Laser wire stripping equipment and method

Abstract

The invention discloses a laser wire stripping device and method, and the device comprises a first bottom plate and a second bottom plate which are arranged in parallel at an interval, and the second bottom plate is provided with a first optical structure assembly and a third optical structure assembly which can move in the Z-axis direction. A second optical structure assembly and a fourth optical structure assembly which can move in the Z-axis direction are arranged on the first bottom plate, the first optical structure assembly and the second optical structure assembly are arranged in a mirror symmetry mode, and each of the first optical structure assembly and the third optical structure assembly comprises a CO2 laser, a CO2 beam expander, a CO2 galvanometer and a CO2 field lens. The third optical structure assembly and the fourth optical structure assembly are arranged in a mirror symmetry mode, and each of the third optical structure assembly and the fourth optical structure assembly comprises an ultraviolet laser, an ultraviolet beam expander, an ultraviolet galvanometer and an ultraviolet field lens. The method has the technical advantages of being easy and convenient to operate and high in universality.

Description

Technical Field

[0001] The invention belongs to the technical field of wire stripping equipment, and in particular relates to a laser wire stripping equipment and method. Background Art

[0002] With the rapid development of artificial intelligence technology, the market demand for high-speed cable transmission lines, as a key link for data transmission, has shown explosive growth. In particular, with the advent of super chips such as GB100 / 200, high-speed cable transmission lines supporting transmission rates of 100Gbps, 112Gbps, and 400Gbps have been developed one after another, and have been widely used in the stacking and grouping of short-distance QSFP devices. This technological breakthrough not only pushes high-speed cable transmission lines to the forefront of data centers, but also leads the field to a new peak, making it a new favorite in the market and attracting much attention.

[0003] Cable high-speed transmission lines usually adopt a multi-layer structure design, which includes a transparent or translucent Mylar layer, a smooth aluminum foil or copper foil shielding layer, a ground wire layer, a white PTFE anti-fracture layer, a FEP insulation layer, and a copper wire core layer from the outside to the inside. In the fields of computing, storage, and communications, cable high-speed transmission lines are mainly used to connect the I / O interfaces of different devices to achieve high-speed electrical signal transmission between devices. From a physical point of view, in order to achieve high-speed differential signal transmission, its structure has evolved from the early single-core coaxial cable to a dual-core coaxial cable. According to the ground wire distribution design, dual-core coaxial cables can be divided into two types: single ground wire (located between two insulating chips) and dual ground wire (distributed on both sides of the insulating core wire).

[0004] In practical applications, single-core coaxial cables and dual-core coaxial cables (including single-ground and dual-ground) are often combined and arranged to form high-speed transmission cables. However, during the processing, how to ensure the integrity and flatness of the metal shielding layer of the high-speed transmission cable while avoiding damage to other layer structures has become an important technical difficulty.

[0005] Existing technology usually uses traditional tools to process the metal shielding layer of the cable high-speed transmission line. Although this traditional tool processing technology can achieve the required accuracy, it is extremely expensive and easily causes ground wire damage. Although laser processing technology is an alternative, both high-power CO2 lasers and ultraviolet lasers have their own limitations. CO2 lasers are prone to material embrittlement and melting of the insulation layer, while ultraviolet lasers require a complex shielding fixture system, which not only increases costs, but also faces many problems such as fixture accuracy and service life, resulting in low production yields.

[0006] Therefore, it is urgent to develop a laser wire stripping device to realize the laser wire stripping processing of high-speed transmission lines with shielding layers of high-reflective materials. Summary of the invention

[0007] In view of the defects in the prior art, the present invention provides a laser wire stripping device and method, which has the technical advantages of simple and convenient operation and strong versatility.

[0008] The invention discloses a laser wire stripping device, comprising a first base plate and a second base plate which are arranged in parallel and spaced apart, wherein a first optical structure component and a third optical structure component which can be displaced in the Z-axis direction are arranged on the second base plate, and a second optical structure component and a fourth optical structure component which can be displaced in the Z-axis direction are arranged on the first base plate, wherein the first optical structure component and the second optical structure component are arranged in a mirror-symmetrical manner, wherein the first optical structure component and the third optical structure component both comprise a CO2 laser, a CO2 beam expander, a CO2 galvanometer and a CO2 field mirror, wherein the third optical structure component and the fourth optical structure component are arranged in a mirror-symmetrical manner, and wherein the third optical structure component and the fourth optical structure component both comprise an ultraviolet laser, an ultraviolet beam expander, an ultraviolet galvanometer and an ultraviolet field mirror.

[0009] In a preferred embodiment of the present invention, the first optical structure component and the third optical structure component both include a base displaceable along the Z-axis direction and a front vertical plate fixed to the base, the base is connected to a CO2 laser, the CO2 laser is connected to the CO2 beam expander, the front vertical plate is connected to a CO2 galvanometer, the CO2 field mirror is mounted on the CO2 galvanometer via a galvanometer adapter mechanism, and the central optical axis of the CO2 field mirror is perpendicular to the optical axis of the CO2 laser.

[0010] In a preferred embodiment of the present invention, the distance between the CO2 galvanometer and the CO2 beam expander is 200 mm.

[0011] In a preferred embodiment of the present invention, the third optical structure component and the fourth optical structure component both include a base displaceable along the Z-axis direction and a front vertical plate fixed to the base, the base is connected to a UV laser, the CO2 UV laser is connected to the UV beam expander, the front vertical plate is connected to a UV galvanometer, the UV field mirror is mounted on the UV galvanometer via a galvanometer adapter mechanism, and the central optical axis of the UV field mirror is perpendicular to the optical axis of the UV laser.

[0012] The distance between the ultraviolet galvanometer and the ultraviolet beam expander is 100 mm.

[0013] In a preferred embodiment of the present invention, a second adjustable lifting platform and a fourth adjustable lifting platform are arranged on the first base plate, a first adjustable lifting platform and a third adjustable lifting platform are arranged on the second base plate, a lifting end of the second adjustable lifting platform is connected to the second optical structure component, a lifting end of the fourth adjustable lifting platform is connected to the fourth optical structure component, a lifting end of the first adjustable lifting platform is connected to the first optical structure component, and a lifting end of the third adjustable lifting platform is connected to the third optical structure component.

[0014] The invention also discloses a laser wire stripping method, which uses a laser wire stripping device to process a cable high-speed transmission line.

[0015] In a preferred embodiment of the present invention, the cable high-speed transmission line includes a coaxially arranged multi-layer structure, and the cable high-speed transmission line includes a Mylar layer, a shielding layer, a ground wire layer, a PTFE winding layer, an insulation layer and a core wire layer from the outside to the inside, and the shielding layer is made of aluminum foil or copper foil.

[0016] In a preferred embodiment of the present invention, a cable high-speed transmission line composed of a single-core coaxial cable and a dual-core coaxial cable is placed on a jig and fixed by a jig cover to expose a high-reflective material shielding layer to be stripped; the jig with the cable high-speed transmission line installed is fixed on the equipment carrier plate; the height of the upper lifting platform is adjusted so that the two laser foci of the upper layer are located on the upper surface of the cable high-speed transmission line arrangement, and the height of the lower lifting platform is adjusted so that the two laser foci of the lower layer are located on the lower surface of the cable high-speed transmission line arrangement; the laser processing parameters, including laser speed and processing position, are set in the software so that the processing path of the CO2 laser coincides with the processing path of the ultraviolet laser, and the ultraviolet focus spot is located at the center of the CO2 focus spot, and the upper and lower four lights form a circular cutting of the same processing plane; the equipment is started, and the cutting of the high-reflective metal material shielding layer of the cable high-speed transmission line is completed in coordination with the galvanometer movement according to the set laser parameters.

[0017] In a preferred embodiment of the present invention, the high-speed transmission line of the cable is processed, and the light spot output by the CO2 laser is focused into a 0.1 mm light spot after passing through a beam expander, a galvanometer and a field lens, and its ellipticity is greater than 85%. The light spot output by the UV laser is focused into a 0.05 mm light spot after passing through a beam expander, a galvanometer and a field lens, and its ellipticity is greater than 95%.

[0018] The beneficial effects of the present invention are as follows: the present invention first innovatively designs a four-way laser optical path system with a vertically symmetrical arrangement, and realizes the circular cutting of high-speed copper cable transmission lines through the reasonable arrangement of two CO2 lasers and two ultraviolet lasers. In addition, the present invention also cleverly combines the powerful heat conversion ability of the CO2 laser and the molecular structure destruction characteristics of the ultraviolet laser on the metal reflective material, and fully utilizes the characteristic that the metal material's absorption rate of the ultraviolet laser increases geometrically when the temperature rises, thereby realizing efficient and precise cutting under low-power conditions.

[0019] Secondly, compared with the traditional tool processing method, the present invention completely avoids the problem of frequent tool replacement, eliminates the consumption of consumables, and overcomes the problem of multi-layer damage that may be caused by uneven force when the tool is cutting. More importantly, the present invention can complete the processing by only setting the adjustment parameters and the focus position. It is easy to operate, has strong versatility, and significantly improves production efficiency.

[0020] In addition, compared with the traditional solution of single CO2 laser (needing more than 50W) or single UV laser (needing more than 5W), the dual laser low-power cutting solution of the present invention has obvious advantages in incision quality, material protection, cost control and operation convenience, etc. It is particularly outstanding in incision burr control, avoiding material embrittlement and shedding, reducing the cost of shielding jigs and simplifying the difficulty of manual cycloid.

[0021] Finally, the present invention adopts low-power CO2 and ultraviolet lasers with high popularity and low price, and cooperates with the carefully designed optical path arrangement (including the specific galvanometer and beam expander distance setting) and the adjustable lifting platform structure, which not only ensures the processing accuracy and stability, but also has significant advantages in reducing production costs and saving energy consumption. At the same time, the processing scheme of the present invention is suitable for the stripping needs of various high-speed copper cable transmission lines, and fully meets the technical requirements of modern high-speed transmission line production. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments disclosed in the present invention, the drawings of the embodiments will be briefly introduced below. These drawings are only used for illustrative purposes and are not intended to limit the protection scope of the present invention.

[0023] Figure 1 The overall structural schematic diagram of the laser wire stripping device of the present invention;

[0024] Figure 2 A partial schematic diagram of the internal structure of the laser wire stripping device of the present invention;

[0025] Figure 3 A simplified diagram of the optical structure device lens of the laser wire stripping equipment of the present invention;

[0026] Figure 4 Optical path diagram of the optical structure device of the laser wire stripping equipment of the present invention;

[0027] Figure 5 Schematic diagram of a dual-core high-speed cable with ground wires on both sides of the present invention;

[0028] Figure 6 A schematic diagram of the process flow of high-speed transmission cable wire of the present invention;

[0029] Figure 7 Schematic diagram of the high-speed cable wiring product of the present invention

[0030] Figure 8 Schematic diagram of the scanning and cutting process of the high-reflective material shielding layer of the laser processing high-speed cable line arrangement of the present invention;

[0031] In the figure: 100-wire stripping equipment; 101-three-color lamp; 102-display; 103-industrial computer; 104-electric control box; 105-first bottom plate; 106-second bottom plate; 107-first adjustable lifting platform; 108-second adjustable lifting platform; 109-third adjustable lifting platform; 110-fourth adjustable lifting platform; 111-first optical structure component; 112-second optical structure component; 113-third optical structure component; 114-fourth optical structure component; 201-first CO2 laser; 202-second CO2 laser; 203-first ultraviolet laser; 204-second ultraviolet laser; 205-first CO2 beam expander; 206-second CO2 beam expander; 207-first ultraviolet beam expander; 208-second ultraviolet beam expander; 209-first CO 2 galvanometer; 210-second CO2 galvanometer; 211-first UV galvanometer; 212-second UV galvanometer; 213-second CO2 field mirror; 214-second UV field mirror; 215-fixture mounting base; 301-first CO2 laser beam; 302-second CO2 laser beam; 303-third UV laser beam, 304-fourth UV laser beam; 311-first CO2 field mirror; 312-first UV field mirror; 400-two-core cable with ground wires on both sides; 401-Mylar layer; 402-aluminum foil / copper foil shielding layer; 403-ground wire; 404-PTFE winding layer; 405-insulating layer; 406-core wire layer; 600-high-speed cable arrangement; 601-single-core high-speed cable; 602-two-core cable with ground wire in the middle; 603-high-speed cable arrangement fixing fixture. DETAILED DESCRIPTION

[0032] The technical solution of the present invention (including the preferred technical solution) is further described in detail below by means of the accompanying drawings and by listing some optional embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] Example 1

[0034] like Figure 1-5 As shown, the technical problems to be solved by the present invention are as follows: when processing aluminum foil and copper foil high-reflective material shielding layers, the shielding layers made of metal materials such as aluminum foil and copper foil with smooth surfaces are not cut smoothly, and the Mylar layer has obvious molten residue; the shielding layers of metal materials such as aluminum foil and copper foil with smooth surfaces are damaged and have burrs, and at the same time, the ground wire is damaged and the fourth layer of PTFE winding layer and the fifth layer of FEP insulation layer are burned, and the sixth layer of copper wire core layer is cut, resulting in processing defects and low yield.

[0035] In view of the above technical problems, the present invention provides a laser wire stripping device for high-speed transmission lines of shielding layers of high-reflective materials, which adopts two low-power lasers with different wavelengths as the laser cutting power source of aluminum foil and copper foil, which are shielding layers of high-reflective materials. It adopts an upper and lower galvanometer layout, and scans and cuts up and down. The upper optical path adopts a left and right galvanometer layout to combine low-power CO2 lasers and low-power ultraviolet lasers. A high-speed deflection motor is used to drive the lens, and the 10600 nanosecond CO2 laser and 355 ultraviolet laser of different wavelengths are integrated to cut at the same position. The shielding layer of metal materials such as aluminum foil and copper foil is cut in an annular manner up and down in coordination with the galvanometer scanning movement. The CO2 and ultraviolet lasers are automatically controlled by software to cut the shielding layer of metal materials such as aluminum foil and copper foil at the same time, which is beneficial to the powerful thermal conductivity of the CO2 laser. The conversion ability and ultraviolet light have a strong cutting characteristic of destroying the molecular structure of metal reflective materials. When the temperature of aluminum foil, copper foil and other metal materials rises, the absorption rate of ultraviolet laser increases geometrically. The purpose of cutting highly reflective aluminum foil, copper foil and other metal materials can be achieved with ultraviolet light of very small energy. In addition, when the ground wire does not heat up, the low-power energy density reaches the threshold value of not damaging the ground wire, and the shielding layer of highly reflective aluminum foil, copper foil and other metal materials can be cut without scalding the fourth layer of PTFE winding layer, the fifth layer of FEP insulation layer, and the sixth layer of copper wire core layer. Ultraviolet light is a cold light source, and low power has basically no reaction to the fourth layer of PTFE winding layer and the fifth layer of FEP insulation layer, and does not penetrate. At the same time, the shielding layer of highly reflective aluminum foil, copper foil and other metal materials is not damaged and has no burrs.

[0036] Specifically, in order to achieve efficient and accurate laser wire stripping function, the present invention provides a wire stripping device with multiple lasers working in coordination. First, from the overall structure, the device is mainly composed of two 10W CO2 lasers (201, 202) and two 3W ultraviolet lasers (203, 204) to form a laser system; in terms of the optical system, it is equipped with two CO2 galvanometers (209, 210) and two ultraviolet galvanometers (211, 212), two CO2 beam expanders (205, 206) and two ultraviolet beam expanders (207, 208), as well as two CO2 field mirrors (311, 213) and two ultraviolet field mirrors (312, 214); in addition, it also includes a complete control system, including an industrial computer, a display and its supporting control software system.

[0037] In terms of laser parameter configuration, the two 10W CO2 lasers (201, 202) are cooled by air cooling, with an operating wavelength of 10600 nanoseconds and a maximum average output power of 10-15W. The beam quality M2 factor of this type of laser does not exceed 1.2, and it is a continuous laser type, and the frequency can be adjusted in the range of 0Hz to 25KHz. In terms of stability, its power fluctuation is controlled within 5%, the maximum output spot size is 2.5 mm, and it has a beam ellipticity greater than 85%, while the beam divergence angle is less than 5 milliradians. Correspondingly, the two 3W ultraviolet lasers (203, 204) are equipped with their own circulating cooling system, with an operating wavelength between 350-360 nanoseconds and a maximum average output power of 3.4-3.8W. This ultraviolet laser also maintains a beam quality M2 factor of no more than 1.2, but it is a pulsed laser type, its frequency range can be adjusted between 20Hz and 150KHz, and it has better power stability, with fluctuations within only 2%. In addition, its optical pulse width is maintained between 10-15 nanoseconds, the maximum output spot size is 0.7 mm, and it has a beam ellipticity of more than 95%, and the beam divergence angle is controlled within 0.4 milliradians.

[0038] In terms of optical system configuration, the present invention adopts a precise three-level optical path design. First, the beam expander part, wherein the CO2 beam expander (205, 206) is composed of two concave-convex mirrors, can achieve 6 times collimation beam expansion, is made of zinc selenide material, has an incident lens diameter of 12 mm, a center thickness of 3 mm, and a light-emitting lens diameter of 20 mm, also maintaining a center thickness of 3 mm, and is coated on both sides with an anti-reflection film of 10600 nanometers. The ultraviolet beam expander (207, 208) is made of fused quartz material, and achieves 10 times collimation beam expansion through two concave-convex mirrors, has an incident lens diameter of 8 mm, and a light-emitting lens diameter of 18 mm, both of which maintain a center thickness of 3 mm, and are coated on both sides with an anti-reflection film of 350-360 nanometers.

[0039] In the design of the galvanometer system, the CO2 galvanometer (209, 210) has a light aperture of 14 mm, and is driven by two motors to form a square SIO2 lens with a diameter of 14 mm and a thickness of 2 mm. A single-sided 10600 nanosecond reflective dielectric film is coated on the surface of the lens, and its reflectivity is as high as more than 99.9%, which can achieve a precise movement of plus or minus 15 degrees on the X-axis and Y-axis. The corresponding UV galvanometer (211, 212) adopts a light aperture design of 14 mm, and is equipped with two motors to drive a square quartz lens with a diameter of 10 mm and a thickness of 1.5 mm. The surface of the lens is coated with a 300-500 nanosecond reflective dielectric film, which also maintains a reflectivity of more than 99.9%, and can also achieve a movement range of plus or minus 15 degrees on the X-axis and Y-axis.

[0040] In terms of field lens configuration, the CO2 field lens (311, 213) uses two concave-convex composite lens structures, with a format of 70 mm and a focal length of 100 mm. Zinc selenide is used as the basic material, and 10600 nanosecond anti-reflection film is coated on both sides to ensure a transmittance of more than 99.7%. The UV field lens (312, 214) uses a more complex structure, consisting of four concave-convex composite lenses and a flat protective lens, with a format of 100 mm and a focal length of 160 mm. It is made of fused quartz material and coated with 350-360 nanosecond anti-reflection film on both sides, and the transmittance can reach more than 99.9%.

[0041] In the installation configuration of the optical system, the equipment adopts a precise group installation scheme. The installation process of the first group of CO2 laser systems is as follows: first, fix the first CO2 laser (201) on the base of the first optical structure component (111), and then install the first CO2 beam expander (205) on it; then install the first CO2 galvanometer (209) on the front vertical plate of the first optical structure component (111), and ensure that the distance between the beam expander and the galvanometer is 200 mm; then install the first CO2 field lens (311) on the first CO2 galvanometer (209) through a special switching mechanism; finally, install the entire assembly on the first adjustable lifting platform (107), and fix the lifting platform on the second bottom plate (106).

[0042] The second CO2 laser system installs the second CO2 laser (202) on the base of the second optical structure component (112), installs the second CO2 beam expander (206) on the top, installs the second CO2 galvanometer (210) on the front vertical plate, and also maintains a spacing of 200 mm. The second CO2 field lens (213) is installed on the second CO2 galvanometer (210) through a switching mechanism. The whole is installed on a second adjustable lifting platform (108) and fixed on the first bottom plate (105).

[0043] For the ultraviolet laser system, the first group installs the first ultraviolet laser (203) on the base of the third optical structure component (113), installs the first ultraviolet beam expander (207) on the top, installs the first ultraviolet galvanometer (211) on the front vertical plate, maintains a spacing of 100 mm, and the first ultraviolet field mirror (312) is installed on the first ultraviolet galvanometer (211) through a switching mechanism. The entire assembly is installed on the third adjustable lifting platform (109) and fixed on the second bottom plate (106). The second group of ultraviolet laser systems installs the second ultraviolet laser (204) on the base of the fourth optical structure component (114), and is equipped with the second ultraviolet beam expander (208), the second ultraviolet galvanometer (212) and the second ultraviolet field mirror (214), and the entire assembly is installed on the fourth adjustable lifting platform (110), and finally fixed on the first bottom plate (105).

[0044] Through this precise design and installation configuration, the laser wire stripping equipment of the present invention can achieve high-precision and high-efficiency wire stripping operations, providing a reliable solution for different types of cable stripping needs. The CO2 laser spot focusing diameter can reach about 0.1 mm, and the focal depth is not less than 0.5 mm; the UV laser spot focusing diameter can reach about 0.05 mm, and the focal depth is not less than 0.2 mm, thereby ensuring the accuracy and stability of the wire stripping process. In addition, the main frame of the equipment is made of 20 mm thick stainless steel, which greatly ensures the stability and reliability of the entire system.

[0045] Example 2

[0046] This embodiment describes in detail the debugging process of the laser wire stripping equipment and its specific application in the stripping of high-speed copper cable transmission lines. The specific implementation steps are as follows:

[0047] 1. Equipment debugging preparation

[0048] First of all, the laser wire stripping equipment needs to be fully installed and debugged. Figure 1As shown, the optical system configuration of the device adopts a four-path laser light path design: the light beam emitted by the first CO2 laser (201) is modulated by a beam expander (205), a galvanometer (209) and a field lens (311) and finally focused into a light spot of 0.1 mm; the light beam generated by the first ultraviolet laser (203) is processed by a beam expander (207), a galvanometer (211) and a field lens (312) to form a focused light spot of 0.05 mm; the light beam of the second CO2 laser (202) is also modulated by a beam expander (206), a galvanometer (210) and a field lens (213) and focused into a light spot of 0.1 mm; the light beam of the second ultraviolet laser (204) is processed by a beam expander (208), a galvanometer (212) and a field lens (214) and finally focused into a light spot of 0.05 mm. When selecting a laser, special attention should be paid to controlling the circularity of the output light spot. The beam ellipticity of a CO2 laser is required to be greater than 85%, while the beam ellipticity of a UV laser needs to be greater than 95%.

[0049] 2. Specific operation steps

[0050] Step 1: Cable layout and fixation: Arrange various types of coaxial cables according to specific requirements: Single-core coaxial cables and dual-core coaxial cables are divided into two layout modes: single ground wire is located in the middle of the two insulated core wires; dual ground wires are distributed on both sides of the insulated core wires. Place the arranged high-speed copper cable transmission line on a special fixture and fix it with the cover of the fixture to ensure that the shielding layer of the high-reflective material is exposed to the outside for easy subsequent processing.

[0051] Step 2: Vehicle Installation

[0052] Place the completed cable layout and fixed jig properly on the carrier plate of the equipment and securely fix it to prepare for subsequent laser processing.

[0053] Step 3: Focus height adjustment

[0054] For precise height adjustment work:

[0055] Adjusting the heights of the first adjustable lifting platform (107) and the second adjustable lifting platform (108) to ensure that the focal points of the two upper lasers are precisely located on the upper surface of the high-speed copper cable transmission line arrangement;

[0056] The heights of the third adjustable lifting platform (109) and the fourth adjustable lifting platform (110) are adjusted so that the focal points of the two laser beams on the lower layer accurately fall on the lower surface of the high-speed copper cable transmission line arrangement.

[0057] Step 4: Parameter setting and path planning

[0058] The following settings are made in the control software: set the working parameters of the four lasers respectively; plan a detailed processing flow; set the appropriate laser movement speed; accurately configure the processing position parameters; ensure that the processing paths of the CO2 laser and the UV laser are accurately overlapped; adjust the UV laser focus spot to the center of the CO2 laser focus spot; calibrate the upper and lower four optical paths so that they are in the same processing plane to form a complete circular cutting trajectory

[0059] Step 5: Start processing

[0060] After completing the above preparations, start the equipment for automatic processing: the equipment starts running according to the pre-set parameters; the control system coordinates the work of each laser; the galvanometer system moves according to the planned trajectory; and the shielding layer of high-reflective metal materials such as aluminum foil and copper foil on the high-speed copper cable transmission line is accurately cut; through the precise implementation of the above five steps, high-quality stripping of high-speed copper cable transmission lines can be achieved, ensuring the accuracy and consistency of cutting. During the whole process, the four lasers work together to achieve efficient cutting of the cable shielding layer through precise optical path adjustment and parameter control.

[0061] like Figure 6 As shown, the process flow of the high-speed transmission line arrangement of the coaxial cable of the present invention is as follows: the first step: using laser to cut the first Mylar and the second layer of high-reflective material shielding layer; the second step: using a bending and drawing machine to bend and draw out the first and second Mylar and high-reflective material shielding layers. The third step: using laser to cut the fourth and fifth layers of winding and insulation layers; the fourth step: using a drawing machine to draw the fourth and fifth layers of winding and insulation layers; the fifth step, using laser to cut the sixth layer of core wire. The laser wire stripping equipment of the present invention solves the technical difficulty of cutting the first Mylar and the second layer of high-reflective material shielding layers in the process flow of the high-speed transmission line arrangement of the coaxial cable.

[0062] The fifth step of the process steps of the present invention adopts laser cutting, and its principle utilizes the characteristics of good stability, uniform energy, high energy, high efficiency and high precision of laser, adopts special cutting process and parameter control, and uses CO2 laser scanning to cut the wire. After the wire is initially heated to a certain temperature, a low-power ultraviolet laser is used to cut the same position. At the same time, the CO2 reduces the power to maintain the temperature of the wire cutting position until it is cut off, thereby cutting the aluminum foil and copper foil shielding layers of the high-reflective material.

[0063] After using the present invention, compared with the traditional tool method, there is no need to frequently replace the tool, no consumables, and the tool does not cut the third layer of ground wire. The processing cost is high. The cables are arranged inconsistently according to a certain rule composed of multiple single-core coaxial cables or multiple double-core coaxial cables. During the processing, the tool cutting is prone to uneven force. It is very easy to cut the fourth layer of PTFE winding layer when cutting the third layer of ground wire, and squeeze the fifth layer of FEP insulation layer and the sixth layer of copper wire core layer. In addition, there are many types, and different tools need to be replaced frequently. The tool cost is high, and the process of adjusting to the original accuracy and performance is slow, the speed is slow, and the time is long. The method of the present invention only needs to set the adjustment parameters and the focus position, and the operation is simple, convenient, and versatile.

[0064] Compared with other traditional laser processing methods, the present invention adopts two low-power lasers with different wavelengths as the energy source for laser cutting aluminum foil and copper foil, which are high-reflective material shielding layers. It adopts an upper and lower galvanometer layout for up and down scanning and cutting. The upper optical path adopts a left and right galvanometer layout to combine low-power CO2 lasers and low-power UV lasers. A high-speed deflection motor is used to drive the lens. The 10600 nanosecond CO2 laser and 355 UV laser with different wavelengths are integrated to cut the same position. The shielding layer of metal materials such as aluminum foil and copper foil is cut up and down in an annular manner in coordination with the galvanometer scanning movement. The software is used to automatically control the CO2 and UV lasers to cut the shielding layer of metal materials such as aluminum foil and copper foil at the same time, which is beneficial to the powerful thermal conversion ability of the CO2 laser and the strong cutting characteristics of UV to destroy the molecular structure of metal reflective materials. When the temperature of metal materials such as aluminum foil and copper foil rises, the absorption of UV laser is greatly improved. The yield increases geometrically. With very small energy of ultraviolet light, the purpose of cutting highly reflective aluminum foil, copper foil and other metal materials can be achieved. In addition, when the ground wire does not heat up, the low-power energy density reaches the threshold value of not damaging the ground wire, and the shielding layer of highly reflective aluminum foil, copper foil and other metal materials can be cut without scalding the fourth layer of PTFE winding layer, the fifth layer of FEP insulation layer, and the sixth layer of copper wire core layer. Ultraviolet light is a cold light source. Low power has basically no reaction to the fourth layer of PTFE winding layer and the fifth layer of FEP insulation layer, and does not penetrate. At the same time, the shielding layer of highly reflective aluminum foil, copper foil and other metal materials is not damaged and has no burrs. Compared with the single CO2 laser cutting method, the single CO2 laser cuts the aluminum foil of high-reflective materials. The copper foil shielding layer reaches the embrittlement requirement, and the power requirement must reach more than 50W. In addition, the incision burrs are serious after bending, basically reaching more than 0.2 mm. The greater the power. The coarser the spot, the coarser the cut, and the brittle material is easy to fall off, resulting in poor use in the later stage. Compared with the single UV laser cutting method, the UV laser cuts the aluminum foil of the high-reflective material and cuts off the copper foil shielding layer. The power requirement is basically above 5W, and the cut is basically burr-free. However, the shielding fixture is expensive, the manual pendulum is difficult, and the fourth layer of ground wire is often cut.

[0065] Compared with other laser processing modes, this process uses laser processing equipment, which uses low-power CO2 and ultraviolet lasers. Such lasers are widely used, very cheap, and simple to set up. It has fundamental advantages in reducing production costs and energy consumption.

[0066] Example 3

[0067] like Figure 7-8 As shown, this embodiment takes a certain 112G high-speed transmission line as an example. This line consists of 8 wires, including 2 single-core wires, 2 double-core wires with ground wires in the middle and 4 double-core high-speed copper cables with ground wires on both sides, with a thickness of 0.86 mm and a width of 15 mm.

[0068] The CO2 laser uses a 10W CO2 continuous air-cooled laser, model 48-1SAN, with a central wavelength of 10600 nanometers; the UV laser uses a 3W air-cooled laser, model FIT`-355-3-30-F, with a central wavelength of 355 nanometers

[0069] First, install and debug the laser wire stripping device 100, and install and debug the optical system of the laser wire stripping device.

[0070] The specific implementation steps are as follows:

[0071] The first step: Arrange different single-core coaxial cables and dual-core coaxial cables (single ground wire is located in the middle of two insulating chips and dual ground wires are distributed on both sides of the insulating core wires) together to form a high-speed copper cable transmission line 600 and place it on the fixture 604. Fix the cable arrangement through the cover plate on the fixture 604 to expose the shielding layer 402 and Mylar layer 401 of the high-reflective material to be stripped.

[0072] Step 2: Place the fixture 604 installed with the high-speed copper cable transmission line on the carrier base 215 of the device and fix the fixture 604.

[0073] Step 3: Adjust the height of the two upper lifting platforms 107 and 109 to ensure that the focus of the two upper lasers is on the upper surface of the high-speed copper cable transmission line 600, and adjust the height of the two lower lifting platforms 108 and 110 to ensure that the focus of the two lower lasers is on the lower surface of the high-speed copper cable transmission line 600.

[0074] Step 4: Set the first group of parameters of the first and second CO2 lasers, laser processing power is 8W, frequency is 20KHz, scanning speed of the galvanometer is 1200, number of back and forth times is 10 times, scanning length is 18 mm, the second group of parameters, laser processing power is 5W, frequency is 10KHz, scanning speed of the galvanometer is 1200, number of back and forth times is 12 times, set the third and fourth UV laser parameters, laser processing power is 1.5W, frequency is 30KHz, scanning speed of the galvanometer is 300, number of back and forth times is 3 times, scanning length is 18 mm, set the processing position in the software, ensure that the CO2 laser processing path coincides with the UV laser processing path, the UV focal spot is at the center of the CO2 focal spot, the upper and lower four-way light is in the same processing plane, forming a circular cut, edit the laser processing process, after the first group of parameters of the first and second CO2 lasers are processed at the same time, the second group of parameters of the first and second CO2 lasers and the third and fourth UV laser parameters are started at the same time to start the processing workflow.

[0075] Step 5: Start the machine. The machine sets the laser parameters of each channel, processing flow, laser speed, laser processing position according to the software, and cooperates with the movement of the galvanometer to complete the cutting of the shielding layer of high-reflective metal materials such as aluminum foil and copper foil of the high-speed copper cable transmission line.

[0076] Those skilled in the art will readily appreciate that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, combinations, replacements, improvements, etc. made within the spirit and principles of the present invention are included within the protection scope of the present invention.

Claims

1. A laser wire stripping device, characterized in that: The invention comprises a first base plate (105) and a second base plate (106) which are arranged in parallel and spaced apart. A first optical structure component (111) and a third optical structure component (113) which can be displaced in the Z-axis direction are arranged on the second base plate (106). A second optical structure component (112) and a fourth optical structure component (114) which can be displaced in the Z-axis direction are arranged on the first base plate (105). The first optical structure component (111) and the second optical structure component (112) are arranged in a mirror-symmetrical manner. The first optical structure component (111) and the third optical structure component (113) both comprise a CO2 laser, a CO2 beam expander, a CO2 galvanometer and a CO2 field lens. The third optical structure component (113) and the fourth optical structure component (114) are arranged in a mirror-symmetrical manner. The third optical structure component (113) and the fourth optical structure component (114) both comprise an ultraviolet laser, an ultraviolet beam expander, an ultraviolet galvanometer and an ultraviolet field lens.

2. A laser wire stripping device according to claim 1, characterized in that: The first optical structure component (111) and the third optical structure component (113) both comprise a base that can be displaced along the Z-axis direction and a front vertical plate fixed to the base, the base is connected to a CO2 laser, the CO2 laser is connected to the CO2 beam expander, the front vertical plate is connected to a CO2 galvanometer, the CO2 field mirror is mounted on the CO2 galvanometer via a galvanometer adapter mechanism, and the central optical axis of the CO2 field mirror is perpendicular to the optical axis of the CO2 laser.

3. A laser wire stripping device according to claim 2, characterized in that: The distance between the CO2 galvanometer and the CO2 beam expander is 200 mm.

4. The laser wire stripping device according to claim 1, characterized in that: The third optical structure component (113) and the fourth optical structure component (114) both include a base that can be displaced along the Z-axis direction and a front vertical plate fixed to the base, the base is connected to an ultraviolet laser, the CO2 ultraviolet laser is connected to the ultraviolet beam expander, the front vertical plate is connected to an ultraviolet galvanometer, the ultraviolet field mirror is installed on the ultraviolet galvanometer via a galvanometer adapter mechanism, and the central optical axis of the ultraviolet field mirror is perpendicular to the optical axis of the ultraviolet laser.

5. The laser wire stripping device according to claim 2, characterized in that: The distance between the ultraviolet galvanometer and the ultraviolet beam expander is 100 mm.

6. The laser wire stripping device according to claim 1, characterized in that: A second adjustable lifting platform (108) and a fourth adjustable lifting platform (110) are arranged on the first bottom plate (105); a first adjustable lifting platform (107) and a third adjustable lifting platform (109) are arranged on the second bottom plate (106); a lifting end of the second adjustable lifting platform (108) is connected to a second optical structure component (112); a lifting end of the fourth adjustable lifting platform (110) is connected to a fourth optical structure component (114); a lifting end of the first adjustable lifting platform (107) is connected to a first optical structure component (111); and a lifting end of the third adjustable lifting platform (109) is connected to a third optical structure component (113).

7. A laser wire stripping method, characterized in that: It uses the laser wire stripping equipment as described in any one of claims 1 to 6 to process cable high-speed transmission lines.

8. A laser wire stripping method according to claim 6, characterized in that: The cable high-speed transmission line comprises a coaxially arranged multi-layer structure, and the cable high-speed transmission line comprises, from the outside to the inside, a Mylar layer (401), a shielding layer (402), a ground layer (403), a PTFE winding layer (404), an insulating layer (405) and a core layer (406), wherein the shielding layer (402) is made of aluminum foil or copper foil.

9. A laser wire stripping method according to claim 8, characterized in that: The cable high-speed transmission line composed of a single-core coaxial cable and a dual-core coaxial cable is placed on the jig and fixed by the jig cover to expose the high-reflective material shielding layer to be stripped; the jig with the cable high-speed transmission line installed is fixed on the equipment carrier plate; the height of the upper lifting platform is adjusted so that the focus of the two upper lasers is located on the upper surface of the cable high-speed transmission line arrangement, and the height of the lower lifting platform is adjusted so that the focus of the two lower lasers is located on the lower surface of the cable high-speed transmission line arrangement; the laser processing parameters, including laser speed and processing position, are set in the software so that the processing path of the CO2 laser coincides with the processing path of the UV laser, and the UV focal spot is located at the center of the CO2 focal spot, and the upper and lower four-way light forms a circular cutting on the same processing plane; the equipment is started, and according to the set laser parameters, the galvanometer movement is used to complete the cutting of the high-reflective metal material shielding layer of the cable high-speed transmission line.

10. A laser wire stripping method according to claim 9, characterized in that: The processing cable high-speed transmission line, the light spot output by the CO2 laser is focused into a 0.1 mm light spot after passing through a beam expander, a galvanometer and a field lens, and its ellipticity is greater than 85%. The light spot output by the ultraviolet laser is focused into a 0.05 mm light spot after passing through a beam expander, a galvanometer and a field lens, and its ellipticity is greater than 95%.

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