A welding device for the PIN structure of an FPC connector

Abstract

The present application provides a welding device for the PIN pin structure of an FPC connector, and relates to the technical field of welding processing of a flexible circuit board. It includes a machine, a moving mechanism, a welding assembly, and a separation device; the moving mechanism is connected to the machine, the welding assembly and the separation device are both connected to the moving mechanism, the moving mechanism drives the welding assembly and the separation device to move in a three-dimensional space, and the welding assembly welds the PIN pin to the flexible circuit board; the separation device includes a supporting mechanism and a separation block, the supporting mechanism is connected to the moving mechanism, the separation block is connected to the supporting mechanism, and the separation block is used to abut against the flexible circuit board; the separation block and the supporting mechanism are both provided in multiple and one-to-one correspondence, and the welding assembly is located between adjacent separation blocks. The present application can reduce the bridging phenomenon of solder between adjacent PIN pins.

Description

Technical Field

[0001] The present application relates to the technical field of welding processing of flexible circuit boards, and in particular to welding equipment for a PIN structure of an FPC connector. Background Art

[0002] FPC connector is a connector based on flexible circuit board. The main feature of FPC connector is good flexibility and bendability, which enables them to be connected in different spaces and angles. They are highly adaptable and very suitable for use in miniaturized and highly integrated electronic devices. The main function of PIN pin is to realize the conductive transmission of electrical signals. PIN pin is inserted into the flexible circuit board and then fixed by welding.

[0003] Flexible circuit boards are highly favored in industrial product applications due to their excellent properties such as light weight, thin thickness, and free bending and folding. They are widely used in military, medical, aerospace, automotive, mobile devices, wearable devices, etc. For example, the FPC connector PIN structure is used in the electronic power-assisted braking system controller of the car. The electronic power-assisted braking system controller is a device used in modern cars to enhance the braking effect. It assists the driver in applying braking force through electronic signal control, making the braking process safer, more efficient and comfortable.

[0004] refer to Figure 1 In the related art, the PIN pin structure of the FPC connector includes a flexible circuit board 1, a connector and a PIN pin 2. The flexible circuit board 1 includes a copper layer 11, a substrate layer 12 and a reinforcement layer 13 connected in sequence. The flexible circuit board 1 is provided with a through hole. The connector is electrically connected to the PIN pin 2. The PIN pin 2 passes through the through hole. The selective wave soldering equipment is used to solder the PIN pin 2 in the through hole through solder, thereby forming the PIN pin structure of the FPC connector. The selective wave soldering equipment includes a flux spraying system, a preheating module, a soldering equipment, a circuit board conveying system and a cooling system. When soldering the flexible circuit board 1 and the PIN pin 2, the circuit board conveying system is usually used to transport the flexible circuit board. The flexible circuit board is first sprayed with flux by the flux spraying system, and then heated by the preheating module and enters the soldering equipment. The selective wave soldering technology is used for soldering, and then the selective wave soldering technology is used for soldering, and then the selective wave soldering technology is used for cooling.

[0005] However, for related technologies, the selective wave soldering equipment flows the solder upward, allowing the solder to enter the through-holes of the flexible circuit board, and at the same time, part of the solder will remain on the surface of the copper layer, forming solder joints between the copper layer and the PIN pins. When the selective wave soldering equipment continuously solders adjacent PIN pins, bridging of adjacent solder joints is likely to occur, and the bridging position needs to be interrupted later, which affects the working efficiency of the selective wave soldering equipment. Summary of the invention

[0006] In order to reduce the bridging phenomenon of solder between adjacent PIN pins, the present application provides a welding device for a PIN pin structure of an FPC connector.

[0007] The present application provides a welding device for a PIN pin structure of an FPC connector, comprising a machine platform, a moving mechanism, a welding assembly and a separating device; the moving mechanism is connected to the machine platform, the welding assembly and the separating device are both connected to the moving mechanism, the moving mechanism drives the welding assembly and the separating device to move in a three-dimensional space, and the welding assembly welds the PIN pin to a flexible circuit board;

[0008] The partition device includes a supporting mechanism and a partition block, wherein the supporting mechanism is connected to the moving mechanism, and the partition block is connected to the supporting mechanism, and the partition block is used to abut against the flexible circuit board; the partition blocks and the supporting mechanism are both provided in multiple and one-to-one correspondence, and the welding assembly is located between adjacent partition blocks.

[0009] By adopting the above technical solution, the moving mechanism drives the welding assembly and the separation device to approach the flexible circuit board, and the welding assembly welds the PIN pin in the through hole. The separation block abuts against the flexible circuit board, effectively reducing the solder bridging phenomenon between adjacent PIN pins and improving welding reliability. The welding assembly is between adjacent separation blocks, and the adjacent separation blocks can limit the diffusion range of the solder on the copper layer, and can effectively separate the solder at each through hole, reduce the occurrence of solder bridging phenomenon, and improve welding quality and reliability.

[0010] Optionally, the support mechanism includes a support seat, a sliding block, a support rod and a spacing adjustment assembly, the support seat is connected to the moving mechanism, the sliding block is slidably connected to the support seat, and the support rod is respectively connected to the sliding block and the dividing block; the spacing adjustment assembly is connected to the support seat, and the spacing adjustment assembly is used to adjust the spacing between adjacent dividing blocks.

[0011] By adopting the above technical solution, the spacing adjustment component adjusts the spacing between adjacent separation blocks, which can adapt to flexible circuit boards with through holes of different spacing specifications, thereby improving the applicability and flexibility of the equipment.

[0012] Optionally, the spacing adjustment assembly includes a rotational drive source and a screw, the screw is rotatably connected to the support seat, the screw is provided with two threaded segments with opposite rotation directions, the threaded segments of the screw are threadedly connected to the sliding block and correspond one to one; the rotational drive source is connected to the support seat, and the rotational drive source drives the screw to rotate.

[0013] By adopting the above technical solution, the rotating driving source drives the screw to rotate, and the two threaded sections of the screw with opposite rotation directions can drive adjacent sliding blocks to move closer to or away from each other, thereby adjusting the spacing between adjacent sliding blocks, and then adjusting the spacing between adjacent dividing blocks to adapt to flexible circuit boards with through holes with different spacing specifications.

[0014] Optionally, a suction hole is opened on a side of the partition block close to the flexible circuit board, and the partition block is connected to a suction tube, which is connected to the suction hole; the suction tube is externally connected to a negative pressure air source so that the suction tube absorbs excess solder from the suction hole.

[0015] By adopting the above technical solution, the suction tube is connected to the suction hole and connected to an external negative pressure gas source. When the solder penetrates between the partition block and the flexible circuit board, the suction tube absorbs excess solder from the suction hole to reduce the bridging phenomenon of adjacent solders. In addition, negative pressure is generated at the suction hole, so that the partition block and the flexible circuit board fit more closely, reducing the situation where the solder penetrates between the partition block and the flexible circuit board, and further reducing the bridging phenomenon of adjacent solders.

[0016] Optionally, a shooting and identifying device is provided on the mobile mechanism, and the shooting and identifying device includes a support plate and a camera mechanism; the support plate is connected to the mobile mechanism, and the camera mechanism is connected to the support plate;

[0017] After welding, the moving mechanism moves the partition device away from the flexible circuit board, so that the partition block moves away from the flexible circuit board to form a partition area on the flexible circuit board; the camera mechanism captures an image of the partition area, so that the camera mechanism is used to identify whether there is residual solder on the surface of the partition area.

[0018] By adopting the above technical solution, after the partition block is separated from the flexible circuit board, the camera mechanism captures the image of the partition area on the flexible circuit board. The camera mechanism can detect whether there is solder residue on the surface of the partition area so that it can be remedied or scrapped in time.

[0019] In summary, the present application includes at least one of the following beneficial effects:

[0020] 1. The moving mechanism drives the welding assembly and the separation device close to the flexible circuit board. The welding assembly welds the PIN pin into the through hole, and the separation block abuts against the flexible circuit board, so that the solder is not easy to enter between the separation block and the flexible circuit board, effectively reducing the solder bridging phenomenon between adjacent PIN pins and improving welding reliability;

[0021] 2. When the solder penetrates between the partition block and the flexible circuit board, the suction tube absorbs excess solder from the suction hole to reduce the bridging phenomenon of adjacent solders; and negative pressure is generated at the suction hole, so that the partition block and the flexible circuit board fit more closely, reducing the solder from penetrating between the partition block and the flexible circuit board, and further reducing the bridging phenomenon of adjacent solders;

[0022] 3. After the partition block is separated from the flexible circuit board, the camera mechanism captures the image of the partition area on the flexible circuit board. The camera mechanism can detect whether there is solder residue on the surface of the partition area so that it can be remedied or scrapped in time. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the PIN structure of an FPC connector in the related art;

[0024] Figure 2 It is a structural schematic diagram of a welding device for a PIN needle structure of an FPC connector according to an embodiment of the present application;

[0025] Figure 3 It is a schematic diagram of the structure of the welding assembly, the separation device and the shooting and identification device in the embodiment of the present application.

[0026] Explanation of the reference numerals: 1. flexible circuit board; 11. copper layer; 12. base material layer; 13. reinforcement layer; 2. PIN needle; 3. machine; 4. welding assembly; 41. jet pipe; 42. accommodating cylinder; 5. partition device; 51. supporting mechanism; 511. supporting seat; 512. sliding block; 513. supporting rod; 514. spacing adjustment assembly; 5141. rotating driving source; 5142. screw; 52. partition block; 53. suction tube; 6. shooting and identification device; 61. supporting plate; 62. camera mechanism; 7. moving mechanism. DETAILED DESCRIPTION

[0027] The following combination Figures 2 to 3 This application is described in further detail.

[0028] An embodiment of the present application provides a welding device for a PIN structure of an FPC connector.

[0029] refer to Figure 2 and Figure 3The welding equipment of the PIN structure of the FPC connector includes a machine 3, a moving mechanism 7, a welding assembly 4 and a separating device 5. In this embodiment, the moving mechanism 7 specifically adopts a three-axis moving module, the body of the moving mechanism 7 is fixedly connected to the machine 3, and the moving mechanism 7 has a moving end, and the moving end of the moving mechanism 7 can move in three directions of the X axis, the Y axis and the Z axis in three-dimensional space. The welding assembly 4 and the separating device 5 are both arranged on the moving end of the moving mechanism 7, and the moving mechanism 7 can drive the welding assembly 4 and the separating device 5 to move in three-dimensional space.

[0030] refer to Figure 2 and Figure 3 The welding assembly 4 includes a jet pipe 41 and a receiving cylinder 42. The receiving cylinder 42 is fixedly connected to the moving end of the moving mechanism 7, and the jet pipe 41 is fixedly connected to the receiving cylinder 42. The jet pipe 41 can slowly spray liquid tin upward, and the sprayed liquid tin falls back into the receiving cylinder 42 for collection. When the FPC connector PIN needle 2 structure is transported to the top of the welding assembly 4, the moving mechanism 7 drives the welding assembly 4 close to the PIN needle 2, and the jet pipe 41 allows the liquid tin to flow into the through hole of the flexible circuit board 1 as solder, thereby soldering the PIN needle 2 in the through hole.

[0031] refer to Figure 2 and Figure 3 , the partition device 5 includes a supporting mechanism 51, a partition block 52 and a suction tube 53. The supporting mechanism 51 includes a supporting seat 511, a sliding block 512, a support rod 513 and a spacing adjustment component 514. The supporting seat 511 is fixedly connected to the moving end of the moving mechanism 7, the sliding block 512 is slidably connected to the supporting seat 511, the support rod 513 is fixedly connected to the supporting seat 511, and the partition block 52 is fixedly connected to the support rod 513. There are two partition blocks 52, and the jet tube 41 is located between the two partition blocks 52. There are two sliding blocks 512 and two support rods 513, and the two sliding blocks 512 correspond to the two partition blocks 52. The moving mechanism 7 drives the partition device 5 to approach the flexible circuit board 1, so that the partition block 52 abuts against the copper layer 11, and the partition block 52 is conducive to separating the solder between adjacent PIN needles 2.

[0032] refer to Figure 2 and Figure 3The spacing adjustment component 514 includes a rotation drive source 5141 and a screw 5142. The rotation drive source 5141 is specifically a motor. The rotation drive source 5141 is fixedly connected to the support seat 511, and the screw 5142 is rotationally connected to the support seat 511. The rotation drive source 5141 drives the screw 5142 to rotate. The screw 5142 passes through two sliding blocks 512. The screw 5142 is provided with two thread segments with opposite rotation directions. The two sliding blocks 512 correspond to the two thread segments one by one and are threadedly connected. Start the rotation drive source 5141, the rotation drive source 5141 drives the screw 5142 to rotate, so that the two sliding blocks 512 are close to or away from each other, and then the two separation blocks 52 are close to or away from each other, that is, the spacing between adjacent separation blocks 52 is adjusted to adapt to the flexible circuit board 1 with through holes of different spacing specifications.

[0033] refer to Figure 2 and Figure 3 The top wall of the partition block 52 is provided with a suction hole, the suction tube 53 is connected to the partition block 52, the suction tube 53 is communicated with the suction hole, and the suction tube 53 is externally connected to a negative pressure gas source, so that negative pressure is generated on the top side of the partition block 52, which is conducive to the partition block 52 being close to the copper layer 11. The solder on both sides of the copper layer 11 may penetrate into the space between the copper layer 11 and the partition block 52 in small amounts due to capillary action and surface tension of the solder, and the suction tube 53 draws away the excess solder from the suction hole.

[0034] refer to Figure 2 and Figure 3 The mobile end of the mobile mechanism 7 is provided with a shooting and identifying device 6, which includes a support plate 61 and a camera mechanism 62. The support plate 61 and the mobile end of the mobile mechanism 7 are fixedly connected, and the camera mechanism 62 is fixedly connected to the support plate 61. After welding is completed, the mobile mechanism 7 moves the partition device 5 away from the flexible circuit board 1, so that the partition block 52 moves away from the copper layer 11 to form a partition area on the copper layer 11. There is solder on the peripheral side of the partition area of ​​the copper layer 11, and there should be no solder in the partition area of ​​the copper layer 11. The camera mechanism 62 captures the image of the partition area and compares it with the standard image, so as to identify whether there is excess solder remaining on the surface of the partition area, so as to facilitate timely remediation or scrapping.

[0035] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A welding device for a PIN structure of an FPC connector, characterized in that: The device comprises a machine platform (3), a moving mechanism (7), a welding assembly (4) and a separating device (5); the moving mechanism (7) is connected to the machine platform (3), the welding assembly (4) and the separating device (5) are both connected to the moving mechanism (7), the moving mechanism (7) drives the welding assembly (4) and the separating device (5) to move in a three-dimensional space, and the welding assembly (4) welds the PIN needle (2) to the flexible circuit board (1); The partition device (5) comprises a support mechanism (51) and a partition block (52); the support mechanism (51) is connected to the moving mechanism (7); the partition block (52) is connected to the support mechanism (51); the partition block (52) is used to abut against the flexible circuit board (1); a plurality of the partition blocks (52) and the support mechanism (51) are provided and correspond to each other one by one; the welding assembly (4) is located between adjacent partition blocks (52); The support mechanism (51) comprises a support seat (511), a sliding block (512), a support rod (513) and a spacing adjustment component (514); the support seat (511) is connected to the moving mechanism (7); the sliding block (512) is slidably connected to the support seat (511); the support rod (513) is respectively connected to the sliding block (512) and the partition block (52); the spacing adjustment component (514) is connected to the support seat (511); and the spacing adjustment component (514) is used to adjust the spacing between adjacent partition blocks (52); A suction hole is provided on a side of the partition block (52) close to the flexible circuit board (1); the partition block (52) is connected to a suction tube (53), and the suction tube (53) is in communication with the suction hole; the suction tube (53) is externally connected to a negative pressure gas source, so that the suction tube (53) sucks excess solder from the suction hole; negative pressure is generated at the suction hole, so that the partition block (52) and the flexible circuit board (1) are closely attached.

2. The welding equipment of the PIN structure of the FPC connector according to claim 1, characterized in that: The spacing adjustment component (514) comprises a rotational drive source (5141) and a screw (5142); the screw (5142) is rotationally connected to the support seat (511); the screw (5142) is provided with two threaded sections with opposite rotation directions; the threaded sections of the screw (5142) are threadedly connected to the sliding block (512) and correspond one to one; the rotational drive source (5141) is connected to the support seat (511); the rotational drive source (5141) drives the screw (5142) to rotate.

3. The welding equipment of the PIN structure of the FPC connector according to claim 1, characterized in that: The mobile mechanism (7) is provided with a photographing and identifying device (6), and the photographing and identifying device (6) comprises a support plate (61) and a photographing mechanism (62); the support plate (61) is connected to the mobile mechanism (7), and the photographing mechanism (62) is connected to the support plate (61); After soldering, the moving mechanism (7) moves the partition device (5) away from the flexible circuit board (1), so that the partition block (52) moves away from the flexible circuit board (1) to form a partition area on the flexible circuit board (1); and the camera mechanism (62) captures an image of the partition area, so that the camera mechanism (62) is used to identify whether solder remains on the surface of the partition area.

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