Testing equipment for detecting wafer

Abstract

The invention relates to the technical field of wafer detection, and discloses a test device for detecting wafers, which comprises a clamping seat, a placement groove is formed in the clamping seat, a plurality of movable clamping plates are arranged on the clamping seat and around the placement groove, pressure sensors are embedded in the clamping plates, and a vacuum adsorption pump is arranged below the clamping seat and right below the placement groove; the testing mechanism is located right above the placement groove and comprises a testing knife, a testing head and a high-definition camera which are arranged below the same supporting rod, the testing head is fixedly arranged above the testing knife and used for sensing the testing force of the testing knife, the testing head is driven by a driving structure, and the high-definition camera is fixedly arranged below the supporting rod and used for sensing the testing force of the testing knife. The supporting rod is driven by a lead screw driver arranged on one side of the clamping base to ascend and descend. And the console is arranged on one side of the clamping seat and is electrically connected with the clamping seat, the testing mechanism and the screw rod driver. The hardness detection device has the advantages that the clamping and fixing effects are good, shaking during hardness detection is avoided, and a detection picture can be transmitted out.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer detection, and in particular to a testing device for detecting wafers. Background Art

[0002] Wafer is the basic material for manufacturing semiconductor devices. In appearance, it is a round thin sheet. It is usually made of silicon or other semiconductor materials. Silicon wafer is the most common because silicon has good semiconductor properties. Wafers play a key role in the manufacturing process of integrated circuits. Chip manufacturers use a series of complex micro-machining processes such as lithography, etching, and doping on the surface of wafers to build hundreds of millions of transistors and other electronic components. These components are combined to form integrated circuits with various functions. Chips such as computer CPUs and mobile phone processors are all manufactured on the basis of wafers.

[0003] When testing the performance of wafers, hardness testing is an important step. The current testing method is to use two electric clamping tools to fix the wafer, and then slide the test head on the wafer surface. During this process, the hardness data will be transmitted to the probe and further transmitted to the external device. However, this testing method has obvious problems. Since the wafer is fixed only by two electric clamping tools, the wafer is prone to shaking when the test head slides and contacts the wafer surface. This shaking will seriously interfere with the test results and cause data deviations. Summary of the invention

[0004] In order to solve the above-mentioned problems, the present invention proposes a test device for detecting wafers, which has good clamping and fixing effect, avoids shaking during hardness testing, and can transmit the test image.

[0005] In order to solve the above technical problems, the technical solution proposed by the present invention is: a test device for detecting wafers, comprising:

[0006] A clamping seat, wherein the clamping seat is provided with a placement groove matching the wafer, the clamping seat is provided with a plurality of movable clamping plates around the placement groove, the clamping plates are embedded with pressure sensors, and a vacuum adsorption pump is provided below the clamping seat directly below the placement groove;

[0007] The testing mechanism is located directly above the placement slot, and includes a testing knife, a testing head and a high-definition camera arranged under the same support rod, wherein the testing head is fixedly arranged above the testing knife for sensing the testing force of the testing knife, the testing head is driven by a driving structure fixedly arranged on the supporting rod, the high-definition camera is fixedly arranged under the supporting rod, and the supporting rod is driven to rise and fall by a screw driver arranged on one side of the clamping seat;

[0008] The control console is arranged on one side of the clamping seat and is electrically connected with the clamping seat, the testing mechanism and the screw driver.

[0009] Furthermore, at least four clamping plates are provided and are evenly spaced around the placement slot.

[0010] Furthermore, the clamping plate is driven by an electric push rod fixed on the clamping seat.

[0011] Furthermore, the driving structure includes a micro motor fixed on the support rod, an eccentric rod is fixed on the output end of the micro motor, and the test head is fixed on one end below the eccentric rod.

[0012] Furthermore, the screw drive includes a housing, a screw driven by a motor, and a ball nut threadedly connected to the screw, the support rod is fixedly connected to the ball nut, guide blocks are integrally formed on both sides of the ball nut, a guide strip matching the guide block is provided on the inner side of the housing, the guide block is slidably connected to the guide strip, a clamping strip is provided on the side of the guide strip close to the guide block, and a clamping groove matching the clamping strip is provided on the guide block.

[0013] Furthermore, the control console is provided with a display screen for displaying the images taken by the high-definition camera and the test results of the test knife.

[0014] Furthermore, the clamping seat, the screw driver and the control console are all fixedly arranged on the same bottom plate, and anti-slip rubber strips are fixedly arranged at the four corners below the bottom plate.

[0015] Furthermore, a placement rack is fixedly provided on the bottom plate at one side of the clamping seat, a plurality of wafer storage slots are provided above the placement rack, and openings are provided at the front sides of the wafer storage slots.

[0016] Compared with the prior art, the advantages of the present invention are as follows: the clamping seat of the equipment is provided with at least four clamping plates evenly spaced around the placement slot, and their positions are accurately driven by an electric push rod, and the clamping effect can be flexibly adjusted according to different wafer sizes. Applying force to the wafer from multiple directions can effectively prevent the wafer from being displaced or shaken during detection, ensuring that the wafer is always in a stable state during the detection process. A vacuum adsorption pump is provided below the clamping seat, just below the placement slot, which cooperates with the clamping effect of the clamping plate to further enhance the fixing effect of the wafer, and can firmly fix the wafer even when performing operations that may generate large vibrations such as hardness testing.

[0017] The console is equipped with a display screen that can display the images taken by the high-definition camera and the test results of the test knife in real time. The operator can directly see the test situation without additional equipment. During the hardness test and other operations, the operator can quickly make judgments and adjustments based on the real-time images and results, which not only improves the operability of the test, but also greatly improves the test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The present invention is a three-dimensional Figure 1 ;

[0019] Figure 2 The present invention is a three-dimensional Figure 2 ;

[0020] Figure 3 It is a front view of the present invention;

[0021] Figure 4 is a top view of the present invention;

[0022] Figure 5 is a side view of the present invention;

[0023] Figure 6 It is an enlarged view of part A of the present invention.

[0024] As shown in the figure: 1. Clamping seat; 2. Placement slot; 3. Clamping plate; 4. Pressure sensor; 5. Vacuum adsorption pump; 6. Support rod; 7. Test knife; 8. Test head; 9. High-definition camera; 10. Control panel; 11. Electric push rod; 12. Micro motor; 13. Eccentric rod; 14. Shell; 15. Screw; 16. Ball nut; 17. Guide block; 18. Guide strip; 19. Card strip; 20. Display screen; 21. Bottom plate; 22. Anti-slip rubber strip; 23. Placement rack; 24. Wafer storage slot. DETAILED DESCRIPTION

[0025] The present invention is further described in detail below with reference to the accompanying drawings.

[0026] Combined with Figure 1 , Attachment Figure 3 , Attachment Figure 6 , a test device for detecting wafers, comprising: a clamping seat 1, the clamping seat 1 is provided with a placement slot 2 matching the wafer, the clamping seat 1 is provided with a plurality of movable clamping plates 3 around the placement slot 2, the clamping plates 3 are driven by an electric push rod 11 fixed on the clamping seat 1, the electric push rod 11 drives the clamping plates 3, can accurately adjust their positions, and can flexibly adjust the clamping effect according to different wafer sizes. A pressure sensor 4 is embedded in the clamping plate 3, a vacuum adsorption pump 5 is provided below the clamping seat 1 directly below the placement slot 2, at least four clamping plates 3 are provided, and are evenly spaced around the placement slot 2, at least four clamping plates 3 are evenly arranged around the placement slot 2, can apply force to the wafer from multiple directions, and can effectively prevent the wafer from shifting or shaking during detection.

[0027] Combined with Figure 5The testing mechanism is located directly above the placement slot 2, and includes a testing knife 7, a testing head 8 and a high-definition camera 9 arranged under the same support rod 6. The high-definition camera 9 is fixedly arranged under the support rod 6, and the testing head 8 is fixedly arranged above the testing knife 7 for sensing the testing force of the testing knife 7. The testing head 8 is driven by a driving structure fixedly arranged on the support rod 6, and the driving structure includes a micro motor 12 fixedly arranged on the support rod 6, and an eccentric rod 13 is fixedly arranged at the output end of the micro motor 12. The testing head 8 is fixedly arranged at one end below the eccentric rod 13. The micro motor 12 and the eccentric rod 13 drive the testing head 8, so that it can move stably on the wafer for precise testing.

[0028] Combined with Figure 1 , Attachment Figure 3 The support rod 6 is driven to rise and fall by a screw driver arranged on one side of the clamping seat 1. The screw driver includes a housing 14, a screw 15 driven by a motor, and a ball nut 16 threadedly connected to the screw 15. The support rod 6 is fixedly connected to the ball nut 16. The screw 15 driven by the motor cooperates with the ball nut 16 to ensure that the support rod 6 drives the test mechanism to rise and fall in a straight line and stably. The ball nut 16 is integrally formed with guide blocks 17 on both sides. A guide bar 18 cooperating with the guide block 17 is arranged on the inner side of the housing 14. The guide block 17 is slidably connected to the guide bar 18. A clamping bar 19 is arranged on the side of the guide bar 18 close to the guide block 17. A clamping groove cooperating with the clamping bar 19 is arranged on the guide block 17. The guide block 17 cooperates with the guide bar 18, and the clamping bar 19 cooperates with the clamping groove, so that the guide block 17 and the guide bar 18 can be interlocked with each other, thereby ensuring that the ball nut 16 drives the support rod 6 to rise and fall stably, preventing the support rod 6 from shaking, etc., and ensuring that the test knife 7 can perform stable testing on the wafer.

[0029] Combined with Figure 1 , Attachment Figure 4 The control panel 10 is arranged at one side of the clamping seat 1 and is electrically connected to the clamping seat 1, the testing mechanism and the screw driver. The control panel 10 is provided with a display screen 20 for displaying the picture taken by the high-definition camera 9 and the test result of the test knife 7. The display screen 20 can display the picture of the high-definition camera 9 and the test result of the test knife 7 in real time. The operator can directly see the test situation and make judgments and adjustments quickly, which effectively improves the operability and efficiency of the test.

[0030] Combined with Figure 1 , Attachment Figure 2 The clamping seat 1, the screw driver and the control console 10 are all fixed on the same base plate 21. Anti-slip rubber strips 22 are fixed at the four corners below the base plate 21 to fix the components on the same base plate 21 to form a stable integrated whole, effectively avoiding vibration and displacement problems caused by unstable connections of the components, and facilitating the installation and transportation of the equipment and the layout of wafer detection at a suitable position.

[0031] Combined with Figure 1 , Attachment Figure 4 A placement rack 23 is fixedly provided on the bottom plate 21 at one side of the clamping seat 1, and a plurality of wafer storage slots 24 are provided above the placement rack 23. The front side of the wafer storage slots 24 is provided with an opening. The placement rack 23 and the wafer storage slots 24 provide a convenient temporary storage space for the wafers to be tested, thereby improving the convenience of the test process. The opening design facilitates the placement and removal of wafers, making the flow smoother.

[0032] Specific implementation of the present invention: connect the device to an external power supply, and place the wafers to be tested in the wafer storage slot 24 in sequence. Take out a wafer to be tested and place it in the placement slot 2 of the clamping seat 1. Then, start the electric push rod 11 through the control console 10, and the electric push rod 11 pushes the clamping plate 3 to move, and flexibly adjusts the position according to the size of the wafer, so that the clamping plate 3 applies force to the wafer from multiple directions, and monitors the pressure of the pressure sensor 4 on the clamping plate 3 in real time to ensure that the wafer can be stably fixed and prevented from being damaged by pressure. At the same time, start the vacuum adsorption pump 5 to further stabilize the wafer to ensure that it will not be displaced or shaken during detection.

[0033] Then, the control console 10 controls the screw driver to work, and the motor in the screw driver drives the screw 15 to rotate, and cooperates with the ball nut 16 connected with the thread, driving the support rod 6 to descend. The guide blocks 17 on both sides of the ball nut 16 slide along the guide strips 18 on the inner side of the housing 14, and the clamping strips 19 are engaged with the clamping grooves on the guide blocks 17 to ensure that the support rod 6 can be stably lifted and lowered.

[0034] When the support rod 6 drives the test knife 7 to descend to the position where the wafer can be tested, the micro motor 12 is started, and the micro motor 12 drives the eccentric rod 13 to rotate, thereby driving the test head 8 to move. The test head 8 drives the test knife 7 below it to slide on the wafer for hardness detection. The test head 8 senses the test result and presents it on the display screen 20. During the process, turn on the high-definition camera 9 to shoot the test process, and the shooting picture will also be displayed in real time on the display screen 20 of the control console 10. After the test is completed, the above steps are reversed to raise the test knife 7, release the clamping plate 3 and turn off the vacuum adsorption pump 5, and take out the tested wafers for classification.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] The present invention and its embodiments are described above, and such description is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if ordinary technicians in the field are inspired by it, without departing from the purpose of the invention, they can design a structure and embodiment similar to the technical solution without creativity, which should belong to the protection scope of the present invention.

Claims

1. A test device for detecting a wafer, characterized in that: include: A clamping seat (1), wherein the clamping seat (1) is provided with a placement groove (2) for matching the wafer, the clamping seat (1) is provided with a plurality of movable clamping plates (3) around the placement groove (2), the clamping plates (3) are embedded with a pressure sensor (4), and a vacuum adsorption pump (5) is provided below the clamping seat (1) and directly below the placement groove (2); The testing mechanism is located directly above the placement slot (2), and comprises a testing knife (7), a testing head (8) and a high-definition camera (9) which are arranged below the same support rod (6); the testing head (8) is fixedly arranged above the testing knife (7) for sensing the testing force of the testing knife (7); the testing head (8) is driven by a driving structure fixedly arranged on the support rod (6); the high-definition camera (9) is fixedly arranged below the support rod (6); and the support rod (6) is driven to rise and fall by a screw driver arranged on one side of the clamping seat (1); The control console (10) is arranged on one side of the clamping seat (1) and is electrically connected to the clamping seat (1), the testing mechanism and the screw drive.

2. The test equipment for detecting wafers according to claim 1, characterized in that: At least four clamping plates (3) are provided and are evenly spaced around the placement groove (2).

3. The test equipment for detecting wafers according to claim 1, characterized in that: The clamping plate (3) is driven by an electric push rod (11) fixed on the clamping seat (1).

4. The test equipment for detecting wafers according to claim 1, characterized in that: The driving structure comprises a micro motor (12) fixedly arranged on a support rod (6), an eccentric rod (13) being fixedly arranged at the output end of the micro motor (12), and the test head (8) being fixedly arranged at one end below the eccentric rod (13).

5. The test equipment for detecting wafers according to claim 1, characterized in that: The screw drive comprises a housing (14), a screw (15) driven by a motor, and a ball nut (16) threadedly connected to the screw (15); the support rod (6) is fixedly connected to the ball nut (16); guide blocks (17) are integrally formed on both sides of the ball nut (16); a guide bar (18) matching the guide block (17) is provided on the inner side of the housing (14); the guide block (17) is slidably connected to the guide bar (18); a clamping bar (19) is provided on the side of the guide bar (18) close to the guide block (17); and a clamping groove matching the clamping bar (19) is provided on the guide block (17).

6. The test equipment for detecting wafers according to claim 1, characterized in that: The control console (10) is provided with a display screen (20) for displaying the images shot by the high-definition camera (9) and the test results of the test knife (7).

7. The test equipment for detecting wafers according to claim 1, characterized in that: The clamping seat (1), the screw drive and the control console (10) are all fixedly arranged on the same base plate (21), and anti-slip rubber strips (22) are fixedly arranged at the four corners below the base plate (21).

8. The test equipment for detecting wafers according to claim 7, characterized in that: A placement rack (23) is also fixedly provided on the bottom plate (21) at one side of the clamping seat (1), a plurality of wafer storage slots (24) are provided above the placement rack (23), and an opening is provided at the front side of the wafer storage slots (24).

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