Lamp driver with antenna module

Abstract

A light fixture driver having an antenna module that includes a multi-layer printed circuit board (PCB). The multi-layer PCB includes conductive layers forming an antenna, at least one insulating layer located between the conductive layers, and an electrical connection to the antenna. Further, a top protective layer is provided over the conductive layer of the antenna and a bottom protective layer is provided under the conductive layer of the antenna, where the top protective layer, the bottom protective layer and the at least one insulating layer are made of a dielectric composite material.

Description

Technical Field

[0001] The present invention relates to a PCB design for providing an antenna module. In particular, the present invention relates to a PCB design for an antenna used in communicating signals to (and optionally from) a lamp driver. Background Art

[0002] Some designs of drivers for lamps are provided with a metal housing, such as a metal linear driver housing. If an antenna is to be used to pass received wireless signals to the driver (to control the light source of the lamp), the metal housing will shield the wireless signals if the antenna is located inside the metal housing. As a result, the antenna can only be placed outside the metal housing. However, since the antenna is considered a live component, it is not possible to expose the bare printed circuit board (PCB) of the antenna.

[0003] It is known to provide an antenna, such as a Near Field Communication (NFC) antenna, as a separate module outside a metal housing, and the antenna has its own plastic cover. The plastic cover allows the antenna to meet communication requirements and approval requirements.

[0004] Figure 1 The antenna is shown covered by a plastic cover 106. The antenna comprises a printed circuit board formed of conductive layers 102 placed between insulating layers 104. If the antenna were not covered by the plastic cover 106, the top and bottom conductive layers 102 would be exposed to the environment.

[0005] However, adding a plastic cover increases the number of manufacturing steps and increases the overall cost of the LED driver.

[0006] Other options include using plastic housings, such as those used in radio frequency identification (RFID) antennas. Figure 2 The RFID antenna is shown covered by a plastic shell 206. The conductive layer 202 of the RFID antenna is placed between insulating layers 204. Similar to the previous example using a plastic cover, if the antenna was not covered by the plastic shell 206, the top and bottom conductive layers 202 would be exposed to the environment.

[0007] However, adding a plastic housing also increases the number of manufacturing steps and increases the overall cost of the LED driver. Therefore, there is a need for improved antenna design.

[0008] CN 204834882U discloses a chip-type NFC antenna.

[0009] US20160205752A1 discloses a lighting device including a communication module, wherein the communication module includes an antenna device.

[0010] EP 3576499A1 discloses a light driving device including a housing and a driving unit. Summary of the invention

[0011] The present invention is defined by the claims.

[0012] According to an example of one aspect of the present invention, there is provided an antenna module, including a multi-layer printed circuit board PCB, wherein the multi-layer PCB includes:

[0013] forming a conductive layer of an antenna;

[0014] at least one insulating layer located between the conductive layers;

[0015] a top protective layer located above the conductive layer of the antenna;

[0016] a bottom protective layer located below the conductive layer of the antenna; and

[0017] Electrical connections to the antenna,

[0018] The top protective layer, the bottom protective layer and at least one insulating layer are made of a dielectric composite material, and the top protective layer and the bottom protective layer are used to be exposed to the surrounding environment around the antenna module.

[0019] The top and bottom protective layers serve to protect the antenna. In particular, the top and bottom layers serve to electrically insulate the traces of the antenna and protect them from the environment to which the top and bottom layers are exposed.

[0020] Typically, the wireless antenna is protected by a plastic cover (or a cover formed of other non-metallic materials). However, this solution not only increases the cost of the wireless antenna, but also adds additional manufacturing steps.

[0021] Forming the protective layer directly as part of the multi-layer PCB of the antenna module can reduce the overall cost and improve manufacturing efficiency while ensuring the normal function of the antenna. The top and bottom protective layers can be used to protect the conductive layer from environmental influences (e.g., moisture, dust, etc.).

[0022] By designing the top and bottom layers to be exposed to the surrounding environment, the antenna module is not intended to be positioned within the device housing or within its own housing, but rather the antenna module is intended to be positioned outside the device housing and exposed to the surrounding environment around the device containing the antenna module. In this way, the cost of a cover for the antenna module is avoided, and attenuation of the RF signal is prevented. The edges of the multi-layer PCB of the antenna module are also exposed to the surrounding environment.

[0023] The top protective layer preferably completely covers the top conductive layer of the antenna. Similarly, the bottom protective layer preferably completely covers the bottom conductive layer of the antenna.

[0024] Dual-layer wireless antenna designs and quad-layer wireless antenna designs are well known to those skilled in the art. They are formed by two or more conductive layers of a multi-layer PCB separated by an insulating layer. Wireless signals received or transmitted by the antenna can pass through the top and bottom protective layers.

[0025] The thickness of both the top protection layer and the bottom protection layer is, for example, greater than 0.05 mm, so they are structural PCB layers (eg, prepreg layers) rather than, for example, solder mask layers.

[0026] The use of dielectric composite materials as both the insulating layer and the protective layer improves manufacturing efficiency because the addition of the protective layer can be accomplished in the same manner as the addition of the insulating layer (ie, using conventional multi-layer PCB manufacturing methods).

[0027] Dielectric composites are electrically insulating and typically consist of a woven or non-woven material such as fiberglass or paper with a resin. The resin may be fully cured in the core / laminate layers or only partially cured in the prepreg layers.

[0028] The multi-layer PCB may include an antenna portion defining at least a portion of the antenna and a hidden portion defining the electrical connector.

[0029] The antenna section of the PCB is intended to be exposed to the environment. This can be achieved by adding top and bottom protective layers. Traditionally, the outer conductive layers of the PCB are only covered by a thin solder mask layer, which does not provide adequate protection for the conductive layers. The protective layer means that no conductive layer is exposed in the antenna section.

[0030] The hidden part is intended to be used as a connector, and therefore, when the antenna module is in use, the electrical connections in the hidden part are not exposed to the external environment. For example, the hidden part is shielded or covered by the main PCB of the lamp driver.

[0031] The exposed vias between the conductive layers can be positioned at the hidden portion. This enables the vias to be hidden when the antenna module is connected to, for example, an LED driver. The multilayer PCB includes vias between the conductive layers to electrically connect the different conductive layers as needed.

[0032] The electrical connector may include a set (eg, two) of exposed conductive pads.

[0033] The top protective layer, the bottom protective layer and the at least one insulating layer may be made of the same material.

[0034] Both the top and bottom protective layers can be prepreg layers. Prepreg layers are made of insulating materials that are commonly used as insulating layers between conductive traces in PCB manufacturing. These materials can also act as protective layers for the conductive components of the antenna, which allows the wireless antenna to still function as intended. These layers are formed as part of PCB manufacturing.

[0035] The four conductive layers may form an antenna. The antenna may be a near field communication NFC antenna. The antenna module may further include a structural support portion for providing mounting for the antenna module.

[0036] The present invention also provides a lamp driver comprising a power supply for powering one or more light sources, a metal housing containing the power supply, an antenna module as defined above located outside the metal housing, and a driver electrical connector between the antenna of the antenna module and the power supply.

[0037] This allows the power supply to be covered by a metal housing while still communicating wirelessly with the wireless antenna.

[0038] In particular, conventional PCB materials may be used for the antenna module without any further protection, as the top and bottom protection layers provide the necessary protection, eg for indoor use.

[0039] For example, the lamp driver is a linear LED driver.

[0040] The metal housing may include a metal chassis and a metal cover, and the power supply is mounted on the metal chassis.

[0041] The present invention also provides a lamp comprising the lamp driver defined above and one or more light sources powered by a power supply of the lamp driver.

[0042] The antenna portion of the antenna module of the lamp driver is exposed to the surrounding environment around the lamp, so no protective cover is provided on the antenna portion.

[0043] These and other aspects of the invention will be apparent from and elucidated with reference to the embodiments described hereinafter. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] For a better understanding of the invention, and in order to more clearly illustrate how the invention may be carried into effect, reference will now be made, by way of example only, to the accompanying drawings, in which:

[0045] Figure 1 A prior art antenna is shown covered by a plastic cover;

[0046] Figure 2 A prior art RFID antenna is shown covered by a plastic shell;

[0047] Figure 3 illustrates a first example cross section of a PCB layer in an antenna module;

[0048] Figure 4 illustrates an example top view of an antenna module;

[0049] Figure 5 illustrates a second example cross section of a PCB layer in an antenna module;

[0050] Figure 6 The diagram shows an antenna connected to an external PCB assembly;

[0051] Figure 7 The diagram shows the antenna and Figure 6 Electrical connections between external PCB components;

[0052] Figure 8 A linear actuator housing having a metal housing is illustrated;

[0053] Fig. 9 Pictured Figure 8 A close-up of the antenna;

[0054] Fig.10 Pictured Figure 8 a side view of a linear actuator housing; and

[0055] Fig.11 Pictured Fig.10 Close-up of the antenna. DETAILED DESCRIPTION

[0056] The present invention will be described with reference to the accompanying drawings.

[0057] It should be understood that although the detailed description and specific examples indicate exemplary embodiments of the apparatus, system, and method, they are intended for illustrative purposes only and are not intended to limit the scope of the invention. These and other features, aspects, and advantages of the apparatus, system, and method of the present invention will be better understood from the following description, the appended claims, and the accompanying drawings. It should be understood that the drawings are only schematic diagrams and are not drawn to scale. It should also be understood that the same reference numerals are used throughout the drawings to indicate the same or similar parts.

[0058] The present invention provides an antenna module, comprising a multi-layer printed circuit board (PCB). The multi-layer PCB comprises conductive layers forming an antenna, at least one insulating layer between the conductive layers, and an electrical connection to the antenna. In addition, a top protective layer is provided above the conductive layer of the antenna, and a bottom protective layer is provided below the conductive layer of the antenna, wherein the top protective layer, the bottom protective layer, and the at least one insulating layer are made of a dielectric composite material.

[0059] Figure 3A first example cross section of PCB layers in an antenna module is shown. The antenna module is formed by four conductive layers 302, three insulating layers 304 placed between the conductive layers 302, a top protective layer 306, and a bottom protective layer 308. The conductive layers 302 are connected using vias and through-holes passing through the insulating layers 304 to form the NFC antenna. Note that Figure 3 It is intended to show the order of the layers. In reality, the conductive layers may not be exposed at the edges of the antenna.

[0060] As shown, the antenna module has an antenna portion 301 and a hidden portion 303, which are separated by a line 312 (this is for illustration purposes only). When the antenna module is in use, the antenna portion 301 is intended to be exposed to the environment, while the hidden portion 303 is intended to be connected to another PCB (e.g., an LED driver) so that the antenna module is electrically connected to the other PCB, while the hidden portion 303 (where there is an electrical connection between the PCBs) is not exposed to the outside.

[0061] In the example shown, the hidden portion 303 includes an electrical connector 310 that is exposed to enable connection to another PCB. Once connected to another PCB, the electrical connector is no longer exposed to the outside in the surrounding environment.

[0062] The electrical connector 310 may be placed above the top protective layer 306 and below the bottom protective layer 308. When the antenna module is connected to another PCB, the exposed electrical connector 310 will no longer be exposed to the environment. Alternatively, the protective layers 304 and 306 may be removed in the hidden portion 303 to expose the top and bottom conductive layers 302.

[0063] Of course, only a single conductive layer 302 above or below protective layers 304 and 306 may be exposed, rather than exposing both top and bottom conductive layers 302. Any suitable connector may be used between the other PCB and the antenna PCB, which ensures that no electrical contact pads are exposed to the surrounding environment.

[0064] The protective layers 306 and 308 are used to protect the conductive layer 302 in the antenna portion 301. The protective layers 306 and 308 can be made of the same dielectric composite material as the insulating layer 304. Therefore, the protective layers 306 and 308 can be prepreg layers and / or core layers conventionally used in PCBs. This enables the protective layers 306 and 308 to be added using existing processes in multi-layer PCB manufacturing, thereby simplifying the manufacturing process.

[0065] Many different dielectric composite materials can be selected to provide different insulation values ​​depending on the requirements of the PCB. Well-known prepreg materials used in the PCB industry include FR-2 (phenolic cotton paper), FR-3 (cotton paper and epoxy resin), FR-4 (glass cloth and epoxy resin), FR-5 (glass cloth and epoxy resin), FR-6 (matte glass and polyester), G-10 (glass cloth and epoxy resin), CEM-1 (cotton paper and epoxy resin), CEM-2 (cotton paper and epoxy resin), CEM-3 (non-woven glass and epoxy resin), CEM-4 (glass cloth and epoxy resin) and CEM-5 (glass cloth and polyester).

[0066] One or more of these dielectric compositions may be used for insulating layer 304 and protective layers 306 and 308. Of course, other dielectric compositions may be used, depending on, for example, desired thickness, desired dielectric constant, and / or desired thermal expansion.

[0067] In an example, FR-4 prepreg layers are used for protective layers 306 and 308. Insulating layer 304 may include one or more copper clad cores (also referred to as copper clad laminates) and one or more FR-4 prepreg layers. FR-4 grade materials are widely used for their flame retardant and self-extinguishing properties. However, the exact material and resin percentage selected may depend on the desired dielectric constant and / or layer thickness.

[0068] Conductive layer 302 is usually made of copper with a thickness of about 1 oz or 2 oz. Of course, other conductive materials and thicknesses may also be used.

[0069] In conclusion, Figure 3 A six-layer PCB design for an NFC antenna is shown (ie, six conductive layers in total), where four of the conductive layers 302 form the antenna, and the top and bottom conductive layers (layers 310 ) are only exposed in a hidden portion 303 of the six-layer PCB.

[0070] Figure 4 An example top view of an antenna module is shown. Figure 4 4 shows that a portion of the antenna 408 is exposed in the antenna portion 402 of the antenna module. Line 403 represents the boundary between the antenna portion 402 and the hidden portion 404. The hidden portion 404 includes two pads 410 and 412 (located on the same side of the antenna PCB in this example), which enables the antenna 408 to be electrically connected to a different PCB. The vias 414 used to connect the conductive layers in the antenna module PCB are all located at the hidden portion 404, so that they are hidden when the antenna module is connected to a different PCB.

[0071] The antenna module also includes a structural support portion 406 that provides mounting support for the antenna module. The structural support portion 406 helps the antenna module remain mounted to a different PCB when it is connected to another PCB (eg, during manufacturing).

[0072] The other PCB may be a PCB assembly (PCB A) of a lamp driver (eg, LED driver). Thus, the antenna module may be mounted on PCB A of the LED driver to enable wireless NFC functionality.

[0073] The antenna module may be mounted with an antenna parallel (e.g., horizontally) to the LED driver PCB A, or it may be mounted with a vertical antenna. For example, there may be a 90 degree angle between the plane of the LED driver PCB A and the plane of the antenna module PCB. For example, the LED driver may be mounted horizontally, and the antenna module may be mounted vertically, so that the radiation pattern extends around the horizontal plane.

[0074] Figure 5 A second example cross section of PCB layers in an antenna module is shown. Conductive layer 302 is separated by insulating layer 304. Protective layers 306 and 308 are used to protect conductive layer 302 from the environment and to protect a user from the conductive layer. In this example, sides 502 and 504 of the PCB are shown as being covered by insulating layer 304 and protective layers 306 and 308. Thus, the conductive layers at the sides of the PCB and the top and bottom surfaces are also protected from the environment.

[0075] Figure 6 An antenna 604 is shown connected to an external PCB assembly (PCBA) 602. The antenna 604 is mounted perpendicular to the PCBA 602. The antenna portion 402 of the antenna is exposed to the environment, while the hidden portion 404 is buried within and beneath the PCBA 602.

[0076] Figure 7 The antenna 604 is shown with Figure 6 Solder 702 is used to provide an electrical connection between the antenna 604 and the PCBA 602, and the antenna 604 is connected to the conductive layer using vias 704.

[0077] Figure 8 A linear housing drive having a metal housing is shown. Fig. 9 Shows Figure 8 Close-up of the antenna.

[0078] The linear housing drive has a PCBA 802 with a power supply mounted on it. The PCBA 802 is mounted on a metal chassis 806 of the metal housing and is covered by a metal cover 808 of the metal housing. A portion of the PCBA 802 is located outside the metal housing. This enables the antenna module 804 to be connected to the PCBA 802 and still provide a wireless NFC connection.

[0079] Antenna module 804 cannot be mounted within a metal housing because this would prevent the antenna from wirelessly communicating with other antenna modules outside the metal housing.

[0080] Typically, the presence of an external conductive layer in the antenna module 804 means that live components are exposed on the PCB of the antenna module. As such, the antenna module 804 requires some protection. Conventionally, a plastic cover is used to cover the antenna module 804. However, this increases manufacturing time and cost.

[0081] Add the protection layer discussed earlier ( Figure 3 The layers 306 and 308 in FIG. 8A and 8B) enable the bare antenna module PCB to be connected to the PCBA 802 of the lamp driver without the need for an additional protective cover.

[0082] The hidden portion of the antenna module 804 can be located under the PCBA 802 of the lamp driver, or it can be inserted into a slot of the PCBA 802. Then, an electrical connection is provided between the power supply on the PCBA 802 and the antenna module 804.

[0083] For example, Figure 4 As shown in , the electrical connector ( Figure 3 The layer 310 in the antenna module 804 and any exposed vias on the antenna module 804 are placed at the hidden portion 404 of the antenna module 804.

[0084] like Fig. 9 As shown in FIG. 1 , the hidden portion of the antenna is received through a slot in the main PCB A. The structural support portion 406 is also received in a corresponding slot in the main PCB A.

[0085] Therefore, the hidden part is inserted through the receiving slot of PCBA 802 so that the electrical connectors that need to be connected to PCBA 802 are located on the lower side of PCBA.

[0086] For example, the electrical connections between the antenna PCB and the main PCB A include connection pins (of a connector pin block) on one of the PCBs and connection sockets (of a connector socket block) on the other PCB. Any alternative suitable connection type may be used between the contacts of the antenna module and the contacts of the main PCB, such as solder connections or leaded connections or any suitable electrical connector or mechanical and electrical connectors.

[0087] In all cases, the electrical connections between the antenna module and PCB A are not exposed. The structural support portion 406 of the antenna module 804 is used to hold the antenna module in place during the manufacturing process. The antenna portion 402 (not obstructed by metal components) provides a wireless connection.

[0088] Fig.10 Shows Figure 8 Side view of the linear housing actuator. Fig.11 Shows Fig.10 A close-up of the antenna with a portion of the chassis 806 cut away. The PCBA 802 can be mounted on the metal chassis 806, and the metal cover 808 covers the driver to form a linear driver housing. The metal cover 808 covers the power supply on the PCBA 802.

[0089] It can be seen that the antenna module 804 is visible from the side of the linear housing actuator and is not covered by metal. Therefore, the antenna module 804 can interact with other external antenna modules (e.g., a mobile phone with an NFC antenna) to control the power supply of the linear housing actuator. In particular, the antenna portion 402 of the antenna module 804 is not covered by metal parts. The hidden portion 404 is inserted into a slot in the PCBA 802 and protrudes from the bottom of the PCBA. However, this part of the actuator is shielded by the chassis and is therefore inherently protected from environmental influences.

[0090] When the antenna module is mounted on the PCBA 802 , the structural portion 406 provides support for the antenna module.

[0091] In the example shown, the antenna module is perpendicular to the main PCB, for example, the main PCB is parallel to the bottom of the housing (i.e., the chassis portion), and the antenna PCB stands perpendicular to the bottom of the housing. For example, the housing is horizontal and the antenna is vertical. However, the main PCB and the antenna PCB can extend in parallel planes, for example, the main PCB overlaps the antenna PCB in the hidden portion area of ​​the antenna PCB.

[0092] For example, the antenna module 804 is used as a part of an indoor lamp. No additional housing is required outside the antenna module.

[0093] Those skilled in the art can understand and implement variations to the disclosed embodiments when practicing the claimed invention by studying the drawings, the disclosure and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality.

[0094] The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

[0095] If the term "suitable for" is used in the claims or description, it should be noted that the term "suitable for" is intended to be equivalent to the term "configured to". If the term "arranged" is used in the claims or description, it should be noted that the term "arranged" is intended to be equivalent to the term "system" and vice versa.

[0096] Any reference signs in the claims should not be construed as limiting the scope.

Claims

1. A lamp driver, comprising: a power supply for supplying power to one or more light sources; a metal housing, containing the power supply; An antenna module (804) is located outside the metal housing; as well as a driver electrical connector, located between the antenna of the antenna module and the power supply; The antenna module comprises a multi-layer printed circuit board, i.e., a multi-layer PCB, wherein the multi-layer PCB comprises: A conductive layer (302) forming an antenna (408); at least one insulating layer (304) located between the conductive layers; a top protective layer (306) located above the conductive layer of the antenna; a bottom protection layer (308) located below the conductive layer of the antenna; and an electrical connection (310) to the antenna, The top protective layer (306), the bottom protective layer (308) and the at least one insulating layer are made of a dielectric composite material, and the top protective layer and the bottom protective layer are used to be exposed to the surrounding environment around the antenna module.

2. The lamp driver according to claim 1, wherein the multilayer PCB comprises an antenna portion (301, 402) defining at least a portion of the antenna and a hidden portion (303, 404) defining the electrical connection (310).

3. The lamp driver of claim 2, wherein the exposed vias (414) between the conductive layers are positioned at the hidden portions.

4. The lamp driver according to any one of claims 1 to 3, wherein the electrical connection (310) comprises a set of exposed conductive pads (410, 412).

5. The lamp driver according to any one of claims 1 to 4, wherein the top protective layer (306), the bottom protective layer (308) and the at least one insulating layer are made of the same material. 6 . The lamp driver according to claim 1 , wherein both the top protective layer and the bottom protective layer are prepreg layers.

7. A lamp driver according to any one of claims 1 to 6, comprising four conductive layers forming the antenna. 8 . The lamp driver according to claim 1 , wherein the antenna is a near field communication (NFC) antenna.

9. The lamp driver according to any one of claims 1 to 8, further comprising a structural support portion (406) for providing mounting for the antenna module.

10. The lamp driver according to claim 1, wherein the metal housing comprises a metal chassis (306) and a metal cover (308), the power supply being mounted on the metal chassis.

11. A lamp, comprising: The lamp driver according to any one of claims 1 to 10; as well as One or more light sources are powered by the power supply of the lamp driver.

12. The lamp of claim 11, wherein an antenna portion of the antenna module of the lamp driver is exposed to an ambient environment around the lamp.

13. An antenna module suitable for a lamp driver according to any one of claims 1 to 10, the antenna module comprising a multi-layer printed circuit board PCB, i.e. a multi-layer PCB, wherein the multi-layer PCB comprises: A conductive layer (302) forming an antenna (408); at least one insulating layer (304) located between the conductive layers; a top protective layer (306) located above the conductive layer of the antenna; a bottom protection layer (308) located below the conductive layer of the antenna; and an electrical connection (310) to the antenna, wherein the top protective layer (306), the bottom protective layer (308) and the at least one insulating layer are made of a dielectric composite material, and the top protective layer and the bottom protective layer are used to be exposed to the surrounding environment around the antenna module; wherein the multilayer PCB comprises an antenna portion (301, 402) defining at least a portion of the antenna and a hidden portion (303, 404) defining the electrical connector (310); Wherein an exposed via (414) located between the conductive layers is positioned at the hidden portion.

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