Automatic chip testing device and automatic chip testing method

Abstract

The invention provides an automatic chip testing device and an automatic chip testing method. The automatic chip testing device comprises a main body, a processor, at least one testing seat, a pressing device and at least one sensing device, the pressing device comprises a pressing rod and at least one protruding part arranged on the pressing rod. The processor receives a test instruction and generates and outputs a test signal according to the test instruction. A chip to be tested is placed on the at least one test seat. The pressing device and the sensing device receive the test signal. The pressing device moves towards the test seat based on the test signal and presses the to-be-tested chip in the test seat through the at least one protruding part. The sensing device judges whether the distance between the sensing device and the to-be-sensed object meets a preset condition based on the test signal. If yes, the processor starts a test program and outputs test data to at least one test seat.

Description

Technical Field

[0001] The present invention relates to a testing device, and in particular to an automatic chip testing device and an automatic chip testing method. Background Art

[0002] In the current field of automated chip testing, a robot usually picks up the chip from a tray and places it in a test socket, then a pressing device applies pressure to the chip to ensure good contact between the chip and the test socket, and finally the test socket executes a test program on the chip.

[0003] In the above process, the test program is generally started by a timer. Specifically, after the chip is placed in the test socket, the timer can instruct the test socket to execute the test program after a fixed delay.

[0004] However, the increase in usage time, wear and aging of components, and changes in the external environment will reduce the accuracy of the timer, causing the test program to be started at an incorrect time point, thereby affecting the test efficiency and accuracy of the chip. Summary of the invention

[0005] In view of this, the present invention provides an automatic chip testing device and an automatic chip testing method, which can effectively improve the testing efficiency and accuracy of the chip.

[0006] An automated chip testing device of the present invention comprises a main body, a processor, at least one test seat, a pressing device and at least one sensing device. At least one test seat, the pressing device and at least one sensing device are located on the main body and coupled to the processor. The pressing device comprises a pressing rod and at least one protrusion arranged on the pressing rod. The chip to be tested is placed on the test seat. The processor receives a test instruction and generates and outputs a test signal according to the test instruction. The pressing device and the sensing device receive the test signal. The pressing device moves toward the test seat based on the test signal and presses the chip to be tested in the test seat through at least one protrusion. The sensing device determines whether the distance between the sensing device and the object to be sensed meets a preset condition based on the test signal. If so, the processor starts the test program and outputs the test data to at least one of the test seats.

[0007] In an embodiment of the present invention, the sensing device is located on a first surface of the main body, wherein the first surface is a surface facing the pressing device.

[0008] In an embodiment of the present invention, the sensing device is located on the pressing device.

[0009] In an embodiment of the present invention, the protrusion further comprises a first protrusion and a second protrusion. The sensing device is located between the first protrusion and the second protrusion. The first protrusion and the second protrusion are higher than the sensing device.

[0010] In an embodiment of the present invention, the sensing device further includes a first sensing device and a second sensing device. The first sensing device is used to transmit a detection signal to the surface of the chip to be tested in the test seat. The second sensing device is used to receive the detection signal reflected from the surface of the chip to be tested. If the second sensing device does not receive the detection signal within a preset range, the second sensing device transmits an alarm signal to the processor. The processor transmits a stop signal to the pressing device based on the alarm signal and outputs an alarm notification.

[0011] In an embodiment of the present invention, after the pressing device moves a preset distance toward the test seat, the sensing device is further used to detect the pressing distance and determine whether the pressing distance is within the preset distance range. If it is not within the preset distance range, the processor outputs a compensation signal to the pressing device, and the pressing device adjusts the pressing distance according to the compensation signal.

[0012] In an embodiment of the present invention, the pressing distance is the distance between the pressing rod and the first surface or the chip to be tested.

[0013] In an embodiment of the present invention, the sensing device further comprises a third sensing device and a fourth sensing device. The third sensing device is used to detect the first distance. The fourth sensing device is used to detect the second distance. The processor is further used to determine whether the first distance and the second distance exceed a preset threshold value according to the first distance and the second distance. If so, the processor transmits a stop signal to the pressing device and outputs an abnormality notification.

[0014] In an embodiment of the present invention, the first distance is the distance between the third sensing device and the first surface and the second distance is the distance between the fourth sensing device and the pressing rod.

[0015] An automated chip testing method of the present invention comprises: a processor receives a test instruction, and generates and outputs a test signal according to the test instruction; a pressing device and a sensing device receive the test signal; the pressing device moves toward a test socket based on the test signal, and presses the chip to be tested in the test socket through at least one protrusion in the pressing device; the sensing device determines whether the distance between the sensing device and the object to be sensed meets a preset condition based on the test signal; if so, the processor starts a test program and outputs test data to the test socket.

[0016] Based on the above, the automatic chip testing device and the automatic chip testing method of the present invention can improve the testing efficiency and the accuracy of the testing, and avoid the damage of the chip to be tested.

[0017] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1is a schematic diagram of an automated chip testing device according to an embodiment of the present invention;

[0019] Figure 2 is a schematic diagram of a test socket, a chip to be tested, a main body, a pressing device and a sensing device according to a first embodiment of the present invention;

[0020] Figure 3 is a schematic diagram of a management test program according to a first embodiment of the present invention;

[0021] Figure 4 is a schematic diagram of a management test program according to a first embodiment of the present invention;

[0022] Figure 5 is a schematic diagram of a management self-detection mechanism according to a first embodiment of the present invention;

[0023] Figure 6 is a schematic diagram of managing over-pressing and under-pressing problems according to a first embodiment of the present invention;

[0024] Figure 7 is a schematic diagram of managing the warping problem according to a first embodiment of the present invention;

[0025] Figure 8 is a schematic diagram of a test socket, a chip to be tested, a main body, a pressing device and a sensing device according to a second embodiment of the present invention;

[0026] Fig. 9 is a schematic diagram of a test socket, a chip to be tested, a main body, a pressing device and a sensing device according to a third embodiment of the present invention;

[0027] Fig.10 is a schematic diagram of a test socket, a chip to be tested, a main body, a pressing device and a sensing device according to a fourth embodiment of the present invention;

[0028] Fig.11 FIG. 4 is a flow chart of an automated chip testing method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0029] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0030] Figure 1 is a schematic diagram of an automated chip testing device according to an embodiment of the present invention. Figure 1. The automated chip testing device 100 includes a processor 110, a pickup device 120, a test socket 130-1 to 130-N, a pressing device 140, and a sensing device 150-1 to 150-M. The processor 110 is coupled to the pickup device 120, the test socket 130-1 to 130-N, the pressing device 140, and the sensing device 150-1 to 150-M. The sensing device 150-1 to 150-M may be, for example, a non-contact sensing device, an infrared sensing device, or a laser sensing device. The number of the test sockets 130-1 to 130-N and the number of the sensing devices 150-1 to 150-M may be designed according to actual needs, and the present invention is not limited thereto. In addition, the number of the test sockets 130 - 1 ˜ 130 -N may be equal to the number of the sensing devices 150 - 1 ˜ 150 -M, or the number of the test sockets 130 - 1 ˜ 130 -N may be different from the number of the sensing devices 150 - 1 ˜ 150 -M, and the present invention is not limited thereto.

[0031] Figure 2 is a schematic diagram of a test socket, a chip to be tested, a main body, a pressing device and a sensing device according to a first embodiment of the present invention; Figure 3 is a schematic diagram of a management test procedure according to a first embodiment of the present invention. Figure 2 and Figure 3 . In this embodiment, the number of test sockets 130-1 to 130-5 is 5, and the number of sensing devices 150-1 to 150-6 is 6. The pressing device 140 includes a pressing rod 141 and protrusions 1421 to 1425 arranged on the pressing rod 141. The test sockets 130-1 to 130-5, the pressing device 140 and the sensing devices 150-1 to 150-6 are located on the main body MB. The main body MB includes a machine body B and a pressing rod 141 of the pressing device 140. In this embodiment, the test sockets 130-1 to 130-5 are arranged on the machine body B at intervals from each other. The sensing devices 150-1 to 150-6 are located on the pressing device 140. For example, Figure 2 The sensing devices 150-2 to 150-5 are respectively disposed between the protrusions 1421 to 1425, and the sensing devices 150-1 to 150-6 are respectively disposed on both sides of the pressing rod 141. In this embodiment, the height of the sensing devices 150-1 to 150-6 needs to be lower than the height of the protrusions 1421 to 1425 and the test sockets 130-1 to 130-5 to avoid affecting the pressing device 140 in pressing the chips C1 to C5 to be tested.

[0032] When a test program is to be executed on the chip to be tested, the tester may, for example, transmit a test instruction to the automated chip testing device 100 via a host computer (not shown). The processor 110 may receive the test instruction, generate a test signal according to the test instruction, and output the test signal to the pickup device 120, the pressing device 140, the sensing devices 150-1 to 150-6 and / or the test sockets 130-1 to 130-5.

[0033] The picking device 120 can place the chips C1 to C5 to be tested on the test seats 130-1 to 130-5 respectively based on the test signal. For example, there is a material preparation table (not shown) next to the automatic chip testing device 100. The material preparation table is used to place a material tray (not shown), and the material tray is used to place the chips C1 to C5 to be tested.

[0034] Next, the pressing device 140 can move toward the test sockets 130-1 to 130-5 based on the test signal, and press the chips C1 to C5 in the test sockets 130-1 to 130-5 through the protrusions 1421 to 1425. Figure 2 As shown, the pressing device 140 can move along a moving direction (eg, vertically downward) toward the test sockets 130 - 1 ˜ 130 - 5 .

[0035] In order to effectively improve the test efficiency and accuracy of the chip, the sensing devices 150-1 to 150-6 can determine whether the distance between the sensing devices 150-1 to 150-6 and the object to be sensed meets the preset conditions based on the test signal. In the present embodiment, the sensing devices 150-1 to 150-6 can, for example, continuously detect the distance between the sensing devices 150-1 to 150-6 and the chips to be tested C1 to C5 (the objects to be sensed). In other words, the sensing devices 150-1 to 150-6 can continuously detect the descent of the pressing device 140, that is, the actual condition of the pressing device 140 pressing the chips to be tested C1 to C5. In another embodiment, the sensing devices 150-1 to 150-6 can, for example, continuously detect the distance between the sensing devices 150-1 to 150-6 and the pressing rod 141 (the object to be sensed). In another embodiment, the sensing devices 150 - 1 ˜ 150 - 6 may, for example, continuously detect the distance between the sensing devices 150 - 1 ˜ 150 - 6 and the machine body B (the object to be sensed), and the present invention is not limited thereto.

[0036] When the distance detected by the sensing devices 150-1 to 150-6 is not as Figure 3When the distance D1 is shown, the sensing devices 150-1 to 150-6 can continue to detect the distance between them and the machine body B until the detected distance is the distance D1. Thereafter, when the distance detected by the sensing devices 150-1 to 150-6 is the distance D1, the sensing devices 150-1 to 150-6 can determine that the distance between the sensing devices 150-1 to 150-6 and the object to be sensed (for example, the machine body B) meets the preset condition. In short, Figure 3 The distance D1 in FIG. 1 is the distance between the sensing devices 150 - 1 to 150 - 6 and the machine body B. Therefore, after the pressing device 140 starts to move toward the test sockets 130 - 1 to 130 - 5 , the sensing devices 150 - 1 to 150 - 6 can continuously detect the distance between themselves and the machine body B until the distance is the distance D1 (i.e., the preset condition is satisfied).

[0037] Accordingly, the sensing devices 150-1 to 150-6 can instruct the processor 110 to start the test program and output the test data to the test sockets 130-1 to 130-5. The test sockets 130-1 to 130-5 can respectively execute the test program on the chips to be tested C1 to C5 according to the test data. It is worth mentioning that in conventional practices, after the processor 110 receives the test instruction, the processor 110 starts the test program after a fixed delay. However, problems such as increased usage time, wear and aging of components will cause the test program to be started at an incorrect time point, thereby affecting the test efficiency and accuracy of the chip. The automated chip testing device 100 of the present invention can detect the actual situation of the pressing device 140 pressing the chips to be tested C1 to C5 through the sensing devices 150-1 to 150-6, and instruct the processor 110 to start the test program at the most appropriate time (that is, when the preset conditions are met), which can effectively improve the test efficiency and accuracy.

[0038] It should be noted that if the sensing devices 150-1 to 150-6 do not detect that the distance between them and the machine host B is D1 within the preset time, the sensing devices 150-1 to 150-6 may output an alarm signal to the processor 110, and the processor 110 may output an alarm notification based on the alarm signal to instruct the tester to perform maintenance on the automated chip testing device 100. Specifically, if the sensing devices 150-1 to 150-6 do not detect that the distance between them and the machine host B is D1 within the preset time, it indicates that the lowering condition of the pressing device 140 is incorrect and / or the detection condition of the sensing devices 150-1 to 150-6 is incorrect. Therefore, the processor 110 may instruct the pressing device 140 to stop moving so as not to start the test program temporarily, and output an alarm notification to instruct the tester to perform maintenance on the automated chip testing device 100.

[0039] In one embodiment, only one sensing device (eg, the sensing device 150 - 2 ) may be used to detect the actual condition of the pressing device 140 pressing the chips C1 ˜ C5 to be tested. Figure 4 is a schematic diagram of a management test procedure according to a first embodiment of the present invention. Figure 4 . In the present embodiment, only one sensing device 150-2 is provided to detect the timing of starting the test program. Specifically, the sensing device 150-2 receives a test signal from the processor 110, and determines whether the distance between the sensing device 150-2 and the object to be sensed satisfies a preset condition based on the test signal. For example, the sensing device 150-2 may continuously detect the distance between the sensing device 150-2 and the object to be sensed based on the test signal until the detected distance is distance D1 (that is, the preset condition is satisfied). If the detected distance is distance D1, the sensing device 150-1 may instruct the processor 110 to start the test program, and output the test data to the test sockets 130-1 to 130-5, so that the processor 110 may start the test program at the most appropriate time, which may effectively improve the test efficiency and accuracy.

[0040] It is worth mentioning that, since the automated chip testing device 100 of the present invention indicates to start the test program through the sensing devices 150-1 to 150-6. Therefore, how to ensure the accuracy of the sensing devices 150-1 to 150-6 is a very important issue. In this regard, the present invention provides a self-detection mechanism for the sensing devices 150-1 to 150-6. Specifically, before detecting the distance between the sensing device and the object to be sensed, or any multiple of the sensing devices 150-1 to 150-6, the first distance and the second distance can be detected respectively, and the measured first distance and the second distance can be transmitted to the processor 110 respectively. Accordingly, the processor 110 can determine whether the first distance and the second distance exceed the preset threshold value according to the first distance and the second distance. If the preset threshold value is not exceeded, the processor 110 can determine that the sensing devices 150-1 to 150-6 can continue to detect the distance between them and the object to be sensed. On the contrary, if the preset threshold value is exceeded, the processor 110 can transmit a stop signal to the pressing device 140 to instruct the pressing device 140 to stop moving. In addition, the processor 110 can also output an abnormality notification to instruct the tester to perform maintenance on the sensing devices 150-1 to 150-6. Accordingly, the self-detection mechanism provided by the present invention can ensure the accuracy of the sensing devices 150-1 to 150-6, thereby effectively improving the accuracy of the test.

[0041] For details, please refer to Figure 5 , Figure 5is a schematic diagram of a management self-detection mechanism according to the first embodiment of the present invention. In this embodiment, before detecting the distance between the object to be sensed, the sensing device 150-1 (also referred to as the third sensing device) and the sensing device 150-6 (also referred to as the fourth sensing device) can detect the first distance and the second distance respectively. It should be noted that the sensing device 150-1 and the sensing device 150-6 are both arranged on the pressing device 140 (that is, on the pressing rod 141). Therefore, the first distance can be, for example, the distance between the sensing device 150-1 and the machine body B, and the second distance can be, for example, the distance between the sensing device 150-6 and the machine body B. The sensing device 150-1 and the sensing device 150-6 can transmit the measured first distance and second distance to the processor 110 respectively. The processor 110 can determine whether the first distance and the second distance exceed the preset threshold value. For example, the processor 110 can calculate the error value between the first distance and the second distance, and determine whether the error value exceeds the preset threshold value. If the preset threshold is not exceeded, the processor 110 can determine that the sensing devices 150-1 to 150-6 can continue to detect the distance between them and the object to be sensed. On the contrary, if the preset threshold is exceeded, the processor 110 can output a stop signal to instruct the pressing device 140 to stop moving, and output an abnormality notification to instruct the tester to perform maintenance, thereby improving the accuracy of the test.

[0042] It is worth mentioning that Figure 5 The sensing device 150-1 and the sensing device 150-6 are disposed on the same component (i.e., the pressing device 140). In another embodiment, the third sensing device and the fourth sensing device may also be disposed on different components. For example, the third sensing device is disposed on the pressing device 140, and the fourth sensing device is disposed on the machine body B. The embodiment in which the third sensing device and the fourth sensing device may also be disposed on different components will be described later.

[0043] On the other hand, as the use time increases, the pressing device 140 is worn, which affects its movement accuracy. That is, during the movement of the pressing device 140 toward the test sockets 130-1 to 130-5, the moving distance of the pressing device 140 may be wrong, which may cause the pressing device 140 to over-press the chips C1 to C5 or under-press the chips C1 to C5.

[0044] In this regard, the embodiments of the present invention provide an effective improvement solution. Figure 6 is a schematic diagram showing the management of over-pressing and under-pressing problems according to the first embodiment of the present invention. Figure 6 .

[0045] In the present embodiment, after the pressing device 140 moves a distance D2 (also referred to as a preset distance) toward the test sockets 130-1 to 130-5 based on the test signal, the sensing device 150-6 (or any one of the sensing devices 150-1 to 150-6) can detect the pressing distance and determine whether the pressing distance is within the preset distance range. Assuming that under ideal conditions, after the pressing device 140 moves a distance D2 toward the test sockets 130-1 to 130-5, the distance between the lower surface of the pressing rod 141 and the chips to be tested C1 to C5 should be a distance D3. In the present embodiment, after the pressing device 140 moves a preset distance D2 toward the test sockets 130-1 to 130-5, the pressing device 140 can pause moving. Thereafter, the sensing device 150-6 can detect whether the distance between the lower surface of the pressing rod 141 and the chip to be tested C5 (i.e., the pressing distance) is within the preset range. The preset range is associated with the distance D3. For example, the preset range may be within ±0.1 cm of the distance D3. In an exemplary embodiment, the pressing distance may also be the distance between the pressing rod 141 and a surface (also referred to as the first surface) on the body MB facing the pressing device 140.

[0046] If the pressing distance is within the preset range, the pressing device 140 can continue to move toward the test sockets 130-1 to 130-5 to press the chips C1 to C5 to be tested. Specifically, if the pressing distance is within the preset range, it means that there is no problem with the pressing accuracy of the pressing device 140, and the pressing device 140 will not cause over-pressing or under-pressing of the chips C1 to C5 to be tested in the future. The pressing device 140 can continue to move closer to the test sockets 130-1 to 130-5 to press the chips C1 to C5 to be tested.

[0047] In contrast, if the pressing distance is not within the preset range, the sensing device 150-6 may instruct the processor 110 to output a compensation signal to the pressing device 140, and the pressing device 140 may adjust the pressing distance according to the compensation signal. Specifically, if the pressing distance is not within the preset range, it means that there is a problem with the movement accuracy of the pressing device 140, which may subsequently cause over-pressing or under-pressing of the chips C1 to C5 to be tested. Accordingly, if the pressing distance is not within the preset range, the sensing device 150-6 may, for example, transmit the error value between the pressing distance and the distance D3 to the processor 110, so that the processor 110 may output a compensation signal to the pressing device 140 according to the error value to adjust the movement accuracy of the pressing device 140 to avoid over-pressing or under-pressing of the chips C1 to C5 to be tested.

[0048] It should be noted that the reason why the sensing device 150-6 needs to wait until the pressing device 140 moves the distance D2 toward the test sockets 130-1 to 130-5 before detecting the pressing distance is because before the pressing device 140 moves toward the test sockets 130-1 to 130-5 based on the test signal, the pressing device 140 is located at the top of the automated chip testing device 100 and cannot move upward. Therefore, the pressing device 140 needs to move the distance D2 toward the test sockets 130-1 to 130-5 before performing the above-mentioned operation of adjusting the movement accuracy.

[0049] It should be noted that the above uses one sensing device 150-6 to detect the pressing distance. If the ability to prevent over-pressing or under-pressing of the chips C1 to C5 to be tested is to be improved, multiple sensing devices (for example, pressing devices 150-2 to 150-6) can also be used to detect the distance between the lower surface of the pressing rod 141 and the chips C1 to C5 to be tested (that is, multiple pressing distances). Accordingly, when most of the pressing distances (or any pressing distance) among the multiple pressing distances are not within the preset range, the processor 110 can output a compensation signal to the pressing device 140 to avoid over-pressing or under-pressing of the chips C1 to C5 to be tested.

[0050] According to the above, the automatic chip testing device 100 of the present invention can effectively avoid the over-pressing and under-pressing problems of the chips C1 to C5 to be tested by moving the pressing device 140 by a fixed distance and detecting the pressing distance through the sensing devices 150-1 to 150-6 to determine whether there is an error in the moving distance of the pressing device 140, and further instruct the processor 110 to dynamically compensate for the error. It is worth mentioning that the chips C1 to C5 to be tested may have different thicknesses, which may lead to the over-pressing and under-pressing problems of the chips C1 to C5 to be tested. The solution provided by the above embodiment can also respond to this situation, avoid damage to the chips C1 to C5 to be tested, and effectively improve the stability and reliability of the test.

[0051] In addition to the incorrect start time of the test program, poor sensing accuracy, and over-pressing and under-pressing problems mentioned above, the chip C1-C5 to be tested often warps during the test process. Specifically, during the process of the pickup device 120 placing the chip C1-C5 to be tested on the test sockets 130-1-130-5, the chip C1-C5 to be tested may warp due to wear of the components of the pickup device 120, foreign matter in the test socket, or unevenness of the chip C1-C5 to be tested. If the chip C1-C5 to be tested is in a warped state, the protrusions 1421-1425 may damage the chip after pressing.

[0052] Figure 7 is a schematic diagram of managing the warping problem according to the first embodiment of the present invention. Figure 7 In this embodiment, after the pick-up device 120 places the chips C1 to C5 to be tested on the test sockets 130 - 1 to 130 - 5 , the sensing devices 150 - 1 to 150 - 6 can be used to detect whether the chips C1 to be tested have a warping problem.

[0053] In this embodiment, if it is to be detected whether the chip C1 to be tested has a warping problem, the sensing device 150-2 (also referred to as the first sensing device) with a transmitting function can transmit a detection signal (for example, an optical signal) to the surface of the chip C1 to be tested in the test socket 130-1. Thereafter, the sensing device 150-1 (also referred to as the second sensing device) with a receiving function can receive the detection signal reflected from the surface of the chip C1 to be tested. Specifically, the sensing device 150-1 determines whether it receives the detection signal within a preset range. If so, it indicates that the chip C1 to be tested does not have a warping problem. Conversely, if not, it indicates that the chip C1 to be tested has a warping problem, and the sensing device 150-1 can transmit an alarm signal to the processor 110. The processor 110 can transmit a stop signal to the pressing device 140 based on the alarm signal to stop the operation of the pressing device 140 and temporarily not start the test program to avoid damaging the chip C1 to be tested. In addition, the processor 110 can also output an alarm notification based on the alarm signal to instruct the tester to solve the warping problem.

[0054] In another embodiment, if it is desired to detect whether the chips C1 to C5 to be tested have a warpage problem, the sensing devices 150-2 to 150-6 may respectively transmit detection signals (e.g., optical signals) to the surfaces of the chips C1 to C5 to be tested in the test sockets 130-1 to 130-5. Next, the sensing devices 150-1 to 150-5 may respectively receive the detection signals reflected from the surfaces of the chips C1 to C5 to be tested.

[0055] In this embodiment, the sensing devices 150-1 to 150-5 can respectively determine whether they have received the detection signal within the preset range. Figure 5 As shown, the chip C1 to be tested and the chips C3 to C5 to be tested are placed flat on the test socket 130-1 and the test sockets 130-3 to 130-5, respectively. Therefore, the detection signals reflected from the surfaces of the chip C1 to be tested and the chips C3 to C5 to be tested are accurately reflected to the preset ranges of the sensing device 150-1 and the sensing device 150-3 to 150-5, respectively.

[0056] In contrast, Figure 5The chip C2 to be tested is not stably placed on the test seat 130-2. Therefore, the detection signal reflected from the surface of the chip C2 to be tested will be offset, so that the sensing device 150-2 cannot receive the detection signal reflected from the surface of the chip C2 to be tested within the preset range. Since the sensing device 150-2 does not receive the detection signal reflected from the surface of the chip C2 to be tested within the preset range, the sensing device 150-2 can transmit an alarm signal to the processor 110. Accordingly, the processor 110 can transmit a stop signal to the pressing device 140 based on the alarm signal to stop the operation of the pressing device 140 and temporarily not start the test program to avoid damaging the chip C2 to be tested. In addition, the processor 110 can also output an alarm notification based on the alarm signal to instruct the tester to solve the warping problem of the chip C2 to be tested.

[0057] In addition, after the sensing device 150-1 and the sensing devices 150-3 to 150-5 receive the detection signals reflected from the surfaces of the chip to be tested C1 and the chip to be tested C3 to C5 respectively within the preset range, the sensing device 150-1 and the sensing devices 150-3 to 150-5 can further determine whether the intensity of the received detection signal is within the preset intensity. In detail, if the intensity of the received detection signal is within the preset intensity, it means that the chip to be tested that reflects this detection signal has been placed flat on the test seat. In contrast, if the intensity of the received detection signal is not within the preset intensity (the different directions of chip warping cause the intensity of the received detection signal to be too high or too low), it means that the detection signal has been offset (that is, the chip to be tested that reflects this detection signal has a warping problem), so that part of the detection signal falls outside the preset range. Accordingly, the sensing device that receives a detection signal with an intensity not greater than a preset intensity can transmit an alarm signal to the processor 110, so that the processor 110 can output the above-mentioned stop signal and alarm notification based on the alarm signal to avoid the adverse effects caused by the warping problem, and based on the intensity of the detection signal within the preset range, further determine whether the chip to be tested is warped, thereby improving the accuracy of the detection and avoiding the long-term use of the test sockets C1~C5, which cannot fully restrict the chip to be tested, resulting in the chip to be tested being within the preset range but in a warped state.

[0058] It is understandable that if the chip to be tested is in a flat state, the strength of the detection signal emitted by the sensing devices 150-3 to 150-5 and the strength of the detection signal received are consistent. If the chip to be tested is in a warped state, the detection signal received by 150-3 to 150-5 may be too high or too low during the receiving process. In the actual process, the processor 110 takes a long time to judge whether the chip to be tested is flat according to the strength of the detection signal. Therefore, it is preferred to judge whether the chip to be tested is flat according to the preset range.

[0059] It should be noted that, in the present embodiment, the sensing devices 150-2 to 150-5 may be, for example, non-contact sensing devices (or, optical sensing devices) having both a transmitting function and a receiving function. That is to say, the sensing devices 150-2 to 150-5 may be the first sensing device and the second sensing device at the same time. The method of using a sensing device having both a transmitting function and a receiving function to detect the warping problem of the chips C1 to C5 to be tested can effectively save the setting cost and space. In addition, in the present embodiment, the sensing device 150-1 arranged on the side of the pressing rod 141 may be, for example, a non-contact sensing device (or, optical sensing device) having only a receiving function, and the sensing device 150-6 arranged on the other side of the pressing rod 141 may be, for example, a non-contact sensing device (or, optical sensing device) having only a transmitting function. Alternatively, the sensing devices 150-1 and 150-6 may also be, for example, non-contact sensing devices (or, optical sensing devices) having both a transmitting function and a receiving function.

[0060] Figure 8 Schematic diagram of a test socket, a chip to be tested, a main body, a pressing device and a sensing device according to a second embodiment of the present invention. Figure 8 .

[0061] In this embodiment, the number of the test sockets 230-1 to 230-4 is 4, and the number of the sensing devices 250-1 to 250-4 is 4. The pressing device 240 includes a pressing rod 241 and protrusions 2421 to 2428 disposed on the pressing rod 241. The main body MB includes a machine body B and a pressing rod 241. The test sockets 230-1 to 230-4, the pressing device 240 and the sensing devices 250-1 to 250-4 are located on the main body MB.

[0062] The test sockets 230-1 to 230-4 are disposed on the machine body B at intervals. The sensing devices 250-1 to 250-4 are located on the pressing device 240 and are disposed corresponding to the test sockets 230-1 to 230-4. For example, Figure 6 The sensing device 250-1 is disposed between the protrusion 2421 and the protrusion 2422. The sensing device 250-2 is disposed between the protrusion 2423 and the protrusion 2424. The sensing device 250-3 is disposed between the protrusion 2425 and the protrusion 2426. The sensing device 250-4 is disposed between the protrusion 2427 and the protrusion 2428. Since the sensing devices 250-1 to 250-4 are disposed between the protrusions 2421 to 2428. In this embodiment, the height of the sensing devices 250-1 to 250-4 needs to be lower than the height of the protrusions 2421 to 2428 to avoid affecting the pressing device 240 pressing the chips C1 to C4 to be tested.

[0063] In this embodiment, the pressing device 240 can move toward the test sockets 230-1 to 230-4 based on the test signal from the processor 110 to press the chips C1 to C4 to be tested in the test sockets 230-1 to 230-4 through the protrusions 2421 to 2428, and the sensing devices 250-1 to 250-4 can also respectively detect whether the distance between them and the object to be sensed (for example, the chips to be tested C1 to C4) meets the preset condition (for example, reaches a preset distance) based on the test signal from the processor 110. When the distance between the sensing devices 250-1 to 250-4 and the chips to be tested C1 to C4 reaches the preset distance, the sensing devices 250-1 to 250-4 can instruct the processor 110 to start the test program. Accordingly, the test efficiency and accuracy of the chip can be effectively improved.

[0064] It is worth mentioning that the second embodiment of the present invention can also adopt the above-mentioned self-detection mechanism, management of over-lamination and under-lamination problems, and management of warping problems to optimize the overall testing process.

[0065] Specifically, after the pickup device 120 places the chips C1 to C4 to be tested on the test sockets 230-1 to 230-4, the sensing devices 250-1 to 250-4 can be used to detect whether the chips C1 to C4 to be tested in the corresponding test sockets 230-1 to 230-4 have warping problems. In this embodiment, the sensing devices 250-1 to 250-4 can be, for example, non-contact sensing devices (or optical sensing devices) having both transmitting and receiving functions.

[0066] The following will describe the implementation details of managing the warping problem of the chip under test using the second embodiment of the present invention. First, the sensing devices 250-1 to 250-4 can respectively transmit detection signals (for example, optical signals) to the surfaces of the chips under test C1 to C4 in the test sockets 230-1 to 230-4. Next, the sensing devices 250-1 to 250-4 can respectively receive the detection signals reflected from the surfaces of the chips under test C1 to C4. Specifically, Figure 6 As shown, the chip C4 to be tested has a warping problem. The detection signal reflected from the surface of the chip C4 to be tested will be offset, so that the sensing device 250-4 cannot receive the detection signal reflected from the surface of the chip C4 to be tested within a preset range. Accordingly, the sensing device 250-4 can transmit an alarm signal to the processor 110. The processor 110 can transmit a stop signal to the pressing device 240 based on the alarm signal to stop the operation of the pressing device 240 to avoid damaging the chip C4 to be tested. In addition, the processor 110 can also issue an alarm notification based on the alarm signal to instruct the tester to solve the warping problem of the chip C4 to be tested.

[0067] After the test personnel solve the warping problem of the chip C4 to be tested, they can further perform the above-mentioned self-detection mechanism and / or management of over-pressing and under-pressing problems, thereby effectively improving the stability and accuracy of the test.

[0068] In addition, the implementation details of the second embodiment of the present invention to perform a self-detection mechanism and / or management of over-pressing and under-pressing problems can be, for example, referred to or inferred from the first embodiment, and are therefore not repeated here.

[0069] Fig. 9 Schematic diagram of a test socket, a chip to be tested, a main body, a pressing device and a sensing device according to a third embodiment of the present invention. Fig. 9 .

[0070] In this embodiment, the number of the test sockets 330-1 to 330-4 is 4, and the number of the sensing devices 350-1 to 350-5 is 5. The pressing device 340 includes a pressing rod 341 and protrusions 3421 to 3424 disposed on the pressing rod 341. The main body MB includes a machine body B and a pressing rod 341. The test sockets 330-1 to 330-4, the pressing device 340 and the sensing devices 350-1 to 350-5 are located on the main body MB.

[0071] The test sockets 330-1 to 330-4 are arranged on the machine body B at intervals. The sensing devices 350-1 to 350-5 are located on a surface (also referred to as the first surface) of the body MB facing the pressing device 340. In this embodiment, the sensing devices 350-1 to 350-5 and the test sockets 330-1 to 330-4 are arranged alternately on the machine body B. For example, Figure 7 The sensing devices 350-2 to 350-4 are respectively arranged between the test sockets 330-1 to 330-4, the sensing device 350-1 is arranged on the left side of the test socket 340-1, and the sensing device 350-5 is arranged on the right side of the test socket 330-4. In this embodiment, the height of the test sockets 330-1 to 330-4 needs to be higher than the height of the sensing devices 350-1 to 350-5 to avoid affecting the pressing device 440 pressing the chips C1 to C4 to be tested.

[0072] In this embodiment, the pressing device 340 can move toward the test sockets 330-1 to 330-4 based on the test signal from the processor 110, so as to press the chips C1 to C4 to be tested in the test sockets 330-1 to 330-4 respectively through the protrusions 3421 to 3421, and the sensing devices 350-1 to 350-5 can determine whether the distance between them and the object to be sensed (for example, the pressing rod 341) is the distance D4 based on the test signal. When the distance between the sensing devices 350-1 to 350-5 and the pressing rod 341 is the distance D4, the sensing devices 350-1 to 250-4 can instruct the processor 110 to start the test program. Accordingly, the test efficiency and accuracy of the chip can be effectively improved.

[0073] It is worth mentioning that the third embodiment of the present invention can also use the above-mentioned self-detection mechanism and / or management for over-pressing and under-pressing problems to optimize the overall test process. The implementation details of the self-detection mechanism and / or management for over-pressing and under-pressing problems using the third embodiment of the present invention can be, for example, referred to the first embodiment or inferred from the first embodiment, so it will not be repeated here.

[0074] Fig.10 Schematic diagram of a test socket, a chip to be tested, a main body, a pressing device and a sensing device according to a fourth embodiment of the present invention. Fig.10 .

[0075] In the present embodiment, the number of the test sockets 430-1 to 430-4 is 4, and the number of the sensing devices 450-1 to 450-2 is 2. The pressing device 440 includes a pressing rod 441 and protrusions 4421 to 4424 disposed on the pressing rod 441. The main body MB includes a machine body B and a pressing rod 441. The test sockets 430-1 to 430-4 are disposed on the machine body B at intervals from each other. In the present embodiment, the sensing device 450-1 is disposed between the test socket 430-2 and the test socket 430-3, and the sensing device 450-2 is disposed between the protrusion 4421 and the protrusion 4422. The sensing device 450-1 is located on a surface (also referred to as the first surface) on the main body MB facing the pressing device 440. In this embodiment, the heights of the protrusions 4421 ˜ 4424 and the test sockets 430 - 1 ˜ 430 - 4 need to be higher than the heights of the sensing devices 450 - 1 and 450 - 2 to avoid affecting the pressing of the chips C1 ˜ C4 by the pressing device 440 .

[0076] In this embodiment, the pressing device 440 can move toward the test sockets 430-1 to 430-4 based on the test signal from the processor 110, so as to press the chips C1 to C4 to be tested in the test sockets 430-1 to 430-4 respectively through the protrusions 4421 to 4424, and the sensing device 450-1 and / or the sensing device 450-2 can determine whether the distance between it and the object to be sensed meets the preset condition based on the test signal. For example, the sensing device 450-1 can determine whether the distance between it and the pressing rod 431 reaches a preset distance based on the test signal, and if so, the sensing device 450-1 can determine that the preset condition is met. For example, the sensing device 450-2 can determine whether the distance between it and the machine body B (or the test sockets 430-1, 430-2, or the chips to be tested C1, C2) reaches a preset distance based on the test signal, and if so, the sensing device 450-2 can determine that the preset condition is met. When the preset condition is met, the sensing device 450 - 1 (or the sensing device 450 - 2 ) may instruct the processor 110 to start the test program, so that the test program is executed at the most appropriate time, which can effectively improve the test efficiency and accuracy of the chip.

[0077] It is worth mentioning that the fourth embodiment of the present invention can also adopt the above-mentioned self-detection mechanism and the management of over-pressing and under-pressing problems to optimize the overall testing process.

[0078] Regarding the implementation details of the management of over-pressing and under-pressing problems using the fourth embodiment of the present invention, for example, reference can be made to the first embodiment and the third embodiment described above or by analogy with the first embodiment and the third embodiment described above, so it will not be repeated here. The implementation details of the self-detection mechanism using the fourth embodiment of the present invention will be described below.

[0079] In this embodiment, before the pressing device 440 moves toward the test seat 430-1~430-4 based on the detection signal, the sensing device 450-2 can be used to detect the distance between it and the first surface (also called the first distance), and the sensing device 450-1 can be used to detect the distance between it and the pressing rod 441 (also called the second distance).

[0080] The sensing device 450-1 and the sensing device 450-2 can transmit the first distance and the second distance to the processor 110 respectively. Accordingly, the processor 110 can determine whether the preset threshold is exceeded according to the first distance and the second distance. For example, the processor 110 can calculate the error value between the first distance and the second distance, and determine whether the error value exceeds the preset threshold. If it does not exceed the preset threshold, the pressing device 440 can continue to move toward the test seat 430-1~430-4 to press the chips C1~C4 to be tested, and the sensing devices 450-1 and 450-2 can continue to detect the distance between them and the object to be sensed. Relatively speaking, if it exceeds the preset threshold, the processor 110 can transmit a stop signal to the pressing device 440 to instruct the pressing device 440 to stop moving. In addition, the processor 110 can also issue an abnormal notification to instruct the test personnel to perform maintenance on the sensing devices 450-1 and 450-2, which can ensure the accuracy of the sensing devices 450-1 and 450-2, thereby effectively improving the accuracy of the test.

[0081] Fig.11 is a flow chart of an automated chip testing method according to an embodiment of the present invention. Fig.11 In step S1101, the processor receives a test instruction, and generates and outputs a test signal according to the test instruction. In step S1102, the test signal is received by the pressing device and the sensing device. In step S1103, the pressing device moves toward the test socket based on the test signal, and presses the chip to be tested in the test socket through at least one protrusion in the pressing device. In step S1104, the sensing device determines whether the distance between the sensing device and the object to be sensed meets the preset condition based on the test signal. In step S1105, if so, the processor starts the test program and outputs the test data to the test socket.

[0082] However, Fig.11 The steps in the above are described in detail, so I will not repeat them here. It is worth noting that Fig.11 Each step in the above process can be implemented as multiple program codes or circuits, and the present invention is not limited thereto. Fig.11 The method can be used in combination with the above embodiments or can be used alone, and the present invention is not limited thereto.

[0083] In summary, the automated chip testing device and the automated chip testing method provided by the embodiments of the present invention can improve the testing efficiency and the accuracy of the testing, and avoid damage to the chip to be tested.

[0084] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An automated chip testing device, characterized in that: include: main body; A processor, configured to receive a test instruction, and generate and output a test signal according to the test instruction; At least one test socket, located on the main body and coupled to the processor, for placing the chip to be tested; a pressing device, located on the main body and coupled to the processor, the pressing device comprising a pressing rod and at least one protrusion disposed on the pressing rod, wherein the pressing device is used to receive the test signal, and based on the test signal, the pressing device moves toward the test seat and presses the chip to be tested in the test seat through at least one protrusion; and at least one sensing device, located on the main body and coupled to the processor, wherein the sensing device is used to receive the test signal, and based on the test signal, determine whether the distance between the sensing device and the object to be sensed meets a preset condition, If so, the processor starts a test program and outputs test data to at least one of the test sockets. 2 . The automated chip testing device according to claim 1 , wherein the sensing device is located on a first surface of the main body, wherein the first surface is a surface facing the pressing device. 3 . The automatic chip testing device according to claim 1 , wherein the sensing device is located on the pressing device. 4 . The automatic chip testing device according to claim 3 , wherein the protrusion further comprises a first protrusion and a second protrusion, the sensing device is located between the first protrusion and the second protrusion, and the first protrusion and the second protrusion are higher than the sensing device.

5. The automated chip testing device according to claim 3, wherein the sensing device further comprises a first sensing device and a second sensing device, and The first sensing device is used to transmit a detection signal to the surface of the chip to be tested in the test seat, The second sensing device is used to receive the detection signal reflected from the surface of the chip to be tested, If the second sensing device does not receive the detection signal within the preset range, the second sensing device transmits an alarm signal to the processor. The processor transmits a stop signal to the pressing device based on the alarm signal and outputs an alarm notification.

6. The automatic chip testing device according to claim 1, after the pressing device moves a preset distance toward the test seat, the sensing device is further used to detect the pressing distance and determine whether the pressing distance is within a preset distance range. If it is not within the preset distance range, the processor outputs a compensation signal to the pressing device, and the pressing device adjusts the pressing distance according to the compensation signal. 7 . The automatic chip testing device according to claim 6 , wherein the pressing distance is the distance between the pressing rod and the first surface or the chip to be tested.

8. The automated chip testing device according to claim 1, wherein the sensing device further comprises a third sensing device and a fourth sensing device, The third sensing device is used to detect the first distance, The fourth sensing device is used to detect the second distance, The processor is further configured to determine whether the first distance and the second distance exceed a preset threshold, If so, the processor transmits a stop signal to the pressing device and outputs an abnormality notification.

9. The automated chip testing device according to claim 8, wherein the first distance is the distance between the third sensing device and the first surface, The second distance is the distance between the fourth sensing device and the pressing rod.

10. An automated chip testing method, characterized in that: include: The processor receives the test instruction, and generates and outputs the test signal according to the test instruction; The test signal is received by the pressing device and the sensing device; The pressing device moves toward the test socket based on the test signal, and presses the chip to be tested in the test socket through at least one protrusion in the pressing device; The sensing device determines, based on the test signal, whether the distance between the sensing device and the object to be sensed meets a preset condition; If so, the processor starts a test program and outputs test data to the test socket.

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