Wafer beveling processing mechanism and method for quartz crystal resonator

Abstract

The invention provides a wafer beveling machining mechanism and method for a quartz crystal resonator, and belongs to the technical field of beveling machining, the wafer beveling machining mechanism comprises a machining table, a first plane and a second plane are arranged at the top of the machining table, the first plane and the second plane are arranged in a trapezoid shape, and a beveling assembly is arranged at the top of the second plane; the beveling assembly comprises multiple groups of beveling motors with adjustable intervals and first infrared sensors, the first infrared sensors are arranged among the multiple groups of beveling motors, the top of the first plane is provided with two groups of transportation assemblies for transporting circular wafers, the two groups of transportation assemblies are both provided with positioning assemblies, the positioning assemblies comprise infrared receivers, and the infrared receivers are arranged on the two groups of transportation assemblies. The top of the transportation assembly is provided with an infrared receiver corresponding to the first infrared sensor. By adjusting the distance between the two sets of beveling motors and then through the rotating motor, the grinding cylinder can conduct grinding around the circumferential side of the wafer, the beveling effects of all the positions of the edge of the wafer are consistent, and the problem that according to a traditional beveling machining mechanism, beveling is not uniform easily is solved.

Description

Technical Field

[0001] The invention belongs to the technical field of chamfering, and more specifically, particularly relates to a chamfering mechanism and method for a wafer of a quartz crystal resonator. Background Art

[0002] Against the backdrop of the rapid development of modern electronic technology, quartz crystal resonators, as a frequency control element, are widely used in the fields of the Internet of Things, smart wearable devices, and automotive electronics due to their excellent frequency stability, high-precision resonant frequency, and low loss.

[0003] The performance of a quartz crystal resonator depends on the quality of the wafer, and the wafer needs to be chamfered during processing. The traditional chamfering mechanism uses a grinding wheel to chamfer one side of the wafer, then turns the wafer over and chamfers the other side. Because the two sides are processed separately, it is easy to cause uneven chamfering of the wafer edge. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a chip chamfering processing mechanism and method for a quartz crystal resonator, so as to solve the technical problem in the prior art that the traditional chamfering processing mechanism chamfers one side of the chip by a grinding wheel, then turns the chip over and chamfers the other side, which easily leads to uneven chamfering of the chip edge.

[0005] The purpose and effect of the wafer chamfering processing mechanism and method of a quartz crystal resonator of the present invention are achieved by the following specific technical means: A wafer chamfering processing mechanism for a quartz crystal resonator comprises a processing table, a first plane and a second plane are arranged on the top of the processing table, the first plane and the second plane are arranged in a trapezoidal shape, a chamfering component is arranged on the top of the second plane, the chamfering component comprises a plurality of groups of chamfering motors with adjustable spacing and a first infrared sensor, the first infrared sensor is arranged between the plurality of groups of the chamfering motors, two groups of transport components for transporting circular wafers are arranged on the top of the first plane, positioning components are arranged on both groups of the transport components, the positioning components comprise an infrared receiver, and the infrared receiver is arranged on the top of the transport component corresponding to the first infrared sensor.

[0006] As a further solution of the present invention, the chamfering assembly also includes a support column, a first slide rail is arranged on the top of the second plane, a sliding block is slidably arranged on the top of the first slide rail, a first screw slide is arranged on one side of the first slide rail, a first driving motor is arranged at one end of the first screw slide, a first slidable screw slider is arranged on the first screw slide, the first screw slider and the sliding block are both connected to the bottom of the connecting plate, the top of the connecting plate is connected to the mounting plate by screws, the support column is arranged on the top of the mounting plate, and a support frame is arranged on one side of the support column and connected to the top of the mounting plate.

[0007] As a further solution of the present invention, a first mounting groove is provided on the top of the support column, a guide seat is provided in the first mounting groove, a first mounting seat is provided on the top of the support column, a lifting motor is provided on the top of the first mounting seat, a lifting screw is provided in the guide seat, a second screw slider is sleeved on the lifting screw, first guide through grooves are provided on both sides of the guide seat, first guide blocks are provided on both sides of the second screw slider, two groups of the first guide blocks are respectively slidably connected with two groups of the first guide through grooves, through grooves are provided on the guide seat and one side of the first mounting groove, and one side of the second screw slider passes through the two groups of the through grooves to be connected to the mounting beam.

[0008] As a further solution of the present invention, a second mounting seat is provided at the top of the mounting beam, a rotating motor is provided at the top of the second mounting seat, a first mounting hole is opened at the top of the mounting beam corresponding to the rotating motor, a bearing is provided in the first mounting hole, a rotating shaft passes through the first mounting hole and the bearing and is connected to the main shaft of the rotating motor, a rotating table is provided at the top of the rotating shaft, the top of the bearing contacts the rotating table, a connecting piece is provided at the bottom of the rotating shaft, a connecting seat is connected to the bottom of the connecting piece by screws, a second screw slide is provided at the bottom of the connecting seat, a second driving motor is provided at one end of the second screw slide, a first bidirectional screw is provided in the second screw slide, and a third screw slider is sleeved on the forward rotation section and the reverse rotation section of the first bidirectional screw; the chamfering motor is divided into two groups, the chamfering motor is provided at the bottom of the two groups of the third screw sliders, a grinding cylinder is provided at the bottom of the two groups of the chamfering motors, a plurality of grinding grooves of different specifications are provided on the circumference of the grinding cylinder, a second mounting hole is opened at the bottom of the mounting beam, and the first infrared sensor is provided in the second mounting hole.

[0009] As a further solution of the present invention, a connecting truncated table is provided at one end of the mounting beam, a first mounting hole is provided at the top of the connecting truncated table, a rotating motor is provided at the top of the first mounting hole, the top of the rotating adjusting member passes through the first mounting hole and is connected to the main shaft of the rotating motor, an adjusting bracket is provided below the connecting truncated table, three groups of connecting grooves are provided on the circumference of the connecting truncated table, connecting brackets are provided in the three groups of connecting grooves and are connected to the adjusting bracket, three groups of sliding through grooves are provided on the adjusting bracket, the three groups of sliding through grooves are radially distributed, and the three groups of sliding through grooves are provided There is a slidable adjustment block, a centripetal spiral groove is provided at the bottom of the rotating adjustment piece, and a threaded section is provided at the top of the three groups of adjustment blocks corresponding to the centripetal spiral groove, and the threaded section is slidably connected with the centripetal spiral groove; there are three groups of chamfering motors, and the bottoms of the three groups of adjustment blocks are provided with the chamfering motors, and the bottom ends of the three groups of chamfering motors are provided with grinding cylinders, and multiple groups of grinding grooves of different specifications are provided on the circumference of the grinding cylinders, and a third mounting seat is provided on one side of the adjustment bracket, and a second mounting hole is provided on the third mounting seat, and the first infrared sensor is provided in the second mounting hole.

[0010] As a further solution of the present invention, the transport component includes a second slide rail, the second slide rail is arranged on the top of the first plane, a slidable electric slider is arranged on the top of the second slide rail, a limiting block is arranged at one end of the second slide rail, a limiting plate is arranged on the first plane corresponding to the other end of the second slide rail, a mounting bracket is arranged on the top of the electric slider, a fourth mounting seat is arranged on one side of the mounting bracket, the infrared receiver is arranged on the top of the fourth mounting seat, a second mounting groove is opened on one side of the second plane corresponding to the infrared receiver, and a second infrared sensor is arranged in the second mounting groove.

[0011] As a further solution of the present invention, the positioning assembly also includes two groups of positioning slides, through holes are opened at both ends of the mounting bracket, a second bidirectional screw is passed through the through holes, a positioning motor is arranged at one end of the mounting bracket, the main shaft of the positioning motor is connected to one end of the second bidirectional screw, the two groups of positioning slides are respectively sleeved on the forward rotation section and the reverse rotation section of the second bidirectional screw, a guide plate is arranged on the mounting bracket, two groups of second guide grooves are opened on one side of the guide plate corresponding to the two groups of positioning slides, second guide blocks are arranged on one side of the two groups of positioning slides, and the two groups of the second guide blocks are respectively slidably connected to the two groups of the second guide grooves.

[0012] As a further solution of the present invention, a fifth mounting seat is arranged on the mounting bracket, a through groove is provided on one side of the fifth mounting seat corresponding to the second bidirectional screw rod, a supporting column for placing the circular wafer is provided on the top of the fifth mounting seat, a V-shaped positioning groove is provided on the adjacent sides of the two groups of positioning slide blocks corresponding to the circular wafer, a third mounting hole is provided on the top of the supporting column, an electric lifting rod is provided in the third mounting hole, a fixed platform is provided on the top of the electric lifting rod, a plurality of groups of through holes are provided on the fixed platform, and a fixed suction nozzle for fixing the circular wafer is provided in each of the plurality of through holes, a vacuum generator is provided on the top of the fifth mounting seat, and the vacuum generator is connected to the plurality of groups of fixed suction nozzles through pipes.

[0013] As a further solution of the present invention, an equipment box is provided at the bottom of the processing table, and the equipment box is installed below the first plane. Two groups of columns are provided below the second plane. A ceiling is provided on the top of the processing table. Openings are provided on both sides of the ceiling corresponding to the two groups of the transport components. Two groups of switchable door panels are provided on the front of the ceiling. Both groups of the door panels are provided with observation windows and handles.

[0014] A method for using a wafer chamfering mechanism for a quartz crystal resonator comprises the following steps: Step 1: Wafer loading and positioning; Start the electric slider to move it on the second slide rail to a preset material change position, place the circular wafer to be processed on the top of the support column, start the positioning motor to drive the second bidirectional screw to rotate, so that the two groups of positioning sliders sleeved on the forward rotation section and the reverse rotation section thereof move toward each other, and the V-shaped positioning grooves on the adjacent sides of the two groups of positioning sliders gradually approach the circular wafer until the V-shaped positioning grooves contact the edge of the circular wafer, thereby achieving preliminary positioning of the wafer and ensuring that the center of the circular wafer is aligned with the center of the fixed platform; Step 2: Wafer positioning and fixing; The electric slider is started to move on the second slide rail toward the chamfering assembly until the infrared receiver detects a signal from the second infrared sensor, at which time the electric slider stops moving, the vacuum generator is started to generate negative pressure through the pipe to fix the circular wafer on the fixed table, ensuring that the wafer will not be positionally offset during the chamfering process, the positioning motor rotates in the opposite direction to move the two groups of positioning sliders in opposite directions, releasing their fixation on the circular wafer, and then the electric lifting rod is started to raise the fixed table, so that the circular wafer reaches the preset chamfering processing position; Step 3: Chamfering operation; Starting the first drive motor to drive the main body of the chamfering assembly to move until the infrared receiver detects the signal of the first infrared sensor, at which time the main body of the chamfering assembly reaches the predetermined position, starting the lifting motor to drive the lifting screw to rotate, so that the mounting beam and the first infrared sensor are lowered, so that one group of grinding grooves on the grinding cylinder and the circular wafer are in the same horizontal plane based on the processing specifications, starting the two groups of chamfering motors to drive the two groups of the grinding cylinders to rotate, starting the second drive motor to drive the two groups of third screw sliders to move toward each other, adjusting the spacing between the two groups of the grinding cylinders based on the wafer chamfering width requirements, so that the peripheral side of the circular wafer contacts the grinding grooves, and at the same time, starting the rotating motor to drive the rotating shaft to rotate, thereby driving the second screw slide and the two groups of chamfering motors to rotate synchronously, so that the two groups of grinding cylinders can surround the peripheral side of the circular wafer at a constant angular velocity to perform chamfering and grinding operations on the peripheral side of the circular wafer; Step 4: Reset after processing; When the chamfering process is completed, the second driving motor is first controlled to rotate in the opposite direction to restore the two groups of the grinding cylinders to the initial spacing position, and the operation of the chamfering motor is stopped at the same time, so that the grinding cylinders stop rotating; then, the second screw slide and the two groups of the chamfering motors are reset and stopped by the rotating motor, and the lifting motor is started to make the grinding cylinder rise away from the circular wafer, and then the first driving motor is started to move the chamfering assembly body toward another group of positioning assemblies to prepare for the processing of the next wafer; Step 5: Wafer cutting; The electric lifting rod is retracted to make the bottom of the circular wafer contact the supporting column, and the electric sliding block is started to move toward the opening on one side of the ceiling to the material changing position to remove the processed circular wafer.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. Through the setting of the chamfering assembly, when using the mechanism, by adjusting the distance between the two sets of chamfering motors, and then rotating the motor, the grinding cylinder can grind around the periphery of the wafer at a constant angular velocity, without the need to flip the circular wafer, and make the chamfer shape of the periphery of the wafer more uniform and consistent, solving the problem of uneven chamfering in traditional chamfering processing mechanisms, improving the chamfering accuracy, ensuring that the chamfering effect of various parts of the wafer edge is consistent, and improving the consistency of the product; by matching the grinding cylinder with grinding grooves of different specifications, it can meet the processing of wafers of various sizes and chamfering requirements without frequent replacement.

[0016] 2. Through the setting of two groups of transport components, when using this mechanism, the electric slider moves on the second slide rail to achieve rapid transportation of wafers between different workstations. At the same time, through the cooperation of the second infrared sensor and the infrared receiver, the wafer position is detected, avoiding the wafer mispositioning that may occur during manual operation, and the chamfering of the wafer side can be completed in one clamping, shortening the processing cycle of a single wafer and improving production efficiency.

[0017] 3. Through the setting of the positioning component, when using this mechanism, the initial positioning of the circular wafer is achieved through the positioning motor and the V-shaped positioning groove, so that its center is aligned with the center of the fixed table, further ensuring the consistency of the edge of the circular wafer after processing; through the setting of the vacuum generator and multiple groups of fixed suction nozzles, the vacuum generator is started to generate negative pressure on the multiple groups of fixed suction nozzles to fix the circular wafer on the fixed table, ensuring the position stability of the wafer during the processing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of the structure of the first embodiment of the present invention after assembly; Figure 2 is a schematic diagram of the structure of the first embodiment of the present invention after expansion; Figure 3 It is a schematic diagram of the structure after the chamfering assembly of the present invention is assembled; Figure 4 It is a schematic diagram of the structure after the chamfering component of the present invention is disassembled; Figure 5 It is a schematic diagram of the structure after the mounting beam and the rotating shaft are assembled in the present invention; Figure 6 yes Figure 5 Schematic diagram of the structure after splitting; Figure 7 It is a schematic diagram of the structure after the first plane and two groups of transport components are assembled in the present invention; Figure 8 yes Figure 7 Schematic diagram of the structure after splitting; Fig. 9 It is a schematic diagram of the structure after the transport component of the present invention is assembled; Fig.10 yes Fig. 9 Schematic diagram of the structure after splitting; Fig.11 It is a flow chart of steps of a method for using a wafer chamfering processing mechanism of a quartz crystal resonator of the present invention; Fig.12 This is a schematic diagram of the structure of the transport component after assembly in the second embodiment of the present invention; Fig.13 It is a schematic diagram of the structure after the transport component in the second embodiment of the present invention is disassembled.

[0019] In the figure, the corresponding relationship between the component names and the figure numbers is as follows: 101, first plane; 102, second plane; 103, circular wafer; 104, equipment box; 105, column; 106, ceiling; 107, door panel; 108, observation window; 109, handle; 110, opening; 201, chamfering motor; 202, first infrared sensor; 203, support column; 204, first slide rail; 205, sliding block; 206, first screw slide; 207, first drive motor; 208, first screw slider; 209, connecting plate; 210, mounting plate; 212, support frame; 213, first mounting groove; 214, guide seat; 215, first mounting seat; 216, lifting motor; 217, lifting screw rod; 218, second screw rod slider; 219, first guide slot; 220, first guide block; 221, mounting beam; 222, second mounting seat; 223, rotating motor; 224, first mounting hole; 225, bearing; 226, rotating shaft; 227, rotating table; 228, connecting piece; 229, connecting seat; 230, second screw rod slider; 2 31. first bidirectional screw rod; 232. third screw rod slider; 233. grinding cylinder; 234. grinding groove; 235. second mounting hole; 236. connecting round table; 237. adjusting member; 238. sliding groove; 239. adjusting block; 240. third mounting seat; 241. adjusting bracket; 242. second driving motor; 243. connecting groove; 244. connecting bracket; 301. second slide rail; 302. electric slider; 303. limit block; 304. limit plate; 305. mounting bracket; 30 6. Fourth mounting seat; 307. Second mounting slot; 308. Second infrared sensor; 401. Infrared receiver; 402. Positioning slider; 403. Second bidirectional screw rod; 404. Positioning motor; 405. Second guide through slot; 406. Second guide block; 407. Fifth mounting seat; 408. Support column; 409. V-shaped positioning slot; 410. Third mounting hole; 411. Electric lifting rod; 412. Fixed platform; 413. Fixed suction nozzle; 414. Vacuum generator; 415. Guide plate. DETAILED DESCRIPTION

[0020] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the technical solutions of the present invention, but cannot be used to limit the scope of protection of the present invention.

[0021] Embodiment 1: As shown in the attached Figures 1 to 13 As shown: The present invention provides a wafer chamfering processing mechanism for a quartz crystal resonator, comprising a processing table, a first plane 101 and a second plane 102 are arranged on the top of the processing table, the first plane 101 and the second plane 102 are arranged in a trapezoidal shape, and this layout provides a basic framework for the reasonable placement of other components, so that the entire processing flow can be carried out in an orderly manner; a chamfering component is arranged on the top of the second plane 102, the chamfering component includes multiple groups of chamfering motors 201 with adjustable spacing and first infrared sensors 202, and the first infrared sensors 202 are arranged between the multiple groups of chamfering motors 201, so that the chamfering component can locate the position of a circular wafer 103; two groups of transport components for transporting the circular wafer 103 are arranged on the top of the first plane 101, and positioning components are arranged on both groups of transport components, and the positioning components include an infrared receiver 401, and the infrared receiver 401 can select a CHQB model; an infrared receiver 401 is arranged on the top of the transport component corresponding to the first infrared sensor 202, and the infrared receiver 401 and the first infrared sensor 202 cooperate with each other to realize the perception and control of the wafer position.

[0022] Please refer to Figure 3 and Figure 4 As shown, the chamfering assembly also includes a support column 203, a first slide rail 204 is arranged on the top of the second plane 102, a sliding block 205 is slidably arranged on the top of the first slide rail 204, and the sliding block 205 can slide smoothly on the first slide rail 204; a first screw slide 206 is arranged on one side of the first slide rail 204, a first drive motor 207 is arranged at one end of the first screw slide 206, and a slidable first screw slider 208 is arranged on the first screw slide 206, and the first drive motor 207 can realize the precise movement of the first screw slider 208 Movement; the first screw slider 208 and the sliding block 205 are both connected to the bottom of the connecting plate 209, ensuring the effective transmission of power. The top of the connecting plate 209 is connected to the mounting plate 210 by screws, so that the support column 203 on the top of the mounting plate 210 can obtain stable support. The support frame 212 arranged on one side of the support column 203 is connected to the top of the mounting plate 210, which further enhances the stability of the support column 203, so that it can withstand various forces during the processing without deformation or displacement, and provide reliable protection for subsequent chamfering operations.

[0023] Please refer to Figure 4As shown, a guide seat 214 is arranged in the first mounting groove 213 opened at the top of the support column 203, and the guide seat 214 plays a guiding role in the whole lifting movement process. A first mounting seat 215 is arranged on the top of the support column 203, and a lifting motor 216 is arranged on the top of the first mounting seat 215, which serves as a power source for driving the mounting beam 221 to lift and lower; a lifting screw rod 217 is arranged in the guide seat 214, and a second screw rod slider 218 is sleeved on the lifting screw rod 217. The main shaft of the lifting motor 216 is connected to the top of the lifting screw rod 217. The lifting screw rod 217 rotates under the drive of the lifting motor 216, and the second screw rod slider 218 sleeved thereon As it rises and falls, first guide grooves 219 are provided on both sides of the guide seat 214, and first guide blocks 220 are provided on both sides of the second screw slider 218. The two groups of first guide blocks 220 are slidably connected to the two groups of first guide grooves 219 respectively, ensuring the stability of the second screw slider 218 during the lifting process and preventing it from shifting or shaking; through grooves are provided on one side of the guide seat 214 and the first mounting groove 213, providing a channel for one side of the second screw slider 218 to pass through and connect with the mounting beam 221, so that the mounting beam 221 can achieve stable lifting movement under the drive of the lifting motor 216, thereby meeting different processing requirements.

[0024] Please refer to Figure 5 and Figure 6As shown, the second mounting seat 222 on the top of the mounting beam 221 provides a stable mounting position, a rotating motor 223 is arranged on the top of the second mounting seat 222, a first mounting hole 224 is opened on the top of the mounting beam 221 corresponding to the rotating motor 223, a bearing 225 is arranged in the first mounting hole 224, the main shaft of the rotating motor 223 passes through the first mounting hole 224 and the bearing 225 and is connected to the rotating shaft 226, a rotating table 227 is arranged on the top of the rotating shaft 226, and the top of the bearing 225 is in contact with the rotating table 227. The arrangement of the bearing 225 reduces the friction resistance of the rotating shaft 226 when it rotates. Ensure the smoothness of its rotation; the connecting piece 228 at the bottom of the rotating shaft 226 is screwed to the connecting seat 229, and a second screw slide 230 is arranged at the bottom of the connecting seat 229, and a first bidirectional screw 231 is arranged in the second screw slide 230, and a third screw slider 232 is sleeved on the forward rotation section and the reverse rotation section of the first bidirectional screw 231; the chamfering motor 201 is divided into two groups, and the bottom of the two groups of third screw sliders 232 are both provided with a chamfering motor 201, and the bottom of the two groups of chamfering motors 201 are both provided with a grinding cylinder 233; the second drive motor 242 at one end of the second screw slide 230 can drive the first bidirectional screw The rod 231 rotates, thereby driving the third screw slider 232 mounted on its forward rotation section and reverse rotation section to move toward or away from each other. The chamfering motor 201 and the grinding cylinder 233 at the bottom of the two sets of third screw sliders 232 can therefore adjust the spacing. The multiple sets of grinding grooves 234 of different specifications opened on the side of the grinding cylinder 233 can select the appropriate grinding groove 234 for operation according to actual processing requirements, without the need to frequently replace the grinding cylinder 233, which can meet the processing of wafers of various sizes and chamfering requirements; the first infrared sensor 202 arranged in the second mounting hole 235 opened at the bottom of the mounting beam 221 is used to During the processing, the relative position of the grinding cylinder 233 and the wafer is monitored in real time to ensure the accuracy and stability of the processing; by adjusting the distance between the two sets of chamfering motors 201, and then using the rotating motor 223 to drive the grinding cylinder 233 to rotate, the grinding cylinder 233 can be made to grind around the circumference of the wafer at a constant angular velocity, effectively avoiding the problem of uneven chamfering caused by the flipping operation in the traditional processing method, improving the chamfering accuracy, ensuring that the chamfering effect is consistent at all parts of the wafer edge, and the chamfering processing of the circumference of the wafer can be completed in one clamping, shortening the processing cycle of a single wafer and improving production efficiency.

[0025] Please refer to Fig.12 and Fig.13As shown, a connecting truncated platform 236 is provided at one end of the mounting beam 221, a first mounting hole 224 is provided at the top of the connecting truncated platform 236, a rotating motor 223 is provided at the top of the first mounting hole 224, a top of a rotating adjusting member 237 passes through the first mounting hole 224 and is connected to the main shaft of the rotating motor 223, an adjusting bracket 241 is provided below the connecting truncated platform 236, three groups of connecting grooves 243 are provided on the circumference of the connecting truncated platform 236, connecting brackets 244 are provided in the three groups of connecting grooves 243 and connected to the adjusting bracket 241, and three groups of sliding through grooves 238 are provided on the adjusting bracket 241, the three groups of sliding through grooves 238 are radially distributed, and the three groups of sliding through grooves 238 are provided in the three groups of sliding through grooves 238. Each of the three groups of adjustment blocks 239 is provided with a slidable adjustment block 239, a centripetal spiral groove is provided at the bottom of the rotating adjustment member 237, and a threaded section is provided at the top corresponding to the centripetal spiral groove, and the threaded section is slidably connected with the centripetal spiral groove; there are three groups of chamfering motors 201, and the bottom of the three groups of adjustment blocks 239 is provided with a chamfering motor 201, and the bottom of the three groups of chamfering motors 201 is provided with a grinding cylinder 233, and a plurality of groups of grinding grooves 234 of different specifications are provided on the circumference of the grinding cylinder 233, and a third mounting seat 240 is provided on one side of the adjustment bracket 241, and a second mounting hole 235 is provided on the third mounting seat 240, and a first infrared sensor 202 is provided in the second mounting hole 235.

[0026] Please refer to Figure 7 and Figure 8 As shown, the transport component includes a second slide rail 301, which is laid on the top of the first plane 101 and provides a reliable sliding track for the electric slider 302. The electric slider 302 can slide smoothly on the top of the second slide rail 301, thereby realizing the transfer of wafers between different workstations; a limit block 303 arranged at one end of the second slide rail 301 and a limit plate 304 arranged at the other end corresponding to the first plane 101 jointly limit the sliding range of the electric slider 302 to prevent it from sliding out of the track, thereby ensuring the safety of the transportation process; a mounting bracket 305 is arranged on the top of the electric slider 302 for mounting other components, and a fourth mounting seat 306 is arranged on one side of the mounting bracket 305. An infrared receiver 401 is arranged on the top of the fourth mounting seat 306, and a second mounting groove 307 is opened on one side of the second plane 102 corresponding to the infrared receiver 401. A second infrared sensor 308 is arranged in the second mounting groove 307. Both the first infrared sensor 202 and the second infrared sensor 308 can use the E3P-DS5C4 model; the infrared receiver 401 and the second infrared sensor 308 cooperate with each other to realize the detection of the chip position. When the electric slider 302 drives the chip to move to the processing position, the infrared receiver 401 can receive the signal of the second infrared sensor 308, thereby determining the position of the chip, avoiding the chip misalignment that may occur during manual operation.

[0027] Please refer to Fig. 9 and Fig.10As shown, the positioning assembly also includes two groups of positioning sliders 402, through holes are provided at both ends of the mounting bracket 305, and a second bidirectional screw rod 403 is passed through the through holes. A positioning motor 404 at one end of the mounting bracket 305 serves as a power source, and its main shaft is connected to one end of the second bidirectional screw rod 403. When the positioning motor 404 is started, it can drive the second bidirectional screw rod 403 to rotate, thereby making the two groups of positioning sliders 402 mounted on its forward rotation section and reverse rotation section move toward or away from each other; a guide plate 415 is provided on the mounting bracket 305, and two groups of second guide through grooves 405 are provided on one side of the guide plate 415, which cooperate with a second guide block 406 arranged on one side of the positioning slider 402 to ensure the stability of the positioning slider 402 during movement and prevent it from shifting or shaking, thereby realizing the positioning of the circular wafer 103.

[0028] Please refer to Fig.10 As shown, a fifth mounting seat 407 is provided on the mounting bracket 305, and a through groove corresponding to the second bidirectional screw rod 403 is provided on one side of the fifth mounting seat 407, which can prevent the rotation of the second bidirectional screw rod 403 from being affected. A support column 408 for placing the circular wafer 103 on the top of the fifth mounting seat 407 provides initial support for the wafer. The V-shaped positioning grooves 409 provided on the adjacent sides of the two sets of positioning slide blocks 402 can achieve preliminary positioning of the circular wafer 103 under the drive of the positioning motor 404, so that the center of the circular wafer 103 is aligned with the center of the fixing table 412, further ensuring the consistency of the edge of the circular wafer 103 after processing. A buffer pad is provided in the V-shaped positioning groove 409; the support column 408 A third mounting hole 410 is provided on the top, and an electric lifting rod 411 arranged in the third mounting hole 410 can drive the fixed platform 412 on the top thereof to rise and fall. A plurality of through holes are provided on the fixed platform 412, and a fixed suction nozzle 413 is provided in each of the plurality of through holes. A vacuum generator 414 arranged on the top of the fifth mounting seat 407 is connected to the plurality of fixed suction nozzles 413 through a pipeline, and the vacuum generator 414 can adopt the VTM301 model; under the action of the vacuum generator 414, negative pressure can be generated on the fixed suction nozzle 413, so that the circular wafer 103 can be firmly fixed on the fixed platform 412, thereby ensuring the position stability of the wafer during the processing and preventing it from being displaced during the processing and affecting the processing quality.

[0029] Please refer to Figure 2As shown, an equipment box 104 is arranged at the bottom of the processing table, and the equipment box 104 is installed below the first plane 101 and is connected to an external power supply to provide stable operation support for the entire processing mechanism; two groups of columns 105 are arranged below the second plane 102 to provide a support basis for the processing table to ensure the stability of the processing table during operation, and a spray device for spraying grinding liquid on the circular wafer 103 can also be installed on the top of the second plane 102; the ceiling 106 on the top of the processing table can play a certain protective role in the processing area, and openings 110 corresponding to two groups of transportation components on both sides of the ceiling 106 are opened to facilitate the transportation operation of the wafer; two groups of switchable door panels 107 arranged on the front of the ceiling 106 are convenient for operators to maintain, inspect and observe the processing process inside the processing mechanism, and the observation window 108 arranged on the door panel 107 allows the operator to observe the processing situation without opening the door panel 107, and the handle 109 facilitates the opening and closing operation of the door panel 107.

[0030] A method for using a wafer chamfering mechanism for a quartz crystal resonator comprises the following steps: Step 1: Wafer loading and positioning; First, the electric slider 302 is started, and the electric slider 302 moves on the second slide rail 301 to a preset material change position, at which the circular wafer 103 to be processed is placed on the top of the support column 408; then the positioning motor 404 is started to drive the second bidirectional screw rod 403 to rotate. Since the two groups of positioning sliders 402 are respectively sleeved on the forward rotation section and the reverse rotation section of the second bidirectional screw rod 403, the two groups of positioning sliders 402 will move towards each other as the second bidirectional screw rod 403 rotates; during the movement, the second guide block 406 on one side of the positioning slider 402 slides smoothly along the second guide through groove 405 on one side of the guide plate 415 to ensure that the movement direction of the positioning slider 402 is correct; the V-shaped positioning groove 409 on the adjacent side of the two groups of positioning sliders 402 gradually approaches the circular wafer 103 until the V-shaped positioning groove 409 contacts the edge of the circular wafer 103, thereby realizing the preliminary positioning of the wafer and ensuring that the center of the circular wafer 103 is accurately aligned with the center of the fixing table 412; Step 2: Wafer positioning and fixing; After completing the preliminary positioning, the electric slider 302 is started again to move it on the second slide rail 301 toward the chamfering assembly. During the movement, the infrared receiver 401 on the top of the fourth mounting seat 306 on one side of the mounting bracket 305 continues to work. When the infrared receiver 401 detects the signal of the second infrared sensor 308, the electric slider 302 immediately stops moving; the vacuum generator 414 is started to transmit the negative pressure to the fixed suction nozzle 413 on the fixed table 412 through the pipeline. The fixed suction nozzle 413 generates negative pressure to adsorb the circular wafer 103 on the fixed table 412 to ensure that the wafer will not be positionally shifted during the chamfering process; then the positioning motor 404 is started to rotate in the opposite direction, driving the second bidirectional screw rod 403 to rotate in the opposite direction, so that the two groups of positioning sliders 402 move in opposite directions, and release their fixation on the circular wafer 103; finally, the electric lifting rod 411 is started to drive the fixed table 412 to rise, so that the circular wafer 103 reaches the preset chamfering processing position; Step 3: Chamfering operation; The first driving motor 207 is started to drive the first screw slide 206 to work. The first screw slider 208 on the first screw slide 206 starts to move under the action of the screw. At the same time, the sliding block 205 connected to the bottom of the connecting plate 209 together with the first screw slider 208 also slides on the first slide rail 204. The two work together to drive the main body of the chamfering component to move; during the movement, the infrared receiver 401 on the transport component continuously monitors the signal of the first infrared sensor 202. When the signal of the first infrared sensor 202 is detected, it indicates that the main body of the chamfering component has reached the predetermined position; then the lifting motor 216 is started to drive the lifting screw 217 to rotate, and the second screw slider 218 sleeved on the lifting screw 217 starts to descend under the guiding action of the guide seat 214; the first guide blocks 220 on both sides of the second screw slider 218 slide down smoothly along the first guide grooves 219 on both sides of the guide seat 214 to ensure the stability of the descending process; as the second screw slider 218 descends, the mounting beam 221 connected thereto and the mounting beam 221 on the mounting beam 221 The first infrared sensor 202 also descends together, and according to the processing specifications, one group of grinding grooves 234 on the grinding cylinder 233 is at the same horizontal plane as the circular wafer 103; then the two groups of chamfering motors 201 are started, and the chamfering motors 201 start to drive the two groups of grinding cylinders 233 to rotate, ready for the grinding work, and then the second drive motor 242 is started, and the second drive motor 242 drives the first bidirectional screw 231 in the second screw slide 230 to rotate, so that the third screw slide 231 sleeved on its forward rotation section and reverse rotation section 2, the two groups of grinding cylinders 233 move toward each other, and the distance between the two groups of grinding cylinders 233 is adjusted according to the wafer chamfer width requirement, so that the peripheral side of the circular wafer 103 contacts the grinding groove 234; at the same time, the rotating motor 223 is started to drive the rotating shaft 226 to rotate, and the rotating shaft 226 drives the rotating table 227 and the second screw slide 230 connected thereto to rotate synchronously with the two groups of chamfering motors 201, so that the two groups of grinding cylinders 233 can circle around the peripheral side of the circular wafer 103 at a constant angular velocity to perform chamfering and grinding operations on the peripheral side of the circular wafer 103; Step 4: Reset after processing; When the chamfering process is completed, first control the second drive motor 242 to rotate in the opposite direction, and the second drive motor 242 drives the first bidirectional screw 231 in the second screw slide 230 to rotate in the opposite direction, so that the two groups of third screw sliders 232 move in opposite directions, and the two groups of grinding cylinders 233 are restored to the initial spacing position; at the same time, the operation of the chamfering motor 201 is stopped to stop the rotation of the grinding cylinder 233, and then, the second screw slide 230 and the two groups of chamfering motors 201 are rotated in the opposite direction by the rotating motor 223, and the operation is stopped after resetting to the initial position; then, the lifting motor 216 is started to rotate in the opposite direction, driving the lifting screw 217 to rotate in the opposite direction, so that the second screw slider 218 rises, and then drives the grinding cylinder 233 to rise away from the circular wafer 103; then, the first drive motor 207 is started to rotate in the opposite direction, so that the main body of the chamfering assembly moves toward another group of positioning assemblies to prepare for the processing of the next wafer; Step 5: Wafer cutting; The electric lifting rod 411 retracts, and the electric lifting rod 411 drives the fixed platform 412 to descend, so that the bottom of the circular wafer 103 contacts the supporting column 408, and then the electric slider 302 is started to move toward the opening 110 on one side of the ceiling 106 to the material changing position to remove the processed circular wafer 103.

[0031] Embodiment 2: Based on the wafer chamfering mechanism and method of a quartz crystal resonator provided in Embodiment 1 of the present application, Embodiment 2 of the present application proposes a wafer chamfering mechanism and method of a quartz crystal resonator. This Embodiment 2 is only a preferred method of Embodiment 1, and the implementation of Embodiment 2 will not affect the independent implementation of Embodiment 1. The second Embodiment 2 of the present invention will be further described below.

[0032] Please refer to Fig.12 and Fig.13As shown, a connecting truncated cone 236 is provided at one end of the mounting beam 221, and a first mounting hole 224 is provided at the top of the connecting truncated cone 236, which provides a stable mounting position for the rotating motor 223; the rotating motor 223 is installed at the top of the first mounting hole 224, and its main shaft is connected to the top of the rotating adjusting member 237, which ensures that the rotating motor 223 can effectively transmit power to the rotating adjusting member 237, and an adjusting bracket 241 is provided below the connecting truncated cone 236, and three groups of connecting grooves 243 are provided on the circumference of the connecting truncated cone 236. The adjusting bracket 241 is firmly connected to the connecting truncated cone 236 through the connecting grooves 243 and the connecting brackets 244 therein, forming a stable overall structure. The three groups of sliding grooves 238 radially distributed on the adjustment bracket 241 provide tracks for the sliding of the subsequent adjustment blocks 239. A slidable adjustment block 239 is arranged in each group of sliding grooves 238. The centripetal spiral groove opened at the bottom of the rotating adjustment member 237 is slidably connected with the threaded section at the top of the adjustment block 239. When the rotating adjustment member 237 rotates under the drive of the rotating motor 223, the adjustment block 239 will slide in the sliding groove 238, thereby realizing the adjustment of the positions of the three groups of chamfering motors 201; the chamfering motors 201 are three groups, which are respectively arranged at the bottom of the three groups of adjustment blocks 239. A grinding cylinder 233 is arranged at the bottom of each group of chamfering motors 201. A plurality of grinding grooves 234 of different specifications are provided on the side of the adjusting bracket 241, and these grinding grooves 234 can meet the processing of wafers of various sizes and chamfering requirements, thereby improving the processing flexibility and efficiency; a third mounting seat 240 is provided on one side of the adjusting bracket 241, and a first infrared sensor 202 is installed in a second mounting hole 235 provided on the third mounting seat 240, and the first infrared sensor 202 can detect the relative position of the grinding cylinder 233 and the circular wafer 103; in the chamfering processing operation, the rotating motor 223 is first started, and the rotating motor 223 starts to run, driving the rotating adjusting member 237 to rotate. As the rotating adjusting member 237 rotates, based on the centripetal spiral groove and the thread of the adjusting block 239 With the cooperation of the three sections, the three groups of adjustment blocks 239 move toward the center along a radial trajectory in the sliding groove 238 of the adjustment bracket 241; in the process of moving together, the three groups of grinding cylinders 233 gradually approach the circular wafer 103 until the circular wafer 103 is firmly clamped between the three groups of grinding grooves 234, thereby realizing the positioning and fixation of the circular wafer 103; at this time, the fixation of the circular wafer 103 by the multiple groups of fixed suction nozzles 413 is released, and the chamfering motor 201 is started to drive the grinding cylinder 233 to rotate, and the circular wafer 103 rotates accordingly under the friction force of the grinding groove 234, and since the rotation speeds of the three groups of chamfering motors 201 are different, the peripheral side of the circular wafer 103 is chamfered.

[0033] Compared with the method of using two groups of grinding cylinders 233 to chamfer the circumference of the circular wafer 103 in the first embodiment, the second embodiment clamps the circular wafer 103 between the grinding grooves 234 on the three groups of grinding cylinders 233. The main difference is that the circumference of the circular wafer 103 is chamfered by using the differential speed of the three groups of chamfering motors 201. In actual operation, when the three groups of chamfering motors 201 are running at different speeds, the circular wafer 103 will rotate under the friction of the grinding grooves 234, thereby realizing the chamfering operation on the edge of the circumference of the circular wafer 103. Not only can each part of the edge of the circular wafer 103 be subjected to a more uniform and comprehensive grinding effect, but also the occurrence of local over-grinding or under-grinding can be avoided, thereby improving The uniformity of the chamfering is improved. In addition, this differential grinding method can better adapt to the processing requirements of circular wafers 103 of different materials and sizes. For wafers with higher hardness or larger size, the grinding force can be controlled by adjusting the speed difference of the three sets of chamfering motors 201, so that chamfering can be achieved without damaging the wafer. Therefore, compared with the method of chamfering the circular wafer 103 by surrounding it with two sets of grinding cylinders 233, the quality and efficiency of the chamfering processing can be improved, thereby further enhancing the performance and competitiveness of the chamfering processing mechanism, so that it can perform well in the face of various complex processing tasks and meet the production requirements of the modern electronics industry for high-precision quartz crystal resonator wafers; the remaining conditions are consistent with those in Example 1, so this example will not be repeated.

[0034] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A wafer chamfering mechanism for a quartz crystal resonator, comprising a processing table, characterized in that: A first plane (101) and a second plane (102) are arranged on the top of the processing table, the first plane (101) and the second plane (102) are arranged in a trapezoidal shape, a chamfering assembly is arranged on the top of the second plane (102), the chamfering assembly comprises a plurality of sets of chamfering motors (201) with adjustable spacing and a first infrared sensor (202), the first infrared sensor (202) is arranged between the plurality of sets of chamfering motors (201), two sets of transport assemblies for transporting circular wafers (103) are arranged on the top of the first plane (101), positioning assemblies are arranged on both sets of the transport assemblies, the positioning assemblies comprise an infrared receiver (401), and the infrared receiver (401) is arranged on the top of the transport assembly corresponding to the first infrared sensor (202).

2. The wafer chamfering mechanism for a quartz crystal resonator according to claim 1, characterized in that: The chamfering assembly also includes a support column (203); a first slide rail (204) is arranged on the top of the second plane (102); a sliding block (205) is slidably arranged on the top of the first slide rail (204); a first screw slide (206) is arranged on one side of the first slide rail (204); a first drive motor (207) is arranged on one end of the first screw slide (206); a first slidable screw slider (208) is arranged on the first screw slide (206); the first screw slider (208) and the sliding block (205) are both connected to the bottom of a connecting plate (209); a mounting plate (210) is connected to the top of the connecting plate (209) by screws; the support column (203) is arranged on the top of the mounting plate (210); a support frame (212) is arranged on one side of the support column (203) and is connected to the top of the mounting plate (210).

3. The wafer chamfering mechanism for a quartz crystal resonator according to claim 2, characterized in that: A first mounting groove (213) is provided at the top of the support column (203), a guide seat (214) is provided in the first mounting groove (213), a first mounting seat (215) is provided at the top of the support column (203), a lifting motor (216) is provided at the top of the first mounting seat (215), a lifting screw rod (217) is provided in the guide seat (214), a second screw rod slider (218) is sleeved on the lifting screw rod (217), first guide through grooves (219) are provided on both sides of the guide seat (214), first guide blocks (220) are provided on both sides of the second screw rod slider (218), two groups of the first guide blocks (220) are respectively slidably connected to two groups of the first guide through grooves (219), a through groove is provided on one side of the guide seat (214) and the first mounting groove (213), and one side of the second screw rod slider (218) passes through the two groups of the through grooves and is connected to the mounting beam (221).

4. The wafer chamfering mechanism for a quartz crystal resonator according to claim 3, characterized in that: A second mounting seat (222) is arranged on the top of the mounting beam (221), a rotating motor (223) is arranged on the top of the second mounting seat (222), a first mounting hole (224) is opened on the top of the mounting beam (221) corresponding to the rotating motor (223), a bearing (225) is arranged in the first mounting hole (224), a rotating shaft (226) passes through the first mounting hole (224) and the bearing (225) and is connected to the main shaft of the rotating motor (223), a rotating platform (227) is arranged on the top of the rotating shaft (226), the top of the bearing (225) is in contact with the rotating platform (227), a connecting piece (228) is arranged on the bottom end of the rotating shaft (226), the bottom of the connecting piece (228) is connected to a connecting seat (229) by screws, and the bottom of the connecting seat (229) is connected to the rotating seat (229). A second screw slide (230) is provided at the bottom of the second screw slide (230), a second drive motor (242) is provided at one end of the second screw slide (230), a first bidirectional screw (231) is provided inside the second screw slide (230), and a third screw slider (232) is sleeved on the forward rotation section and the reverse rotation section of the first bidirectional screw (231); the beveling motor (201) is provided in two groups, the bottom of the two groups of the third screw sliders (232) are provided with the beveling motor (201), the bottom of the two groups of the beveling motor (201) are provided with a grinding cylinder (233), the peripheral side of the grinding cylinder (233) is provided with a plurality of groups of grinding grooves (234) of different specifications, the bottom of the mounting beam (221) is provided with a second mounting hole (235), and the first infrared sensor (202) is provided in the second mounting hole (235).

5. The wafer chamfering mechanism for a quartz crystal resonator according to claim 3, characterized in that: A connecting truncated platform (236) is provided at one end of the mounting beam (221), a first mounting hole (224) is provided at the top of the connecting truncated platform (236), a rotating motor (223) is provided at the top of the first mounting hole (224), a top end of a rotating adjusting member (237) passes through the first mounting hole (224) and is connected to the main shaft of the rotating motor (223), an adjusting bracket (241) is provided below the connecting truncated platform (236), three groups of connecting grooves (243) are provided on the circumference of the connecting truncated platform (236), connecting brackets (244) are provided in the three groups of connecting grooves (243) and are connected to the adjusting bracket (241), and three groups of sliding through grooves (238) are provided on the adjusting bracket (241), the three groups of sliding through grooves (238) are radially distributed, and the three groups of sliding through grooves (238) are radially distributed. A slidable adjustment block (239) is arranged inside each of the three groups of adjustment blocks (239), a centripetal spiral groove is arranged at the bottom of the rotation adjustment member (237), a threaded section is arranged at the top of each of the three groups of adjustment blocks (239) corresponding to the centripetal spiral groove, and the threaded section is slidably connected to the centripetal spiral groove; the beveling motor (201) is arranged in three groups, the beveling motor (201) is arranged at the bottom of each of the three groups of adjustment blocks (239), a grinding cylinder (233) is arranged at the bottom end of each of the three groups of beveling motors (201), a plurality of grinding grooves (234) of different specifications are arranged on the circumference of the grinding cylinder (233), a third mounting seat (240) is arranged on one side of the adjustment bracket (241), a second mounting hole (235) is arranged on the third mounting seat (240), and the first infrared sensor (202) is arranged in the second mounting hole (235).

6. The wafer chamfering mechanism for a quartz crystal resonator according to claim 1, characterized in that: The transport component comprises a second slide rail (301), the second slide rail (301) is arranged on the top of the first plane (101), a slidable electric slider (302) is arranged on the top of the second slide rail (301), a limit block (303) is arranged at one end of the second slide rail (301), a limit plate (304) is arranged on the first plane (101) at the other end corresponding to the second slide rail (301), a mounting bracket (305) is arranged on the top of the electric slider (302), a fourth mounting seat (306) is arranged on one side of the mounting bracket (305), the infrared receiver (401) is arranged on the top of the fourth mounting seat (306), a second mounting groove (307) is opened on one side of the second plane (102) corresponding to the infrared receiver (401), and a second infrared sensor (308) is arranged in the second mounting groove (307).

7. The wafer chamfering mechanism for a quartz crystal resonator according to claim 6, characterized in that: The positioning assembly also includes two groups of positioning sliders (402), both ends of the mounting bracket (305) are provided with through holes, a second bidirectional screw rod (403) is inserted into the through holes, one end of the mounting bracket (305) is provided with a positioning motor (404), the main shaft of the positioning motor (404) is connected to one end of the second bidirectional screw rod (403), the two groups of positioning sliders (402) are respectively sleeved on the forward rotation section and the reverse rotation section of the second bidirectional screw rod (403), the mounting bracket (305) is provided with a guide plate (415), one side of the guide plate (415) is provided with two groups of second guide slots (405) corresponding to the two groups of positioning sliders (402), one side of the two groups of positioning sliders (402) is provided with a second guide block (406), and the two groups of the second guide blocks (406) are respectively slidably connected to the two groups of the second guide slots (405).

8. The wafer chamfering mechanism for a quartz crystal resonator according to claim 7, characterized in that: The mounting bracket (305) is provided with a fifth mounting seat (407), one side of the fifth mounting seat (407) is provided with a through groove corresponding to the second bidirectional screw rod (403), the top of the fifth mounting seat (407) is provided with a support column (408) for placing the circular wafer (103), the adjacent sides of the two groups of positioning slide blocks (402) are provided with a V-shaped positioning groove (409) corresponding to the circular wafer (103), and the top of the support column (408) is provided with a third mounting hole (409). 10), an electric lifting rod (411) is arranged in the third mounting hole (410), a fixing platform (412) is arranged on the top of the electric lifting rod (411), a plurality of through holes are provided on the fixing platform (412), a fixed suction nozzle (413) for fixing the circular wafer (103) is arranged in each of the plurality of through holes, a vacuum generator (414) is arranged on the top of the fifth mounting seat (407), and the vacuum generator (414) is connected to the plurality of fixed suction nozzles (413) through a pipeline.

9. The wafer chamfering mechanism for a quartz crystal resonator according to claim 1, characterized in that: An equipment box (104) is arranged at the bottom of the processing table, and the equipment box (104) is installed below the first plane (101). Two groups of columns (105) are arranged below the second plane (102). A ceiling (106) is arranged at the top of the processing table. Openings (110) are provided on both sides of the ceiling (106) corresponding to the two groups of transport components. Two groups of switchable door panels (107) are arranged on the front of the ceiling (106), and both groups of door panels (107) are provided with observation windows (108) and handles (109).

10. The method for using the wafer chamfering mechanism of a quartz crystal resonator according to any one of claims 1 to 9, characterized in that: The following steps are included: Step 1: Wafer loading and positioning; Start the electric slider (302) to move it on the second slide rail (301) to a preset material change position, place the circular wafer (103) to be processed on the top of the support column (408), start the positioning motor (404) to drive the second bidirectional screw (403) to rotate, so that the two groups of positioning sliders (402) sleeved on the forward rotation section and the reverse rotation section thereof move towards each other, and the V-shaped positioning grooves (409) on the adjacent sides of the two groups of positioning sliders (402) gradually approach the circular wafer (103) until the V-shaped positioning grooves (409) contact the edge of the circular wafer (103), thereby achieving preliminary positioning of the wafer and ensuring that the center of the circular wafer (103) is aligned with the center of the fixed platform (412); Step 2: Wafer positioning and fixing; The electric slider (302) is started to move on the second slide rail (301) toward the chamfering assembly until the infrared receiver (401) detects a signal from the second infrared sensor (308), at which time the electric slider (302) stops moving, the vacuum generator (414) is started to generate negative pressure through the pipe to fix the circular wafer (103) on the fixed table (412), thereby ensuring that the wafer will not be positionally shifted during the chamfering process, the positioning motor (404) rotates in the opposite direction to move the two groups of positioning sliders (402) in opposite directions, thereby releasing their fixation on the circular wafer (103), and then the electric lifting rod (411) is started to lift the fixed table (412), so that the circular wafer (103) reaches a preset chamfering processing position; Step 3: Chamfering operation; The first drive motor (207) is started to drive the chamfering assembly body to move until the infrared receiver (401) detects a signal from the first infrared sensor (202), at which time the chamfering assembly body reaches a predetermined position, the lifting motor (216) is started to drive the lifting screw (217) to rotate, so that the mounting beam (221) and the first infrared sensor (202) are lowered, so that one group of grinding grooves (234) on the grinding cylinder (233) and the circular wafer (103) are on the same horizontal plane based on the processing specifications, the two groups of chamfering motors (201) are started to drive the two groups of grinding cylinders (233) to rotate, and the second drive motor is started. The motor (242) drives the two sets of third screw sliders (232) to move toward each other, and adjusts the spacing between the two sets of grinding cylinders (233) based on the wafer chamfer width requirement, so that the peripheral side of the circular wafer (103) contacts the grinding groove (234). At the same time, the rotating motor (223) is started to drive the rotating shaft (226) to rotate, thereby driving the second screw slider (230) and the two sets of chamfering motors (201) to rotate synchronously, so that the two sets of grinding cylinders (233) can circle around the peripheral side of the circular wafer (103) at a constant angular velocity to perform a chamfering operation on the peripheral side of the circular wafer (103); Step 4: Reset after processing; When the chamfering process is completed, the second drive motor (242) is first controlled to rotate in the opposite direction to restore the two groups of the grinding cylinders (233) to the initial spacing position, and the operation of the chamfering motor (201) is stopped at the same time, so that the grinding cylinder (233) stops rotating; then, the second screw slide (230) and the two groups of the chamfering motors (201) are reset and stopped by the rotating motor (223), and the lifting motor (216) is started to make the grinding cylinder (233) rise away from the circular wafer (103); then, the first drive motor (207) is started to move the main body of the chamfering assembly toward another group of positioning assemblies to prepare for the processing of the next wafer; Step 5: Wafer cutting; The electric lifting rod (411) is retracted so that the bottom of the circular wafer (103) contacts the supporting column (408), and the electric slider (302) is started to move toward the opening (110) on the side of the ceiling (106) to the material change position to remove the processed circular wafer (103).

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