Variable Temperature Testing Device for Chip Testing and Chip Manufacturing System

Abstract

The present invention provides a variable-temperature testing device for chip testing and a chip manufacturing process system, relating to the technical field of chip detection. It includes a middle-test Dewar assembly, a fixing assembly, and a refrigeration assembly; the middle-test Dewar assembly includes a thin-wall cold finger, a transition ring, a Dewar base, and a Dewar window seat; the fixing assembly includes: a bottom plate; a connecting member disposed on the bottom plate and having a first height from the bottom plate; a supporting member disposed on the bottom plate and having a second height from the bottom plate; one end of the supporting member is connected to the bottom plate, and the other end is supported and connected to the Dewar window seat; the refrigeration assembly includes: a refrigerator disposed on the bottom plate and communicatively connected to an external control device; an expander disposed on the bottom plate, one end connected to the refrigerator, and the other end detachably connected to the other end of the thin-wall cold finger through the connecting member; the refrigerator determines the refrigeration temperature of the expander. The variable-temperature testing device provided by the present invention has the characteristics of fast temperature adjustment response rate, large adjustable temperature range, and high temperature control accuracy.

Description

Technical Field

[0001] The present invention relates to the technical field of chip detection, and more specifically, to a variable-temperature test device for chip testing and a chip manufacturing process system. Background Art

[0002] Infrared detectors have the characteristics of passive detection, high detection accuracy, and strong environmental adaptability, and are widely used in night vision, astronomical observation, aerospace and other fields. Infrared detection chips are important components of infrared detectors.

[0003] During the preparation of infrared detection chips, before their formal component packaging, it is necessary to perform performance detection on the infrared detection chips to determine whether the electrical performance of the infrared detection chips meets the design requirements. This detection process is the in-process test of the chips.

[0004] Currently, during the in-process test of chips, generally, a cryogenic environment is provided for infrared detection chips through an in-process test dewar (such as setting cryogenic liquid in the in-process test dewar to provide a cryogenic environment) to complete the performance test of the infrared detection chips in a cryogenic environment.

[0005] However, the inventor found that such performance test methods are limited by the temperature range of cryogenic liquids. For example, when the cryogenic liquid is liquid nitrogen, the in-process test dewar can only reduce the temperature of the infrared detection chip to the liquid nitrogen temperature range (such as 77K), and cannot achieve the adjustment of other temperature ranges (such as 50 - 77K or 80 - 250K, etc.), resulting in limited adjustment of the temperature environment and inability to meet the test requirements.

[0006] The content of the background art section is only the technology known to the applicant and does not necessarily represent the prior art in this field. Summary of the Invention

[0007] The present invention provides a variable-temperature test device for chip testing and a chip manufacturing process system, aiming to solve the problem that the current chip performance test methods are limited by the temperature range of cryogenic liquids.

[0008] According to one aspect of the present invention, the present invention provides a variable-temperature testing device for chip testing, including a middle-test Dewar assembly, a fixing assembly, and a refrigeration assembly. The middle-test Dewar assembly includes: a thin-wall cold finger; a transition ring connected to one end of the thin-wall cold finger; a Dewar base connected to the transition ring; a Dewar window seat detachably connected to the Dewar base through a locking member; the fixing assembly includes: a bottom plate; a connecting member disposed on the bottom plate and having a first height from the bottom plate; a supporting member disposed on the bottom plate and having a second height from the bottom plate; one end of the supporting member is connected to the bottom plate, and the other end is supported and connected to the Dewar window seat; the refrigeration assembly includes: a refrigerator disposed on the bottom plate and communicatively connected to an external control device; an expander disposed on the bottom plate, one end connected to the refrigerator, and the other end detachably connected to the other end of the thin-wall cold finger through the connecting member; wherein, the refrigerator determines the refrigeration temperature of the expander according to the control signal of the external control device.

[0009] According to some embodiments of the present invention, the Dewar base includes: a first Dewar housing connected to the transition ring; a lead housing disposed on one side of the first Dewar housing; a connector connected to the lead housing; an insulator unit disposed on the first Dewar housing and electrically connected to the connector and a temperature measuring sensor.

[0010] According to some embodiments of the present invention, the Dewar base further includes: an exhaust unit disposed on the first Dewar housing.

[0011] According to some embodiments of the present invention, the Dewar window seat includes: a cold stage including an upper cold stage, a lower cold stage, and a cold shield; a plurality of pins circumferentially disposed on the cold stage; a lead square disposed on the first Dewar housing; a lead ring including an upper lead ring and a lower lead ring; at least two support columns, one end of the support column is connected to the first Dewar housing, and the other end is supported and connected to the lead ring.

[0012] According to some embodiments of the present invention, the insulator unit includes at least two redundantly arranged insulators.

[0013] According to some embodiments of the present invention, the refrigeration assembly further includes: a first heat dissipation unit disposed to surround the refrigerator; the first heat dissipation unit includes: a first heat dissipation end disposed on the top of the refrigerator; first heat dissipation teeth disposed on both sides of the refrigerator.

[0014] According to some embodiments of the present invention, the refrigeration assembly further includes: a second heat dissipation unit disposed to surround the expander; the second heat dissipation unit includes: a second heat dissipation end disposed on the top of the expander; second heat dissipation teeth disposed on both sides of the expander.

[0015] According to some embodiments of the present invention, a first annular sealing groove is circumferentially provided on the thin-wall cold finger, and a first sealing ring is provided in the first annular sealing groove; and / or, a second annular sealing groove is provided on the first Dewar housing, and a second sealing ring is provided in the second annular sealing groove.

[0016] According to some embodiments of the present invention, the connecting member is provided with a third annular sealing groove, and a third sealing ring is arranged in the third annular sealing groove.

[0017] According to another aspect of the present invention, the present invention further provides a chip manufacturing system. The chip manufacturing system includes a variable-temperature testing device for chip testing as described above.

[0018] Beneficial effects

[0019] The variable-temperature testing device provided by the present invention includes an intermediate testing Dewar assembly, a fixing assembly, and a refrigeration assembly. The intermediate testing Dewar assembly is connected to the refrigeration assembly through the fixing assembly. The intermediate testing Dewar assembly can provide a testing environment for chip intermediate testing, the fixing assembly can provide fixed support for the intermediate testing Dewar assembly, and the refrigeration assembly can provide a cold source for chip intermediate testing.

[0020] The present invention replaces the cold source mode of setting low-temperature liquid in the intermediate testing Dewar in the prior art with the cold source mode of a refrigerator, and can provide a variable-temperature environment with a large adjustable range for chip intermediate testing. The variable-temperature testing device provided by the present invention has the characteristics of fast temperature adjustment response rate, large adjustable temperature range, and high temperature control accuracy.

[0021] In addition, through the setting of the fixing assembly, the present invention can realize the detachable connection between the intermediate testing Dewar assembly and the refrigeration assembly, so as to realize the batch operation of chip intermediate testing. And through the setting of the fixing assembly, the present invention can also realize the fixation of the intermediate testing Dewar assembly. This fixing method does not require additional fixing tools, and has the characteristics of simple structure. Description of the drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 A schematic structural diagram of the variable-temperature testing device showing an embodiment of the present invention;

[0024] Figure 2 Another schematic structural diagram of the variable-temperature testing device showing an embodiment of the present invention.

[0025] Description of the reference numerals:

[0026] Variable-temperature testing device 1; Intermediate testing Dewar assembly 10; Fixing assembly 20; Refrigeration assembly 30;

[0027] Thin-walled cold finger 11; Transition ring 12; Dewar base 13; Dewar window seat 14; Locking member 15;

[0028] Base plate 21; Connecting member 22; Support member 23; First weight reduction hole 211; Second weight reduction hole 212;

[0029] Refrigerator 31; Expander 32;

[0030] First Dewar housing 131; Lead housing 132; Connector 133; Insulator unit 134; Exhaust unit 135;

[0031] Cold stage 141; Pin 142; Lead square 143; Lead ring 144; Upper lead ring 1441; Support column 145;

[0032] First heat dissipation unit 33; First heat dissipation end 331; First heat dissipation teeth 332;

[0033] Second heat dissipation unit 34; Second heat dissipation end 341 and second heat dissipation teeth 342. Detailed implementation manners

[0034] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. Like reference numerals in the figures denote like or similar parts, and thus their repetitive description will be omitted.

[0035] The features, structures, or characteristics described may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of the embodiments of the present disclosure. However, those skilled in the art will realize that the technical solutions of the present disclosure can be practiced without one or more of these specific details, or can be implemented in other ways, components, materials, devices, etc. In these cases, well-known structures, methods, devices, implementations, materials, or operations will not be shown or described in detail.

[0036] In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally further include steps or units not listed, or may optionally further include other steps or units inherent to these processes, methods, products, or devices.

[0037] The terms "first", "second", etc. in the description and claims of the present invention and in the above accompanying drawings are used to distinguish different objects, rather than to describe a specific order.

[0038] Combined with the accompanying drawings in the embodiments of the present invention, the technical solutions of the present invention will be clearly and completely described. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0039] According to one aspect of the present invention, the present invention provides a variable-temperature test device for chip testing.

[0040] Figure 1 A schematic structural diagram of the variable-temperature test device according to an embodiment of the present invention is shown; Figure 2 Another schematic structural diagram of the variable-temperature test device according to an embodiment of the present invention is shown.

[0041] According to the exemplary embodiment, as Figure 1 shown, the variable-temperature test device 1 may include a middle test Dewar assembly 10, a fixing assembly 20, and a refrigeration assembly 30.

[0042] For example, as Figure 1 shown, the middle test Dewar assembly 10 is connected to the refrigeration assembly 30 through the fixing assembly 20. The variable-temperature test device 1 can provide a test environment that can meet the refrigeration temperature requirements for the middle test of the chip to be detected.

[0043] Exemplarily, the chip to be detected may be an infrared detection chip. Of course, it may also be any other type of chip that requires middle testing of the chip, and the present invention is not limited thereto.

[0044] According to the exemplary embodiment, as Figure 1 or Figure 2 shown, the middle test Dewar assembly 10 includes a thin-wall cold finger 11, a transition ring 12, a Dewar base 13, and a Dewar window seat 14.

[0045] For example, the material of the thin-wall cold finger 11 may be a metal material with low thermal conductivity, and the thin-wall cold finger 11 has a relatively thin wall thickness. With such a setting, through the low thermal conductivity and thin-wall characteristics of the thin-wall cold finger 11, the thermal load of the middle test Dewar assembly 10 can be reduced.

[0046] As Figure 1 or Figure 2 shown, the transition ring 12 is connected to one end of the thin-wall cold finger 11. The Dewar base 13 is detachably connected to the Dewar window seat 14 through a locking member 15.

[0047] For example, the locking member 15 may be a clamp.

[0048] The Dewar base 13 is provided with an electrical lead-out structure required for the middle test Dewar assembly 10, which can achieve electrical connection with the chip to be tested. By the detachable connection mode of the Dewar window seat 14 and the Dewar base 13 in the present invention, the replacement of the chip to be tested can be facilitated, so that the variable temperature test device 1 can be adapted to the middle test of various chips.

[0049] According to an exemplary embodiment, as Figure 1 shown, the fixing assembly 20 may include a bottom plate 21, a connecting member 22 and a supporting member 23.

[0050] Exemplarily, the material of the fixing assembly 20 may be aluminum alloy material. Such a setting can make the fixing assembly 20 have the characteristics of light material and high heat dissipation.

[0051] According to an exemplary embodiment, as Figure 1 shown, the bottom plate 21 is arranged at the bottom of the variable temperature test device 1.

[0052] Optionally, as Figure 1 shown, the bottom plate 21 is provided with a first weight reduction hole 211 and a second weight reduction hole 212. Such a setting can make the structure of the variable temperature test device 1 more lightweight.

[0053] According to an exemplary embodiment, as Figure 1 shown, the connecting member 22 is arranged on the bottom plate 21 and has a first height with respect to the bottom plate 21.

[0054] For example, as Figure 1 shown, the connecting member 22 is used to connect the thin-wall cold finger 11 and the refrigeration assembly 30. And since the connecting member 22 has a first height (or a first angle), by setting the first height (or the first angle) of the connecting member 22, the center height (or angle) of the middle test Dewar assembly 10 can be controlled. Such a setting makes the center height (or angle) of the middle test Dewar assembly 10 adaptable to the center height (or angle) of the lens during the middle test of the chip, so as to meet the test requirements of the chip middle test.

[0055] Exemplarily, the connecting member 22 may include an adapter flange.

[0056] According to an exemplary embodiment, the supporting member 23 is arranged on the bottom plate 21 and has a second height (or a second angle) with respect to the bottom plate 21. One end of the supporting member 23 is connected to the bottom plate 21, and the other end is in a supporting connection with the Dewar window seat 14.

[0057] For example, as Figure 1As shown, the support member 23 is used to provide a supporting force for the variable temperature test device 1. And since the support member 23 has a second height (or a second angle), by setting the second height (or the second angle) of the support member 23, the central height (or the angle) of the intermediate measurement dewar assembly 10 can also be controlled accordingly.

[0058] According to an exemplary embodiment, as Figure 1 shown, the refrigeration assembly 30 may include a refrigerator 31 and an expander 32.

[0059] The refrigerator 31 is disposed on the bottom plate 21 and is communicatively connected to an external control device. The expander 32 is disposed on the bottom plate 21, one end thereof is connected to the refrigerator 31, and the other end thereof is detachably connected to the other end of the thin-walled cold finger 11 through a connecting member 22.

[0060] The refrigerator 31 determines the refrigeration temperature of the expander 32 according to a control signal of the external control device.

[0061] For example, the refrigerator 31 may be a full-range linear Stirling refrigerator. A Stirling refrigerator is a refrigeration device based on the Stirling cycle principle. It can achieve refrigeration by compressing and expanding gases, and has the characteristics of simple operation, high efficiency, large cooling capacity, and stable temperature control.

[0062] Exemplarily, the refrigerator 31 can communicate with an external control device (such as a refrigerator controller) through host computer software, can quickly respond to the control signal, and control the refrigeration temperature within a preset temperature range (such as 50K - 250K), so as to meet the temperature environment required by the chip to be tested (such as an infrared detection chip) during the intermediate measurement of the chip.

[0063] Through the above embodiments, the variable temperature test device 1 provided by the present invention includes an intermediate measurement dewar assembly 10, a fixing assembly 20, and a refrigeration assembly 30. The intermediate measurement dewar assembly 10 is connected to the refrigeration assembly 30 through the fixing assembly 20. The intermediate measurement dewar assembly 10 can provide a test environment for the intermediate measurement of the chip, the fixing assembly 20 can provide fixed support for the intermediate measurement dewar assembly 10, and the refrigeration assembly 30 can provide a cold source for the intermediate measurement of the chip.

[0064] The present invention replaces the cold source method of setting low-temperature liquid in the intermediate measurement dewar in the prior art with the cold source method of the refrigerator, and can provide a wide range of adjustable temperature environments for the intermediate measurement of the chip. The variable temperature test device 1 provided by the present invention has the characteristics of fast temperature adjustment response rate, large adjustable temperature range, and high temperature control accuracy.

[0065] In addition, through the provision of the fixing component 20, the present invention can achieve a detachable connection between the in - process test Dewar component 10 and the refrigeration component 30, thereby enabling batch operation of chip in - process testing. Moreover, through the provision of the fixing component 20, the present invention can also fix the in - process test Dewar component 10. This fixing method does not require additional configuration of other fixing tooling and has the characteristic of simple structure.

[0066] Optionally, as Figure 1 or Figure 2 shown, the Dewar base 13 further includes a first Dewar housing 131, a lead housing 132, a connector 133, and an insulator unit 134.

[0067] The first Dewar housing 131 is connected to the transition ring 12. The lead housing 132 is provided on one side of the first Dewar housing 131 and is used to lead out the circuit structure in the Dewar base 13 and the Dewar window seat 14.

[0068] The connector 133 is connected to the lead housing 132 and is used to connect to the in - process test Dewar internal terminal through a wire that meets the heat leakage requirement.

[0069] For example, the connector 133 can be two 25 - core electrical connectors.

[0070] As Figure 2 shown, the insulator unit 134 is provided on the first Dewar housing 131 and is electrically connected to the connector 133 and the temperature - measuring sensor.

[0071] Optionally, the insulator unit 134 includes at least two redundantly provided insulators.

[0072] Optionally, as Figure 1 shown, the Dewar base 13 may further include an exhaust unit 135. The exhaust unit 135 is provided on the first Dewar housing 131.

[0073] For example, the exhaust unit 135 can be an exhaust nozzle. Through the provision of the exhaust nozzle, the present invention can exhaust the inside of the in - process test Dewar component 10, so that the inside of the in - process test Dewar component 10 is in a vacuum environment.

[0074] Optionally, as Figure 2 shown, the Dewar window seat 14 includes a cold stage 141, pins 142, a lead square 143, a lead ring 144 (including an upper lead ring 1441 and a lower lead ring, the lower lead ring is not shown in the figure), and at least two support columns 145.

[0075] The cold stage 141 includes an upper cold stage, a lower cold stage, and a cold shield. For example, the upper cold stage and the lower cold stage can be installed and connected through a first mounting hole 1411; the cold shield can be installed and connected to the cold stage through a second mounting hole 1412.

[0076] AsFigure 2 As shown, a plurality of pins 142 are circumferentially arranged on the cold table 141. The lead side 143 is arranged on the first Dewar housing 131.

[0077] One end of the support column 145 is connected to the first Dewar housing 131, and the other end is supported and connected to the lead ring 144.

[0078] Exemplarily, the Dewar window seat 14 may include 4 support columns 145 arranged circumferentially, and the angular difference between the 4 support columns 145 arranged circumferentially may be 90°.

[0079] Through the above embodiments, based on the structural settings of the pins 142, the lead side 143, the lead ring 144 and the connector 133, the present invention forms a lead bonding pad. The present invention replaces the lead connection method of welding indium balls to the lead connection post in the prior art with the lead connection method of the lead bonding pad, which can avoid problems such as indium ball shedding or solder wire shedding, making the structure of the variable temperature testing device 1 more stable and reliable.

[0080] Optionally, as Figure 1 shown, the refrigeration assembly 30 may further include a first heat dissipation unit 33. The first heat dissipation unit 33 is disposed to surround the refrigerator 31.

[0081] For example, as Figure 1 shown, the refrigeration assembly 30 may include two first heat dissipation units 33, and the two first heat dissipation units 33 are disposed at both ends of the refrigerator 31.

[0082] The first heat dissipation unit 33 may further include a first heat dissipation end 331 and first heat dissipation teeth 332. The first heat dissipation end 331 is disposed on the top of the refrigerator 31. The first heat dissipation teeth 332 are disposed on both sides of the refrigerator 31.

[0083] The first heat dissipation end 331 and the first heat dissipation teeth 332 can dissipate the heat generated during the operation of the refrigerator 31.

[0084] Optionally, as Figure 1 shown, the refrigeration assembly 30 may further include a second heat dissipation unit 34. The second heat dissipation unit 34 is disposed to surround the expander 32.

[0085] For example, as Figure 1 shown, the refrigeration assembly 30 may include one second heat dissipation unit 34.

[0086] The second heat dissipation unit 34 may further include a second heat dissipation end 341 and second heat dissipation teeth 342. The second heat dissipation end 341 is disposed on the top of the expander 32. The second heat dissipation teeth 342 are disposed on both sides of the expander 32.

[0087] The second heat dissipation end 341 and the second heat dissipation teeth 342 can dissipate the heat generated during the operation of the expander 32.

[0088] Optionally, the thin-walled cold finger 11 is circumferentially provided with a first annular sealing groove, and a first sealing ring is arranged in the first annular sealing groove.

[0089] With such a setting, it can be ensured that the thin-walled cold finger 11 has good sealing performance.

[0090] Optionally, the first Dewar shell 131 is provided with a second annular sealing groove, and a second sealing ring is arranged in the second annular sealing groove.

[0091] With such a setting, it can be ensured that the first Dewar shell 131 has good sealing performance.

[0092] Optionally, the connecting member 22 is provided with a third annular sealing groove, and a third sealing ring is arranged in the third annular sealing groove.

[0093] With such a setting, it can be ensured that the connecting member 22 has good sealing performance.

[0094] According to another aspect of the present invention, the present invention also provides a chip manufacturing system. The chip manufacturing system includes the variable-temperature testing device for chip testing as described above.

[0095] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions of the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A variable temperature testing device for chip testing, characterized in that: Including the mid-test Dewar assembly, fixed assembly and refrigeration assembly; The mid-test Dewar assembly comprises: Thin wall cold finger; A transition ring connected to one end of the thin-walled cold finger; A Dewar base is connected to the transition ring, and the Dewar base includes: A first Dewar housing connected to the transition ring; A lead housing is arranged on one side of the first Dewar housing; A connector connected to the lead housing; An insulator unit, arranged on the first Dewar housing and electrically connected to the connector and the temperature sensor; A Dewar window seat, detachably connected to the Dewar base via a locking member; The fixing assembly comprises: Base plate; A connecting member, disposed on the bottom plate and having a first height relative to the bottom plate; A support member is arranged on the bottom plate and has a second height with the bottom plate; one end of the support member is connected to the bottom plate, and the other end is connected to the Dewar window seat support; The refrigeration assembly comprises: A refrigerator, disposed on the base plate and communicatively connected to an external control device; An expander, arranged on the bottom plate, one end of which is connected to the refrigerator, and the other end of which is detachably connected to the other end of the thin-walled cold finger through the connector; wherein the refrigerator determines the refrigeration temperature of the expander according to the control signal of the external control device; The Dewar window seat comprises: Cold stage, including upper cold stage, lower cold stage and cold screen; A plurality of pins are arranged around the cold table; A lead wire is arranged on the first Dewar housing; A lead ring, comprising an upper lead ring and a lower lead ring; At least two support columns, one end of each support column is connected to the first Dewar housing, and the other end of each support column is connected to the lead ring support; Wherein, the upper cold stage and the lower cold stage are installed and connected through a first installation hole; and the cold screen is installed and connected to the cold stage through a second installation hole.

2. The variable temperature testing device according to claim 1, characterized in that: The Dewar base also includes: The exhaust unit is arranged on the first Dewar shell.

3. The variable temperature testing device according to claim 1, characterized in that: The insulator unit comprises at least two redundantly arranged insulators.

4. The variable temperature testing device according to claim 1, characterized in that: The refrigeration assembly also includes: A first heat dissipation unit is disposed around the refrigerator; The first heat dissipation unit comprises: A first heat dissipation end is arranged on the top of the refrigerator; The first heat dissipation teeth are arranged on both sides of the refrigerator.

5. The variable temperature testing device according to claim 1, characterized in that: The refrigeration assembly also includes: A second heat dissipation unit is disposed around the expander; The second heat dissipation unit comprises: A second heat dissipation end is arranged on the top of the expander; The second heat dissipation teeth are arranged on both sides of the expander.

6. The variable temperature testing device according to claim 1, characterized in that: A first annular sealing groove is arranged around the thin-walled cold finger, and a first sealing ring is arranged in the first annular sealing groove; and / or The first Dewar shell is provided with a second annular sealing groove, and a second sealing ring is provided in the second annular sealing groove.

7. The variable temperature testing device according to claim 1, characterized in that: The connecting piece is provided with a third annular sealing groove, and a third sealing ring is provided in the third annular sealing groove.

8. A chip manufacturing system, characterized in that: It comprises a variable temperature testing device as described in any one of claims 1-7.

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