Integrated system-in-package for magnetic field-based current monitoring

Abstract

The embodiment of the invention relates to an integrated system-in-package for magnetic field-based current monitoring. An integrated system for current monitoring includes a package and a MEMS sensor device disposed inside the package to provide an output electrical signal indicative of a current to be monitored. A sensing coil is provided within the package. The monitored current is passed through the sense coil. The MEMS sensor device is arranged relative to the sensing coil to be affected by a flux line of a magnetic field generated by the sensing coil as a whole as a function of the current to be monitored.

Description

[0001] Priority claim

[0002] This application claims the benefit of priority from Italian Patent Application No. 102023000019944, filed on September 27, 2023, the contents of which are hereby incorporated by reference in their entirety to the maximum extent permitted by law. Technical Field

[0003] The present solution relates to an integrated system-in-package (SiP) for magnetic field-based current monitoring. Background Art

[0004] In electronic devices or systems, for example for power simulation applications, it is known that there is a need to implement monitoring of circulating currents in order to control and improve the operation of the same.

[0005] For example, known solutions for current monitoring provide: using a resistor arranged in series with the load and monitoring the voltage across the same resistor; or implementing a current mirror, using resistors with different areas and different on-resistances RDS on Two power devices (eg, MOSFET transistors) are connected in parallel and driven with the same signal.

[0006] Another known solution envisages the use of Hall effect magnetic sensors placed close to the path conducting the current to the load, for example by means of wires or conductive tracks.

[0007] Although they allow current monitoring, the aforementioned known solutions have some disadvantages, for example in terms of area occupied or operating frequency limitations, which may be disadvantageous at least for certain applications.

[0008] There is a need in the art to overcome the limitations of known systems. Summary of the invention

[0009] In one embodiment, an integrated system for current monitoring includes: a package; and a MEMS sensor device, which is arranged inside the package and configured to provide an output electrical signal indicative of a current to be monitored. A sensing coil is provided inside the package. The sensing coil is designed to be passed through by the current to be monitored. The MEMS sensor device is arranged relative to the sensing coil to be affected by flux lines of a magnetic field generated by the sensing coil according to the entirety of the current to be monitored. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] For a better understanding of the invention, preferred embodiments thereof will now be described, by way of non-limiting example only, with reference to the accompanying drawings, in which:

[0011] Figure 1A A schematic top view of the system is shown (with parts removed for clarity);

[0012] Figure 1B Shows Figure 1A A perspective view of the system;

[0013] Figure 2 and Figure 3 is a schematic top view of a variant embodiment of the system;

[0014] Figure 4 is a schematic cross-section of a system according to another embodiment; and

[0015] Figure 5 yes Figure 4 A schematic perspective view of the system. DETAILED DESCRIPTION

[0016] One aspect of the present solution generally contemplates forming an integrated system package to enable monitoring of electrical current circulating in an electronic device or system.

[0017] As will be described in detail below, the integrated system includes within the same package: a coil, which is designed to generate a total magnetic flux having a propagation center axis (which corresponds to the center axis of the coil) based on the current to be monitored; and a microelectromechanical sensor device (made using microelectromechanical system (MEMS) technology), which operates as a magnetometer and is arranged along the aforementioned center axis to be affected by the total magnetic flux generated by the coil and output a sensing signal indicative of the aforementioned current to be monitored.

[0018] In detail, and first refer to Figure 1A and Figure 1B In the possible embodiment shown in the figure, the current monitoring system (indicated as a whole by 1) includes a package 2, which in this example is a QFN (quad flat no-lead) type having a roughly parallelepiped shape; however, it should be emphasized that other types of packages (and other shapes) can also be provided, as will be highlighted below.

[0019] The packaging 2 comprises a coating 4 of epoxy or other type of material (for example a ceramic material), which represents the interface of the system 1 with the external environment and surrounds and houses the elements that are part of the same system 1 .

[0020] The package 2 also includes a wire or electrical contact terminal 5 made of a conductive material (e.g. aluminum), which is arranged outside relative to the coating 4 and is accessible from the outside (flush with the same coating 4), in particular at the side surface 2b of the package 2 and at the lower surface 2a of the same package 2, and the wire or electrical contact terminal is designed to be coupled to a printed circuit board (PCB) of an external electronic device, wherein the system 1 is used to monitor the circulating current.

[0021] In the illustrated embodiment, the aforementioned electrical contact terminals 5 are arranged in two parallel rows, on opposite sides of the side surface 2b of the package 2. In particular, in the example, the number of electrical contact terminals 5 in each row is equal to 8 (thus indicated by progressive numbers 1 to 8 for the first row and by progressive numbers 9 to 16 for the second row), aligned along a first horizontal axis x of the aforementioned horizontal plane xy of the main extension of the package 2 (taking into account the thickness of the package 2 with reference to the vertical axis z, orthogonal to the aforementioned horizontal plane xy).

[0022] The package 2 internally comprises a support structure or frame 6 (commonly referred to as a "lead frame"), which is made of a conductive material (e.g., copper) and is surrounded by a coating 4, and which carries the aforementioned elements as part of the system 1. Bonding wires 8 appropriately connect these elements to corresponding electrical contact terminals 5 (as will be highlighted below).

[0023] The frame structure 6 (which has a main extension in the horizontal plane xy) comprises two islands (or pads), in particular a first island 10a and a second island 10b, which are different and separated and mechanically and electrically insulated from each other, are arranged side by side on the aforementioned horizontal plane xy and have a roughly rectangular shape in the example.

[0024] In particular, the first island 10a carries a microelectromechanical (MEMS) sensor device, which operates as a magnetometer (hence referred to as MEMS magnetometer device 12 hereinafter) and comprises: a first die 14 made of a semiconductor material (e.g. silicon), which integrates a suitable magnetic field sensing structure, for example of the capacitive type and based on Lorentz force (of a known type, not described in detail herein); and a second die 15 of semiconductor material, which integrates an ASIC (application-specific integrated circuit) electronic circuit, which is operably electrically coupled to the aforementioned sensing structure to provide an output electrical signal indicative of the sensed magnetic field (and therefore the magnetic field of the current to be monitored that has generated the same magnetic field).

[0025] In the illustrated example, the second die 15 is arranged on the first island 10 a , and the first chip is stacked on the second die 15 .

[0026] The aforementioned bonding wires 8 electrically connect pads carried by the upper surface of the second die 15 (not in contact with the first island 10a) to corresponding electrical contact terminals 5 (in this example, indicated by progressive numbers 5 to 8 and 9 to 11) to receive electrical bias signals from an external electronic device and to provide the aforementioned output electrical signals indicating the current to be monitored to the same external electronic device at the output.

[0027] It is emphasized that the sensing structure integrated into the first die 14 may have further functionalities besides current monitoring, for example the functionality for sensing at least another quantity of interest (acceleration, angular velocity, pressure, temperature, or any other quantity).

[0028] Furthermore, above the same first island 10a (or above a further and different island of the frame structure 6 within the package 2), the system 1 may include at least one further die configured to integrate at least one further micromechanical structure (and / or ASIC circuit), for example for sensing at least one corresponding quantity of interest.

[0029] According to a particular aspect of the present solution, the second island 10b is configured to at least partially form a sensing coil 20 designed to be traversed by the current to be monitored and to generate a resulting induced magnetic field as a function of this current.

[0030] In detail, the sensing coil 20 includes a first bridge element 22 which is arranged above the aforementioned second island 10 b (keeping a certain separation distance from the second island 10 b along the vertical axis z) and is made of a conductive material (eg, copper).

[0031] This first bridge element 22 forms together with the underlying second island 10 b a sensing coil 20 which in this case has a single-turn arrangement; it therefore has a three-dimensional arrangement inside the package 2 (having extension both in the horizontal plane xy and along the vertical axis z).

[0032] In particular, in the aforementioned Figure 1A The flux of the induced magnetic field indicated by F in FIG. 1 (generated as a whole by the sensing coil 20 in response to the flow of the current to be monitored) has flux lines having a central axis oriented (directed) along the first horizontal axis x. Central axis Corresponding to the central axis of the same sensing coil 20 .

[0033] According to one aspect of the present solution, the MEMS magnetometer device 12 is arranged in the package 2 in such a way that it is affected by the line of magnetic flux F, in particular on the aforementioned central axis. Place.

[0034] As mentioned above Figure 1B As shown in the figure, a ferromagnetic material area 24 can also be provided, which is arranged under the first bridge element 22 and inserted between the same first bridge element 22 and the second island 10b of the frame structure 6; in the illustrated embodiment, this ferromagnetic material area 24 is supported by a support member 25 (for example, made of silicon) arranged on the second island 10b.

[0035] The ferromagnetic material region 24 may be made of an alloy of iron and nickel (NiFe), nickel and cobalt, or other suitable materials or material alloys.

[0036] The aforementioned second island 10 b is directly connected to some of the aforementioned electrical contact terminals 5 which are their extension in the horizontal plane xy in order to define a path for the current to be monitored at the input of the sensing coil 20 or at the output of the same sensing coil 20 .

[0037] In detail, in the aforementioned Figure 1A and Figure 1B In the embodiment illustrated in , the electrical contact terminals 5 indicated by the numbers 1 and 2 (electrically short-circuited to each other) are dedicated to the input of current (and are therefore called input terminals); these input terminals are electrically separated from the second island 10b and are contacted by the first distal portion of the bridge element 22 (shaped as a column).

[0038] The electrical contact terminals 5 indicated by the numbers 3 and 4 (electrically short-circuited to each other) are adjacent to the aforementioned input terminals in the same row along the first horizontal axis x and are dedicated to the output of electric current (and are therefore called output terminals); these output terminals are directly connected to the second island 10b and are its extension in the horizontal plane xy.

[0039] Furthermore, the electrical contact terminals 5 (indicated by progressive numerals 13 to 16) which are opposite to the aforementioned input and output terminals and which are placed in opposite rows are electrically short-circuited to one another and are directly contacted by the second island 10 b which is its extension in the horizontal plane xy; moreover, these terminals (indicated by numerals 13 to 16) are contacted by a second distal portion (shaped as a column) of the first bridge element 22 (this second distal portion having an extension along the first horizontal axis x that is greater than the aforementioned first distal portion).

[0040] The aforementioned electrical contact terminals 5 from 13 to 16 may be left floating (ie not connected to any potential) in use.

[0041] Therefore, a current path is generated inside the sensing coil 20, which starts from the input terminal; passes through the first bridge element 22 (in particular, passes through the corresponding span) in the direction of the second horizontal axis y (orthogonal to the aforementioned first horizontal axis x, and uses this first horizontal axis x to define the horizontal plane xy), reaches the electrical contact terminals 5 from 13 to 16; passes through the second island 10b in the opposite direction along the same second horizontal axis y; and flows out of the package 2 from the output terminal.

[0042] Therefore, in this embodiment, current enters and flows out from the same side of the package 2 at which the aforementioned input terminal and output terminal are formed.

[0043] The sensing coil 20 may alternatively include a greater number of turns.

[0044] like Figure 2 As shown in , in a possible variation, the sensing coil 20 is formed by two turns and, in addition to the first bridge element 22, also includes a second bridge element 32, which also extends above the second island 10b, crosses the second island 10b along the second horizontal axis y, and is arranged parallel to the first bridge element 22.

[0045] In detail, in the aforementioned Figure 2 In the embodiment illustrated in , the input terminals dedicated to the input of electric current (indicated by the numbers 1 and 2, electrically short-circuited to each other) are contacted again by the first distal end portion of the first bridge element 22 (shaped as a pillar).

[0046] The electrical contact terminals 5 indicated by numerals 3 and 4 are electrically short-circuited to each other and are contacted by the respective first distal end portions (shaped as pillars) of the second bridge element 32 and are also in direct contact with the second island 10b.

[0047] The electrical contact terminals 5 indicated by the progressive numerals 15 and 16 opposite to the aforementioned input terminals are electrically short-circuited to each other and are contacted directly by the second island 10 b and by the second distal portion (shaped as a column) of the first bridge element 22 (in this case, this second distal portion has the same extension along the first horizontal axis x as the aforementioned first distal portion).

[0048] The aforementioned electrical contact terminals 5 from 3 to 4 and from 15 to 16 may be left floating (ie not connected to any potential) in use.

[0049] In this case, the output terminals are the electrical contact terminals 5 indicated with progressive numerals 13 and 14 , which are electrically short-circuited to each other and are contacted by the second distal portion of the second bridge element 32 , shaped as a pillar.

[0050] Therefore, in this case, the current path inside the sensing coil 20 starts from the input terminal; passes through the first bridge element 22 in the direction of the second horizontal axis y until reaching the electrical contact terminal 5 indicated by 15 and 16; passes through the second island 10b in the opposite direction along the same second horizontal axis y to reach the electrical contact terminal 5 indicated by 3 and 4; and passes through the second bridge element 32 in the direction of the second horizontal axis y to reach the output terminal (in this case, the aforementioned electrical contact terminal 5 indicated by 13 and 14), and then leaves the package 2.

[0051] In another embodiment, Figure 3 As shown in the two-turn implementation of the reference sensing coil 20 (but what is illustrated applies regardless of the number of turns of the same sensing coil 20), the system 1 may include, in addition to the sensing coil 20, a calibration coil 35, which is integrated in the same package 2 so as to allow calibration of the current sensing even by the end user (i.e., in a step after manufacturing and subsequent electrical testing steps).

[0052] In the aforementioned Figure 3 In the illustrated embodiment, this calibration coil 35 comprises a respective bridge element 36 arranged above the first island 10a, at a distance from the same first island 10a carrying the MEMS magnetometer device 12 in a similar manner as already discussed above.

[0053] Alternatively, in a manner not shown, the calibration coil 35 can be arranged over a different further island formed in the frame structure 6 inside the package 2 .

[0054] During operation, the calibration coil 35 is passed through a calibration current (of known value) for generating a calibration magnetic field having the value described above. Figure 3 F cal A calibration magnetic flux indicated having flux lines having a central axis oriented along a first horizontal axis x Located at the center of the same calibration coil 35, in the opposite direction to the flux lines of the induced magnetic field.

[0055] The MEMS magnetometer device 12 is arranged in the package 2 to be interposed between the sensing coil 20 and the calibration coil 35 so as to be also subjected to the calibration magnetic flux F cal The influence of the lines, especially those arranged on the central axis of the aforementioned Place.

[0056] In more detail, in the aforementioned Figure 3In the illustrated embodiment, the electrical contact terminals 5 indicated by the numbers 8 and 9 (in this case, each row includes nine corresponding electrical contact terminals 5) are dedicated to the input of the calibration current; these input terminals are electrically separated from the first island 10a and are contacted by the first distal portion of the corresponding bridge element 36 (shaped as a column).

[0057] In this case, the only electrical contact terminal 5 (indicated with 7) adjacent to the preceding input terminal in the same row is dedicated to the output of the calibration current; this output terminal is directly contacted by the first island 10a.

[0058] Furthermore, the electrical contact terminals 5 (indicated by progressive numerals 10 and 11) opposite to the aforementioned input terminals (arranged in opposite rows) are electrically short-circuited to each other and are directly contacted by the first island 10a; these terminals are also contacted by the second distal end portion (shaped as a column) of the corresponding bridge element 36.

[0059] The aforementioned electrical contact terminals 5 from 10 to 11 may be left floating (ie not connected to any potential) when in use.

[0060] Thus, a path is generated for the calibration current inside the calibration coil 35, which starts from the input terminal; passes through the corresponding bridge element 36 of the calibration coil 35 in the direction of the second horizontal axis y, reaches the electrical contact terminal 5 indicated by 10 and 11; passes through the first island 10a in the opposite direction along the same second horizontal axis y; and comes out from a single output terminal.

[0061] In this possible embodiment, the electrical contact terminals 5 available for the MEMS magnetometer device 12 are the electrical contact terminals indicated with the numbers 5 - 6 and 12 - 14 .

[0062] Previous references Figure 2 What has been discussed applies to this embodiment in a substantially similar manner, the only difference being the progressive numbers corresponding to the electrical contact terminals 5 , since the number of electrical contact terminals 5 is different within each of the two parallel rows arranged on the sides of the package 2 .

[0063] From the foregoing description, the advantages of the proposed solution can be clearly seen.

[0064] Anyway, it is important to emphasize that this solution allows measuring and / or monitoring current in analog power applications over a very wide frequency range (from DC to several MHz).

[0065] Furthermore, the described solution allows forming a current sensor in a very small volume inside the package of an integrated system, which current sensor has a much smaller area footprint than conventional solutions (using discrete components such as resistors, transistors, or Hall effect sensors).

[0066] As indicated before, to implement the system 1 it may also be advantageous to use packaging of MEMS devices that may already be present in the electronic system where the current is to be monitored, for example MEMS sensor devices such as accelerometers, gyroscopes, pressure sensors or the like.

[0067] In particular, in order to implement system 1, the package of this MEMS device can be modified to include an island arranged in an insulating manner in a frame structure so as to form a sensing coil, which includes this island to form a path passed by the current to be monitored; and also includes a suitable magnetometer sensing structure, for example, a capacitive magnetometer sensing structure based on the Lorentz force (or alternatively, based on other magnetic field measurement principles).

[0068] Furthermore, in the described solution, the MEMS sensor device configured to sense the overall axial field generated by the sensing coil is typically immune to external magnetic disturbances (such disturbances are in fact typically orders of magnitude lower than the magnetic field to be sensed).

[0069] Finally, it is evident that modifications and variations may be made to what is herein described and illustrated, without departing from the scope of the present invention, as defined by the appended claims.

[0070] In particular, in the system 1 , different mutual arrangements may be provided between the sensing coils 20 and the MEMS magnetometer devices 12 , the MEMS magnetometer devices 12 being in any case placed along a central axis associated with the coils so as to be influenced by the magnetic field flux generated overall by the same sensing coils 20 .

[0071] in this regard, Figure 4 and Figure 5 A further possible embodiment of the system 1 is shown, in which the MEMS magnetometer device 12 and the sensing coil 20 are arranged stacked in a three-dimensional manner along a vertical axis Z in the package 2 .

[0072] In this embodiment, the MEMS magnetometer device 12 (in particular the corresponding first die 14 and possibly, in a manner not illustrated here, the corresponding second die 15 ) is incorporated in a base substrate 40 (eg made of epoxy) of the package 2 .

[0073] This base substrate 40 has a first main surface 40 a in a horizontal plane xy, at which the MEMS magnetometer device 12 is arranged, and a second main surface 40 b defining the outer (upper) surface of the same package 2 .

[0074] Over the first main surface 40 a of the base substrate 40 , the package 2 has a first redistribution layer (RDL) 42 , for example made of copper, having a first thickness of, for example, about 30 μm.

[0075] Above this first redistribution layer 42 there is a second redistribution layer 44 , for example also made of copper, having a second thickness greater than the first thickness, for example equal to about 150 μm.

[0076] The first redistribution layer 42 is separated from the first tube core 14 by a first dielectric layer 46, and the first dielectric layer 46 has a first through-hole 47 formed therethrough, and the first through-hole 47 has a conductive material; similarly, the second redistribution layer 44 is separated from the first redistribution layer 42 by a second dielectric layer 48, and the second dielectric layer 48 has a second through-hole 49 formed therethrough, and the second through-hole 49 also has a conductive material.

[0077] In particular, according to one aspect of the present embodiment, the first redistribution layer 42 is patterned to define an electrical connection track 50 above the first main surface 40a; and the second redistribution layer 44 is patterned to define a contact pad 52, and also defines the aforementioned sensing coil 20, and the contact pad 52 is arranged at the corresponding end of the aforementioned electrical connection track 50, transversely to the package 2.

[0078] In this case, this sensing coil 20 has a single turn arrangement, for example a Greek capital letter omega-like shape (Ω) in the horizontal plane xy, and is arranged vertically above the MEMS magnetometer device 12 so that the same MEMS magnetometer device 12 is centered along its central axis relative to the aforementioned single turn.

[0079] The electrical contact terminals 5 of the package 2 are formed over the contact pads 52 ; moreover, the coating 54 coats the aforementioned second redistribution layer 44 , except for the same electrical contact terminals 5 , which are accessible from the outside of the package 2 .

[0080] As mentioned above Figure 5 As shown, the first and second of the aforementioned electrical contact terminals 5 are connected to the respective ends of the turns of the sensing coil 20, thereby allowing the input and output of the current to be monitored. The remaining electrical contact terminals 5, which are arranged transversely in two parallel rows on opposite sides of the package 2, can be connected to the MEMS magnetometer device 12 via the aforementioned electrical connection rails 50.

[0081] Similar to what was discussed previously, also in this embodiment, the system 1 integrated in the package 2 therefore envisions that the MEMS magnetometer device 12 inside the package 2 is affected by the flux of the concentrated magnetic field generated by the sensing coil 20, and is arranged along the central axis of the same flux (which in this case corresponds to the central axis of the aforementioned Ω-shaped turns of the sensing coil 20).

[0082] In a manner not described in detail, further variant embodiments may also be provided having an inverted arrangement along the vertical axis z of the sensing coil 20 (in this case formed in the first redistribution layer 42) and the MEMS magnetometer device 12, the MEMS magnetometer device 12 being superimposed on the sensing coil 20 in this case and being arranged again in a different plane along the vertical axis z relative to the same sensing coil 20.

[0083] Finally, it is emphasized again that the MEMS sensor device 12 integrated in the package 2 may have other functions besides magnetic field sensing to provide an output electrical signal indicative of the current to be monitored. For example, the MEMS sensor device 12 may have the functions of a gyroscope, an accelerometer, a pressure sensor, or the like.

Claims

1. An integrated system for current monitoring, comprising: Packages; as well as a micro-electromechanical system (MEMS) sensor device inside the package and configured to provide an output electrical signal indicative of the current to be monitored; wherein the sensing coil is located inside the package; The sensing coil is configured to be passed through by the current to be monitored; Wherein the MEMS sensor device is arranged relative to the sensing coil to be influenced by flux lines of a magnetic field, which is generated by the sensing coil as a whole in dependence on the current to be monitored. 2 . The system of claim 1 , wherein the MEMS sensor device comprises a magnetometer configured to generate the output electrical signal indicative of the current to be monitored based on the magnetic field. 3 . The system of claim 1 , wherein the MEMS sensor device is arranged along a central axis of the flux of the magnetic field, wherein the central axis of the flux corresponds to a central axis of the sensing coil.

4. The system according to claim 1, further comprising: a frame structure, the frame structure being inside the package and contained in the coating of the package; wherein the frame structure has a main extension in a horizontal plane and comprises a first island and a second island, the first island and the second island being arranged side by side in the horizontal plane, the first island being distinct and separate from the second island and being electrically insulated from each other; and Wherein the first island carries the MEMS sensor device, and the second island is configured to at least partially form the sensing coil and a path for the current to be monitored.

5. The system according to claim 4, wherein the sensing coil includes a first bridge element, which is arranged above the second island and is made of a conductive material; wherein the first bridge element and the second island located below the first bridge element form a first turn of the sensing coil and the path for the current to be monitored.

6. The system according to claim 5: wherein the package comprises electrical contact terminals, the electrical contact terminals being made of an electrically conductive material, and the electrical contact terminals being arranged outside the coating and being accessible from outside the package; wherein the second island is directly connected to a first terminal of the electrical contact terminal, the first terminal of the electrical contact terminal being an extension of the electrical contact terminal in the horizontal plane to define one of an input to or an output from the sensing coil in the path of the current to be monitored; and Wherein the first bridge element is directly connected to the second terminal of the electrical contact terminal through a first end portion to define the other of the input to the sensing coil or the output from the sensing coil in the path of the current to be monitored. 7 . The system of claim 6 , wherein further ones of the electrical contact terminals are connected to the MEMS sensor device via respective bond wires.

8. The system of claim 6, wherein the second end of the first bridge element is directly connected to the second island.

9. The system of claim 5, wherein the sensing coil includes a second bridge element disposed above the second island and made of a conductive material, the second bridge element being positioned side by side with the first bridge element to at least partially define a second turn of the sensing coil.

10. The system according to claim 9: wherein the package comprises electrical contact terminals, the electrical contact terminals being made of an electrically conductive material, and the electrical contact terminals being arranged outside the coating and being accessible from outside the package; wherein the second island is directly connected to a first terminal of the electrical contact terminal, the first terminal of the electrical contact terminal being an extension of the electrical contact terminal in the horizontal plane to define a path of the current to be monitored in the sensing coil; and wherein the first bridge element is directly connected to a second terminal of the electrical contact terminal through a first end portion to define one of the input to the sensing coil or the output from the sensing coil in the path of the current to be monitored; and The second bridge element is directly connected to the third terminal of the electrical contact terminals through a respective end portion to define the other of the input to the sensing coil or the output from the sensing coil in the path of the current to be monitored.

11. The system of claim 4, further comprising: a calibration coil, which is integrated into the package in addition to the sensing coil, and is designed to be passed through by a calibration current, the calibration current being used to generate a calibration magnetic field; wherein the calibration coil comprises a respective bridge element, the respective bridge element being arranged above the first island; and Wherein the MEMS sensor device is arranged in the package to be interposed between the sensing coil and the calibration coil so as to be also affected by the flux lines of the calibration magnetic field.

12. The system according to claim 1: wherein the enclosure has a horizontal plane of major extension; and The MEMS sensor device and the sensing coil are stacked along a vertical axis in the package so that the MEMS sensor device is at a central position relative to the sensing coil along a central axis of the sensing coil and is affected by flux lines of the magnetic field oriented along the vertical axis, and the vertical axis is orthogonal to the horizontal plane.

13. The system of claim 12, wherein the MEMS sensor device comprises: a die of semiconductor material, the die being contained within a base substrate of the package; wherein the base substrate has a first main surface and a second main surface, the first main surface being in the horizontal plane, the MEMS sensor device being arranged at the first main surface, and the second main surface defining an outer surface of the package; The redistribution layer is arranged above the first main surface, the redistribution layer is separated from the first main surface by a dielectric layer, the redistribution layer is made of a conductive material, the dielectric layer has a through hole, the through hole is formed through the dielectric layer, and the redistribution layer is patterned to define the sensing coil.

14. The system of claim 13, wherein the sensing coil has a single turn arrangement defined in the redistribution layer in the horizontal plane.

15. The system according to claim 13: wherein a conductive layer is patterned over the first major surface to define electrical connection tracks, the electrical connection tracks facing the MEMS sensor device; and The redistribution layer is arranged above the conductive layer, and the redistribution layer is separated from the conductive layer by the dielectric layer.

16. An integrated circuit comprising: a frame structure comprising a first island and a second island, wherein the first island and the second island are different from each other and electrically insulated; a micro-electromechanical system (MEMS) sensor device mounted to the first island and configured to provide an output electrical signal indicative of the current to be monitored; a sensing coil formed at least in part by the second island, wherein the sensing coil is configured to be passed through by the current to be monitored; as well as A package encapsulates the first island, the second island, the MEMS sensor device, and the sensing coil. 17 . The integrated circuit of claim 16 , further comprising a first bridge element disposed over the second island and made of a conductive material, wherein the first bridge element and the second island form a first turn of the sensing coil.

18. The integrated circuit of claim 17, wherein the package comprises: a first electrical contact terminal connected to one end of the first bridge element; wherein the other end of the first bridge element is connected to the second island; a second electrical contact terminal connected to the second island; The current to be monitored flows between the first electrical contact terminal and the second electrical contact terminal.

19. The integrated circuit of claim 18, wherein the package comprises a third electrical contact terminal, the third electrical contact terminal being connected to the MEMS sensor device.

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