Apparatus and method for manufacturing display device

Abstract

Disclosed are an apparatus and a method for manufacturing a display device. The apparatus for manufacturing a display device includes: a base portion on which a substrate having a dummy layer thereon is placed; a support portion on the base portion to support the substrate; and a measuring portion facing the base portion and configured to measure a thickness of the dummy layer, in which the base portion is configured to move linearly such that the measuring portion and the dummy layer are positioned at corresponding positions based on a result of detection by the measuring portion.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0127367 filed in the Korean Intellectual Property Office on September 22, 2023, and Korean Patent Application No. 10-2023-0197607 filed in the Korean Intellectual Property Office on December 29, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] One or more embodiments relate to an apparatus and a method for manufacturing a display device. Background Art

[0004] Mobile electronic devices have been widely used. In addition to small electronic devices such as mobile phones, tablet personal computers (PCs) have recently been widely used as mobile electronic devices.

[0005] In order to support various functions, mobile electronic devices include display devices to provide visual information such as images or videos to users. In recent years, as the size of other components for driving the display device decreases, the proportion of the display device in the electronic device has gradually increased, and a structure that can be bent from a flat state to a corresponding angle has also been developed.

[0006] When manufacturing such a display device, various layers are formed, and the thickness of at least one of the various layers determines the performance of the display device. Summary of the invention

[0007] Typically, when forming at least one layer of a display device, it is suitable to form the at least one layer to a thickness equal to or similar to a corresponding (e.g., preset) thickness. To this end, various methods are used, but the thickness of at least one layer may be different from the corresponding (e.g., preset) thickness. In this case, the manufactured display device may not be able to emit light of a suitable wavelength to the outside, or the performance of the display device may deteriorate. One or more embodiments include an apparatus and method for manufacturing a display device, wherein the thickness of at least one layer is measured and compensated so that a display device of uniform quality can be manufactured.

[0008] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the disclosed embodiments.

[0009] According to one or more embodiments, an apparatus for manufacturing a display device includes: a base portion, on which a substrate is placed, the substrate having a dummy layer on the substrate; a supporting portion, on the base portion to support the substrate; a measuring portion, facing the base portion and configured to measure the thickness of the dummy layer, wherein the base portion is configured to move linearly so that the measuring portion and the dummy layer are positioned at corresponding positions based on a result of detection by the measuring portion.

[0010] The apparatus may further include a drive portion connected to the base portion and configured to linearly move the base portion.

[0011] The apparatus may further include a detection portion configured to detect a position of the base portion and a position of the substrate.

[0012] The base portion may also be configured to linearly move the substrate based on a result of the detection by the detection portion.

[0013] The support portions may be at respective different heights.

[0014] The apparatus may further include a moving driving portion configured to move the detecting portion or the measuring portion on the moving driving portion.

[0015] The apparatus may further include: a processing part configured to deposit a layer on the substrate; and a path unit connected to the processing part and configured to determine a moving path of the substrate, wherein the base part, the supporting part and the measuring part are arranged in the processing part or the path unit.

[0016] The processing portion may include a first processing portion and a second processing portion, wherein the first processing portion and the second processing portion are configured to deposit respective layers on the substrate, wherein the thickness of the layer on the substrate is configured to be adjusted in the first processing portion or in the second processing portion based on a measurement of the layer on the substrate in the first processing portion.

[0017] The apparatus may further include a substrate pressing portion facing the support portion or the base portion and configured to keep at least a portion of the substrate flat.

[0018] The measuring portion may also be configured to radiate a signal in a direction perpendicular to one surface of the dummy layer.

[0019] According to one or more embodiments, a method for manufacturing a display device includes: moving a substrate on a base portion to a position; separating the substrate from a supporting portion; moving the supporting portion to an initial position; placing the substrate on the supporting portion; moving the substrate to the position; and moving the supporting portion so that a dummy layer on the substrate corresponds to a dummy position.

[0020] The method may further include detecting the position of the substrate and the position of the base portion.

[0021] The method may further include measuring a thickness of the dummy layer.

[0022] The thickness of the dummy layer may be measured during the transfer of the substrate.

[0023] The thickness of the dummy layer may be measured at a space of the substrate having the same layer as the dummy layer.

[0024] The method may further include measuring a position of the dummy layer.

[0025] The method may also include comparing the position of the dummy layer to the dummy position.

[0026] The method may also include supporting different portions of the substrate at respective different heights.

[0027] The method may further include maintaining the substrate flat.

[0028] The method may further include maintaining a portion of the substrate flat by applying pressure to an end portion of the substrate adjacent to the dummy layer, the dummy layer being at the portion of the substrate.

[0029] These and / or other aspects will become apparent and more readily understood from the following detailed description of the embodiments, the drawings, and the claims.

[0030] These aspects may be practiced using a system, a method, a computer program, or any combination thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and other aspects of the embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0032] Figure 1 is a plan view schematically showing an apparatus for manufacturing a display device according to one or more embodiments;

[0033] Figure 2 It is schematically shown Figure 1 A cross-sectional view of the first connecting portion shown in ;

[0034] Figure 3 It is schematically shown Figure 2 A perspective view of the first base portion, the first support portion and the first drive portion shown in ;

[0035] FIG. 4A to FIG. 4G It is schematically shown Figure 1 A partial perspective view of a portion of an operation of an apparatus for manufacturing a display device shown in ;

[0036] Figure 5 It is schematically shown Figure 3 A front view of a portion of the first support portion shown in ;

[0037] Fig. 6A is a cross-sectional view schematically illustrating a third processing portion of an apparatus for manufacturing a display device according to one or more other embodiments;

[0038] Figure 6B It is schematically shown Fig. 6A The rotating part shown in FIG. 1 and the plan view showing the substrate;

[0039] Figure 7 is a front view schematically showing a portion of an apparatus for manufacturing a display device according to one or more other embodiments;

[0040] Figure 8 is a front view schematically showing a portion of an apparatus for manufacturing a display device according to one or more other embodiments;

[0041] Fig. 9 is a front view showing a portion of an apparatus for manufacturing a display device according to one or more other embodiments;

[0042] Fig.10 is a plan view schematically showing a display device according to one or more embodiments;

[0043] Fig.11 is schematically shown along Fig.10 A cross-sectional view of a section taken along line XI-XI';

[0044] Fig.12 It is schematically shown Fig.11 A cross-sectional view of an organic light emitting diode of a display device in FIG.

[0045] Fig.13 It is schematically shown Fig.11 A cross-sectional view of an organic light emitting diode of a display device in FIG.

[0046] Fig.14 It is schematically shown Fig.11A cross-sectional view of an organic light emitting diode of a display device in FIG. 1 ; and

[0047] Fig.15 It is schematically shown Fig.11 A cross-sectional view of an organic light emitting diode of a display device in FIG. DETAILED DESCRIPTION

[0048] Reference will now be made in detail to embodiments, examples of which are shown in the accompanying drawings, wherein the same reference numerals represent the same elements throughout. In this regard, the present embodiment may have different forms and should not be construed as being limited to the description set forth herein. Therefore, embodiments will be described later only by reference to the accompanying drawings to explain aspects of this specification. As used herein, the term "and / or" includes any and all combinations of one or more related listed items. Throughout the disclosure, the expression "at least one of a, b, and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0049] Since the present disclosure allows for various changes and numerous embodiments, the embodiments will be shown in the drawings and described in detail in the written specification. Hereinafter, aspects of the present disclosure and methods for implementing them will be described more fully with reference to the drawings, in which embodiments of the present disclosure are shown. However, the present disclosure may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein.

[0050] Hereinafter, embodiments will be described with reference to the accompanying drawings, wherein like reference numerals refer to like elements throughout and repeated descriptions thereof will be omitted.

[0051] In one or more embodiments below, the terms such as "first" and "second" are used herein only to describe various elements, but the elements are not limited by these terms. These terms are only used to distinguish one element from another element.

[0052] Unless it has an apparently different meaning in the context, in the following one or more embodiments, an expression used in the singular encompasses the plural expression.

[0053] In one or more of the following embodiments, terms such as “include” or “comprising” may be interpreted as indicating features or elements or a combination thereof, but may not be interpreted as excluding the possibility of the existence or addition of one or more other features, elements or a combination thereof.

[0054] For ease of explanation, spatially relative terms (such as "under", "below", "lower", "lower side", "below", "above", "upper", and "upper side", etc.) may be used herein to describe the relationship of one element or feature to another element or feature (other multiple elements or features) as shown in the accompanying drawings. It will be understood that in addition to the orientations depicted in the accompanying drawings, spatially relative terms are also intended to cover different orientations of the device in use or operation. For example, if the device in the accompanying drawings is turned over, the elements described as "under", "under", or "below" other elements or features will then be oriented to be "above" other elements or features. Therefore, the exemplary terms "under" or "below" can include both "above" and "below". The device can be oriented in other ways (e.g., rotated by 90 degrees or in other orientations), and the spatially relative descriptors used herein should be interpreted accordingly. Similarly, when a first portion is described as being disposed “on” a second portion, this means that the first portion is disposed at an upper side or a lower side of the second portion, and is not limited to being at an upper side of the second portion based on a gravity direction.

[0055] In addition, the phrase "in a plan view" refers to when viewing an object portion from above, and the phrase "in a schematic cross-sectional view" refers to when viewing a schematic cross-section obtained by vertically cutting an object portion from the side. The term "overlapping with..." or "overlapping" means that the first object can be above or below or on one side of the second object, and vice versa. In addition, the term "overlapping with..." may include stacking, facing or facing, extending throughout, covering or partially covering or any other suitable term that a person of ordinary skill in the art will understand and understand. The statement "not overlapping with..." may include meanings such as "away from" or "separated" or "offset" and any other suitable equivalents that a person of ordinary skill in the art will understand and understand. The terms "facing" and "facing" may mean that the first object may be directly or indirectly opposite to the second object. In the case where a third object is between the first object and the second object, the first object and the second object may be understood to be indirectly opposite to each other, although still facing each other.

[0056] It will be understood that when an element, layer, region, or component is referred to as being "formed on," "on," "connected to," or "(operably or communicatively) coupled to" another element, layer, region, or component, it may be directly formed on, directly on, directly connected to, or coupled to, or indirectly formed on, indirectly on, indirectly connected to, or coupled to, such that there may be one or more intervening elements, layers, regions, or components. Additionally, this may be collectively referred to as being coupled or connected directly or indirectly and being coupled or connected integrally or non-integrally. For example, when a layer, region, or component is referred to as being "electrically connected" or "electrically coupled" to another layer, region, or component, it may be directly electrically connected or coupled to, or there may be one or more intervening layers, regions, or components. The one or more intervening components may include switches, resistors and / or capacitors, etc. In describing the embodiments, unless explicitly described as directly connected, the expression of connection indicates electrical connection, and "directly connected / directly coupled" or "directly on..." means that one component is directly connected or coupled to another component, or is located on another component without intervening components.

[0057] In addition, in this specification, when a portion of a layer, film, region, plate, etc. is formed on another part, the formation direction is not limited to the upper direction, but includes forming the portion on the side surface or in the lower direction. On the contrary, when a portion of a layer, film, region, plate, etc. is formed "below" another part, this includes not only the case where the portion is "directly below" another part, but also the case where there is another part between the portion and the other part. At the same time, other expressions describing the relationship between components, such as "between...", "immediately between..." or "adjacent to" and "directly adjacent to" can be interpreted similarly. It will be understood that when an element or layer is referred to as "between" two elements or layers, it can be the only element or layer between the two elements or layers, or one or more intermediate elements or layers may also be present.

[0058] For the convenience of explanation, the size of the elements in the drawings may be exaggerated or reduced. For example, since the size and thickness of the elements in the drawings are arbitrarily shown for the convenience of explanation, the present disclosure is not limited thereto.

[0059] In the following embodiments, the X-axis, Y-axis, and Z-axis are not limited to the three axes of the rectangular coordinate system, and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0060] When one or more embodiments may be implemented differently, the process order may be performed differently from the described order. For example, two processes described successively may be performed substantially simultaneously or in an order opposite to the described order.

[0061] In some embodiments, well-known structures and devices may be described in the accompanying drawings in relation to one or more functional blocks (e.g., block diagrams), units and / or modules to avoid unnecessary obscurity of various embodiments. It will be understood by those skilled in the art that such blocks, units and / or modules are physically implemented by logic circuits, single components, microprocessors, hard-wired circuits, storage elements, line connections and other electronic circuits. This can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. Blocks, units and / or modules implemented by microprocessors or other similar hardware can be programmed and controlled using software to perform the various functions discussed herein, optionally driven by firmware and / or software. In addition, each block, unit and / or module can be implemented by dedicated hardware, or by a combination of dedicated hardware that performs certain functions and a processor (e.g., one or more programmed microprocessors and related circuits) that performs functions different from the functions of the dedicated hardware. In addition, in some embodiments, blocks, units and / or modules can be physically separated into two or more interacting separate blocks, units and / or modules without departing from the scope of this disclosure. Additionally, in some embodiments, blocks, units and / or modules may be physically combined into more complex blocks, units and / or modules without departing from the scope of the present disclosure.

[0062] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will also be understood that, unless explicitly defined herein, terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and / or this specification, and should not be interpreted in an idealized or overly formal sense.

[0063] Figure 1 is a plan view schematically illustrating an apparatus 1 for manufacturing a display device according to one or more embodiments. Figure 2 It is schematically shown Figure 1 A cross-sectional view of the first connecting portion 9210 is shown in FIG. Figure 3 It is schematically shown Figure 2 A perspective view of the first base portion 9214, the first support portion 9215 and the first drive portion 9212 shown in FIG.

[0064] Reference Figures 1 to 3, an apparatus 1 for manufacturing a display device may include a loading part 1000 , a flip part 2000 , at least one cluster, an unloading part 9100 , and (a plurality of) connecting parts 9200 .

[0065] The display substrate DP may be introduced into the loading part 1000 from the outside. In one or more embodiments, the display substrate DP may have at least one layer on the substrate, which will be described later. In one or more embodiments, the loading part 1000 may have a separate robot arm to move the display substrate DP to the flip part 2000.

[0066] The turning part 2000 may turn over the display substrate DP transferred from the loading part 1000. For example, the turning part 2000 may turn over the display substrate DP so that one surface of the display substrate DP on which layers are formed while performing processes in at least one cluster is viewed from top to bottom.

[0067] At least one cluster may temporarily accommodate a display substrate DP, or may form a single layer on the display substrate DP. In this case, at least one cluster may include a transfer chamber, which is a path unit connected to a connection portion 9200 as a path unit to temporarily store and transfer the display substrate DP, and may include a processing portion, which is connected to the transfer chamber to form a single layer on the display substrate DP. In one or more other embodiments, at least one cluster may also include a thickness measuring portion, which is used to measure the thickness of the layer formed in the processing portion. In this case, in one or more embodiments, the thickness measuring portion may be provided in at least one of the multiple clusters. The thickness measuring portion may be arranged between the transfer chambers of the multiple clusters to connect the connection portion 9200 to the transfer chamber. Below, for ease of description, the case where at least one cluster includes multiple clusters and the thickness measuring portion is provided in the second cluster 4000 is mainly described.

[0068] In one or more embodiments, the plurality of clusters may include a first cluster 3000 , a second cluster 4000 , a third cluster 5000 , a fourth cluster 6000 , a fifth cluster 7000 , and a sixth cluster 8000 , which may be connected to each other, respectively.

[0069] The first cluster 3000 may include a first transfer chamber 3100 connected to the flipping part 2000 and having a first robot 3200 disposed therein, and a first processing part 3300 connected to the first transfer chamber 3100 to form a first layer on the display substrate DP. In this case, the first layer may be a first functional layer described later. In this case, the first functional layer may include a plurality of layers including materials different from each other.

[0070] The second cluster 4000 may be connected to the first cluster 3000 through the connection part 9200. In this case, the second cluster 4000 may include a second transfer chamber 4100 connected to the connection part 9200 and having the second robot 4200 disposed therein, and a second processing part 4300 connected to the second transfer chamber 4100 to form a second layer on the display substrate DP. In addition, the second cluster 4000 may include a second thickness measuring part 4400 connected to the second transfer chamber 4100 and having a second thickness measuring unit described later disposed therein.

[0071] The third cluster 5000 may be connected to the second cluster 4000 through the connection part 9200. In this case, the third cluster 5000 may include a third transfer chamber 5100 connected to the connection part 9200 and in which a third robot 5200 is disposed, and a third processing part 5300 connected to the third transfer chamber 5100 to form a third layer on the display substrate DP.

[0072] The fourth cluster 6000 may be connected to the third cluster 5000 through the connection part 9200. In this case, the fourth cluster 6000 may include a fourth transfer chamber 6100 connected to the connection part 9200 and a fourth processing part 6300 in which a fourth robot 6200 is arranged, and the fourth processing part 6300 is connected to the fourth transfer chamber 6100 to form a fourth layer on the display substrate DP. In this case, the fourth processing part 6300 may include a plurality of fourth processing parts 6300, and the plurality of fourth processing parts 6300 may form layers different from each other. For example, each fourth processing part 6300 may form an organic emission layer, and the plurality of fourth processing parts 6300 may form an organic emission layer including materials different from each other. For example, each fourth processing part 6300 may form a green, red, or blue organic emission layer on the third layer.

[0073] The fifth cluster 7000 may be connected to the fourth cluster 6000 through the connection part 9200. In this case, the fifth cluster 7000 may include a fifth transfer chamber 7100 connected to the connection part 9200 and in which a fifth robot 7200 is disposed, and a fifth processing part 7300 connected to the fifth transfer chamber 7100 to form a fifth layer on the display substrate DP.

[0074] The sixth cluster 8000 may be connected to the fifth cluster 7000 by a connecting portion 9200. In this case, the sixth cluster 8000 may include a sixth transfer chamber 8100 and a sixth processing portion 8300, the sixth transfer chamber 8100 being connected to the connecting portion 9200 and the sixth transfer chamber 8100 having a sixth robot 8200 arranged therein, and the sixth processing portion 8300 being connected to the sixth transfer chamber 8100 to form a sixth layer on the display substrate DP. In this case, the sixth processing portion 8300 may include a plurality of sixth processing portions 8300, and the plurality of sixth processing portions 8300 may form layers different from each other. For example, one of the plurality of sixth processing portions 8300 may form a sixth-1 layer, another of the plurality of sixth processing portions 8300 may form a sixth-2 layer, another of the plurality of sixth processing portions 8300 may form a sixth-3 layer, and another of the plurality of sixth processing portions may form a sixth-4 layer. In this case, the sixth-1 layer, the sixth-2 layer, the sixth-3 layer, and the sixth-4 layer may be stacked sequentially on the fifth layer. In one or more other embodiments, the sixth cluster 8000 may include a plurality of sixth clusters 8000 connected to each other. In this case, the plurality of sixth clusters 8000 may form a sixth-1 layer, a sixth-2 layer, a sixth-3 layer, and a sixth-4 layer. In this case, the plurality of sixth clusters 8000 may be arranged in rows.

[0075] The unloading portion 9100 may be connected to at least one cluster, and may transport the process-completed display substrate DP to the outside or transfer the display substrate DP to another apparatus for manufacturing a display device.

[0076] The connection portion 9200 may be a path unit, and the connection portion 9200 may be arranged between the flip portion 2000 and the first cluster 3000, between adjacent clusters from the first cluster 3000 to the sixth cluster 8000, and between the sixth cluster 8000 and the unloading portion 9100. The connection portion 9200 may not only connect adjacent structures to each other, but also transfer the display substrate DP between adjacent structures. For example, the connection portion 9200 may include a first connection portion 9210, a second connection portion 9220, a third connection portion 9230, a fourth connection portion 9240, a fifth connection portion 9250, and a sixth connection portion 9260. In this case, the first connection portion 9210 may be disposed between the first cluster 3000 and the second cluster 4000, the second connection portion 9220 may be disposed between the second cluster 4000 and the third cluster 5000, the third connection portion 9230 may connect the third cluster 5000 and the fourth cluster 6000 to each other, the fourth connection portion 9240 may be disposed between the fourth cluster 6000 and the fifth cluster 7000, the fifth connection portion 9250 may be disposed between the fifth cluster 7000 and the sixth cluster 8000, and the sixth connection portion 9260 may connect the sixth cluster 8000 and the unloading portion 9100 to each other. In one or more other embodiments, the sixth connection portion 9260 may connect the sixth cluster 8000 and the flip portion 2000 to each other, and the flip portion 2000 may be connected to the unloading portion 9100.

[0077] The apparatus 1 for manufacturing a display device may include a thickness measuring unit that measures the thickness of at least one layer from among the various layers stacked on the display substrate DP. In this case, the thickness measuring unit may form each layer and may be arranged on a path along which the display substrate DP on which the layers are formed moves. In addition, the thickness measuring unit may include a plurality of thickness measuring units, and each of the thickness measuring units may measure at least one of the thickness of each layer stacked on the display substrate DP in the apparatus 1 for manufacturing a display device, or the thickness of each dummy layer formed simultaneously or substantially simultaneously with each layer. In other words, the plurality of thickness measuring units may include: a first thickness measuring unit that measures at least one of the thickness of the first layer and the thickness of the first dummy layer; a second thickness measuring unit that measures at least one of the thickness of the second layer and the thickness of the second dummy layer; a third thickness measuring unit that measures at least one of the thickness of the third layer and the thickness of the third dummy layer; a fourth thickness measuring unit that measures at least one of the thickness of the fourth layer and the thickness of the fourth dummy layer; a fifth thickness measuring unit that measures at least one of the thickness of the fifth layer and the thickness of the fifth dummy layer; and / or a sixth thickness measuring unit that measures at least one of the thickness of the sixth layer and the thickness of the sixth dummy layer.

[0078] In this case, each thickness measuring unit can measure at least one of the thickness of the layer formed in one cluster and the thickness of the dummy layer, and can be arranged in at least one of the conveying chamber, the processing part, the thickness measuring part, and the connecting part 9200 connected to this cluster of one cluster. For example, the first thickness measuring unit can be arranged in at least one of the first conveying chamber 3100, the first processing part 3300, and the first connecting part 9210. The second thickness measuring unit can be arranged in at least one of the second conveying chamber 4100, the second processing part 4300, the second thickness measuring part 4400, and the second connecting part 9220. The third thickness measuring unit can be arranged in at least one of the third conveying chamber 5100, the third processing part 5300, and the third connecting part 9230. The fourth thickness measuring unit can be arranged in at least one of the fourth conveying chamber 6100, the fourth processing part 6300, and the fourth connecting part 9240. The fifth thickness measuring unit can be arranged in at least one of the fifth conveying chamber 7100, the fifth processing part 7300, and the fifth connecting part 9250. The sixth thickness measuring unit may be arranged in at least one of the sixth conveying chamber 8100, the sixth processing part 8300, and the sixth connecting part 9260. In this case, when a plurality of different layers are formed in one cluster, at least one of the thickness of the layer and the thickness of the dummy layer corresponding to the layer may be measured only in one of the conveying chamber and the processing part of the corresponding cluster. For example, in the third cluster 5000, the third thickness measuring unit may be arranged in at least one of the third conveying chamber 5100 and the third processing part 5300 to measure at least one of the thickness of the third layer and the thickness of the third dummy layer. In the sixth cluster 8000, the sixth thickness measuring unit may be arranged only in at least one of the sixth conveying chamber 8100 and the sixth processing part 8300 to measure at least one of the thickness of the sixth layer and the thickness of the sixth dummy layer. The first to sixth thickness measuring units may be formed similarly to each other and may be arranged in similar positions. For ease of description, only the first thickness measuring unit will be described in detail later.

[0079] Although it is described above that the apparatus 1 for manufacturing a display device has only the second thickness measuring part 4400, one or more embodiments are not limited thereto. In other words, the apparatus 1 for manufacturing a display device may include at least one of a first thickness measuring part connected to the first conveying chamber 3100, a second thickness measuring part 4400 connected to the second conveying chamber 4100, a third thickness measuring part connected to the third conveying chamber 5100, a fourth thickness measuring part connected to the fourth conveying chamber 6100, a fifth thickness measuring part connected to the fifth conveying chamber 7100, and a sixth thickness measuring part connected to the sixth conveying chamber 8100. In addition, each of the first thickness measuring part, the second thickness measuring part 4400, the third thickness measuring part, the fourth thickness measuring part, the fifth thickness measuring part, and the sixth thickness measuring part described above may have a similar form to the first connection part 9210 described below.

[0080] Reference Figure 1 , Figure 2 and Figure 3 , the first cluster 3000 or the first connection part 9210 may include a first thickness detection unit for detecting the thickness of the first layer. In other words, the first thickness detection unit may be arranged in the first transfer chamber 3100, the first processing part 3300, or the first connection part 9210. For ease of description, the following mainly describes in detail the case where the first thickness detection unit is arranged in the first connection part 9210.

[0081] The first connection part 9210 may include a first connection chamber 9211 and a first thickness detection unit. In this case, the first thickness detection unit may include a first driving part 9212, a first linear moving part 9213, a first base part 9214, a first supporting part 9215, a first detection part 9216, and a first measuring part 9217.

[0082] The first connection chamber 9211 may connect the first transfer chamber 3100 and the second transfer chamber 4100 to each other. In this case, a first pressure adjustment portion 9218 capable of adjusting the internal pressure of the first connection chamber 9211 may be connected to the first connection chamber 9211. The first pressure adjustment portion 9218 may include a first pipe connected to the first connection chamber 9211 and a first pump located on the first pipe. The above-mentioned first connection chamber 9211 may have an opening area, and a separate first opening / closing portion 9211a such as a gate valve for opening and closing the opening area may be arranged in the one opening area. In addition, a first transmission window 9211b may be provided on the outer surface of the first connection chamber 9211, and the first transmission window 9211b may transmit its interior from the outside. In this case, the first transmission window 9211b may include a transparent material. In this case, at least one of the first detection portion 9216 and the first measurement portion 9217 may be arranged inside the first connection chamber 9211 or outside the first connection chamber 9211.

[0083] The first driving portion 9212 may be disposed within the first connecting chamber 9211 and may allow the first base portion 9214 to be moved from a first direction (eg, Figure 2 in the X direction) and in the second direction (e.g., Figure 2 The first driving portion 9212 may include a first-1 driving portion 9212a and a first-2 driving portion 9212b connected to each other. One of the first-1 driving portion 9212a and the first-2 driving portion 9212b may be placed on the other of the first-1 driving portion 9212a and the first-2 driving portion 9212b. In addition, the first linear moving portion 9213 may be placed on the one of the first-1 driving portion 9212a and the first-2 driving portion 9212b. For ease of description, the following mainly describes in detail the situation where the first-2 driving portion 9212b is placed on the first-1 driving portion 9212a and the first linear moving portion 9213 is placed on the first-2 driving portion 9212b.

[0084] The first-2 driving portion 9212b may be placed on the first-1 driving portion 9212a and may move linearly on the first-1 driving portion 9212a according to the operation of the first-1 driving portion 9212a. In addition, the first linear moving portion 9213 may be located on the first-2 driving portion 9212b and may move linearly on the first-2 driving portion 9212b according to the operation of the first-2 driving portion 9212b.

[0085] The first-1 driving part 9212a and the first-2 driving part 9212b can be formed in various shapes. In this case, since the first-1 driving part 9212a and the first-2 driving part 9212b have similar shapes, for the convenience of description, the first-1 driving part 9212a will be mainly described in detail below.

[0086] The first-1 driving part 9212a can have various shapes. For example, the first-1 driving part 9212a may include a cylinder, a moving block connected to the cylinder to move according to the operation of the cylinder, and a guide rail along which the moving block is arranged and guides the movement of the moving block. In one or more other embodiments, the first-1 driving part 9212a may include a motor, a ball screw connected to the motor to work, and a moving block that moves linearly according to the rotation of the ball screw. In this case, the first-1 driving part 9212a may also include a separate guide rail that guides the movement of the moving block. In one or more other embodiments, the first-1 driving part 9212a may include a linear motor. In this case, the first-1 driving part 9212a is not limited thereto, and may include any device and structure that allows the first-2 driving part 9212b to move linearly when the first-2 driving part 9212b is installed.

[0087] The first linear moving portion 9213 may protrude from the first base portion 9214 toward the first driving portion 9212, and the first base portion 9214 and the first driving portion 9212 may be connected to each other. For example, the first linear moving portion 9213 may be connected to the linear moving portion of the first-2 driving portion 9212b. In this case, a pair of first linear moving portions 9213 and a pair of first driving portions 9212 may be provided, and the two pairs may be arranged symmetrically with respect to the first base portion 9214.

[0088] The first base portion 9214 may be connected to the first linear moving portion 9213. The first base portion 9214 may have / define an open area at a central portion thereof. Through this open area, a portion of the display substrate DP on the first base portion 9214 may be exposed to the outside.

[0089] The first supporting portion 9215 may be located on the first base portion 9214, and may support an edge of the display substrate DP. In this case, the first supporting portion 9215 may include a plurality of first supporting portions 9215, and the plurality of first supporting portions 9215 may be located on the first base portion 9214 spaced apart from each other. In addition, the plurality of first supporting portions 9215 may support at least two edges of the display substrate DP. In addition, each of the first supporting portions 9215 may support a portion of the display substrate DP on which a layer is not formed.

[0090] The plurality of first supporting portions 9215 may be arranged at different heights from each other on the first base portion 9214, or may be arranged to be able to be raised and lowered from the first base portion 9214. In this way, the plurality of first supporting portions 9215 may adjust the shape of the edge of the display substrate DP.

[0091] At least one of the first measuring portion 9217 and the first detecting portion 9216 may be arranged outside or inside the first connecting chamber 9211. For example, the first measuring portion 9217 and the first detecting portion 9216 may be arranged outside or inside the first connecting chamber 9211. In addition, one of the first measuring portion 9217 and the first detecting portion 9216 may be arranged in one of the outside and the inside of the first connecting chamber 9211, and the other of the first measuring portion 9217 and the first detecting portion 9216 may be arranged in the other of the outside and the inside of the first connecting chamber 9211.

[0092] The first detecting portion 9216 may include a charge coupled device (CCD) camera. In this case, the first detecting portion 9216 may photograph the display substrate DP and the first base portion 9214 to detect the position of the display substrate DP and the position of the first base portion 9214.

[0093] The first measuring part 9217 may detect (measure) the thickness of the first layer of the display substrate DP. For example, the first measuring part 9217 may detect the thickness of the first layer of the display substrate DP in the display area DA (see Fig.10 ) is arranged in the display area DA or the peripheral area PA (see FIG. 2 ) of the display substrate DP. Fig.10 ), the first measuring part 9217 may detect the thickness of the first dummy layer arranged in the display area DA of the display substrate DP in the same process as the process of detecting the thickness of the first layer. For convenience of description, a case where the first measuring part 9217 detects the thickness of the first dummy layer of the display substrate DP in the same process as the process of detecting the thickness of the first layer will be described in detail.

[0094] The first measuring part 9217 may include at least one of an ellipsometer and a reflectometer. For example, the first measuring part 9217 may include at least one of a nano-spectrometer, a spectroscopic reflectometer, an ultra-pulse, an X-ray reflectometer, and a fluorescence analyzer. The first measuring part 9217 may radiate light or a laser beam to the outside, and may receive reflected light or a laser beam.

[0095] In order to align the display substrate DP, a structure identical or similar to that of a first base portion 9214, a first supporting portion 9215, a first driving portion 9212, and a first measuring portion 9217, which are some of the elements of the first thickness detecting unit, may be separately provided in the first transfer chamber 3100 in addition to the first connecting portion 9210. In this case, a structure identical or similar to that of the first base portion 9214, the first supporting portion 9215, the first driving portion 9212, and the first measuring portion 9217 may align the position of the display substrate DP.

[0096] When a structure identical or similar to that of the first thickness detection unit is disposed in the first transfer chamber 3100, the first thickness detection unit may be disposed in a space of the first transfer chamber 3100 similar to that of the first thickness detection unit. Figure 1 4500 of the second conveying chamber 4100 that does not overlap with the second robot arm 4200. The first thickness detection unit may be disposed in a separate space connected to the first conveying chamber 3100. For example, in one or more embodiments, the first thickness detection unit may be disposed in a first thickness measuring portion connected to the first conveying chamber 3100, similar to the second thickness measuring portion 4400 connected to the second conveying chamber 4100.

[0097] In the above-mentioned apparatus 1 for manufacturing a display device, various layers may be sequentially stacked on the display substrate DP. For example, the display substrate DP may be moved to the flipping part 2000 after entering the loading part 1000. The flipping part 2000 may flip the display substrate DP. In other words, in the loading part 1000, the display substrate DP may be supplied from the outside so that the layers stacked on the display substrate DP (or substrate) face up. Thereafter, the flipping part 2000 may flip the display substrate DP so that the layers stacked on the display substrate DP (or substrate) face down.

[0098] Thereafter, the display substrate DP may be introduced into the first transfer chamber 3100. In this case, the first robot 3200 may supply the display substrate DP from the reversing portion 2000 to the first transfer chamber 3100. In this case, the internal pressure of the reversing portion 2000 and the internal pressure of the first transfer chamber 3100 may be maintained the same or similar to each other.

[0099] The first robot 3200 may transfer the display substrate DP from the first transfer chamber 3100 to the first processing part 3300. In this case, the internal pressure of the first processing part 3300 and the internal pressure of the first transfer chamber 3100 may be maintained the same or similar to each other.

[0100] When the display substrate DP is introduced into the first processing part 3300, the first layer may be formed on the display substrate DP in the first processing part 3300. In this case, the material included in the first layer may be oriented in the third direction (eg, Figure 1 In other words, the material contained in the first layer may be supplied from the lower side of the display substrate DP toward the display substrate DP.

[0101] After the first layer is on the display substrate DP, the first robot 3200 may move the display substrate DP from the first processing part 3300 to the first transfer chamber 3100. In this case, internal pressures of the first processing part 3300 and the first transfer chamber 3100 may remain the same or similar to each other.

[0102] The first robot 3200 may move the display substrate DP from the first transfer chamber 3100 to the first connection portion 9210. In this case, an internal pressure of the first transfer chamber 3100 and an internal pressure of the first connection portion 9210 may be the same or similar to each other.

[0103] The first connection part 9210 may arrange the display substrate DP so that the surface on which the first layer of the display substrate DP is located faces downward. In this case, the first thickness detection unit may measure the thickness of the first layer. A separately provided controller may control the first processing part 3300 based on the measured thickness of the first layer. In one or more embodiments, the above-mentioned apparatus 1 for manufacturing a display device may have a separate controller, and each of the multiple elements of the apparatus 1 for manufacturing a display device may be controlled based on the measurement results. In this case, the controller may include various devices and structures, such as a computer, a portable terminal, or a circuit board.

[0104] For example, when the measured thickness of the first layer is different from the corresponding (e.g., preset) first thickness, the controller may control the first processing part 3300 so that the thickness of the first layer is equal to or similar to the corresponding (e.g., preset) thickness. For example, in one or more embodiments, the controller may transfer the display substrate DP on which the first layer is located to the first processing part 3300 again, and may control the first processing part 3300 to perform the process again so that the thickness of the first layer is equal to or similar to the first thickness. In this case, the controller may control the first processing part 3300 to further form an additional first layer having a thickness equal to the difference between the measured thickness of the first layer and the first thickness on the display substrate DP. In one or more other embodiments, the display substrate DP on which the first layer is already located may perform subsequent operations, and when a new display substrate DP is arranged in the first processing part 3300, the controller may control the first processing part 3300 so that the thickness of the first layer located on the new display substrate DP corresponds to the corresponding (e.g., preset) first thickness. In one or more other embodiments, when a first layer is formed again on the display substrate DP in addition to the first layer formed as described above, the controller may control the first processing part 3300 so that the thickness of the first layer formed again is adjusted based on the thickness measured above. In other words, the controller may control the first processing part 3300 to adjust the thickness of the first layer to be formed again so that the sum of the thickness of the first layer to be formed again and the thickness of the first layer formed previously is constant.

[0105] A method for forming the first layer having a thickness corresponding to the first thickness may include increasing or decreasing the temperature of a crucible containing a material forming the first layer, increasing or decreasing an internal pressure of the first processing part 3300, and the like.

[0106] In addition to the above, the controller may control the apparatus 1 for manufacturing a display device so that the thickness of at least one of the second layer, the third layer, the fourth layer, the fifth layer, and the sixth layer other than the first layer can be adjusted based on the thickness of the first layer. In this case, the controller may control the apparatus 1 for manufacturing a display device to adjust the thickness of at least one layer so that a plurality of layers that complement each other are formed based on the change in optical properties caused by the thickness of each layer. For example, in one layer and another layer from among the first to sixth layers, in a state where the optical properties decrease as the thickness decreases, the optical properties increase as the thickness increases, and the thickness of one layer from among the first to sixth layers is less than the corresponding (e.g., preset) thickness, the thickness of another layer from among the first to sixth layers can be formed to be greater than the corresponding (e.g., preset) thickness, so that after stacking at least two layers from among the first to sixth layers, the optical properties of the overall structure of the stacked layers can correspond to the designed optical properties.

[0107] The second robot 4200 may move the display substrate DP having the first layer thereon from the first connection portion 9210 to the second transfer chamber 4100. In this case, internal pressures of the first connection portion 9210 and the second transfer chamber 4100 may be equal to or similar to each other.

[0108] The second robot arm 4200 may move the display substrate DP from the second conveying chamber 4100 to the second processing part 4300. In this case, the internal pressure of the second conveying chamber 4100 and the internal pressure of the second processing part 4300 may be equal to or similar to each other. The second processing part 4300 may form a second layer on the first layer. In this case, the second processing part 4300 may supply a material contained in the second layer toward the display substrate DP from the lower side of the display substrate DP.

[0109] The second robot 4200 may move the display substrate DP on which the second layer is formed from the second processing part 4300 to the second transfer chamber 4100, and may move the display substrate DP from the second transfer chamber 4100 to the second thickness measuring part 4400. In this case, the internal pressure of the second processing part 4300 and the internal pressure of the second transfer chamber 4100 may be equal to or similar to each other, and the internal pressure of the second transfer chamber 4100 and the internal pressure of the second thickness measuring part 4400 may be equal to or similar to each other.

[0110] The second thickness measuring part 4400 may measure the thickness of at least one of the second layer and the second dummy layer formed in the same process as the process of forming the second layer. In this case, the second dummy layer may be located on other portions of the display substrate DP that are different from the portion of the display substrate DP on which the first dummy layer is formed. Below, for ease of description, the second thickness measuring part 4400 measures the thickness of the second dummy layer formed in the same process as the process of forming the second layer in detail.

[0111] The controller may calculate the thickness of the second layer by measuring the thickness of the second dummy layer on the display substrate DP, and may compare the measured thickness of the second layer with the corresponding (e.g., preset) second thickness. In this case, the controller may control the second processing part 4300 to correct the thickness of the second layer based on the measured thickness of the second layer, to correct the thickness of a layer different from the second layer, or when the second layer is formed again on the display substrate DP on which the second layer is formed, to correct the thickness of the second layer formed again.

[0112] The second robot arm 4200 may pull out the display substrate DP from the second thickness measuring part 4400, and may move the pulled out display substrate DP to the second processing part 4300 or the second connecting part 9220 through the second conveying chamber 4100. In this case, the internal pressure of the second thickness measuring part 4400 and the internal pressure of the second conveying chamber 4100 may be maintained equal to or similar to each other, or the internal pressure of the second conveying chamber 4100 and the internal pressure of the second processing part 4300 may be maintained equal to or similar to each other, or the internal pressure of the second conveying chamber 4100 and the internal pressure of the second connecting part 9220 may be maintained equal to or similar to each other.

[0113] The display substrate DP arranged in the second connection part 9220 can be moved from the second connection part 9220 to the third transfer chamber 5100 by the third mechanical arm 5200. The third mechanical arm 5200 can transfer the display substrate DP to the third processing part 5300, and at least one third layer and at least one third dummy layer can be formed on the display substrate DP. In this case, when a plurality of third layers are formed, in one or more embodiments, a plurality of third layers can be formed sequentially in a single third processing part 5300. In one or more other embodiments, the display substrate DP can sequentially move a plurality of third processing parts 5300, wherein a plurality of third layers different from each other can be located on the display substrate DP. In this case, a plurality of different third layers can be organic emission layers for emitting light of different colors. In this case, a plurality of third layers located on the display substrate DP by each of the plurality of third processing parts 5300 can be arranged in different regions of the display substrate DP so as not to overlap each other. In one or more other embodiments, a plurality of third layers can be sequentially stacked on the entire surface of the display substrate DP or in the corresponding region of the display substrate DP. In this case, between adjacent third layers, at least one layer among the first layer, the second layer, the fourth layer, and the fifth layer can be arranged. In this case, the plurality of third dummy layers may be located on the display substrate DP to be spaced apart from each other. In addition, each of the plurality of third dummy layers may be located on the display substrate DP so as not to overlap with the first dummy layer and the second dummy layer.

[0114] One or more embodiments are not limited thereto, and a plurality of different third layers may be formed in a plurality of different third clusters 5000. In this case, in one or more embodiments, the plurality of third clusters 5000 may be arranged in a row between the second cluster 4000 and the fourth cluster 6000, and may be connected by at least one third connection portion 9230. However, for ease of description, forming the third layers different from each other in the plurality of third processing portions 5300 of a single third cluster 5000 is described in detail below.

[0115] The third robot 5200 may move the display substrate DP having at least one third layer formed thereon from the third processing portion 5300 to the third transfer chamber 5100 , and may then transfer the display substrate DP from the third transfer chamber 5100 to the third connection portion 9230 .

[0116] The third thickness measuring unit arranged in the third connection part 9230 can measure the thickness of at least one of the third layer and the third dummy layer. In this case, the third thickness measuring unit can sequentially measure the thickness of the plurality of third layers and at least one of the thickness of the plurality of third dummy layers. In this case, the thickness of each of the plurality of third layers can be obtained by forming a plurality of third layers and each of the plurality of third dummy layers respectively corresponding to the plurality of third layers and then measuring the thickness of each of the plurality of third layers and at least one of the thickness of each of the plurality of third dummy layers separately, or by forming a plurality of third layers and a plurality of third dummy layers respectively corresponding to the plurality of third layers and then measuring the thickness of each of the plurality of third layers and at least one of the thickness of each of the plurality of third dummy layers to obtain the thickness of each of the plurality of third layers. Below, for the convenience of description, the thickness of each of the plurality of third layers is calculated by measuring the thickness of the plurality of third dummy layers respectively corresponding to the plurality of third layers.

[0117] The controller may calculate the thickness of the third layer based on the thickness of the third dummy layer measured in the third thickness measuring unit. The controller may control the third processing part 5300 to compare the thickness of the third layer calculated as above with the corresponding (e.g., preset) third thickness, and may adjust the thickness of the third layer, or may control at least one of the first processing part 3300, the second processing part 4300, the fourth processing part 6300, the fifth processing part 7300, and the sixth processing part 8300 to adjust the thickness of at least one of the first layer, the second layer, the fourth layer, the fifth layer, and the sixth layer other than the third layer.

[0118] When the third layer is formed on the display substrate DP as described above, the third transfer chamber 5100 and each of the third processing parts 5300 or the third transfer chamber 5100 and the third connection part 9230 may be selectively connected to each other depending on the moving path of the display substrate DP. In this case, when the display substrate DP moves, the internal pressure of the third transfer chamber 5100 and the internal pressure of each of the third processing parts 5300 may be equal to or similar to each other, or the internal pressure of the third transfer chamber 5100 and the internal pressure of the third connection part 9230 may be equal to or similar to each other.

[0119] The fourth robot 6200 may move the display substrate DP from the third connection part 9230 to the fourth transfer chamber 6100, and may then transfer the display substrate DP from the fourth transfer chamber 6100 to the fourth processing part 6300. In this case, the internal pressure of the third connection part 9230 and the internal pressure of the fourth transfer chamber 6100 or the internal pressure of the fourth transfer chamber 6100 and the internal pressure of the fourth processing part 6300 may be equal to or similar to each other depending on the moving path of the display substrate DP.

[0120] The fourth layer and the fourth dummy layer may be formed on the display substrate DP in the fourth processing part 6300. The display substrate DP on which the fourth layer is formed may be moved from the fourth processing part 6300 to the fourth transfer chamber 6100 by the fourth robot 6200, and may be moved from the fourth transfer chamber 6100 to the fourth connecting part 9240. In this case, the internal pressure of the fourth processing part 6300 and the internal pressure of the fourth transfer chamber 6100 or the internal pressure of the fourth transfer chamber 6100 and the internal pressure of the fourth connecting part 9240 may be equal to or similar to each other.

[0121] In this case, the thickness of at least one of the fourth layer and the fourth dummy layer may be measured by a fourth thickness measuring unit disposed in the fourth connection portion 9240. Hereinafter, for ease of description, it is mainly described in detail that the fourth thickness measuring unit measures the thickness of the fourth dummy layer and the controller calculates the thickness of the fourth layer based on the thickness of the fourth dummy layer.

[0122] The fourth dummy layer may be located on the display substrate DP so as not to overlap with the first dummy layer, the second dummy layer, and the third dummy layer.

[0123] The controller may control the fourth processing part 6300 to compare the thickness of the fourth layer calculated based on the thickness of the fourth dummy layer with the corresponding (e.g., preset) fourth thickness. The controller may adjust the thickness of the fourth layer, or may control at least one of the first processing part 3300, the second processing part 4300, the third processing part 5300, the fifth processing part 7300, and the sixth processing part 8300 to adjust the thickness of at least one layer from among the first layer, the second layer, the third layer, the fifth layer, and the sixth layer except the fourth layer.

[0124] The fifth robot 7200 may move the display substrate DP arranged in the fourth connection part 9240 from the fourth connection part 9240 to the fifth transfer chamber 7100, and then may move the display substrate DP from the fifth transfer chamber 7100 to the fifth processing part 7300. Thereafter, when the fifth layer and the fifth dummy layer are formed on the display substrate DP, the fifth robot 7200 may move the display substrate DP from the fifth processing part 7300 to the fifth transfer chamber 7100. In this case, the internal pressure of the fourth connection part 9240 and the internal pressure of the fifth transfer chamber 7100 or the internal pressure of the fifth transfer chamber 7100 and the internal pressure of the fifth processing part 7300 may be equal to or similar to each other according to the moving path of the display substrate DP.

[0125] The fifth robot 7200 may move the display substrate DP on which the fifth layer is formed from the fifth conveying chamber 7100 to the fifth connecting portion 9250. In this case, the fifth thickness measuring unit of the fifth connecting portion 9250 may measure the thickness of at least one of the fifth layer and the fifth dummy layer. In this case, the fifth dummy layer may be located on the display substrate DP so as not to overlap with the first dummy layer, the second dummy layer, the third dummy layer, and the fourth dummy layer. Hereinafter, for ease of description, the fifth thickness measuring unit measures the thickness of the fifth dummy layer, and the controller calculates the thickness of the fifth layer based on the thickness of the fifth dummy layer.

[0126] The controller can control the fifth processing part 7300 to compare the calculated thickness of the fifth layer with the corresponding (e.g., preset) fifth thickness and adjust the thickness of the fifth layer, or can control at least one of the first processing part 3300, the second processing part 4300, the third processing part 5300, the fourth processing part 6300 and the sixth processing part 8300 to adjust the thickness of at least one of the first layer, the second layer, the third layer, the fourth layer and the sixth layer other than the fifth layer.

[0127] The sixth robot 8200 may move the display substrate DP from the fifth connection part 9250 to the sixth transfer chamber 8100, and may move the display substrate DP from the sixth transfer chamber 8100 to the sixth processing part 8300. In this case, the internal pressure of the fifth connection part 9250 and the internal pressure of the sixth transfer chamber 8100 or the internal pressure of the sixth transfer chamber 8100 and the internal pressure of the sixth processing part 8300 may be equal to or similar to each other depending on the moving path of the display substrate DP.

[0128] The sixth processing part 8300 may form a sixth layer and a sixth dummy layer on the display substrate DP. In this case, a plurality of sixth processing parts 8300 may form a sixth layer including materials different from each other. For example, the sixth layer may include a sixth-1 layer, a sixth-2 layer, a sixth-3 layer, a sixth-4 layer, and a sixth-5 layer. The sixth-1 layer may be a common electrode, the sixth-2 layer may be a protective layer (or a covering layer), and the sixth-3 layer may be a first inorganic encapsulation layer described later, the sixth-4 layer may include an organic encapsulation layer described later, and the sixth-5 layer may include a second inorganic encapsulation layer described later. When each of the plurality of sixth layers is formed on the display substrate DP, the sixth robot 8200 may move the display substrate DP from one of the plurality of sixth processing parts 8300 to the sixth transfer chamber 8100, and then the display substrate DP may be moved from the sixth transfer chamber 8100 to another of the plurality of sixth processing parts 8300. When the plurality of sixth layers described above are formed, a plurality of sixth dummy layers may be formed to correspond to the plurality of sixth layers, respectively. In addition, a plurality of sixth dummy layers may be arranged in regions different from each other of the display substrate DP so as not to overlap with each other.

[0129] When the sixth layer is formed on the display substrate DP, the sixth robot 8200 may move the display substrate DP from the sixth processing part 8300 to the sixth transfer chamber 8100, and then may move the display substrate DP from the sixth transfer chamber 8100 to the sixth connection part 9260. The sixth thickness measuring unit arranged in the sixth connection part 9260 may measure the thickness of the sixth layer. In this case, the sixth thickness measuring unit may measure at least one of the thickness of each of the plurality of sixth layers and the thickness of each of the plurality of sixth dummy layers. In one or more other embodiments, the sixth thickness measuring unit may measure only one of the thickness of one of the plurality of sixth layers and the thickness of one of the plurality of sixth dummy layers. Hereinafter, for ease of description, it is mainly described in detail that the sixth thickness measuring unit only measures the thickness of the sixth dummy layer corresponding to the sixth-3 layer as an organic encapsulation layer from among the plurality of sixth layers.

[0130] In this case, the thickness of the sixth dummy layer corresponding to the sixth-3 layer measured in the sixth thickness measurement unit can be measured, and the controller can calculate the thickness of the sixth-3 layer based on the thickness of the sixth dummy layer measured in the sixth thickness measurement unit. The controller can compare the calculated thickness of the sixth-3 layer with the corresponding (e.g., preset) sixth-3 thickness (or sixth thickness). In this way, the controller can control the corresponding sixth processing part 8300 to adjust the thickness of the sixth-3 layer, or to adjust the thickness of at least one of the remaining sixth layers except the sixth-3 layer. In one or more other embodiments, at least one of the first processing part 3300, the second processing part 4300, the third processing part 5300, the fourth processing part 6300, and the fifth processing part 7300 can be controlled so that the thickness of at least one of the remaining first layer, the second layer, the third layer, the fourth layer, and the fifth layer except the sixth layer can be adjusted.

[0131] The display substrate DP on which the sixth layer is formed may be moved to the unloading part 9100. In this case, in one or more embodiments, the unloading part 9100 may have a separate mechanical arm. In addition, a separate flipping part 2000 may be provided between the unloading part 9100 and the sixth processing part 8300 so that the posture of the display substrate DP is flipped, thereby changing the posture of the display substrate DP.

[0132] Therefore, in the apparatus 1 for manufacturing a display device and the method for manufacturing a display device, the optical properties (eg, wavelength, energy, intensity, etc. of light) of the manufactured display device may be similar to corresponding (eg, preset) optical properties.

[0133] In the apparatus 1 for manufacturing a display device and the method for manufacturing a display device, the thickness of at least one of the multiple layers formed on the display substrate DP during the manufacturing process can be accurately measured. In this case, the first thickness measuring unit, the second thickness measuring unit, the third thickness measuring unit, the fourth thickness measuring unit, the fifth thickness measuring unit, and the sixth thickness measuring unit can operate similarly to each other. Hereinafter, for ease of description, a method for measuring the thickness of the first layer by the first thickness measuring unit is described in detail.

[0134] FIG. 4A to FIG. 4G It is schematically shown Figure 1 0026] A partial perspective view of a portion of an operation of an apparatus 1 for manufacturing a display device is shown in FIG.

[0135] Reference Figure 4A, in one or more embodiments, a display substrate DP on which a first layer and a first dummy layer TEG are formed may be arranged in a first connection portion. In this case, a first dummy layer TEG, which is performed in the same process as the process of the first layer and is arranged at the edge of the display substrate DP, may be located on the display substrate DP. In this case, in one or more embodiments, the first dummy layer TEG may be in direct contact with the substrate of the display substrate DP, or in one or more embodiments, the first dummy layer TEG may be located on the electrode layer in a state where a layer such as a buffer layer, a gate insulating layer, and an electrode layer (source electrode or drain electrode) as described below is stacked on the substrate. In addition, the first dummy layer TEG may be arranged only in the corresponding region of the display substrate DP. In this case, in a plan view, the first dummy layer TEG may have an island shape and may be completely disconnected from the first layer.

[0136] At least one dummy layer including the first dummy layer TEG may be provided on the display substrate DP. For example, a plurality of dummy layers may be provided to correspond to the first layer, the second layer, the third layer, the fourth layer, the fifth layer, and the sixth layer, respectively. In this case, in each of the plurality of dummy layers, at least two of the first layer, the second layer, the third layer, the fourth layer, the fifth layer, and the sixth layer are not stacked in sequence, but one dummy layer may correspond to one of the first layer, the second layer, the third layer, the fourth layer, the fifth layer, and the sixth layer. Therefore, in a plan view, the plurality of dummy layers are arranged in different portions of the display substrate DP from each other so as not to overlap each other.

[0137] In one or more embodiments, the first robotic arm 3200 may move the display substrate DP from the first transfer chamber to the first connection chamber. The first robotic arm 3200 may move the display substrate DP to a corresponding (e.g., preset) position in the first connection chamber. In addition, the first base portion 9214 may be arranged at a corresponding (e.g., preset) initial position. The posture of the first base portion 9214 may maintain a corresponding (e.g., preset) initial setting posture. For example, the first base portion 9214 may be arranged in the first connection chamber so that a point of the first base portion 9214 (e.g., the center of the opening area of ​​the first base portion 9214) corresponds to a corresponding (e.g., preset) first center setting position. In this case, the first center setting position may be the center of the first connection chamber.

[0138] Reference Figure 4B, the first mechanical arm 3200 can be lowered, and the display substrate DP can be mounted on the first support portion 9215. In this case, due to various reasons, such as design errors in the first mechanical arm 3200, the operation of the first mechanical arm 3200, the moving speed of the first mechanical arm 3200, etc., the display substrate DP may be twisted on the first mechanical arm 3200, or one point of the display substrate DP (e.g., the center of the display substrate DP) may not be arranged at an accurate position. In other words, when the first mechanical arm 3200 moves the display substrate DP into the first connection chamber and arranges the display substrate DP on the first base portion 9214 at intervals, one point of the display substrate DP must be arranged at the first center setting position. However, when the display substrate DP is located on the first base portion 9214 due to the above reasons, one point of the display substrate DP and the first center setting position may deviate from each other. In addition, the display substrate DP may be in a distorted state different from the corresponding (e.g., preset) posture.

[0139] Reference Figure 4C , after the display substrate DP can be placed on the first support portion 9215, the first support portion 9215 can be moved so that the position of one point of the display substrate DP corresponds to the first center set position. In addition, the first support portion 9215 can be moved so that the posture of the display substrate DP corresponds to the corresponding (e.g., preset) posture. In this case, the first base portion 9214 can be twisted from its initial state, or can be arranged at a position different from its initial position.

[0140] For example, the first detection part 9216 may shoot the edge of the substrate of the display substrate DP or the alignment mark ARM located on the substrate of the display substrate DP. By shooting the edge of the display substrate DP or the alignment mark ARM, the position and posture of the display substrate DP may be calculated. In addition, the first detection part 9216 may shoot the first base part 9214. Based on the shot display substrate DP and the first base part 9214, the relative position between the display substrate DP and the first base part 9214 may be identified. Thereafter, after the display substrate DP is placed on the first base part 9214, the first mechanical arm 3200 may lower the display substrate DP, and the display substrate DP may be arranged on the first support part 9215. When the first base part 9214 moves linearly so that the edge of the display substrate DP or the alignment mark ARM corresponds to the corresponding (e.g., preset) alignment position, the display substrate DP may move linearly so that one point of the display substrate DP corresponds to the first center setting position. In addition, the display substrate DP may be rotated by linearly moving the first support part 9215 so that the posture of the display substrate DP corresponds to the corresponding (e.g., preset) posture.

[0141] Reference Figure 4D , after the position of the first base portion 9214 is moved, the first robot 3200 may support and raise the display substrate DP again. In this case, the display substrate DP may be separated from the first supporting portion 9215. In addition, the first driving portion 9212 may move the first supporting portion 9215 so that the first base portion 9214 corresponds to the initial position and the initial setting posture. Thereafter, in one or more embodiments, after the display substrate DP is located on the first supporting portion 9215, the first robot 3200 may be separated from the display substrate DP and may be returned to the first transfer chamber.

[0142] Reference Figure 4E , when the display substrate DP is ascended and descended by the first robot arm 3200, the posture of the display substrate DP may be distorted or the position of the display substrate DP may be changed.

[0143] Reference Figure 4F , the position of the display substrate DP can be aligned. For example, the first detection part 9216 can shoot the edge of the display substrate DP or the alignment mark ARM. The position and posture of the display substrate DP can be calculated by comparing with the alignment position based on the photographed edge of the display substrate DP or the photographed alignment mark ARM. The first base part 9214 can move linearly so that the edge of the display substrate DP or the alignment mark ARM corresponds to the alignment position.

[0144] Reference Figure 4G , when performing the above operations, the positions of the first dummy layer TEG and the first measuring part 9217 can be aligned to a certain extent. However, there may be a situation where the center of the first dummy layer TEG and the center of the first measuring part 9217 do not correspond to each other. In this case, it may be difficult to accurately measure the thickness of the first dummy layer TEG. In order to reduce or prevent the possibility of this problem, the first measuring part 9217 can detect the position and posture of the first dummy layer TEG, and the position and posture of the display substrate DP can be changed based on the detection result. For example, a point (e.g., center) of the first dummy layer TEG measured by the first measuring part 9217 can be compared with a corresponding (e.g., preset) dummy position. In this way, the position and posture of the first dummy layer TEG can be calculated. In this case, the first driving part 9212 can linearly move the first base part 9214 according to the detected position and posture of the first dummy layer TEG.

[0145] When the above process is completed, the first measuring part 9217 can measure the thickness of the first dummy layer TEG. In this case, the first measuring part 9217 can accurately measure the thickness of the first dummy layer TEG by irradiating a laser beam or light to the first dummy layer TEG and then analyzing the wavelength of the reflected laser beam or light, etc.

[0146] As described above, the method for measuring the thickness of the first dummy layer TEG can be similarly applied to the thickness of the second layer, the thickness of the third layer, the thickness of the fourth layer, the thickness of the fifth layer, and the thickness of the sixth layer. In other words, the thickness of the first dummy layer TEG can be measured by a process similar to that described above to be used in the apparatus 1 for manufacturing a display device (see Figure 1 ) is the thickness of the dummy layer formed in the same process as each layer formed in ).

[0147] Therefore, in the apparatus 1 for manufacturing a display device and the method for manufacturing a display device, the thickness of each layer can be accurately controlled by accurately measuring the thickness of the dummy layer. In addition, in the apparatus 1 for manufacturing a display device and the method for manufacturing a display device, the measurement error caused by the error between the position of the measuring part and the position of the dummy layer can be reduced by accurately controlling the positions of the dummy layer and the measuring part.

[0148] Figure 5 It is schematically shown Figure 3 A front view of a portion of the first support portion 9215 is shown in FIG.

[0149] Reference Figure 5 , when the thickness of each layer is measured by measuring the thickness of the dummy layer, in one or more embodiments, the thickness of each layer may be affected by the curvature of the curved surface of the display substrate DP (or substrate). In other words, when the plurality of first supporting portions 9215 support the display substrate DP, the display substrate DP may bend due to the size, area, weight, etc. of the display substrate DP. In this case, the portion of the display substrate DP on which the above-mentioned dummy layer is located may have different curved surface shapes in different display substrates DP. In this case, even if the dummy layer is formed identically in the same area of ​​different display substrates DP, the thickness of each layer measured by the first measuring portion 9217 (see Figure 4G ) may also be different from each other. In this case, when the above process is performed based on the value measured by the first measuring part 9217, it may become difficult to manufacture a display device of stable quality.

[0150] Therefore, in order to manufacture a display device of uniform quality, the plurality of first supporting portions 9215 may be arranged at different heights from each other so as to support the display substrate DP to have a constant shape.

[0151] For example, in one or more embodiments, one of the plurality of first support portions 9215, another of the plurality of first support portions 9215, and yet another of the plurality of first support portions 9215 may be arranged at heights different from each other on one surface of the first base portion, respectively. For example, the plurality of first support portions 9215 may include a first-1 support portion 9215a, a first-2 support portion 9215b, and a first-3 support portion 9215c. In this case, the first-1 support portion 9215a may be located at a higher position than the first-2 support portion 9215b, the first-2 support portion 9215b may be located at a lower position than the first-3 support portion 9215c, and the first-3 support portion 9215c may be located at a higher position than the first-1 support portion 9215a. In addition, the first-2 support portion 9215b and the first-3 support portion 9215c may be symmetrical to each other relative to the first-1 support portion 9215a. In this case, the plurality of first support portions 9215 may support one edge of the display substrate DP in a "W" shape. In this case, the portion where the first dummy layer TEG is located always has a constant shape in the plurality of display substrates DP, thereby reducing the measurement error caused by the shape of the display substrate DP. In this case, the shape of the supporting display substrate DP is not limited to the above shape, and may include all structures that support the display substrate DP while keeping the shape of the display substrate DP unchanged.

[0152] The above structure is not necessarily applicable only to the first thickness measurement unit. For example, at least one of the second support portion of the second thickness measurement unit, the third support portion of the third thickness measurement unit, the fourth support portion of the fourth thickness measurement unit, the fifth support portion of the fifth thickness measurement unit, and the sixth support portion of the sixth thickness measurement unit may have a shape that is the same as or similar to the shape of the first support portion 9215.

[0153] Therefore, in the apparatus 1 for manufacturing a display device (see Figure 1 ) and a method for manufacturing a display device, the measurement error caused by the curvature of the substrate can be reduced.

[0154] Fig. 6A Schematically illustrates an apparatus 1 for manufacturing a display device according to one or more other embodiments (see Figure 1 ) is a cross-sectional view of the third processing portion 5300. Figure 6B It is schematically shown Fig. 6A The rotating portion 5380 shown in FIG. 5 and the plan view of the display substrate DP are shown in FIG.

[0155] Reference Fig. 6A and Figure 6B, the third process part 5300 may include a third process chamber 5310 , a third thickness measuring unit, a third mask supporting part 5390 , a third deposition source 3320 , and a third process pressure adjusting part 5391 .

[0156] The third process chamber 5310 may have a space formed therein and may accommodate the display substrate DP and the mask assembly MS. In this case, the third process chamber 5310 may have an opening to allow the display substrate DP and the mask assembly MS to move, and may include an opening / closing portion such as a gate valve that may open and close the opening.

[0157] The above-mentioned mask assembly MS may include a mask frame M-1 and a mask sheet M-2. The mask frame M-1 may have / define an opening area at its center and may be in the form of a picture frame. The mask sheet M-2 may be located on the mask frame M-1 in a tensioned state and may shield the opening area of ​​the mask frame M-1. In this case, the mask sheet M-2 may include at least one opening M-2a. This opening M-2a may include one or more openings according to the layer in which the opening M-2a is formed. For example, in a layer located on the front surface of the display substrate DP, a single opening M-2a may be provided and formed the same or similarly to the opening area. In one or more other embodiments, when the opening M-2a is arranged in a pattern in a corresponding portion of the display substrate DP, similar to the organic emission layer, a plurality of openings M-2a may be provided to be spaced apart from each other. In the following, since the third layer corresponds to the organic emission layer, for ease of description, the case where the third layer includes a plurality of layers is mainly described in detail.

[0158] In addition to the above, the mask assembly MS may further include a support rod M-3. The support rod M-3 may be located on the mask frame M-1, may divide the opening area into a plurality of opening areas, and may support the mask sheet M-2. In this case, in one or more embodiments, the support rod M-3 may include a plurality of support rods M-3, and the plurality of support rods M-3 may be arranged spaced apart from each other in the same direction. In one or more other embodiments, some of the plurality of support rods M-3 may be arranged spaced apart from each other in a first direction, and other support rods M-3 of the plurality of support rods M-3 may be arranged spaced apart from each other in a second direction. In this case, one support rod M-3 of the plurality of support rods M-3 and another support rod M-3 of the plurality of support rods M-3 may cross each other.

[0159] The third thickness measuring unit may include a third base portion 5340, a third supporting portion 5350, a third detecting portion 5360, a third measuring portion 5370, and a rotating portion 5380. In this case, the third base portion 5340, the third supporting portion 5350, the third detecting portion 5360, and the third measuring portion 5370 are respectively the same as those described above with reference to Figure 3 The first base portion 9214, the first supporting portion 9215, the first detecting portion 9216, and the first measuring portion 9217 are described to be the same or similar, and repeated descriptions thereof are omitted.

[0160] At least one of the third detection part 5360 and the third measuring part 5370 may be located on the rotating part 5380, and the rotating part 5380 may rotate at least one of the third detection part 5360 and the third measuring part 5370. In this case, the rotating part 5380 may be rotated according to the process of forming the third layer. In this case, the rotating part 5380 may include a rotating plate 5381 and a rotating driving part 5382 having a motor connected to the rotating plate 5381, and at least one of the third detection part 5360 and the third measuring part 5370 is located on the rotating plate 5381. Hereinafter, for the convenience of description, the case where only the third measuring part 5370 is located on the rotating plate 5381 is mainly described in detail.

[0161] The mask assembly MS may be placed on the third mask supporting portion 5390. The third mask supporting portion 5390 may allow the mask assembly MS to be placed thereon and the position of the mask assembly MS may be adjusted.

[0162] The third deposition source 3320 may be disposed inside the third process chamber 5310 and may supply the deposition material to the display substrate DP. In this case, the third deposition source 3320 may contain the deposition material therein and may apply heat to the deposition material to evaporate or sublime the deposition material.

[0163] The third process pressure regulating part 5391 may be connected to the third process chamber 5310, and may regulate the internal pressure of the third process chamber 5310. For example, the third process pressure regulating part 5391 may have a pipe connected to the third process chamber 5310, and may have a pump located on the pipe. In this case, according to the operation of the pump, external air may be supplied to the third process chamber 5310, or the air within the third process chamber 5310 may be discharged to the outside.

[0164] Meanwhile, when the third processing part 5300 is operated, the position of the display substrate DP may be aligned. FIG. 4A to FIG. 4ESimilar to the description provided, the position of the display substrate DP is adjusted so that the display substrate DP can be placed on the third supporting portion 5350 .

[0165] When the above process is completed, the mask assembly MS is located on the third mask supporting part 5390, and then, the position between the mask assembly MS and the display substrate DP can be photographed by using the third detection part 5360. Based on the above, the relative position of the mask assembly MS and the display substrate DP can be calculated so that the mask assembly MS and the display substrate DP can be aligned with each other. In this case, the third detection part 5360 can be arranged outside the third processing chamber 5310, and the inside of the third detection part 5360 can be photographed through the transmission window of the third processing chamber 5310.

[0166] When the alignment of the mask assembly MS with the display substrate DP is completed, the third process pressure adjusting portion 5391 may adjust the pressure inside the third process chamber 5310 from a state similar to the atmospheric pressure to a state similar to a vacuum. Thereafter, a deposition material may be supplied through the third deposition source 3320 so that a third layer may be located on the display substrate DP. In this case, the third layer may be an organic emission layer as described above.

[0167] The above-mentioned organic emission layer may form a dummy layer TEG (i.e., a third dummy layer) located on the same layer as the third layer on one area of ​​the display substrate DP. When the formation of the third layer on the display substrate DP is completed, the mask assembly MS may be pulled out of the third process chamber 5310. Thereafter, the rotating part 5380 may be operated to rotate the third measuring part 5370 so that the third measuring part 5370 may be arranged to correspond to the dummy layer TEG. In this case, in order to arrange the third measuring part 5370 and the dummy layer TEG to correspond to each other, the above-mentioned Figure 4F and Figure 4G The operation is similar to the operation of

[0168] After the thickness of the dummy layer TEG is measured by the third measuring part 5370, the thickness of the third layer may be adjusted based on the thickness of the dummy layer TEG, or the thickness of another layer other than the third layer may be adjusted. For example, since the third measuring part 5370 is disposed inside the third processing chamber 5310, and since the thickness of the third layer may be calculated in a state where the display substrate DP is not pulled out of the third measuring part 5370, the thickness of the third layer may be adjusted to correspond to the corresponding (e.g., preset) third thickness.

[0169] In one or more other embodiments, the rotating plate 5381 of the rotating part 5380 may be disposed between the display substrate DP and the mask assembly MS. In this case, as described above, the third detection part 5360 may be disposed outside or inside the third process chamber 5310. In addition, in this case, the rotating plate 5381 of the rotating part 5380 may rotate (e.g., around point 5381a) and may be disposed between the display substrate DP and the mask assembly MS, and therefore, the mask assembly MS may not be pulled out of the third process chamber 5310 to measure the thickness of the third dummy layer.

[0170] In one or more other embodiments, the third processing part 5300 may support the display substrate DP and the mask assembly MS by a single structure (e.g., a shuttle, etc.). In this case, the third base portion 5340 and the third mask supporting portion 5390 may be integrally formed. In addition, the rotating portion 5380 may be connected to at least one of the third base portion 5340 and the third mask supporting portion 5390.

[0171] In this case, when the deposition process is performed, the rotating plate 5381 of the rotating part 5380 may be arranged so as not to interfere with the path of the deposition material. After the deposition process is completed, the rotating plate 5381 of the rotating part 5380 may be rotated to measure the thickness of the third dummy layer, and in a plan view, the rotating plate 5381 may overlap with the display substrate DP.

[0172] The first process part, the second process part, the fourth process part, and the fifth process part may be the same as or similar to the above-mentioned third process part 5300. In this case, when the layers formed in the first process part, the second process part, the fourth process part, and the fifth process part are formed on the entire surface of the display substrate DP, the mask sheet for deposition may have a single opening.

[0173] Therefore, in the apparatus 1 for manufacturing a display device, the thickness of a layer can be measured in a processing portion where one layer is formed.

[0174] In one or more embodiments, the above structure may be applied to at least one of the first thickness measurement unit, the second thickness measurement unit, the fourth thickness measurement unit, the fifth thickness measurement unit, and the sixth thickness measurement unit.

[0175] Figure 7 is a front view schematically illustrating a portion of an apparatus for manufacturing a display device according to one or more other embodiments.

[0176] exist Figure 7 Because the equipment used to manufacture the display device is different from the reference Figures 1 to 3The described apparatuses 1 for manufacturing a display device are the same or similar, and for ease of description, mainly the differences are described in detail.

[0177] In one or more embodiments, the first thickness measuring unit may include a first base portion 9214, a first supporting portion 9215, a first detecting portion 9216, a first measuring portion 9217, and a moving driving portion 9219. In this case, since the first base portion 9214 and the first supporting portion 9215 are similar to the above reference Figure 1 Those described are the same or similar, and thus a detailed description thereof is omitted.

[0178] The mobile driving part 9219 may include a driving force generating part 9219a, a guiding part 9219b and a moving block 9219c, the moving block 9219c is placed on the driving force generating part 9219a to move itself, the guiding part 9219b is connected to the driving force generating part 9219a to guide the movement of the moving block 9219c, and at least one of the first detecting part 9216 and the first measuring part 9217 is located on the moving block 9219c. In this case, the moving block 9219c can move along the curve according to the operation of the driving force generating part 9219a. For example, in the moving block 9219c, when the display substrate DP is located on the first supporting part 9215, the display substrate DP may sag due to the load. In this case, the portion of the display substrate DP that the first measuring part 9217 must measure may be round. The moving path of the moving block 9219c may correspond to the arc portion of the display substrate DP.

[0179] In this case, each of the first detection portion 9216 and the first measurement portion 9217 may be arranged so that the signal is incident in a direction perpendicular to one surface of the display substrate DP. In other words, each of the first detection portion 9216 and the first measurement portion 9217 may be located on the moving block 9219c so that the longitudinal direction is inclined from the load direction rather than the load direction. By the above, the problem of signal path distortion or signal non-reception due to sagging of the display substrate DP can be reduced.

[0180] In one or more embodiments, the above structure may be applied to at least one of the second thickness measurement unit, the third thickness measurement unit, the fourth thickness measurement unit, the fifth thickness measurement unit, and the sixth thickness measurement unit.

[0181] Figure 8 is a front view schematically illustrating a portion of an apparatus for manufacturing a display device according to one or more other embodiments.

[0182] exist Figure 8 In the invention, since the equipment for manufacturing the display device is different from the reference Figures 1 to 3 The described apparatuses 1 for manufacturing a display device are the same or similar, and for ease of description, mainly the differences are described in detail.

[0183] In one or more embodiments, the first thickness measurement unit may include a first base portion 9214, a first support portion 9215, a first detection portion, and a first measurement portion. In this case, the first base portion 9214, the first support portion 9215, the first detection portion, and the first measurement portion are the same as those described above. Figure 1 Those described are similar, and duplicate descriptions thereof are omitted.

[0184] The first thickness measurement unit may further include a substrate fixing portion SUT, which is a substrate pressing portion arranged to face the first base portion 9214. The substrate fixing portion SUT may be in the form of an electrostatic chuck or an adhesive chuck, and may keep the display substrate DP flat. In this case, the display substrate DP may form a flat surface, and a plurality of first support portions 9215 may be arranged at the same height.

[0185] In addition, in this case, when the thickness of the dummy layer is measured by the first measuring part 9217, one surface of the display substrate DP is flat, and thus, a measurement error generated by bending of the display substrate DP due to a load of the display substrate DP may be reduced.

[0186] In one or more embodiments, the above structure may be applied to at least one of the second thickness measurement unit, the third thickness measurement unit, the fourth thickness measurement unit, the fifth thickness measurement unit, and the sixth thickness measurement unit.

[0187] Fig. 9 is a front view illustrating a portion of an apparatus for manufacturing a display device according to one or more other embodiments.

[0188] exist Fig. 9 In the invention, since the equipment for manufacturing the display device is different from the reference Figures 1 to 3 The described apparatuses 1 for manufacturing a display device are the same or similar, and for ease of description, mainly the differences are described in detail.

[0189] In one or more embodiments, the first thickness measuring unit may include a first base portion, a first support portion 9215, a first detection portion, and a first measurement portion. In this case, the first base portion, the first support portion 9215, the first detection portion 9216, and the first measurement portion 9217 are the same as those described above. Figure 1 Those described are similar, and redundant descriptions thereof are omitted.

[0190] The first thickness measuring unit may further include a substrate clamp CLP, which is a substrate pressing portion arranged to face a portion of the first supporting portion 9215. The substrate clamp CLP may be in the form of an electrostatic chuck or an adhesive chuck, and may keep a corresponding portion of the display substrate DP flat. For example, the substrate clamp CLP may fix an edge portion of the display substrate DP where the dummy layer is arranged so that the edge forms a flat surface.

[0191] In this case, when the thickness of the dummy layer is measured by the first measuring part 9217, one surface of the display substrate DP is flat, and thus, a measurement error caused by bending of the display substrate DP due to a load of the display substrate DP may be reduced.

[0192] In one or more embodiments, the above structure may be applied to at least one of the second thickness measurement unit, the third thickness measurement unit, the fourth thickness measurement unit, the fifth thickness measurement unit, and the sixth thickness measurement unit.

[0193] Fig.10 is a plan view schematically showing a display device 2 according to one or more embodiments.

[0194] Reference Fig.10 , the display device 2 may include a display area DA and a peripheral area PA located outside the display area DA. The display device 2 may provide an image through an array of a plurality of pixels PX two-dimensionally arranged in the display area DA.

[0195] The peripheral area PA is an area in which an image is not provided, and may completely or partially surround the display area DA. In the peripheral area PA, a driver or the like for providing an electrical signal or power to a pixel circuit corresponding to each of the pixels PX may be arranged. In the peripheral area PA, a pad may be arranged, which is an area to which an electronic component, a printed circuit board, or the like may be electrically connected.

[0196] In the following, the display device 2 is described as including an organic light emitting diode OLED as a light emitting element. However, the display device 2 of one or more embodiments is not limited to this. In one or more other embodiments, the display device 2 can be a light emitting display device including an inorganic light emitting diode, i.e., an inorganic light emitting display. The inorganic light emitting diode can include a PN junction diode containing a material based on an inorganic material semiconductor. When a voltage is applied forward to the PN junction diode, holes and electrons are injected, and the energy generated by the recombination of holes and electrons is converted into light energy to emit light of a corresponding color. The above-mentioned inorganic light emitting diode can have a width of several microns to several hundred microns, and in some embodiments, the inorganic light emitting diode can be referred to as a micro light emitting diode (LED). In one or more other embodiments, the display device 2 can be a quantum dot light emitting display.

[0197] At the same time, the display device 2 can be used not only as a portable electronic device (such as a mobile phone, a smart phone, a tablet personal computer (PC), a mobile communication terminal, an electronic notebook, an electronic book, a portable multimedia player (PMP), a navigator, and an ultra-mobile PC (UMPC)), but also as a display screen for various products (such as a television, a laptop computer, a monitor, a billboard, and an Internet of Things (IoT) device). In addition, the display device 2 according to one or more embodiments can be used for wearable devices such as smart watches, watch phones, glasses-type displays, and head-mounted displays (HMD). In addition, the display device 2 according to one or more embodiments can be used for a dashboard of a vehicle, a central information display arranged on a central panel or an instrument panel, an interior mirror display that replaces a side mirror of a vehicle, or a display screen arranged on the rear surface of a front seat as a rear seat entertainment display for a vehicle.

[0198] Fig.11 is schematically shown along Fig.10 A cross-sectional view of a section taken along line XI-XI' in FIG.

[0199] Reference Fig.11 The display device 2 may include a stacked structure of a substrate 100, a pixel circuit layer PCL, a display element layer DEL, and an encapsulation layer 300. Display substrate DP (see Figure 1 ) may be during the manufacturing process of the display device 2, and for example, the display substrate DP may include a substrate 100, and may include a stacked structure of at least any one of at least one layer of a pixel circuit layer PCL, at least one layer of a display element layer DEL, and at least one layer of an encapsulation layer 300 on the substrate 100.

[0200] The substrate 100 may have a multilayer structure including a base layer including a polymer resin and an inorganic layer. For example, the substrate 100 may include a base layer including a polymer resin and a barrier layer as an inorganic insulating layer. For example, the substrate 100 may include a first base layer 101, a first barrier layer 102, a second base layer 103, and a second barrier layer 104 stacked in sequence. The first base layer 101 and the second base layer 103 may include polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), triacetyl cellulose (TAC) and / or cellulose acetate propionate (CAP). The first barrier layer 102 and the second barrier layer 104 may include an inorganic insulating material such as silicon oxide, silicon oxynitride and / or silicon nitride. The substrate 100 may have a flexible property.

[0201] The pixel circuit layer PCL may be located on the substrate 100 . Fig.11 The pixel circuit layer PCL is shown to include a thin film transistor TFT and a buffer layer 111, a first gate insulating layer 112, a second gate insulating layer 113, an interlayer insulating layer 114, a first planarizing insulating layer 115 and a second planarizing insulating layer 116 located below and / or above the thin film transistor TFT / part of the thin film transistor TFT.

[0202] The buffer layer 111 may reduce or block penetration of foreign matter, moisture, or external air from the lower portion of the substrate 100, and may provide a flat surface on the substrate 100. The buffer layer 111 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, and silicon nitride, and may include a single layer or multilayer structure including the above materials.

[0203] The thin film transistor TFT on the buffer layer 111 may include a semiconductor layer Act, and the semiconductor layer Act may include polycrystalline silicon. Alternatively, the semiconductor layer Act may include amorphous silicon, an oxide semiconductor, an organic semiconductor, etc. The semiconductor layer Act may include a channel region C and a drain region D and a source region S arranged on opposite sides of the channel region C. The gate electrode GE may overlap the channel region C.

[0204] The gate electrode GE may include a low resistance metal material. The gate electrode GE may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may include one or more layers including the above materials.

[0205] The first gate insulating layer 112 between the semiconductor layer Act and the gate electrode GE may include an inorganic insulating material such as silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO x ). Zinc oxide (ZnO x ) can be zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ).

[0206] The second gate insulating layer 113 may be provided to cover the gate electrode GE. Similar to the first gate insulating layer 112, the second gate insulating layer 113 may include an inorganic insulating material such as SiO 2 、SiN x 、SiOx N y 、Al 2 O 3 、TiO 2 、 2 O 5 , HfO 2 or ZnO x .ZnO x It can be ZnO and / or ZnO 2 .

[0207] The upper electrode Cst2 of the storage capacitor Cst may be located above the second gate insulating layer 113. The upper electrode Cst2 may overlap the gate electrode GE thereunder. In this case, the gate electrode GE and the upper electrode Cst2 overlapping each other and the second gate insulating layer 113 interposed between the gate electrode GE and the upper electrode Cst2 may form a storage capacitor Cst. In other words, the gate electrode GE may serve as the lower electrode Cst1 of the storage capacitor Cst.

[0208] As described above, the storage capacitor Cst and the thin film transistor TFT may overlap each other. In some embodiments, the storage capacitor Cst may be formed not to overlap with the thin film transistor TFT.

[0209] The upper electrode Cst2 may include Al, platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), Mo, Ti, tungsten (W) and / or Cu, and may include one or more layers of the above materials.

[0210] The interlayer insulating layer 114 may cover the upper electrode Cst2. The interlayer insulating layer 114 may include an inorganic insulating material such as SiO 2 、SiN x 、SiO x N y 、Al 2 O 3 、TiO 2 、 2 O 5 , HfO 2 or ZnO x .ZnO x It can be ZnO and / or ZnO 2 The interlayer insulating layer 114 may include one or more layers including the above-mentioned inorganic insulating material.

[0211] The drain electrode DE and the source electrode SE may be located on the interlayer insulating layer 114. The drain electrode DE and the source electrode SE may be connected to the drain region D and the source region S, respectively, through contact holes formed in the insulating layer thereunder. The drain electrode DE and the source electrode SE may include a material having good electrical conductivity. The drain electrode DE and the source electrode SE may include a conductive material including Mo, Al, Cu, Ti, etc., and the drain electrode DE and the source electrode SE may include one or more layers including the above materials. In one or more embodiments, the drain electrode DE and the source electrode SE may have a multilayer structure of Ti / Al / Ti.

[0212] The first planarization insulating layer 115 may cover the drain electrode DE and the source electrode SE. The first planarization insulating layer 115 may include an organic insulating material, such as a general polymer such as polystyrene (PS), polymethyl methacrylate (PMMA), a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aromatic ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, and / or a mixture thereof.

[0213] The second planarization insulating layer 116 may be located on the first planarization insulating layer 115. The second planarization insulating layer 116 may include the same material as the first planarization insulating layer 115, and may include an organic insulating material such as a general polymer (such as PS), PMMA, a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aromatic ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, and / or a mixture thereof.

[0214] The display element layer DEL may be located on the pixel circuit layer PCL having the above structure. The display element layer DEL may include an organic light emitting diode OLED as a display element (e.g., a light emitting element), and the organic light emitting diode OLED may include a stacked structure of a pixel electrode 210, an intermediate layer 220, and a common electrode 230. For example, the organic light emitting diode OLED may emit one of red light, green light, and blue light, or may emit one of red light, green light, blue light, and white light. The organic light emitting diode OLED may emit light through an emission region, and the emission region is defined as a pixel PX.

[0215] The pixel electrode 210 of the organic light emitting diode OLED may be electrically connected to the thin film transistor TFT through a contact hole formed in the second planarization insulating layer 116 and the first planarization insulating layer 115 and through a contact metal CM located on the first planarization insulating layer 115 .

[0216] The pixel electrode 210 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), indium gallium oxide (IGO) or aluminum zinc oxide (AZO). In one or more other embodiments, the pixel electrode 210 may include a reflective film, and the reflective film includes Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or a compound thereof. In one or more other embodiments, the pixel electrode 210 may also include a layer including ITO, IZO, ZnO or In above / below the reflective film. 2 O 3 membrane.

[0217] The pixel defining layer 117 may be located on the pixel electrode 210, and the pixel defining layer 117 may have an opening 117OP exposing the central portion of the pixel electrode 210. The pixel defining layer 117 may include an organic insulating material and / or an inorganic insulating material. The opening 117OP may define an emission region of light emitted from the organic light emitting diode OLED. For example, the size / width of the opening 117OP may correspond to the size / width of the emission region. Therefore, the size and / or width of the pixel PX may be based on the size and / or width of the opening 117OP of the corresponding pixel defining layer 117.

[0218] The intermediate layer 220 may include an emission layer 222 formed to correspond to the pixel electrode 210. The emission layer 222 may include a high molecular weight organic material or a low molecular weight organic material that emits light of a corresponding color. Alternatively, the emission layer 222 may include an inorganic emission material or quantum dots.

[0219] In one or more embodiments, the intermediate layer 220 may include a first functional layer 221 and a second functional layer 223 located below and above the emission layer 222, respectively. For example, the first functional layer 221 may include a hole transport layer, or may include a hole transport layer and a hole injection layer. The second functional layer 223 is an element located above the emission layer 222, and may include an electron transport layer and / or an electron injection layer. Similar to the common electrode 230 described later, the first functional layer 221 and / or the second functional layer 223 may be a common layer formed to completely cover the substrate 100. In this case, refer to Figures 1 to 3The first layer described may be a hole transport layer, the second layer may be a hole injection layer, and the third layer may be an emission layer 222. In addition, the fourth layer may be an electron transport layer, the fifth layer may be an electron injection layer, and the sixth-1 layer may be a common electrode. In this case, when the thickness of one layer in one intermediate layer 220 is different from the corresponding (e.g., preset) thickness, the thickness of the corresponding layer may be adjusted, or the thickness of another layer of one intermediate layer 220 may be adjusted. For example, when the thickness of the hole transport layer is less than the corresponding (e.g., preset) thickness, the thickness of the hole transport layer may be adjusted, or the thickness of another layer other than the hole transport layer may be adjusted. For example, the corresponding display substrate may be sent to the first processing part again to deposit more hole transport layers on the display substrate, or, optionally, when forming a hole transport layer on a new display substrate, more hole transport layers may be deposited than before. Optionally, when adjusting the thickness of another layer, as described above with reference to Figures 1 to 3 As described above, the thickness of another layer whose optical characteristics according to the thickness variation are similar to the optical characteristics of the hole transport layer can be adjusted. In this case, the thickness of the other layer can be adjusted according to the sum of the thickness of the hole transport layer and the thickness of the other layer, so that the final optical characteristics of the intermediate layer 220 correspond to the corresponding (e.g., preset) optical characteristics.

[0220] In one or more other embodiments, when the thickness of the hole transport layer is greater than the corresponding (e.g., preset) thickness, the thickness of the hole transport layer may be adjusted, or the thickness of another layer different from the hole transport layer may be adjusted. When adjusting the thickness of the hole transport layer, the thickness of the hole transport layer formed on the new display substrate may be adjusted. In addition, when adjusting the thickness of another layer different from the hole transport layer, as described above with reference to Figures 1 to 3 As described above, the thickness of another layer whose optical characteristics according to the thickness variation are similar to the optical characteristics of the hole transport layer can be adjusted. In this case, the thickness of the other layer can be adjusted according to the sum of the thickness of the hole transport layer and the thickness of the other layer so that the final optical characteristics of the intermediate layer 220 correspond to the corresponding (e.g., preset) optical characteristics.

[0221] The common electrode 230 may be located on the pixel electrode 210 and may overlap with the pixel electrode 210. The common electrode 230 may include a conductive material having a low work function. For example, the common electrode 230 may include a (semi) transparent layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, lithium (Li), Ca or an alloy thereof. Optionally, the common electrode 230 may also include ITO, IZO, ZnO or In on the (semi) transparent layer including the above materials. 2 O 3 The common electrode 230 may be integrally formed to completely cover the substrate 100.

[0222] The encapsulation layer 300 may be located on the display element layer DEL and may cover the display element layer DEL. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer, and in one or more embodiments, Fig.11 The encapsulation layer 300 is shown to include a first inorganic encapsulation layer 310 , an organic encapsulation layer 320 , and a second inorganic encapsulation layer 330 that are sequentially stacked.

[0223] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include one or more inorganic materials selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. x ) can be zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ). The organic encapsulation layer 320 may include a polymer-based material. The polymer-based material may include an acrylic resin, an epoxy resin, PI, and polyethylene. In one or more embodiments, the organic encapsulation layer 320 may include an acrylate. The organic encapsulation layer 320 may be formed by curing a monomer or applying a polymer. The organic encapsulation layer 320 may be transparent.

[0224] In one or more embodiments, the touch sensor layer may be located on the encapsulation layer 300, and the optical function layer may be located on the touch sensor layer. The touch sensor layer may obtain coordinate information based on external input (e.g., a touch event). The optical function layer may reduce the reflectivity of light (external light) incident from the outside to the display device and / or improve the color purity of light emitted from the display device. In one or more embodiments, the optical function layer may include a phase retarder and / or a polarizer. The phase retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be a film type or a liquid crystal coating type. The film-type polarizer may include a stretchable synthetic resin film, and the liquid crystal coating type polarizer may include liquid crystals arranged in a corresponding arrangement. The phase retarder and the polarizer may also include a protective film.

[0225] The adhesive member may be arranged between the touch sensor layer and the optical functional layer. The adhesive member may be any general material known in the art without limitation. The adhesive member may be a pressure sensitive adhesive (PSA) member.

[0226] Fig.12 It is schematically shown Fig.11 sectional view of the organic light emitting diode OLED of the display device 2 in FIG. Fig.13 It is schematically shown Fig.11 sectional view of the organic light emitting diode OLED of the display device 2 in FIG. Fig.14 It is schematically shown Fig.11 sectional view of the organic light emitting diode OLED of the display device 2 in FIG. Fig.15 It is schematically shown Fig.11 sectional view of the organic light emitting diode OLED of the display device 2 in FIG.

[0227] Reference Figures 12 to 15 , the organic light emitting diode OLED may include a single emission layer. However, one or more embodiments are not limited thereto. Figures 12 to 15 As shown in , the organic light emitting diode OLED may have a tandem structure in which a plurality of emission layers are stacked.

[0228] Reference Fig.12 , the organic light emitting diode OLED may include a pixel electrode 210 as an anode electrode, a common electrode 230 as a cathode electrode, and a first emission unit 220-1 and a second emission unit 220-3 as a stacked intermediate layer between the pixel electrode 210 and the common electrode 230. The charge generation layer CGL may be disposed between the first emission unit 220-1 and the second emission unit 220-3 of the organic light emitting diode OLED.

[0229] The first emission unit 220-1 may include a blue emission layer B. A hole injection layer and / or a hole transport layer may be disposed between the pixel electrode 210 and the blue emission layer B. An electron injection layer and / or an electron transport layer may be disposed between the blue emission layer B and the charge generation layer CGL.

[0230] The second emission unit 220 - 3 may include a yellow emission layer Y. A hole injection layer and / or a hole transport layer may be disposed between the charge generation layer CGL and the yellow emission layer Y. An electron injection layer and / or an electron transport layer may be disposed between the yellow emission layer Y and the common electrode 230 .

[0231] The charge generation layer CGL may be disposed between the first emission unit 220 - 1 and the second emission unit 220 - 3 so that charges between the first emission unit 220 - 1 and the second emission unit 220 - 3 are adjusted to achieve charge balance.

[0232] The charge generation layer CGL may be provided by stacking an n-type layer and a p-type layer, the n-type layer being located adjacent to the first emission unit 220-1 to supply electrons thereto, and the p-type layer being located adjacent to the second emission unit 220-3 to supply holes thereto.

[0233] Reference Fig.13The organic light emitting diode OLED may include a pixel electrode 210 as an anode electrode, a common electrode 230 as a cathode electrode, and a first emission unit 220-1, a second emission unit 220-3, and a third emission unit 220-5 stacked between the pixel electrode 210 and the common electrode 230. The charge generation layer CGL may be disposed between the first emission unit 220-1 and the second emission unit 220-3 of the organic light emitting diode OLED and between the second emission unit 220-3 and the third emission unit 220-5 of the organic light emitting diode OLED.

[0234] The first emission unit 220-1 may include a blue emission layer B. The hole injection layer and / or the hole transport layer may be located below the blue emission layer B, and the electron injection layer and / or the electron transport layer may be located above the blue emission layer B. The blue emission layer B may be arranged between the hole injection layer and / or the hole transport layer and the electron injection layer and / or the electron transport layer.

[0235] The second emission unit 220-3 may include a yellow emission layer Y. The hole injection layer and / or the hole transport layer may be located below the yellow emission layer Y, and the electron injection layer and / or the electron transport layer may be located above the yellow emission layer Y. The yellow emission layer Y may be arranged between the hole injection layer and / or the hole transport layer and the electron injection layer and / or the electron transport layer.

[0236] The third emission unit 220-5 may include a blue emission layer B. The hole injection layer and / or the hole transport layer may be located below the blue emission layer B, and the electron injection layer and / or the electron transport layer may be located above the blue emission layer B. The blue emission layer B may be arranged between the hole injection layer and / or the hole transport layer and the electron injection layer and / or the electron transport layer.

[0237] The charge generation layer(s) CGL may be disposed (eg, respectively) between the first emission unit 220-1, the second emission unit 220-3, and the third emission unit 220-5, and may be provided by stacking an n-type layer supplying electrons and a p-type layer supplying holes.

[0238] Reference Fig.14 The organic light emitting diode OLED may include a pixel electrode 210 as an anode electrode, a common electrode 230 as a cathode electrode, and a first emission unit 220-1, a second emission unit 220-3′, and a third emission unit 220-5 stacked between the pixel electrode 210 and the common electrode 230. The charge generation layer CGL may be disposed between the first emission unit 220-1 and the second emission unit 220-3′ of the organic light emitting diode OLED and between the second emission unit 220-3′ and the third emission unit 220-5 of the organic light emitting diode OLED.

[0239] and Fig.14 One or more corresponding embodiments are Fig.13 The second emission unit 220-3' in one or more embodiments may be modified as follows: In addition to the yellow emission layer Y, the second emission unit 220-3' may further include a red emission layer R and / or a green emission layer G.

[0240] exist Fig.14 In the embodiment, the red emission layer R is located below the yellow emission layer Y, and the green emission layer G is located above the yellow emission layer Y. However, one or more embodiments are not limited thereto.

[0241] For example, the red emission layer R is located on both the upper and lower parts of the yellow emission layer Y, or the green emission layer G may be located on both the upper and lower parts of the yellow emission layer Y. Alternatively, the red emission layer R or the green emission layer G may be located on only one of the upper and lower parts of the yellow emission layer Y, and various modifications may be made.

[0242] Figure 12 to Figure 14 The organic light emitting diode OLED in the display area DA may be formed integrally with a plurality of pixels arranged in the display area DA. In this case, the organic light emitting diode OLED may emit white light or blue light. A color filter may be located on the organic light emitting diode OLED, and a color may be realized according to each pixel.

[0243] Reference Fig.15 , the organic light emitting diode OLED may include a red organic light emitting diode OLEDr, a green organic light emitting diode OLEDg, and a blue organic light emitting diode OLEDb that emit light of different colors from each other.

[0244] The red organic light emitting diode OLEDr, the green organic light emitting diode OLEDg, and the blue organic light emitting diode OLEDb may all have a series structure.

[0245] The red organic light emitting diode OLEDr may be provided by sequentially stacking a first pixel electrode 210r, a first emission unit 220-1 including a red emission layer R', a charge generation layer CGL, a second emission unit 220-3 including a red emission layer R and an additional red emission layer R', and a common electrode 230. The first emission unit 220-1 and the second emission unit 220-3 may each include a hole injection layer HTL located below the additional red emission layer R' and an electron injection layer ETL located above the red emission layer R'.

[0246] A green organic light emitting diode OLEDg may be provided by sequentially stacking a second pixel electrode 210g, a first emission unit 220-1 including a green emission layer G, a charge generation layer CGL, a second emission unit 220-3 including a green emission layer G, and a common electrode 230. The first emission unit 220-1 and the second emission unit 220-3 may each include a hole injection layer HTL located below the green emission layer G and an electron injection layer ETL located above the green emission layer G.

[0247] A blue organic light emitting diode OLEDb may be provided by sequentially stacking a third pixel electrode 210b, a first emission unit 220-1 including a blue emission layer B, a charge generation layer CGL, a second emission unit 220-3 including a blue emission layer B, and a common electrode 230. The first emission unit 220-1 and the second emission unit 220-3 may include a hole injection layer HTL located below the blue emission layer B and an electron injection layer ETL located above the blue emission layer B, respectively.

[0248] The hole injection layer HTL, the electron injection layer ETL, and the charge generation layer CGL may be integrally formed across the red organic light emitting diode OLEDr, the green organic light emitting diode OLEDg, and the blue organic light emitting diode OLEDb. In some embodiments, in order to improve leakage current caused by the charge generation layer CGL, a spacer may be disposed between the organic light emitting diodes OLED.

[0249] The thicknesses of the red emission layer R, green emission layer G, and blue emission layer B included in the red organic light emitting diode OLEDr, the green organic light emitting diode OLEDg, and the blue organic light emitting diode OLEDb, respectively, may be different from each other. These may be set in consideration of the thickness of the light resonating according to the wavelength emitted from the emission layer. For example, the thickness of the red emission layer R may be greater than the thickness of the green emission layer G. The thickness of the green emission layer G may be greater than the thickness of the blue emission layer B.

[0250] When the organic light emitting diode OLED has a tandem structure, the organic light emitting diode OLED may have high brightness and a long lifespan.

[0251] As described above, when the organic light emitting diode OLED has a tandem structure, there may be a case where at least two layers have the same material. In this case, at least two layers having the same material may be performed in the same processing section. In this case, the display substrate may be moved in one direction according to the formation of each layer, and then returned in the opposite direction to perform each process. In one or more other embodiments, as many different clusters as the number of layers of the organic light emitting diode OLED may be provided, or each layer may be formed in each cluster.

[0252] In this case, when the thickness of one layer from among the at least two layers is different from the corresponding (e.g., preset) thickness, the thickness of the other layer from among the at least two layers may be adjusted. For example, when the thickness of one layer from among the at least two layers is less than the corresponding (e.g., preset) thickness, the thickness of the other layer from among the at least two layers may be adjusted to be greater than the corresponding (e.g., preset) thickness. In addition, when the thickness of one layer from among the at least two layers is greater than the corresponding (e.g., preset) thickness, the thickness of the other layer from among the at least two layers may be adjusted to be less than the corresponding (e.g., preset) thickness.

[0253] In addition to the above, when the thickness of one layer of the organic light emitting diode OLED is different from the corresponding (e.g., preset) thickness so that the optical properties of the organic light emitting diode OLED correspond to the corresponding (e.g., preset) optical properties, the thickness of another layer of the organic light emitting diode OLED can be adjusted.

[0254] Therefore, in the apparatus and method for manufacturing a display device, a display device realizing a clear image can be manufactured.

[0255] In the apparatus and method for manufacturing a display device according to one or more embodiments, the thickness of a layer may be adjusted in real time by measuring the thickness of the layer.

[0256] In the apparatus and method for manufacturing a display device according to one or more embodiments, a high-resolution display device may be manufactured.

[0257] In the apparatus and method for manufacturing a display device according to one or more embodiments, the thickness of a layer may be measured at an accurate position.

[0258] In the apparatus and method for manufacturing a display device according to one or more embodiments, a measurement error due to curvature of a substrate may be reduced.

[0259] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered as other similar features or aspects that can be used in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and detail can be made in the embodiments without departing from the spirit and scope defined by the appended claims.

Claims

1. An apparatus for manufacturing a display device, wherein: The device comprises: a base portion on which a substrate is placed, the substrate having a dummy layer on the substrate; a support portion on the base portion to support the substrate; a measuring portion facing the base portion and configured to measure a thickness of the dummy layer, The base portion is configured to move linearly so that the measuring portion and the dummy layer are positioned at corresponding positions based on a result of detection by the measuring portion.

2. The device according to claim 1, wherein: The apparatus also includes a drive portion connected to the base portion and configured to linearly move the base portion.

3. The device according to claim 1, wherein: The apparatus further includes a detection portion configured to detect a position of the base portion and a position of the substrate.

4. The device according to claim 3, wherein: The base portion is also configured to linearly move the substrate based on a result of the detection by the detection portion.

5. The device according to claim 1, wherein: The support portions are at respective different heights.

6. The device according to claim 1, wherein: The device further comprises a moving driving portion configured to move the detecting portion or the measuring portion on the moving driving portion.

7. The device according to claim 1, wherein: The device also includes: a processing portion configured to deposit a layer on the substrate; and a path unit connected to the processing part, and the path unit is configured to determine a moving path of the substrate, Wherein, the base portion, the support portion and the measuring portion are arranged in the processing portion or the path unit.

8. The device according to claim 7, wherein: The processing section includes a first processing section and a second processing section, the first processing section and the second processing section are configured to deposit respective layers on the substrate, and Wherein a thickness of the layer on the substrate is configured to be adjusted in the first processing portion or in the second processing portion based on a measurement of the layer on the substrate in the first processing portion.

9. The device according to claim 1, wherein: The apparatus further includes a substrate pressing portion facing the support portion or the base portion and configured to keep at least a portion of the substrate flat.

10. The device according to claim 1, wherein: The measuring portion is also configured to radiate a signal in a direction perpendicular to one surface of the dummy layer.

11. A method for manufacturing a display device, wherein: The method comprises: moving a substrate on the base portion to a position; separating the substrate from the support portion; moving the support portion to an initial position; placing the substrate on the support portion; moving the substrate to the position; and The supporting portion is moved so that the dummy layer on the substrate corresponds to the dummy position.

12. The method according to claim 11, wherein: The method also includes detecting the position of the substrate and the position of the base portion.

13. The method according to claim 11, wherein: The method also includes measuring a thickness of the dummy layer.

14. The method according to claim 13, wherein: The thickness of the dummy layer is measured during the conveyance of the substrate.

15. The method according to claim 13, wherein: The thickness of the dummy layer is measured at a space of the substrate having the same layer as the dummy layer.

16. The method according to claim 11, wherein: The method also includes measuring a position of the dummy layer.

17. The method according to claim 16, wherein: The method also includes comparing the position of the dummy layer to the dummy position.

18. The method according to claim 11, wherein: The method also includes supporting different portions of the substrate at respective different heights.

19. The method according to claim 11, wherein: The method also includes maintaining the substrate flat.

20. The method according to claim 11, wherein: The method also includes maintaining a portion of the substrate flat by applying pressure to an end portion of the substrate adjacent to the dummy layer, the dummy layer being at the portion of the substrate.

Images