A curvature detection device and method for an optical polishing sheet

Abstract

The present invention discloses a curvature detection device and method for an optical polishing sheet, which relates to the technical field of polishing sheet detection. The device includes a machine body. A water flow pool is arranged at the bottom of the machine body. A fixed platform is arranged at the center of the water flow pool. A fixing plate is arranged on the top of the fixed platform. A plurality of suction cups are arranged on the top of the fixing plate. A driving device is arranged on the side wall of the machine body, and a detection device is arranged on the driving device. The suction cups suck and fix the polishing sheet tightly. Then, after the driving device is started, it drives the detection device to move. The detection device then moves towards the side close to the polishing sheet, so that the detection device contacts the surface of the polishing sheet. Finally, the controller controls the detection device and the first motor in the fixed platform to start. After the first motor starts, it drives the fixing plate to rotate. The fixing plate drives the polishing sheet to rotate. When the polishing sheet rotates, the detection device moves from the edge of the polishing sheet to the center of the polishing sheet under the action of the driving device, thereby completing the curvature detection of the polishing sheet.

Description

Technical Field

[0001] The present invention relates to the technical field of polished wafer detection, and specifically relates to a curvature detection device and method for an optical polished wafer. Background Art

[0002] An optical polished wafer is a transparent material made of glass optical material and having one or more curved surfaces. After being polished, it is often assembled with a spectacle frame to form glasses for correcting the vision of users and obtaining a clear vision. When the optical polished wafer is manufactured, it is necessary to measure the curvature of the optical polished wafer to check whether the optical polished wafer meets the usage requirements. When the machine measures the optical polished wafer, it is necessary to change the different angles of the optical polished wafer for measurement. When measuring, the angle adjustment range of the optical polished wafer is small, and omissions may occur during detection; and the optical polished wafer usually needs to be cleaned before detection to ensure the surface is clean and does not affect the detection accuracy. However, the process of cleaning first and then detecting reduces the detection efficiency of the optical polished wafer. Summary of the Invention

[0003] The purpose of the present invention is to provide a curvature detection device and method for an optical polished wafer to solve the problems raised in the prior art.

[0004] To achieve the above purpose, the present invention provides the following technical solutions:

[0005] A curvature detection device for an optical polished wafer includes a machine body. A water flow pool is provided at the bottom of the machine body. A fixed table is provided at the center of the water flow pool. A fixing plate is provided on the top of the fixed table. A plurality of suction cups are provided on the top of the fixing plate. A first motor is provided inside the fixed table. The driving shaft of the first motor is connected to a transmission shaft, and the transmission shaft is connected to the bottom of the fixing plate. An air pump is provided inside the fixing plate. The air pump is connected to the suction cups through a pipeline. A driving device is provided on the side wall of the machine body, and a detection device is provided on the driving device.

[0006] The staff places the polished wafer to be detected on the top of the fixing plate and makes it contact with the suction cups. Subsequently, the controller controls the air pump to start. The air pump extracts the air in the space between the suction cups and the polished wafer, so that the suction cups suck and fix the polished wafer tightly. Subsequently, the controller controls the driving device to start. After the driving device starts, it drives the detection device to move. The detection device then moves towards the side close to the polished wafer, so that the detection device contacts the surface of the polished wafer. Finally, the controller controls the detection device and the first motor inside the fixed table to start. After the first motor starts, the driving shaft of the first motor drives the transmission shaft to rotate. When the transmission shaft rotates, it drives the fixing plate to rotate. Further, the fixing plate drives the polished wafer to rotate. When the polished wafer rotates, the detection device moves from the edge of the polished wafer to the center of the polished wafer under the action of the driving device, thereby completing the curvature detection of the polished wafer.

[0007] Preferably, the driving device includes a vertical groove, a slider is arranged on the vertical groove, a vertical plate is arranged on the side of the slider away from the machine body, a second motor is arranged in the slider, a friction wheel is arranged on the driving shaft of the second motor, and the friction wheel is slidably connected to the vertical groove.

[0008] Preferably, a horizontal groove is arranged at the top of the vertical plate, a moving block is arranged in the horizontal groove, a third motor is arranged in the moving block, a transmission wheel is arranged on the driving shaft of the third motor, the transmission wheel is slidably connected to the horizontal groove, and a horizontal plate is arranged on the side of the moving block away from the horizontal groove.

[0009] Preferably, the detection device includes a detection column, the detection column is arranged at one end of the horizontal plate away from the horizontal groove, an arc-shaped plate is arranged on the outer wall of the detection column, and a cleaning ring is arranged on the side of the arc-shaped plate away from the detection column.

[0010] Preferably, a plurality of water spray nozzles are arranged on the inner wall of the arc-shaped plate, the plurality of water spray nozzles are arranged around the axis of the arc-shaped plate, a plurality of water delivery pipes are arranged in the arc-shaped plate, the water delivery pipes correspond to the water spray nozzles one by one, a water delivery groove is arranged at the top of the arc-shaped plate, a water pump is arranged inside the flowing water pool, and the water pump is connected to the water delivery groove through a pipeline.

[0011] Preferably, a detection groove is arranged at the bottom of the detection column, a moving frame is arranged in the detection groove, the moving frame is slidably connected to the detection groove, a pressure sensor is arranged inside the detection groove, a pressure plate is arranged in the detection groove, a pressure-sensitive spring is arranged between the pressure plate and the moving frame, and a detection roller is arranged at the bottom of the moving frame.

[0012] Preferably, a pressurization cavity is arranged in the middle of the detection column, a scroll fan is arranged in the pressurization cavity, electromagnetic coils are arranged in the inner wall of the pressurization cavity, a magnetic conductor is arranged on the scroll fan, the scroll fan is rotatably connected to the pressurization cavity, a plurality of air inlets are arranged at the top of the pressurization cavity, a plurality of air outlets are arranged on the side of the detection column close to the detection groove, and a delivery pipe is arranged between the air outlet and the pressurization cavity.

[0013] Preferably, the water spray nozzles are arranged obliquely towards the side close to the detection column, the air outlets are arranged obliquely towards the side close to the cleaning ring, fluff is arranged at the bottom side of the cleaning ring, the cleaning ring is made of rubber, the detection roller is made of resin, and the distance between the bottom plane of the cleaning ring and the top plane of the detection column is greater than the distance between the bottom end of the detection roller and the top plane of the detection column;

[0014] After the polishing wafer is fixed by the suction cup, the controller controls the second motor and the third motor to start. The drive shaft of the second motor drives the friction wheel to rotate. When the friction wheel rotates, it contacts the vertical groove, and then the friction wheel drives the vertical plate to move towards the side close to the water flow pool. When the vertical plate moves, it drives the horizontal plate to move, so that the horizontal plate moves towards the side close to the polishing wafer. At the same time, the drive shaft of the third motor drives the transmission wheel to rotate. When the transmission wheel rotates, it contacts the horizontal groove, and then the transmission wheel drives the horizontal plate to move. The horizontal plate moves along the horizontal groove and moves towards the edge of the polishing wafer. When the horizontal plate moves, it drives the detection column to move;

[0015] During the process of the horizontal plate moving from the center of the polishing wafer to the edge of the polishing wafer, since the distance between the bottom plane of the cleaning ring and the top plane of the detection column is greater than the distance between the bottom end of the detection roller and the top plane of the detection column, the cleaning ring first contacts the surface of the polishing wafer. At this time, the detection roller does not contact the surface of the polishing wafer. At the same time, the controller controls the water pump in the water flow pool to start. The water pump pumps the water in the water flow pool, and then conveys the water to the water delivery groove through the pipeline. The water moves from the water delivery groove to the water delivery pipe, and finally is conveyed to the water spray nozzle through the water delivery pipe and sprays out from the water spray nozzle onto the surface of the polishing wafer. The sprayed water rinses the impurities on the surface of the polishing wafer;

[0016] When the detection column moves to the edge of the polishing wafer under the drive of the horizontal plate, the controller controls the second motor to start, so that the second motor drives the horizontal plate to descend, and then the detection roller descends and contacts the surface of the polishing wafer;

[0017] After the detection roller contacts the surface of the polishing wafer, the detection roller is subjected to the extrusion force of the polishing wafer, so that the detection roller moves towards the side close to the detection groove. Then the detection roller pushes the moving frame to move. When the moving frame moves, it squeezes the pressure-sensitive spring. After the pressure-sensitive spring is squeezed, it pushes the pressure plate to move, so that the pressure plate moves towards the side away from the detection roller. The pressure plate immediately applies pressure to the pressure sensor. The pressure sensor immediately converts the pressure signal into an electrical signal and transmits it to the controller. The controller calculates the distance between the contact position of the detection roller and the polishing wafer and the top plane of the detection column according to the electrical signal (the smaller the pressure, the greater the distance, and the greater the pressure, the shorter the distance);

[0018] Subsequently, the controller controls the start of the first motor. The drive shaft of the first motor drives the transmission shaft to rotate. When the transmission shaft rotates, it drives the fixed plate to rotate, and then the fixed plate drives the polishing disc to rotate. While the polishing disc is rotating, the third motor drives the horizontal plate to move along the horizontal groove, so that the horizontal plate drives the detection column to move. At this time, the detection column moves from the edge of the polishing disc towards the center of the polishing disc. Since the polishing disc rotates and the detection roller moves horizontally, the movement trajectory of the detection roller on the surface of the polishing disc is in a spiral state. By moving the detection roller on the surface of the polishing disc, the distance between the contact position of the detection roller and the polishing disc and the top plane of the detection column is monitored in real time, thereby forming height change information presented in a spiral form. The controller takes the center of the spiral as the base point and shoots extension lines from the center of the spiral to the periphery of the spiral. Through the height information detected by the positioning points between adjacent two spiral lines, the curvature of the polishing disc can be obtained, thus realizing the curvature detection of the polishing disc;

[0019] When the detection roller contacts the surface of the polishing disc, at this time the detection column drives the cleaning ring to descend. Since the cleaning ring is made of rubber, the cleaning ring is squeezed and deformed, so that the cleaning ring contacts the surface of the polishing disc as much as possible. Subsequently, during the process of the detection roller detecting the polishing disc, the controller controls the electromagnetic coil in the pressure chamber to be energized. After the electromagnetic coil is energized, it generates a magnetic force. The magnetic force attracts the magnetic conductor in the vortex fan. Subsequently, the vortex fan generates a rotational force under the action of the electromagnetic coil. Then, the outside air is conveyed into the pressure chamber through the air inlet, and after being pressurized by the vortex fan, it is conveyed to the conveying pipe, and then conveyed to the air outlet through the conveying pipe, and finally sprayed onto the polishing disc through the air outlet;

[0020] While the squeezing air is sprayed out, the water spray nozzle also sprays water onto the polishing disc. Since the water spray nozzle is arranged obliquely towards the side close to the detection column and the air outlet is arranged obliquely towards the side close to the cleaning ring, after the water contacts the surface of the polishing disc, it is disturbed by the pressurized air, and then moves towards the edge of the cleaning ring under the action of the pressurized air, thereby keeping the area around the detection roller dry and avoiding water from affecting the detection accuracy of the detection roller. The water moves towards the edge of the cleaning ring and cooperates with the fluff at the bottom of the cleaning ring to wipe and clean the surface of the polishing disc, cleaning the impurities on the surface of the polishing disc, thus achieving the effect of synchronous cleaning and detection, saving the process and improving the detection efficiency of the polishing disc.

[0021] A detection method for a curvature detection device of an optical polishing disc, the detection method includes the following specific steps,

[0022] S1. Place the polishing disc on the fixed plate and fix it with a suction cup;

[0023] S2. The driving device drives the detection device to move towards the side close to the polishing disc;

[0024] S3. The detection device performs curvature detection on the surface of the polishing disc;

[0025] In S4, during the curvature detection process, the cleaning ring, water, and pressurized air are used to clean the surface of the polishing wafer, and the area around the detection roller is dried.

[0026] In S5, after the detection is completed, the polishing wafer is taken away.

[0027] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0028] 1. The detection column moves from the edge of the polishing wafer to the center of the polishing wafer, cooperating with the rotation of the polishing wafer, so that the movement trajectory of the detection roller on the surface of the polishing wafer is in a spiral state. By moving the detection roller on the surface of the polishing wafer, the distance between the contact position of the detection roller and the polishing wafer and the top plane of the detection column is monitored in real time, thereby forming height change information presented in a spiral form. The controller takes the center of the spiral as the base point and shoots extension lines from the center of the spiral to the periphery of the spiral. Through the height information monitored by the positioning points between adjacent two spiral lines, the curvature of the polishing wafer can be obtained, thus realizing the curvature detection of the polishing wafer, and solving the problem that when measuring an optical polishing wafer, it is necessary to change different angles of the optical polishing wafer for measurement, and the angle adjustment range of the optical polishing wafer is small during measurement, which may cause omissions during detection, and improving the accuracy of the curvature detection of the polishing wafer.

[0029] 2. While the pressurized air is ejected, the water spray nozzle also sprays water onto the polishing wafer. Since the water spray nozzle is inclined towards the side close to the detection column and the air outlet is inclined towards the side close to the cleaning ring, after the water contacts the surface of the polishing wafer, it is interfered by the pressurized air and then moves towards the edge of the cleaning ring under the action of the pressurized air, thereby keeping the area around the detection roller dry and avoiding the influence of water on the detection accuracy of the detection roller. The water moves towards the edge of the cleaning ring and cooperates with the fluff at the bottom of the cleaning ring to wipe and clean the surface of the polishing wafer, cleaning the impurities on the surface of the polishing wafer, thus achieving the effect of synchronous cleaning and detection, saving the process, and improving the detection efficiency of the polishing wafer. Description of the Drawings

[0030] Figure 1 is a side view of the present invention;

[0031] Figure 2 is a three-dimensional view of the present invention;

[0032] Figure 3 is a top structural schematic diagram of the detection device;

[0033] Figure 4 is a bottom structural schematic diagram of the detection device;

[0034] Figure 5 is an internal structural schematic diagram of the detection device;

[0035] Figure 6 Is the internal front view of the detection device;

[0036] Figure 7 Is a schematic diagram of the spiral trajectory of the detection roller on the surface of the polishing wafer;

[0037] Figure 8 Is a schematic cross-sectional view of the spiral trajectory of the detection roller on the surface of the polishing wafer;

[0038] In the figure: 1. Machine body; 11. Flowing water tank; 12. Fixed table; 13. Fixed plate; 14. Suction cup;

[0039] 2. Driving device; 21. Vertical groove; 22. Vertical plate; 23. Horizontal groove; 24. Horizontal plate;

[0040] 3. Detection equipment; 31. Detection column; 32. Arc-shaped plate; 321. Water spray nozzle; 322. Water delivery pipe; 323. Water delivery tank; 33. Cleaning ring; 34. Detection tank; 341. Moving frame; 342. Detection roller; 35. Pressurization chamber; 351. Air inlet; 352. Air outlet; 353. Delivery pipe; 36. Vortex fan. Detailed implementation manners

[0041] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0042] Embodiment: As Figures 1-8 shown, the present invention provides a technical solution for a curvature detection device and method for an optical polishing wafer,

[0043] A curvature detection device for an optical polishing wafer, comprising a machine body 1, a flowing water tank 11 is arranged at the bottom of the machine body 1, a fixed table 12 is arranged at the center of the flowing water tank 11, a fixed plate 13 is arranged on the top of the fixed table 12, a plurality of suction cups 14 are arranged on the top of the fixed plate 13, a first motor is arranged in the fixed table 12, a transmission shaft is connected to the driving shaft of the first motor, the transmission shaft is connected to the bottom of the fixed plate 13, an air pump is arranged in the fixed plate 13, the air pump is connected to the suction cups 14 through a pipeline, a driving device 2 is arranged on the side wall of the machine body 1, and a detection device 3 is arranged on the driving device 2.

[0044] As a specific embodiment of the present invention, the driving device 2 includes a vertical groove 21, on which a slider is arranged. On the side of the slider away from the body 1, a vertical plate 22 is arranged. A second motor is arranged inside the slider, and a friction wheel is arranged on the driving shaft of the second motor. The friction wheel is slidably connected to the vertical groove 21;

[0045] On the top of the vertical plate 22, a horizontal groove 23 is arranged, in which a moving block is arranged. A third motor is arranged inside the moving block, and a transmission wheel is arranged on the driving shaft of the third motor. The transmission wheel is slidably connected to the horizontal groove 23. On the side of the moving block away from the horizontal groove 23, a horizontal plate 24 is arranged.

[0046] As a specific embodiment of the present invention, the detection device 3 includes a detection column 31, which is arranged at one end of the horizontal plate 24 away from the horizontal groove 23. An arc-shaped plate 32 is arranged on the outer wall of the detection column 31. A cleaning ring 33 is arranged on the side of the arc-shaped plate 32 away from the detection column 31. Fluff is arranged at the bottom side of the cleaning ring 33. The cleaning ring 33 is made of rubber;

[0047] A plurality of water spray nozzles 321 are arranged on the inner wall of the arc-shaped plate 32. The plurality of water spray nozzles 321 are arranged around the axis of the arc-shaped plate 32. A plurality of water delivery pipes 322 are arranged inside the arc-shaped plate 32. The water delivery pipes 322 correspond to the water spray nozzles 321 one by one. A water delivery groove 323 is arranged on the top of the arc-shaped plate 32. A water pump is arranged inside the flowing water pool 11. The water pump is connected to the water delivery groove 323 through a pipeline. The water spray nozzles 321 are arranged obliquely towards the side close to the detection column 31.

[0048] As a specific embodiment of the present invention, a detection groove 34 is arranged at the bottom of the detection column 31. A moving frame 341 is arranged in the detection groove 34. The moving frame 341 is slidably connected to the detection groove 34. A pressure sensor is arranged inside the detection groove 34. A pressure plate is arranged in the detection groove 34. A pressure-sensitive spring is arranged between the pressure plate and the moving frame 341. A detection roller 342 is arranged at the bottom of the moving frame 341. The detection roller 342 is made of resin.

[0049] As a specific embodiment of the present invention, a pressure chamber 35 is provided in the middle of the detection column 31. A scroll fan 36 is provided in the pressure chamber 35. Electromagnetic coils are provided in the inner wall of the pressure chamber 35. A magnetic conductor is provided on the scroll fan 36. The scroll fan 36 is rotatably connected to the pressure chamber 35. A plurality of air inlets 351 are provided at the top of the pressure chamber 35. A plurality of air outlets 352 are provided on one side of the detection column 31 close to the detection groove 34. A delivery pipe 353 is provided between the air outlet 352 and the pressure chamber 35. The air outlet 352 is arranged obliquely toward the side close to the cleaning ring 33.

[0050] As a specific embodiment of the present invention, the distance between the bottom plane of the cleaning ring 33 and the top plane of the detection column 31 is greater than the distance between the bottom end of the detection roller 342 and the top plane of the detection column 31.

[0051] A detection method for a curvature detection device of an optical polishing sheet, the detection method includes the following specific steps,

[0052] S1. Place the polishing sheet on the fixing plate 13 and fix it with the suction cup 14;

[0053] S2. The driving device 2 drives the detection device 3 to move toward the side close to the polishing sheet;

[0054] S3. The detection device 3 performs curvature detection on the surface of the polishing sheet;

[0055] S4. During the curvature detection process, the cleaning ring 33, water and pressurized air clean the surface of the polishing sheet and dry the area around the detection roller 342;

[0056] S5. After the detection is completed, take away the polishing sheet.

[0057] The working principle of the present invention:

[0058] When the polishing sheet is fixed by the suction cup 14, the controller controls the second motor and the third motor to start. The drive shaft of the second motor drives the friction wheel to rotate. When the friction wheel rotates, it contacts the vertical groove 21, and then the friction wheel drives the vertical plate 22 to move toward the side close to the flowing water tank 11. When the vertical plate 22 moves, it drives the horizontal plate 24 to move, so that the horizontal plate 24 moves toward the side close to the polishing sheet. At the same time, the drive shaft of the third motor drives the transmission wheel to rotate. When the transmission wheel rotates, it contacts the horizontal groove 23, and then the transmission wheel drives the horizontal plate 24 to move. The horizontal plate 24 moves along the horizontal groove 23 and moves toward the edge of the polishing sheet. When the horizontal plate 24 moves, it drives the detection column 31 to move;

[0059] During the process of the horizontal plate 24 moving from the center of the polishing wafer towards the edge of the polishing wafer, since the distance between the bottom plane of the cleaning ring 33 and the top plane of the detection column 31 is greater than the distance between the bottom end of the detection roller 342 and the top plane of the detection column 31, the cleaning ring 33 first contacts the surface of the polishing wafer. At this time, the detection roller 342 does not contact the surface of the polishing wafer. Meanwhile, the controller controls the water pump in the water tank 11 to start. The water pump extracts the water in the water tank 11, and then conveys the water to the water delivery groove 323 through a pipeline. The water moves from the water delivery groove 323 to the water delivery pipe 322, and finally is conveyed to the water spray nozzle 321 through the water delivery pipe 322 and sprays out from the water spray nozzle 321 onto the surface of the polishing wafer. The sprayed water rinses the impurities on the surface of the polishing wafer;

[0060] When the detection column 31 moves to the edge of the polishing wafer under the drive of the horizontal plate 24, the controller controls the second motor to start, causing the second motor to drive the horizontal plate 24 to descend, and further causing the detection roller 342 to descend and contact the surface of the polishing wafer;

[0061] After the detection roller 342 contacts the surface of the polishing wafer, the detection roller 342 is subjected to the extrusion force of the polishing wafer, causing the detection roller 342 to move towards the side close to the detection groove 34. Further, the detection roller 342 pushes the moving frame 341 to move. When the moving frame 341 moves, it squeezes the pressure-sensitive spring. After being squeezed, the pressure-sensitive spring pushes the pressure plate to move, causing the pressure plate to move towards the side away from the detection roller 342. The pressure plate then applies pressure to the pressure sensor, and the pressure sensor immediately converts the pressure signal into an electrical signal and transmits it to the controller. The controller calculates the distance between the contact position of the detection roller 342 and the surface of the polishing wafer and the top plane of the detection column 31 based on the electrical signal (the smaller the pressure, the greater the distance; the greater the pressure, the shorter the distance);

[0062] Subsequently, the controller controls the first motor to start. The drive shaft of the first motor drives the transmission shaft to rotate. When the transmission shaft rotates, it drives the fixed plate 13 to rotate. Further, the fixed plate 13 drives the polishing wafer to rotate. While the polishing wafer rotates, the third motor drives the horizontal plate 24 to move along the horizontal groove 23, causing the horizontal plate 24 to drive the detection column 31 to move. At this time, the detection column 31 moves from the edge of the polishing wafer towards the center of the polishing wafer. Due to the rotation of the polishing wafer and the horizontal movement of the detection roller 342, the movement trajectory of the detection roller 342 on the surface of the polishing wafer is in a spiral state. By moving the detection roller 342 on the surface of the polishing wafer, the distance between the contact position of the detection roller 342 and the surface of the polishing wafer and the top plane of the detection column 31 is monitored in real time, thereby forming height change information presented in a spiral form. The controller takes the center of the spiral as the base point and shoots extension lines from the center of the spiral towards the periphery of the spiral. Through the positioning points between adjacent two spiral lines (that is Figure 7 and Figure 8The height information monitored by A and B in it (A and B are the intersection points of the spiral line and the extension line) can be used to obtain the curvature of the polished wafer, thereby realizing the curvature detection of the polished wafer;

[0063] When the detection roller 342 contacts the surface of the polished wafer, at this time, the detection column 31 drives the cleaning ring 33 to descend. Since the cleaning ring 33 is made of rubber, the cleaning ring 33 is deformed by extrusion, so that the cleaning ring 33 contacts the surface of the polished wafer as much as possible. Subsequently, during the detection of the polished wafer by the detection roller 342, the controller controls the electromagnetic coil in the pressure chamber 35 to be energized. After the electromagnetic coil is energized, a magnetic force is generated. The magnetic force attracts the magnetic conductor in the vortex fan 36. Subsequently, the vortex fan 36 generates a rotational force under the action of the electromagnetic coil. Then, the outside air is conveyed to the pressure chamber 35 through the air inlet 351, pressurized by the vortex fan 36 and conveyed to the conveying pipe 353, conveyed to the air outlet 352 through the conveying pipe 353, and finally sprayed onto the polished wafer through the air outlet 352;

[0064] While the pressurized air is sprayed, the water spray port 321 also sprays water onto the polished wafer. Since the water spray port 321 is arranged obliquely towards the side close to the detection column 31 and the air outlet 352 is arranged obliquely towards the side close to the cleaning ring 33, after the water contacts the surface of the polished wafer, it is disturbed by the pressurized air and then moves towards the edge of the cleaning ring 33 under the action of the pressurized air, thereby keeping the area around the detection roller 342 dry and avoiding the influence of water on the detection accuracy of the detection roller 342. The water moves towards the edge of the cleaning ring 33 and cooperates with the fluff at the bottom of the cleaning ring 33 to wipe and clean the surface of the polished wafer, cleaning the impurities on the surface of the polished wafer, thus achieving the effect of simultaneous cleaning and detection.

[0065] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. A curvature detection device for an optical polishing sheet, characterized in that: The invention comprises a machine body (1), a water pool (11) is provided at the bottom of the machine body (1), a fixed platform (12) is provided at the center of the water pool (11), a fixed plate (13) is provided at the top of the fixed platform (12), a plurality of suction cups (14) are provided at the top of the fixed plate (13), a No. 1 motor is provided in the fixed platform (12), a driving shaft of the No. 1 motor is connected to a transmission shaft, the transmission shaft is connected to the bottom of the fixed plate (13), an air pump is provided in the fixed plate (13), the air pump is connected to the suction cup (14) through a pipeline, a driving device (2) is provided on the side wall of the machine body (1), and a detection device (3) is provided on the driving device (2); The driving device (2) comprises a vertical slot (21), a slider is provided on the vertical slot (21), a vertical plate (22) is provided on the side of the slider away from the machine body (1), and a horizontal slot (23) is provided on the top of the vertical plate (22); a moving block is provided in the horizontal slot (23), and a horizontal plate (24) is provided on the side of the moving block away from the horizontal slot (23); The detection device (3) comprises a detection column (31), the detection column (31) being arranged at one end of the horizontal plate (24) away from the horizontal groove (23), an arc-shaped plate (32) being arranged on the outer wall of the detection column (31), and a cleaning ring (33) being arranged on the side of the arc-shaped plate (32) away from the detection column (31); The inner wall of the arc-shaped plate (32) is provided with a plurality of water spraying ports (321), and the plurality of water spraying ports (321) are arranged around the axis of the arc-shaped plate (32). The arc-shaped plate (32) is provided with a plurality of water delivery pipes (322), and the water delivery pipes (322) correspond to the water spraying ports (321) one by one. The top of the arc-shaped plate (32) is provided with a water delivery trough (323), and a water pump is provided inside the water flow pool (11), and the water pump is connected to the water delivery trough (323) through a pipeline. The bottom of the detection column (31) is provided with a detection groove (34), a movable frame (341) is provided in the detection groove (34), the movable frame (341) is slidably connected to the detection groove (34), a pressure sensor is provided inside the detection groove (34), a pressure plate is provided in the detection groove (34), a pressure-sensing spring is provided between the pressure plate and the movable frame (341), and a detection roller (342) is provided at the bottom of the movable frame (341); A pressurized chamber (35) is provided in the middle of the detection column (31), a turbofan (36) is provided in the pressurized chamber (35), an electromagnetic coil is provided in the inner wall of the pressurized chamber (35), a magnetic conductor is provided on the turbofan (36), the turbofan (36) is rotatably connected to the pressurized chamber (35), a plurality of air inlets (351) are provided on the top of the pressurized chamber (35), a plurality of air outlets (352) are provided on the side of the detection column (31) close to the detection slot (34), and a delivery pipe (353) is provided between the air outlet (352) and the pressurized chamber (35); The water spray port (321) is arranged obliquely toward a side close to the detection column (31), and the air outlet (352) is arranged obliquely toward a side close to the cleaning ring (33). The bottom of the side of the cleaning ring (33) is provided with fluff. The cleaning ring (33) is made of rubber, and the detection roller (342) is made of resin. The distance between the bottom plane of the cleaning ring (33) and the top plane of the detection column (31) is greater than the distance between the bottom end of the detection roller (342) and the top plane of the detection column (31).

2. The curvature detection device for an optical polishing sheet according to claim 1, characterized in that: A No. 2 motor is provided in the slider, a friction wheel is provided on the driving shaft of the No. 2 motor, and the friction wheel is slidably connected to the vertical groove (21).

3. The curvature detection device for an optical polishing sheet according to claim 2, characterized in that: A No. 3 motor is provided in the moving block, a transmission wheel is provided on the driving shaft of the No. 3 motor, and the transmission wheel is slidably connected to the horizontal slot (23).

4. A detection method for a curvature detection device for an optical polishing sheet according to any one of claims 1 to 3, characterized in that: The detection method comprises the following specific steps: S1, placing the polishing sheet on the fixing plate (13) and fixing it with a suction cup (14); S2, the driving device (2) drives the detection device (3) to move toward the side close to the polishing sheet; S3, the detection device (3) performs curvature detection on the surface of the polishing sheet; S4, during the curvature detection process, the cleaning ring (33), water and pressurized air clean the surface of the polishing sheet, and dry the area around the detection roller (342); S5. After the test is completed, remove the polishing sheet.

Images