Copper alloy material with ultrahigh strength and high conductivity and preparation method thereof

By regulating the mass ratio of Ni and Sn elements and adding alloy element M, Ni3Sn2 hexagonal structure precipitation phase is formed. Combined with directional solidification, multi-stage homogenization treatment and cyclic "cold rolling-current" treatment process, the problem of Cu-Ni-Sn alloy deterioration when improving the conductive properties is solved, achieving both high-strength and high-conductivity and simplification of process.

CN119710361AActive Publication Date: 2025-03-28CENT SOUTH UNIV
13 Cites 4 Cited by

Patent Information

Application Number
CN202411930881.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-26
Publication Date
2025-03-28
Estimated Expiration
2044-12-26

AI Technical Summary

Technical Problem

While improving the conductivity, the existing Cu-Ni-Sn alloys are difficult to maintain high strength, and the processing technology is complex, the cost is high and the conductivity is low.

Method used

By regulating the mass ratio of Ni and Sn elements, the Ni3Sn2 hexagonal structure precipitation phase is formed to improve the conductivity of the alloy; at the same time, the alloy element M, such as In, replace part of the Sn atoms, reduce the formation enthalpy of the Ni3Sn2 phase, and enhance the stability of the precipitation phase. Directional solidification and multi-stage homogenization treatment processes are adopted to form columnar crystal structure and uniform microstructure; combined with cyclic "cold rolling-current" treatment and aging treatment, the ultra-refinement of the grain and uniform precipitation of the second phase are achieved.

Benefits of technology

The ultra-high strength and high conductivity of Cu-Ni-Sn alloy are achieved, simplifying the process flow, reducing costs and improving conductivity.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The invention discloses a copper alloy material with ultrahigh strength and high conductivity and a preparation method thereof. The copper alloy material comprises, by mass, 5%-13% of Ni, 6%-14% of Sn, 40%-70% of Sn (Ni + Sn), 0.01%-0.5% of M and the balance Cu, and M is selected from at least one of In, Al, Cr, V, Mn and Fe. The preparation process comprises the following steps: carrying out multi-stage homogenization treatment on a cast ingot of a columnar crystal structure containing the components, carrying out cyclic'processing-current treatment 'on the homogenized cast ingot to obtain an ultra-fine crystal structure, and then carrying out processing-aging treatment to obtain the ultra-fine crystal structure. The copper alloy material provided by the invention not only has ultrahigh hardness and tensile strength, but also has good conductivity.
Need to check novelty before this filing date? Find Prior Art