Temperature detection circuit and method of IGBT (Insulated Gate Bipolar Translator) module

Abstract

The invention provides a temperature detection circuit and method of an IGBT module, and relates to the technical field of electronics. The temperature detection circuit comprises a driving board and a plurality of adapter boards, the driving board is provided with a driving power supply and a first detection unit, each adapter board is provided with a second detection unit, and the second detection units on the plurality of adapter boards are respectively used for connecting temperature detection ends of a plurality of IGBT modules. The second detection units on the plurality of adapter boards are sequentially cascaded through a signal wire harness, and the second detection unit of the last-stage adapter board in the plurality of adapter boards is connected with the first detection unit on the driving board through the signal wire harness; the first detection unit is further used for being connected with client equipment, and the driving power supply is used for being connected with the driving ends of the multiple IGBT modules. Therefore, the IGBT module temperature detection circuit is suitable for various IGBT module temperature detection structures, and the circuit cost is reduced.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a temperature detection circuit and method for an IGBT module. Background Art

[0002] In the prior art, the temperature sampling of multi-level and multi-parallel IGBT (Insulate-Gate Bipolar Transistor) modules has the problems of high cost, complex wiring, and multiple wiring harnesses. In particular, for modules where the NTC (Negative Temperature Coefficient) is connected to the E-pole (emitter) of the lower tube of the IGBT, there is a lack of accurate sampling and transmission solutions to achieve full temperature sampling.

[0003] In the prior art, a multi-channel analog switch selector and a phase-shift pulse are used to realize time-sharing modulation of multiple signals, and the temperature sampling of multiple parallel IGBT modules is realized through a single data bus. However, FPGA (Field Programmable Gate Array) is required for demodulation to restore the original data, and the device cost is high; and when three or more IGBTs are connected in parallel, the NTC sampling end of each IGBT module has a long path from the voltage-frequency conversion circuit. In the field use environment, the NTC analog signal is easily interfered by conduction and radiation, which affects the sampling accuracy.

[0004] In the prior art, a main board is also used, and a slave board is used in combination to transmit NTC samples. The output end of the isolation optocoupler is used as the output end of the main board. However, when the transmission line is disturbed, erroneous data is easily generated; at the same time, an additional NTC data harness is added. In order to meet the high-voltage insulation requirements of the harness, the harness needs to be protected by an insulating sleeve. However, the sleeve requires manual operation, which increases additional production costs; IGBT power drivers are often used in high-reliability scenarios, such as wind power, rail transit, etc. Compared with conventional connectors, they also need to meet the requirements of corrosion resistance, vibration resistance, plug-in resistance, and high temperature resistance. Therefore, the overall cost of the connector and harness is relatively high. The programs of the front-end and rear-end microcontrollers of this solution are inconsistent. Due to the different number of NTC samples of each microcontroller and the different cascade positions, a large number of program firmware versions need to be maintained, which also increases the software maintenance and management costs.

[0005] Moreover, the methods in the prior art can only be applied to modules with basic isolation of IGBT built-in NTC, and cannot be applied to modules with NTC connected to the E pole of the lower tube of IGBT. An additional isolated power supply is required to separately power the NTC sampling part, which is complex in design and inconvenient to use. Summary of the invention

[0006] The purpose of the present application is to address the deficiencies in the above-mentioned prior art and to provide a temperature detection circuit and method for an IGBT module to solve the problem that the temperature detection circuit in the prior art cannot adapt to all IGBT structures.

[0007] To achieve the above purpose, the technical solution adopted in the embodiment of the present application is as follows: In a first aspect, an embodiment of the present application provides a temperature detection circuit of an IGBT module, the temperature detection circuit comprising: a driving board and a plurality of adapter boards, the driving board being provided with: a driving power supply and a first detection unit, each adapter board being provided with a second detection unit, the second detection units on the plurality of adapter boards being respectively used to connect to the temperature detection ends of a plurality of IGBT modules, the second detection units on the plurality of adapter boards being cascaded in sequence through a signal harness, and the second detection unit of the last-stage adapter board among the plurality of adapter boards being connected to the first detection unit on the driving board through a signal harness; The first detection unit is also used to connect to a client device, and the driving power supply is used to connect to driving ends of the multiple IGBT modules.

[0008] Optionally, the driving board is further provided with a first connector, and each adapter board is further provided with a second connector and a third connector; The second detection unit on each adapter board is connected to the second connector and the third connector, and the second connector of one adapter board of two adjacent adapter boards is connected to the third connector on the other adapter board through a communication line in a signal harness; The second connector on the last adapter board is connected to the first connector on the driving board through the communication line of the signal harness, and the first connector is connected to the first detection unit.

[0009] Optionally, the first detection unit includes: a first control unit, a receiving interface of the first control unit is connected to the first connector; The driving board is also provided with: a signal isolator, wherein the sending interface of the first control unit is connected to the client device through the signal isolator.

[0010] Optionally, the first detection unit further includes: a power isolator, and the driving power supply is connected to the first connector through the power isolator; The first connector is also connected to the second connector on the last adapter board via a driving line in the signal harness; The second connector on each adapter board is also connected to the third connector via a driving line; the second connector on one adapter board is also connected to the third connector on another adapter board via a driving line in the signal harness; The second connector on each adapter board is also connected to the power supply end of the second detection unit, and the driving output end of the second detection unit is also used to connect to the driving end of the IGBT module corresponding to each adapter board.

[0011] Optionally, the first detection unit further includes: a first configuration unit, and the first configuration unit is connected to an input and output interface of the first control unit.

[0012] Optionally, the second detection unit includes: a second control unit and a sampling unit, the input end of the sampling unit is used to connect to the temperature detection end of an IGBT module, the output end of the sampling unit is connected to the analog-to-digital conversion interface of the second control unit, the receiving interface of the second control unit is connected to the second connector, and the sending interface of the second control unit is connected to the third connector.

[0013] Optionally, the second detection unit also includes: a power supply unit; the input end of the power supply unit is connected to the second connector, the first output end of the power supply unit is connected to the power interface of the second control unit, and the second output end of the power supply unit is the driving output end of the second detection unit, which is used to connect the driving end of the IGBT module corresponding to each adapter board.

[0014] Optionally, the second detection unit further includes: a second configuration unit, and the second configuration unit is connected to an input and output interface of the second control unit.

[0015] In a second aspect, an embodiment of the present application provides a temperature detection method, which is applied to any temperature detection circuit described in the first aspect; the method includes: The second detection unit on any adapter board in the temperature detection circuit obtains temperature sampling data of the IGBT module corresponding to each adapter board; If the second detection unit on any of the adapter boards also receives a temperature data packet transmitted by the second detection unit of the previous adapter board, the second detection unit on any of the adapter boards parses the temperature data packet to obtain at least one temperature data frame; The second detection unit on any adapter board transmits the temperature sampling data and the at least one temperature data frame to the second detection unit on the next-level adapter board or the first detection unit on the driving board in the temperature detection circuit.

[0016] Optionally, the second detection unit on any adapter board transmits the temperature sampling data and the at least one temperature data frame to the second detection unit on the next-level adapter board or the first detection unit on the driver board in the temperature detection circuit, including: After the second detection unit on any adapter board updates the identification information corresponding to the at least one temperature data frame, the updated at least one temperature data frame and the temperature sampling data are packaged and transmitted to the second detection unit on the next-level adapter board or the first detection unit on the driver board in the temperature detection circuit.

[0017] Compared with the prior art, this application has the following beneficial effects: The present application provides a temperature detection circuit and method for an IGBT module, wherein the temperature detection circuit comprises: a driving board and a plurality of adapter boards, wherein the driving board is provided with: a driving power supply and a first detection unit, wherein each adapter board is provided with a second detection unit, wherein the second detection units on the plurality of adapter boards are respectively used to connect the temperature detection ends of the plurality of IGBT modules, wherein the second detection units on the plurality of adapter boards are sequentially cascaded through a signal harness, wherein the second detection unit of the last adapter board in the plurality of adapter boards is connected to the first detection unit on the driving board through a signal harness; the first detection unit is also used to connect a client device, and the driving power supply is used to connect the driving ends of the plurality of IGBT modules. Thus, the temperature detection circuit is applicable to a variety of IGBT module temperature detection structures, is convenient for detecting the temperature of the IGBT module, improves the temperature detection efficiency, and each second detection unit is exactly the same, thereby reducing the maintenance cost of the detection unit, and does not require the addition of an isolated power supply, reduces the connection harness, and reduces the circuit cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic diagram of a temperature detection circuit of an IGBT module provided in an embodiment of the present application; Figure 2 A schematic diagram of another temperature detection circuit of an IGBT module provided in an embodiment of the present application; Figure 3 A schematic diagram of a temperature detection method provided in an embodiment of the present application; Figure 4 A schematic diagram of a configuration unit provided in an embodiment of the present application.

[0020] Icons: 1-driving board, 2-adapter board, 11-driving power supply, 12-first detection unit, 21-second detection unit, 13-first connector, 22-second connector, 23-third connector, 121-first control unit, 14-signal isolator, 15-power isolator, 122-first configuration unit, 211-second control unit, 212-sampling unit, 213-power supply unit, 214-second configuration unit. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0023] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0024] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0025] It should be noted that, in the absence of conflict, the features in the embodiments of the present application may be combined with each other.

[0026] The temperature detection circuit of an IGBT module provided in an embodiment of the present application is explained below through a specific embodiment. Figure 1 A schematic diagram of a temperature detection circuit for an IGBT module provided in an embodiment of the present application.

[0027] like Figure 1 As shown, the temperature detection circuit includes: a driving board 1 and a plurality of adapter boards 2.

[0028] The driving board 1 is provided with: a driving power supply 11 and a first detection unit 12, each adapter board 2 is provided with a second detection unit 21, the second detection units 21 on multiple adapter boards 2 are respectively used to connect the temperature detection ends of multiple IGBT modules, the second detection units 21 on multiple adapter boards 2 are cascaded in sequence through a signal harness, and the second detection unit 21 of the last-stage adapter board 2 among the multiple adapter boards 2 is connected to the first detection unit 12 on the driving board 1 through a signal harness.

[0029] The first detection unit 12 is also used to connect to the client device, and the driving power supply 11 is used to connect to the driving ends of multiple IGBT modules.

[0030] In order to improve the utilization rate of components and reduce costs, the driver board 1 and the multiple adapter boards 2 use the driver boards and adapter boards corresponding to the existing multiple IGBT modules, and add as few new components as possible.

[0031] The second detection unit 21 on each adapter board 2 detects the temperature of the IGBT module corresponding to the adapter board 2. For example, the second detection unit 21 is connected to the NTC of the IGBT module. The connection method in this embodiment can be connected to the NTC in any form, which is applicable to both the IGBT module with basic isolation from the NTC and the IGBT module with the NTC connected to the E pole of the lower tube of the IGBT, thereby improving the applicability of the temperature detection circuit.

[0032] Each second detection unit 21 detects and obtains the temperature sampling data of the IGBT module, and transmits the temperature sampling data to the second detection unit 21 in the next-level adapter board 2. If the current second detection unit 21 also receives the temperature data transmitted by the second detection unit 21 in the previous-level adapter board 2, the temperature data is packaged together with the current temperature sampling data and transmitted to the second detection unit 21 in the next-level adapter board 2. The second detection unit 21 in the last-level adapter board 2 packages the temperature data together with the current temperature sampling data and transmits it to the first detection unit 12 in the driver board 1.

[0033] The first detection unit 12 in the driving board 1 uploads the received temperature data to the client device, so that the client device determines the actual temperatures of the multiple IGBT modules based on the temperature data and performs further control processing.

[0034] Among them, data transmission between the detection units is carried out using a signal wiring harness, and the signal wiring harness is also used to transmit the electric energy of the driving power supply 11 to the first detection unit 12 and multiple second detection units 21. The communication data line and the driving power signal share the wiring harness, which saves the cost of adding new wiring harnesses, insulating sleeves and high-voltage insulating isolation power supplies.

[0035] like Figure 1As shown, multiple adapter boards 2 are arranged from right to left, the rightmost adapter board 2 is the first level, and the leftmost adapter board 2 is the last level. The temperature data is also transmitted from right to left in sequence to the first detection unit 12.

[0036] Therefore, it is suitable for a variety of IGBT module temperature detection structures, is convenient for detecting the temperature of the IGBT module, improves the temperature detection efficiency, each second detection unit is exactly the same, reduces the maintenance cost of the detection unit, does not require a new isolated power supply, reduces the connection harness, and reduces the circuit cost.

[0037] In summary, in this embodiment, the temperature detection circuit includes: a driving board and multiple adapter boards, the driving board is provided with: a driving power supply and a first detection unit, each adapter board is provided with a second detection unit, the second detection units on the multiple adapter boards are respectively used to connect the temperature detection ends of multiple IGBT modules, the second detection units on the multiple adapter boards are sequentially cascaded through signal harnesses, and the second detection unit of the last adapter board in the multiple adapter boards is connected to the first detection unit on the driving board through a signal harness; the first detection unit is also used to connect the client device, and the driving power supply is used to connect the driving ends of multiple IGBT modules. Therefore, it is suitable for a variety of IGBT module temperature detection structures, is convenient for detecting the temperature of the IGBT module, and improves the temperature detection efficiency. Each second detection unit is exactly the same, which reduces the maintenance cost of the detection unit, does not require a new isolated power supply, reduces the connection harness, and reduces the circuit cost.

[0038] In the above Figure 1 On the basis of the corresponding embodiment, the embodiment of the present application further provides another temperature detection circuit of an IGBT module. Figure 2 A schematic diagram of another temperature detection circuit for an IGBT module provided in an embodiment of the present application.

[0039] like Figure 2 As shown, the driving board 1 is further provided with a first connector 13 , and each adapter board 2 is further provided with a second connector 22 and a third connector 23 .

[0040] The second detection unit 21 on each adapter board 2 is connected to the second connector 22 and the third connector 23, and the second connector 22 of one adapter board 2 of two adjacent adapter boards 2 is connected to the third connector 23 on the other adapter board 2 through the communication line in the signal harness.

[0041] The second connector 22 on the last adapter board 2 is connected to the first connector 13 on the driver board 1 through the communication line of the signal harness, and the first connector 13 is connected to the first detection unit 12 .

[0042] It should be noted that the third connector 23 on the last adapter board 2 is not connected to any port.

[0043] In summary, in this embodiment, the driver board is further provided with a first connector, and each adapter board is further provided with a second connector and a third connector; the second detection unit on each adapter board is connected to the second connector and the third connector, and the second connector of one of the two adjacent adapter boards is connected to the third connector on the other adapter board through the communication line in the signal harness; the second connector on the last adapter board is connected to the first connector on the driver board through the communication line of the signal harness, and the first connector is connected to the first detection unit. Thus, by providing the connector, the connection of the signal harness is more standardized, which facilitates the accurate transmission of temperature data.

[0044] Continue to refer to Figure 2 In another embodiment of the present application, the first detection unit 12 includes: a first control unit 121 , and a receiving interface of the first control unit 121 is connected to the first connector 13 .

[0045] The driving board 1 is also provided with a signal isolator 14 , wherein the sending interface of the first control unit 121 is connected to the client device through the signal isolator 14 .

[0046] The first control unit 121 is used to receive the temperature data sent by the second detection unit 21 in the last-stage adapter board 2 , and transmit the temperature data to the client device through the signal isolator 14 .

[0047] For example, the first control unit 121 is a MCU (Micro Controller Unit). The signal isolator 14 is a signal isolation device such as a capacitive coupling or a magnetic coupling, which performs high-voltage insulation isolation on the primary and secondary sides during signal transmission to ensure human-machine safety.

[0048] In summary, in this embodiment, the first detection unit includes: a first control unit, the receiving interface of the first control unit is connected to the first connector; the driving board is also provided with: a signal isolator, wherein the sending interface of the first control unit is connected to the client device through the signal isolator. Thus, isolated transmission of temperature data is achieved.

[0049] Continue to refer to Figure 2 In another embodiment of the present application, the first detection unit 12 further includes: a power isolator 15 , and the driving power supply 11 is connected to the first connector 13 through the power isolator 15 .

[0050] The first connector 13 is also connected to the second connector 22 on the last adapter board 2 through a driving line in the signal harness.

[0051] The second connector 22 on each adapter board 2 is also connected to the third connector 23 via a driving line; the second connector 22 on one adapter board 2 is also connected to the third connector 23 on another adapter board 2 via a driving line in the signal harness.

[0052] The second connector 22 on each adapter board 2 is also connected to the power supply end of the second detection unit 21 , and the drive output end of the second detection unit 21 is also used to connect to the drive end of the IGBT module corresponding to each adapter board 2 .

[0053] For example, the driving power supply 11 is a driving secondary power supply, wherein the primary side is a low voltage side and the secondary side is a high voltage side. The driving power supply 11 supplies power to the first detection unit 12 and the plurality of second detection units 21 through the power isolator 15, and the driving power supply 11 is also used to drive the IGBT module. The driving secondary power supply of the IGBT module is used for power supply, and the signal harness and the driving line are combined into one, thereby reducing the circuit and harness costs.

[0054] In summary, in this embodiment, the first detection unit also includes: a power isolator, the driving power supply is connected to the first connector through the power isolator; the first connector is also connected to the second connector on the last adapter board through the driving line in the signal harness; the second connector on each adapter board is also connected to the third connector through the driving line; the second connector on one adapter board is also connected to the third connector on another adapter board through the driving line in the signal harness; the second connector on each adapter board is also connected to the power supply end of the second detection unit, and the driving output end of the second detection unit is also used to connect the driving end of the IGBT module corresponding to each adapter board. Thus, the circuit cost is reduced.

[0055] Continue to refer to Figure 2 In another embodiment of the present application, the first detection unit 12 further includes: a first configuration unit 122 , and the first configuration unit 122 is connected to an input and output interface of the first control unit 121 .

[0056] For example, the first configuration unit 122 can be a low-level unit, which is a grounded resistor, used to transmit a low-level signal to the first control unit 121 to indicate that the first control unit 121 does not need to perform temperature sampling. The first configuration unit 122 can also be a high-level unit, which is a pull-up resistor, one end of the pull-up resistor is connected to the input and output interface of the first control unit 121, and the other end is connected to the driving power supply, which is used to transmit a high-level signal to the first control unit 121, and the high-level signal indicates that the first control unit 121 needs to perform temperature sampling. That is, whether the first detection unit 12 can perform temperature sampling is determined by the first configuration unit 122. If the first control unit 121 needs to perform temperature sampling, it is connected to the corresponding IGBT module in the same connection method as the second detection unit 21.

[0057] Continue to refer to Figure 2 In another embodiment of the present application, the second detection unit 21 includes: a second control unit 211 and a sampling unit 212 .

[0058] The input end of the sampling unit 212 is used to connect to the temperature detection end of an IGBT module, the output end of the sampling unit 212 is connected to the analog-to-digital conversion interface of the second control unit 211, the receiving interface of the second control unit 211 is connected to the second connector 22, and the sending interface of the second control unit 211 is connected to the third connector 23.

[0059] The sampling unit 212 collects the voltage signal of the temperature detection terminal (NTC) of the IGBT module, and transmits the collected voltage signal to the analog-to-digital conversion interface of the second control unit 211, so that the second control unit 211 obtains the collected temperature data, and the second control unit 211 then sends it through the third connector 23.

[0060] For example, the second control unit 211 is an MCU, and the sampling unit 212 is an NTC sampling circuit. Therefore, only the second control unit 211 and the sampling unit 212 need to be newly provided, and there is no need to provide too many components, thereby reducing the circuit cost.

[0061] In summary, in this embodiment, the second detection unit includes: a second control unit, a sampling unit, the input end of the sampling unit is used to connect to the temperature detection end of an IGBT module, the output end of the sampling unit is connected to the analog-to-digital conversion interface of the second control unit, the receiving interface of the second control unit is connected to the second connector, and the sending interface of the second control unit is connected to the third connector. Thus, the circuit cost is reduced.

[0062] Continue to refer to Figure 2 In another embodiment of the present application, the second detection unit 21 further includes: a power supply unit 213.

[0063] The input end of the power supply unit 213 is connected to the second connector 22, the first output end of the power supply unit 213 is connected to the power interface of the second control unit 211, and the second output end of the power supply unit 213 is the driving output end of the second detection unit 21, which is used to connect the driving end of the IGBT module corresponding to each adapter board 2.

[0064] Among them, the power supply unit 213 is an existing power supply on the adapter board 2, which is used to provide driving electrical signals to the IGBT module, reducing the circuit cost. On the basis of the existing power supply, the power supply unit 213 is used to obtain electrical energy from the second connector 22, supply power to the second control unit 211, and supply power to the adjacent adapter board 2 through the second control unit 211, the third connector 23, and the signal harness, so as to transmit and then realize power supply to all adapter boards 2.

[0065] In summary, in this embodiment, the second detection unit further includes: a power supply unit; the input end of the power supply unit is connected to the second connector, the first output end of the power supply unit is connected to the power interface of the second control unit, and the second output end of the power supply unit is the driving output end of the second detection unit, which is used to connect the driving end of the IGBT module corresponding to each adapter board. Thus, the circuit cost is reduced.

[0066] Continue to refer to Figure 2 In another embodiment of the present application, the second detection unit 21 further includes: a second configuration unit 214 , and the second configuration unit 214 is connected to the input and output interface of the second control unit 211 .

[0067] For example, the second configuration unit 214 is a high-level unit, which is a pull-up resistor. One end of the pull-up resistor is connected to the input and output interface of the second control unit 211, and the other end is connected to the power supply unit 213, which is used to transmit a high-level signal to the second control unit 211. The high-level signal indicates that the second control unit 211 needs to perform temperature sampling.

[0068] In summary, in this embodiment, the second detection unit further includes: a second configuration unit, and the second configuration unit is connected to the input and output interface of the second control unit, thereby reducing the circuit cost.

[0069] The following is an explanation of a temperature detection method provided in an embodiment of the present application through a specific example. Figure 3 A schematic diagram of a temperature detection method provided in an embodiment of the present application.

[0070] like Figure 3 As shown, a temperature detection circuit applied to any of the above embodiments; the method includes: S101. A second detection unit on any adapter board in a temperature detection circuit acquires temperature sampling data of an IGBT module corresponding to each adapter board.

[0071] The second detection unit performs analog-to-digital conversion on the analog voltage signal of the temperature detection end of the IGBT module to obtain temperature sampling data of the IGBT module.

[0072] S102: If the second detection unit on any adapter board also receives a temperature data packet transmitted by the second detection unit of the previous adapter board, the second detection unit on any adapter board parses the temperature data packet to obtain at least one temperature data frame.

[0073] It can be seen from the above embodiment that multiple adapter boards are cascaded from right to left. Therefore, the first adapter board can only send the temperature sampling data collected by itself to the second detection unit on the next-level adapter board, and does not receive the temperature data packet from the previous-level adapter board. In addition to the collected temperature sampling data, other adapter boards can also receive the temperature data packet transmitted by the second detection unit of the previous-level adapter board.

[0074] In order to accurately transmit temperature data, the temperature data packet needs to be parsed to obtain at least one temperature data frame, so as to facilitate the subsequent sorting of the current temperature sampling data and temperature data frames.

[0075] S103: The second detection unit on any adapter board transmits the temperature sampling data and at least one temperature data frame to the second detection unit on the next-level adapter board or the first detection unit on the driver board in the temperature detection circuit.

[0076] In order to accurately transmit the temperature data, the temperature sampling data and at least one temperature data frame are sorted according to the cascade order of the acquired adapter boards, and the sorted temperature sampling data and at least one temperature data frame are continuously transmitted.

[0077] If the current adapter board is not the last adapter board, the sorted temperature sampling data and at least one temperature data frame are transmitted to the second detection unit of the next level. If the current adapter board is the last adapter board, the sorted temperature sampling data and at least one temperature data frame are transmitted to the first detection unit.

[0078] Therefore, it is suitable for a variety of IGBT module temperature detection structures, which is convenient for accurately detecting the temperature of the IGBT module and improves the temperature detection efficiency. The software and hardware parts of each second detection unit are exactly the same, which reduces the maintenance cost of the detection unit, does not require a new isolated power supply, reduces the connection harness, and reduces the circuit cost.

[0079] In summary, in this embodiment, the second detection unit on any adapter board in the temperature detection circuit obtains the temperature sampling data of the IGBT module corresponding to each adapter board; if the second detection unit on any adapter board also receives the temperature data packet transmitted by the second detection unit of the previous adapter board, the second detection unit on any adapter board parses the temperature data packet to obtain at least one temperature data frame; the second detection unit on any adapter board transmits the temperature sampling data and at least one temperature data frame to the second detection unit on the next adapter board or the first detection unit on the driver board in the temperature detection circuit. Therefore, it is suitable for a variety of IGBT module temperature detection structures, which is convenient for accurately and comprehensively detecting the temperature of each IGBT module, and improves the temperature detection efficiency. Each second detection unit is exactly the same, which reduces the maintenance cost of the detection unit, does not require a new isolated power supply, reduces the connection harness, and reduces the circuit cost.

[0080] In the above Figure 3 On the basis of the corresponding embodiments, in another embodiment of the present application, the second detection unit on any adapter board transmits the temperature sampling data and at least one temperature data frame to the second detection unit on the next-level adapter board or the first detection unit on the driver board in the temperature detection circuit, including: After the second detection unit on any adapter board updates the identification information corresponding to at least one temperature data frame, the updated at least one temperature data frame and the temperature sampling data are packaged and transmitted to the second detection unit on the next-level adapter board or the first detection unit on the driver board in the temperature detection circuit.

[0081] For example, each frame of temperature data includes: a frame header, identification information, temperature data and a check byte. The frame header is used to determine the starting position of the data frame. The identification information is used to indicate the identity information of the IGBT module detected by the second detection unit. The temperature data is the temperature of the IGBT module detected by the second detection unit. The check byte is used to check the bit errors during the transmission process. The abnormal data frame is filtered by the transmission protocol including the fixed frame header and the check byte, which is not easy to be falsely reported and has high reliability.

[0082] When the first adapter board collects the temperature sampling data, the temperature sampling data is added to the temperature data frame, and the identification information of the temperature sampling data collected by the first adapter board is set to 1.

[0083] When the second adapter board collects temperature sampling data, the temperature sampling data is added to the received temperature data frame, the identification information of the temperature sampling data collected by the second adapter board is set to 1, and the identification information of the temperature sampling data collected by the first adapter board is modified to 2. It should be noted that each time the identification information is modified, the check byte corresponding to the identification information is synchronously modified.

[0084] When the third adapter board collects temperature sampling data, the temperature sampling data is added to the received temperature data frame, the identification information of the temperature sampling data collected by the third adapter board is set to 1, and the identification information of the temperature sampling data collected by the second adapter board is modified to 2, and the identification information of the temperature sampling data collected by the first adapter board is modified to 3. It should be noted that each time the identification information is modified, the check byte corresponding to the identification information is synchronously modified.

[0085] When the fourth adapter board collects temperature sampling data, the temperature sampling data is added to the received temperature data frame, the identification information of the temperature sampling data collected by the fourth adapter board is set to 1, and the identification information of the temperature sampling data collected by the third adapter board is modified to 3, the identification information of the temperature sampling data collected by the second adapter board is modified to 2, and the identification information of the temperature sampling data collected by the first adapter board is modified to 1. It should be noted that each time the identification information is modified, the check byte corresponding to the identification information is synchronously modified.

[0086] By analogy, each time the identification information is updated, the identification information of the temperature sampling data corresponding to the current adapter board is set to 1, and the identification information of the remaining data frames is increased by 1. Therefore, the data frames in the temperature data received by the first detection unit are finally arranged in the order from left to right of the adapter board, so as to facilitate the determination of the IGBT module corresponding to the temperature data according to the identification information of the data frame and the actual order of physical wiring.

[0087] For example, when the temperature data frame is transmitted, one temperature data frame is transmitted at every preset time interval, and the temperature data frames are sent one by one.

[0088] In summary, in this embodiment, after the second detection unit on any adapter board updates the identification information corresponding to at least one temperature data frame, the updated at least one temperature data frame and the temperature sampling data are packaged and transmitted to the second detection unit on the next-level adapter board or the first detection unit on the driver board in the temperature detection circuit. Thus, it is convenient to determine the IGBT module corresponding to the temperature data according to the identification information of the data frame.

[0089] Furthermore, when the adapter board performs temperature collection and data transmission, it is actually the second control unit in the adapter board that performs temperature collection and data transmission.

[0090] Further, Figure 4 Schematic diagram of a configuration unit provided in an embodiment of the present application. Figure 4 As shown, the configuration unit can be configured as a high level unit or a low level unit.

[0091] It should be noted that each component and the connection method between the components in the present application are prior arts and are not described in detail to avoid confusion.

[0092] The above description is only the preferred embodiment of the present application, and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. The above description is only the preferred embodiment of the present application, and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A temperature detection circuit for an IGBT module, characterized in that: The temperature detection circuit comprises: a driving board and a plurality of adapter boards, wherein the driving board is provided with: a driving power supply and a first detection unit, each adapter board is provided with a second detection unit, the second detection units on the plurality of adapter boards are respectively used to connect to the temperature detection ends of a plurality of IGBT modules, the second detection units on the plurality of adapter boards are sequentially cascaded through a signal harness, and the second detection unit of the last-stage adapter board among the plurality of adapter boards is connected to the first detection unit on the driving board through a signal harness; The first detection unit is also used to connect to a client device, and the driving power supply is used to connect to driving ends of the multiple IGBT modules.

2. The temperature detection circuit according to claim 1, characterized in that: The driving board is also provided with a first connector, and each adapter board is also provided with a second connector and a third connector; The second detection unit on each adapter board is connected to the second connector and the third connector, and the second connector of one adapter board of two adjacent adapter boards is connected to the third connector on the other adapter board through a communication line in a signal harness; The second connector on the last adapter board is connected to the first connector on the driving board through the communication line of the signal harness, and the first connector is connected to the first detection unit.

3. The temperature detection circuit according to claim 2, characterized in that: The first detection unit includes: a first control unit, a receiving interface of the first control unit is connected to the first connector; The driving board is also provided with: a signal isolator, wherein the sending interface of the first control unit is connected to the client device through the signal isolator.

4. The temperature detection circuit according to claim 3, characterized in that: The first detection unit further includes: a power isolator, through which the driving power source is connected to the first connector; The first connector is also connected to the second connector on the last adapter board via a driving line in the signal harness; The second connector on each adapter board is also connected to the third connector via a driving line; the second connector on one adapter board is also connected to the third connector on another adapter board via a driving line in the signal harness; The second connector on each adapter board is also connected to the power supply end of the second detection unit, and the driving output end of the second detection unit is also used to connect to the driving end of the IGBT module corresponding to each adapter board.

5. The temperature detection circuit according to claim 3, characterized in that: The first detection unit further includes: a first configuration unit, and the first configuration unit is connected to an input and output interface of the first control unit.

6. The temperature detection circuit according to claim 2, characterized in that: The second detection unit includes: a second control unit and a sampling unit, wherein the input end of the sampling unit is used to connect to the temperature detection end of an IGBT module, the output end of the sampling unit is connected to the analog-to-digital conversion interface of the second control unit, the receiving interface of the second control unit is connected to the second connector, and the sending interface of the second control unit is connected to the third connector.

7. The temperature detection circuit according to claim 6, characterized in that: The second detection unit also includes: a power supply unit; the input end of the power supply unit is connected to the second connector, the first output end of the power supply unit is connected to the power interface of the second control unit, and the second output end of the power supply unit is the driving output end of the second detection unit, which is used to connect the driving end of the IGBT module corresponding to each adapter board.

8. The temperature detection circuit according to claim 6, characterized in that: The second detection unit further includes: a second configuration unit, and the second configuration unit is connected to the input and output interface of the second control unit.

9. A temperature detection method, characterized in that: The temperature detection circuit according to any one of claims 1 to 8 above; the method comprises: The second detection unit on any adapter board in the temperature detection circuit obtains temperature sampling data of the IGBT module corresponding to each adapter board; If the second detection unit on any of the adapter boards also receives a temperature data packet transmitted by the second detection unit of the previous adapter board, the second detection unit on any of the adapter boards parses the temperature data packet to obtain at least one temperature data frame; The second detection unit on any adapter board transmits the temperature sampling data and the at least one temperature data frame to the second detection unit on the next-level adapter board or the first detection unit on the driving board in the temperature detection circuit.

10. The method according to claim 9, characterized in that The second detection unit on any adapter board transmits the temperature sampling data and the at least one temperature data frame to the second detection unit on the next-level adapter board or the first detection unit on the driver board in the temperature detection circuit, including: After the second detection unit on any adapter board updates the identification information corresponding to the at least one temperature data frame, the updated at least one temperature data frame and the temperature sampling data are packaged and transmitted to the second detection unit on the next-level adapter board or the first detection unit on the driver board in the temperature detection circuit.

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