Detection device of power semiconductor

Abstract

The invention provides a power semiconductor detection device, and belongs to the technical field of semiconductors, the power semiconductor detection device comprises a containing disc, a first driving assembly, a detection assembly, a clamping assembly and a second driving assembly, the upper edge of the containing disc is provided with a plurality of notches for containing wafers, the first driving assembly is arranged at the bottom of the containing disc, and the second driving assembly is arranged at the bottom of the containing disc. The first driving assembly is arranged on the containing disc and used for driving the containing disc to rotate intermittently, the two detection assemblies are arranged on the side of the containing disc and used for detecting wafers rotating along with the containing disc, and the clamping assembly and the second driving assembly are arranged between the two detection assemblies. Compared with the prior art, through the arrangement of the two detection assemblies, the clamping assembly and the second driving assembly, comprehensive automatic detection of the two sides of a plurality of wafers can be achieved, and the wafer detection device has the advantages of being good in detection effect and high in detection efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductors, and in particular is a detection device for power semiconductors. Background Art

[0002] After the semiconductor wafer manufacturing process is completed, the surface of the semiconductor wafer needs to be inspected to confirm whether there are defects such as scratches.

[0003] At present, the detection of surface defects of semiconductor wafers is mostly carried out by using a transportation mechanism to drive the semiconductor wafers to be inspected, so that several semiconductor wafers are moved under the inspection mechanism in turn, and the inspection mechanism is used to inspect the several semiconductor wafers in turn. This detection method is relatively traditional. Since the semiconductor wafer moved under the inspection mechanism has only one side facing the inspection mechanism, the inspection mechanism can only inspect one side of the wafer at a time. As for whether there are defects such as scratches on the other side of the wafer, it is necessary to manually turn the wafer over after the current side of the wafer is inspected, and then inspect it again, which results in relatively low wafer inspection efficiency. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the embodiments of the present invention is to provide a detection device for a power semiconductor.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: A power semiconductor detection device includes a holding plate, a first driving component, a detection component, a clamping component and a second driving component. The upper edge of the holding tray is provided with a plurality of notches for accommodating wafers. The first driving assembly is disposed at the bottom of the holding tray and is used to drive the holding tray to rotate intermittently. The detection components are provided with two groups, and the two groups of the detection components are arranged on the side of the holding plate, and are used to detect the wafers rotating with the holding plate. The clamping assembly and the second driving assembly are arranged between the two groups of detection assemblies. After a group of wafers is detected by one of the groups of detection assemblies, the clamping assembly clamps the group of wafers, and the second driving assembly drives the clamping assembly to rotate to turn over the clamped wafers.

[0006] As a further improvement of the present invention: a base is provided below the holding tray, and the center of the bottom of the holding tray is rotatably connected to the base via a column rod. The first driving assembly includes a first gear, a motor and a second gear, The motor is fixedly mounted on the upper portion of the base, the first gear is arranged at the output end of the motor, and the second gear is fixedly arranged outside the column and meshes with the first gear.

[0007] As a further improvement of the present invention: the notch is in an arc structure, and a push rod is fixedly provided on the bottom edge of the holding tray. The clamping assembly includes a clamping plate, an end plate, a triangular plate and a vertical plate. The end plate is movably arranged on the side of the vertical plate facing the containing plate, and the clamping plates are provided with two groups, and the two groups of clamping plates are distributed at intervals in the upper and lower directions on the side of the end plate facing the containing plate, and the two groups of clamping plates are slidably matched with the end plate, and a group of triangular plates are fixedly arranged on the sides of the two groups of clamping plates away from each other.

[0008] As a further improvement of the present invention: the side wall of the vertical plate is fixedly provided with a second guide rail distributed vertically, a slide seat is slidably provided on the second guide rail, a rotating shaft is fixedly provided on the side of the end plate away from the clamping plate, and one end of the rotating shaft away from the end plate is rotatably connected to the slide seat, The two groups of clamping plates are connected by a first elastic member, and the first elastic member is used to provide elastic support for the two groups of clamping plates. Stoppers are fixedly provided at both ends of one side of the end plate, and the two groups of clamping plates are located between the two groups of stoppers. The second driving assembly includes a third gear, a support plate and a bevel gear. The third gear is fixedly arranged outside the rotating shaft, the support plate is fixedly arranged on the side wall of the vertical plate, the support plate is located on the side above the third gear, the beveled gear plates are provided with a plurality of groups, a plurality of the beveled gear plates are hingedly arranged on one side of the support plate, a plurality of the beveled gear plates are vertically spaced apart along the side wall of the support plate, and one side of each group of the beveled gear plates is connected to the support plate through a group of second elastic members.

[0009] As a further improvement of the present invention: a first vertically distributed guide rail is fixedly provided on one side of the end plate facing the holding tray, and guide rail grooves matching the first guide rail are formed on the two groups of side walls of the clamping plates.

[0010] As a further improvement of the present invention: a support rod is also fixedly provided on the side wall of the slide seat, and the support rod extends to the side of the third gear at one end away from the slide seat, and a check plate is hingedly provided on the support rod, and the check plate can extend from one end of the support rod to between two adjacent groups of teeth of the third gear to limit the third gear to one-way rotation.

[0011] As a further improvement of the present invention: the first elastic member and the second elastic member are springs or metal springs.

[0012] Compared with the prior art, the present invention has the following beneficial effects: In an embodiment of the present invention, when it is necessary to inspect the wafers, the wafers to be inspected can be respectively embedded in the grooves on the upper edge of the holding tray, and then the holding tray is driven to rotate intermittently by the first driving component, thereby driving the wafers to rotate intermittently. When a group of wafers rotates to the bottom of one group of detection components, the detection component detects scratches and other defects on the surface of one side of the wafers. After the detection of one side of the wafers is completed, the holding tray drives the wafers to continue to rotate. The wafers are clamped by the clamping component, and the second driving component drives the clamping component to rotate, thereby turning the wafers over to adjust the other side of the wafers to face upward. The turned wafers are then rotated to the bottom of another group of detection components, and the other group of detection components detects scratches and other defects on the other side of the wafer. Compared with the prior art, through the arrangement of two groups of detection components, the clamping component and the second driving component, comprehensive and automatic detection of both sides of a number of wafers can be achieved, which has the advantages of good detection effect and high detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A schematic diagram of the structure of a power semiconductor detection device Figure 1 ; Figure 2 A schematic diagram of the structure of a power semiconductor detection device Figure 2 ; Figure 3 A schematic diagram of the structure of a clamping assembly in a power semiconductor detection device Figure 1 ; Figure 4 A schematic diagram of the structure of a clamping assembly in a power semiconductor detection device Figure 2 ; Figure 5 for Figure 3 A magnified schematic diagram of the middle A area; Figure 6 for Figure 4 A magnified schematic diagram of the middle B area; In the figure: 10-holding plate, 101-base, 102-push rod, 103-column, 20-first driving assembly, 201-first gear, 202-motor, 203-second gear, 30-detection assembly, 40-clamping assembly, 401-clamping plate, 402-first elastic member, 403-first guide rail, 404-end plate, 405-triangular plate, 406-stop block, 407-rotating shaft, 408-slide seat, 409-vertical plate, 410-second guide rail, 50-second driving assembly, 501-third gear, 502-check plate, 503-support rod, 504-oblique gear plate, 505-support plate. DETAILED DESCRIPTION

[0014] The technical solution of the present invention is further described in detail below in conjunction with specific implementation methods.

[0015] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0016] See also Figure 1 , Figure 2 , Figure 3 as well as Figure 4 The present embodiment provides a detection device for power semiconductors, including a placing tray 10, a first driving component 20, a detection component 30, a clamping component 40 and a second driving component 50. The upper edge of the placing tray 10 is provided with a plurality of notches for accommodating wafers. The first driving component 20 is arranged at the bottom of the placing tray 10, and is used to drive the placing tray 10 to rotate intermittently. The detection component 30 is provided with two groups, and the two groups of the detection components 30 are arranged on the sides of the placing tray 10, and are used to detect the wafers rotating with the placing tray 10. The clamping component 40 and the second driving component 50 are arranged between the two groups of the detection components 30. After a group of wafers is detected by one of the groups of the detection components 30, the clamping component 40 clamps the group of wafers, and at the same time, the second driving component 50 drives the clamping component 40 to rotate to turn over the clamped wafers.

[0017] When it is necessary to inspect the wafers, the wafers to be inspected can be respectively embedded in the grooves on the upper edge of the holding tray 10, and then the holding tray 10 is driven to rotate intermittently by the first driving component 20, thereby driving the wafers to rotate intermittently. When a group of wafers rotates to the bottom of one group of detection components 30, the detection component 30 detects scratches and other defects on the surface of one side of the wafers. After the detection of one side of the wafers is completed, the holding tray 10 drives the wafers to continue to rotate. The wafers are clamped by the clamping component 40. At the same time, the second driving component 50 drives the clamping component 40 to rotate, thereby turning the wafers over to adjust the other side of the wafers to face upward. Subsequently, the turned wafers are rotated to the bottom of another group of detection components 30, and the other group of detection components 30 detects scratches and other defects on the other side of the wafer. In this way, through the arrangement of two groups of detection components 30, the clamping component 40 and the second driving component 50, comprehensive detection of both sides of the wafers can be achieved.

[0018] See also Figure 2In one embodiment, a base 101 is provided below the holding tray 10, and the bottom center position of the holding tray 10 is rotatably connected to the base 101 through a column 103. The first driving assembly 20 includes a first gear 201, a motor 202 and a second gear 203. The motor 202 is fixedly mounted on the upper part of the base 101, the first gear 201 is arranged at the output end of the motor 202, and the second gear 203 is fixedly arranged outside the column 103 and meshes with the first gear 201.

[0019] The first gear 201 is driven to rotate intermittently by the motor 202, and the meshing action of the first gear 201 and the second gear 203 is used to drive the column rod 103 to rotate intermittently. The intermittent rotation of the column rod 10 drives the placing plate 10 to rotate intermittently, and then drives the wafer embedded in the upper edge groove of the placing plate 10 to rotate intermittently, so that the wafer rotates from the bottom of the two groups of detection components 30, and cooperates with the clamping component 40 and the second driving component 50 to flip the wafer, so as to realize comprehensive detection of both sides of the wafer.

[0020] See also Figure 2 , Figure 3 as well as Figure 4 In one embodiment, the groove is in an arc structure, a push rod 102 is fixedly provided at the bottom edge of the holding tray 10, the clamping assembly 40 includes a clamping plate 401, an end plate 404, a triangular plate 405 and a vertical plate 409, the end plate 404 is movably provided on the side of the vertical plate 409 facing the holding tray 10, the clamping plate 401 is provided with two groups, the two groups of the clamping plates 401 are distributed at intervals in the upper and lower directions on the side of the end plate 404 facing the holding tray 10, the two groups of the clamping plates 401 are slidably matched with the end plate 404, and a group of the triangular plates 405 are fixedly provided on the sides of the two groups of the clamping plates 401 away from each other.

[0021] Since the slot is in an arc structure, when a circular wafer is inserted into the slot, a portion of the wafer extends toward the side of the tray 10 (eg, Figure 1 As shown in the figure), when one side surface of a group of wafers is detected by a group of detection components 30, the group of wafers can be rotated between the two groups of clamps 401. At this time, the push rod 102 at the bottom of the holding tray 10 can act on the triangular plate 405 at the bottom of the lower clamp 401, thereby pushing the lower clamp 401 to slide upward compared to the end plate 404. When the lower clamp 401 slides up, it acts on the bottom position of the wafer located on the outside of the holding tray 10, thereby pressing the wafer to the bottom of the upper clamp 401 to clamp the wafer. After the wafer is clamped, the second driving component 50 drives the end plate 404 and the two groups of clamps 401 to rotate, thereby driving the wafer to rotate to realize the wafer flipping operation.

[0022] See also Figure 5 as well as Figure 6 In one embodiment, a second guide rail 410 distributed vertically is fixedly provided on the side wall of the vertical plate 409, a slide seat 408 is slidably provided on the second guide rail 410, a rotating shaft 407 is fixedly provided on the side of the end plate 404 away from the clamping plate 401, and the end of the rotating shaft 407 away from the end plate 404 is rotatably connected to the slide seat 408, the two groups of the clamping plates 401 are connected by a first elastic member 402, the first elastic member 402 is used to provide elastic support for the two groups of the clamping plates 401, and the upper and lower ends of one side of the end plate 401 are fixedly provided with stoppers 406, and the two groups of the clamping plates 401 are located between the two groups of the stoppers 406 The second driving assembly 50 includes a third gear 501, a support plate 505 and a beveled tooth piece 504, the third gear 501 is fixedly arranged outside the rotating shaft 407, the support plate 505 is fixedly arranged on the side wall of the vertical plate 409, the support plate 505 is located on one side above the third gear 501, and the beveled tooth piece 504 is provided with a plurality of groups, a plurality of the beveled tooth pieces 504 are hingedly arranged on one side of the support plate 505, and a plurality of the beveled tooth pieces 504 are vertically spaced along the side wall of the support plate 505, and one side of each group of the beveled tooth pieces 504 is connected to the support plate 505 through a group of second elastic members (not shown in the figure).

[0023] When the push rod 102 acts on the triangular plate 405 at the bottom of the lower clamping plate 401 and thus pushes the lower clamping plate 401 to move upward, the lower clamping plate 401 acts on the wafer to extend to the bottom of the outer side of the holding tray 10, thereby pressing the wafer against the bottom of the upper clamping plate 401 to clamp the wafer. After the wafer is clamped, as the push rod 102 continues to push the triangular plate 405, the end plate 404, the two sets of clamping plates 401 and the wafer move upward as a whole, the rotating shaft 407 drives the slide seat 408 to slide up along the second guide rail 410, and the third gear 501 acts on the plurality of bevel gear pieces 504 and thereby pushes the plurality of bevel gear pieces 504 to deflect toward the support plate 505. The third gear 501 cannot mesh with the plurality of bevel gear pieces 504. When the push rod 102 slides away from the lower end of the triangular plate 405, the end plate 404, the two sets of clamping plates 401 and the wafer move upward as a whole. The plate 404, the two groups of clamping plates 401, the rotating shaft 407, the third gear 501 and the slide 408 move downward as a whole. At this time, the third gear 501 and the plurality of bevel gear pieces 504 enter into a meshing state, thereby driving the rotating shaft 407 to rotate compared to the slide 408. When the rotating shaft 407 rotates, it drives the end plate 404 and the two groups of clamping plates 401 to rotate, thereby driving the wafer to rotate. When the wafer rotates 180°, the third gear 501 and the plurality of bevel gear pieces 504 are disengaged, the end plate 404 and the two groups of clamping plates 401 move downward to the initial position, and the first elastic member 402 pushes the two groups of clamping plates 401 to make the two groups of clamping plates 401 move away from each other, so that the subsequent wafer can be rotated again between the two groups of clamping plates 401, and then be clamped again by the two groups of clamping plates 401.

[0024] See also Figure 3 In one embodiment, a vertically distributed first guide rail 403 is fixedly provided on one side of the end plate 404 facing the receiving tray 10 , and guide rail grooves (not shown in the figure) adapted to the first guide rail 403 are formed on the side walls of the two groups of clamping plates 401 .

[0025] See also Figure 5 In one embodiment, a support rod 503 is fixedly provided on the side wall of the slide 408, and one end of the support rod 503 away from the slide 408 extends to the side of the third gear 501. A check plate 502 is hingedly provided on the support rod 503, and one end of the check plate 502 away from the support rod 503 can extend to between two adjacent groups of teeth of the third gear 501 to limit the third gear 501 to one-way rotation.

[0026] When the push rod 102 acts on the triangular plate 405 at the bottom of the lower clamping plate 401, the check plate 502 restricts the third gear 501, so that the rotating shaft 407 cannot rotate relative to the slide 408. The force applied by the push rod 102 to the triangular plate 405 can smoothly drive the lower clamping plate 401 to slide up along the side wall of the end plate 404, thereby pressing the wafer to the bottom of the upper clamping plate 401, thereby achieving stable clamping of the wafer.

[0027] In one embodiment, the first elastic member 402 and the second elastic member may be springs or metal springs, which are not limited here.

[0028] In one embodiment, as the push rod 102 acts on the triangular plate 405 and thereby drives the two groups of clamps 401 and the end plate 404 to move upward, the two groups of clamps 401 will clamp the wafer and move upward together, and the wafer will detach from the current slot. After the push rod 102 slides away from the lower end of the triangular plate 405, as the two groups of clamps 401 drive the wafer to move downward, the wafer will be misaligned with the previously placed slot. Therefore, in the initial wafer placement process, the wafers can be placed at intervals so that there is an empty slot between two adjacent groups of wafers. In this way, when the two groups of clamps 401 drive the flipped wafer to move downward, the flipped wafer can be embedded in the empty slot at the rear, so that the latter group of detection components 30 can accurately detect the flipped wafer.

[0029] In one embodiment, the detection component 30 is an image acquisition camera. When a group of wafers rotates to the bottom of the image acquisition camera, the image acquisition camera is used to capture the surface image of the group of wafers to determine whether there are scratches or other defects on the surface of the group of wafers.

[0030] In the embodiment of the present invention, when it is necessary to inspect the wafers, the plurality of wafers to be inspected can be respectively embedded in the plurality of notches on the upper edge of the holding tray 10, and then the holding tray 10 is driven to rotate intermittently by the first driving component 20, thereby driving the plurality of wafers to rotate intermittently. When a group of wafers rotates to the bottom of one group of inspection components 30, the group of inspection components 30 inspects the defects such as scratches on the surface of one side of the group of wafers. After the inspection of one side of the group of wafers is completed, the holding tray 10 drives the group of wafers to continue rotating, and the group of wafers is clamped by the clamping component. 40, and at the same time, the second driving component 50 drives the clamping component 40 to rotate, thereby turning over the group of wafers to adjust the other side surface of the group of wafers to face upward, and then the turned wafers are rotated to the bottom of another group of detection components 30, and the other group of detection components 30 detects scratches and other defects on the other side surface of the wafer. Compared with the prior art, through the arrangement of two groups of detection components 30, the clamping component 40 and the second driving component 50, comprehensive and automatic detection of both sides of several wafers can be achieved, which has the advantages of good detection effect and high detection efficiency.

[0031] The preferred embodiments of the present invention are described in detail above, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in this field without departing from the purpose of the present invention.

Claims

1. A power semiconductor detection device, characterized in that: It includes a holding plate, a first driving assembly, a detection assembly, a clamping assembly and a second driving assembly. The upper edge of the holding tray is provided with a plurality of notches for accommodating wafers. The first driving assembly is disposed at the bottom of the holding tray and is used to drive the holding tray to rotate intermittently. The detection components are provided with two groups, and the two groups of the detection components are arranged on the side of the holding plate, and are used to detect the wafers rotating with the holding plate. The clamping assembly and the second driving assembly are arranged between the two groups of detection assemblies. After a group of wafers is detected by one of the groups of detection assemblies, the clamping assembly clamps the group of wafers, and the second driving assembly drives the clamping assembly to rotate to turn over the clamped wafers.

2. A power semiconductor detection device according to claim 1, characterized in that: A base is provided below the holding tray, and the center of the bottom of the holding tray is rotatably connected to the base through a column rod. The first driving assembly includes a first gear, a motor and a second gear, The motor is fixedly mounted on the upper portion of the base, the first gear is arranged at the output end of the motor, and the second gear is fixedly arranged outside the column and meshes with the first gear.

3. A power semiconductor detection device according to claim 1, characterized in that: The notch is in an arc structure, and a push rod is fixedly arranged on the bottom edge of the holding tray. The clamping assembly includes a clamping plate, an end plate, a triangular plate and a vertical plate. The end plate is movably arranged on the side of the vertical plate facing the containing plate, and the clamping plates are provided with two groups, and the two groups of clamping plates are distributed at intervals in the upper and lower directions on the side of the end plate facing the containing plate, and the two groups of clamping plates are slidably matched with the end plate, and a group of triangular plates are fixedly arranged on the sides of the two groups of clamping plates away from each other.

4. A power semiconductor detection device according to claim 3, characterized in that: The side wall of the vertical plate is fixedly provided with a second guide rail distributed vertically, a slide seat is slidably provided on the second guide rail, a rotating shaft is fixedly provided on the side of the end plate away from the clamping plate, and one end of the rotating shaft away from the end plate is rotatably connected to the slide seat, The two groups of clamping plates are connected by a first elastic member, and the first elastic member is used to provide elastic support for the two groups of clamping plates. Stoppers are fixedly provided at both ends of one side of the end plate, and the two groups of clamping plates are located between the two groups of stoppers. The second driving assembly includes a third gear, a support plate and a bevel gear. The third gear is fixedly arranged outside the rotating shaft, the support plate is fixedly arranged on the side wall of the vertical plate, the support plate is located on the side above the third gear, the beveled gear plates are provided with a plurality of groups, a plurality of the beveled gear plates are hingedly arranged on one side of the support plate, a plurality of the beveled gear plates are vertically spaced apart along the side wall of the support plate, and one side of each group of the beveled gear plates is connected to the support plate through a group of second elastic members.

5. The power semiconductor detection device according to claim 3, characterized in that: A vertically distributed first guide rail is fixedly provided on one side of the end plate facing the containing tray, and guide rail grooves matching the first guide rail are formed on the side walls of the two groups of clamping plates.

6. A power semiconductor detection device according to claim 4, characterized in that: A support rod is also fixedly provided on the side wall of the slide seat, and the support rod extends to the side of the third gear at one end away from the slide seat. A check plate is hingedly provided on the support rod, and the check plate can extend to between two adjacent groups of teeth of the third gear at one end away from the support rod to limit the third gear to one-way rotation.

7. A power semiconductor detection device according to claim 4, characterized in that: The first elastic member and the second elastic member are springs or metal springs.

Images