Wafer grinding machine and method for taking and placing wafer

Abstract

The invention discloses a wafer grinding machine tool and a method for taking and placing wafers, the wafer grinding machine tool comprises a plurality of wafer racks, a driving device, a grinding device, a front table, a rear table, a transferring device and a control unit, each wafer rack respectively penetrates through a plurality of positioning holes for positioning the wafers at intervals, and the driving device and the grinding device are arranged on the front table, the rear table, the transferring device and the control unit. Each wafer rack is provided with an identification mark for distinguishing and identifying each wafer rack, a first positioning mark for identifying the configuration center of each positioning hole and a hole position mark for identifying each positioning hole, and the wafer grinding device can bind the identification marks and the hole position marks corresponding to the wafers and becomes a grinding record beneficial to tracking the machining process of the wafers.

Description

Technical Field

[0001] The invention relates to an equipment component used in a wafer grinding process, and in particular to a wafer grinding machine and a method for taking and placing a wafer. Background Art

[0002] The wafer grinding equipment includes several wafer racks, a driving device, a grinding device and a transfer device, wherein each wafer rack is arranged on the driving device at intervals along a circular path, the driving device drives each wafer rack to run in a planetary cycle along the circular path, and each wafer rack rotates according to its radial center, each wafer rack passes through several positioning holes, each positioning hole is used to position and set a wafer, the grinding device has two grinding discs, each grinding disc performs grinding processing on two surfaces of each wafer set on each wafer rack, each surface is located on two opposite sides of the wafer in the thickness direction, and the transfer device is used to transfer each wafer to each positioning hole, and transfer each wafer away from the wafer rack after completing the grinding process.

[0003] The transfer device includes a pick-and-place unit, a processing unit and a robotic arm, wherein the pick-and-place unit is arranged at the working end of the robotic arm, and the pick-and-place unit includes a vacuum suction cup, a lifting structure and an image capturer, wherein the vacuum suction cup is used to attract and release the wafer, the lifting structure is used to control the lifting of the vacuum suction cup, and the image capturer is used to capture the image of the positioning hole. The processing unit is mainly composed of an electronic circuit with a microprocessor, which is used to run an image recognition program. The processing unit recognizes the image captured by the image capturer and controls the vacuum suction cup, the lifting structure and the robotic arm based on the recognition result.

[0004] The vacuum suction cup attracts the wafer to be ground, and then the robotic arm is activated to move the pick-and-place unit to the top of the positioning hole where the wafer is predetermined. The image capturer captures the image of the positioning hole, and the processing unit identifies whether the wafer is aligned with the positioning hole based on the image. The processing unit controls the robotic arm to operate according to the deviation value of the wafer and the positioning hole to make the wafer face the positioning hole. When the processing unit determines that the wafer is aligned with the positioning hole, the lifting structure is controlled to operate to lower the vacuum suction cup. When the wafer enters the positioning hole, the vacuum suction cup releases the wafer and sets the wafer in the selected positioning hole. The above operations are repeated to set multiple wafers in different positioning holes one by one.

[0005] After the grinding process is completed, the transfer device moves the multiple polished wafers away one by one. When each wafer is moved away from the wafer rack, the transfer device also needs to perform image recognition and alignment so that the vacuum suction cup can accurately align and attract the wafer, and the wafer can be moved away from the wafer rack and placed in the set position to prepare for the execution of the next process.

[0006] The processing history of each wafer needs to be recorded separately. The grinding process of the wafer not only needs to record the grinding time of the grinding wafer, but also needs to record the wafer rack and positioning hole where the wafer is positioned. The transfer device cannot identify the wafer rack and positioning hole where each wafer is transferred and positioned, which is not conducive to tracking the processing history of each wafer. Summary of the invention

[0007] The main purpose of the present invention is to provide a wafer grinding machine and a method for taking and placing a wafer.

[0008] In order to achieve the aforementioned objectives, the present invention adopts the following technical solutions.

[0009] A wafer grinding machine includes several wafer racks, a driving device, a grinding device, a front stage, a rear stage, a transfer device and a control unit, wherein each wafer rack is arranged at intervals on the driving device, each wafer rack is respectively penetrated by several positioning holes at intervals, each positioning hole is respectively used to set and position a wafer, and the grinding device is used to grind each wafer.

[0010] Each wafer rack forms an identification mark, each identification mark is used to distinguish and identify each wafer rack. Each wafer rack forms a first positioning mark, the first positioning mark is used to identify the configuration center of each positioning hole. Each wafer rack forms a plurality of hole position marks, each hole position mark is adjacent to each positioning hole, and each hole position mark is used to distinguish and identify each positioning hole.

[0011] The front stage forms at least one first configuration structure for arranging a wafer to be ground.

[0012] The post stage forms at least one second configuration structure for placing the polished wafer.

[0013] The transfer device includes a pick-and-place unit and a robot arm, wherein the pick-and-place unit is arranged at the working end of the robot arm, and the pick-and-place unit includes a socket, a lifter, a suction cup module and an image capturer, wherein the socket is connected to the robot arm, the lifter is connected to the socket, and the suction cup module is connected to the lifter, so that the lifter drives the suction cup module to move up and down to approach or move away from a selected wafer, and the suction cup module includes at least one vacuum suction cup for attracting and releasing the wafer, and the image capturer is connected to the socket for capturing images.

[0014] The control unit is mainly composed of electronic circuits, which include a programmable controller, a storage medium and a microprocessor, wherein the programmable controller and the storage medium are electrically connected to the microprocessor respectively, the programmable controller is electrically connected to the pick-and-place unit and the robotic arm, the storage medium is a readable and writable memory medium for storing the grinding records of each wafer, and the microprocessor is electrically connected to the image capture device.

[0015] The microprocessor runs an image recognition program to identify the image captured by the image capturer, and controls the robot arm and the pick-and-place unit through the programmable controller based on the recognition result to place or remove the wafer. The microprocessor also binds the wafer's identity identifier, sets the wafer's identification mark and hole position mark, which become the grinding record of the corresponding wafer.

[0016] A method for placing and picking up a wafer is performed using the wafer grinding tool as described above, and includes the following steps.

[0017] The pick-and-place unit picks up the wafer: the robot arm moves the pick-and-place unit to the space above the front table, and the control unit controls the transfer device to calibrate the suction cup module based on the result of the image captured by the recognition image capturer to align the position of the wafer to be ground which is pre-configured in the first configuration structure, and then the suction cup module attracts the wafer.

[0018] The pick-and-place unit aligns the wafer rack: the robot arm drives the pick-and-place unit to move to the space above the selected wafer rack. The control unit controls the transfer device to calibrate the suction cup module relative to the selected positioning hole based on the result of the image captured by the recognition image capture device and the first positioning mark as a reference. The control unit records the identification mark of the wafer rack and the hole position mark of the positioning hole corresponding to the wafer.

[0019] The pick-and-place unit places the wafer: the suction cup module releases the wafer and enters the corresponding positioning hole, which enables the driving device and the grinding device to operate to complete the grinding process of the wafer.

[0020] The pick-and-place unit aligns the wafer: After the grinding process is completed, the robot arm drives the pick-and-place unit to move to the space above the selected wafer rack. The control unit controls the transfer device to calibrate the suction cup module to align with the selected wafer that has been ground based on the results of the image captured by the recognition image capturer, and the control unit records the identification mark of the wafer rack and the hole position mark of the positioning hole corresponding to the wafer.

[0021] The transfer device transfers the wafer: the suction cup module attracts the wafer, and then the suction cup module drives the wafer to rise and leave the wafer rack, and then the robot arm drives the pick-and-place unit to move to the top of the rear stage. The control unit controls the transfer device to calibrate the positioning of the suction cup module relative to the second configuration structure based on the results of the image captured by the recognition image capturer, and the pick-and-place unit releases the polished wafer to the second configuration structure.

[0022] Storing grinding records: The microprocessor binds the wafer's identity identifier, the corresponding identification mark and the hole position mark of the wafer to form the grinding record of the corresponding wafer, and the storage medium stores the grinding record.

[0023] The main effect and advantage of the present invention is that it can record the identification mark of the wafer rack where each wafer is set and the hole position mark of the corresponding positioning hole, and combine it with the identity identifier of the wafer to become a grinding record, which is conducive to tracking the processing history of each wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a three-dimensional schematic diagram of a partial structure of a wafer grinding tool according to the first embodiment of the present invention.

[0025] Figure 2 It is a partial top view of the wafer grinding tool according to the first embodiment of the present invention.

[0026] Figure 3 yes Figure 2 A partial enlarged view showing the first positioning mark and the hole position mark.

[0027] Figure 4 yes Figure 2 A partial enlarged view showing portions of the second positioning mark and the first configuration mark.

[0028] Figure 5 yes Figure 2 A partial enlarged view showing portions of the third positioning mark and the second configuration mark.

[0029] Figure 6 It is a partial stereoscopic view of the wafer grinding tool according to the first embodiment of the present invention, showing another viewing angle of the pick-and-place unit.

[0030] Figure 7 4 is a circuit block diagram of the transfer device according to the first embodiment of the present invention.

[0031] Figure 8 It is a flow chart of a method for loading and unloading a wafer according to the first embodiment of the present invention.

[0032] Fig. 9 It is a three-dimensional schematic diagram of a wafer grinding machine placing a wafer on a wafer rack according to the first embodiment of the present invention.

[0033] Fig.10 It is a three-dimensional schematic diagram of a part of the structure of a wafer grinding tool according to the second embodiment of the present invention, showing a robot arm and a transfer device.

[0034] Fig.11 It is a partially enlarged top view of the wafer rack according to the third embodiment of the present invention. DETAILED DESCRIPTION

[0035] The drawings show embodiments of the present invention, but these embodiments are for illustration only and the patent application is not limited to these embodiments.

[0036] like Figures 1 to 7As shown, the wafer grinding machine includes several wafer racks 10, a driving device 20, a grinding device 30, a front stage 40, a rear stage 50, a transfer device 60 and a control unit 70, wherein each wafer rack 10 is arranged at intervals on the driving device 20, the driving device 20 is used to drive each wafer rack 10 to circulate, and each wafer rack 10 performs a rotational action while circulating, and each wafer rack 10 is respectively penetrated by several positioning holes 11 at intervals. In this example, the positioning holes 11 are arranged equidistantly, and each positioning hole 11 is respectively used to set and position a wafer 90, and the grinding device 30 is used to grind each wafer 90 set on each wafer rack 10; the driving device 20 and the grinding device 30 are familiar to people in the relevant technical field, and the driving device 20 and the grinding device 30 are not necessarily related to the technical features of the present invention, and the specific structure of the driving device 20 and the grinding device 30 will not be described in detail.

[0037] Each wafer rack 10 forms an identification mark 12, each identification mark 12 is used to distinguish and identify each wafer rack 10, each wafer rack 10 forms a first positioning mark 13, the first positioning mark 13 is used to identify the configuration center of each positioning hole 11. In this example, each first positioning mark 13 is located at the radial center of each wafer rack 10, and each positioning hole 11 is configured around the first positioning mark 13. Each wafer rack 10 forms a plurality of hole position marks 14, each hole position mark 14 is adjacent to each positioning hole 11, and each hole position mark 14 is used to distinguish and identify each positioning hole 11.

[0038] The identification mark 12, the first positioning mark 13 and each hole position mark 14 can be selected as numbers, text, graphics or a combination thereof. Different wafer racks 10 have different identification marks 12. In this example, numbers are selected as identification marks 12, the first positioning mark 13 and the hole position mark 14 are selected as holes passing through the wafer rack 10, and each hole position mark 14 is selected as a hole with a different aperture.

[0039] The front stage 40 cooperates with the number and configuration relationship of each positioning hole 11 of each wafer rack 10 to form a plurality of first configuration structures 41 and a plurality of first configuration marks 42 for setting the wafers 90 to be ground. Each first configuration mark 42 is used to distinguish and identify each first configuration structure 41. The front stage 40 forms a second positioning mark 43, and the second positioning mark 43 is used to identify the configuration center of each first configuration structure 41.

[0040] The number and configuration relationship of the first configuration structures 41 may not be limited to the number and configuration relationship of the positioning holes 11. The number of the first configuration structures 41 may be increased or decreased as needed. When the front stage 40 chooses to form one first configuration structure 41, the front stage 40 chooses not to form the first configuration mark 42 and the second positioning mark 43. When the front stage 40 chooses to form several first configuration structures 41, the front stage 40 chooses to form each first configuration mark 42 and the second positioning mark 43.

[0041] The rear stage 50 cooperates with the number and configuration relationship of each positioning hole 11 of each wafer rack 10 to form a plurality of second configuration structures 51 for setting the polished wafers 90 at intervals. The rear stage 50 forms a third positioning mark 53, and the third positioning mark 53 is used to identify the configuration center of each second configuration structure 51.

[0042] The number and arrangement relationship of the second configuration structures 51 may not be limited to the number and arrangement relationship of the positioning holes 11. The number of the second configuration structures 51 may be increased or decreased as needed. When the rear stage 50 chooses to form one second configuration structure 51, the rear stage 50 cooperates to choose not to form the second configuration mark 52 and the third positioning mark 53. When the rear stage 50 chooses to form several second configuration structures 51, the rear stage 50 cooperates to choose to form each second configuration mark 52 and the third positioning mark 53.

[0043] The transfer device 60 is used to transfer each wafer 90 between the front stage 40, the wafer rack 10 and the back stage 50, and includes a pick-and-place unit 61 and a robot arm 62, wherein the pick-and-place unit 61 is arranged at the working end 63 of the robot arm 62, and the robot arm 62 is used to drive the pick-and-place unit 61 to approach or move away from a selected wafer rack 10.

[0044] The pick-and-place unit 61 includes a socket 64, a lifter 65, a suction cup module 66 and an image capturer 67, wherein the socket 64 is connected to the robot arm 62, the lifter 65 is connected to the socket 64, and the suction cup module 66 is connected to the lifter 65, so that the lifter 65 drives each suction cup module 66 to move up and down to approach or move away from a selected wafer 90. The suction cup module 66 includes three vacuum suction cups 662 for attracting and releasing the wafer 90. The number of vacuum suction cups 662 constituting the suction cup module 66 can be increased or decreased as needed, and is limited to each suction cup module 66 having at least one vacuum suction cup 662.

[0045] The image capturer 67 is connected to the socket 64 for capturing images. In this example, a camera lens with a photosensitive component (not shown) is selected as the image capturer 67. Specific examples of the photosensitive component include a charge-coupled device (CCD) and a complementary metal-oxide-semiconductor (CMOS).

[0046] The control unit 70 is mainly composed of electronic circuits. The control unit 70 can be optionally set at an appropriate position of the wafer grinding machine. It includes a programmable controller 71, a storage medium 72 and a microprocessor 73, wherein the programmable controller 71 and the storage medium 72 are electrically connected to the microprocessor 73 respectively, the programmable controller 71 is electrically connected to the placement unit 61 and the robot arm 62, the storage medium 72 is a readable and writable memory medium, and is used to store the grinding records of each wafer 90, and the microprocessor 73 is electrically connected to the image capture device 67.

[0047] The microprocessor 73 runs an image recognition program to recognize the image captured by the image capturer 67, and controls the robot arm 62 and the pick-and-place unit 61 through the programmable controller 71 based on the recognition result, so that the wafer 90 to be ground is placed in the selected positioning hole 11 of the selected wafer rack 10, and the ground wafer 90 is taken out from the selected positioning hole 11 of the selected wafer rack 10. The microprocessor 73 also binds the identity identifier of the wafer 90, the first configuration mark 42, the identification mark 12, the hole position mark 14 and the second configuration mark 52 corresponding to the wafer 90 to become the grinding record of the corresponding wafer 90.

[0048] When the front stage 40 does not have the first configuration mark 42 , the grinding record formed by the microprocessor 73 does not have the first configuration mark 42 ; when the rear stage 50 does not have the second configuration mark 52 , the grinding record formed by the microprocessor 73 does not have the second configuration mark 52 .

[0049] like Figures 8 to 9 As shown, the method for picking up and placing a wafer using the aforementioned wafer grinding tool includes the following steps.

[0050] The pick-and-place unit picks up the wafer: the robot arm 62 moves the pick-and-place unit 61 to the space above the front stage 40, and the control unit 70 controls the transfer device 60 to calibrate the suction cup module 66 relative to the position of a selected wafer 90 from the several wafers 90 to be ground pre-configured in each first configuration structure 41 based on the result of the image capture device 67 capturing the image of the front stage 40, and the microprocessor 73 records the first configuration mark 42 corresponding to the first configuration structure 41 of the wafer 90, and then, the control unit 70 controls each vacuum suction cup 662 of the suction cup module 66 to attract the wafer 90, and the control unit 70 records the first configuration mark 42 corresponding to the wafer 90.

[0051] The alignment process of the transfer device 60 calibrating the suction cup module 66 relative to the selected wafer 90 is mainly as follows: the robot arm 62 moves to align the center of the pick-and-place unit 61 with the second positioning mark 43, and then the control unit 70 controls the movement of the robot arm 62 based on the second positioning mark 43 to move the pick-and-place unit 61 toward the top of the selected wafer 90. The control unit 70 controls the moving direction and amount of the robot arm 62 based on the difference in alignment between the wafer 90 and the suction cup module 66 to align the suction cup module 66 with the wafer 90.

[0052] When the front stage 40 selects to form a first configuration structure 41 and does not have the second positioning mark 43 and the first configuration mark 42, the control unit 70 controls the movement of the robot arm 62 to move the pick-and-place unit 61 toward the top of the selected wafer 90. The control unit 70 controls the movement direction and amount of the robot arm 62 based on the difference in alignment between the wafer 90 and the suction cup module 66 to align the suction cup module 66 with the wafer 90.

[0053] The pick-and-place unit aligns the wafer rack: the robot arm 62 drives the pick-and-place unit 61 to move to the space above the selected wafer rack 10, the image capturer 67 captures the identification mark 12 of the wafer rack 10, the microprocessor 73 runs the image recognition program, identifies and records the wafer rack 10 on which each wafer 90 is set, the image capturer 67 captures the image of the first positioning mark 13 of the wafer rack 10, the microprocessor 73 identifies the first positioning mark 13, and calculates the distance deviation value of the axial positioning of the pick-and-place unit 61 and the selected positioning hole 11 based on the first positioning mark 13, the control unit 70 controls the movement amount and movement direction of the robot arm 62, so that the transfer device 60 can calibrate the alignment of the suction cup module 66 relative to the selected positioning hole 11, and the control unit 70 records the identification mark 12 of the wafer rack 10 and the hole position mark 14 of the positioning hole 11 corresponding to the wafer 90.

[0054] The pick-and-place unit places the wafer: the control unit 70 controls the suction cup module 66 to release the wafer 90 and enter the positioning hole 11 .

[0055] By repeating the aforementioned steps of the pick-and-place unit picking up the wafer, the pick-and-place unit aligning the wafer rack, and the pick-and-place unit placing the wafer, multiple wafers 90 to be ground can be placed one by one in each positioning hole 11 of each wafer rack 10. Accordingly, the driving device 20 and the grinding device 30 can be operated to complete the grinding process of each wafer 90.

[0056] The pick-and-place unit aligns the wafer: After the grinding process is completed, the robot arm 62 drives the pick-and-place unit 61 to move to the space above the selected wafer rack 10. The control unit 70 controls the transfer device 60 to calibrate the suction cup module 66 relative to the selected wafer 90 that has been ground based on the result of the image of the wafer rack 10 captured by the recognition image capturer 67. The control unit 70 also records the identification mark 12 of the wafer rack 10 and the hole position mark 14 of the positioning hole 11 corresponding to the wafer 90.

[0057] The transfer device transfers the wafer: the suction cup module 66 attracts the wafer 90, and then the suction cup module 66 drives the wafer 90 to rise and leave the wafer rack 10, and then the robot arm 62 drives the pick-and-place unit 61 to move to the top of the back stage 50. The control unit 70 controls the transfer device 60 to calibrate the positioning of the suction cup module 66 relative to the second configuration structure 51 based on the result of the image captured by the recognition image capturer 67, and the pick-and-place unit 61 releases the polished wafer 90 to the second configuration structure 51 of the back stage 50, and the control unit 70 records the second configuration mark 52 corresponding to the second configuration structure 51 where the wafer 90 is set.

[0058] The alignment process of the transfer device 60 calibrating the suction cup module 66 relative to the second configuration structure 51 is mainly as follows: the robot arm 62 moves to align the center of the pick-and-place unit 61 with the third positioning mark 53, and then the control unit 70 controls the movement of the robot arm 62 based on the third positioning mark 53 to move the pick-and-place unit 61 toward the top of the selected second configuration structure 51. The control unit 70 controls the movement direction and amount of the robot arm 62 based on the difference in alignment between the second configuration structure 51 and the suction cup module 66 to align the suction cup module 66 with the second configuration structure 51.

[0059] Storing grinding records: The microprocessor 73 binds the identity identifier of the wafer 90, the first configuration mark 42, the identification mark 12, the hole mark 14 and the second configuration mark 52 corresponding to the wafer 90 to form a grinding record corresponding to the wafer 90, and the storage medium 72 stores the grinding record.

[0060] When the front stage 40 does not have the first configuration mark 42 , the grinding record formed by the microprocessor 73 does not have the first configuration mark 42 ; when the rear stage 50 does not have the second configuration mark 52 , the grinding record formed by the microprocessor 73 does not have the second configuration mark 52 .

[0061] When the wafer 90 is placed on the selected wafer rack 10 and the wafer 90 is taken out from the wafer rack 10, the transfer device 60 can identify the first configuration structure 41, the wafer rack 10, the positioning hole 11 and the second positioning structure 51 configured for each wafer 90, and record the first configuration mark 42 of the first configuration structure 41 set for each wafer 90, the identification mark 12 corresponding to the wafer rack 10, the hole position mark 14 corresponding to the positioning hole 11 and the second configuration mark 52 corresponding to the second configuration structure 51, and bind the identity identifier of each wafer 90 to form a grinding record stored in the storage medium 72, which is conducive to tracking the processing history of each wafer 90.

[0062] The suction cup module 66 further includes a positioning frame 664 , each vacuum suction cup 662 is respectively disposed on the positioning frame 664 , and the lifter 65 is connected to the positioning frame 664 .

[0063] like Fig.10 As shown, the second embodiment is different from the first embodiment mainly in that the shape of the robot arm 62 is different.

[0064] like Fig.11 As shown, the third embodiment is mainly different from the first embodiment in that each hole position mark 14 is a hole of different shapes.

Claims

1. A wafer grinding machine, characterized in that It includes several wafer racks, a driving device, a grinding device, a front stage, a rear stage, a transfer device and a control unit, wherein each wafer rack is arranged at intervals on the driving device, each wafer rack is respectively penetrated by several positioning holes at intervals, each positioning hole is respectively used to set and position a wafer, and the grinding device is used to grind each wafer; Each wafer rack forms an identification mark, each identification mark is used to distinguish and identify each wafer rack, each wafer rack forms a first positioning mark, the first positioning mark is used to identify the configuration center of each positioning hole, each wafer rack forms a plurality of hole position marks, each hole position mark is adjacent to each positioning hole, and each hole position mark is used to distinguish and identify each positioning hole; The front stage forms at least one first configuration structure for setting a wafer to be ground; The back stage forms at least one second configuration structure for setting the polished wafer; The transfer device includes a pick-and-place unit and a robot arm, wherein the pick-and-place unit is arranged at the working end of the robot arm, and the pick-and-place unit includes a socket, a lifter, a suction cup module and an image capturer, wherein the socket is connected to the robot arm, the lifter is connected to the socket, and the suction cup module is connected to the lifter, so that the lifter drives the suction cup module to move up and down to approach or move away from a selected wafer, and the suction cup module includes at least one vacuum suction cup for sucking and releasing the wafer, and the image capturer is connected to the socket for capturing images; The control unit is mainly composed of an electronic circuit, which includes a programmable controller, a storage medium and a microprocessor, wherein the programmable controller and the storage medium are electrically connected to the microprocessor respectively, the programmable controller is electrically connected to the pick-and-place unit and the robot arm, the storage medium is a readable and writable memory medium for storing the polishing records of each wafer, and the microprocessor is electrically connected to the image capture device; The microprocessor runs an image recognition program to identify the image captured by the image capturer, and controls the robot arm and the pick-and-place unit through the programmable controller based on the recognition result to place or remove the wafer. The microprocessor also binds the wafer's identity identifier, sets the wafer's identification mark and hole position mark, which become the grinding record of the corresponding wafer.

2. The wafer grinding machine according to claim 1, characterized in that The front stage cooperates with the number and arrangement relationship of the positioning holes of each wafer rack to form a plurality of first arrangement structures and a plurality of first arrangement marks at intervals, each first arrangement mark is used to distinguish and identify each first arrangement structure, and the front stage forms a second positioning mark, and the second positioning mark is used to identify the arrangement center of each first arrangement structure; The microprocessor binds the identity identifier of each wafer, and sets the first configuration mark, identification mark and hole position mark of each wafer accordingly, so as to form a plurality of grinding records corresponding to each wafer respectively.

3. The wafer grinding tool according to claim 1, characterized in that The rear stage cooperates with the number and arrangement relationship of the positioning holes of each wafer rack to form a plurality of second arrangement structures at intervals. The rear stage forms a third positioning mark, and the third positioning mark is used to identify the arrangement center of each second arrangement structure.

4. The wafer grinding tool according to claim 3, characterized in that The rear stage forms a plurality of second configuration marks, each second configuration mark is used to distinguish and identify each second configuration structure; The microprocessor binds the identity identifier of each wafer, and sets the identification mark, hole position mark and second configuration mark of each wafer accordingly, so as to form a plurality of grinding records corresponding to each wafer respectively.

5. A method for picking up and placing a wafer, performed using the wafer grinding tool as claimed in claim 1, characterized in that The following steps are involved: The pick-and-place unit takes up the wafer: the robot arm moves the pick-and-place unit to the space above the front stage, and the control unit controls the transfer device to calibrate the position of the suction cup module relative to the wafer to be ground which is pre-configured in the first configuration structure based on the result of the image captured by the recognition image capturer, and then the suction cup module attracts the wafer; The pick-and-place unit aligns the wafer rack: the robot arm drives the pick-and-place unit to move to the space above the selected wafer rack. The control unit controls the transfer device to calibrate the position of the suction cup module relative to the selected positioning hole based on the result of the image captured by the recognition image capture device and the first positioning mark as a reference. The control unit records the identification mark of the wafer rack and the hole position mark of the positioning hole corresponding to the wafer. The pick-and-place unit places the wafer: the suction cup module releases the wafer and puts it into the corresponding positioning hole, which then causes the driving device and the grinding device to operate, completing the grinding process of the wafer; Wafer alignment by the pick-and-place unit: After the grinding process is completed, the robot arm drives the pick-and-place unit to move to the space above the selected wafer rack. The control unit controls the position of the transfer device to calibrate the suction cup module relative to the selected polished wafer based on the image captured by the recognition image capturer, and the control unit records the identification mark of the wafer rack and the hole position mark of the positioning hole corresponding to the wafer; The transfer device transfers the wafer: the suction cup module attracts the wafer, and then the suction cup module drives the wafer to rise and leave the wafer rack, and then the robot arm drives the pick-and-place unit to move to the top of the rear stage, and the control unit controls the transfer device to calibrate the position of the suction cup module relative to the second configuration structure based on the result of the image captured by the recognition image capturer, and the pick-and-place unit releases the polished wafer to the second configuration structure; Storing grinding records: The microprocessor binds the wafer's identity identifier, the corresponding identification mark and the hole position mark of the wafer to form the grinding record of the corresponding wafer, and the storage medium stores the grinding record.

Images