Component mounting device

Abstract

A component mounting device is provided with: a component recognition unit that recognizes the position of a component; an inspection unit that inspects whether or not a component can be mounted on the substrate mounting point; a first control unit that controls the operation of the component recognition unit and the inspection unit; and a second control unit that executes a pickup setting process that specifies which of the plurality of heads to pick up for each of the plurality of elements and that specifies the order of pickup of the plurality of elements by the plurality of heads. The first control unit performs, in parallel, position recognition of the component by the component recognition unit and inspection of the availability of mounting by the inspection unit. The second control unit executes the pick-up setting process on the basis of the results of the position recognition of the component and the inspection of whether or not the mounting is possible, which are executed in parallel.

Description

Technical Field

[0001] The present invention relates to a component mounting device which uses a plurality of heads to pick up components arranged in a matrix and mounts the components on a substrate. Background Art

[0002] A component loading device is known that picks up components arranged in a matrix, such as bare chips of a diced wafer or tray components stored in a tray, and mounts them on a substrate (e.g., Patent Document 1). In the component loading device, the following actions are repeatedly performed: components loaded into a component arrangement area in the machine are photographed with a camera to identify the components, and then the components are picked up respectively with a plurality of heads of a head unit capable of XY movement, and the head unit is moved to load the components onto the substrate. Before loading the components onto the substrate, an inspection process is performed to determine whether the components can be loaded onto a predetermined loading point on the substrate.

[0003] In the past, the inspection process was performed, and the component recognition process was performed after the non-mountable mounting points that cannot be mounted with components were identified. Furthermore, after the results of these processes were obtained, the following picking settings were performed: the allocation of which of the multiple heads is used to pick up each of the multiple components in one picking action and the order of picking were determined.

[0004] In the above-mentioned prior art, the process of component recognition and pickup setting is executed after the loading point is inspected. Therefore, there is a time waiting for the inspection process to be executed, which may deteriorate the tact time.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent No. 6709900 Summary of the invention

[0008] Problems to be solved by the invention

[0009] An object of the present invention is to improve the tact time in a component mounting device that picks up components arranged in a matrix using a plurality of heads and mounts the components on a substrate.

[0010] A component mounting device according to one aspect of the present invention comprises: a component supply section having a component arrangement area in which a plurality of components arranged in a matrix are arranged; a component recognition section having a camera and a processing section, wherein the camera photographs the components in the component arrangement area, and the processing section recognizes the position of the components in the component arrangement area based on the image obtained by the camera; a head unit capable of moving between a component mounting area in which a substrate for mounting the components is arranged and the component arrangement area, and having a plurality of heads for picking up the components in the component arrangement area and mounting the components on the substrate in the component mounting area; an inspection section for inspecting whether the components can be mounted on a predetermined mounting point on the substrate arranged in the component mounting area; a first control section for controlling the operation of the component recognition section and the inspection section; and a second control section for performing the following picking setting processing: determining the allocation of which of the plurality of heads is to be picked up for each of the plurality of components and the order in which the plurality of heads pick up the plurality of components. The first control section performs the position recognition of the components by the component recognition section and the inspection of the mounting possibility by the inspection section in parallel. The second control unit executes the pickup setting process based on the results of the position recognition of the component and the inspection of the mounting availability which are executed in parallel. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a plan view showing the overall structure of a component mounting device according to an embodiment of the present invention.

[0012] Figure 2 It is a schematic perspective view showing the head unit and the lift unit.

[0013] Figure 3A This is a top view of the wafer after dicing.

[0014] Figure 3B This is a diagram showing an example of a wafer map.

[0015] Figure 4 This is a schematic diagram showing a component mounting state in which components are mounted on a multi-piece substrate by a head unit.

[0016] Figure 5 This is a block diagram showing a control structure of the above-mentioned component mounting device.

[0017] Figure 6 It is a flowchart showing the component mounting operation according to the comparative example.

[0018] Figure 7 This is a flowchart showing the component mounting operation according to the embodiment.

[0019] Figure 8This is a diagram used to illustrate the picking settings including the allocation of bare chips and suction heads on wafers, and the allocation of bare chips and mounting points on substrates.

[0020] Fig. 9 It is a diagram for explaining the change of the above-mentioned pickup setting when a loading point NG occurs.

[0021] Fig.10 This is a diagram showing an example of changing the pickup setting when the mounting priority mode is selected in which a bare chip is picked up by a head adjacent to a head assigned to a mounting point NG.

[0022] Fig.11A This is a diagram showing the component mounting operation based on the mounting priority mode.

[0023] Fig. 11B This is a diagram showing the component mounting operation based on the mounting priority mode.

[0024] Fig. 11C This is a diagram showing the component mounting operation based on the mounting priority mode.

[0025] Fig.12 This is a diagram showing an example of changing the pickup setting when the pickup priority mode for picking up a bare chip with the head assigned to the mounting point NG is selected.

[0026] Fig.13A This is a diagram showing the component loading operation based on the pickup priority mode.

[0027] Fig. 13B This is a diagram showing the component loading operation based on the pickup priority mode.

[0028] Fig. 13C This is a diagram showing the component loading operation based on the pickup priority mode.

[0029] Fig.14 This is a schematic diagram showing the relationship between the head pitch and the bare chip pitch or the component mounting point pitch, and the relationship between the head movement amount.

[0030] Fig.15 It is a diagram in a tabular form showing a calculation formula of the head movement amount in each mode when the pickup priority mode is selected.

[0031] Fig.16 It is a diagram in a tabular form showing a calculation formula for the head movement amount in each mode when the above-mentioned mounting priority mode is selected. DETAILED DESCRIPTION

[0032] The embodiment of the present invention is described in detail below based on the accompanying drawings. The component loading device involved in the present invention is a device that picks up a plurality of components arranged in a matrix, such as bare chips cut from a wafer, electronic components neatly arranged on a tray or pallet for accommodating components, by means of adsorption or the like, and loads them on a substrate. The component loading device in the case where the above-mentioned component is a bare chip of a wafer is described below.

[0033] [Description of component mounting device]

[0034] Figure 1 1 is a plan view showing the overall structure of a component mounting device 1 according to an embodiment of the present invention. The component mounting device 1 mounts a bare chip 7a (component) cut from a wafer 7 on a substrate P. The component mounting device 1 includes a base 2, a conveyor 3, a head unit 4, a component supply section 5 (component arrangement area), a wafer supply device 6, a camera unit 32U, and a lift unit 40. Figure 2 To represent the head unit 4 and Figure 1 A schematic perspective view of the lift unit 40 which is not exposed in FIG.

[0035] The base 2 is a mounting base for various devices provided in the component mounting device 1. The conveyor 3 is a conveying line for the substrate P provided on the base 2 in a manner extending in the X direction. The conveyor 3 carries the substrate P from outside the machine to a predetermined working position, and carries the substrate P out of the machine from the working position after the component mounting operation. The conveyor 3 has a clamping mechanism (not shown) for holding the substrate P at the working position. It should be noted that Figure 1 The position of the substrate P shown in FIG. 1 is the above-mentioned working position. In the present embodiment, the above-mentioned working position is a component mounting area where a substrate on which components are mounted is arranged. The component supply unit 5 supplies a plurality of bare chips 7a cut from a wafer 7 in a matrix arrangement.

[0036] The head unit 4 picks up the bare chip 7a in the component supply section 5, moves to the above-mentioned working position, and mounts the bare chip 7a on the substrate P. The head unit 4 includes a plurality of heads 4H, which adsorb and hold the bare chip 7a during the above-mentioned picking up, and release the held bare chip 7a during the above-mentioned mounting. The head 4H can move forward and backward (up and down) in the Z direction relative to the head unit 4 and rotate around the axis.

[0037] The head unit 4 is equipped with a substrate recognition camera 31 and a laser height measuring device 4R (a part of the inspection unit) for photographing the substrate P. The Fid (reference) marks FM1, FM2, and the defective mark 66 ( Figure 4). By identifying the Fid mark FM, the positional deviation of the substrate P is identified, and the positional deviation is corrected when the component is mounted. In addition, by identifying the defective product mark 66, it is possible to check whether the component can be mounted at the mounting point predetermined as the component mounting position. The laser height measuring device 4R is a device that uses laser to measure distance, and is a measuring device for checking whether there is a foreign object at the mounting point.

[0038] The component loading device 1 is provided with a first driving mechanism D1, which can move the head unit 4 in the horizontal direction (X and Y directions) at least in the upper space between the component supply part 5 and the substrate P maintained at the above-mentioned working position. The first driving mechanism D1 is provided with a pair of Y-axis fixed rails 13, a first Y-axis servo motor 14 and a ball screw shaft 15 on the +X side and the X side as a moving mechanism in the Y direction of the head unit 4. A pair of Y-axis fixed rails 13 are fixed on the base 2 and extend in the Y direction at a predetermined interval and parallel to each other in the X direction. The ball screw shaft 15 is configured to extend in the Y direction at a position close to the Y-axis fixed rails 13. The first Y-axis servo motor 14 drives the ball screw shaft 15 to rotate. A support frame 16 for supporting the head unit 4 is set between the pair of Y-axis fixed rails 13. Nuts 17 threaded with each ball screw shaft 15 are assembled at the +X side end and the X side end of the support frame 16.

[0039] The first drive mechanism D1 includes a guide member (not shown) mounted on the support frame 16, a first X-axis servo motor 18, and a ball screw shaft 19 as a moving mechanism for the head unit 4 in the X direction. The guide member is a member that guides the movement of the head unit 4 in the X direction, and is fixed to the +Y side of the support frame 16 in a manner extending in the X direction. The ball screw shaft 19 is close to the guide member and is arranged to extend in the X direction. The first X-axis servo motor 18 drives the ball screw shaft 19 to rotate. A nut (not shown) is attached to the head unit 4, and the nut is screwed with the ball screw shaft 19.

[0040] According to the first drive mechanism D1 having the above structure, the first Y-axis servo motor 14 operates to rotate the ball screw shaft 15, thereby the head unit 4 moves in the Y direction together with the support frame 16. In addition, the first X-axis servo motor 18 operates to rotate the ball screw shaft 19, thereby the head unit 4 moves relative to the support frame 16 in the X direction.

[0041] The component supply section 5 is provided with a wafer supply device 6, which supplies a plurality of bare chips 7a in the form of wafers 7 to a predetermined component removal operation position (wafer stage 10). Wafer 7 is a disc-shaped semiconductor wafer on which a circuit pattern and the like have been formed. The wafer supply device 6 includes a wafer holding frame 8 for holding a wafer sheet 8a. A collection of a large number of bare chips 7a, 7a, etc. formed by cutting the wafer 7 into a checkerboard pattern is attached to the wafer sheet 8a. The wafer supply device 6 supplies the bare chips 7a to the above-mentioned component removal operation position by replacing the wafer holding frame 8.

[0042] The wafer supply device 6 includes a wafer storage elevator 9, a wafer stage 10 and a wafer conveyor 11. The wafer storage elevator 9 stores the wafer pieces 8a attached with the wafer 7 in multiple layers up and down while being held in the wafer holding frame 8. The wafer stage 10 is set on the base 2 at the position on the -Y side of the wafer storage elevator 9. Relative to the above-mentioned working position which becomes the stop position of the substrate P, the wafer stage 10 is arranged in a position side by side on the +Y side. In the present embodiment, the wafer stage 108 which becomes the area where the cut wafer 7 is arranged on the base 2 becomes the component arrangement area. The wafer conveyor 11 pulls the wafer holding frame 8 from the wafer storage elevator 9 to the wafer stage 10.

[0043] The camera unit 32U is a unit that can move in the X direction and the Y direction, and is equipped with a wafer camera 32 (camera / component recognition unit). The wafer camera 32 photographs a portion of the wafer 7 positioned on the wafer stage 10, that is, a bare chip 7a within the camera field of view in the component configuration area. Based on the captured image, the position of the bare chip 7a to be picked up is identified. The component mounting device 1 is equipped with a second drive mechanism D2 that can move the camera unit 32U in the horizontal direction (X and Y directions) at least in the upper space between the component supply part 5 and the specified standby position. The second drive mechanism D2 is a drive system that is independent of the first drive mechanism D1 that drives the head unit 4. It should be noted that in the present embodiment, the above-mentioned standby position is a position separated from the wafer stage 10 to the +Y side.

[0044] The second drive mechanism D2 has a pair of Y-axis fixed rails 33 on the +X side and the X side, a second Y-axis servo motor 34 arranged on the +X side, and a ball screw shaft 35 as a moving mechanism in the Y direction of the camera unit 32U. A pair of Y-axis fixed rails 33 are fixed on the base 2, and extend in the Y direction at a predetermined interval in the X direction and in parallel with each other. The ball screw shaft 35 is configured to extend in the Y direction at a position close to the Y-axis fixed rail 33 on the +X side. The second Y-axis servo motor 34 drives the ball screw shaft 35 to rotate. A support frame 36 for supporting the camera unit 32U is arranged between the pair of Y-axis fixed rails 33. A nut 37 threaded with the ball screw shaft 35 is assembled at the +X side end of the support frame 36.

[0045] The second drive mechanism D2 includes a guide member (not shown) mounted on the support frame 36, a second X-axis servo motor 38, and a ball screw shaft 39 as a moving mechanism of the camera unit 32U in the X direction. The guide member is a member that guides the movement of the camera unit 32U in the X direction, and is fixed to the -Y side of the support frame 36 in a manner extending in the X direction. The ball screw shaft 39 is arranged to extend in the X direction near the guide member. The second X-axis servo motor 38 drives the ball screw shaft 39 to rotate. A nut (not shown) is attached to the camera unit 32U, and the nut is screwed with the ball screw shaft 39.

[0046] According to the second drive mechanism D2 having the above structure, the second Y-axis servo motor 34 operates to rotate the ball screw shaft 35, thereby the camera unit 32U moves in the Y direction together with the support frame 36. In addition, the second X-axis servo motor 38 operates to rotate the ball screw shaft 39, thereby the camera unit 32U moves relative to the support frame 36 in the X direction.

[0047] The lifting unit 40 is arranged below the component supply unit 5, and lifts up the bare chip 7a to be adsorbed by the head 4H from the lower surface side of the wafer 8a. The component mounting device 1 of this embodiment is not a flip-flop type, but a direct wafer type device in which the head 4H directly adsorbs the bare chip 7a lifted up by the lifting unit 40. The lifting unit 40 is arranged on the base 2 in a manner that allows it to move in the XY direction within a range corresponding to the wafer stage 10. The lifting unit 40 is supported by a support frame 42 in a manner that allows it to move in the X direction, and the support frame 42 can move along a pair of guide rails 41 extending in the Y direction.

[0048] The ball screw shaft 43, which is screwed with a nut portion (not shown) provided inside the support frame 42, is rotationally driven by the third Y-axis servo motor 44. As a result, the lift unit 40 moves in the Y direction integrally with the support frame 42. In addition, the support frame 42 is provided with a ball screw shaft 45, which is screwed with a nut portion (not shown) provided inside the lift unit 40. The ball screw shaft 45 is rotationally driven by the third X-axis servo motor 46, thereby moving the lift unit 40 in the X-axis direction. The lift unit 40 has a lift pin 47 for lifting the bare chip 7a. When the bare chip 7a is adsorbed by the head 4H, the lift pin 47 rises, passes through the wafer 8a, and lifts up the bare chip 7a. The lift pin 47 is driven by the pin lifting motor 48 ( Figure 5 ) and lifting drive.

[0049] A component recognition camera 30 is installed on the base 2. The component recognition camera 30 captures a bare chip 7a adsorbed to the head 4H of the head unit 4 from the bottom before mounting the bare chip 7a on the substrate P. Based on the captured image, it is determined whether the head 4H adsorbs the bare chip 7a abnormally or incorrectly.

[0050] [Wafer and substrate]

[0051] Figure 3A It is a top view of the wafer 7 after dicing. There are multiple bare chips 7a that are independent by dicing on the wafer 7. The bare chips 7a are arranged in a matrix of X rows × Y columns on the wafer 8a. The wafer 7 is circular when viewed from above, so the number of the multiple bare chips 7a in the X row arranged in the Y direction is more in the center of the Y direction and less at the ends. Similarly, the number of the multiple bare chips 7a in the Y column arranged in the X direction is more in the center of the X direction and less at the ends. The positions of the bare chips 7a are managed by addresses based on the XY coordinate system.

[0052] Figure 3B It indicates the wafer related to wafer 7 Figure 7 An example of M. Wafer Figure 7 M is a file that records the evaluation of each bare chip 7a on the wafer 7 as to whether it is a good product or a defective product based on a predetermined standard. The evaluation value is recorded in correspondence with the address of the bare chip 7a. Figure 3B In the figure, "1" indicates a good bare chip 7a, "2" indicates a bare chip 7a of low grade although not defective, and "3" indicates a defective bare chip 7a. It should be noted that "n" indicates that there is no bare chip 7a at this address. When the bare chip 7a is picked up from the wafer 7 by the head 4H, refer to the wafer Figure 7 M, for example, performs control to sequentially pick up only good bare chips 7a.

[0053] Figure 41 is a diagram showing an example of a substrate on which components are mounted by the component mounting device 1. Figure 4 In the figure, a multi-piece substrate PA is shown as the above-mentioned substrate, and the component loading status of the multi-piece substrate PA by the head unit 4 is schematically shown. The multi-piece substrate PA is a substrate in which a plurality of sub-substrates 61 that can be cut away from each other are arranged in a matrix. Two mounting areas 63 are set on each sub-substrate 61. A plurality of predetermined component loading points are set within the range of these mounting areas 63. The component loading operation is performed in units of a multi-piece substrate PA, and after the component is loaded, it is cut away in units of a sub-substrate 61. Perforated lines or slits are provided between adjacent sub-substrates 61 to facilitate cutting.

[0054] exist Figure 4 , an enlarged view of a sub-substrate 61 is attached. Here, an IC component mounting point 64 (mounting point) for mounting IC components in the mounting area 63 and a plurality of bare chip mounting points 65 (mounting points) for mounting bare chips 7a are illustrated. In addition, a defective product mark 66 is also provided at the peripheral portion of the mounting area 63. In the case where the mounting area 63 is judged as unmountable in the previous process before reaching the component mounting device 1, the defective product mark 66 is, for example, painted black, as in the mounting area 63 on the left. The defective product mark 66 is photographed by the substrate recognition camera 31, and the mounting area 63 where the defective product mark 66 painted black is recognized by the image is processed as "unmountable". That is, the IC component mounting point 64 and the bare chip mounting point 65 of the mounting area 63 are set as "unmountable" mounting points and excluded from the component mounting objects.

[0055] The unit mounting area 62 is determined on the multi-piece substrate PA according to the number of heads 4H included in the head unit 4. Figure 4 In the figure, there is illustrated a head unit 4 in which 10 heads 4H are arranged in a straight line. Each head 4H includes a shaft 51 that can move in the up-down direction and a suction nozzle 52 mounted on the lower end of the shaft 51. The number of components that can be picked up by the suction nozzle 52 group in the component supply section 5 by a single component adsorption action is 10. It is assumed that the components picked up by each suction nozzle 52 by a single adsorption action are respectively mounted on a mounting area 63. In this case, since there are two mounting areas 63 for each sub-substrate 61, the unit mounting area 62 becomes an area of ​​five sub-substrates 61 arranged in a row in the X direction. Figure 4 In the example of , the groups of unit mounting areas 62 arranged in 6 rows in the Y direction are arranged in 3 columns in the X direction. That is, there are 18 unit mounting areas 62.

[0056] A plurality of Fid marks are attached to the unit loading area 62. Here, an example is shown in which the first Fid mark FM1 is attached to the -X, -Y corners of each unit loading area 62, and the second Fid mark FM2 is attached to the +X, +Y corners. The Fid marks FM1 and FM2 are photographed by the substrate recognition camera 31 to identify the positions of these marks. Then, based on the result of the above position recognition, the movement correction amount of each head 4H is calculated. The same is true for other unit loading areas 62. Then, the components adsorbed to each head 4H are installed in the installation area 63 allocated to each head 4H.

[0057] [Control structure of component mounting device]

[0058] Figure 5 1 is a block diagram showing a control structure of a component mounting device 1. The component mounting device 1 includes a control unit 20 that comprehensively controls the operation of each unit of the component mounting device 1. The control unit 20 is electrically connected to each device of the head unit 4, the camera unit 32U, and the lifting unit 40, as well as the wafer supply device 6 and the component recognition camera 30. The control unit 20 operates in a manner that functionally includes an overall control unit 21 (first control unit), an axis control unit 22, a photographing control unit 23, an image processing unit 24 (processing unit / component recognition unit), a loading possibility determination unit 25 (a part of the inspection unit), a pickup setting unit 26 (second control unit), and a storage unit 27 by executing a predetermined program.

[0059] The overall control unit 21 generally controls the actions of each functional unit of the control unit 20 and performs various calculations. For example, the overall control unit 21 performs position recognition of the bare chip 7a and checks whether it can be loaded on the component loading point. The above position recognition is based on the image obtained by the wafer camera 32, and the image processing unit 24 performs the position recognition process of each bare chip 7a of the wafer 7 placed on the wafer carrier 10. The above loading check is based on the image obtained by the substrate recognition camera 31 and the measurement result of the laser height meter 4R, and the loading determination unit 25 determines whether the component can be loaded on each loading point of the multi-piece substrate PA. In this embodiment, the overall control unit 21 performs the above position recognition and the above loading check in parallel.

[0060] The axis control unit 22 is a driver that drives the servo motors provided in each unit, and operates each drive motor according to the instruction from the overall control unit 21. Specifically, with respect to the head unit 4, the axis control unit 22 controls the movement of the head unit 4 along the XY directions of the ball screw shafts 15 and 19 by controlling the driving of the first Y-axis servo motor 14 and the first X-axis servo motor 18. In addition, the axis control unit 22 controls the movement of the head 4H in the Z direction by controlling the driving of the Z-axis servo motor 401, and controls the rotational movement of the head 4H around its own axis by controlling the driving of the R-axis servo motor 402.

[0061] Regarding the camera unit 32U, the axis control unit 22 controls the movement of the camera unit 32U along the XY directions of the ball screw shafts 35 and 39 by controlling the driving of the second Y-axis servo motor 34 and the second X-axis servo motor 38. In addition, regarding the lift unit 40, the axis control unit 22 controls the movement of the lift unit 40 along the XY directions of the ball screw shafts 43 and 45 by controlling the driving of the third Y-axis servo motor 44 and the third X-axis servo motor 46. In addition, the axis control unit 22 controls the lifting and lowering movement of the lift pin 47 by controlling the driving of the pin lifting motor 48.

[0062] The photographing control unit 23 controls the photographing actions of the component recognition camera 30, the substrate recognition camera 31, and the wafer camera 32. Specifically, the photographing control unit 23 controls the action of the component recognition camera 30 to photograph the bare chip 7a or other components adsorbed on the head 4H. In addition, the photographing control unit 23 controls the action of the substrate recognition camera 31 to photograph the substrate P or the multi-piece substrate PA positioned in the component mounting area of ​​the component mounting device 1. Moreover, the photographing control unit 23 controls the action of the wafer camera 32 to photograph the bare chip 7a in the wafer stage 10.

[0063] The image processing unit 24 performs various image processing including edge extraction processing on the image data input from the component recognition camera 30, the substrate recognition camera 31, and the wafer camera 32. Based on the image obtained by the component recognition camera 30, the image processing unit 24 performs image processing for identifying the presence and the adsorption posture of the bare chip 7a or other components to the suction nozzle 52. Based on the image obtained by the substrate recognition camera 31, the image processing unit 24 performs image processing for identifying the Fid marks FM1, FM2, the mounting area 63, and the defective product mark 66 of the multi-piece substrate PA. Based on the image obtained by the wafer camera 32, the image processing unit 24 performs image processing for identifying the position of the bare chip 7a to be adsorbed on the wafer stage 10.

[0064] Before mounting the component, the mounting possibility determination unit 25 performs a process of determining whether the component can be mounted on the predetermined component mounting point of the substrate P or the multi-piece substrate PA. Specifically, the mounting possibility determination unit 25 determines whether the component can be mounted based on the recognition result of the mounting area 63 and the defective product mark 66 by the image processing unit 24 and the measurement result of the laser height measuring device 4R. In the case where it is recognized that there is a foreign object or the defective product mark 66 is painted black at the mounting point of the mounting area 63, and further in the case where the laser height measuring device 4R detects an abnormal height in the mounting area 63, the mounting possibility determination unit 25 determines that the mounting point of the mounting area 63 is "not mountable". In the case where the above-mentioned various conditions are not detected, the mounting possibility determination unit 25 determines that the mounting point of the mounting area 63 is "mountable".

[0065] The pick-up setting unit 26 performs the following pick-up setting processing: determining the allocation of which of the multiple heads 4H is to pick up each of the multiple bare chips 7a (components) and the order in which the multiple heads 4H pick up the multiple bare chips 7a. The pick-up setting unit 26 performs the above-mentioned pick-up setting processing based on the results of the position recognition of the bare chip 7a and the inspection of whether the component can be mounted, which are performed in parallel under the control of the overall control unit 21.

[0066] In a more preferred embodiment, first, as a first process, the pick-up setting unit 26 assumes that there is no non-mountable mounting point (mounting area 63) in the inspection of whether the component can be mounted, and temporarily performs the above-mentioned pick-up setting. Thereafter, when the mounting determination unit 25 extracts a "non-mountable" mounting point in the inspection of whether the component can be mounted, as a second process following the above-mentioned first process, the pick-up setting unit 26 excludes the non-mountable mounting point from the above-mentioned assigned objects and performs the above-mentioned pick-up setting again. The above-mentioned pick-up setting in the above-mentioned second process is executed before the head unit 4 actually picks up the bare chip 7a.

[0067] The storage unit 27 stores various programs such as the installation program and various data. In the present embodiment, the storage unit 27 stores arrangement data such as the arrangement pitch of the heads 4H provided in the head unit 4, the arrangement pitch of the bare chips 7a in the wafer stage 10, and the arrangement pitch of the mounting points in the mounting area 63 in the multi-piece substrate PA. In addition, the storage unit 27 also stores the movement amount of the head unit 4 calculated in advance based on these arrangement data. The movement amount includes a first movement amount of the head unit 4 when the plurality of heads 4H mount the bare chips 7a on the mounting area 63, respectively, and a second movement amount of the head unit 4 when the plurality of heads 4H pick up the bare chips 7a, respectively.

[0068] [Component Mounting Process]

[0069] Next, based on Figure 6 and Figure 7 The flow of the component mounting operation performed by the component mounting device 1 will be described. Figure 6 , the process of a comparative example of the prior art equivalent to this embodiment is described. Figure 4 As shown in the example, Figure 6 and Figure 7 The "first suction group" and "second suction group" respectively refer to the groups of components (a total of 10 bare chips 7a) picked up by the head unit 4 having 10 heads 4H through one suction operation. Component loading is performed in units of the "first suction group" and "second suction group". The operation of loading the components picked up in one suction group on one unit loading area 62 of the multi-piece substrate PA is repeated.

[0070] In the comparative example, first, for the "first adsorption group", a substrate pre-mounting inspection process is performed to detect mounting points where components cannot be mounted based on the image of the multi-piece substrate PA obtained by the substrate recognition camera 31 (step S1). Next, a component recognition process is performed to recognize the position of the bare chip 7a based on the image of the wafer 7 obtained by the wafer camera 32 (step S2). After that, the allocation of each head 4H of the head unit 4 and the bare chip 7a to be picked up corresponding to the above-mentioned pickup setting is determined (step S3).

[0071] Then, according to the above allocation, the suction nozzle 52 of each head 4H is made to suck the bare chip 7a designated as the "first suction group" (step S4). Then, the head unit 4 is moved to the multi-piece substrate PA, and the sucked bare chip 7a is mounted on a unit mounting area 62 (step S5). After that, steps S6 to S10 similar to the above steps S1 to S5 are performed for the "second suction group". The same is true for the third suction group and the subsequent ones.

[0072] According to the comparative example, after executing the substrate pre-loading inspection of step S1, the component identification of step S2 and the picking setting including the allocation of step S3 are executed. Therefore, the picking setting can be performed based on the grasp of the "non-loading" loading points in the multi-piece substrate PA. Therefore, the processing can be simplified. However, when executing steps S2 and S3, sometimes there is a waiting time for the processing of step S1, and there is a situation where the cycle time deteriorates. In addition, waiting for the loading processing of the "first adsorption group" to end and starting the loading processing of the "second adsorption group" is not preferred from the perspective of improving the cycle time.

[0073] Figure 7 FIG. 1 is a flowchart showing the component mounting operation involved in the embodiment to which the present invention is applied. Figure 7In the figure, the time axis t is marked, and the steps executed in parallel are recorded side by side on the time axis t. In the embodiment, the overall control unit 21 executes the processing of substrate pre-mounting inspection (step S11) and the processing of component recognition (step S12) in parallel in time for the "first adsorption group".

[0074] In the pre-mounting inspection of the substrate in step S11, the image processing unit 24 performs a predetermined image processing on the image of the multi-piece substrate PA obtained by the substrate recognition camera 31. Based on the image processing result, the mounting possibility determination unit 25 determines whether the predetermined component mounting point is "mountable" or "unmountable". In the component recognition in step S12, the image processing unit 24 performs a predetermined image processing on the image of the wafer 7 obtained by the wafer camera 32, and determines the coordinate position of the bare chip 7a that is the object of adsorption. Following step S12, as the first processing, the picking setting unit 26 temporarily performs the above-mentioned picking setting, assuming that the "unmountable" component mounting point is not detected in the inspection of step S11 that is executed simultaneously in parallel. That is, the allocation of each head 4H of the head unit 4 and the bare chip 7a to be picked up is temporarily determined (step S13).

[0075] Next, based on the inspection result of step S11, as a second process, the picking setting unit 26 performs the picking setting again (step S14). In the case where no "unloadable" component loading point is detected in step S11, the picking setting temporarily determined in step S13 is directly referenced. On the other hand, in the case where a "unloadable" component loading point is extracted in step S11, the picking setting unit 26 excludes the "unloadable" component loading point from the allocation object and performs the picking setting again. For a specific example of the re-picking setting, refer to Figure 8 to Figure 13C The above pickup setting is performed before the head unit 4 picks up the bare chip 7a.

[0076] Then, according to the pickup setting of step S14, the axis control unit 22 controls the operation of the head unit 4 to make the suction nozzle 52 of each head 4H suck the bare chips 7a designated as the "first suction group" (step S15). Then, the axis control unit 22 moves the head unit 4 to the multi-chip substrate PA and carries out component mounting of mounting the sucked 10 bare chips 7a on one unit mounting area 62 (step S16).

[0077] The component recognition process for the "second adsorption group" is performed in parallel with step S16 (step S22). This is because the head unit 4 moves from the component supply unit 5 to the multi-chip substrate PA, the wafer stage 10 becomes idle, and the wafer camera 32 can take pictures of the wafer 7. Then, based on the recognition result of step S22, the pickup setting unit 26 temporarily determines the allocation of each head 4H and the bare chip 7a (step S23).

[0078] On the other hand, a substrate pre-loading inspection (step S21) is performed for the "second adsorption group" in parallel with the processing of steps S22 and S23. That is, when the component loading of step S16 of the "first adsorption group" is completed, the loading possibility determination unit 25 determines whether the component can be loaded on the loading point of the "second adsorption group". Afterwards, similarly to steps S14, S15, and S16, the formal determination of the allocation of each head 4H and the bare chip 7a (step S24), component adsorption (step S25), and component loading (step S26) are performed for the "second adsorption group". After step S26 is completed, a substrate pre-loading inspection (step S31) is performed for the "third adsorption group". Then, the component identification processing for the "third adsorption group" is performed in parallel with step S26 (step S32). The following processing is the same as above.

[0079] According to the above-mentioned embodiment, in the component mounting device 1 that directly picks up the bare chip 7a from the wafer 7 using the multiple heads 4H of the head unit 4, the cycle time can be improved. That is, instead of sequentially performing the position identification of the bare chip 7a and the feasibility check of the mounting point of the substrate P, they are performed in parallel, thereby shortening the cycle time. In addition, the pick-up setting unit 26 performs the pick-up setting after the position identification of the bare chip 7a and the pre-mounting inspection of the substrate, so that the accurate allocation of each head 4H to the bare chip 7a and the mounting point, and the setting of the picking order can be performed. In addition, in the case where the "non-mountable" mounting point is not detected, the temporary pick-up setting of steps S13 and S23 can be directly used. Therefore, the pick-up setting corresponding to both the "non-mountable" mounting point detected and the "non-mountable" mounting point not detected can be simply performed.

[0080] [Specific example of picking settings]

[0081] Next, a specific example of the pickup setting performed by the pickup setting unit 26 will be described. Figure 8 , the number assignment for the component mounting points of the multi-chip substrate PA, the heads 4H of the head unit 4, and the bare chips 7a of the wafer 7 will be described. The ten heads 4H of the head unit 4 are assigned head numbers 1 to 10, respectively.

[0082] The component loading points on the substrate PA are assigned numbers 1 to 10 indicating the positions where the heads 4H No. 1 to 10 respectively load the bare chips 7a. 1G, 2G, and 3G respectively represent the rows of bare chips 7a respectively adsorbed by the first, second, and third adsorption groups described above. Each bare chip 7a on the wafer 7 is also assigned numbers 1 to 10 indicating that it is adsorbed by each head 4H No. 1 to 10. The XY numbers marked on the wafer 7 are equivalent to Figure 3AThe XY directions shown are displayed, and each XY number is an XY coordinate value indicating the address of each bare chip 7a.

[0083] For example, the bare chip 7a located at the coordinate (X15, Y4) of the wafer 7 is assigned the number 10. The bare chip 7a number 10 is picked up by the head 4H assigned the number 10. In the case of the first adsorption group, the bare chip 7a number 10 adsorbed by the head 4H number 10 is mounted on the mounting point number 10 of [1G] of the substrate PA. Here, the head 4H is picked up from Figure 8 Numbers from 10 to 1 are marked from left to right. Figure 8 When picking up in the right direction, the heads 4H of No. 10, No. 9, and No. 8 pick up in this order. On the other hand, when picking up in the left direction, the heads 4H of No. 1, No. 2, and No. 3 pick up in this order. If set in this way, the movement amount of the head unit 4 can be suppressed. Figure 8 In the example, the bare chip 7a is picked up in the right direction (X15-18, Y4) in the order of heads 4H No. 10 to No. 7, and then the bare chip 7a is picked up in the left direction (X20-15, Y3) in the order of heads 4H No. 1 to No. 6.

[0084] The following is a specific example of changing the pickup setting of the head 4H when a "non-mountable" mounting point (hereinafter sometimes referred to as "mounting point NG") is extracted in the substrate pre-mounting inspection. Here, the mounting priority mode (second mode) for reducing the movement amount of the head unit 4 as much as possible when mounting components on the multi-piece substrate PA and the pickup priority mode (first mode) for reducing the movement amount of the head unit 4 as much as possible when sucking the bare chip 7a from the wafer 7 are exemplified.

[0085] <Installation Priority Mode>

[0086] Fig. 9 and Fig.10 1 is a schematic diagram for explaining an example of changing the pickup setting based on the mounting priority mode when a mounting point NG occurs. Fig. 9 In the example, it is assumed that the No. 8 pick-up point of the first adsorption group [1G] of the multi-piece substrate PA is extracted as a pick-up point NG. For the No. 8 pick-up point, a temporary pick-up setting ( Figure 7 In step S13), the No. 8 head 4H adsorbs the No. 8 bare chip 7a at the address (X17, Y4) of the wafer 7 and carries the No. 8 bare chip 7a.

[0087] Fig.10This is a schematic diagram showing the way of re-execution of the pickup setting in the installation priority mode. In the installation priority mode, the allocation is changed to skip the No. 8 head 4H assigned to the mounting point NG to pick up the bare chip 7a. Specifically, the bare chip 7a (target component) of the address (X17, Y4) assigned to the No. 8 mounting point as the mounting point NG is not assigned to the No. 8 head 4H (target head) assigned in the temporary setting, but is assigned to the No. 7 head 4H adjacent to it in the suction order. In other words, the bare chip 7a of (X17, Y4) is sucked by the No. 7 head 4H instead of the No. 8 head 4H.

[0088] In this way, the pick-up setting unit 26 performs the pick-up setting again so that the bare chip 7a assigned to the mounting point NG does not remain on the wafer 7 on the wafer stage 10 ( Figure 7 Step S14). That is, the bare chip 7a of (X17, Y4) is not left on the wafer 7 and is attracted by the head 4H. Moreover, the bare chips 7a attracted by the remaining heads 4H from No. 6 to No. 1 are also shifted one by one from the temporary setting. Specifically, the bare chip 7a of (X18, Y4) is changed from No. 7 to No. 6. As for the bare chips 7a of the Y3 row, the allocation of the heads 4H from No. 1 to No. 5 is maintained according to the temporary setting. This is because, Figure 8 As shown in the picking path R, the Y3 row becomes the picking in the left direction.

[0089] If the bare chip 7a (X17, Y4) assigned to the mounting point NG in the temporary setting is retained, the action of picking up the bare chip 7a is requested later. In this case, extra tact time may be generated, and in combination with the situation that the surrounding bare chips 7a are picked up, it may be impossible to identify and pick up the components with high accuracy. In this embodiment, such a problem does not occur.

[0090] By changing the pickup setting as described above, the head unit 4 ends the operation of sucking the bare chips 7a of the first suction group [1G] from the wafer 7, while only the No. 8 head 4H does not suck the bare chips 7a. Then, the head unit 4 moves to the air above the multi-chip substrate PA, and the bare chips 7a sucked by each head 4H are sequentially loaded except for the No. 8 loading point which is the loading point NG.

[0091] In the mounting priority mode described above, the movement amount of the head unit 4 during component mounting is intended to be smaller than the movement amount of the head unit 4 during pickup of the bare chip 7a by each head 4H. Therefore, the tact time during component mounting can be improved. Figures 11A to 11C This point will be described in detail.

[0092] Figures 11A to 11C1 is a diagram showing a specific example of the component mounting operation based on the mounting priority mode. Here, it is also assumed that the No. 8 mounting point of the multi-piece substrate PA is a mounting point NG, and as Fig.10 The case where the pickup setting is performed again as shown. Fig.11A Step #11 shows that the 10th head 4H first picks up the 10th bare chip 7a of the wafer 7, and then the 9th head 4H picks up the 9th bare chip 7a. Since the 8th head 4H has not yet allocated components, the 8th head 4H does not pick up.

[0093] Fig.11A Step #12 shows that the No. 7 head 4H is aligned with the No. 7 bare chip 7a located at (X17, Y4) of the wafer 7. In the state of step #11, the No. 8 head 4H is close to the bare chip 7a at (X17, Y4) to be picked up next. However, in this mode, the No. 8 head 4H is skipped and the No. 7 head 4H picks up the bare chip 7a at (X17, Y4). Therefore, in order to perform the above alignment, it is necessary to move the head unit 4 by a relatively large movement amount Δm1.

[0094] Fig. 11B Step #13 indicates that the No. 7 head 4H has picked up the No. 7 bare chip 7a. The No. 8 head 4H does not hold the bare chip 7a. After that, along the picking path R, the assigned bare chips 7a are picked up in the order of the No. 6 head, the No. 1 head, the No. 2 head, etc. After the picking is completed, the head unit 4 moves to the air above the multi-piece substrate PA and starts to load the picked bare chips 7a onto the multi-piece substrate PA. Fig. 11B Step #14 shows that the bare chip 7a is loaded from the No. 10 head 4H to the No. 10 loading point of the multi-piece substrate PA, and from the No. 9 head 4H to the No. 9 loading point. Since the No. 8 loading point is a loading point NG, the bare chip 7a is not loaded.

[0095] Fig. 11C Step #15 shows the state where the No. 7 head 4H is aligned to the No. 7 loading point. In this alignment, the loading point originally assigned to the No. 7 head 4H is aligned, so the movement amount of the head unit 4 is a relatively small movement amount Δm2. That is, it can be set to Δm1>Δm2, so when a loading point NG occurs, the tact time when mounting components can be shortened. Fig. 11C Step #16 shows the state where the bare chip 7a is loaded from the No. 7 head 4H to the No. 7 loading point. After that, the bare chips 7a are loaded from the No. 6 to No. 1 heads 4H to the No. 6 to No. 1 loading points, respectively, and the component loading of the first suction group [1G] is completed. Then, the picking and component loading of the second suction group [2G] is started.

[0096] <Pickup Priority Mode>

[0097] Fig.12 1 is a schematic diagram showing the manner of re-execution of the pickup setting in the pickup priority mode. In the pickup priority mode, the allocation is changed so that the 8th head 4H allocated to the mounting point NG picks up the 8th bare chip 7a and the mounting point NG is skipped.

[0098] Specifically, the bare chip 7a (object component) of the address (X17, Y4) assigned to the No. 8 loading point, which is the loading point NG, is assigned to the No. 8 head 4H (object head) as assigned in the temporary setting. Then, as the part not loaded on the No. 8 loading point, the No. 1 head 4H is removed from the picking object. That is, the assignment of the bare chip 7a of (X20, Y3) is changed from the No. 1 head to the No. 2 head. Regarding the bare chip 7a of (X19~16, Y3), the assignment is also changed so that the head numbers are shifted one by one. On the other hand, for the multi-piece substrate PA side, the No. 8 head 4H is assigned to the No. 7 loading point. For the No. 7 to No. 2 heads 4H, the head numbers are also shifted one by one and assigned to the No. 6 to No. 1 loading points, respectively.

[0099] By changing the pickup setting as described above, the head unit 4 ends the operation of sucking the bare chips 7a of the first suction group [1G] from the wafer 7, while only the No. 1 head 4H does not suck the bare chips 7a. Then, the head unit 4 moves to the air above the multi-chip substrate PA, and the bare chips 7a sucked by each head 4H are sequentially loaded except for the No. 8 loading point which is the NG loading point.

[0100] In the pickup priority mode described above, the movement amount of the head unit 4 when picking up the bare chip 7a from the wafer 7 is intended to be smaller than the movement amount of the head unit 4 when mounting components using each head 4H. Therefore, the tact time during pickup can be mainly improved. Figures 13A to 13C This point will be described in detail.

[0101] Figures 13A to 13C 1 is a diagram showing a specific example of the component loading operation based on the pick-up priority mode. Here, it is also assumed that the No. 8 loading point of the multi-piece substrate PA is a loading point NG, and as Fig.10 The case where the pickup setting is performed again as shown. Fig.13A Step #21 shows that the 10th head 4H picks up the 10th bare chip 7a, and then the 9th head 4H picks up the 9th bare chip 7a. In the pick-up priority mode, the 8th head 4H is also assigned the 8th bare chip 7a, so the 8th head 4H picks up the bare chip 7a next.

[0102] Fig.13AStep #22 shows that the No. 8 head 4H is aligned with the No. 8 chip 7a located at (X17, Y4) of the wafer 7. In the state of step #21, the No. 8 head 4H is closest to the bare chip 7a (X17, Y4) to be picked up next. Therefore, the movement amount of the head unit 4 used for the above alignment can be a relatively small movement amount Δm3.

[0103] Fig. 13B Step #23 indicates the state where the No. 8 head 4H has picked up the No. 8 bare chip 7a. After that, the assigned bare chips 7a are picked up in the order of the No. 7 head, the No. 2 head, the No. 3 head, etc. The No. 1 head 4H does not pick up the bare chip 7a. After the picking is completed, the head unit 4 moves to the air above the multi-piece substrate PA and starts to load the picked-up bare chips 7a onto the multi-piece substrate PA. Fig. 13B Step #24 shows that the bare chip 7a is loaded from the No. 10 head 4H to the No. 10 loading point of the multi-piece substrate PA, and from the No. 9 head 4H to the No. 9 loading point. Since the No. 8 loading point is a loading point NG, the bare chip 7a is not loaded.

[0104] Fig. 13C Step #25 shows the state of aligning the No. 8 head 4H to the No. 7 loading point. In this alignment, since the No. 8 head 4H is shifted to the loading point assigned to the adjacent No. 7 head 4H, the movement amount of the head unit 4 needs to be relatively large Δm4. That is, since Δm3<Δm4, the tact time during picking can be shortened when a loading point NG occurs.

[0105] Fig. 13C Step #26 shows the state where the bare chip 7a is loaded from the No. 8 head 4H to the No. 7 loading point. After that, the bare chips 7a are loaded from the No. 7 to No. 2 heads 4H to the No. 6 to No. 1 loading points, respectively, and the component loading of the first suction group [1G] is completed. Then, the picking and component loading of the second suction group [2G] is started.

[0106] [Differentiation of the two component mounting modes]

[0107] It can be said that the above-mentioned two component loading modes, namely the installation priority mode and the picking priority mode, are in a compromise relationship in terms of improving the cycle time. In the case where the substrate extracts the loading point NG, the picking setting unit 26 needs to select any mode. The preferred selection method is to comprehensively consider the picking process and the component loading process, and select a mode with excellent cycle time. Which mode is excellent in cycle depends on the size relationship between the spacing of the bare chips 7a on the wafer carrier 10 or the spacing of the loading points on the substrate PA and the arrangement spacing of the heads 4H in the head unit 4. The following shows an example of taking this size relationship into consideration, calculating which mode is excellent in cycle, and adopting the dominant mode.

[0108] Fig.14 This is a schematic diagram showing the relationship between the pitch of the head 4H and the arrangement pitch of the bare chip 7a or the pitch of the component mounting points, and the movement amount of the head 4H. As in the above example, it is assumed that the mounting point assigned to the 8th head 4H is determined to be a mounting point NG. As the size relationship of the pitch, the following patterns (1) to (3) can be cited.

[0109] • Mode (1): The pitch of the bare chip 7a or the substrate mounting point > the pitch of the head 4H;

[0110] • Mode (2): the pitch of the head 4H>the pitch of the bare chip 7a or the substrate mounting point;

[0111] • Mode (3): The pitch of the bare chips 7a or the substrate mounting points>the pitch of the heads 4H×2.

[0112] exist Fig.14 , heads No. 9, No. 8, and No. 7 of the head unit 4 are schematically shown, and the head spacing is represented by "H". In addition, adjacent bare chips 7a on the wafer 7 or adjacent substrate mounting points on the multi-chip substrate PA are represented by "X" and "Y", and their spacing is represented by "Dn" (n=1 to 3).

[0113] Mode (1) is a mode in which the pitch D1 of "X" and "Y" is larger than the head pitch H. In this mode (1), the movement amount of the head 4H in mode (1)-1 corresponding to the pickup priority mode (first mode) in which the No. 8 head adsorbs / mounts the component (bare chip 7a) and mode (1)-2 corresponding to the mounting priority mode (second mode) in which the No. 7 head adsorbs / mounts the component by skipping the No. 8 head. In mode (1)-1, the movement amount a1 required to move the No. 8 head to the center of "Y" (the center of the bare chip 7a or the center of the mounting point) is:

[0114] a1=D1-H.

[0115] On the other hand, in mode (1)-2, the amount of movement b1 required to move head No. 7 to the center of "Y" is:

[0116] b1=2×H-D1.

[0117] Next, in mode (2)-1 corresponding to the pickup priority mode of mode (2) in which the No. 8 head adsorbs and mounts components, the movement amount a2 required to move the No. 8 head to the center of "Y" is:

[0118] a2=H-D2.

[0119] In mode (2)-2 corresponding to the mounting priority mode of making head No. 7 adsorb / mount components in mode (2), the movement amount b2 required to move head No. 7 to the center of "Y" is:

[0120] b2=2×H-D2.

[0121] Furthermore, in mode (3)-1 corresponding to the pickup priority mode of making head No. 8 adsorb / mount components in mode (3), the movement amount a3 required to move head No. 8 to the center of "Y" is:

[0122] a3=D3-H.

[0123] In mode (3)-2 corresponding to the mounting priority mode of mode (2) in which the No. 7 head adsorbs and mounts components, the movement amount b3 required to move the No. 7 head to the center of "Y" is:

[0124] b3=D3-2×H.

[0125] Fig.15 The figure is a table showing the calculation formula of the movement amount of the head unit 4 in each mode when the pick-up priority mode is selected. In the above-mentioned two cases where "X" and "Y" are the bare chip 7a and the substrate mounting point, the relationship with the head spacing H is assumed. Fig.14 The three modes (1)-1, (1)-2, and (1)-3 are as follows. Fig.15 As shown in the figure, there are nine modes of size relationship combinations (A) to (I). Fig.15 In the example, "X" and "Y" are the distances when the bare chip 7a is picked up. Fig.14 Similarly, they are recorded as a1, a2, and a3, and the bare chip pitch is recorded as D1, D2, and D3. To distinguish them, the distances when "X" and "Y" are substrate mounting points (Mount) are recorded as a1p, a2p, and a3p, and the mounting point pitch is recorded as D1p, D2p, and D3p, with a lowercase letter p added.

[0126] Fig.16 This is a diagram in the form of a table showing a calculation formula for the movement amount of the head unit 4 in each mode when the installation priority mode is selected. Fig.14 The three modes (2)-1, (2)-2, and (2)-3 are as follows. Fig.15 As shown in the figure, there are nine conditions (A) to (I) for the combination of size relationships. Fig.15 In the example, "X" and "Y" are the distances when the bare chip 7a is picked up. Fig.14 Similarly, b1, b2, b3 are recorded, and the bare chip pitch is recorded as D1, D2, D3. To distinguish them, the distances when "X" and "Y" are substrate mounting points (Mount) are recorded as b1p, b2p, b3p, and the mounting point pitches are recorded as D1p, D2p, D3p.

[0127] The movement amounts a1, a2, a3 and b1, b2, b3 (hereinafter referred to as first movement amounts) of the head unit 4 during the above-mentioned picking, and the movement amounts a1p, a2p, a3p and b1p, b2p, b3p (hereinafter referred to as second movement amounts) of the head unit 4 during the component loading are pre-stored in the storage unit 27 ( Figure 5 That is, regarding the substrate P and components to be produced in the component mounting device 1, the values ​​of the substrate mounting point pitch, component pitch, and head pitch and the value of the movement amount of the head unit 4 are stored in the storage unit 27.

[0128] The picking setting unit 26 (second control unit) refers to the above-mentioned first movement amount and second movement amount, and adopts the one of the picking priority mode and the installation priority mode that is advantageous in terms of beat to perform picking setting. Specifically, the picking setting unit 26 calculates the first total of the first movement amount and the second movement amount when the picking priority mode is adopted, and the second total of the first movement amount and the second movement amount when the installation priority mode is adopted. And the picking setting unit 26 performs the above-mentioned picking setting in the following manner: compare the first total with the second total, select the picking priority mode when the first total is smaller, and select the installation priority mode when the second total is smaller.

[0129] For example, using Fig.15 and Fig.16 The picking setting unit 26 obtains a1+a1p as the first total and b1+b1p as the second total, and calculates the difference DF between the two. That is, it calculates:

[0130] DF=(a1+a1p)-(b1+b1p)

[0131] =(D1-H+D1p-H)-(2×H-D1+2×H-D1p)

[0132] =2D1+2D1p-6H.

[0133] If the difference DF value is positive, (a1+a1p) is large = the total movement amount of the head unit 4 is large = the cycle is disadvantageous, so the mounting priority mode is selected to make the No. 7 head absorb / mount the component. On the contrary, if the difference DF value is negative, the picking priority mode is selected to make the No. 8 head absorb / mount the component. According to this embodiment, it is possible to carry out component mounting in a mode that can further shorten the cycle time by taking into account both the component mounting and the picking.

[0134] [Modifications]

[0135] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments. For example, the following modified embodiments can be adopted.

[0136] (1) In the above-mentioned embodiment, if Fig. 9 The condition setting shown in the figure is based on the example that the pick-up point NG is detected only at the pick-up point No. 8 of the multi-piece substrate PA. The case of one pick-up point NG shown in the figure is applicable, and the pickup setting can be changed in the same manner when two or more pick-up point NG are detected for each suction group.

[0137] (2) In the above-mentioned embodiment, the substrate is exemplified as Figure 4 The multi-piece substrate PA is an example of the "substrate" according to the present invention, and may be various printed circuit boards other than the multi-piece substrate PA.

[0138] (3) In the above-mentioned embodiment, the amount of movement of the head unit 4 during picking and component loading is described as a special evaluation criterion for the quality of the takt time. The takt time is also affected by the amount of movement of the head unit 4 from the component picking position to the component loading position, the amount of movement of the head unit 4 for picking up the next adsorption group, etc. Therefore, when changing the picking setting, it is preferable to also consider the amount of movement of the head unit 4 other than during picking and component loading.

[0139] [Inventions included in the above-mentioned embodiments]

[0140] The specific embodiments described above mainly include the invention having the following structures.

[0141] A component mounting device according to one aspect of the present invention comprises: a component supply section having a component arrangement area in which a plurality of components arranged in a matrix are arranged; a component recognition section having a camera and a processing section, wherein the camera photographs the components in the component arrangement area, and the processing section recognizes the position of the components in the component arrangement area based on the image obtained by the camera; a head unit capable of moving between a component mounting area in which a substrate for mounting the components is arranged and the component arrangement area, and having a plurality of heads for picking up the components in the component arrangement area and mounting the components on the substrate in the component mounting area; an inspection section for inspecting whether the components can be mounted on a predetermined mounting point on the substrate arranged in the component mounting area; a first control section for controlling the operation of the component recognition section and the inspection section; and a second control section for performing the following picking setting processing: determining the allocation of which of the plurality of heads is to be picked up for each of the plurality of components and the order in which the plurality of heads pick up the plurality of components. The first control section performs the position recognition of the components by the component recognition section and the inspection of the mounting possibility by the inspection section in parallel. The second control unit executes the pickup setting process based on the results of the position recognition of the component and the inspection of the mounting availability which are executed in parallel.

[0142] According to the component loading device, in a component loading device that directly picks up a plurality of components from a component arrangement area using a plurality of heads of a head unit, the cycle time can be improved. That is, instead of sequentially performing position recognition of components and checking whether the loading point of a substrate is possible, they are performed in parallel, thereby shortening the cycle time. Furthermore, since the picking setting is performed after the above-mentioned position recognition and the above-mentioned inspection, accurate allocation and setting of the picking order can be performed.

[0143] In the above-mentioned component loading device, it is also possible that, as a first processing, the second control unit assumes that there is no non-loadable loading point in the loading feasibility inspection and temporarily performs the picking setting. When the non-loadable loading point is extracted in the loading feasibility inspection, as a second processing following the first processing, the second control unit excludes the non-loadable loading point from the assigned objects and performs the picking setting again.

[0144] According to this method, temporary pickup settings are performed in the first process, and when the inspection unit detects a non-carrying point, a definite pickup setting is performed in the second process based on the temporary pickup settings. When the non-carrying point is not detected, the temporary pickup settings can be used directly. Therefore, the pickup settings corresponding to both the detection of the non-carrying point and the non-carrying point can be easily performed.

[0145] In the above-mentioned component mounting device, preferably, the second control unit executes the pickup setting in the second process before the head unit performs the pickup.

[0146] According to this aspect, the timing of the pickup setting can be optimized.

[0147] In the above-mentioned component mounting device, preferably, the second control unit performs the pickup setting in the second process so that the components allocated to the non-mountable mounting points in the first process do not remain in the component arrangement area.

[0148] If the allocated component to the non-mountable loading point is left, the action of picking up the component is requested later. In this case, extra tact time may be generated, and in combination with the situation where the surrounding components are picked up, the situation where the component cannot be identified and picked up with high accuracy may occur. According to the above method, such problems can be eliminated.

[0149] In the above-mentioned component mounting device, it can also be as follows: the second control unit performs the picking setting in the second processing in such a way that the movement amount of the head unit when the multiple heads mount the components on the substrate respectively is smaller than the movement amount of the head unit when the multiple heads pick up the components respectively.

[0150] According to this aspect, the pickup setting in the second process is performed with priority given to reducing the amount of movement of the head unit when mounting components. Therefore, the tact time when mounting components can be mainly improved.

[0151] In the above-mentioned component mounting device, it can also be as follows: the second control unit performs the picking setting in the second processing in such a way that the movement amount of the head unit when the multiple heads pick up the components respectively is smaller than the movement amount of the head unit when the multiple heads mount the components respectively on the substrate.

[0152] According to this aspect, the pickup setting in the second process is performed with priority given to reducing the amount of movement of the head unit during pickup. Therefore, the tact time during pickup can be mainly improved.

[0153] In the above-mentioned component mounting device, it can also be as follows: the component mounting device includes a storage unit, which stores a first movement amount of the head unit when the multiple heads mount the components on the substrate respectively and a second movement amount of the head unit when the multiple heads pick up the components respectively, which are pre-calculated based on the arrangement spacing of the multiple heads and the arrangement spacing of the multiple components in the component configuration area or the arrangement spacing of the mounting points of the substrate. The second control unit calculates the following first total and second total when the picking setting in the second processing is performed, wherein the first total is the total of the first movement amount and the second movement amount when the first mode is selected, and the The first mode is a mode in which the object element assigned to the non-mountable mounting point in the first process is picked up by the object head assigned in the first process which is set to pick up the object element, and the object element is mounted on the substrate. The second total is the total of the first movement amount and the second movement amount when the second mode is selected. The second mode is a mode in which the object element is picked up by an adjacent head adjacent to the object head, and the object element is mounted on the substrate. The first total is compared with the second total. When the first total is smaller, the first mode is selected. When the second total is smaller, the second mode is selected to perform the picking setting.

[0154] According to this method, by comparing the first total with the second total, it is determined which of the target head (first mode) and the adjacent head (second mode) is used to pick up the allocated component to the above-mentioned non-mountable loading point. The first total and the second total are the total of the movement amount of the head unit when loading and picking up the component. Therefore, it is possible to consider both when loading and picking up the component, and to carry out the component loading in a mode that can further shorten the tact time.

[0155] In the above-mentioned component mounting device, preferably, the component arrangement area is an area for arranging diced wafers, the components are bare chips, the camera is a wafer camera for photographing the wafer, and the plurality of heads are arranged in a straight line.

[0156] According to this aspect, the tact time can be improved in a component mounting device that picks up bare chips from a diced wafer and mounts the bare chips on a substrate.

Claims

1. A component mounting device, comprising: A component supply section having a component arrangement area in which a plurality of components arranged in a matrix are arranged; A component recognition unit including a camera and a processing unit, wherein the camera photographs the component in the component configuration area, and the processing unit recognizes the position of the component in the component configuration area based on the image obtained by the camera; a head unit capable of moving between a component mounting area where a substrate on which the component is mounted is arranged and the component arrangement area, and having a plurality of heads for picking up the component in the component arrangement area and mounting the component on the substrate in the component mounting area; An inspection unit that inspects whether a component can be mounted on a predetermined mounting point on the substrate disposed in the component mounting area; a first control unit, controlling the operations of the component recognition unit and the inspection unit; and The second control unit performs the following picking setting processing: determining the allocation of which of the plurality of heads is to be used to pick up each of the plurality of components and the order in which the plurality of heads pick up the plurality of components, The first control unit executes position recognition of the component by the component recognition unit and the inspection of the mounting possibility by the inspection unit in parallel, The second control unit executes the pickup setting process based on the results of the position recognition of the component and the inspection of the mounting availability which are executed in parallel.

2. The component mounting device according to claim 1, wherein: As a first process, the second control unit temporarily performs the pickup setting assuming that there is no loading point that cannot be loaded in the loading permission check. When a non-carryable loading point is extracted in the loading permission check, the second control unit excludes the non-carryable loading point from the assigned objects as a second process subsequent to the first process, and performs the pickup setting again.

3. The component mounting device according to claim 2, wherein: The second control section executes the pickup setting in the second process before the head unit performs the pickup.

4. The component mounting device according to claim 2, wherein: The second control unit performs the pickup setting in the second process so that the component allocated to the non-mountable mounting point in the first process does not remain in the component arrangement area.

5. The component mounting device according to claim 4, wherein: The second control unit performs the pickup setting in the second process so that the movement amount of the head unit when the plurality of heads mount the components on the substrate is smaller than the movement amount of the head unit when the plurality of heads pick up the components.

6. The component mounting device according to claim 4, wherein: The second control unit performs the pickup setting in the second process so that the movement amount of the head unit when the plurality of heads pick up the components respectively is smaller than the movement amount of the head unit when the plurality of heads mount the components respectively on the substrate.

7. The component mounting device according to claim 4, wherein: The component mounting device includes a storage unit that stores a first movement amount of the head unit when the multiple heads mount the components on the substrate respectively and a second movement amount of the head unit when the multiple heads pick up the components respectively, which are pre-calculated based on the arrangement pitch of the multiple heads and the arrangement pitch of the multiple components in the component configuration area or the arrangement pitch of the mounting points on the substrate. The second control unit obtains the following first total and second total during the pickup setting in the second process: The first total is the total of the first movement amount and the second movement amount when the first mode is selected, wherein the target component assigned to the non-mountable mounting point in the first process is picked up by the target head assigned in the first process set to pick up the target component, and the target component is mounted on the substrate, The second total is a total of the first movement amount and the second movement amount when a second mode is selected, wherein the second mode is a mode in which the target component is picked up by an adjacent head adjacent to the target head and the target component is mounted on the substrate, and The first total is compared with the second total, and when the first total is smaller, the first mode is selected, and when the second total is smaller, the second mode is selected to perform the pickup setting.

8. The component mounting device according to any one of claims 1 to 7, wherein: The component configuration area is an area for configuring the wafer after dicing, and the component is a bare chip. The camera is a wafer camera for photographing the wafer, The plurality of heads are arranged in a straight line.

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