting hole 321, the fourth mounting hole 214, and the conductive contact 231 is sequentially penetrated in the third mounting hole 321, the fifth ... The fourth mounting hole 214 and the fifth mounting hole 281, and the abutment block 2312 can be clamped between the abutment portion 2141 and the fixed plate 28, and the end of the conductive contact 231 away from the mounting surface 111 can pass through the fifth mounting hole 281 from the fixed plate 28 to connect with the wire 232. When assembling the suction nozzle assembly 2, the conductive contact 231 can be first installed on the base 21 through the fixed plate 28, and then the wire 232 and the conductive contact 231 are connected. Finally, the adsorption component 24 and the heater 22 are installed on the base 21, and the wire 232 is connected to the heater 22.

[0056] like Figure 4 , Figure 5 and Fig.13 As shown, in order to improve the heating effect of the chip, the suction nozzle assembly 2 also includes a heat conductor 29, and one side of the heat conductor 29 has an adsorption hole 291. The heat conductor 29 is sleeved on the adsorption end through the adsorption hole 291, and the adsorption hole 291 runs through the side of the heat conductor 29 away from the heater 22, and the side of the heat conductor 29 facing the heater 22 is in contact with the heater 22. The side of the heat conductor 29 away from the heater 22 is a heating surface 292, and the heating surface 292 is used to heat the chip. The heat of the heater 22 is transferred to the chip by setting the heat conductor 29, and since the specifications of the heat conductor 29 can be adjusted according to the size of the chip, the heat transferred by the heat conductor 29 can be more evenly transferred to the chip, thereby avoiding quality problems of the chip caused by regional temperature differences.

[0057] In order to achieve the same purpose, a die bonding machine according to an embodiment of the present invention includes the mounting mechanism as described above.

[0058] In summary, the embodiment of the present invention provides a mounting mechanism and a die bonding machine, which enable the heater 22 to be electrically connected in a contact conductive manner by setting a first conductive member 23 and a first energizing member 12. Specifically, after the nozzle assembly 2 is installed to the main assembly 1, the first conductive end 2311 of the first conductive member 23 can contact the first energizing end 121 of the first energizing member 12, and the first energizing member 12 transmits current to the heater 22 through the first conductive member 23 to energize the heater 22. On this basis, the present application integrates the heater 22 on the base 21 of the nozzle assembly 2, so that the present application can be disassembled and assembled from the nozzle assembly 2 and the main assembly 1 through the connecting assembly 3. The heater 22 and the base 21 can be disassembled and assembled together, and the setting of the heater 22 will not affect the disassembly and assembly of the base 21, so that the present application can not only heat the suction nozzle assembly 2, but also conveniently complete the replacement of the suction nozzle assembly 2, thereby improving work efficiency. In addition, since the present application sets the heater 22 on the side of the mounting surface 111 away from the suction nozzle, and contacts with the adsorption end of the adsorption member 24, it is possible to heat the adsorption end more directly, thereby improving the eutectic effect, and the heat will not be directly transferred to the main component 1. During this period, the base 21 of the suction nozzle assembly 2 will also buffer the heat dissipation, thereby reducing the impact on the service life of the main component 1.

[0059] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A mounting mechanism, characterized in that: include: Main body assembly, nozzle assembly and connection assembly; The main body assembly comprises a mounting seat and a first power supply member, wherein the mounting seat has a mounting surface, the first power supply member is arranged on the mounting seat, and the first power supply member has a first power supply end, and the first power supply end is located on the mounting surface; The suction nozzle assembly includes a base, a heater, a first conductive member and an adsorption member. The base is detachably mounted on the mounting surface through the connecting assembly. The heater is disposed on a side of the base facing away from the mounting surface. The first conductive member is disposed on the base and is electrically connected to the heater. The first conductive member has a first conductive end, which is located on a side of the base facing the mounting surface. The adsorption member is disposed on the base. The adsorption member has an adsorption end, which passes through the base and is disposed on the heater. The adsorption end is used to adsorb chips. As the base is mounted on the mounting surface, the first conductive end can be electrically connected to the first energized end.

2. The mounting mechanism according to claim 1, characterized in that: The mounting surface has a first mounting hole, and the base has a protrusion on a side facing the mounting surface. The protrusion is arranged corresponding to the first mounting hole and is adapted to the first mounting hole. As the base is mounted on the mounting surface, the protrusion can be inserted into the first mounting hole.

3. The mounting mechanism according to claim 2, characterized in that: The main body component also includes a suction piece, which is arranged in the first mounting hole. The side of the protrusion facing the mounting surface has a second mounting hole, and the second mounting hole passes through the mounting seat. The adsorption piece is arranged in the second mounting hole. As the base is installed on the mounting surface, the protrusion can be inserted into the first mounting hole to connect the adsorption piece with the suction piece.

4. The mounting mechanism according to claim 3, characterized in that: The suction nozzle assembly also includes an elastic member, the inner side wall of the second mounting hole has a convex edge extending inward, the outer side wall of the adsorption member has a flange, the elastic member is arranged on the side of the convex edge facing the mounting surface, the flange of the adsorption member overlaps the side of the elastic member facing the mounting surface, and as the base is installed on the mounting surface, the adsorption member can contact the suction member and compress the elastic member.

5. The mounting mechanism according to claim 1, characterized in that: The mounting surface is provided with a limiting portion, which extends along the outer peripheral side wall of the mounting seat in a direction away from the mounting surface, and the limiting portion and the mounting surface are enclosed to form a limiting groove, and the inner peripheral side surface of the limiting portion has a card slot, and the outer peripheral side surface of the base is also provided with a card strip, and the shape of the card strip and the card slot are adapted, and as the card strip is docked with the card slot, the base can slide along the limiting groove until it is in contact with the mounting surface.

6. The mounting mechanism according to claim 1, characterized in that: The interior of the substrate is hollow, and the side of the substrate facing away from the mounting surface is open. The heater is installed on the side of the substrate facing away from the mounting surface, and together with the substrate, forms a cavity. The outer peripheral side of the substrate has a plurality of hollow holes. The first conductive member is arranged on the side of the substrate facing the mounting surface, and extends through the cavity toward the heater to be electrically connected to the heater. The adsorption member is arranged on the side of the substrate facing the mounting surface, and extends through the cavity toward the heater to pass through the heater.

7. The mounting mechanism according to claim 1, characterized in that: The connecting component comprises a magnetic attraction member and a magnetic member. The magnetic attraction member is arranged on the installation surface, and the magnetic member is arranged on a side of the base body facing the installation surface.

8. The mounting mechanism according to claim 7, characterized in that: The connecting component includes a plurality of magnetic members, which are arranged at intervals along the circumference of the mounting surface, the magnetic member is annular and corresponds to the plurality of magnetic members, the substrate has a mounting groove on the side facing the mounting surface, the magnetic member is arranged in the mounting groove, and the magnetic member has a third mounting hole on the side facing the mounting surface, a fourth mounting hole is provided at a position on the substrate corresponding to the third mounting hole, and the first conductive member passes through the third mounting hole in sequence. The fourth mounting hole reaches the interior of the substrate, and passes through the interior of the substrate to be connected to the heater, and a gap is left between the third mounting hole and the first conductive end.

9. The mounting mechanism according to claim 1, characterized in that: The main body component includes a plurality of the first power-carrying parts, and the plurality of the first power-carrying ends are arranged at intervals along the circumference of the mounting surface. The nozzle component includes a plurality of the first conductive parts, and the plurality of the first conductive ends are respectively arranged in one-to-one correspondence with the plurality of the first power-carrying ends.

10. The mounting mechanism according to claim 1, characterized in that: The nozzle assembly also includes a sensor and a second conductive member, the sensor is arranged in the heater, the main body assembly also includes a second conductive member, the second conductive member has a second conductive end, the second conductive member is arranged on the mounting seat, and the second conductive end is located on the mounting surface and is spaced apart from the first conductive end, the second conductive member is arranged on the substrate and is electrically connected to the sensor, the second conductive member has a second conductive end, the second conductive end is arranged on a side of the substrate facing the mounting surface, and as the substrate is installed on the mounting surface, the second conductive end can be electrically connected to the second conductive end.

11. The mounting mechanism according to claim 1, characterized in that: The first conductive member includes a conductive contact and a wire, wherein the conductive contact is arranged on a side of the base facing the mounting seat, and the end of the conductive contact facing the mounting surface is the first conductive end, and the wire is arranged inside the base, and one end of the conductive contact is electrically connected to the conductive contact, and the other end is electrically connected to the heater.

12. The mounting mechanism according to any one of claims 1 to 11, characterized in that: The nozzle assembly also includes a heat conductive member, one side of the heat conductive member has an adsorption hole, the heat conductive member is sleeved on the adsorption end through the adsorption hole, and the adsorption hole passes through the side of the heat conductive member away from the heater, the side of the heat conductive member facing the heater is in contact with the heater, and the side of the heat conductive member away from the heater is a heating surface, which is used to heat the chip.

13. A die bonding machine, characterized in that: It comprises a mounting mechanism as described in any one of claims 1-12.

Images