Embedded manifold microchannel based on heat pipe array

Abstract

The invention relates to the technical field of manifold microchannels, and discloses an embedded manifold microchannel based on a heat pipe array, the embedded manifold microchannel comprises a mounting assembly, the mounting assembly comprises a supporting seat, a base fixedly mounted at the upper end of the supporting seat, a supporting plate mounted on the side wall of the base, and a cover plate clamped at the top of the supporting plate; the heat pipe assembly comprises a fixing plate fixedly connected to the side wall of the supporting plate, an adapter fixedly arranged in the middle of the fixing plate in a sleeving mode, a heat pipe body installed at the end of the adapter and fins arranged on the side wall of the heat pipe body in a sleeving mode. The micro-channel heat exchanger has the beneficial effects that heat can be quickly conducted to the micro-channel from a heat source, the heat exchange efficiency is improved by reasonably designing the layout and number of the heat pipe array, efficient heat management can be achieved in a limited space, the temperature distribution on the surface of the micro-channel is more uniform in the heat transfer process due to the isothermal property of the heat pipes, and the heat transfer efficiency is improved. And flexible design and optimization can be carried out according to different application requirements and heat source characteristics.

Description

Technical Field

[0001] The invention relates to the technical field of manifold microchannels, and in particular to an embedded manifold microchannel based on a heat pipe array. Background Art

[0002] Manifold microchannel is an advanced heat exchange or fluid transfer structure. The microchannel design consists of a large number of tiny channels, and the channel size is usually in the order of micrometers to millimeters. These microchannels have a large specific surface area and can provide efficient heat exchange or material transfer interfaces. For example, in some microchannel heat exchangers, the hydraulic diameter of the microchannel may be only a few hundred microns, which greatly increases the contact area between the fluid and the channel wall. The manifold structure is used to distribute and collect fluids. The manifold is usually connected to the microchannel to evenly distribute the fluid to each microchannel, or to collect the fluid flowing out of the microchannel. The design of the manifold can be optimized according to the specific application, such as using different manifold structures such as tree shape and comb shape to achieve better fluid distribution uniformity.

[0003] In energy conversion and storage systems, such as solar collectors, fuel cells, and power transformers, the effective transfer and management of heat is crucial to improving energy conversion efficiency and reducing energy losses. Traditional heat exchangers have some inherent limitations. Conventional shell and tube heat exchangers are large in size, relatively low in heat transfer efficiency, and face challenges in handling high heat flux densities; although plate heat exchangers have high heat transfer efficiency, they have limited sealing performance and pressure resistance, and are difficult to operate reliably under some high-pressure and high-temperature conditions. In addition, these traditional heat exchangers are often limited by space and weight when integrated with miniaturized and lightweight equipment, and cannot meet the needs of modern industry for efficient and compact thermal management. Traditional heat pipes still have some problems in practical applications, such as the connection method between heat pipes and heat dissipation components is not optimized enough, resulting in large contact thermal resistance, affecting the overall heat transfer efficiency; the layout and quantity configuration of heat pipes lack a systematic design method, making it difficult to give full play to their advantages. Summary of the invention

[0004] In view of the above problems existing in the existing embedded manifold microchannel based on heat pipe array, the present invention is proposed.

[0005] Therefore, the purpose of the present invention is to provide an embedded manifold microchannel based on a heat pipe array, the purpose of which is to: combine different heat exchange components closely together through an embedded structure, reduce the thermal resistance in the heat transfer path, improve the overall heat exchange efficiency and the compactness of the system, and embed the heat pipe array into the manifold microchannel to achieve rapid collection and uniform distribution of heat, optimize heat flow distribution, and at the same time reduce the volume and weight of the system, meeting the development trend of modern industry for miniaturization and high efficiency of equipment.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: comprising:

[0007] The mounting assembly includes a support seat, a base fixedly mounted on the upper end of the support seat, a support plate mounted on the side wall of the base, and a cover plate clamped on the top of the support plate;

[0008] The heat pipe assembly comprises a fixing plate fixedly connected to the side wall of the support plate, an adapter fixedly sleeved in the middle of the fixing plate, a heat pipe body installed at the end of the adapter, and a fin sleeved on the side wall of the heat pipe body.

[0009] As a preferred solution of the embedded manifold microchannel based on the heat pipe array described in the present invention, the heat pipe assembly also includes a connector connected to the side wall of the heat pipe body, and a sleeve threadedly connected to the end of the connector, and the sleeve is sleeved on the outside of the heat pipe body.

[0010] As a preferred solution of the embedded manifold microchannel based on the heat pipe array of the present invention, the fin is arranged on the inner side of the sleeve, and the end of the fin does not contact the inner wall of the sleeve.

[0011] As a preferred solution of the embedded manifold microchannel based on the heat pipe array of the present invention, the heat pipe assembly also includes a baffle movable on the inner wall of the sleeve, and a vent arranged on the side wall of the sleeve, and the baffle is inserted into the inner side of the vent.

[0012] As a preferred solution of the embedded manifold microchannel based on the heat pipe array of the present invention, the heat pipe assembly further comprises a knob rotatably mounted on the side wall of the sleeve, and the rack at the end of the knob is meshed with the rack on the side wall of the baffle.

[0013] As a preferred solution of the embedded manifold microchannel based on the heat pipe array of the present invention, the heat pipe assembly further comprises a spring clip clamped on the inner wall of the sleeve, and the end protrusion of the spring clip is clamped on the side wall of the baffle.

[0014] As a preferred solution of the embedded manifold microchannel based on the heat pipe array of the present invention, the adapter side wall is clamped in the middle of the support plate side wall slot, and the fixing plate is connected to the support plate side wall by bolts.

[0015] As a preferred solution of the embedded manifold microchannel based on the heat pipe array described in the present invention, the heat pipe assembly also includes a flange plate fixedly connected to the end of the adapter, a connecting pipe is welded to the end of the flange plate, and the connecting pipe is connected to the inside of the adapter.

[0016] As a preferred solution of the embedded manifold microchannel based on the heat pipe array described in the present invention, the heat pipe assembly also includes a pad block clamped on the outer wall of the sleeve, a top block movably plugged into the upper end of the pad block, and a handle bolt threadedly connected to the side wall of the pad block.

[0017] As a preferred solution of the embedded manifold microchannel based on the heat pipe array of the present invention, the side wall of the top block is provided with an arc surface structure matching the bottom of the cushion block, and the end of the handle bolt passes through the cushion block and is used in conjunction with the top block.

[0018] Beneficial effects of the present invention: The heat pipe array has an extremely high thermal conductivity and can quickly conduct heat from the heat source to the microchannel. By reasonably designing the layout and number of the heat pipe array, heat can be effectively collected and transferred, so that the heat is evenly distributed on the entire microchannel surface, greatly improving the heat exchange efficiency, ensuring that the heat can be dissipated in time, and is suitable for heat dissipation scenarios with high heat flux density, such as heat dissipation of high-performance electronic chips, high-power lasers and other equipment. The embedded manifold microchannel structure closely combines the heat pipe array with the microchannel to achieve a highly integrated and miniaturized design. Compared with traditional separate heat exchangers, it is conducive to efficient thermal management in a limited space, and is particularly suitable for applications with strict requirements on volume and weight. The isothermal nature of the heat pipe makes the temperature distribution on the microchannel surface more uniform during the heat transfer process. It can be flexibly designed and optimized according to different application requirements and heat source characteristics, and can adapt to various complex working environments and heat dissipation requirements by adjusting the size, shape, type of working fluid and structural parameters of the heat pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0021] Figure 2 It is a schematic diagram of the front structure of the present invention.

[0022] Figure 3 It is a side structural schematic diagram of the present invention.

[0023] Figure 4 It is a schematic diagram of the top structure of the present invention.

[0024] Figure 5 It is a schematic diagram of the AA cross-sectional structure of the present invention.

[0025] In the figure: 100, installation assembly; 101, support seat; 102, base; 103, support plate; 104, cover plate; 200, heat pipe assembly; 201, fixing plate; 202, adapter; 203, heat pipe body; 204, fin; 205, connector; 206, sleeve; 207, baffle; 208, vent; 209, knob; 210, spring; 211, flange plate; 212, connecting pipe; 213, gasket; 214, top block; 215, handle bolt. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0027] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0029] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0030] Example 1

[0031] Reference Figure 1-4 , which is the first embodiment of the present invention, provides an embedded manifold microchannel based on a heat pipe array, and the device includes.

[0032] The mounting assembly 100 includes a support base 101, a base 102 fixedly mounted on the upper end of the support base 101, a support plate 103 mounted on the side wall of the base 102, and a cover plate 104 clamped on the top of the support plate 103;

[0033] The heat pipe assembly 200 includes a fixing plate 201 fixedly connected to the side wall of the support plate 103, an adapter 202 fixedly sleeved in the middle of the fixing plate 201, a heat pipe body 203 installed at the end of the adapter 202, and a fin 204 sleeved on the side wall of the heat pipe body 203.

[0034] Among them, the mounting assembly 100 is used to install the heat pipe assembly 200 and maintain the stability of the position of the heat pipe assembly 200. The array-type heat pipe assembly 200 is installed in the middle of the support plate 103, has an extremely high thermal conductivity, and can quickly conduct heat from the heat source to the microchannel. The fixing plate 201 is used to cooperate with the installation of the heat pipe body 203 with the adapter 202, and cooperate with the adapter 202 to maintain the stability of the position of the heat pipe body 203, and is convenient to fix in the middle of the mounting assembly 100. The fins 204 are used to assist the heat pipe body 203 to dissipate heat and transfer the heat evenly outward. The support seat 101 is used to cooperate with fixing the device on the ground installation foundation. The base 102 cooperates with the support plate 103 to dock with the heat pipe assembly 200, which can maintain the stability of the position of the heat pipe assembly 200. The cover plate 104 is used to shield and protect the area above the heat pipe assembly 200.

[0035] Specifically, the heat pipe assembly 200 further includes a connector 205 connected to the side wall of the heat pipe body 203 , and a sleeve 206 threadedly connected to the end of the connector 205 , and the sleeve 206 is sleeved on the outside of the heat pipe body 203 .

[0036] Among them, adding a connector 205 with a sleeve 206 installed on the side wall of the heat pipe body 203 can shield and protect the heat pipe body 203 and improve the heat preservation capacity of the heat pipe body 203.

[0037] Furthermore, the fin 204 is disposed inside the sleeve 206 , and the end of the fin 204 does not contact the inner wall of the sleeve 206 .

[0038] The sleeve 206 is wrapped around the outside of the fin 204 , which can shield and protect the fin 204 and reduce the impact of the external environment on the fin 204 .

[0039] Furthermore, the heat pipe assembly 200 further includes a baffle 207 movable on the inner wall of the sleeve 206 , and a vent 208 disposed on the side wall of the sleeve 206 , and the baffle 207 is plugged into the inner side of the vent 208 .

[0040] A baffle 207 is added to the side wall of the sleeve 206 to close the vent 208 on the side wall of the sleeve 206 . Opening the baffle 207 can connect the vent 208 with the inside of the sleeve 206 , thereby improving the ventilation and heat dissipation capacity inside the sleeve 206 .

[0041] Preferably, the heat pipe assembly 200 further includes a knob 209 rotatably mounted on the side wall of the sleeve 206 , and a rack at an end of the knob 209 is meshed with a rack on the side wall of the baffle 207 .

[0042] A knob 209 is added to the side wall of the sleeve 206. Turning the knob 209 can drive the baffle 207 to move along the inner wall of the sleeve 206 through the side wall rack, adjust the size of the vent 208, and further adjust the ventilation state of the side wall of the sleeve 206 to meet different usage requirements.

[0043] Preferably, the heat pipe assembly 200 further includes a spring piece 210 clamped on the inner wall of the sleeve 206 , and a protrusion at the end of the spring piece 210 is clamped on the side wall of the baffle 207 .

[0044] Among them, the spring piece 210 is installed on the inner wall of the sleeve 206 to connect with the baffle 207. When the end of the baffle 207 moves to the side wall of the spring piece 210, the spring piece 210 will be clamped on the side wall of the end of the baffle 207, cooperate with the inner wall of the sleeve 206 to provide support, limit the baffle 207, and maintain the stability of the position of the baffle 207.

[0045] It should be noted that the side wall of the adapter 202 is clamped in the middle of the slot of the side wall of the support plate 103, and the fixing plate 201 is connected to the side wall of the support plate 103 by bolts.

[0046] Among them, the fixing plate 201 and the support plate 103 are fixed to maintain the stability of the position of the end components of the adapter 202, and loosening the fixing plate 201 facilitates the disassembly and maintenance of the end parts of the adapter 202.

[0047] Specifically, the heat pipe assembly 200 further includes a flange plate 211 fixedly connected to the end of the adapter 202 . A connecting pipe 212 is welded to the end of the flange plate 211 . The connecting pipe 212 is connected to the inside of the adapter 202 .

[0048] Among them, a flange plate 211 with a connecting pipe 212 is added to the end of the adapter 202 to facilitate the connection of two sets of adapters 202, facilitate heating, keep the pipeline connected, and maintain the stability of the pipeline position.

[0049] When in use, the two sets of adapters 202 are connected together through a flange plate 211 with a connecting pipe 212 to keep the pipes connected and transfer heat. When the heat dissipation state of the sleeve 206 needs to be adjusted, turning the knob 209 can drive the baffle 207 to move along the inner wall of the sleeve 206 through the side wall rack, adjust the size of the vent 208, and then adjust the ventilation state of the side wall of the sleeve 206.

[0050] In summary, the heat pipe array has an extremely high thermal conductivity and can quickly transfer heat from the heat source to the microchannel. By rationally designing the layout and number of the heat pipe array, it can effectively collect and transfer heat so that the heat is evenly distributed over the entire microchannel surface, greatly improving the heat exchange efficiency and ensuring that the heat can be dissipated in a timely manner. It is suitable for heat dissipation scenarios with high heat flux density, such as heat dissipation of high-performance electronic chips, high-power lasers and other equipment. The embedded manifold microchannel structure tightly combines the heat pipe array with the microchannel.

[0051] Example 2

[0052] Reference Figure 1-5 , which is the second embodiment of the present invention, and this embodiment is different from the first embodiment in that: a supporting component of the sleeve 206 in the heat pipe assembly 200 is proposed, including;

[0053] The heat pipe assembly 200 further includes a cushion block 213 clamped on the outer wall of the sleeve 206 , a top block 214 movably plugged on the upper end of the cushion block 213 , and a handle bolt 215 threadedly connected to the side wall of the cushion block 213 .

[0054] Among them, the cushion block 213 is added and used in conjunction with the top block 214 to provide support for the sleeves 206 that are close to each other, maintain the stability of the position of the sleeve 206, and prevent the sleeve 206 from being deformed by heat. The handle bolt 215 is tightened to fix the top block 214 at the end of the cushion block 213 to maintain the stability of the combined length of the top block 214 and the cushion block 213.

[0055] Preferably, the side wall of the top block 214 is provided with an arc surface structure matching the bottom of the cushion block 213 , and the end of the handle bolt 215 passes through the cushion block 213 and is used in conjunction with the top block 214 .

[0056] Among them, the top block 214 and the cushion block 213 are provided with a matching arc structure on the side wall, which can adjust the installation direction according to actual needs, adapt to installation at different positions of the side wall of the sleeve 206, support the sleeve 206, and maintain the stability of the position of the sleeve 206.

[0057] When in use, the cushion block 213 and the top block 214 are combined together and docked with the two sets of sleeves 206. After adjusting to an appropriate length, the handle bolt 215 is tightened to fix the top block 214 to the end of the cushion block 213 to maintain the stability of the combined length of the top block 214 and the cushion block 213, and to support and limit the sleeve 206.

[0058] In summary, a highly integrated and miniaturized design is achieved. Compared with the traditional separate heat exchanger, it is conducive to efficient thermal management in a limited space and is particularly suitable for applications with strict requirements on volume and weight. The isothermal property of the heat pipe makes the temperature distribution on the surface of the microchannel more uniform during the heat transfer process. It can be flexibly designed and optimized according to different application requirements and heat source characteristics. By adjusting the size, shape, type of working fluid and structural parameters of the heat pipe, it can adapt to various complex working environments and heat dissipation requirements. At the same time, it can support components such as the sleeve, improve the installation strength of the microchannel components, and prevent the microchannel components from being deformed due to heat, affecting connectivity.

[0059] Importantly, it should be noted that the construction and arrangement of the present application shown in a plurality of different exemplary embodiments are only exemplary. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and ratio of various elements, and parameter values ​​(e.g., temperature, pressure, etc.), installation arrangement, use of materials, color, directional changes, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in the application. For example, the element shown as integrally formed can be composed of multiple parts or elements, the position of the element can be inverted or otherwise changed, and the nature or number or position of the discrete element can be changed or changed. Therefore, all such modifications are intended to be included in the scope of the present invention. The order or sequence of any process or method steps can be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also equivalent structure. Without departing from the scope of the present invention, other replacements, modifications, changes and omissions can be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the invention is not limited to a specific embodiment, but extends to several modifications still falling within the scope of the appended claims.

[0060] Additionally, in order to provide a concise description of exemplary embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0061] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. An embedded manifold microchannel based on a heat pipe array, characterized in that: include, The mounting assembly (100) comprises a support seat (101), a base (102) fixedly mounted on the upper end of the support seat (101), a support plate (103) mounted on the side wall of the base (102), and a cover plate (104) clamped on the top of the support plate (103); The heat pipe assembly (200) comprises a fixing plate (201) fixedly connected to the side wall of the support plate (103), an adapter (202) fixedly sleeved in the middle of the fixing plate (201), a heat pipe body (203) installed at the end of the adapter (202), and a fin (204) sleeved on the side wall of the heat pipe body (203).

2. The embedded manifold microchannel based on heat pipe array according to claim 1, characterized in that: The heat pipe assembly (200) further comprises a connector (205) connected to the side wall of the heat pipe body (203), and a sleeve (206) threadedly connected to the end of the connector (205), wherein the sleeve (206) is sleeved outside the heat pipe body (203).

3. The embedded manifold microchannel based on heat pipe array according to claim 2, characterized in that: The fin (204) is arranged inside the sleeve (206), and the end of the fin (204) does not contact the inner wall of the sleeve (206).

4. The embedded manifold microchannel based on heat pipe array according to claim 3, characterized in that: The heat pipe assembly (200) further comprises a baffle (207) movable on the inner wall of the sleeve (206), and a vent (208) arranged on the side wall of the sleeve (206), wherein the baffle (207) is plugged into the inner side of the vent (208).

5. The embedded manifold microchannel based on heat pipe array according to claim 4, characterized in that: The heat pipe assembly (200) further comprises a knob (209) rotatably mounted on the side wall of the sleeve (206), wherein a toothed rack at the end of the knob (209) meshes with a toothed rack on the side wall of the baffle (207).

6. The embedded manifold microchannel based on heat pipe array according to claim 5, characterized in that: The heat pipe assembly (200) further comprises a spring sheet (210) clamped on the inner wall of the sleeve (206), and a protrusion at the end of the spring sheet (210) is clamped on the side wall of the baffle (207).

7. The embedded manifold microchannel based on heat pipe array according to claim 6, characterized in that: The side wall of the adapter (202) is clamped in the middle of the slot on the side wall of the support plate (103), and the fixing plate (201) is connected to the side wall of the support plate (103) by bolts.

8. The embedded manifold microchannel based on heat pipe array according to claim 7, characterized in that: The heat pipe assembly (200) further comprises a flange plate (211) fixedly connected to the end of the adapter (202); a connecting pipe (212) is welded to the end of the flange plate (211); and the connecting pipe (212) is connected to the inside of the adapter (202).

9. The embedded manifold microchannel based on heat pipe array according to claim 8, characterized in that: The heat pipe assembly (200) further comprises a cushion block (213) clamped on the outer wall of the sleeve (206), a top block (214) movably plugged into the upper end of the cushion block (213), and a handle bolt (215) threadedly connected to the side wall of the cushion block (213).

10. The embedded manifold microchannel based on heat pipe array according to claim 9, characterized in that: The side wall of the top block (214) is provided with an arc surface structure matching the bottom of the cushion block (213), and the end of the handle bolt (215) passes through the cushion block (213) and is used in conjunction with the top block (214).

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