Manufacturing method of display module, display module and display device

Abstract

The application relates to the technical field of display, in particular to a manufacturing method of a display module, the display module and a display device. The display module comprises a substrate with metal lines, the substrate comprises at least one metal pad group, and the metal pad group comprises a pair of metal pads. First, a first protective layer is formed on the substrate, then the first protective layer in the area except the area corresponding to the metal lines between the pair of metal pads is removed, then a second protective layer is formed, then the second protective layer corresponding to the metal pad group is etched to form a containing cavity with an acute angle inclined surface, and finally, a connecting metal is brushed on the containing cavity to connect the pair of metal pads of the metal pad group. When the connecting metal is brushed, the connecting metal on both sides will be subjected to the force of the acute angle inclined surface to move towards the center of the containing cavity, and after solidification, the pair of metal pads can be connected to serve as a "wire" to increase the width of the lines on the substrate.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a method for manufacturing a display module, a display module, and a display device. Background Art

[0002] To reduce costs and compete with PCB backlighting, current research is exploring a single-layer metal trace solution on the substrate. However, due to the limitations of the IC and LED array, the driver traces in some locations are relatively thin, making routing difficult and significantly impacting backlight uniformity and the trace's current handling capacity. Therefore, a solution using externally bonded 0-ohm resistors to increase the in-plane trace width has been adopted. However, this increases the resistor and bonding costs, impacting product yield and making it unsuitable for mass production. Summary of the Invention

[0003] The object of the present invention is to provide a method for manufacturing a display module, a display module and a display device, which form a conductive line by forming a connecting metal at a metal pad to replace the setting of a 0-ohm resistor, thereby increasing the line width of the in-plane routing, facilitating routing, and reducing costs.

[0004] In order to achieve the above objectives, the technical solutions adopted in the embodiments of the present invention are as follows:

[0005] In a first aspect, a method for manufacturing a display module comprises: providing a substrate having a metal circuit, the substrate comprising at least one metal pad group, the metal pad group comprising a pair of metal pads; forming a first protective layer on the substrate; retaining the first protective layer corresponding to the metal circuit between the pair of metal pads, and removing the first protective layer corresponding to the remaining area on the substrate; forming a second protective layer on the substrate; etching the second protective layer corresponding to the metal pad group to form a receiving cavity with an acute-angled inclined surface, the metal pad group being in the receiving cavity; and brushing connecting metal on the receiving cavity to connect the pair of metal pads of the metal pad group together.

[0006] A metal pad group is set on the substrate, and the metal pad group includes a pair of metal pads; the metal circuit between the pair of metal pads is first insulated and protected by a first protective layer, and then a second protective layer is etched to form a accommodating cavity with an acute-angled inclined surface. When the accommodating cavity is brushed with connecting metal, the two sides of the connecting metal are subjected to the force of the acute-angled inclined surface, squeezing the connecting metal toward the center. After solidification, the pair of metal pads can be connected together, playing the role of a "wire", which can facilitate routing in different substrate areas and replace the 0 ohm resistor; at the same time, it is ensured that the metal circuit between the pair of metal pads is protected by the first protective layer and insulated to prevent short circuit.

[0007] Furthermore, the step of etching the second protective layer at the corresponding position of the metal pad group to form a receiving cavity having an acute-angle inclined surface includes: using light of predetermined power to etch the second protective layer at the corresponding position of the metal pad group, and forming a receiving cavity having an acute-angle inclined surface through scattering, diffraction or reflection of the light.

[0008] The second protective layer corresponding to the metal pad group is etched by light of predetermined power, i.e., "high-dose exposure". After the light is irradiated, it will cause scattering, diffraction or reflection at the position below or inside the second protective layer, so that the etching degree below the second protective layer is greater than the etching degree above, thereby forming a accommodating cavity with an acute-angle inclined surface.

[0009] Furthermore, the step of brushing connecting metal at the accommodating cavity to connect a pair of metal pads of the metal pad group together includes: covering the substrate with a printing mold having an opening corresponding to the accommodating cavity, brushing connecting metal, and the connecting metal is acted upon by the force of the acute-angled inclined surface of the accommodating cavity on both sides during the curing process, and flows toward the center of the accommodating cavity to connect the pair of metal pads of the metal pad group together.

[0010] By brushing connecting metal in the accommodating cavity, during the heating and curing process of the connecting metal, since the accommodating cavity itself has a sharp inclined surface, it will exert force on the connecting metal from both sides to squeeze the connecting metal toward the center, thereby connecting a pair of metal pads together to form a wire, replacing the 0 ohm resistor.

[0011] Furthermore, the substrate also includes a plurality of bonding pads, each of which is used to bond electronic components; after the step of forming a second protective layer on the substrate, it also includes: etching the second protective layer corresponding to the plurality of bonding pads to expose the plurality of bonding pads; forming a bonding metal on each of the bonding pads for bonding with the electronic components.

[0012] By arranging a plurality of bonding pads on the substrate, the bonding pads can also be bonded to a variety of electronic components, such as a driver IC or a light-emitting chip, so that the substrate can perform display.

[0013] Furthermore, the step of forming a second protective layer on the substrate includes: forming an organic layer on the substrate; and forming a white oil layer on the organic layer.

[0014] The organic layer is usually transparent, and the white oil layer is usually opaque. Placing the organic layer close to the substrate and the white oil layer away from the substrate can better avoid the problem of reflection of the emitted light and affecting the visual effect.

[0015] In a second aspect, a display module is provided, wherein the display module is manufactured according to the manufacturing method of the display module.

[0016] In a third aspect, a display device is provided, comprising a packaging substrate and the display module, wherein the packaging substrate is fixed on the display module.

[0017] An embodiment of the present invention provides a method for manufacturing a display module, a display module, and a display device. The display module includes a substrate with a metal circuit, the substrate includes at least one metal pad group, and the metal pad group includes a pair of metal pads; a first protective layer is first formed on the substrate, and then the first protective layer is removed from the area other than the first protective layer corresponding to the metal circuit between the pair of metal pads, and then a second protective layer is formed, and then the second protective layer corresponding to the metal pad group is etched to form a accommodating cavity with an acute-angled inclined surface, and the metal pad group is located in the accommodating cavity; finally, connecting metal is brushed on the accommodating cavity to connect the pair of metal pads of the metal pad group together. This solution is achieved by arranging a metal pad group including a pair of metal pads on the substrate, and forming a accommodating cavity with an acute-angled inclined surface around the metal pad group, so that when the connecting metal is brushed, the two sides of the connecting metal will be subjected to the force of the acute-angled inclined surface to move toward the center of the accommodating cavity. After solidification, the pair of metal pads can be connected to act as "wires" to increase the width of the wiring on the substrate; at the same time, the metal wiring between the pair of metal pads has been protected by the first protective layer, there will be no short circuit problem, and the performance of the substrate is guaranteed.

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A schematic structural diagram of an existing solution provided by an embodiment of the present invention is shown.

[0021] Figure 2 A structural schematic diagram of a 0-ohm resistor setting method provided by an embodiment of the present invention is shown.

[0022] Figure 3 A schematic flow chart of a method for manufacturing a display module provided by an embodiment of the present invention is shown.

[0023] Figure 4 A schematic structural diagram of a substrate provided by an embodiment of the present invention is shown.

[0024] Figure 5 A schematic diagram of forming a first protective layer provided by an embodiment of the present invention is shown.

[0025] Figure 6 A schematic diagram of processing the second protective layer provided by an embodiment of the present invention is shown.

[0026] Figure 7 A comparative schematic diagram of etching states of the second protective layer 140 using different doses of light provided by an embodiment of the present invention is shown.

[0027] Figure 8 A schematic diagram showing the etching state of the second protective layer by light provided by an embodiment of the present invention is shown.

[0028] Figure 9 A schematic diagram of the state of the second protective layer after etching provided by an embodiment of the present invention is shown.

[0029] Figure 10 A schematic diagram of a metal connection after reflow soldering under normal circumstances provided by an embodiment of the present invention is shown.

[0030] Figure 11 A schematic diagram showing the stress conditions of the connecting metal in the accommodating cavity provided by an embodiment of the present invention is shown.

[0031] Figure 12 A schematic structural diagram of a printing mold provided by an embodiment of the present invention is shown.

[0032] Diagram:

[0033] 100 - substrate; 110 - metal trace; 120 - metal pad group; 121 - metal pad; 122 - bonding pad; 130 - first protective layer; 140 - second protective layer; 141 - receiving cavity; 150 - connection metal; 160 - printing mold; 161 - first opening; 162 - second opening. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present invention.

[0035] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. At the same time, in the description of the present invention, the terms "first", "second", etc. are used only to distinguish the description and should not be understood as indicating or implying relative importance.

[0036] Please refer to Figure 1 As shown, it is a schematic diagram of the structure of the existing scheme. The metal trace 110 in the current substrate 100 is first formed by vapor-depositing a layer of metal on the entire layer of the substrate 100, and then by patterned etching. Taking the structure in the figure as an example, a driver IC is placed at the metal trace position in the center of the substrate 100. One driver IC is used to synchronously drive 16 LEDs. The 16 LEDs are grouped in groups of 4, and are divided into 4 groups in total. Taking the figure as an example, they can be distributed in the upper left, lower left, upper right, and lower right four areas of the substrate 100. The 4 LEDs in each group are connected in series and then connected to the driver IC. Since the metal trace 110 is formed by etching after vapor-depositing the metal layer, in order to realize cross-regional connection wiring between the four areas of upper left, lower left, upper right, and lower right, if the metal trace 110 is directly formed by etching after vapor-depositing the metal, it is bound to cause the problem of line short circuit. Therefore, the current practice is to set a 0 ohm resistor where the two areas need to be connected. Combined with Figure 2 Figure 1 shows a schematic diagram of a 0-ohm resistor configuration. The 0-ohm resistor is bonded to metal traces 110 in different regions via a bonding material such as solder at both ends. This facilitates wiring between the two regions separated by the metal traces 110. The 0-ohm resistor also increases the width of the in-plane traces, further facilitating routing. However, the use of a 0-ohm resistor increases the cost of the resistor and the additional process cost of bonding the 0-ohm resistor to the substrate 100.

[0037] In view of this, an embodiment of the present invention provides a method for manufacturing a display module to replace the role of a 0-ohm resistor, while also being able to achieve wiring between multiple areas separated by metal traces 110 on the substrate 100 .

[0038] See Figure 3 , is a flow chart of a method for manufacturing a display module provided by an embodiment of the present invention.

[0039] S110 , providing a substrate having a metal circuit, wherein the substrate includes at least one metal pad group, and the metal pad group includes a pair of metal pads.

[0040] It should be noted that the substrate 100 is a glass substrate with a thickness of 0.4 mm. It is easy to understand that the substrate 100 can also be a substrate of other materials, such as a silicon substrate, and its thickness can also be adjusted according to actual needs. The metal circuit is a metal trace 110 formed by first vapor-depositing a whole layer of metal on the substrate 100 and patterning the formed metal layer. The thickness of the metal trace 110 is 0.55-2um. The metal forming the metal trace 110 can be one of copper, aluminum, tin or other metals or a mixture, preferably a single layer of copper. That is to say, this solution is explained by taking the formation of a single layer of thin copper metal traces on a glass substrate as an example, and its structure can be referred to. Figure 1 As shown, further, the design of setting a single layer of thin copper metal wiring on the glass substrate is mainly used to verify the driving of the light-emitting chip and detect the impact of the current circuit architecture on the driving performance of the light-emitting chip. The light-emitting chip can be, but is not limited to, light-emitting chips of different sizes such as MiniLED, MicroLED, and OLED.

[0041] For further information, please refer to Figure 4 As shown in FIG, it is a schematic diagram of the structure of a substrate 100 provided by an embodiment of the present invention. The substrate 100 also includes at least one metal pad group 120, each metal pad group 120 includes a pair of metal pads 121, and the two metal pads 121 are arranged at a certain distance from each other, and metal traces 110 are also arranged between the two metal pads 121. That is to say, under normal circumstances, the pair of metal pads 121 are arranged across different wiring areas on the substrate 100, so that the pair of metal pads 121 can form "wires" in the later stage to complete the cross-region wiring connection on the substrate 100. For example, you can refer to Figure 1 and Figure 2 In the configuration of the 0 ohm resistor, the pair of metal pads 121 is equivalent to the solder provided on the metal traces 110 on both sides. The difference is that Figure 1 and Figure 2 The previous solution also requires the solder provided on both sides to be bonded to the two ends of the 0 ohm resistor respectively to achieve electrical connection of the metal traces 110 on both sides; while in this solution, a pair of metal pads 121 is used to replace the "solder + 0 ohm resistor" setting, which can directly form a "wire" to achieve electrical connection of the metal traces 110 on both sides, thereby achieving the technical effect of increasing the trace width and facilitating the trace.

[0042] In addition, the substrate 100 also includes a plurality of bonding pads 122 , each bonding pad 122 is used for bonding electronic components, and the electronic components may be but are not limited to MicroLED, MiniLED, OLED or driver IC.

[0043] It should be noted that the metal pad 121 and the bonding pad 122 are both connected to the metal trace 110 set on the substrate 100. The connection method is usually that the metal pad 121 or the bonding pad 122 is directly bonded to the metal trace 110. It is easy to understand that other connection methods can also be used, such as connecting the pad (including the metal pad 121 or the bonding pad 122) to the metal trace 110 on the substrate 100 through other wire bonding methods, so that the pad can transmit signals.

[0044] S120: forming a first protective layer on the substrate.

[0045] S130, retaining the first protective layer corresponding to the metal circuit between the pair of metal pads, and removing the first protective layer corresponding to the remaining area on the substrate.

[0046] Please refer to Figure 5 , is a schematic diagram of the formation of the first protective layer 130 provided by the present invention. Figure 5 As shown in (a), a first protective layer 130 is first formed on the entire substrate 100. At this time, the first protective layer 130 covers all metal pads 121, bonding pads 122 and metal traces 110 on the substrate 100. Figure 5 As shown in FIG. 2( b ), through exposure, development, and etching processes, only the first protective layer 130 above the metal wiring (i.e., metal trace 110) between the pair of metal pads 121 is retained, while the first protective layer 130 is removed from all other areas of the substrate 100. This provides insulation protection for the metal trace 110 between the pair of metal pads 121 to prevent short circuits during subsequent processing. The first protective layer 130 may be made of, but is not limited to, an insulating material such as photoresist.

[0047] S140, forming a second protective layer on the substrate.

[0048] See Figure 6 , is a schematic diagram of the treatment of the second protection layer 140 provided by an embodiment of the present invention. After the first protection layer 130 is formed to protect the metal trace 110 between a pair of metal pads 121, as shown in FIG. Figure 6 As shown in FIG. 5 , a second protective layer 140 is formed on the substrate 100 . The second protective layer 140 completely covers the surface of the substrate 100 .

[0049] The second protective layer 140 comprises an organic layer and a white oil layer. Specifically, the second protective layer 140 comprises two layers: an organic layer and a white oil layer positioned above the organic layer. The organic layer is typically transparent and insulating, serving to smooth the surface of the substrate 100 and protect the circuitry thereon. The white oil layer is opaque, enhancing light reflection and preventing light emitted from electronic components from being reflected by the solder pads on the substrate 100, causing a halo phenomenon. The white oil layer is a thermosetting barrier white oil with high reflectivity, heat resistance, and flex resistance. The organic layer can be made of, but is not limited to, one or more of polyimide (PI), polytetrafluoroethylene (PTFE), and polyetheretherketone (PEEK). It is easy to understand that the second protective layer 140 can also be configured as a multi-layer configuration, such as "white oil + organic layer + white oil", "organic layer + white oil + organic layer", etc., or the second protective layer 140 can also be configured as a single layer, such as a white oil layer or an organic layer. Furthermore, the thickness of the organic layer can be set to 1-2 μm, and the thickness of the white oil layer can be set to 30 μm.

[0050] S150 , etching the second protection layer corresponding to the metal pad group to form a receiving cavity with an acute-angle inclined surface, wherein the metal pad group is located in the receiving cavity.

[0051] like Figure 6 As shown in (b), a mask is provided above the second protective layer 140, and an opening is provided in the mask corresponding to the position of the metal pad group 120. Then, light of predetermined power is used to etch the second protective layer 140 corresponding to the metal pad group 120, and a receiving cavity 141 with an acute angle inclined surface is formed by scattering, diffraction or reflection of light. Figure 6 As shown in (c), the metal pad group 120 is located in the accommodating cavity 141.

[0052] like Figure 7 As shown in FIG, it is a comparative schematic diagram of the etching state of the second protective layer 140 using different doses of light provided by an embodiment of the present invention. Figure 7 As shown in (a), when the second protective layer 140 is exposed to light with a normal dose, the normal exposure dose causes the sidewalls of the second protective layer 140 to have no change in the depth direction and are etched uniformly. After the etching is completed, a steep sidewall is formed. Figure 7 As shown in (b), when high-dose exposure is used to etch the second protective layer 140, it will etch away the part of the second protective layer 140 that is not in the vertical direction through light scattering, diffraction, and reflection, and finally form a receiving cavity 141 with an acute angled surface. This exposure method is performed by an exposure machine, and the power of high-dose exposure should generally be greater than 300 mil / cm 2It is easy to understand that the power parameters of different exposure machines are different. The power parameters are only examples. As long as the accommodating cavity 141 with the acute-angle inclined surface can be formed in the end, it is acceptable.

[0053] Further, see Figure 8 , is a schematic diagram of the etching state of light in the second protective layer 140 provided by an embodiment of the present invention. Figure 8 , further showing that when the second protective layer 140 is exposed to a high dose, the incident light will be reflected or diffusely reflected at the metal pad 121, over-exposing the surrounding second protective layer 140, so that the cavity finally etched is not regular, but has a shape that is larger at the bottom and smaller at the top, that is, a receiving cavity 141 with an acute-angled inclined surface.

[0054] For further information, see Figure 9 , is a schematic diagram of the state of the second protective layer 140 after etching provided by an embodiment of the present invention. Figure 9 It can be seen that after etching the second protective layer 140 , the two sides of the formed accommodating cavity 141 are cylindrical grooves respectively, and the connecting area of ​​the two cylindrical grooves is a cubic groove. The entire cross-section of the accommodating cavity 141 is trapezoidal.

[0055] In addition, a photomask can be designed to have openings at locations corresponding to the bonding pads 122, so that when etching the second protective layer 140 at the metal pads 121, the second protective layer 140 corresponding to the bonding pads 122 on the substrate 100 can also be etched simultaneously to expose the bonding pads 122, facilitating subsequent bonding of electronic components. Alternatively, a separate photomask can be designed, and after etching the second protective layer 140 corresponding to the metal pads 121, the second protective layer 140 corresponding to the bonding pads 122 can be etched using the same or different dose of light as that used to etch the second protective layer 140 corresponding to the metal pads 121 to expose the bonding pads 122, facilitating subsequent bonding of electronic components.

[0056] S160 , brushing a connection metal on the receiving cavity to connect a pair of metal pads of the metal pad group together.

[0057] See Figure 10, is a schematic diagram of the connection metal 150 after reflow soldering under normal circumstances provided by an embodiment of the present invention. It should be noted that the connection metal 150 can be, but is not limited to, solder or tin paste. If a layer of connection metal 150 is directly brushed between the metal pads 121, and subjected to high temperature during the reflow soldering process, the connection metal 150, which was originally in a paste form, will change from a long strip to a liquid spherical shape, and the connection metal 150 will shrink and gather around the metal pad 121 as the center, and will not remain in the area between the metal pads 121, causing the wiring formed by the connection metal 150 to deform and break. This is because there is no metal in the area between the metal pads 121, and there is no gripping force on the connection metal 150, and thus the pair of metal pads 121 cannot form a "wire" to increase the routing area and achieve the purpose of cross-area wiring.

[0058] The accommodating cavity 141 with an acute angled surface formed by S150 in the embodiment of the present invention can solve the problem of deformation and fracture caused by the connection metal 150 being recycled toward the metal pad 121 during the reflow process. Figure 11 , is a schematic diagram of the force condition of the connecting metal 150 provided by an embodiment of the present invention in the accommodating cavity 141. As can be seen from the figure, the cross-section of the accommodating cavity 141 is a trapezoid, and the angle between its side wall and the bottom edge is α, which is an acute angle less than 90 degrees. When the brushed connecting metal 150, such as solder paste, falls into the accommodating cavity 141, one side of it is subjected to a force F1 by the side wall of the accommodating cavity 141. F1 includes a rightward horizontal component force F2 and a downward force F3. Similarly, it can be seen that the other side of the connecting metal 150 is also simultaneously subjected to the force of the side wall of the accommodating cavity 141, so that the two horizontal components of force are balanced. Therefore, the component force F3 of the two side walls of the accommodating cavity 141 on the connecting metal 150 can effectively limit the movement of the connecting metal 150. The calculation method of F3 is: F3 = F1*cosα, the smaller α is, the larger F3 is.

[0059] Therefore, when the connecting metal 150 is brushed into the accommodating cavity 141, on the one hand, the accommodating cavity 141 can accommodate more connecting metal 150, and on the other hand, due to the design of the acute-angle inclined surface of the accommodating cavity 141, its two side walls will give the flowing connecting metal 150 a downward force, so that the connecting metal 150 is gathered in the middle of a pair of metal pads 121 under the force. At this time, even if there is no metal setting in the middle of the pair of metal pads 121 and there is no gripping force on the connecting metal 150, the connecting metal 150 can be retained in the middle of the pair of metal pads 121 under the force, and with the cooling process after reflow soldering, it solidifies to form a routing, thereby achieving the purpose of increasing the routing area and facilitating cross-region routing.

[0060] Based on the above principles, the embodiment of the present invention further provides Figure 12The printing mold 160 is shown. The printing mold 160 is provided with a first opening 161 corresponding to the bonding pad 122 of the substrate 100, and a second opening 162 corresponding to the metal pad 121 of the substrate 100. In order to facilitate the connection of a pair of metal pads 121 spaced a certain distance apart into a "wire", the second opening 162 is configured as a long window. In addition, the printing mold 160 can be a steel mesh or other mold that is convenient for brushing.

[0061] In actual use, the printed mold 160 is covered on the substrate 100, and then the connecting metal 150 is brushed. The connecting metal 150 falls from the first opening 161 and forms on the bonding pad 122 for bonding with the electronic component; it falls from the second opening 162 and forms in the accommodating cavity 141. The connecting metal 150 is subjected to the force of the acute angle inclined surface of the accommodating cavity 141 on both sides, flowing toward the center of the accommodating cavity 141 to connect the pair of metal pads 121 together. During the reflow process, the connecting metal 150 on the bonding pad 122 and the metal pad 121 is solidified respectively, so that the electronic component can be fixed on the bonding pad 122, and the metal trace 110 can also be formed between the pair of metal pads 121.

[0062] In addition, an embodiment of the present invention further provides a display module, which is manufactured using the above-described display module manufacturing method. The display module includes a substrate 100 having a metal trace 110, a metal pad 121, a bonding pad 122, a first protective layer 130, a second protective layer 140, and electronic components.

[0063] The substrate 100 is formed with metal traces 110 through patterning, and a plurality of metal pads 121 and a plurality of bonding pads 122 are respectively provided in different areas of the metal traces 110. The bonding pads 122 are used for bonding with electronic components, which may be, but are not limited to, MicroLEDs, MiniLEDs, OLEDs, or driver ICs. The metal pads 121 are arranged in pairs and are generally connected across the metal traces 110 and distributed in different areas of the substrate 100. That is, in order to realize the routing between different areas of the substrate 100, one of the pair of metal pads 121 is arranged in one area and the other is arranged in another area. At this time, there are still some metal traces 110 in the middle of the metal pads 121. The metal pads 121 arranged in pairs are used to form "wires" after being connected through the connecting metal 150 to facilitate the wiring connection between different areas on the substrate 100.

[0064] The first protective layer 130 is only arranged on the metal trace 110 between a pair of metal pads 121 to insulate and protect the metal trace 110 there, so as to avoid the short circuit problem of the connecting metal 150 between the metal pads 121 when the connecting metal 150 is subsequently formed on the pair of metal pads 121.

[0065] The second protection layer 140 is disposed on the substrate 100 and covers the metal traces 110 . However, the metal pads 121 and the bonding pads 122 will be exposed later by etching. The second protection layer 140 is mainly used to planarize and protect the substrate 100 .

[0066] Furthermore, embodiments of the present invention provide a display device comprising a packaging substrate and the display module described above, wherein the packaging substrate is fixed to the display module to package the display module. The display device can be a display screen, such as a computer display screen, a mobile phone display screen, a vehicle display screen, a television display screen, etc. The display device can also be a terminal product, such as a computer, a mobile phone, a vehicle-mounted terminal device, a television, etc.

[0067] In summary, an embodiment of the present invention provides a method for manufacturing a display module, a display module, and a display device, wherein the display module includes a substrate having a metal circuit, the substrate includes at least one metal pad group, and the metal pad group includes a pair of metal pads; a first protective layer is first formed on the substrate, and then the first protective layer is removed from the area other than the first protective layer corresponding to the metal circuit between the pair of metal pads, and then a second protective layer is formed, and then the second protective layer corresponding to the metal pad group is etched to form a accommodating cavity with an acute-angled inclined surface, and the metal pad group is located in the accommodating cavity; finally, connecting metal is brushed on the accommodating cavity to connect the pair of metal pads of the metal pad group together. This solution is achieved by arranging a metal pad group including a pair of metal pads on the substrate, and forming a accommodating cavity with an acute-angled inclined surface around the metal pad group, so that when the connecting metal is brushed, the two sides of the connecting metal will be subjected to the force of the acute-angled inclined surface to move toward the center of the accommodating cavity. After solidification, the pair of metal pads can be connected to act as "wires" to increase the width of the wiring on the substrate; at the same time, the metal wiring between the pair of metal pads has been protected by the first protective layer, there will be no short circuit problem, and the performance of the substrate is guaranteed.

[0068] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0069] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Various modifications and variations are readily apparent to those skilled in the art. Any modifications, equivalent substitutions, improvements, and the like made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention. It should be noted that similar reference numerals and letters denote similar items in the following figures. Therefore, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.

[0070] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A method for manufacturing a display module, characterized in that: The method comprises: Providing a substrate having a metal circuit, the substrate comprising at least one metal pad group, the metal pad group comprising a pair of metal pads; forming a first protective layer on the substrate; retaining the first protective layer corresponding to the metal circuit between the pair of metal pads, and removing the first protective layer corresponding to the remaining area on the substrate; forming a second protective layer on the substrate; Etching the second protective layer at a position corresponding to the metal pad group to form a receiving cavity having an acute-angle inclined surface, wherein the metal pad group is located in the receiving cavity; A connection metal is brushed on the receiving cavity to connect a pair of metal pads of the metal pad group together.

2. The method for manufacturing a display module according to claim 1, wherein: The step of etching the second protective layer corresponding to the metal pad group to form a receiving cavity having an acute-angle inclined surface includes: Light of predetermined power is used to etch the second protective layer corresponding to the metal pad group, and a receiving cavity with an acute-angle inclined surface is formed by scattering, diffraction or reflection of the light.

3. The method for manufacturing a display module according to claim 1 or 2, wherein: The cross section of the accommodating cavity is trapezoidal.

4. The method for manufacturing a display module according to claim 1, wherein: The step of brushing connection metal on the receiving cavity to connect a pair of metal pads of the metal pad group includes: A printing mold with an opening corresponding to the accommodating cavity is covered on the substrate, and connecting metal is brushed on it. During the curing process, the connecting metal is acted upon by the sharp-angled inclined surface of the accommodating cavity on both sides and flows toward the center of the accommodating cavity to connect a pair of metal pads of the metal pad group together.

5. The method for manufacturing a display module according to claim 1, wherein: The substrate further comprises a plurality of bonding pads, each of the bonding pads being used for bonding electronic components; After the step of forming a second protective layer on the substrate, the step further includes: Etching the second protective layer at locations corresponding to the plurality of bonding pads to expose the plurality of bonding pads; A bonding metal is formed on each bonding pad for bonding with the electronic component.

6. The method for manufacturing a display module according to claim 1, wherein: The step of forming a second protective layer on the substrate comprises: forming an organic layer on the substrate; A white oil layer was formed on the organic layer.

7. The method for manufacturing a display module according to any one of claims 1 to 2 or 4 to 6, wherein: The substrate is a glass substrate, and the thickness of the substrate is 0.4 mm.

8. The method for manufacturing a display module according to any one of claims 1 to 2 or 4 to 6, wherein: The metal circuit is formed by evaporating metal onto the entire surface of the substrate and then patterning the metal circuit, and the thickness of the metal circuit is 0.55-2 μm.

9. A display module, characterized in that: The display module is manufactured according to the method for manufacturing a display module according to any one of claims 1 to 8.

10. A display device, characterized in that: The display device includes a packaging substrate and the display module according to claim 9, wherein the packaging substrate is fixed on the display module.

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