Method and device suitable for realizing capacitance compensation processing at different angles, processor and computer readable storage medium thereof

Abstract

The invention relates to a method suitable for realizing capacitance compensation processing at different angles, and the method comprises the following steps: starting multi-angle calibration, and obtaining calibration data; setting an expected cutting height, and starting capacitance compensation; the laser cutting head is in a vertical state with the plate surface, follow-up is started, and follow-up is waited to be in place; calculating an included angle between the laser cutting head and the plate surface in real time; real-time compensation is conducted according to the included angle between the laser cutting head and the plate face; and light-emitting cutting is carried out. The invention further relates to a device suitable for capacitance compensation processing at different angles, a processor and a computer readable storage medium of the processor. By means of the method and device suitable for achieving capacitance compensation processing at different angles, the processor and the computer readable storage medium of the processor, only one-time multi-angle calibration needs to be carried out, multi-angle capacitance compensation is started, and when the laser cutting head and the plate face are located at any included angle in the cutting process, the capacitance compensation processing can be achieved; the follow-up control enables the distance between the laser cutting head and the plate to be consistent with the expected height, so that the cutting precision is improved.

Description

Technical Field

[0001] The present invention relates to the field of laser bevel cutting, and in particular to the field of capacitance compensation, and specifically refers to a method, device, processor and computer-readable storage medium thereof suitable for realizing capacitance compensation processing at different angles. Background Art

[0002] In the prior art, the following processing flow is as follows:

[0003] Step 1: Calibrate the cutting head with it perpendicular to the board surface and record the calibration data (capacitance-height).

[0004] Step 2: Move to the starting point and start following the laser cutting head when it is perpendicular to the plate surface. Wait until the following head is in place before performing angle deflection.

[0005] Step 3: During the cutting process, when the laser cutting head moves or the angle between it and the board surface changes, the height is adjusted in real time according to the calibration data.

[0006] The defects are as follows:

[0007] In the prior art steps 2 and 3, when the angle between the laser cutting head and the board surface changes, the capacitance-height relationship will be different, such as Figure 1 As shown, resulting in loss of cutting accuracy. Summary of the invention

[0008] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art and provide a method, device, processor and computer-readable storage medium thereof which are easy to operate, have high cutting accuracy and a wide range of applications and are suitable for realizing capacitance compensation processing at different angles.

[0009] In order to achieve the above-mentioned object, the method, device, processor and computer-readable storage medium thereof applicable to realizing capacitance compensation processing at different angles of the present invention are as follows:

[0010] The method is applicable to realizing capacitance compensation processing at different angles, and its main feature is that the method comprises the following steps:

[0011] (1) Enable multi-angle calibration and obtain calibration data;

[0012] (2) Set the expected cutting height and enable capacitor compensation;

[0013] (3) Move to the starting position, the laser cutting head is perpendicular to the plate surface, start following motion, and wait for following motion to be in place;

[0014] (4) Calculate the angle between the laser cutting head and the plate surface in real time during the movement;

[0015] (5) Real-time compensation is performed based on the angle between the laser cutting head and the plate surface obtained by real-time calculation;

[0016] (6) Perform light cutting.

[0017] Preferably, the step (5) specifically comprises the following steps:

[0018] (5.1) According to the angle between the laser cutting head and the board surface, match the corresponding capacitor from the calibration data;

[0019] (5.2) Record the last capacitance, calculate the difference between the capacitance matched to the height corresponding to the current angle and the last capacitance, and compensate the difference in real time to achieve the expected tracking height.

[0020] Preferably, the step (1) further comprises the following steps:

[0021] Set the calibration maximum inclination angle and calibration angle interval.

[0022] The device for realizing capacitance compensation processing applicable to different angles is characterized in that the device comprises:

[0023] a processor configured to execute computer executable instructions;

[0024] The memory stores one or more computer executable instructions. When the computer executable instructions are executed by the processor, the steps of the above-mentioned method for realizing capacitance compensation processing at different angles are implemented.

[0025] The processor for implementing capacitance compensation processing applicable to different angles is characterized in that the processor is configured to execute computer executable instructions, and when the computer executable instructions are executed by the processor, the various steps of the above-mentioned method for implementing capacitance compensation processing applicable to different angles are implemented.

[0026] The computer-readable storage medium is characterized in that a computer program is stored thereon, and the computer program can be executed by a processor to implement the various steps of the above-mentioned method for realizing capacitance compensation processing at different angles.

[0027] By adopting the method, device, processor and computer-readable storage medium of the present invention suitable for realizing capacitance compensation processing at different angles, it is only necessary to perform multi-angle calibration once and enable multi-angle capacitance compensation. During the cutting process, when the laser cutting head and the board surface are at any angle, the follow-up control can make the height of the laser cutting head from the board consistent with the expected height, thereby improving the cutting accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1FIG. 4 is a schematic diagram of the capacitance-angle-height relationship of the prior art.

[0029] Figure 2 It is a schematic diagram of the interface of the follow-up control of the method for realizing capacitance compensation processing at different angles according to the present invention.

[0030] Figure 3 The figure is a flow chart of a method for realizing capacitance compensation processing at different angles according to the present invention. DETAILED DESCRIPTION

[0031] In order to more clearly describe the technical content of the present invention, further description is given below in conjunction with specific embodiments.

[0032] The method of the present invention is applicable to realizing capacitance compensation processing at different angles, and comprises the following steps:

[0033] (1) Enable multi-angle calibration and obtain calibration data;

[0034] (2) Set the expected cutting height and enable capacitor compensation;

[0035] (3) Move to the starting position, the laser cutting head is perpendicular to the plate surface, start following motion, and wait for following motion to be in place;

[0036] (4) Calculate the angle between the laser cutting head and the plate surface in real time during the movement;

[0037] (5) Real-time compensation is performed based on the angle between the laser cutting head and the plate surface obtained by real-time calculation;

[0038] (6) Perform light cutting.

[0039] As a preferred embodiment of the present invention, the step (5) specifically comprises the following steps:

[0040] (5.1) According to the angle between the laser cutting head and the board surface, match the corresponding capacitor from the calibration data;

[0041] (5.2) Record the last capacitance, calculate the difference between the capacitance matched to the height corresponding to the current angle and the last capacitance, and compensate the difference in real time to achieve the expected tracking height.

[0042] As a preferred embodiment of the present invention, the step (1) further comprises the following steps:

[0043] Set the calibration maximum inclination angle and calibration angle interval.

[0044] The device for realizing capacitance compensation processing at different angles of the present invention comprises:

[0045] a processor configured to execute computer executable instructions;

[0046] The memory stores one or more computer executable instructions. When the computer executable instructions are executed by the processor, the steps of the above-mentioned method for realizing capacitance compensation processing at different angles are implemented.

[0047] The present invention provides a processor for implementing capacitance compensation processing suitable for different angles, wherein the processor is configured to execute computer executable instructions, and when the computer executable instructions are executed by the processor, the various steps of the above-mentioned method for implementing capacitance compensation processing suitable for different angles are implemented.

[0048] The computer-readable storage medium of the present invention stores a computer program thereon, and the computer program can be executed by a processor to implement the various steps of the above-mentioned method for realizing capacitance compensation processing at different angles.

[0049] In a specific embodiment of the present invention, the defects of the above-mentioned prior art are overcome, and a method is provided to ensure that when the laser cutting head and the plate surface are at any angle, the follow-up control can make the height of the laser cutting head from the plate consistent with the expected height.

[0050] The process of the present invention is as follows:

[0051] 1. Set the maximum calibration inclination angle and calibration angle interval to calibrate and obtain the calibration data (angle-capacitance-height).

[0052] 2. Enable capacitor compensation and set the expected cutting height.

[0053] 3. Move to the starting point, and start following the laser cutting head when it is perpendicular to the board surface. Wait until the following head is in place, and then perform angle deflection. Real-time capacitor compensation is performed to achieve the expected following height.

[0054] 4. When the laser cutting head moves or the angle between it and the board changes during the cutting process, real-time capacitance compensation is performed to achieve the expected follow-up height.

[0055] The present invention specifically comprises the following steps:

[0056] 1. Enable multi-angle calibration, and set the maximum inclination angle and calibration angle interval (such as Figure 2 : Follow-up control).

[0057] 2. Step at the calibration angle interval to obtain the height-capacitance calibration mapping table corresponding to different angles.

[0058] 3. Set the cutting height, enable capacitor compensation, move to the starting point, start following, and wait for following to be in place.

[0059] 4. Driven by a timer, the angle between the laser cutting head and the board surface is calculated in real time during the movement.

[0060] 5. Match the corresponding capacitor in the calibration mapping table according to the angle between the laser cutting head and the board surface.

[0061] 6. Record the last capacitance, calculate the difference between the capacitance matched to the height corresponding to the current angle and the last capacitance, and compensate the difference in real time.

[0062] Compared with the prior art, the technical solution of the present invention can identify and measure the angle-capacitance height-relationship, and compensate in real time according to the above relationship during the cutting process. The present invention introduces follow-up control during the cutting process, but the follow-up control depends on the capacitor, which will be different at different angles. The technical solution of the present invention can solve the problem of incorrect follow-up height caused by inconsistent capacitance at different angles.

[0063] The specific implementation scheme of this embodiment can refer to the relevant description in the above embodiment, which will not be repeated here.

[0064] It can be understood that the same or similar parts of the above embodiments can be referenced to each other, and the contents not described in detail in some embodiments can refer to the same or similar contents in other embodiments.

[0065] It should be noted that, in the description of the present invention, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, the meaning of "plurality" refers to at least two.

[0066] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code that includes one or more executable instructions for implementing the steps of a specific logical function or process, and the scope of the preferred embodiments of the present invention includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by those skilled in the art to which the embodiments of the present invention belong.

[0067] It should be understood that the various parts of the present invention can be implemented by hardware, software, firmware or a combination thereof. In the above-mentioned embodiments, a plurality of steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution device. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0068] A person skilled in the art may understand that all or part of the steps in the method for implementing the above-mentioned embodiment may be completed by instructing related hardware through a program, and the corresponding program may be stored in a computer-readable storage medium, which, when executed, includes one of the steps of the method embodiment or a combination thereof.

[0069] In addition, each functional unit in each embodiment of the present invention may be integrated into a processing module, or each unit may exist physically separately, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0070] The storage medium mentioned above can be a read-only memory, a magnetic disk or an optical disk, etc.

[0071] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0072] By adopting the method, device, processor and computer-readable storage medium of the present invention suitable for realizing capacitance compensation processing at different angles, it is only necessary to perform multi-angle calibration once and enable multi-angle capacitance compensation. During the cutting process, when the laser cutting head and the board surface are at any angle, the follow-up control can make the height of the laser cutting head from the board consistent with the expected height, thereby improving the cutting accuracy.

[0073] In this specification, the present invention has been described with reference to specific embodiments thereof. However, it is apparent that various modifications and variations may be made without departing from the spirit and scope of the present invention. Therefore, the specification and drawings should be regarded as illustrative rather than restrictive.

Claims

1. A method for realizing capacitance compensation processing at different angles, characterized in that: The method comprises the following steps: (1) Enable multi-angle calibration and obtain calibration data; (2) Set the expected cutting height and enable capacitor compensation; (3) Move to the starting position, the laser cutting head is perpendicular to the plate surface, start following motion, and wait for following motion to be in place; (4) Calculate the angle between the laser cutting head and the plate surface in real time during the movement; (5) Real-time compensation is performed based on the angle between the laser cutting head and the plate surface obtained by real-time calculation; (6) Perform light cutting.

2. The method for realizing capacitance compensation processing at different angles according to claim 1, characterized in that: The step (5) specifically comprises the following steps: (5.1) According to the angle between the laser cutting head and the board surface, match the corresponding capacitor from the calibration data; (5.2) Record the last capacitance, calculate the difference between the capacitance matched to the height corresponding to the current angle and the last capacitance, and compensate the difference in real time to achieve the expected tracking height.

3. The method for realizing capacitance compensation processing at different angles according to claim 1, characterized in that: The step (1) further comprises the following steps: Set the calibration maximum inclination angle and calibration angle interval.

4. A device for realizing capacitance compensation processing at different angles, characterized in that: The device comprises: a processor configured to execute computer-executable instructions; A memory storing one or more computer executable instructions, wherein when the computer executable instructions are executed by the processor, the steps of the method for realizing capacitance compensation processing at different angles as described in any one of claims 1 to 3 are implemented.

5. A processor for implementing capacitance compensation processing at different angles, characterized in that: The processor is configured to execute computer executable instructions. When the computer executable instructions are executed by the processor, the steps of the method for realizing capacitance compensation processing at different angles described in any one of claims 1 to 3 are implemented.

6. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and the computer program can be executed by a processor to implement the various steps of the method for realizing capacitance compensation processing at different angles as described in any one of claims 1 to 3.

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