Full-automatic film pair carrier tape sorting machine

Abstract

The invention provides a full-automatic film pair carrier tape sorting machine which comprises a complete machine platform, the complete machine platform is provided with a crystal disc workbench, a first swing arm mechanism, a transfer table, a second swing arm mechanism, a strip table and a defective product placing area, and the crystal disc workbench and the transfer table are located in the working range of the first swing arm mechanism; the transfer table, the strip table and the defective product containing area are all located in the working range of the second swing arm mechanism. A first AOI camera is arranged above the crystal disc workbench, a second AOI camera is arranged above the transfer table, and a third AOI camera is arranged above the strip table. By the adoption of the chip sorting and arranging device, the AOI camera captures the coordinates and the orientation of the chip and judges whether the chip has defects or not, the transfer table moves to align the coordinates and the orientation of the chip, the second swing arm mechanism transfers the chip to a defective product containing area or a carrier band on the strip table, chip sorting and chip arranging of the film to the strip are synchronously achieved, operation is convenient and fast, and the working efficiency is improved; and the device cost is saved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip arrangement devices, and in particular to a fully automatic film-to-carrier tape sorting machine. Background Art

[0002] In some processes of IC semiconductor chip processing, the chips need to be re-sorted and re-arranged, the chips need to be removed from the original wafer film, the defective chips need to be separated, and the remaining good chips need to be rearranged and placed on a new film to realize the sorting and arrangement of semiconductor chips.

[0003] At present, the field mainly adopts double swing arm type chip arrangement device for accurate chip arrangement. Specifically, the loading XY worktable, the first swing arm mechanism, the XY-θ transfer table, the second swing arm mechanism and the unloading XY worktable are arranged in the same direction at one time. The first swing arm mechanism takes the chip from the loading XY worktable, rotates 180° and places it on the XY-θ transfer table. The XY-θ transfer table fine-tunes the coordinates and orientation of the chip. The second swing arm mechanism takes the chip from the XY-θ transfer table, rotates 180° and places it on the film of the unloading XY worktable to complete high-precision chip arrangement and high-precision chip bonding.

[0004] The above device cannot complete the chip sorting. In addition, since the starting and ending positions of the swing arm mechanism are basically unchanged, the unloading XY workbench needs to move in the XY plane to drive the empty spaces on the film to move to the end points of the swing arm mechanism in sequence; at the same time, in order to spread the film evenly, a crystal expansion tray mechanism is often required on the unloading XY workbench, resulting in a complex device structure and high cost. After the chips are arranged, the film removed from the unloading XY workbench lacks support and protection, so it often needs to be sorted and loaded into a crystal tray before it can be sent to the next process. The operation is cumbersome and the work efficiency is low. Summary of the invention

[0005] The technical problem to be solved by the present invention is: how to realize the synchronous sorting and arranging of chips, reduce the complexity of the device and improve the working efficiency.

[0006] The technical solution of the present invention to solve the above technical problems is as follows: The present invention provides a fully automatic film-to-carrier sorting machine, comprising a complete machine platform, on which a crystal disk worktable, a first swing arm mechanism, a transfer table, a second swing arm mechanism, a strip table and a defective product placement area are arranged, the crystal disk worktable and the transfer table are located within the working range of the first swing arm mechanism, and the transfer table, the strip table and the defective product placement area are all located within the working range of the second swing arm mechanism; a first AOI camera is arranged above the crystal disk worktable, a second AOI camera is arranged above the transfer table, and a third AOI camera is arranged above the strip table.

[0007] The beneficial effects of the present invention are: By adopting the present invention, the coordinates, orientation and defects of the chip are captured by the AOI camera, the coordinates and orientation of the chip are adjusted by the movement of the transfer table, the defective products are transferred to the defective product placement area by the second swing arm mechanism, and the good products are transferred to the carrier tape on the strip table, thereby realizing the sorting and accurate arrangement of the chips simultaneously; the carrier tape is fed by the strip table to realize the sorting and arrangement of the strips by the membrane, the product is in the shape of a strip roll, has good stability, and can be sent to the next process without strengthening the sorting and protection, which is convenient to operate and improves the work efficiency; at the same time, the structures such as the crystal expansion plate at the position of the strip table are omitted, thereby reducing the complexity of the device and saving the device cost.

[0008] Based on the above technical solution, the present invention can also be improved as follows.

[0009] Furthermore, the crystal disk workbench includes a bottom frame, a middle frame and a crystal disk seat. The upper side of the bottom frame is connected to the lower side of the middle frame through a first linear module, and the upper side of the middle frame is connected to the lower side of the crystal disk seat through a second linear module. The first linear module is perpendicular to the second linear module; the bottom frame is fixed on the whole machine platform.

[0010] By superimposing the motion of the first and second linear modules, an XY plane motion is formed, which facilitates the delivery of each chip on the wafer disk to the coordinate origin of the first swing arm mechanism in sequence, with high automation and accurate chip arrangement.

[0011] Furthermore, an ejector mechanism is provided in the bottom frame, and the ejector mechanism is fixed on the whole machine platform.

[0012] When the first swing arm mechanism picks up the chip from the crystal tray workbench, the ejector pin mechanism abuts upward against the film of the crystal expansion tray, causing the film to convexly deform, thereby making the chip easier to detach and avoiding slippage between the chip and the suction nozzle of the first swing arm mechanism during pickup, thereby having good reliability and facilitating accurate chip arrangement.

[0013] Furthermore, the ejector mechanism includes a vertical guide rail and a support seat, the lower end of the vertical guide rail is fixed on the whole machine platform; one side of the vertical guide rail is connected to the support seat through a Z-axis linear module, the support seat is provided with a first XY horizontal plane module, the first XY horizontal plane module is provided with a support block, the top of the support block is slidably connected with an ejector column, one side of the support block is provided with an ejector motor, the output end of the ejector motor is provided with a cam, and the lower end of the ejector column contacts the cam.

[0014] During installation, the Z-axis linear module can drive the support seat to descend to avoid structural interference; during operation, the Z-axis linear module drives the support seat to rise, so that the ejector column is close to the crystal expansion plate on the crystal plate seat, and the first XY horizontal plane module can drive the ejector column to move under each chip; the ejector motor drives the ejector column to reciprocate up and down through the cam, thereby quickly lifting each chip. When the chip is absorbed by the first swing arm mechanism, the ejector column quickly descends, with quick action and high work efficiency.

[0015] Furthermore, the whole machine platform is also provided with a loading gantry and a loading table, and the loading table and the crystal plate workbench are located on the same side of the loading gantry; the loading gantry is provided with a YZ motion module, and the YZ motion module is provided with a support arm, one end of the support arm extends above the crystal plate workbench and is provided with a crystal plate clamping cylinder.

[0016] During operation, the prepared material can be placed on the loading table. Through the YZ motion module and the crystal plate clamping cylinder, the expanded crystal plate on the loading table can be automatically clamped to the crystal plate workbench, which is convenient for automatic loading and high work efficiency.

[0017] Furthermore, the transfer table includes a second XY horizontal plane module, a support frame is provided on the second XY horizontal plane module, a θ motor and a carrier are provided on the support frame, and the θ motor is transmission-connected to the carrier.

[0018] The chip coordinates can be adjusted through the second XY horizontal plane module so that the chip is located at the coordinate origin of the second swing arm mechanism; the chip orientation can be adjusted by driving the carrier to rotate through the θ motor, which facilitates accurate chip arrangement.

[0019] Furthermore, the top of the support frame is provided with an extension portion extending horizontally, the carrier is arranged on the extension portion, and the θ motor is connected to the carrier via a belt drive.

[0020] The θ motor is installed independently from the carrier, which is easy to install, has good stability, reliable transmission, small error, and is convenient for accurately adjusting the position of the chip.

[0021] Furthermore, a fourth AOI camera is provided below the carrier, and the fourth AOI camera is fixed on the support frame or the whole machine platform; the carrier is a transparent structure.

[0022] The extension part provides a suspended installation space for the carrier, so that the fourth AOI camera can detect the lower side of the carrier upwards. When the second swing arm mechanism absorbs the chip, the transfer table moves away from the fourth AOI camera, and the fourth AOI camera can efficiently capture the image of the lower side of the chip, thereby detecting whether there are defects on the lower side of the chip, thereby improving the accuracy of chip sorting.

[0023] Furthermore, the strip table includes an XY movable table for mounting a frame, on which a carrier platform and a finished carrier winding station are provided; a patch area is provided on the upper side of one end of the carrier platform, the patch area is provided with a carrier hole for the carrier to pass through, and a carrier outlet is provided at the other end of the carrier platform, which is connected to the finished carrier winding station; a carrier motor is provided in the middle of the carrier platform, and the driving shaft of the carrier motor extends into the carrier platform and is provided with a pin wheel; the patch area is located within the working range of the second swing arm mechanism.

[0024] By passing the carrier tape downward through the carrier tape hole, the carrier tape is ensured to be laid flat in the patch area, thereby improving the patch quality; by the independent operation of the carrier tape motor and the finished carrier tape roll, the advancement and reeling of the carrier tape are ensured, while at the same time, the carrier tape is prevented from being deformed by tension, thereby ensuring the patch quality.

[0025] Furthermore, the XY movable platform of the mounting frame is also provided with a first tape sorting block and a second tape sorting block. The first tape sorting block is semicircular and located above the carrier tape outlet, and the second tape sorting block is cylindrical and located above the finished product carrier tape roll station.

[0026] After the carrier tape is led out from the carrier tape outlet, it passes around the first tape sorting block and the second tape sorting block in sequence, and is finally connected to the finished carrier tape roll, which makes it easy to straighten the carrier tape and avoids the twisting of the carrier tape when the finished carrier tape roll is rolled up, thereby improving product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a three-dimensional schematic diagram of the crystal plate workbench side of the present invention.

[0028] Figure 2 It is a three-dimensional schematic diagram of the strip stage side of the present invention.

[0029] Figure 3 It is a top view of the present invention.

[0030] Figure 4 It is a structural schematic diagram of the crystal plate workbench.

[0031] Figure 5 It is a structural schematic diagram of the ejector mechanism.

[0032] Figure 6 This is a schematic diagram of the structure of the relay station.

[0033] Figure 7 Schematic diagram of the strip stage structure.

[0034] In the accompanying drawings, the technical features represented by the reference numerals are as follows: 1-Complete machine platform; 2-Wave plate workbench; 3-First swing arm mechanism; 4-Transfer table; 5-Second swing arm mechanism; 6-Strip table; 7-Defective product placement area; 8-First AOI camera; 9-Second AOI camera; 10-Third AOI camera; 11-Fourth AOI camera; 12-Bottom frame; 13-Middle frame; 14-Wave plate seat; 15-First linear module; 16-Second linear module; 17-Vertical guide rail; 18-Support seat; 19-First XY horizontal plane module; 20-Support block; 21- Ejector column; 22-ejector motor; 23-cam; 24-loading gantry; 25-loading platform; 26-YZ motion module; 27-support arm; 28-crystal disk clamping cylinder; 29-second XY horizontal plane module; 30-support frame; 31-θ motor; 32-carrier; 33-extension; 34-mounting frame XY moving table; 35-carrier platform; 36-finished product carrier winding station; 37-carrier hole; 38-carrier motor; 39-carrier outlet; 40-first tape sorting block; 41-second tape sorting block. DETAILED DESCRIPTION

[0035] The principles and features of the present invention are described below. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0036] The present invention refers to Figure 1-7 .

[0037] The present invention provides a fully automatic film-to-carrier sorting machine, comprising a whole machine platform 1, on which a crystal disk worktable 2, a first swing arm mechanism 3, a transfer table 4, a second swing arm mechanism 5, a strip table 6 and a defective product placement area 7 are provided. The crystal disk worktable 2 and the transfer table 4 are located within the working range of the first swing arm mechanism 3, and the transfer table 4, the strip table 6 and the defective product placement area 7 are all located within the working range of the second swing arm mechanism 5; a first AOI camera 8 is provided above the crystal disk worktable 2, a second AOI camera 9 is provided above the transfer table 4, and a third AOI camera 10 is provided above the strip table 6.

[0038] principle: The first and second swing arm mechanisms 5 both include a frame, a motor and a swing arm are provided on the lower side of the frame, the output end of the motor is connected to one end of the swing arm and can drive the swing arm to swing horizontally, and a suction nozzle is provided at the other end of the swing arm, and the suction nozzle can be used to suck up the chip. In addition, the first and second swing arm mechanisms 5 can adopt the swing arm mechanism in the background technology. When the swing arm swings horizontally, the circular contour passed by its suction nozzle is the working range of the swing arm mechanism, and the suction nozzle can suck up or put down the chip at any point of the contour. Preferably, the crystal plate workbench 2 adopts an XY platform, and the transfer table 4 adopts an XYθ platform.

[0039] Work preparation: Place the expansion tray on the tray workbench 2, connect the loading carrier roll at one end of the strip table 6, and connect the finished product carrier roll at the other end of the strip table 6. The carrier tape on the loading carrier roll passes through the strip table 6 and is connected to the finished product carrier roll. The carrier tape can be driven to feed by rotating the finished product carrier roll or moving the strip table 6. During operation: The first AOI camera 8 captures the chip coordinates, and the tray workbench 2 moves to send each chip to the coordinate origin of the first swing arm mechanism 3 in turn; the first swing arm mechanism 3 absorbs the chip from the tray workbench 2, and places the chip on the transfer table 4 after horizontal swing; the second AOI camera 9 captures the chip coordinates, orientation, and whether there are defects, etc., and the transfer table 4 moves to adjust the chip coordinates and orientation; the second swing arm mechanism 5 absorbs the chip from the transfer table 4 and swings horizontally. If it is a defective defective product, it is placed in the defective product placement area 7, and if it is a good product, it is placed on the carrier tape on the strip table 6. The third AOI camera 10 captures the coordinates of the chips on the carrier tape. Each time a chip is placed on the carrier tape, the carrier tape is operated to feed a chip station so as to sort the next chip.

[0040] The present invention can also be used to transfer chips from a carrier tape roll to a wafer expansion tray.

[0041] By adopting the present invention, the coordinates, orientation and defects of the chip are captured by the AOI camera, the coordinates and orientation of the chip are adjusted by the movement of the transfer table 4, the second swing arm mechanism 5 transfers the defective products to the defective product placement area 7, and the good products are transferred to the carrier tape on the strip table 6, thereby simultaneously realizing the sorting and accurate arrangement of the chips; the carrier tape is conveyed and fed by the strip table 6, so that the strips are sorted and arranged by the membrane, and the product is in the shape of a strip roll with good stability. It can be sent to the next process without strengthening the sorting and protection, and the operation is convenient, thereby improving the work efficiency; at the same time, the structures such as the crystal expansion plate at the position of the strip table 6 are omitted, thereby reducing the complexity of the device and saving the device cost.

[0042] Further, such as Figure 4 As shown: the crystal disk workbench 2 includes a bottom frame 12, a middle frame 13 and a crystal disk seat 14, the upper side of the bottom frame 12 is connected to the lower side of the middle frame 13 through a first linear module 15, the upper side of the middle frame 13 is connected to the lower side of the crystal disk seat 14 through a second linear module 16, and the first linear module 15 is perpendicular to the second linear module 16; the bottom frame 12 is fixed on the whole machine platform 1.

[0043] Note: Both the first and second linear modules 16 can adopt modules such as linear motors or lead screw pairs. When installed, the fixed end of the linear module is connected to the upper side of the lower component, and the movable end is connected to the lower side of the upper component.

[0044] By superimposing the motion of the first and second linear modules 16 , an XY plane motion is formed, so that each chip on the wafer disk can be sent to the coordinate origin of the first swing arm mechanism 3 in sequence, which is highly automated and convenient for accurate chip arrangement.

[0045] Furthermore, an ejector mechanism is provided in the bottom frame 12 , and the ejector mechanism is fixed on the whole machine platform 1 .

[0046] When the first swing arm mechanism 3 picks up the chip from the crystal plate workbench 2, the ejector pin mechanism abuts upward against the film of the crystal expansion plate, causing the film to convexly deform, thereby making the chip easier to detach, avoiding slippage between the chip and the suction nozzle of the first swing arm mechanism 3 during suction, thereby having good reliability and facilitating accurate chip arrangement.

[0047] Further, such as Figure 5 As shown: the ejector mechanism includes a vertical guide rail 17 and a support seat 18, the lower end of the vertical guide rail 17 is fixed on the whole machine platform 1; one side of the vertical guide rail 17 is connected to the support seat 18 through a Z-axis linear module, a first XY horizontal plane module 19 is provided on the support seat 18, the first XY horizontal plane module 19 is provided with a support block 20, the top of the support block 20 is slidably connected with an ejector column 21, one side of the support block 20 is provided with an ejector motor 22, the output end of the ejector motor 22 is provided with a cam 23, and the lower end of the ejector column 21 is in contact with the cam 23.

[0048] Note: The first XY horizontal plane module 19 can be formed by stacking two sets of mutually perpendicular linear modules, for example: the fixed end of the X linear module is fixed on the support seat 18, the movable end of the X linear module is connected to the fixed end of the Y linear module, and the movable end of the Y linear module is connected to the support block 20. The linear module can use a linear motor or a lead screw pair, which belongs to the existing technology products. The Z axis represents the vertical direction, and the X and Y axes can be defined arbitrarily.

[0049] During installation, the Z-axis linear module can drive the support seat 18 to descend to avoid structural interference; during operation, the Z-axis linear module drives the support seat 18 to rise, so that the top column 21 is close to the crystal expansion plate on the crystal plate seat 14, and the first XY horizontal plane module 19 can drive the top column 21 to move under each chip; the ejector motor 22 drives the ejector column 21 to reciprocate up and down through the cam 23, thereby quickly lifting each chip. When the chip is sucked by the first swing arm mechanism 3, the ejector column 21 quickly descends, the action is fast, and the work efficiency is high.

[0050] Further, such as Figure 4 As shown: the whole machine platform 1 is also provided with a loading gantry 24 and a loading table 25, and the loading table 25 and the crystal plate workbench 2 are both located on the same side of the loading gantry 24; the loading gantry 24 is provided with a YZ motion module 26, and the YZ motion module 26 is provided with a support arm 27, one end of the support arm 27 extends to the top of the crystal plate workbench 2 and is provided with a crystal plate clamping cylinder 28.

[0051] Note: The YZ motion module 26 can be formed by stacking two sets of linear modules perpendicular to each other, for example: a Y-axis linear motor is provided on the gantry, a Z-axis linear motor is provided at the moving end of the Y-axis linear motor, and the moving end of the Z-axis linear motor is connected to the support arm 27. The Z axis represents the vertical direction, and the Y axis represents the gantry direction.

[0052] During operation, the prepared material can be placed on the loading table 25. The expanded crystal plate on the loading table 25 can be automatically clamped to the crystal plate workbench 2 through the YZ motion module 26 and the crystal plate clamping cylinder 28, which is convenient for automatic loading and has high work efficiency.

[0053] Further, such as Figure 6 As shown, the transfer table 4 includes a second XY horizontal plane module 29 , a support frame 30 is provided on the second XY horizontal plane module 29 , a θ motor 31 and a carrier 32 are provided on the support frame 30 , and the θ motor 31 is transmission-connected with the carrier 32 .

[0054] Note: The second XY horizontal plane module 29 can be formed by stacking two sets of mutually perpendicular linear modules, for example: the fixed end of the X linear module is fixed on the whole machine platform 1, the movable end of the X linear module is connected to the fixed end of the Y linear module, and the movable end of the Y linear module is connected to the support frame 30.

[0055] The chip coordinates can be adjusted by the second XY horizontal plane module 29 so that the chip is located at the coordinate origin of the second swing arm mechanism 5; the chip orientation can be adjusted by the θ motor 31 driving the carrier 32 to rotate, which facilitates accurate chip arrangement.

[0056] Furthermore, an extension portion 33 extending horizontally is provided on the top of the support frame 30, the carrier 32 is provided on the extension portion 33, and the θ motor 31 is connected to the carrier 32 via a belt drive.

[0057] The θ motor 31 and the carrier 32 are installed independently, which is convenient to install, has good stability, reliable transmission, small error, and is convenient for accurately adjusting the orientation of the chip.

[0058] Furthermore, a fourth AOI camera 11 is disposed below the carrier 32 , and the fourth AOI camera 11 is fixed on the support frame 30 or the whole machine platform 1 .

[0059] The extension portion 33 provides a suspended installation space for the carrier 32, so that the fourth AOI camera 11 can detect the lower side of the carrier 32 upward. When the second swing arm mechanism 5 absorbs the chip, the transfer table 4 moves away from the fourth AOI camera 11, and the fourth AOI camera 11 can efficiently capture the image of the lower side of the chip, thereby detecting whether there are defects on the lower side of the chip, thereby improving the accuracy of chip sorting.

[0060] Further, such as Figure 7As shown: the strip table 6 includes an installation frame XY movable table 34, on which a carrier platform 35 and a finished carrier winding station 36 are provided; a patch area is provided on the upper side of one end of the carrier platform 35, and the patch area is provided with a carrier hole 37 for the carrier to pass through, and a carrier outlet 39 is provided at the other end of the carrier platform 35, and the carrier outlet 39 is connected to the finished carrier winding station 36; a carrier motor 38 is provided in the middle of the carrier platform 35, and the driving shaft of the carrier motor 38 extends into the carrier platform 35 and is provided with a pin wheel; the patch area is located within the working range of the second swing arm mechanism 5.

[0061] During installation, the finished carrier roll is installed on the finished carrier roll station 36, the carrier is led out from the loading carrier roll, the carrier is attached to the patch area, and inserted from the carrier hole 37, bypassing the pin wheel of the carrier motor 38, and then led out from the carrier outlet 39, and finally connected to the finished carrier roll. The edge of the carrier can be made into a row of holes, and the outer periphery of the pin wheel is provided with a plurality of column head needles that can cooperate with the row of holes. The carrier motor 38 drives the pin wheel to rotate, which can drive the carrier forward. The loading carrier roll can release the carrier by itself, so the carrier motor 38 only needs to apply a small force to the carrier to drive the carrier forward, and there is no need to consider the problem of tensile deformation of the carrier. When there are more carriers at the carrier outlet 39, the finished carrier roll can be rotated to reel up the finished carrier with the chip attached.

[0062] Preferably, the finished product carrier tape roll station 36 may also be provided with a finished product carrier tape motor, and the finished product carrier tape roll is mounted on the driving shaft of the finished product carrier tape motor.

[0063] By passing the carrier tape downward through the carrier tape hole 37, the carrier tape is smoothly arranged in the patch area, thereby improving the patch quality; by the carrier tape motor 38 and the finished carrier tape roll working independently, the advancement and reeling of the carrier tape are guaranteed, while at the same time, the carrier tape is prevented from being deformed by tension, thereby ensuring the patch quality.

[0064] Furthermore, the mounting frame XY movable table 34 is also provided with a first tape sorting block 40 and a second tape sorting block 41. The first tape sorting block 40 is semicircular and located above the carrier tape outlet 39, and the second tape sorting block 41 is cylindrical and located above the finished carrier tape roll station 36.

[0065] After the carrier tape is led out from the carrier tape outlet 39, it passes around the first tape sorting block 40 and the second tape sorting block 41 in sequence, and is finally connected to the finished carrier tape roll, which makes it easy to straighten the carrier tape and avoids the twisting of the carrier tape when the finished carrier tape roll is rolled up, thereby improving product quality.

[0066] In the description of the present invention, it should be understood that if there are descriptive terms indicating orientation, direction or positional relationship, such as “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., the orientation or positional relationship indicated in this specification is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of understanding the present invention and simplifying the description, and does not indicate or imply that the referred part, element or whole must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0067] In addition, if there are order description terms, such as "first", "second", etc., their purpose in this specification is to facilitate understanding or simplify description. For example, in order to distinguish multiple technical features of the same type or function, but they have to be mentioned separately, this specification may use prefix or suffix order description terms to distinguish them. Therefore, it cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0068] In the present invention, if the terms describing the relative functional relationship of structures are used, such as "install", "connect", "connect", "fix", etc., they should be understood in a broad sense unless otherwise clearly specified and limited. For example, "install", "connect", "connect", etc. can be a fixed connection, a detachable connection, or an integrated one; can be a mechanical connection or an electrical connection; can be a direct connection or an indirect connection through an intermediate medium, can be the internal connection of two elements or the interaction relationship between two elements; "fix" can be an integrated fixation or a detachable fixation through fasteners; can be a direct fixation or a fixation through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above-mentioned descriptive terms in the present invention can be understood according to the specific circumstances, the context, the coherence of the context, etc.

[0069] In the present invention, if there are descriptive terms with subsidiary or connecting meanings, for example, a first feature is "on" or "below" a second feature, unless otherwise clearly specified and limited, it should not be interpreted in a restrictive manner. For example, "on" or "below" can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above descriptive terms in the present invention can be understood according to the specific circumstances, the context, the coherence of the context, etc.

[0070] Furthermore, the first feature being “above”, “above”, and “above” the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being “below”, “below”, and “below” the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0071] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments, examples and features of the different embodiments and examples described in this specification without contradiction, and these combinations or combinations shall all fall within the scope summarized by the present invention.

[0072] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations on the present invention. Changes, modifications, substitutions and variations of the above embodiments made by a person skilled in the art within the scope of information available from public channels and in combination with the technical inspiration provided by the present application documents are still within the scope of protection of the present application.

Claims

1. A fully automatic film to carrier sorting machine, characterized by: The invention comprises a whole machine platform (1), wherein the whole machine platform (1) is provided with a crystal plate workbench (2), a first swing arm mechanism (3), a transfer table (4), a second swing arm mechanism (5), a strip table (6) and a defective product placement area (7); the crystal plate workbench (2) and the transfer table (4) are located within the working range of the first swing arm mechanism (3), and the transfer table (4), the strip table (6) and the defective product placement area (7) are all located within the working range of the second swing arm mechanism (5); a first AOI camera (8) is provided above the crystal plate workbench (2), a second AOI camera (9) is provided above the transfer table (4), and a third AOI camera (10) is provided above the strip table (6).

2. The fully automatic film to carrier sorting machine according to claim 1, characterized in that: The crystal disk workbench (2) comprises a bottom frame (12), a middle frame (13) and a crystal disk seat (14); the upper side of the bottom frame (12) is connected to the lower side of the middle frame (13) via a first linear module (15); the upper side of the middle frame (13) is connected to the lower side of the crystal disk seat (14) via a second linear module (16); the first linear module (15) is perpendicular to the second linear module (16); and the bottom frame (12) is fixed on the whole machine platform (1).

3. The fully automatic film to carrier sorting machine according to claim 2, characterized in that: An ejector mechanism is also provided in the bottom frame (12), and the ejector mechanism is fixed on the whole machine platform (1).

4. The fully automatic film-to-carrier sorting machine according to claim 3 is characterized in that: The ejector mechanism comprises a vertical guide rail (17) and a support seat (18), wherein the lower end of the vertical guide rail (17) is fixed on the whole machine platform (1); one side of the vertical guide rail (17) is connected to the support seat (18) via a Z-axis linear module, a first XY horizontal plane module (19) is provided on the support seat (18), a support block (20) is provided on the first XY horizontal plane module (19), a top of the support block (20) is slidably connected to an ejector column (21), an ejector motor (22) is provided on one side of the support block (20), a cam (23) is provided at the output end of the ejector motor (22), and the lower end of the ejector column (21) contacts the cam (23).

5. The fully automatic film to carrier sorting machine according to claim 1, characterized in that: The whole machine platform (1) is also provided with a loading gantry (24) and a loading platform (25), and the loading platform (25) and the crystal plate workbench (2) are both located on the same side of the loading gantry (24); the loading gantry (24) is provided with a YZ motion module (26), and the YZ motion module (26) is provided with a support arm (27), one end of the support arm (27) extends above the crystal plate workbench (2) and is provided with a crystal plate clamping cylinder (28).

6. The fully automatic film-to-carrier sorting machine according to claim 1, characterized in that: The transfer table (4) comprises a second XY horizontal plane module (29), a support frame (30) is provided on the second XY horizontal plane module (29), a θ motor (31) and a carrier (32) are provided on the support frame (30), and the θ motor (31) is transmission-connected with the carrier (32).

7. The fully automatic film-to-carrier sorting machine according to claim 6, characterized in that: The top of the support frame (30) is provided with an extension part (33) extending horizontally, the carrier (32) is arranged on the extension part (33), and the θ motor (31) is connected to the carrier (32) through a belt drive.

8. The fully automatic film-to-carrier sorting machine according to claim 7, characterized in that: A fourth AOI camera (11) is also provided below the carrier (32), and the fourth AOI camera (11) is fixed on the support frame (30) or the whole machine platform (1).

9. The fully automatic film to carrier sorting machine according to claim 1, characterized in that: The strip table (6) comprises an XY movable table (34) for mounting a frame, on which a carrier platform (35) and a finished product carrier winding station (36) are arranged; a patch area is arranged on the upper side of one end of the carrier platform (35), and the patch area is provided with a carrier hole (37) for the carrier to pass through; a carrier outlet (39) is arranged at the other end of the carrier platform (35), and the carrier outlet (39) is connected to the finished product carrier winding station (36); a carrier motor (38) is arranged in the middle of the carrier platform (35), and a drive shaft of the carrier motor (38) extends into the carrier platform (35) and is provided with a pin wheel; the patch area is located within the working range of the second swing arm mechanism (5).

10. The fully automatic film-to-carrier sorting machine according to claim 9, characterized in that: The mounting frame XY movable platform (34) is also provided with a first tape sorting block (40) and a second tape sorting block (41); the first tape sorting block (40) is semicircular and is located above the carrier tape outlet (39); the second tape sorting block (41) is cylindrical and is located above the finished product carrier tape roll station (36).

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