Storage battery tab soldering flux dipping device

Abstract

The invention discloses a storage battery tab soldering flux dipping device, and relates to the technical field of storage battery production and processing. The device comprises a tank body for fixedly mounting a soldering flux dipping pad and a control system for controlling the lifting of a surface in the tank body; a partition plate with a rectangular opening is arranged at the top of the tank body, and the scaling powder dipping pad is installed at the rectangular opening. The soldering flux dipping pad is arranged above the tank body, the liquid level in the tank body is controlled by the control system to ascend and descend during use, so that the soldering flux dipping pad uniformly dips the soldering flux, and after the soldering flux dipping is completed, the liquid level of the soldering flux in the tank body is controlled to be separated from the bottom of the soldering flux dipping pad, so that the soldering flux dipping effect is improved. At the moment, the redundant soldering flux adsorbed in the infiltrated soldering flux dipping pad drops into the tank body, so that the tab of the storage battery is controlled to be inserted into the soldering flux dipping pad during use, and at the moment, the soldering flux adsorbed in the soldering flux dipping pad is uniformly coated on the tab.

Description

Technical Field

[0001] The invention belongs to the technical field of battery production and processing, and particularly relates to a battery tab soldering flux dipping device. Background Art

[0002] The battery plates are all equipped with tabs. In each pole group, the tabs of all positive pole plates are located on one side of the top surface of the pole group, and the tabs of all negative pole plates are located on the other side of the top surface of the pole group. The tabs of the same pole are connected in series by cast welding with the busbar; before cast welding the tabs, the tabs need to be dipped in flux.

[0003] However, the devices for dipping the solder flux used in the existing processes generally directly extend the tab into the dipping tank containing the solder flux to dip the solder flux. For example, the Chinese utility model patent with the authorization announcement number CN203956057U discloses a device for dipping the solder flux for the tab of a battery, comprising a fixed plate, a dipping groove is provided on the fixed plate, at least one liquid storage tank is provided on the fixed plate, and the liquid storage tank and the dipping groove are connected to each other through an overflow port provided on the top surface of the fixed plate.

[0004] Directly inserting the tab into the dipping tank containing flux to dip the flux has the following problems: 1. With use, the flux liquid level will change, resulting in differences in the amount of flux dipped on the tab, affecting the welding effect; 2. When dipping the flux, lead alloy debris from the tab or other parts of the plate falls into the dipping tank, contaminating the flux, and the depth of the pole group inserted into the flux is difficult to control. Once the pole group is inserted too deep, these debris may stick to the separator of the pole group, causing a short circuit, which ultimately affects the quality of the battery. Summary of the invention

[0005] The object of the present invention is to provide a battery tab flux dipping device, which is provided with a flux dipping pad above a tank body, and when in use, controls the liquid level in the tank body to rise and fall through a control system to complete the uniform dipping of the flux dipping pad into the flux, and after the flux dipping is completed, controls the flux liquid level in the tank body to separate from the bottom of the flux dipping pad, and at this time, the excess flux adsorbed in the infiltrated flux dipping pad drips into the tank body, thereby solving the problems raised by the existing background technology.

[0006] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0007] The present invention is a battery tab solder flux dipping device, comprising a trough body for fixing a solder flux dipping pad, and a control system for controlling the lifting of a page in the trough body; a partition with a rectangular opening is provided on the top of the trough body, and the solder flux dipping pad is installed at the rectangular opening; when in use, the control system controls the flux liquid level in the trough body to rise to the top of the liquid level higher than the top of the solder flux dipping pad, so as to achieve wetting of the solder flux dipping pad; after the solder flux dipping pad is wetting, the control system controls the solder flux liquid level in the trough body to drop to the bottom of the solder flux dipping pad where the liquid level is separated from the solder flux dipping pad, and at this time, the excess solder flux adsorbed in the wetting solder flux dipping pad drips into the trough body; a liquid level detection mechanism is provided in the trough body; the liquid level detection mechanism is connected to the control system.

[0008] Furthermore, the control system includes a plurality of telescopic structures A arranged on the bottom side of the trough body, the end of the telescopic structure A is connected to a containing trough with a water inlet hole at the bottom, the outer wall of the containing trough is provided with a sleeve that seals therewith, the top of the sleeve is provided with a protrusion protruding inward, and multiple groups of springs are connected between the protrusion and the end face of the containing trough.

[0009] Furthermore, the telescopic structure A is a telescopic cylinder, a telescopic motor, or the telescopic structure A comprises an inner sleeve rod and an outer sleeve that cooperate with each other, and an electromagnet A and a magnet A are respectively arranged on opposite sides of the inner sleeve rod and the outer sleeve.

[0010] Furthermore, the control system includes a movable groove connected to the bottom of the groove body through a hose, and the outer bottom side of the movable groove is connected to a telescopic structure B for driving its upward and downward movement, and the telescopic structure B is a telescopic cylinder or a telescopic motor.

[0011] Furthermore, the control system includes a convex edge A arranged on the inner bottom side of the slot body, and a movable block is arranged in the convex edge A with a gap formed between the circumferential side wall and the convex edge A; a magnet B is embedded in the movable block, and an electromagnet B is arranged on the inner bottom side of the slot body; and a through hole is arranged on the circumferential side of the bottom of the convex edge A.

[0012] Furthermore, the width of the gap is less than 1 mm, and the size of the through hole gradually decreases from the inside to the outside; a limiting boss is arranged inside the convex edge A above the through hole; the convex edge A below the limiting boss is connected to an air pressure balance pipe that runs through the trough body, and the end of the air pressure balance pipe is connected to the side wall of the trough body above the partition.

[0013] Furthermore, the control system includes an opening on the bottom side of the trough body, and an upwardly protruding convex edge B is provided on the inner bottom side of the trough body located on the peripheral side of the opening, and the convex edge B is provided with a movable plate that slides sealingly along its inner wall; at least two U-shaped frames are provided on the outer bottom side of the trough body, and a telescopic structure C is connected to the U-shaped frame, and the end of the telescopic structure C is connected to the bottom side of the movable plate, and the telescopic structure C uses a telescopic cylinder or a telescopic motor.

[0014] Furthermore, the bottom of the tank body is also connected with a feed pipe, and the feed pipe is connected with the flux storage tank through a pipeline with a valve.

[0015] Furthermore, the partition includes a water-permeable plate body, two rectangular holes are arranged on the water-permeable plate body, a substrate made of plastic or rubber material is installed on the inner wall of the rectangular hole, and the rectangular opening is opened at the substrate.

[0016] Furthermore, the flux dipping pad includes a porous bottom plate at the bottom, a sponge block is bonded and fixed to the upper surface of the porous bottom plate; a clamping block is arranged on the side wall of the porous bottom plate, and a clamping groove cooperating with the clamping block is arranged on the inner wall of the rectangular opening.

[0017] The present invention has the following beneficial effects:

[0018] The present invention provides a flux dipping pad above the tank body, and controls the liquid level in the tank body to rise and fall through a control system during use so that the flux dipping pad evenly dips the flux. After the flux dipping is completed, the flux liquid level in the tank body is controlled to separate from the bottom of the flux dipping pad, and at this time, excess flux adsorbed in the infiltrated flux dipping pad drips into the tank body. Then, when in use, the battery tab is controlled to be inserted into the flux dipping pad, and at this time, the flux absorbed in the flux dipping pad is evenly coated on the tab.

[0019] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0021] Figure 1 It is a schematic diagram of the structure of the soldering flux dipping device of the present invention;

[0022] Figure 2 The control system structure of the present invention is shown in FIG. Figure 1 ;

[0023] Figure 3 This is a schematic structural diagram of the telescopic structure A of the present invention;

[0024] Figure 4 The control system structure of the present invention is shown in FIG. Figure 2 ;

[0025] Figure 5 The control system structure of the present invention is shown in FIG. Figure 3 ;

[0026] Figure 6 The control system structure of the present invention is shown in FIG. Figure 4 ;

[0027] Figure 7 This is a schematic diagram of the partition structure of the present invention;

[0028] Figure 8 It is a schematic diagram of the structure of the flux dipping pad of the present invention. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "all around" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0031] See also Figure 1 As shown, the present invention is a battery tab flux dipping device, comprising a slot body 1 for fixing a flux dipping pad 22, and a control system for controlling the lifting of pages in the slot body 1; the control system is used to control the lifting of the flux liquid level in the slot body 1.

[0032] Specifically, in order to facilitate the installation of the flux dipping pad 22 and to use the flux dipping pad 22 to evenly coat the flux on the tab; Figure 8In the present invention, a partition 2 with a rectangular opening 21 is arranged on the top of the trough body 1, and the flux dipping pad 22 includes a porous bottom plate 221 located at the bottom, and a sponge block 222 is bonded and fixed to the upper surface of the porous bottom plate 221; a clamping block 223 is arranged on the side wall of the porous bottom plate 221, and a clamping groove matched with the clamping block 223 is arranged on the inner wall of the rectangular opening 21; and then when in use, the flux dipping pad 22 is installed at the rectangular opening 21 through the cooperation of the clamping block 223 and the clamping groove.

[0033] Furthermore, in the above, when the control system controls the flux liquid level in the tank body 1 to rise to the point where the top of the liquid level is higher than the top of the flux dipping pad 22, the flux dipping pad 22 is wetting; after the wetting of the flux dipping pad 22 is completed, the control system controls the flux liquid level in the tank body 1 to drop to the point where the liquid level is separated from the bottom of the flux dipping pad 22, and at this time, the excess flux adsorbed in the wetting flux dipping pad 22 drips into the tank body 1.

[0034] Based on the above, when the flux liquid level rises to the point where the top of the liquid level is higher than the top of the flux dipping pad 22, the flux liquid level is higher than the upper surface of the partition 2. In order to facilitate the flux immersed in the upper surface of the partition 2 to flow back into the tank body 1, Figure 7 The partition 2 provided by the present invention includes a water-permeable plate body 200, on which two rectangular holes 201 are arranged, and a substrate 202 made of plastic or rubber material is installed on the inner wall of the rectangular hole 201. The rectangular opening 21 is opened at the substrate 202, and a water-absorbent cotton cloth layer is fixed on the upper surface of the substrate 202 and the water-permeable plate body 200.

[0035] In order to facilitate the control of the soldering flux liquid level, a liquid level detection mechanism is provided in the tank body 1; and the liquid level detection mechanism is connected to the control system.

[0036] Based on the above requirements, in order to facilitate the control of the liquid level of the tank body 1 to rise and fall during use, the present invention provides the following several possible implementation methods.

[0037] Method 1: If Figure 2The control system includes a plurality of telescopic structures A30 arranged on the inner bottom side of the tank body 1, the end of the telescopic structure A30 is connected to a containing tank 3 with a water inlet hole arranged at the bottom, the outer wall of the containing tank 3 is provided with a sleeve 31 which is sealed with it, the top of the sleeve 31 is provided with a protrusion protruding inward, and a plurality of groups of springs are connected between the protrusion and the end face of the containing tank 3; and when in use; when the telescopic structure A30 is controlled to extend, the containing tank 3 and the sleeve 31 move upward at the same time, until the end face of the sleeve 31 abuts against the bottom side of the partition 2, and this When the telescopic structure A30 is controlled to continue to extend, the containing tank 3 continues to rise, and then most of the flux located in the containing tank 3 and the sleeve 31 flows upward from the rectangular opening 21 to the wetting flux dipping pad 22, and a small amount of flux flows back to the tank body 1 through the water inlet hole; at the same time, after the wetting flux dipping pad 22 is completed, the control system controls the flux liquid level in the tank body 1 to drop to the bottom of the flux dipping pad 22 when the liquid level is separated from the bottom of the flux dipping pad 22, and the excess flux adsorbed in the wetting flux dipping pad 22 drips into the tank body 1.

[0038] Specifically, the telescopic structure A30 uses a telescopic cylinder and a telescopic motor.

[0039] or Figure 3 The telescopic structure A30 includes an inner sleeve rod 302 and an outer sleeve 301 that cooperate with each other, and an electromagnet A303 and a magnet A304 are respectively arranged on the opposite sides of the inner sleeve rod 302 and the outer sleeve 301; when it is necessary to control the telescopic structure A30 to extend during use, the electromagnet A303 is energized, and the electromagnet A303 and the magnet A304 produce a repulsive effect; conversely, when it is necessary to control the telescopic structure A30 to contract, the electromagnet A303 is de-energized, and the electromagnet A303 and the magnet A304 produce an attractive effect.

[0040] Method 2: If Figure 4 The control system includes a movable groove 4 connected to the bottom of the groove body 1 through a hose 41, and the outer bottom side of the movable groove 4 is connected to a telescopic structure B42 for driving it to move up and down. The telescopic structure B42 uses a telescopic cylinder or a telescopic motor; when in use, the movable groove 4 is connected to the groove body 1 and the connecting device is separated to achieve the adjustment of the flux liquid level in the groove body 1 by controlling the movable groove 4 to move up and down.

[0041] Method 3: If Figure 5The control system includes a convex edge A16 arranged on the inner bottom side of the tank body 1, and a movable block 163 with a gap formed between the circumferential side wall and the convex edge A16 is arranged in the convex edge A16; a magnet B is embedded in the movable block 163, and an electromagnet B is arranged on the inner bottom side of the tank body 1; a through hole 161 is arranged on the bottom circumferential side of the convex edge A16, and then when in use, the liquid level in the tank body 1 is adjusted by controlling the movable block 163 to move up and down; when in use, when it is necessary to control the movable block 163 to move upward, the electromagnet B is controlled to be energized, and at this time, the electromagnet B and the magnet B produce a repulsive effect; conversely, when it is necessary to control the movable block 163 to move downward, the electromagnet B is controlled to be de-energized, and at this time, the electromagnet B and the magnet B produce an attractive effect; and in the whole process, the liquid level of the tank body 1 is higher than the end face of the convex edge A16.

[0042] Specifically, in order to facilitate the control of the upward and downward movement of the movable block 163, avoid the inability to control the upward and downward movement of the movable block 163 due to air pressure, and avoid excessive flux flowing into the convex edge A16 below the movable block 163 when the movable block 163 moves upward; the width of the gap designed by the present invention is 0.03mm; and a limiting boss 162 is arranged in the convex edge A16 above the through hole 161; the convex edge A16 below the limiting boss 162 is connected to the air pressure balance pipe 17 that passes through the slot body 1, and the end of the air pressure balance pipe 17 is connected to the side wall of the slot body 1 above the partition 2, and then when in use, the setting of the air pressure balance pipe 17 is utilized, and when in use, the air pressure inside the convex edge A16 below the movable block 163 can be kept equivalent to the ambient air pressure, thereby facilitating the control of the upward and downward movement of the movable block 163; and the size of the through hole 161 gradually decreases from the inside to the outside, and the diameters at both ends of the through hole 161 are 0.1cm and 0.15cm respectively.

[0043] Method 4: If Figure 6 The control system includes an opening 11 on the bottom side of the tank body 1, and an upwardly protruding convex edge B12 is provided on the inner bottom side of the tank body 1 located around the opening 11, and a movable plate 13 is provided on the convex edge B12 to seal and slide along its inner wall; at least two U-shaped frames 14 are provided on the outer bottom side of the tank body 1, and a telescopic structure C15 is connected to the U-shaped frame 14, and the end of the telescopic structure C15 is connected to the bottom side of the movable plate 13. The telescopic structure C15 uses a telescopic cylinder or a telescopic motor. When in use, the liquid level in the tank body 1 is controlled by controlling the extension and contraction of the telescopic structure C15. During the whole process, the liquid level of the tank body 1 is higher than the end surface of the convex edge B12.

[0044] In the above, in order to replenish the soldering flux into the tank body 1 in time, a feed pipe 10 is also connected to the bottom of the tank body 1, and the feed pipe 10 is connected to the soldering flux storage tank through a pipeline with a valve.

[0045] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0046] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A battery tab soldering flux dipping device, characterized in that: It comprises a trough body (1) for fixing and installing a solder flux dipping pad (22); a partition plate (2) having a rectangular opening (21) is arranged on the top of the trough body (1), and the solder flux dipping pad (22) is installed at the rectangular opening (21); It also includes a control system for controlling the lifting and lowering of pages in the tank body (1); When in use, the control system is used to control the flux liquid level in the tank body (1) to rise until the top of the liquid level is higher than the top of the flux dipping pad (22), thereby wetting the flux dipping pad (22); after wetting the flux dipping pad (22), the control system is used to control the flux liquid level in the tank body (1) to drop until the liquid level is separated from the bottom of the flux dipping pad (22), and at this time, excess flux adsorbed in the wetting flux dipping pad (22) drips into the tank body (1); A liquid level detection mechanism is arranged in the tank body (1); the liquid level detection mechanism is connected to a control system.

2. A battery tab soldering flux dipping device according to claim 1, characterized in that: The control system comprises a plurality of telescopic structures A (30) arranged on the inner bottom side of the tank body (1); the ends of the telescopic structures A (30) are connected to a containing tank (3) having a water inlet hole arranged at the bottom; the outer side wall of the containing tank (3) is provided with a sleeve (31) which is sealed with the containing tank; the top of the sleeve (31) is provided with a protruding portion protruding inwardly; and a plurality of groups of springs are connected between the protruding portion and the end surface of the containing tank (3).

3. A battery tab soldering flux dipping device according to claim 2, characterized in that: The telescopic structure A (30) is a telescopic cylinder, a telescopic motor, or the telescopic structure A (30) includes an inner sleeve rod (302) and an outer sleeve (301) that cooperate with each other, and the electromagnet A (303) and the magnet A (304) are respectively arranged on the opposite sides of the inner sleeve rod (302) and the outer sleeve (301).

4. A battery tab soldering flux dipping device according to claim 1, characterized in that: The control system comprises a movable groove (4) connected to the bottom of the groove body (1) through a hose (41); the outer bottom side of the movable groove (4) is connected to a telescopic structure B (42) for driving the movable groove to move up and down; the telescopic structure B (42) is a telescopic cylinder or a telescopic motor.

5. The battery tab soldering flux dipping device according to claim 1, characterized in that: The control system comprises a convex edge A (16) arranged on the inner bottom side of the tank body (1), wherein a movable block (163) is arranged inside the convex edge A (16) and a gap is formed between the peripheral side wall and the convex edge A (16); The movable block (163) is embedded with a magnet B, and the inner bottom side surface of the slot body (1) is provided with an electromagnet B; and the bottom peripheral side of the convex edge A (16) is provided with a through hole (161).

6. A battery tab soldering flux dipping device according to claim 5, characterized in that: The width of the gap is less than 1 mm, and the size of the through hole (161) gradually decreases from the inside to the outside; a limiting boss (162) is provided inside the convex edge A (16) above the through hole (161); The convex edge A (16) located below the limiting boss (162) is connected to an air pressure balance pipe (17) that passes through the tank body (1), and the end of the air pressure balance pipe (17) is connected to the side wall of the tank body (1) located above the partition (2).

7. A battery tab soldering flux dipping device according to claim 1, characterized in that: The control system comprises an opening (11) formed on the bottom side of the tank body (1); an upwardly protruding convex edge B (12) is provided on the inner bottom side of the tank body (1) around the opening (11); and a movable plate (13) is provided on the convex edge B (12) which is sealed and slides along its inner wall; At least two U-shaped frames (14) are arranged on the outer bottom side of the trough body (1), and a telescopic structure C (15) is connected to the U-shaped frame (14). The end of the telescopic structure C (15) is connected to the bottom side of the movable plate (13), and the telescopic structure C (15) is a telescopic cylinder or a telescopic motor.

8. The battery tab soldering flux dipping device according to claim 1, characterized in that: The bottom of the tank body (1) is also connected to a feed pipe (10), and the feed pipe (10) is connected to a soldering flux storage tank through a pipeline with a valve.

9. The battery tab soldering flux dipping device according to claim 1, characterized in that: The partition (2) comprises a water-permeable plate body (200), two rectangular holes (201) are arranged on the water-permeable plate body (200), a substrate (202) made of plastic or rubber material is installed on the inner wall of the rectangular hole (201), and the rectangular opening (21) is opened at the substrate (202).

10. The battery tab soldering flux dipping device according to claim 1, characterized in that: The solder flux dipping pad (22) comprises a porous bottom plate (221) located at the bottom, a sponge block (222) being bonded and fixed to the upper surface of the porous bottom plate (221); a clamping block (223) is arranged on the peripheral side wall of the porous bottom plate (221), and a clamping groove cooperating with the clamping block (223) is arranged on the inner wall of the rectangular opening (21).

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