Chip variable-pitch conveying device and chip testing machine

Abstract

The invention discloses a chip variable-pitch conveying device and a chip testing machine. The chip variable-pitch conveying device comprises a rack and a variable-pitch mechanism. The distance changing mechanism is configured to adjust the distance between the chips; the variable-pitch mechanism comprises a first rotary drum, a sliding table and a driving rack, a first spiral limiting groove is formed in the peripheral surface of the first rotary drum, a driving gear is arranged at one end of the first spiral limiting groove, a plurality of buffering grooves are formed in the sliding table, and chips are placed in the buffering grooves in the variable-pitch mechanism. The driving gear is meshed with the driving rack, and when the first rotary drum rotates, the driving gear moves in the extending direction of the driving rack on the basis of meshing of the driving rack; meanwhile, the distance between the cache grooves can be adjusted under the driving of the first spiral limiting grooves, and then the distance between the chips is adjusted, so that the testing distance of the testing device is met, and the purpose of facilitating the testing device to test the chips is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip detection, and in particular to a chip variable-distance transmission device and a chip testing machine. Background Art

[0002] In the chip production process, rectangular trays are often used to hold chips. The trays have several hollow grooves, each of which can hold a chip.

[0003] In the subsequent chip testing process, the chips in the tray need to be taken out and loaded into the testing equipment for testing. In order to test multiple chips at the same time, the grabbing device can be provided with multiple grabbing members, so that the chips to be tested can be grabbed from the multiple grooves of the material box and transported to the testing device for chip testing.

[0004] However, the test spacing of the test device is different from the spacing between the grooves in the tray, which makes it impossible for the test device to test multiple chips to be tested at the same time, resulting in low test efficiency and being unfavorable for chip production. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a chip variable pitch conveying device, which can adjust the spacing between chips in a tray to a spacing suitable for testing by a testing device, thereby facilitating the testing device to test the chips.

[0006] The present invention also provides a chip testing machine having the above-mentioned chip variable-pitch transmission device.

[0007] According to an embodiment of the present invention, the chip variable pitch transmission device comprises: A frame, wherein the frame is provided with a slide seat, the slide seat is configured to slide close to the testing device, one side of the slide seat has a tray placement area, and the tray placement area is used to place a tray for storing chips; and A pitch-changing mechanism, the pitch-changing mechanism is disposed on the slide, the pitch-changing mechanism is located at one side of the tray placement area, and the pitch-changing mechanism is configured to adjust the spacing between the chips; The pitch-changing mechanism comprises: A first rotating drum, wherein the first rotating drum is rotatably disposed on the sliding seat, a plurality of first spiral limiting grooves are disposed on the outer circumference of the first rotating drum, and a driving gear is disposed at one end of the first rotating drum; A slide, the slide is arranged on one side of the first rotating drum, the length direction of the slide is parallel to the axis direction of the first rotating drum, a plurality of buffer slots are arranged on the slide, the buffer slots are configured to slide on the slide along the length direction of the slide, the buffer slots are used to place the chips, the slide is connected to the first rotating drum through a first connection stopper, and the first connection stopper is arranged in the first spiral stopper slot; and A driving rack is arranged on the frame, the length direction of the driving rack extends horizontally along the axis direction perpendicular to the first rotating drum, one end of the driving rack is close to the testing device, the initial position of the driving gear is engaged with the other end of the driving rack, and the driving gear is configured to translate along the length direction of the driving rack.

[0008] The chip variable pitch conveying device according to the embodiment of the present invention has at least the following beneficial effects: the chip is placed in the cache slot on the variable pitch mechanism, and when the first rotating drum rotates, the cache slot can be driven by the first spiral limiting groove to slide along the length direction of the slide, and under the guidance of the first spiral limiting groove, the spacing between the cache slots can be adjusted, and then the spacing of the chips can be adjusted to meet the test spacing of the test device, thereby achieving the purpose of facilitating the test device to test the chip.

[0009] According to some embodiments of the present invention, a plurality of driving gears are provided at the other end of the first rotating drum, the plurality of driving gears are spaced apart from each other, a plurality of driving racks are provided, the plurality of driving racks are spaced apart from each other, the plurality of driving gears and the plurality of driving racks are arranged in one-to-one correspondence, and the plurality of driving racks are configured to be able to slide along the axial direction of the first rotating drum so that the driving racks can respectively engage with the corresponding driving gears.

[0010] According to some embodiments of the present invention, the radius of the multiple-stage driving gear gradually decreases in a direction away from the first rotating drum, and the height of the multiple driving racks gradually increases in a direction away from the first rotating drum.

[0011] According to some embodiments of the present invention, a gripping mechanism is further included, wherein the gripping mechanism is disposed on the frame, the gripping mechanism is slidably disposed between the variable distance mechanism and the tray placement area, and the gripping mechanism is configured to grab the chip from the tray and put it into the cache slot.

[0012] According to some embodiments of the present invention, the grasping mechanism includes a fixed plate, a first variable distance component is arranged on the fixed plate, a plurality of suction members are arranged on the first variable distance component, the first variable distance component is configured to adjust the spacing between the suction members, and the suction members are used to suck the chip.

[0013] According to some embodiments of the present invention, the first variable pitch component comprises: A slide plate, the slide plate is slidably disposed on the fixed plate, and the slide plate is configured to slide up and down in a vertical direction; A guide hanging ring, wherein a plurality of guide hanging rings are provided, both ends of the guide hanging rings are provided on the slide plate, and the plurality of guide hanging rings all have guide grooves; and The mounting plate is mounted on the guide hanging ring through a second connection limiter. The mounting plate can be slidably arranged on one side of the fixing plate in a horizontal direction. The suction member is arranged at the lower end of the mounting plate.

[0014] According to some embodiments of the present invention, the grasping mechanism also includes two groups of second distance variable assemblies, the second distance variable assemblies are arranged on the fixed plate, the second distance variable assemblies are respectively connected to the two ends of the guide hanging ring, the guide hanging ring can be extended and retracted along the length direction of the guide hanging ring, and the second distance variable assembly is configured to adjust the distance between the two ends of the guide hanging ring.

[0015] According to some embodiments of the present invention, two groups of the second pitch variable assemblies each include a second rotating drum, which is rotatably disposed on the fixed plate, and the two second rotating drums are respectively located on one side of the two ends of the guide hanging ring, and a plurality of second spiral limiting grooves are provided on the outer circumference of the second rotating drum, and the two ends of the guide hanging ring are respectively connected to the second rotating drum through a third connecting limiting member, and the third connecting limiting member is located in the second spiral limiting groove.

[0016] According to some embodiments of the present invention, the guide hanging ring includes a first half ring and a second half ring, the connecting ends between the first half ring and the second half ring are connected by an elastic member, and the outer end of the first half ring and the outer end of the second half ring are respectively connected to the second variable distance assembly.

[0017] According to the chip tester of the second aspect embodiment of the present invention, the chip tester includes the chip variable-pitch transmission device described in any one of the embodiments of the first aspect above, the chip tester also includes the testing device, the testing device includes a manipulator, the manipulator is used to grab the chip in the chip variable-pitch transmission device, and the testing device is configured to test the chip.

[0018] The chip testing machine according to the embodiment of the present invention has at least the following beneficial effects: through the chip variable-pitch conveying device, the spacing between the cache slots can be adjusted, and then the spacing of the chips can be adjusted, so that the spacing of the chips on the tray is adjusted to meet the test spacing of the testing device, thereby facilitating the grabbing of the testing device and achieving the purpose of facilitating the testing device to test the chip.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 It is a schematic structural diagram of a chip variable-distance transmission device according to an embodiment of the present invention; Figure 2 for Figure 1 The schematic diagram of the structure of the variable pitch mechanism of the chip variable pitch transmission device is shown; Figure 3 for Figure 1 The schematic diagram of the structure of the grabbing mechanism of the chip variable-pitch conveying device is shown; Figure 4 for Figure 3 A partial structural schematic diagram of the grabbing mechanism shown (mounting plate omitted); Figure 5 for Figure 4 A schematic structural diagram of a guide hanging ring of a grabbing mechanism is shown.

[0021] Figure Number: Frame 10; slide 11; tray placement area 12; Pitch changing mechanism 20; first rotating drum 21; first spiral limiting groove 211; driving gear 212; slide 22; buffer groove 221; driving rack 23; Grabbing mechanism 30; fixing plate 31; first pitch changing assembly 32; sliding plate 321; guide hanging ring 322; guide groove 3221; first half ring 3222; second half ring 3223; mounting plate 323; second pitch changing assembly 33; second rotating drum 331; second spiral limiting groove 3311. DETAILED DESCRIPTION

[0022] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0023] In the description of the present invention, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0024] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0025] Reference Figures 1 to 4 According to the chip variable pitch conveying device of the embodiment of the present invention, the chip variable pitch conveying device includes a frame 10 and a pitch changing mechanism 20. The frame 10 is provided with a slide 11, and the slide 11 is configured to slide close to the test device (not shown in the figure). One side of the slide 11 has a tray placement area 12, and the tray placement area 12 is used to place the tray for storing chips; the pitch changing mechanism 20 is arranged on the slide 11, and the pitch changing mechanism 20 is located on one side of the tray placement area 12, and the pitch changing mechanism 20 is configured to adjust the spacing between chips. The pitch changing mechanism 20 includes: a first rotating drum 21, a slide 22, and a driving rack 23. The first rotating drum 21 is rotatably arranged on the slide 11, and a plurality of first spiral limiting grooves 211 are arranged on the outer circumferential surface of the first rotating drum 21, and a driving gear 212 is arranged at one end of the first rotating drum 21. The slide 22 is arranged on one side of the first rotating drum 21, and the length direction of the slide 22 is parallel to the axial direction of the first rotating drum 21. A plurality of buffer grooves 221 are arranged on the slide 22, and the buffer grooves 221 are configured to slide on the slide 22 along the length direction of the slide 22. The buffer grooves 221 are used to place chips. The slide 22 is connected to the first rotating drum 21 through a first connecting limiter (not shown in the figure), and the first connecting limiter is arranged in the first spiral limiting groove 211; the driving rack 23 is arranged on the frame 10, and the length direction of the driving rack 23 extends horizontally along the axial direction perpendicular to the first rotating drum 21, one end of the driving rack 23 is close to the testing device, and the initial position of the driving gear 212 is engaged with the other end of the driving rack 23, and the driving gear 212 is configured to translate along the length direction of the driving rack 23.

[0026] The chip variable pitch transmission device of the present invention realizes efficient and accurate transmission of chips from a material tray (not shown in the figure) to a test device by integrating a frame 10, a slide 11 and a variable pitch mechanism 20, and solves the problem that the test spacing of the test device does not match the spacing of the grooves in the material tray. The variable pitch mechanism 20 uses the cooperation of the first spiral limiting groove 211 on the first rotating cylinder 21 with the buffer groove 221 and the first connecting limiting member on the slide 22 to realize flexible adjustment of the chip spacing. When the driving rack 23 drives the driving gear 212 to translate, the first rotating cylinder 21 rotates, and then drives the buffer groove 221 to slide along the length direction of the slide 22 through the first spiral limiting groove 211, thereby adjusting the spacing between the chips. This design not only improves the efficiency of chip testing, but also enhances the versatility of the test device, so that it can adapt to the testing requirements of chips of different specifications and different spacings, greatly improving the flexibility and production efficiency of the chip production line.

[0027] Specifically, the chip variable pitch transmission device of the present embodiment includes a frame 10 and a slide 11 arranged on the frame 10. The frame 10 serves as a supporting structure of the entire device and has sufficient rigidity and stability. The slide 11 is configured to slide along the frame 10 close to the test device, and a tray placement area 12 is provided on one side thereof for placing a tray loaded with chips. A variable pitch mechanism 20 is provided on the slide 11, located on one side of the tray placement area 12. The variable pitch mechanism 20 is a core component of the present invention and is used to adjust the spacing between chips. The variable pitch mechanism 20 specifically includes a first rotating drum 21, a slide 22 and a driving rack 23. The first rotating drum 21 is rotatably arranged on the slide 11, and a plurality of first spiral limiting grooves 211 are arranged on its outer peripheral surface. These first spiral limiting grooves 211 are distributed in a spiral shape, and are used to provide a trajectory for the sliding of the buffer groove 221. A driving gear 212 is provided at one end of the first rotating drum 21 for meshing and transmission with the driving rack 23. The slide 22 is arranged on one side of the first rotating drum 21, and its length direction is parallel to the axis direction of the first rotating drum 21. A plurality of buffer slots 221 are arranged on the slide 22, and these buffer slots 221 are configured to slide on the slide 22 along the length direction of the slide 22. The buffer slots 221 are used to place the chips taken out from the tray. The slide 22 is connected to the first rotating drum 21 through a first connection stopper, and the first connection stopper is arranged in the first spiral stopper groove 211. When the first rotating drum 21 rotates, the first connection stopper slides in the first spiral stopper groove 211, driving the buffer slots 221 on the slide 22 to slide along the length direction of the slide 22, thereby realizing the adjustment of the chip spacing. The drive rack 23 is arranged on the frame 10, and its length direction extends horizontally along the axis direction perpendicular to the first rotating drum 21. One end of the drive rack 23 is close to the test device, and is used to drive the drive gear 212 to translate. The initial position of the drive gear 212 is meshed with the other end of the drive rack 23. When the first rotating drum 21 rotates, the driving gear 212 at one end of the first rotating drum 21 can rotate, and the driving gear 212 translates along the length direction of the driving rack 23, and drives the slide 22 to slide, thereby adjusting the chip spacing and driving the chip close to the test device, so that the test device can test the chip.

[0028] During actual use, the operator first places the tray containing the chips in the tray placement area 12. Then, by driving the first rotating drum 21 to rotate, the driving gear 212 is rotated, and then the driving rack 23 is driven to make the driving gear 212 translate along the length direction of the driving rack 23, and finally the purpose of bringing the chip close to the test device is achieved. At the same time, the rotation of the first rotating drum 21 drives the buffer slot 221 on the slide 22 to slide along the length direction of the slide 22 through the cooperation of the first spiral limiting groove 211 and the first connecting limiting member. When the buffer slot 221 slides to the appropriate position, the spacing between the chips is adjusted to match the test spacing of the test device. At this time, the operator or the automated equipment can take out the chips in the buffer slot 221 and load them into the test device for testing.

[0029] Therefore, it can be understood that the chip variable pitch transmission device according to the embodiment of the present invention has at least the following beneficial effects: the chip is placed in the cache slot 221 on the variable pitch mechanism 20, and when the first rotating drum 21 rotates, the cache slot 221 can slide along the length direction of the slide 22 under the drive of the first spiral limiting groove 211, and under the guidance of the first spiral limiting groove 211, the spacing between the cache slots 221 can be adjusted, and then the spacing of the chips can be adjusted to meet the test spacing of the test device, thereby achieving the purpose of facilitating the test device to test the chip.

[0030] Reference Figure 2 In some embodiments of the present invention, a multi-stage driving gear 212 is provided at the other end of the first rotating drum 21, and the multi-stage driving gears 212 are arranged at intervals. A plurality of driving racks 23 are provided, and the plurality of driving racks 23 are arranged at intervals. The multi-stage driving gear 212 and the plurality of driving racks 23 are arranged in a one-to-one correspondence, and the plurality of driving racks 23 are configured to be able to slide along the axial direction of the first rotating drum 21, so that the driving racks 23 can respectively engage with the corresponding driving gears 212.

[0031] Specifically, in the chip variable pitch transmission device of the present invention, since there are tens of thousands of chip specifications and the sizes of different chips are inconsistent, the spacing adjustment effects to be achieved are also different. For example, some chips are larger in size, so the spacing adjustment requirements are smaller, while some chips are smaller in size, so the spacing adjustment requirements are larger. Therefore, in order to further improve the flexibility and adaptability of the variable pitch mechanism 20, a multi-stage drive gear 212 is designed at the other end of the first rotating drum 21. These drive gears 212 are arranged at intervals to ensure that they can each independently engage with the drive rack 23 for transmission. Correspondingly, a plurality of drive racks 23 are also provided, and the plurality of drive racks 23 are also arranged at intervals. The multi-stage drive gears 212 are arranged one-to-one with the plurality of drive racks 23 to form a plurality of independent transmission units. These drive racks 23 are configured to be able to slide along the axial direction of the first rotating drum 21. Specifically, the frame 10 may be provided with corresponding slide rails or guide structures (not shown in the figure), so that the driving rack 23 can be guided by these slide rails or guide structures to perform precise sliding motion along the axis direction of the first drum 21. Through such a design, the driving rack 23 can selectively mesh with the corresponding driving gear 212 according to actual needs.

[0032] When the chip spacing needs to be adjusted, the operator or the control system can control the corresponding drive rack 23 to slide along the axial direction of the first rotating drum 21 so that it meshes with the corresponding drive gear 212. Then, by moving the drive rack 23, the drive gear 212 is driven to rotate, thereby rotating the first rotating drum 21. The rotation of the first rotating drum 21 drives the buffer groove 221 on the slide 22 to slide along the length direction of the slide 22 through the cooperation of the first spiral limiting groove 211 and the first connecting limiting member, thereby realizing the precise adjustment of the chip spacing. This design of multi-stage drive gears 212 and multiple drive racks 23 not only improves the transmission efficiency and stability of the pitch-changing mechanism 20, but also enhances its adaptability and flexibility. By selectively engaging different drive gears 212 and drive racks 23, the chip spacing adjustment of different specifications can be easily realized, meeting the diversified needs in the chip testing process.

[0033] Reference Figure 2 Furthermore, in some embodiments of the present invention, the radius of the multi-stage driving gear 212 gradually decreases in the direction away from the first rotating drum 21, and the heights of the multiple driving racks 23 gradually increase in the direction away from the first rotating drum 21.

[0034] In the chip variable pitch transmission device of the present invention, in order to further optimize the transmission efficiency and adapt to the chip spacing adjustment in different ranges, the design of the multi-stage drive gear 212 adopts a structure in which the radius gradually decreases. Specifically, starting from one end of the first rotating drum 21, along the direction away from the first rotating drum 21, the radius of each stage of the drive gear 212 is smaller than the previous stage. Such a design enables the first rotating drum 21 to produce different rotation angles under the same horizontal displacement, thereby achieving the adjustment of different spacings of different chips. At the same time, the heights of the multiple drive racks 23 also increase one by one along the direction away from the first rotating drum 21. This is to match the radius change of the multi-stage drive gear 212, ensuring that each stage of the drive gear 212 can mesh well with the drive rack 23 of the corresponding height. When it is necessary to adjust the chip spacing, the drive rack 23 and the drive gear 212 that match the required adjustment range can be selected for meshing transmission.

[0035] In actual operation, the operator or control system can control the corresponding drive rack 23 to slide along the axial direction of the first rotating drum 21 according to the chip spacing adjustment requirements, so that it meshes with the drive gear 212 with a suitable radius. Then, by moving the drive rack 23, the drive gear 212 is driven to rotate, thereby rotating the first rotating drum 21. Since the radius of the drive gear 212 and the height of the drive rack 23 are both changed step by step, the adjustment of different spacings of chips of different specifications can be achieved by selecting different combinations of drive gears 212 and drive racks 23. This design of the multi-stage drive gear 212 with a gradually decreasing radius and the multiple drive racks 23 with a gradually increasing height not only improves the transmission flexibility and adaptability of the chip variable pitch transmission device, but also enables the device to more accurately meet the diverse spacing adjustment requirements during chip testing.

[0036] Reference Figure 1 as well as Figures 3 to 5 In some embodiments of the present invention, the chip variable pitch conveying device also includes a grasping mechanism 30, which is disposed on the frame 10, and the grasping mechanism 30 is slidably disposed between the variable pitch mechanism 20 and the tray placement area 12, and the grasping mechanism 30 is configured to grasp the chip from the tray to the cache slot 221.

[0037] Specifically, in the chip variable pitch conveying device of the present invention, in order to realize the automatic transfer of chips from the material tray to the buffer slot 221, a grabbing mechanism 30 is also specially provided. This grabbing mechanism 30 is cleverly mounted on the frame 10, and is slidably arranged between the variable pitch mechanism 20 and the material tray placement area 12. The grabbing mechanism 30 may have a set of precise mechanical structures or pneumatic / electric actuators, which can accurately locate the position of each chip in the material tray. When it is necessary to grab the chip, the grabbing mechanism 30 will first slide above the material tray placement area 12, and then accurately grab the chip in the material tray according to the preset program or the information fed back by the sensor. After grabbing the chip, the grabbing mechanism 30 will smoothly transfer the chip to the buffer slot 221 of the variable pitch mechanism 20 along the set sliding track. In this process, the grabbing mechanism 30 will maintain a firm grip on the chip to prevent the chip from falling or shifting during the transfer process. By slidingly arranging the grabbing mechanism 30 between the variable pitch mechanism 20 and the tray placement area 12, and configuring it to grab the chip from the tray to the cache slot 221, the chip variable pitch conveying device of the present invention realizes the full automation of the chip from the tray to the test device. This not only greatly improves the efficiency of chip testing, but also reduces manual intervention and the risk of errors in the operation process, providing a strong guarantee for the efficient and stable operation of the chip production line.

[0038] Further, refer to Figures 3 to 5 In some embodiments of the present invention, the gripping mechanism 30 includes a fixed plate 31, a first pitch-changing component 32 is disposed on the fixed plate 31, a plurality of suction members (not shown in the figure) are disposed on the first pitch-changing component 32, and the first pitch-changing component 32 is configured to adjust the spacing between the suction members, and the suction members are used to suck the chip. In the chip pitch-changing conveying device of the present invention, the gripping mechanism 30 better adapts to the gripping requirements of chips of different specifications.

[0039] Specifically, the gripping mechanism 30 includes a fixed plate 31, which is firmly mounted on the frame 10 as the basic support structure of the gripping mechanism 30. A first variable pitch component 32 is provided on the fixed plate 31. The first variable pitch component 32 is the core part of the gripping mechanism 30, which is responsible for adjusting the spacing between the suction pieces to adapt to the arrangement spacing between different chips. The first variable pitch component 32 may adopt a slide rail, a lead screw or other precision mechanical structure, and is driven by electric, pneumatic or manual means to achieve flexible adjustment of the spacing between the suction pieces.

[0040] A plurality of suction pieces are arranged on the first variable pitch component 32. These suction pieces may be vacuum nozzles, electromagnetic suction cups or other components that can firmly absorb the chip. They are evenly distributed on the first variable pitch component 32, and their spacing can be adjusted as needed. When it is necessary to grab the chip, the grabbing mechanism 30 will first adjust the spacing between the suction pieces through the first variable pitch component 32 to match the arrangement spacing of the chips in the tray. Then, the suction piece will be activated to generate suction or magnetic force to firmly absorb the chip. Then, the grabbing mechanism 30 will smoothly transfer the chip to the cache slot 221 of the variable pitch mechanism 20 along the set sliding track. Through this design, the grabbing mechanism 30 can not only flexibly adapt to the grabbing requirements of chips of different specifications, but also ensure the stability and accuracy of the chip during the grabbing and transfer process. This greatly improves the versatility and practicality of the chip variable pitch conveying device, and provides strong support for the efficient operation of the chip production line.

[0041] Reference Figures 3 to 5 In some embodiments of the present invention, the first pitch-changing assembly 32 specifically includes a slide plate 321, a guide ring 322, and a mounting plate 323. The slide plate 321 is slidably disposed on the fixed plate 31, and the slide plate 321 is configured to slide up and down in the vertical direction; a plurality of guide rings 322 are provided, and both ends of the guide rings 322 are disposed on the slide plate 321, and the plurality of guide rings 322 all have guide grooves 3221; the mounting plate 323 is installed on the guide ring 322 through a second connection limiter, and the mounting plate 323 can be slidably disposed on one side of the fixed plate 31 in the horizontal direction, and a suction member is disposed at the lower end of the mounting plate 323.

[0042] Specifically, in the chip variable pitch conveying device of the present invention, the first variable pitch component 32 mainly includes a slide plate 321, a guide hanging ring 322 and a mounting plate 323. The slide plate 321, as the sliding base of the first variable pitch component 32, is configured to slide up and down along the fixed plate 31 in the vertical direction. The slide plate 321 may slide up and down through a slide rail, a cylinder or other driving mechanism (not shown in the figure). A plurality of guide hanging rings 322 are provided on the slide plate 321. Both ends of these guide hanging rings 322 are fixed on the slide plate 321, and each guide hanging ring 322 has a guide groove 3221. The design of the guide groove 3221 enables the mounting plate 323 to slide along the guide hanging ring 322 in the horizontal direction, thereby realizing the adjustment of the spacing between the suction members. The mounting plate 323 is mounted on the guide hanging ring 322 through a second connection stopper. The second connection stopper (not shown in the figure) may be a slider, a pin or other component that can slide along the guide groove 3221. When the slide plate 321 slides up and down along the vertical direction, the slide plate 321 drives the guide ring 322 to move up and down, and the guide ring 322 can drive the second connection limiter to slide horizontally in the left and right direction through the guide groove 3221, thereby driving the mounting plate 323 on one side of the fixed plate 31 and located on the outside of the slide plate 321 (the front side in the figure) to slide horizontally, so this sliding is achieved by the second connection limiter in the guide groove 3221 of the guide ring 322. The lower end of the mounting plate 323 is provided with a suction piece, and when the mounting plate 323 slides, the suction piece will also move accordingly, thereby changing the distance between them.

[0043] In actual operation, when the spacing between the suction members needs to be adjusted, the driving mechanism can firstly make the slide plate 321 slide up and down in the vertical direction, thereby driving the mounting plate 323 to slide along the guide groove 3221 of the guide hanging ring 322, so as to adjust the spacing between the suction members. When the spacing between the suction members matches the arrangement spacing of the chips in the tray, the suction members can be activated to firmly absorb the chips and transfer them to the buffer slot 221 of the pitch-changing mechanism 20.

[0044] Further, refer to Figures 3 to 5 In some embodiments of the present invention, the grasping mechanism 30 also includes two sets of second variable distance components 33, the second variable distance components 33 are arranged on the fixed plate 31, the second variable distance components 33 are respectively connected to the two ends of the guide hanging ring 322, the guide hanging ring 322 can be extended and retracted along the length direction of the guide hanging ring 322, and the second variable distance components 33 are configured to adjust the distance between the two ends of the guide hanging ring 322.

[0045] Specifically, in the chip variable pitch conveying device of the present invention, in order to further improve the flexibility of the grasping mechanism 30 and the adaptability of the chip size, two sets of second variable pitch components 33 are specially designed. The two sets of second variable pitch components 33 are arranged on the fixed plate 31 and are respectively connected to the two ends of the guide hanging ring 322. The guide hanging ring 322, as a part of the first variable pitch component 32, is connected to the fixed plate 31 at both ends through the second variable pitch component 33. It is important that the guide hanging ring 322 is designed to be retractable along its length direction. This means that by adjusting the second variable pitch component 33, the overall length of the guide hanging ring 322 can be changed, thereby affecting the sliding range of the mounting plate 323 in the horizontal direction, as well as the maximum and minimum spacing between the suction parts. The second variable pitch component 33 may use a lead screw, a cylinder, an electric push rod or other precision driving mechanism to drive the guide hanging ring 322 to retract manually or automatically. When it is necessary to adjust the spacing between the two ends of the guide hanging ring 322, the operator or the control system will activate the second variable pitch component 33 to drive the guide hanging ring 322 to retract along the length direction.

[0046] As the guide ring 322 expands and contracts, the spacing between the suction pieces on the mounting plate 323 will also change. This design allows the gripping mechanism 30 to flexibly adapt to the requirements of grabbing chips of different specifications and different arrangement spacings. Whether it is a closely arranged chip or a chip with a large spacing, the gripping mechanism 30 can achieve precise matching of the suction piece spacing by adjusting the second variable spacing component 33 and the first variable spacing component 32 (i.e., the sliding of the mounting plate 323 on the guide ring 322).

[0047] Further, refer to Figure 3 to Figure 4 In some embodiments of the present invention, the two groups of second pitch-changing assemblies 33 each include a second rotating cylinder 331, which is rotatably disposed on the fixed plate 31. The two second rotating cylinders 331 are respectively located on one side of the two ends of the guide hanging ring 322. The outer circumferential surface of the second rotating cylinder 331 is provided with a plurality of second spiral limiting grooves 3311. The two ends of the guide hanging ring 322 are respectively connected to the second rotating cylinder 331 through a third connecting limiting member (not shown in the figure), and the third connecting limiting member is located in the second spiral limiting groove 3311.

[0048] Specifically, in the chip variable pitch transmission device of the present invention, each set of second variable pitch components 33 includes a second rotating drum 331, and the two second rotating drums 331 are rotatably arranged on the fixed plate 31 and are respectively located at the two ends of the guide hanging ring 322. A plurality of second spiral limiting grooves 3311 are designed on the outer circumference of the second rotating drum 331, and these spiral limiting grooves extend spirally along the axial direction of the second rotating drum 331. This design enables the third connection limiting member located thereon to move along the spiral limiting groove when the second rotating drum 331 rotates, thereby realizing the spacing adjustment of the two ends of the guide hanging ring 322. The two ends of the guide hanging ring 322 are respectively connected to the two second rotating drums 331 through the third connection limiting members. These third connection limiting members may be pins, sliders or other components that can fit tightly in the second spiral limiting grooves 3311. When the second rotating drum 331 rotates, the third connection limiting member will move along the axial direction of the second rotating drum 331 under the guidance of the spiral limiting groove, thereby driving the guide hanging ring 322 to extend and retract.

[0049] In actual operation, when the distance between the two ends of the guide hanging ring 322 needs to be adjusted, the operator or the control system will drive the two second rotating drums 331 to rotate. Since the spiral limiting groove on the second rotating drum 331 is spiral, the third connection limiting member will move along the spiral limiting groove as the second rotating drum 331 rotates, thereby changing the length of the guide hanging ring 322. This design not only realizes the precise adjustment of the distance between the guide hanging rings 322, but also ensures the stability and reliability during the adjustment process.

[0050] Furthermore, refer to Figure 5In some embodiments of the present invention, the guide hanging ring 322 includes a first half ring 3222 and a second half ring 3223. The connecting end between the first half ring 3222 and the second half ring 3223 is connected by an elastic member (not shown in the figure), and the outer end of the first half ring 3222 and the outer end of the second half ring 3223 are respectively connected to the second pitch changing assembly 33. The connecting end between the first half ring 3222 and the second half ring 3223 is connected by an elastic member. This elastic member may be a spring, an elastic sheet or other elastic member. Its function is to provide necessary elastic support and buffer when the second pitch changing assembly 33 drives the guide hanging ring 322 to extend and retract, so as to ensure that the guide hanging ring 322 can adjust its length smoothly and accurately. It should be noted that the elastic member should always maintain tension to maintain a stable connection between the first half ring 3222 and the second half ring 3223. It should also be noted that, in order to facilitate the stable sliding of the second connection stopper in the guide groove 3221, the connection between the first half ring 3222 and the second half ring 3223 should satisfy that at least part of the structure of one half ring is inserted into the other half ring, and the elastic member is arranged in the half ring, so as to achieve the purpose of facilitating the stable sliding of the second connection stopper in the guide groove 3221. The outer end of the first half ring 3222 and the outer end of the second half ring 3223 are respectively connected to the two sets of second variable pitch components 33. This connection mode enables the first half ring 3222 and the second half ring 3223 to move along their length direction when the second variable pitch component 33 is working, thereby realizing the overall extension and retraction of the guide hanging ring 322.

[0051] In actual operation, when the length of the guide hanging ring 322 needs to be adjusted, the second variable pitch assembly 33 drives the first half ring 3222 and the second half ring 3223 to move outward or inward respectively. Since the first half ring 3222 and the second half ring 3223 are connected by an elastic member, the elastic member plays a role of connection and support during the movement, ensuring that the length of the guide hanging ring 322 can be adjusted smoothly and accurately and ensuring the stable sliding of the second connection limiter.

[0052] According to the chip tester of the second aspect embodiment of the present invention, the chip tester includes a chip variable pitch conveying device of any one of the above-mentioned first aspect embodiments, and the chip tester also includes a testing device, the testing device includes a manipulator, the manipulator is used to grab the chip in the chip variable pitch conveying device, and the testing device is configured to test the chip. Through the chip variable pitch conveying device, the spacing between the cache slots 221 can be adjusted, and then the spacing of the chips can be adjusted, so that the spacing of the chips from the tray is adjusted to meet the test spacing of the testing device, thereby facilitating the grabbing of the testing device, and achieving the purpose of facilitating the testing device to test the chip.

[0053] Another key component of the chip tester is the test device. The test device is equipped with a precision manipulator, which is exquisitely designed and can accurately grab the chip in the chip variable pitch conveyor. The movement of the manipulator is precisely controlled by an advanced control system to ensure that the chip will not be damaged during the grabbing process, while ensuring the accuracy of the grabbing position, laying a solid foundation for subsequent testing work. The test device itself is configured to perform comprehensive testing on the chip. It may contain a series of test modules, such as electrical performance test modules, functional test modules, etc., which can test various indicators of the chip according to the preset test process. Through the test device, the performance parameters, functional integrity and defects of the chip can be quickly detected, thereby providing strong support for chip quality control.

[0054] In the actual working process, the chip variable-pitch conveyor first transfers the chip from the tray to the specified position of the test device. Then, under the instruction of the control system, the robot accurately grabs the chip and places it in the test area of ​​the test device. The test device then starts the test program to conduct a comprehensive test on the chip. After the test is completed, the robot will take the chip out of the test area and classify the chip according to the test results and place it in the corresponding position, such as the qualified product area or the unqualified product area.

[0055] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] Of course, the present invention is not limited to the above-mentioned embodiments, and those skilled in the art may make equivalent modifications or substitutions without violating the spirit of the present invention, and these equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A chip variable distance transmission device, characterized in that: include: A frame (10), the frame (10) being provided with a slide seat (11), the slide seat (11) being configured to slide close to a testing device, one side of the slide seat (11) being provided with a material tray placement area (12), the material tray placement area (12) being used to place a material tray, and the material tray being used to store chips; as well as a distance-changing mechanism (20), the distance-changing mechanism (20) being arranged on the slide seat (11), the distance-changing mechanism (20) being located on one side of the tray placement area (12), and the distance-changing mechanism (20) being configured to adjust the distance between the chips; The pitch changing mechanism (20) comprises: A first rotating drum (21), the first rotating drum (21) being rotatably arranged on the sliding seat (11), a plurality of first spiral limiting grooves (211) being arranged on the outer peripheral surface of the first rotating drum (21), and a driving gear (212) being arranged at one end of the first rotating drum (21); a slide (22), the slide (22) being arranged on one side of the first rotating cylinder (21), the length direction of the slide (22) being parallel to the axial direction of the first rotating cylinder (21), the slide (22) being provided with a plurality of buffer grooves (221), the buffer grooves (221) being configured to slide on the slide (22) along the length direction of the slide (22), the buffer grooves (221) being used for placing the chips, the slide (22) being connected to the first rotating cylinder (21) via a first connection stopper, the first connection stopper being arranged in the first spiral stopper groove (211); as well as A driving rack (23), wherein the driving rack (23) is arranged on the frame (10), and the length direction of the driving rack (23) extends horizontally along an axial direction perpendicular to the first rotating drum (21), one end of the driving rack (23) is close to the testing device, and the initial position of the driving gear (212) is meshed with the other end of the driving rack (23), and the driving gear (212) is configured to translate along the length direction of the driving rack (23).

2. The chip variable distance transmission device according to claim 1, characterized in that: The other end of the first rotating drum (21) is provided with a plurality of driving gears (212), the plurality of driving gears (212) are spaced apart from each other, a plurality of driving racks (23) are provided, the plurality of driving racks (23) are spaced apart from each other, the plurality of driving gears (212) and the plurality of driving racks (23) are arranged in a one-to-one correspondence, and the plurality of driving racks (23) are configured to be able to slide along the axial direction of the first rotating drum (21) so that the driving racks (23) can respectively mesh with the corresponding driving gears (212).

3. The chip variable distance transmission device according to claim 2, characterized in that: The radius of the multiple-stage driving gear (212) gradually decreases in a direction away from the first rotating drum (21), and the height of the multiple driving racks (23) gradually increases in a direction away from the first rotating drum (21).

4. The chip variable distance transmission device according to claim 1, characterized in that: It also comprises a grabbing mechanism (30), the grabbing mechanism (30) being arranged on the frame (10), the grabbing mechanism (30) being slidably arranged between the variable distance mechanism (20) and the tray placement area (12), the grabbing mechanism (30) being configured to grab the chip from the tray and put it into the cache slot (221).

5. The chip variable distance transmission device according to claim 4, characterized in that: The gripping mechanism (30) comprises a fixing plate (31), a first variable distance component (32) being arranged on the fixing plate (31), a plurality of suction members being arranged on the first variable distance component (32), the first variable distance component (32) being configured to adjust the spacing between the suction members, the suction members being used to suction the chip.

6. The chip variable-pitch transmission device according to claim 5, characterized in that: The first pitch-changing component (32) comprises: A slide plate (321), the slide plate (321) being slidably disposed on the fixed plate (31), the slide plate (321) being configured to slide up and down in a vertical direction; A guide hanging ring (322), wherein a plurality of the guide hanging rings (322) are provided, both ends of the guide hanging ring (322) are provided on the slide plate (321), and each of the plurality of guide hanging rings (322) has a guide groove (3221); and A mounting plate (323), the mounting plate (323) being mounted on the guide hanging ring (322) via a second connection stopper, the mounting plate (323) being slidably arranged on one side of the fixing plate (31) in a horizontal direction, and the suction member being arranged at the lower end of the mounting plate (323).

7. The chip variable distance transmission device according to claim 6, characterized in that: The gripping mechanism (30) further comprises two sets of second variable-distance components (33), wherein the second variable-distance components (33) are arranged on the fixing plate (31), and the second variable-distance components (33) are respectively connected to two ends of the guide hanging ring (322), and the guide hanging ring (322) can be extended and retracted along the length direction of the guide hanging ring (322), and the second variable-distance components (33) are configured to adjust the distance between the two ends of the guide hanging ring (322).

8. The chip variable distance transmission device according to claim 7, characterized in that: The two groups of the second pitch-changing assemblies (33) each comprise a second rotating cylinder (331), the second rotating cylinder (331) being rotatably disposed on the fixing plate (31), the two second rotating cylinders (331) being respectively located on one side of both ends of the guide hanging ring (322), a plurality of second spiral limiting grooves (3311) being provided on the outer circumferential surface of the second rotating cylinder (331), the two ends of the guide hanging ring (322) being respectively connected to the second rotating cylinder (331) via a third connecting limiting member, and the third connecting limiting member being located in the second spiral limiting groove (3311).

9. The chip variable-pitch transmission device according to claim 7, characterized in that: The guide hanging ring (322) comprises a first half ring (3222) and a second half ring (3223); the connecting ends between the first half ring (3222) and the second half ring (3223) are connected via an elastic member; the outer end of the first half ring (3222) and the outer end of the second half ring (3223) are respectively connected to the second variable pitch assembly (33).

10. A chip testing machine, characterized in that: The chip variable-pitch conveying device comprises the chip variable-pitch conveying device as described in any one of claims 1 to 9, the chip testing machine also comprises the testing device, the testing device comprises a manipulator, the manipulator is used to grab the chip in the chip variable-pitch conveying device, and the testing device is configured to test the chip.

Images