Computing device

Abstract

The embodiment of the invention provides computing equipment which comprises a shell assembly, an air inlet and an air outlet, a first air inlet and a second air outlet, and a second air inlet and a second air outlet are formed in the shell assembly, the calculation module is arranged in the cavity; the fan is arranged in the cavity and used for generating airflow flowing from the air inlet to the air outlet, and the airflow flows through the calculation module. According to the technology of the embodiment of the invention, the shell assembly is provided with the air inlet and the air outlet which are communicated with the inner cavity, the calculation module and the fan are integrated on the shell assembly, the fan can generate the flowing airflow from the air inlet to the air outlet, and the airflow flows through the calculation module, so that the heat dissipation efficiency of the calculation module is improved. In addition, the air outlet of the shell assembly can be used for heating, and the energy utilization rate is increased.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a computing device. Background Art

[0002] In order to meet the heat dissipation requirements of high-performance computing devices, computing devices are usually equipped with a heat dissipation module to reduce the operating temperature of the computing device and prevent hardware damage caused by overheating. In the related art, the heat dissipation module of the computing device has a single function and the design needs to be optimized. Summary of the invention

[0003] The embodiments of the present application provide a computing device to solve or alleviate one or more technical problems in the prior art.

[0004] According to an embodiment of the present application, the computing device includes: a shell assembly, which defines a cavity inside, and the shell assembly is provided with an air inlet and an air outlet connected to the cavity; a computing module, which is arranged in the cavity; and a fan, which is arranged in the cavity and is used to generate an airflow flowing from the air inlet to the air outlet, and the airflow flows through the computing module.

[0005] In one embodiment, the air outlet is disposed on a side of the housing assembly.

[0006] In one embodiment, the fan is disposed on the upper side of the computing module, and the air outlet is disposed adjacent to the top of the housing assembly.

[0007] In one embodiment, the air inlet is disposed on a side of the housing assembly.

[0008] In one embodiment, the air inlet and the air outlet are arranged on different sides of the housing assembly.

[0009] In one embodiment, the air inlet and the air outlet are arranged on the same side of the housing assembly.

[0010] In one embodiment, the air inlet is disposed adjacent to the bottom of the housing assembly.

[0011] In one embodiment, the air inlet is disposed at the bottom of the housing assembly.

[0012] In one embodiment, the computing module includes a computing board and a heat dissipation structure, and the heat dissipation structure is thermally connected to the computing board.

[0013] In one embodiment, the plane where the computing board is located is arranged parallel to the vertical direction.

[0014] In one embodiment, the heat dissipation structure includes at least one heat dissipation fin group, and the heat dissipation fin group is arranged on at least one side of the computing board, and each heat dissipation fin group includes a plurality of heat dissipation fins arranged at intervals.

[0015] In one embodiment, a guide gap is defined between two adjacent heat dissipation fins in the heat dissipation fin group, and an extension direction of the guide gap is arranged parallel to the vertical direction.

[0016] In one embodiment, the ends of the heat sinks in each heat sink group that are away from the computing board are spaced apart from the inner wall of the cavity.

[0017] In one embodiment, the number of the heat sink fin groups is two, and the two heat sink fin groups are respectively arranged on opposite sides of the computing board.

[0018] In one embodiment, the heat dissipation structure further includes a plurality of support beams disposed at the bottom of the computing board, the plurality of support beams are spaced apart along the first direction, and each support beam is supported on the bottom wall of the cavity.

[0019] In one embodiment, the fan has an air flow inlet and an air flow outlet, the air flow inlet is arranged adjacent to the air inlet, and the air flow outlet is arranged adjacent to the air outlet; the air inlet direction of the air flow inlet and the air outlet direction of the air flow outlet have an angle.

[0020] In one embodiment, the fan comprises a cross-flow fan, and the air inlet direction of the air flow inlet and the air outlet direction of the air flow outlet are perpendicular to each other.

[0021] In one embodiment, it also includes: a power module, which is arranged in the cavity, and a power fan is arranged side by side with the computing module in the first direction of the housing assembly, and the airflow generated by the fan flows through the power module and the computing module.

[0022] In one embodiment, the power module has a plug interface, and the computing board of the computing module has a plug end, which is plugged into the plug interface to electrically connect the computing board to the power module.

[0023] In one embodiment, the housing assembly includes an inner shell, and the computing module, the fan and the power module are integrated in the inner shell.

[0024] In one embodiment, the housing assembly further includes an outer shell, the interior of the outer shell defines a cavity, a first mounting opening is provided on one side of the outer shell in the first direction, and the inner shell is slidably mounted in the cavity through the first mounting opening.

[0025] In one embodiment, the interior of the inner shell defines an accommodating cavity, and the computing module and the power module are arranged side by side in the accommodating cavity along a first direction; the top of the inner shell defines an installation groove, and the fan is arranged in the installation groove.

[0026] In one embodiment, a first side baffle and a second side baffle are disposed on the top of the inner shell. The first side baffle and the second side baffle are disposed opposite to each other in the second direction, and a mounting groove is defined between the first side baffle and the second side baffle.

[0027] In one embodiment, the first side baffle and the second side baffle are respectively in contact with the outer wall surface of the fan.

[0028] In one embodiment, the inner shell has two side walls arranged opposite to each other in the second direction, and the inner wall surfaces of the two side walls are respectively provided with support ribs, and the two support ribs are respectively arranged adjacent to the top of the inner shell; wherein the mounting groove is jointly defined by the first side baffle plate, the second side baffle plate and the two support ribs.

[0029] In one embodiment, the support ribs are formed by the inner wall surface of the side wall protruding inwardly, and the length direction of the support ribs is parallel to the first direction.

[0030] In one embodiment, two side walls of the inner shell are respectively provided with limit folds, and the limit folds extend obliquely downward from the side walls in a direction toward the inner wall surface of the outer shell.

[0031] In one embodiment, two inner wall surfaces of the outer shell opposite to each other in the second direction are respectively provided with stoppers, which extend upwardly obliquely from the inner wall surface of the outer shell in a direction toward the outer wall surface of the inner shell, and are located at the lower side of the limiting fold.

[0032] In one embodiment, the bottom of the inner shell has a bottom open area connected to the accommodating cavity, and the side of the inner shell has a side open area connected to the accommodating cavity. The bottom open area is connected to the air inlet correspondingly, and the side open area is connected to the air outlet correspondingly.

[0033] In one embodiment, the housing assembly further includes: a mounting side plate, which is detachably mounted on the first mounting opening to seal the first mounting opening.

[0034] In one embodiment, a snap-fitting protrusion is provided at the end of the fan adjacent to the first installation opening, and a penetrating first snap-fitting hole is provided on the installation side plate, and the first snap-fitting hole forms a snap-fitting fit with the snap-fitting protrusion of the fan.

[0035] In one embodiment, the mounting side plate is provided with a through-hole for passing a cable connecting the control module and the power module, and the control module is arranged outside the accommodating cavity of the inner shell.

[0036] In one embodiment, the outer shell has an extending portion extending along a first direction, the extending portion defines an installation space, and the installation space is adjacent to the inner shell in the first direction, and the installation space is used to install the control module.

[0037] In one embodiment, the top of the installation space is open.

[0038] In one embodiment, a second installation opening is opened on the other side of the shell in the first direction; the shell assembly also includes a cover side plate, which is detachably mounted on the second installation opening to seal the second installation opening.

[0039] In one embodiment, the cover side panel and the control module are respectively located on opposite sides of the shell in the first direction, the cover side panel is provided with a snap-fitting portion, and the control module is provided with a snap-fitting portion; in two computing devices arranged adjacent to each other along the first direction, the snap-fitting portion of one computing device forms a snap-fitting with the snap-fitting portion of the other computing device.

[0040] In one embodiment, it also includes: a control module, including a control box and a control circuit board, the interior of the control box defines an installation cavity, the control box is detachably installed in the housing assembly, the control circuit board is arranged in the installation cavity, and the control circuit board is used to be electrically connected to the computing module and the power module respectively.

[0041] In one embodiment, the control box includes a shell and a side cover plate, the shell defines a mounting cavity and a side opening communicating with the mounting cavity, and the side cover plate is detachably mounted on the side opening.

[0042] In one embodiment, a through-hole is provided on the side cover plate, and the through-hole is used for allowing the cable of the power module to pass through and be electrically connected to the control circuit board.

[0043] In one embodiment, the end of the fan has a snap-fitting protrusion; the side cover plate is also provided with a snap-fitting hole, the shape of which matches the shape of the snap-fitting protrusion, and the snap-fitting hole is used to form a snap-fitting fit with the snap-fitting protrusion.

[0044] In one embodiment, the side cover plate has a recessed portion, which is recessed in a direction toward the installation cavity. The recessed portion defines a cable storage groove, and the wire passing hole and the clamping hole are both arranged in the recessed portion.

[0045] In one embodiment, a snap-in hole is provided on one side of the shell assembly adjacent to the control box, and a snap-in protrusion is provided on one side of the side cover plate adjacent to the shell assembly, and the snap-in protrusion is used to form a snap-in fit with the snap-in hole; or, a snap-in protrusion is provided on one side of the shell assembly adjacent to the control box, and a snap-in hole is provided on the side cover plate, and the snap-in hole is used to form a snap-in fit with the snap-in protrusion.

[0046] In one embodiment, the shell includes an upper shell and a lower shell, and the bottom of the upper shell is connected to the top of the lower shell; wherein the material of the upper shell is a transparent material.

[0047] In one embodiment, the control module further includes a display screen, which is disposed in the installation cavity and electrically connected to the control circuit board, and a display area of ​​the display screen is disposed opposite to the upper shell.

[0048] In one embodiment, an outer side wall of a control box of the control module is provided with a snap-fitting portion, and the snap-fitting portion is provided correspondingly to the snap-fitting portion on the cover side plate of the housing assembly.

[0049] In one embodiment, the snap-fitting portion is a protruding structure, and the snap-fitting portion is a groove structure; or, the snap-fitting portion is a groove structure, and the snap-fitting portion is a protruding structure.

[0050] In one embodiment, the computing board of the computing module includes a board body and a plurality of computing units, wherein the plurality of computing units are arranged on a side surface of the board body, the length direction of the board body is parallel to the first direction, and the width direction of the board body is parallel to the vertical direction.

[0051] In one embodiment, the ratio of the width dimension of the plate body to the length dimension of the plate body is less than or equal to 1 / 6.

[0052] In one embodiment, a plurality of computing units are disposed on a side surface of the plate body, the plurality of computing units are arranged in at least one row, and a plurality of computing units in each row are adjacently arranged along a length direction of the plate body.

[0053] In one embodiment, the plurality of computing units are arranged in two rows, and the computing units in the two rows are spaced apart in the width direction of the board.

[0054] In one embodiment, two rows of computing units are arranged in series.

[0055] In one embodiment, the board includes a first end and a second end oppositely arranged in its length direction, and the computing units in the first row of computing units adjacent to the second end are electrically connected to the computing units in the second row of computing units adjacent to the second end through the first conductive member.

[0056] In one embodiment, a plug-in end is provided at the first end of the board body, and the plug-in end is used to be plugged and matched with the plug interface of the power module.

[0057] In one embodiment, the computing units in the first row of computing units adjacent to the first end and the computing units in the second row of computing units adjacent to the first end are electrically connected to the plug-in end via the second conductive member.

[0058] In one embodiment, the width dimension of the plate body is greater than the width dimension of the plug end.

[0059] In one embodiment, the board body is provided with a plurality of connection holes, and the connection holes are used for fasteners to pass through so as to mount the heat dissipation structure on the board body.

[0060] In one embodiment, the plurality of computing units are arranged in two rows, and the two rows of computing units are spaced apart in the width direction of the board; wherein the plurality of connection holes are arranged between the two rows of computing units, and the plurality of connection holes are spaced apart along the first direction.

[0061] According to the computing device of the embodiment of the present application, the housing assembly is provided with an air inlet and an air outlet connected to the internal cavity, the computing module and the fan are integrated in the housing assembly, the fan can generate an airflow flowing from the air inlet to the air outlet, and the airflow flows through the computing module, thereby improving the heat dissipation efficiency of the computing module. In addition, the hot air discharged from the air outlet of the housing assembly can be used for heating, thereby realizing the reuse of the heat generated by the computing module, thereby improving the energy utilization rate of the computing device.

[0062] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0064] Figure 1 A schematic diagram of the three-dimensional structure of a computing device according to an embodiment of the present application is provided as an example.

[0065] Figure 2 An exploded structural diagram of a computing device according to an embodiment of the present application is provided as an example.

[0066] Figure 3 A schematic diagram of the exploded structure of the computing device of an embodiment of the present application after the outer shell is removed is provided as an example.

[0067] Figure 4 A lateral cross-sectional view of a computing device according to an embodiment of the present application is provided as an example.

[0068] Figure 5A A bottom view of a computing device according to an embodiment of the present application is exemplarily provided.

[0069] Figure 5B A bottom view of a computing device according to another embodiment of the present application is exemplarily provided.

[0070] Fig. 6A A schematic structural diagram of an air inlet filter assembly of a computing device according to an embodiment of the present application is provided as an example.

[0071] Figure 6B A side view of an air inlet filter assembly of a computing device according to an embodiment of the present application is exemplarily provided.

[0072] Figure 6CAn exploded structural diagram of an air inlet filter assembly of a computing device according to an embodiment of the present application is provided as an example.

[0073] Figure 7 A schematic diagram of a partial structure of a computing device according to an embodiment of the present application is provided as an example.

[0074] Figure 8 A longitudinal cross-sectional view of a computing device according to an embodiment of the present application is provided as an example.

[0075] Fig. 9 A transverse cross-sectional view of an inner shell of a computing device according to an embodiment of the present application is exemplarily provided.

[0076] Fig.10 A side view of a computing device according to an embodiment of the present application in which a power module and a fan are integrated and installed in an inner shell is provided as an example.

[0077] Fig.11A A schematic diagram of the three-dimensional structure of a computing device according to an embodiment of the present application is provided as an example at one viewing angle.

[0078] Fig. 11B A schematic diagram of the three-dimensional structure of the computing device of an embodiment of the present application at another viewing angle is exemplarily provided.

[0079] Fig.12 An exemplary assembly diagram of a control module and a housing assembly of a computing device according to an embodiment of the present application is provided.

[0080] Fig.13 An exploded structural diagram of a control module of a computing device according to an embodiment of the present application is exemplarily provided.

[0081] Fig.14 A schematic diagram of the three-dimensional structure of a computing board of a computing device according to an embodiment of the present application is provided as an example.

[0082] Fig.15 A front view of a computing board of a computing device according to an embodiment of the present application is provided as an example.

[0083] Fig.16 An enlarged schematic diagram of the local structure of a computing board of a computing device according to an embodiment of the present application is provided as an example.

[0084] Description of reference numerals:

[0085] 1- Computing device;

[0086] 100-housing assembly; 100a-first sub-cavity; 100b-second sub-cavity;

[0087] 10-inner shell; 10a-accommodating cavity; 10b-installation slot; 111-first side baffle; 112-second side baffle; 12-side wall; 121-support rib; 122-limiting folding edge; 123-first limiting column; 13-power decorative cover; 14-wire passing area; 15-positioning member;

[0088] 20-housing; 20a-first installation opening; 20b-air outlet; 20c-air inlet; 20c1-first air inlet; 20c2-second air inlet; 211-stopper; 212-second limiting column; 22-air outlet baffle; 23-air inlet baffle; 24-air inlet filter assembly; 241-first clamping plate; 242-filter element; 243-second clamping plate; 244-magnetic element; 245-ventilation area; 25-installation space;

[0089] 30-mounting side plate; 30a-first clamping hole; 30b-second clamping hole; 30c-wire hole;

[0090] 40-covering side plate; 41-clamping portion; 42-first hook;

[0091] 50-support; 51-second hook; 52-elastic support pad; 53-fastening screw;

[0092] 60- wireless communication unit;

[0093] 70-environmental temperature detection unit;

[0094] 200- fan; 210- clamping convex part;

[0095] 300-power module; 301-power input unit; 302-switch unit; 303-plug interface;

[0096] 400-computing module;

[0097] 410-computing board; 410a-board body; 410a1-first end; 410a2-second end; 410b-computing unit; 4101-first row of computing units; 4102-first row of computing units; 411-plug-in terminal; 411a-positive pole connecting terminal; 411b-negative pole connecting terminal; 412-connecting hole; 413-first connector; 414-second connector; 415-first conductive member; 416-second conductive member; 416a-positive conductive sheet; 416b-negative conductive sheet; 417-conductive row; 418-temperature sensor; 419a-spare connection terminal; 419b-detection connection terminal;

[0098] 420-heat dissipation structure; 421-heat dissipation fins; 422-fastening screws; 430-support beam;

[0099] 500-control module;

[0100] 510-control box; 511-housing; 511a-installation cavity; 5111-upper shell; 5112-lower shell; 5113-positioning column; 512-side cover; 512a-wire hole; 512b-clamping hole; 512c-installation hole; 5121-clamping protrusion; 5122-recess; 513-clamping matching part;

[0101] 520-display screen;

[0102] 530-control circuit board; 530a-positioning hole;

[0103] L1-first direction; L2-second direction. DETAILED DESCRIPTION

[0104] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0105] As the performance of computing devices continues to improve, the heat generated by high-power computing components such as processors and integrated circuits increases. In order to meet the heat dissipation needs of computing devices, computing devices are usually equipped with a heat dissipation module to reduce the operating temperature of the computing device and prevent hardware damage caused by overheating. In the related art, the computing device is only equipped with a single exhaust port for the heat dissipation module, resulting in a limited air flow path inside the computing device, poor air circulation, and low heat dissipation efficiency. In addition, in the related art, the heat dissipation module of the computing device has a single function and the design needs to be optimized.

[0106] Based on the above defects existing in the related art, the embodiment of the present application provides a computing device, by opening an air inlet and an air outlet connected to the internal cavity on the shell assembly, the computing module and the fan are integrated into the shell assembly, and the fan can generate a flow of air from the air inlet to the air outlet. The airflow flows through the heat dissipation structure of the computing module to take away the heat generated by the computing module, thereby cooling the computing module. In addition, the hot air discharged from the air outlet of the shell assembly can be used for heating, thereby realizing the reuse of the heat generated by the computing module and improving the energy utilization rate of the computing device.

[0107] The embodiments of the present application will be described in detail below in conjunction with the accompanying drawings. It should be noted that in the drawings of this specification, L1 represents the first direction, and the first direction may be a direction parallel to the length direction of the shell assembly. Among them, the length direction of the shell assembly may be understood as a straight line direction extending from one end of the longest side of the shell assembly to the other end. L2 represents the second direction, and the second direction may be perpendicular to the first direction, or parallel to the width direction of the shell assembly. Among them, the width direction of the shell assembly may be a direction perpendicular to the length direction of the shell assembly and in the same plane. The reference descriptions of the first direction L1 and the second direction L2 provided in the embodiments of the present application are for ease of understanding and should not be understood as limitations on the embodiments of the present application.

[0108] Figure 1 A schematic diagram of the three-dimensional structure of a computing device according to an embodiment of the present application is exemplarily provided. Figure 2 An exploded structural diagram of a computing device according to an embodiment of the present application is exemplarily provided. Figure 3 The following is an exemplary diagram of a computing device according to an embodiment of the present application with its housing removed. Figures 1 to 3 As shown, the computing device 1 provided in the embodiment of the present application includes a housing assembly 100, a computing module 400 and a fan 200. The housing assembly 100 defines a cavity inside, and the housing assembly 100 is provided with an air outlet 20b connected to the cavity. The computing module 400 is disposed in the cavity. The fan 200 is disposed in the cavity, and is used to generate an airflow flowing through the computing module 400, and the airflow is discharged from the air outlet 20b.

[0109] Figure 4 The following is an exemplary cross-sectional view of a computing device according to an embodiment of the present application. Figure 4 As shown, the housing assembly 100 is also provided with an air inlet 20c connected to the cavity. By providing the air inlet 20c and the air outlet 20b, an air duct is formed in the cavity. During the operation of the fan 200, the air flows in the air duct, that is, flows in the direction from the air inlet 20c to the air outlet 20b.

[0110] See also Figures 1 to 4 The interior of the housing assembly 100 may define a cavity of the computing device 1, and the cavity may be connected to the outside of the computing device 1 through the air inlet 20c and the air outlet 20b. Functional modules such as the computing module 400, the power module 300, and the fan 200 may be integrated and arranged inside the cavity of the housing assembly 100, and the housing assembly 100 may provide fixation and protection.

[0111] According to the computing device 1 provided in the embodiment of the present application, by providing an air inlet 20c and an air outlet 20b connected to the internal cavity on the housing assembly 100, the computing module 400 and the fan 200 are integrated in the housing assembly 100, and the fan 200 can generate a flow of air from the air inlet 20c to the air outlet 20b. The airflow flows through the computing module 400 during the flow process to take away the heat generated by the computing module 400, thereby cooling the computing module 400. In addition, the hot air discharged from the air outlet 20b of the housing assembly 100 can be used for heating, thereby realizing the reuse of the heat generated by the computing module 400, thereby improving the energy utilization rate of the computing device 1.

[0112] In one embodiment, if Figure 4 As shown, the air outlet 20 b is disposed on the side of the housing assembly 100 .

[0113] In the embodiment of the present application, the side of the housing assembly 100 refers to any side in the horizontal direction of the housing assembly 100. For example, the air outlet 20b can be disposed on at least one of the front side, the rear side, the left side and the right side of the housing assembly 100.

[0114] In some examples, the number of the air outlet 20 b may be at least one, and all the air outlets 20 b may be disposed on only one side of the housing assembly 100 .

[0115] In other examples, the number of the air outlets 20b may be multiple, and some of the air outlets 20b may be disposed on one side of the housing assembly, and another part of the air outlets 20b may be disposed on the other side opposite to the housing assembly.

[0116] It should be noted that the above is only an exemplary description, and the number and location of the air outlets 20b can be set by those skilled in the art according to actual heating needs. For example, when the computing device 1 needs to discharge warm air in different directions to meet multi-directional heating needs, air outlets 20b can be respectively opened on different sides of the shell assembly 100, but the present invention is not limited to this.

[0117] It can be understood that, compared to setting the air outlet 20b at the top of the shell assembly 100, the computing device 1 of the embodiment of the present application sets the air outlet 20b on the side of the shell assembly 100, which can effectively prevent external moisture or condensation water generated at the air outlet 20b from entering the interior of the shell assembly 100, reduce the probability of short circuit or damage of internal components, and thus improve the safety and stability of the operation of the computing device 1.

[0118] It should also be noted that in order to prevent the high-temperature airflow from being retained or forming eddies in the housing assembly 100, thereby affecting the heat dissipation effect of the computing device 1, in some examples, see Figure 4As shown, the opening position of the air outlet 20b can correspond to the position of the exhaust area of ​​the fan 200, and the opening size of the air outlet 20b can be set corresponding to the area size of the exhaust area of ​​the fan 200 to ensure that the airflow exhausted by the fan 200 can be discharged from the inside of the shell assembly 100.

[0119] Regarding the relative positional relationship between the fan 200 and the computing module 400, the fan 200 can be disposed on the upper side of the computing module 400, and in order to arrange the air outlet 20b corresponding to the air outlet direction of the fan 200, the air outlet 20b can be arranged adjacent to the top of the housing assembly 100. The air outlet 20b is arranged adjacent to the top of the housing assembly 100, which can be understood as the distance between the air outlet 20b and the top of the housing assembly 100 is smaller than the distance between the air outlet 20b and the bottom of the housing assembly 100.

[0120] In some examples, the fan 200 and the computing module 400 are arranged at intervals in the vertical direction, and the fan 200 can be located directly above the computing module 400. The fan 200 is arranged adjacent to the top wall of the cavity of the housing assembly 100, and the computing module 400 is arranged adjacent to the bottom of the cavity of the housing assembly 100. The air outlet 20b is opened on the side of the housing assembly and arranged adjacent to the top, so that the air outlet 20b is arranged corresponding to the air outlet direction of the fan 200.

[0121] In other examples, the fan 200 and the computing module 400 are arranged in a vertically spaced relationship, and the fan 200 can be located obliquely above the computing module 400. The air outlet 20b is opened on the side of the housing assembly and is arranged near the top, so that the air outlet 20b is arranged corresponding to the air outlet direction of the fan 200.

[0122] In the description of this specification, the vertical direction may be consistent with the gravity or height direction, that is, the direction vertical to the horizontal ground, upward or downward. It is understandable that, relative to the lower temperature air, the higher temperature air has a lower density and usually floats upward. By adopting the above example, during the operation of the fan 200, an airflow path from bottom to top can be formed inside the housing assembly 100, which cooperates with the natural rising direction of the higher temperature air, so that the warm air flowing through the computing module 400 is easier to discharge, which can reduce the heat reflux inside the housing assembly 100 and improve the heat dissipation and heating efficiency of the computing device 1.

[0123] It should be noted that the above examples are only illustrative descriptions and should not be construed as limitations on the present application. Regarding the relative position relationship between the fan 200 and the computing module 400, in other examples of the present application, a side-by-side arrangement in the horizontal direction may also be adopted. Those skilled in the art may flexibly arrange it according to the appearance of the housing assembly 100 and the layout of the internal space.

[0124] In one embodiment, the fan 200 has an air inlet and an air outlet, wherein the air inlet is disposed adjacent to the air inlet 20c and the air outlet 20b is disposed adjacent to the air outlet. The air inlet direction and the air outlet direction of the air inlet form an angle.

[0125] Exemplarily, the fan 200 may be a cross-flow fan, and the air inlet direction of the air flow inlet and the air outlet direction of the air flow outlet are perpendicular to each other.

[0126] For some examples, see Figure 4 The cross-flow fan 200 may be disposed in the cavity of the housing assembly 100, and may be used to generate an airflow flowing from the air inlet 20c to the air outlet 20b. The air inlet direction of the air flow inlet and the air outlet direction of the air flow outlet may be perpendicular to each other. Specifically, the cross-flow fan may be provided with a cylindrical impeller with blades covered inside, and the impeller may be driven to rotate by a motor so that the airflow enters from the air flow inlet of the cross-flow fan and is finally discharged from the air flow outlet. During the operation of the cross-flow fan, the airflow generated by the cross-flow fan may rise from the bottom of the housing assembly 100, flow through the computing module 400 and the power module 300, enter the air flow inlet of the fan 200, and then blow to the outside of the housing assembly 100 through the air flow outlet to take away the heat generated by the computing module 400 and the power module 300.

[0127] It is understandable that a crossflow fan, also known as a crossflow fan or a tangential flow fan, is a fan with a special structure. Its working principle is to make the air in the wind wheel flow along the radial direction of the wind wheel. Through the action of the fan impeller, the airflow makes a curved flow inside the impeller and obtains airflow at the outlets on both sides of the wind wheel. A crossflow fan usually has a longer cylindrical impeller with a relatively small diameter. Since a crossflow fan has the advantages of uniform air volume, low noise, and compact structure, by using a crossflow fan as the fan 200, the uniformity of the air volume of the warm air blown out from the air outlet 20b can be improved, the noise during the operation of the computing device 1 can be reduced, and it is also beneficial to reduce the external dimensions of the computing device 1 and thus reduce the space occupied.

[0128] It should be noted that in other examples of the present application, the fan 200 is not limited to a cross-flow fan, but may also be an axial flow fan, a centrifugal fan, a mixed flow fan, a cross flow fan or a bladeless fan and other types of fans to generate an airflow flowing from the air inlet 20c to the air outlet 20b.

[0129] In an embodiment where the fan 200 is disposed on the upper side of the computing module 400, Figure 3 and Figure 4As shown, the cavity may include a first sub-cavity 100a and a second sub-cavity 100b that are connected. The first sub-cavity 100a may be located on the upper side of the second sub-cavity 100b. The fan 200 may be arranged in the first sub-cavity 100a, and the computing module 400 may be arranged in the second sub-cavity 100b.

[0130] For example, see Figure 3 and Figure 4 , the interior of the housing assembly 100 may adopt a frame structure, and the interior of the housing assembly 100 may be defined by the frame structure as a first sub-cavity 100a and a second sub-cavity 100b that are connected. The first sub-cavity 100a may be located on the upper side of the second sub-cavity 100b along the vertical direction, and the fan 200 may be arranged in the first sub-cavity 100a along the first direction L1. The second sub-cavity 100b may be located on the lower side of the first sub-cavity 100a along the vertical direction, and the power module 300 and the computing module 400 may be electrically connected to each other and arranged adjacently in the second sub-cavity 100b along the first direction L1.

[0131] In the embodiment of the present application, the opening position of the air outlet 20b can be set corresponding to the position of the exhaust area of ​​the fan 200, and its opening size can be set corresponding to the area size of the exhaust area of ​​the fan 200, ensuring that the airflow exhausted by the fan 200 can be discharged from the inside of the shell assembly 100, avoiding the high-temperature airflow from being retained or forming vortices in the shell assembly 100, thereby avoiding affecting the heat dissipation effect of the computing device 1.

[0132] In the embodiment of the present application, in order to ensure that the airflow generated by the fan 200 can flow through the computing module 400 and the power module 300, it is necessary to determine the position of the air inlet 20c based on the arrangement of the computing module 400 and the power module 300 in the shell assembly 100 and the position of the air outlet 20b.

[0133] In order to utilize the principle that higher temperature air naturally rises, the fan 200 can be located above the computing module 400 and the power module 300 in the vertical direction, and the air outlet 20b can be arranged above the air inlet 20c in the vertical direction, so that the computing module 400 and the power module 300 can be located above the air inlet 20c and below the air outlet 20b in the vertical direction, so that the airflow generated by the fan 200 can flow through the computing module 400 and the power module 300 in the process of flowing from the air inlet 20c to the air outlet 20b. During the operation of the fan 200, the air inlet direction at the air inlet 20c can be set to be toward the computing module 400 and the power module 300.

[0134] In some embodiments, see Figure 3 and Figure 4, when the fan 200 is disposed on the upper side of the computing module 400 and the power module 300, the air inlet 20c of the fan 200 can be opened at the bottom of the housing assembly 100. During the operation of the fan 200, the airflow generated by the fan 200 can rise from the bottom of the housing assembly 100, flow through the second sub-cavity 100b where the computing module 400 and the power module 300 are installed, and then blow to the outside of the housing assembly 100 through the first sub-cavity 100a where the fan 200 is installed, so as to take away the heat generated by the computing module 400 and the power module 300.

[0135] For example, the opening position of the air inlet 20c at the bottom of the shell assembly 100 can correspond to the installation position of the computing module 400, and its opening size can be designed corresponding to the size of the area to be dissipated in the computing module 400 to ensure that the low-temperature airflow can flow evenly through the area to be dissipated in the computing module 400.

[0136] For example, the opening position of the air inlet 20c at the bottom of the shell assembly 100 may correspond to the installation positions of the computing module 400 and the power module 300, and the opening size may be designed corresponding to the size of the area to be cooled of the computing module 400 and the area to be cooled of the power module 300, so as to ensure that the low-temperature airflow can flow evenly through the area to be cooled of the computing module 400 and the area to be cooled of the power module 300.

[0137] In some embodiments, the air inlet 20c may be disposed on the side of the housing assembly 100, adjacent to the bottom of the housing assembly 100. The air inlet 20c is disposed adjacent to the bottom of the housing assembly 100, and it can be understood that the distance between the air inlet 20c and the bottom of the housing assembly 100 is smaller than the distance between the air inlet 20c and the top of the housing assembly 100.

[0138] In some examples, the number of air inlets 20c can be multiple, and each of them is disposed at the bottom of the housing assembly 100. Multiple air inlets 20c can be disposed together at the bottom of the housing assembly 100 to increase the air intake efficiency and ensure the expansion space of the side of the housing assembly 100.

[0139] In some examples, there may be multiple air inlets 20 c , which are disposed on the sides of the housing assembly 100 and adjacent to the bottom of the housing assembly 100 to ensure that the airflow fully enters the housing assembly 100 .

[0140] In addition, it should be further explained that, in the example where the air inlet 20c is arranged on the side of the housing assembly 100, the air inlet 20c and the air outlet 20b can be arranged on the same side or different sides of the housing assembly 100. For example, the air inlet 20c and the air outlet 20b can be arranged together on the front side of the housing assembly 100, and the air inlet 20c is located below the air outlet 20b. For example, the air inlet 20c can be arranged on the rear side of the housing assembly 100, and the air outlet 20b can be arranged on the front side of the housing assembly 100, and the air inlet 20c is located below the air outlet 20b in the vertical direction.

[0141] It should be noted that the above is only an exemplary description and cannot be understood as a limitation of the present application. For example, in other examples of the present application, the number of air inlets 20c can be multiple, some of the air inlets 20c can be set at the bottom of the housing assembly 100, and another part of the air inlets 20c can be set at the side of the housing assembly. Those skilled in the art can flexibly set them according to actual conditions.

[0142] It should also be noted that, in order to ensure that an airflow from bottom to top can be formed inside the shell assembly 100 to dissipate heat, and the discharged warm air meets the actual heating needs of the user, the relative position relationship between the air inlet 20c and the air outlet 20b can also be flexibly set, which can ensure the heat dissipation efficiency of the computing device 1 and meet the actual heating needs of the user. For example, the air inlet direction of the air inlet 20c of the shell assembly 100 can be perpendicular to the air outlet direction of the air outlet 20b, that is, the preset angle between the air inlet direction of the air inlet 20c of the shell assembly 100 and the air outlet direction of the air outlet 20b can be 90 degrees. Of course, the examples of the relative position relationship between the air inlet 20c and the air outlet 20b are not limited to this.

[0143] In short, by setting the relative position relationship between the air outlet 20b, the air inlet 20c and the fan 200, the heat generated inside the device can be effectively discharged in accordance with the natural rising direction of the high-temperature air. At the same time, the warm air can be discharged from the top of the housing assembly 100, which can meet the heating needs of the user.

[0144] Figure 5A A bottom view of a computing device according to an embodiment of the present application is exemplarily provided. Figure 4 and Figure 5A As shown, in some examples, the air inlet 20c may be disposed at the bottom of the housing assembly 100. Figure 5AThe air inlet 20c may include a first air inlet 20c1 and a second air inlet 20c2, the first air inlet 20c1 and the second air inlet 20c2 are arranged side by side in the first direction L1, the opening position of the first air inlet 20c1 is arranged opposite to the position of the power module 300, and the opening position of the second air inlet 20c2 is arranged opposite to the position of the computing module 400. The number of the first air inlet 20c1 and the second air inlet 20c2 is at least one.

[0145] In one example, the number of the first air inlet 20c1 is one, and the opening area of ​​the first air inlet 20c1 is substantially the same as the cross-sectional area of ​​the power module 300. The number of the second air inlet 20c2 may be multiple, and the multiple second air inlets 20c2 may be arranged in at least one row along the first direction L1, each row including at least two second air inlets 20c2 adjacently arranged along the first direction L1, and the sum of the opening areas of the multiple second air inlets 20c2 is close to the cross-sectional area of ​​the computing module 400.

[0146] In another example, there are multiple first air inlets 20c1, and the sum of the opening areas of the multiple first air inlets 20c1 is close to the cross-sectional area of ​​the power module 300. There can be one second air inlet 20c2, and the opening area of ​​the second air inlet 20c2 is close to the cross-sectional area of ​​the computing module 400.

[0147] It should be noted that the above is only an exemplary description and cannot be understood as a limitation of the present application. In other examples of the present application, the number of the first air inlet 20c1 and the second air inlet 20c2 can be multiple, and the arrangement of the multiple first air inlets 20c1 and the multiple second air inlets 20c2 can be any arrangement, for respectively introducing airflow to the power module 300 and the computing module 400.

[0148] In addition, the embodiment of the present application does not specifically limit the shape of the air inlet 20c and the air outlet 20b, and the opening shape of the air inlet 20c and the air outlet 20b can be circular, square or any other geometric shape. It should be noted that the above is only an example and does not constitute a limitation of the present application.

[0149] In some examples, such as Figure 2As shown, an air inlet baffle 23 and an air outlet baffle 22 can be installed at the air inlet 20c and the air outlet 20b of the housing assembly 100, respectively. The air inlet baffle 23 and the air outlet baffle 22 can be designed as a window structure with a grille or a louver window structure, and the arrangement layout or inclination angle of the grille and the louver blades can be fixed or flexibly adjusted to guide the direction of the inlet and outlet airflow, so that the air inlet direction and the air outlet direction of the housing assembly 100 can be flexibly changed, effectively optimizing the path of airflow inlet and outlet, improving heat dissipation efficiency, and at the same time meeting the user's demand for the warm air outlet angle, providing a better user experience.

[0150] In other examples, an air inlet guide structure or an air outlet guide structure may be provided inside the housing assembly 100 to guide the airflow to flow in or out at a predetermined angle. Fig. 9 As shown, in the embodiment of the present application, the first side baffle 111 and the second side baffle 112 which are arranged opposite to each other in the second direction L2 may be provided inside the housing assembly 100, wherein the first side baffle 111 and the second side baffle 112 may be designed in a streamlined or folded line shape in accordance with the exhaust direction of the fan 200, so as to guide the high-temperature airflow that needs to be discharged from the housing assembly 100, thereby improving the heat dissipation effect of the computing device 1, and at the same time meeting the user's requirements for the air outlet angle in the heating scenario. Similarly, a guide plate may also be provided at the air inlet 20c of the housing assembly 100 to guide the airflow entering the housing assembly 100, so that more low-temperature air contacts the heat source, and the heat dissipation effect of the computing device 1 is optimized.

[0151] In one embodiment, Figure 5A As shown, the bottom wall of the internal cavity of the housing assembly 100 is also provided with an air inlet baffle 23. The air inlet baffle 23 has an air inlet grille, which defines a plurality of air inlet holes arranged in an array, and is used to filter the air entering from the air inlet 20c.

[0152] In some examples, the air inlet grille includes a plurality of ribs arranged horizontally and vertically, wherein the plurality of ribs arranged horizontally are spaced apart in the vertical direction, and the plurality of ribs arranged vertically are spaced apart in the horizontal direction, so that the plurality of ribs arranged horizontally and vertically together form the air inlet grille, and the plurality of air inlet holes defined by the air inlet grille may be rectangular in shape.

[0153] In other examples, the air inlet grille may be formed by providing a plurality of air inlet holes arranged in an array on the air inlet baffle 23. The shape of the air inlet hole may be circular, elliptical or any other geometric shape.

[0154] It should be noted that the above description is only an exemplary description and cannot be understood as limiting the present application. In other examples of the present application, the air inlet holes on the air inlet baffle 23 can also be a mixture of rectangular holes and circular (or elliptical) holes, for example, Figure 5A In the example, at the first air inlet 20c1 corresponding to the power module 300, the air inlet hole on the air inlet baffle 23 may be in a circular shape, and at the second air inlet 20c2 corresponding to the computing module 400, the air inlet hole on the air inlet baffle 23 may be in a rectangular shape. In addition, the arrangement, shape and size of the air inlet holes on the air inlet baffle 23 may be flexibly set by those skilled in the art according to actual conditions.

[0155] Figure 7 A partial structural diagram of a computing device according to an embodiment of the present application is provided as an example. Figure 7 As shown, in one embodiment, the computing module 400 includes a computing board 410 and a heat dissipation structure 420, and the heat dissipation structure 420 is thermally connected to the computing board 410.

[0156] For example, the computing device 1 provided in the embodiment of the present application can be applied to terminals such as high-performance data centers and server clusters to perform computing tasks. The computing board 410 can integrate multiple high-performance computing units, such as a central processing unit, a graphics processing unit, a field programmable gate array, and a dedicated integrated circuit, etc. The heat dissipation structure can be thermally connected to the computing board 410, and its material can be selected from metals with strong thermal conductivity, such as aluminum, copper, and silver, etc., which are not specifically limited in the embodiment of the present application.

[0157] In the embodiment of the present application, the heat dissipation structure 420 and the computing board 410 are thermally connected, which can be understood as the heat dissipation structure 420 and the computing board 410 are in contact, or there is a small gap between the two, so that the heat dissipation structure 420 and the computing board 410 can exchange heat. During the operation of the computing board 410, the heat dissipation structure 420 absorbs the heat generated by the computing board 410 and conducts the heat to the cavity inside the housing assembly 100.

[0158] In some examples, the heat dissipation structure 420 may be made of aluminum to accommodate application scenarios with higher weight control requirements.

[0159] In other examples, the heat dissipation structure 420 may be made of copper to obtain better heat dissipation performance.

[0160] It should be noted that the above selection of the material of the heat dissipation structure 420 is only for illustration and does not constitute a limitation to the present application. Those skilled in the art can flexibly select the material of the heat dissipation structure 420 according to actual conditions to achieve heat dissipation for the computing board 410.

[0161] For some examples, see Figure 7, the plane where the computing board 410 is located is set parallel to the vertical direction. It can be understood that since the air inlet 20c is located at the lower side of the air outlet 20b in the vertical direction, the airflow from the air inlet 20c to the air outlet 20b generated during the operation of the fan 200 flows from bottom to top along the vertical direction. By setting the plane where the computing board 410 is located parallel to the vertical direction, the wind resistance generated by the computing board 410 to the airflow can be reduced, and the flow rate of the airflow when flowing through the computing board 410 is guaranteed, thereby ensuring the cooling efficiency of the computing board 410.

[0162] In other examples, the plane where the computing board 410 is located is parallel to the direction from the air inlet 20c to the air outlet 20b. The direction from the air inlet 20c to the air outlet 20b can be tilted relative to the vertical direction and have a small inclination angle with the vertical direction, and the plane where the computing board 410 is located is substantially the same as the flow direction of the airflow from the air inlet 20c to the air outlet 20b.

[0163] Through the above example, the heat exchange efficiency between the airflow and the hash board 410 is ensured, and the heat dissipation efficiency of the hash board 410 can be improved.

[0164] In one embodiment, continue to refer to Figure 7 As shown, the heat dissipation structure 420 includes at least one heat dissipation fin group, which is arranged on at least one side of the computing board 410, and each heat dissipation fin group includes a plurality of heat dissipation fins 421 arranged at intervals. A guide gap may be defined between two adjacent heat dissipation fins 421 in each heat dissipation fin group, and the extension direction of the guide gap may be arranged parallel to the vertical direction.

[0165] Exemplarily, in each heat dissipation fin group, a plurality of heat dissipation fins 421 may be arranged side by side along the first direction L1, and any two adjacent heat dissipation fins are spaced from each other. The heat dissipation fins 421 may be in the form of sheets, and the plane where the heat dissipation fins 421 are located is arranged parallel to the vertical direction. Thus, a guide gap may be defined between two adjacent heat dissipation fins 421, and when the airflow flows through the heat dissipation fin group, it can quickly pass through the guide gap, which increases the contact area between the airflow and the heat dissipation fins 421 on the one hand, and ensures the flow rate of the airflow on the other hand, thereby increasing the heat exchange efficiency between the airflow and the heat dissipation structure 420.

[0166] In some examples, the heat dissipation structure 420 may include a heat dissipation fin group, which is disposed on a side of the computing board 410 where the computing unit is disposed, and the heat dissipation fin group may include a plurality of heat dissipation fins 421 disposed at intervals.

[0167] In other examples, the heat dissipation structure 420 may include two heat dissipation fin groups, and the two heat dissipation fin groups may be respectively arranged on opposite sides of the computing board 410, and each heat dissipation fin group may include a plurality of heat dissipation fins 421 arranged at intervals.

[0168] In one example, the heat dissipation structure 420 may include two heat dissipation fin groups arranged in parallel along the first direction L1 and thermally connected to the computing board 410. Among them, the two heat dissipation fin groups may be respectively arranged on opposite sides of the computing board 410 along the second direction L2, and each heat dissipation fin group may include a plurality of heat dissipation fins 421 arranged at intervals. The material of the heat dissipation fins 421 can be selected from metals with strong thermal conductivity, such as aluminum, copper and silver, and the surface of the heat dissipation fins 421 can be processed, such as coating with a thermal conductive coating or increasing the surface roughness, to further improve the heat dissipation efficiency. In addition, the thickness and spacing of the heat dissipation fins 421 can be designed by those skilled in the art according to specific heat dissipation requirements. The embodiment of the present application does not impose specific restrictions on the material, thickness, etc. of the heat dissipation fins 421, so as to achieve the role of ensuring heat dissipation performance.

[0169] In some examples, the plurality of heat sink fins 421 may be integrally formed with the hash board 410, or thermally connected to the hash board 410 by welding, so that the heat sink fins 421 and the hash board 410 form an integrated structure without any seams or interfaces, thereby minimizing thermal resistance and improving heat conduction efficiency while forming a firm connection.

[0170] In other examples, a plurality of heat sink fins 421 may be plugged into the computing board 410, or may be bonded to one side of the computing board 410 along the first direction L1 by means of a thermally conductive adhesive. This method may enable flexible addition or reduction of the heat sink fins 421, thereby improving the scalability of the computing board 410.

[0171] In some other examples, such as Figure 7 As shown, the heat dissipation structure 420 may include two heat dissipation mounting plates installed on opposite sides of the computing board 410, and two heat dissipation fin groups are respectively arranged on the two heat dissipation mounting plates. The two heat dissipation mounting plates are fixedly connected to the computing board 410 by fastening screws 422.

[0172] It should be noted that the above-mentioned connection method between the heat sink fin 421 and the computing board 410 is only an example and does not constitute a limitation to the present application. Those skilled in the art can flexibly set the connection method between the heat sink fin 421 and the computing board 410 according to actual conditions to achieve a thermal connection between the two.

[0173] Exemplarily, the ends of the heat sinks 421 in each heat sink fin group away from the computing board 410 are spaced apart from the inner wall of the cavity.

[0174] Thus, the ends of the heat sinks 421 in each heat sink fin group away from the computing board 410 can be kept separated from the inner wall of the cavity to avoid the adverse effects caused by the heat sinks 421 with higher temperatures contacting the inner wall of the housing assembly 100. At the same time, it can ensure that the airflow generated by the fan 200 can fully flow through the gap between the heat sink fins 421 and the inner wall of the housing assembly 100, thereby improving the heat dissipation efficiency.

[0175] For example, see Figure 7 The heat dissipation structure 420 may further include a plurality of support beams 430 disposed at the bottom of the computing board 410, wherein the plurality of support beams 430 are spaced apart along the first direction L1, each support beam 430 extends along the second direction L2, and each support beam 430 is supported on the bottom wall of the cavity.

[0176] In this way, stable support can be provided for the installation of the computing module 400 in the cavity inside the shell assembly 100, and the heat dissipation structure 420 can be kept separated from the bottom wall of the cavity of the shell assembly 100 to avoid the adverse effects caused by the higher temperature heat dissipation fins 421 contacting the bottom wall of the shell assembly 100. At the same time, it can be ensured that the airflow generated by the fan 200 can fully flow through the gap between the heat dissipation fins 421 and the inner wall of the shell assembly 100, thereby improving the heat dissipation efficiency.

[0177] Figure 8 A longitudinal cross-sectional view of a computing device according to an embodiment of the present application is exemplarily provided, as shown in FIG. Figure 7 and Figure 8 As shown, in one embodiment, the computing device 1 provided in the embodiment of the present application further includes a power module 300. The power module 300 is disposed inside the housing assembly 100. For example, Figure 4 As shown, the power module 300 may be disposed in the second sub-cavity 100 b of the housing assembly 100 .

[0178] For some examples, see Figure 7 and Figure 8 The power module 300 is arranged side by side with the computing module 400 in the first direction L1 of the housing assembly 100 , and the airflow generated by the fan 200 can flow through the power module 300 and the computing module 400 .

[0179] See also Figure 3 The power module 300 can be electrically connected to the computing module 400, the fan 200, the control module 500 and other functional modules of the computing device 1. During the operation of the computing device 1, the power module 300 generates heat. To achieve a better heat dissipation effect, the airflow generated by the fan 200 can flow through the power module 300 and the computing module 400 at the same time to ensure that the heat dissipation duct generated by the fan 200 can cover the heat source area of ​​the computing device 1, thereby effectively dissipating heat.

[0180] For example, Figure 5A and Figure 5B As shown, the power module 300 has a power input unit 301 and a switch unit 302. The power input unit 301 can adopt a three-phase input interface for electrically connecting to a power plug. The switch unit 302 is used to enable or disable the computing device 1. The power input unit 301 and the switch unit 302 can be arranged at the bottom of the housing assembly 100.

[0181] Continue to refer to Figure 5A and Figure 5B As shown, the computing device 1 also includes a wireless communication unit 60 and an ambient temperature detection unit 70 electrically connected to the power module 300. The bottom of the housing assembly 100 is provided with an installation area for installing the wireless communication unit 60 and the ambient temperature detection unit 70. The wireless communication unit 60 may be a Bluetooth device or a wireless WIFI connection device, and the ambient temperature detection unit 70 may be a temperature sensor for detecting the ambient temperature of the environment in which the computing device 1 is located, and feeding back the ambient temperature detection result to the control module 500. The control module 500 may control the computing power of the computing module 400 and / or the rotation speed of the fan 200 according to the ambient temperature detection result.

[0182] For example, when the ambient temperature detection result is lower than the temperature threshold, the control module 500 can control the fan 200 to increase the rotation speed to improve the heat exchange efficiency between the airflow and the computing module 400, or the control module 500 can control the computing module 400 to increase the computing power to increase the heat generation of the computing module 400, thereby increasing the air outlet temperature of the computing device 1, thereby improving the heating effect in a low temperature environment.

[0183] For example, see Figure 5A and Figure 5B The power input unit 301 , the switch unit 302 , the wireless communication unit 60 , the ambient temperature detection unit 70 and the air inlet 20 c may be arranged at intervals at the bottom of the housing assembly 100 .

[0184] like Figure 8 As shown, in one embodiment, the power module 300 may have a plug interface 303, and the computing board 410 may have a plug end 411, and the plug end 411 may be plugged and matched with the plug interface 303 to electrically connect the computing board 410 to the power module 300.

[0185] Exemplarily, the power module 300 can be electrically connected to the computing board 410 of the computing module 400 through a standardized electrical connection interface to ensure the stability of power transmission.

[0186] Through the above implementation, the hash board 410 and the power module 300 do not need to be connected by wires, which simplifies the connection method between the hash board 410 and the power module 300, improves the convenience of disassembly and assembly between the two, and facilitates subsequent inspection and maintenance.

[0187] Fig. 9 A lateral cross-sectional view of an inner shell of a computing device according to an embodiment of the present application is exemplarily provided. Fig.10 An exemplary side view of a power module and a fan of a computing device according to an embodiment of the present application being integrated and installed in an inner shell is provided, as shown in FIG. Figure 2 , Fig. 9 and Fig.10 As shown, in one embodiment, the housing assembly 100 may include an inner shell 10 and an outer shell 20, the computing module 400, the fan 200 and the power module 300 are integrated in the inner shell 10, the interior of the outer shell 20 may define a cavity, and the outer shell 20 has a first mounting opening 20a on one side in the first direction L1, and the inner shell 10 can be slidably installed in the cavity through the first mounting opening 20a.

[0188] For example, the inner shell 10 may adopt a frame structure to provide a mounting base for the components of the computing device 1 and provide a stable support for the overall structure of the computing device 1. The frame structure of the inner shell 10 may be provided with mounting brackets or mounting holes for fixing various modules of the computing device 1.

[0189] In some examples, the computing module 400, the power module 300, and the fan 200 of the computing device 1 can be integrated and arranged in the frame structure of the inner shell 10 by screw connection. In the screw connection mode, the module of the computing device 1 is more firmly fixed, which can ensure that the computing device 1 is not affected by vibration or impact during transportation.

[0190] In other examples, the computing module 400, the power module 300 and the fan 200 of the computing device 1 can be integrated and arranged in the frame structure of the inner shell 10 by means of snap connection. In the snap connection mode, the installation and removal of the computing device 1 module are more convenient, which is conducive to the maintenance of the computing device 1 and the replacement of the module.

[0191] It should be noted that the above is only an exemplary description. The embodiment of the present application does not specifically limit the connection method between the functional module of the computing device 1 and the inner shell 10. Those skilled in the art can flexibly select other connection methods according to actual needs.

[0192] In the examples of this application, see Figure 2The outer shell 20 may be provided with a first installation opening 20a on one side in the first direction L1, and the first installation opening 20a is connected to the internal cavity. The opening area of ​​the first installation opening 20a is larger than the cross-sectional area of ​​the inner shell 10 after the power module 300, the computing module 400 and the fan 200 are integrated and installed, so as to ensure that the inner shell 10 with the power module 300, the computing module 400 and the fan 200 integrated and installed can slide into the inner part of the outer shell 20 through the first installation opening 20a.

[0193] Exemplarily, the cavity of the outer shell 20 can extend along the first direction L1, and the outer shape of the inner shell 10 also extends along the first direction L1. The size and shape of the inner shell 10 are adapted to the size and shape of the cavity of the outer shell 20 to ensure that the inner shell 10 can smoothly slide into and be completely received in the cavity after the computing device 1 is assembled to form an integral shell assembly 100.

[0194] For example, the cavity shape of the outer shell 20 can be designed as a cuboid, a cube or a cylinder, etc. The outer shape of the inner shell 10 can be designed as a cuboid frame, a cube frame or a cylinder, etc. The outer shape of the inner shell 10 is adapted to the cavity shape of the outer shell 20, so that the inner shell 10 can be accommodated in the cavity of the outer shell 20 and can slide in the cavity along the first direction L1.

[0195] It should be noted that the above examples of the cavity shape of the outer shell 20 and the external shape of the inner shell 10 are only for illustration and cannot be understood as limiting the present application. The cavity shape of the outer shell 20 and the external shape of the inner shell 10 can be flexibly set according to actual conditions, and other inner shell 10 and outer shell 20 matching installation methods can be selected according to actual needs. The outer shell 20 provides external protection for the computing device 1, and can prevent external environmental factors, such as dust, moisture, impact, etc., from damaging the functional modules of the computing device 1.

[0196] In the embodiment of the present application, the outer shell 20 and the inner shell 10 may be connected via a sliding structure to ensure that the inner shell 10 can slide smoothly within the outer shell 20 .

[0197] In some examples, the inner shell 10 can slide into or out of the cavity of the outer shell 20 along a specific track or guide device, wherein the outer wall surface of the inner shell 10 and the inner wall surface of the outer shell 20 may be provided with mutually cooperating sliding structures, and the sliding structure may include slide rails, pulleys and other devices to guide the inner shell 10 to slide into or out of the cavity, ensuring that the sliding process is smooth and smooth, thereby achieving the installation and fixation of the inner shell 10 in the cavity of the outer shell 20.

[0198] In other examples, the outer wall surface of the inner shell 10 and the inner wall surface of the outer shell 20 may be provided with mutually cooperating limiting structures, wherein the limiting structures may include limiting flanges, screw limiting columns and other structures. Through the cooperating abutment of the outer wall surface of the inner shell 10 and the inner wall surface of the outer shell 20 by the limiting structures, the inner shell 10 can be firmly installed in the cavity of the outer shell 20 to prevent the computing device 1 from falling off or shifting during operation or transportation.

[0199] It should be noted that the embodiment of the present application does not specifically limit the sliding matching structure and the limiting structure of the inner shell 10 and the outer shell 20. Those skilled in the art can flexibly set the specific form of the sliding structure according to actual needs.

[0200] In some embodiments, at least one limiting column is provided on the outer surface of the side wall of the inner shell 10 and / or the inner surface of the side wall of the outer shell 20. The limiting column on the side wall of the inner shell 10 can form an abutment fit with the inner surface of the side wall of the outer shell 20 or leave a certain gap, and the limiting column on the side wall of the outer shell 20 can form an abutment fit with the outer surface of the side wall of the inner shell 10 or leave a certain gap.

[0201] For example, Figure 3 and Figure 4 As shown, the side wall 12 of the inner shell 10 may be provided with a first limiting column 123 (extending along the first direction L1 and protruding toward the inner wall surface of the outer shell 20). Figure 3 ), the outer shell 20 may be provided with second limiting posts 212 extending along the first direction L1 and protruding in the direction toward the outer wall surface of the inner shell on two side walls opposite to each other in the second direction L2. Among them, the number of the first limiting posts 123 on the inner shell 10 may be two and they are arranged in pairs in the second direction L2 of the inner shell 10, and the number of the second limiting posts 212 on the outer shell 20 may be two and they are arranged in pairs in the second direction L2 of the outer shell 20. The embodiment of the present application does not specifically limit the number and position of the first limiting posts 123 and the second limiting posts 212.

[0202] Exemplarily, the first limiting column 123 may be arranged to protrude from the side wall 12 of the inner shell 10, and abut against the inner wall surface of the outer shell 20 in the second direction L2, or leave a proper gap between the inner wall surface of the outer shell 20 in the second direction L2. Similarly, the second limiting column 212 may be arranged to protrude from the inner side wall of the outer shell 20, and abut against the side wall 12 of the inner shell 10, or leave a proper gap between the side wall 12 of the inner shell 10. After the inner shell 10 is installed in the cavity of the outer shell 20, the first limiting column 123 and the second limiting column 212 may simultaneously serve as limiting structures to limit the installation position of the inner shell 10 in the cavity of the outer shell 20, so that the inner shell 10 can be firmly installed in the cavity of the outer shell 20 to prevent the computing device 1 from falling off or shifting during operation or transportation.

[0203] Exemplarily, the first limiting column 123 and the second limiting column 212 may be provided with screw holes, which are arranged to penetrate along the first direction L1. A through hole corresponding to the position of the screw hole may be provided on the side panel installed at the first mounting opening 20a. The through hole is used for screws to pass through so that the screws form a threaded connection with the screw holes, thereby fixing the side panel to the first mounting opening 20a to close the first mounting opening 20a.

[0204] In addition, see Figure 2 A second mounting opening (not shown in the figure) is further provided on the other side of the housing 20 opposite to the first mounting opening 20a, and the second mounting opening is communicated with the cavity of the housing 20. Correspondingly, a side plate for closing the second mounting opening is also provided, and the side plate can also be provided with through holes corresponding to the positions of the screw holes, and the through holes are used for screws to pass through so that the screws and the screw holes are threadedly connected, thereby fixing the side plate to the second mounting opening.

[0205] For example, the frame of the inner shell 10 can be made of metal materials, such as aluminum alloy or steel. The metal frame of the inner shell 10 has good mechanical strength and thermal conductivity, and can cooperate with the fan 200 of the computing device 1 to complete heat dissipation while providing a stable support for the computing device 1, thereby improving the heat dissipation efficiency of the computing device 1 during operation.

[0206] For example, the housing 20 can be made of metal materials (such as aluminum alloy or steel) or polymer materials. When the housing 20 is made of metal materials, it can ensure that the housing 20 has good structural rigidity and certain thermal conductivity, thereby effectively protecting the internal components and assisting heat dissipation. When the housing 20 is made of polymer materials, the computing device 1 can have a lighter weight and good durability, which is suitable for application scenarios with high requirements for weight and durability.

[0207] It should be noted that the above material examples for the inner shell 10 and the outer shell 20 are only for illustration and do not constitute a limitation to the present application.

[0208] Through the above implementation, the computing module 400, power module 300, fan 200 and other modules of the computing device 1 are integrated and arranged in the inner and outer double-layer protective shells, which improves the integration and scalability of the computing device 1. The frame structure of the inner shell 10 and the cavity design of the outer shell 20 jointly provide good physical protection to ensure the reliability of the computing device 1 in various working environments. Through the sliding installation method, the inner shell 10 can be easily installed and disassembled, which improves the maintenance convenience of the equipment. The frame structure design of the inner shell 10 and the effective layout of the fan 200 enhance the air flow, improve the heat dissipation efficiency of the computing module 400 and the power module 300, and achieve good heat dissipation effect in the limited space of the computing device 1.

[0209] In one embodiment, Fig. 9 and Fig.10 As shown, the interior of the inner shell 10 may define a accommodating cavity 10a, and the computing module 400 and the power module 300 may be arranged side by side in the accommodating cavity 10a along the first direction L1; the top of the inner shell 10 defines a mounting groove 10b, and the fan 200 is arranged in the mounting groove 10b.

[0210] For example, the top of the inner shell 10 may define a mounting groove 10b, and the fan 200 may be arranged in the mounting groove 10b along the first direction L1. The interior of the inner shell 10 may define a receiving cavity 10a, and the power module 300 and the computing module 400 may be electrically connected to each other. The electrically connected power module 300 and the computing module 400 may be arranged in the receiving cavity 10a of the inner shell 10 along the first direction L1. The power module 300 and the computing module 400 may be electrically connected through a gold finger, and the embodiment of the present application does not specifically limit the connection method between the power module 300 and the computing module 400.

[0211] Exemplarily, the fan 200 may be disposed on the top of the computing module 400 and the power module 300, and its air inlet may be disposed directly opposite the top of the computing module 400 and the power module 300, and the air outlet may be disposed perpendicular to the direction of the air inlet. During the operation of the fan 200, the airflow formed by the fan 200 may rise from the bottom of the inner shell 10, flow through the computing module 400 and the power module 300, enter the air inlet 20c of the fan 200, and then blow to the outside of the inner shell 10 through the air outlet 20b to take away the heat generated by the computing module 400 and the power module 300.

[0212] For example, Figure 2 As shown, the outer side wall 12 of the accommodating cavity 10a of the inner shell 10 may also be provided with a power decorative cover plate 13. Exemplarily, the power decorative cover plate 13 may be provided on the outer side wall 12 of the inner shell 10 at the installation position corresponding to the power module 300 or the computing module 400, and the power decorative cover plate 13 may be a flexible structure for covering and protecting the cables passing thereunder. Specifically, the power decorative plate may be made of silicone, rubber or other flexible polymer materials, which can effectively absorb external shocks and vibrations, effectively protect circuit boards and other vulnerable components, and prevent them from being disturbed by the external environment.

[0213] It should be noted that, continue to refer to Figure 2 The fan 200 may be provided with a snap-fit ​​protrusion 210 at one end along the first direction L1, and the snap-fit ​​protrusion 210 may protrude from the frame of the inner shell 10 at one end along the first direction L1. The power module 300, the computing module 400, and the fan 200 may be fixed to the frame of the inner shell 10 by bolts to prevent the computing device 1 from falling off or shifting during operation or transportation.

[0214] Through the above embodiment, by defining the accommodating cavity 10a inside the inner shell 10, the computing module 400 and the power module 300 can be effectively integrated in the compact space at the bottom of the fan 200, so that the heat dissipation duct formed by the fan 200 can cover the heat source area of ​​the computing device 1. The mounting groove 10b at the top of the inner shell 10 provides a fixed position for the fan 200, so that the fan 200 can operate stably and generate airflow that passes through the internal space of the computing device 1, effectively taking away heat.

[0215] Refer to the following Figure 4 , Fig. 9 and Fig.10 , a specific example is used to describe the assembly process of the computing device 1 of the embodiment of the present application. Fig. 9 and Fig.10 As shown, after the power module 300 and the computing module 400 are electrically connected, they can be inserted into the accommodating cavity 10a of the inner shell 10; the fan 200 can be inserted into the mounting groove 10b of the inner shell 10, and then the fan 200 and the power module 300 are electrically connected. In this way, the fan 200, the power module 300 and the computing module 400 are integrated and installed on the inner shell 10. Then, as shown in FIG. Figure 4 As shown, the integrated fan 200, power module 300, and computing module 400 (see Figure 7 , the computing module 400 and the power module 300 are arranged side by side in the L2 direction, Figure 4 The computing module 400 (not shown) and the inner shell 10 are penetrated into the interior of the outer shell 20 through the first installation opening 10 of the outer shell 20 to complete the integrated installation of various functional modules of the computing device 1 on the shell assembly 100.

[0216] In one embodiment, Fig. 9 and Fig.10 As shown, a first side baffle 111 and a second side baffle 112 may be disposed on the top of the inner shell 10 . The first side baffle 111 and the second side baffle 112 may be disposed opposite to each other in the second direction L2 , and a mounting groove 10 b may be defined between the first side baffle 111 and the second side baffle 112 .

[0217] Exemplarily, the inner shell 10 may be a rectangular parallelepiped frame structure, and the second direction L2 may be perpendicular to the first direction L1, or parallel to the width direction of the inner shell 10, wherein the width direction of the inner shell 10 may be a direction perpendicular to the length direction of the inner shell 10 and in the same plane. It should be noted that the above application examples provided in the embodiments of the present application are for ease of understanding, and the embodiments of the present application do not specifically limit the specific direction of the second direction L2 and its positional relationship with the first direction L1.

[0218] The first side baffle 111 and the second side baffle 112 may be integrally formed with the frame of the inner shell 10 or fixed to the top of the inner shell 10 by fasteners. The present application does not specifically limit the specific connection relationship between the first side baffle 111, the second side baffle 112 and the inner shell 10. An installation groove 10b for installing the fan 200 may be defined between the first side baffle 111 and the second side baffle 112 to ensure that the fan 200 can be stably installed in the groove.

[0219] In some examples, the first side baffle 111 and the second side baffle 112 may be made of metal material and have elastic deformation capability, and the size of the mounting groove 10b formed therebetween may match the size of the fan 200 in the second direction L2. A shock-absorbing gasket may be provided between the fan 200 and the mounting groove 10b to reduce vibration and noise generated when the fan 200 is running.

[0220] In other examples, the first side baffle 111 and the second side baffle 112 can be streamlined or folded in a design to match the air outlet direction of the fan 200 to guide the high-temperature airflow that needs to be discharged from the shell assembly 100, optimize the discharge path of the high-temperature airflow, and further optimize the heat dissipation effect of the computing device 1.

[0221] Through this structural design, the fan 200 can be stably installed in the installation groove 10b at the top of the inner shell 10, and the computing module 400 and the power module 300 can be dissipated more effectively during operation, ensuring that the equipment can maintain a stable temperature even when operating at high load, thereby improving the overall performance and reliability of the computing device 1.

[0222] For example, Figure 3 As shown, the side wall of the inner shell 10 may be provided with a wire passing area 14 corresponding to the position of the power module 300, and the wire passing area 14 is arranged through the side wall of the inner shell 10 to connect the installation cavity 10a of the inner shell 10 and the external space. In this way, the wires of the power module 300 can extend through the wire passing area 14, so that the power module 300 can be electrically connected to other modules through the wires.

[0223] For example, Fig. 9 As shown, the bottom wall of the inner shell 10 may be provided with a positioning member 15, and the positioning member 15 forms a sliding fit with the bottom of the computing module 400. The positioning member 15 may be a groove-shaped structure, and a slide groove extending along the first direction L1 is provided at the top of the groove-shaped structure. The bottom of the computing module 400 forms a sliding fit with the slide groove, so that the computing module 400 is positioned during the process of sliding the computing module 400 to the accommodating cavity 10a, thereby improving the assembly accuracy of the computing module 400 in the inner shell 10. In one embodiment, as Fig.10 As shown, the first side baffle 111 and the second side baffle 112 can respectively abut against the outer wall surface of the fan 200 .

[0224] Exemplarily, the first side baffle 111 and the second side baffle 112 may have elastic deformation capability to adapt to the assembly of fans 200 of different sizes. When the fan 200 is installed in the installation slot 10b, the outer wall surface of one side of the fan 200 may be abutted against one of the side baffles, and then the fan 200 may be slid into the installation slot 10b along the first direction L1, so that the outer wall surface of the other side of the fan 200 abuts against the other side baffle. In order to enhance the fixing effect, additional snap-on holes or screw holes may be provided on the first side baffle 111 and the second side baffle 112, and the fan 200 may be further stably installed by snap-on engagement or bolt tightening.

[0225] In some examples, the first side baffle 111 and the second side baffle 112 can be made of metal materials, which can be closely abutted against the outer wall of the fan 200 to help fix the fan 200 and prevent displacement and falling off during transportation. The side baffles can also conduct part of the heat from the fan 200 to further improve the heat dissipation effect.

[0226] In other examples, the first side baffle 111 and the second side baffle 112 may be made of polymer materials, which can enable the computing device 1 to have a lighter weight and better durability, and is suitable for application scenarios with higher requirements on weight and durability.

[0227] It should be noted that the above-mentioned material examples for the first side baffle 111 and the second side baffle 112 are for illustration only and do not constitute limitations to the present application. For example, the first side baffle 111 and the second side baffle 112 may also be made of a plastic material with good elastic deformation ability, and those skilled in the art may flexibly set it according to actual conditions.

[0228] In one embodiment, Fig. 9 and Fig.10 As shown, the inner shell 10 has two side walls 12 arranged opposite to each other in the second direction L2, and the inner wall surfaces of the two side walls 12 can be respectively provided with support ribs 121, and the two support ribs 121 are respectively provided adjacent to the top of the inner shell 10. The mounting groove 10b can be defined by the first side baffle 111, the second side baffle 112 and the two support ribs 121.

[0229] Exemplarily, the material of the support rib 121 can be selected from high-strength, high-temperature resistant materials, such as aluminum alloy, stainless steel or heat-resistant polymer materials, which can have sufficient mechanical strength to support and fix the fan 200 and maintain stable performance in a high temperature environment. The cross-sectional shape of the support rib 121 can be designed to be rectangular, circular or other specific shapes to optimize its mechanical properties and structural stability. The support rib 121 and the side wall 12 of the inner shell 10 can be fixed or connected by welding, screw connection or integral molding to ensure the strength and stability of the connection and prevent the fan 200 from loosening or falling off due to external forces.

[0230] In the embodiment of the present application, the inner wall surfaces of the two side walls 12 of the inner shell 10 in the second direction L2 may be respectively provided with supporting ribs 121 opposite to each other. The accommodating cavity 10a of the inner shell 10 may be defined by the two side walls 12 opposite to each other in the second direction L2 and the two supporting ribs 121, and the computing module 400 and the power module 300 may be arranged in the accommodating cavity 10a of the inner shell 10. Exemplarily, the two supporting ribs 121 may be respectively provided adjacent to the top of the inner shell 10, and a certain gap may be left between the supporting ribs 121 and the top of the computing module 400 to avoid the adverse effects caused by the top of the high-temperature computing module 400 contacting the shell assembly 100, and at the same time, it can ensure that the airflow generated by the fan 200 can fully flow through the computing module 400 and the power module 300, thereby improving the heat dissipation efficiency. In a specific example, the mounting groove 10b can be defined by a first side baffle plate 111, a second side baffle plate 112 and two supporting ribs 121. The outer wall surface of the fan 200 can be respectively abutted against the first side baffle plate 111 and the second side baffle plate 112. At the same time, the bottom of the fan 200 can be supported by two supporting ribs 121, so that the fan 200 can obtain a stable supporting point in the mounting groove 10b, thereby realizing the assembly and fixation of the fan 200 in the mounting groove 10b.

[0231] Exemplarily, the support rib 121 may be formed by the inner wall surface of the side wall 12 protruding inwardly, and the length direction of the support rib 121 may be parallel to the first direction L1. Exemplarily, the fan 200 may be arranged in the installation groove 10b along the first direction L1, and the side wall 12 of the installation groove 10b may protrude inwardly to form the support rib 121, providing stable support for the bottom of the fan 200, and at the same time, the length direction of the support rib 121 may be parallel to the first direction L1, ensuring that the support rib 121 provides continuous support for the fan 200, avoiding local stress concentration, and ensuring the stability of the fan 200 assembly.

[0232] In one embodiment, Fig. 9 and Fig.10 As shown, the two side walls 12 of the inner shell 10 may be respectively provided with a limiting folding edge 122 , and the limiting folding edge 122 may extend downwardly from the side wall 12 in a direction toward the inner wall surface of the outer shell 20 .

[0233] like Figure 4 As shown, the two inner wall surfaces opposite to each other in the second direction L2 of the outer shell 20 may be respectively provided with stoppers 211, and the stoppers 211 extend upwardly obliquely from the inner wall surface of the outer shell 20 in the direction toward the outer wall surface of the inner shell 10, and the stoppers 211 may be located on the lower side of the limiting fold 122.

[0234] Exemplarily, the outer wall surfaces of the two side walls 12 of the inner shell 10 can be respectively provided with a limit fold 122. Specifically, the limit fold 122 can be provided at the top, middle or bottom of the side wall 12, and the present application does not limit the specific setting position of the limit fold 122 on the side wall 12 of the inner shell 10.

[0235] For example, see Figure 2 The limiting folding edge 122 can be disposed on the side wall 12 and extend downwardly from the side wall 12 toward the inner wall surface of the housing 20. Figure 4 The positions of the limiting folded edges 122 on the two inner wall surfaces opposite to each other in the second direction L2 of the outer shell 20 may be respectively provided with stop members 211. The stop members 211 may extend upwardly from the inner wall surface of the outer shell 20 in a direction toward the outer wall surface of the inner shell 10. The inclination angle of the stop member 211 may match the inclination angle of the limiting folded edge 122 to cooperate in limiting the installation position of the inner shell 10 in the outer shell 20.

[0236] For example, the shape and structure of the stopper 211 can be set according to the actual situation of the space in the cavity of the housing 20. Figure 4 The stopper 211 can be bent once at its end close to the inner wall of the outer shell 20, and the other end can continue to extend upward along the direction of the outer wall of the inner shell 10. This bending structure can provide a clear locking point to ensure that when the inner shell 10 is slidably installed on the outer shell 20, the stopper 211 can cooperate with the installation of the corresponding extension part of the limiting fold 122.

[0237] For example, see Figure 4 The limiting fold 122 of the inner shell 10 can abut against the stopper 211 of the outer shell 20 to improve the stability of the installation of the inner shell 10. The limiting fold 122 of the inner shell 10 can also be kept separate from the stopper 211 of the outer shell 20 to avoid the adverse effects caused by the inner shell 10 with a higher temperature contacting the outer shell 20, and at the same time, it can ensure that the airflow generated by the fan 200 can fully flow through the gap between the inner shell 10 and the outer shell 20 to improve the heat dissipation efficiency.

[0238] It is understandable that, during the process of sliding the inner shell 10 and the outer shell 20, the limiting fold 122 of the inner shell 10 is aligned with the stopper 211 of the outer shell 20, providing a guiding effect so that the inner shell 10 can slide smoothly into the outer shell 20. During the transportation of the shell assembly 100, when the inner shell 10 moves in the vertical or horizontal direction due to bumps, since the limiting fold 122 is opposite to the inclination direction of the stopper 211, the limiting fold 122 can gradually approach and finally contact the stopper 211. The limiting fold 122 can be accurately inserted into the top of the stopper 211, which can prevent the inner shell 10 from being displaced due to vibration or external force during use. This design simplifies the installation process of the inner shell 10 and improves the overall structural stability and reliability of the device, thereby ensuring the normal operation and service life of the device.

[0239] In one embodiment, Figure 4 As shown, the side wall of the housing 20 may be provided with an air outlet 20b connected to the cavity, and the bottom wall of the housing 20 may be provided with an air inlet 20c connected to the cavity. For example, the side wall 12 of the housing 20 along the second direction L2 may be provided with an air outlet 20b connected to the cavity, and one or more air outlets 20b connected to the cavity may be provided on one or both sides of the housing 20 along the second direction L2, and the embodiment of the present application does not impose specific restrictions on this. When the fan 200 performs the heat dissipation task, the airflow can enter the housing assembly 100 from the air inlet 20c of the bottom wall of the housing 20, and the warm air formed by the computing module 400 can be blown out from the side wall of the housing 20.

[0240] For example, see Figure 4 The bottom of the inner shell 10 may have a bottom open area connected to the accommodating cavity 10a, and the side of the inner shell 10 may have a side open area connected to the accommodating cavity 10a. The bottom open area is connected to the air inlet 20c correspondingly, and the side open area is connected to the air outlet 20b correspondingly.

[0241] In the embodiment of the present application, the cross-flow fan 200 can be arranged in the frame structure of the inner shell 10, and the specific position can be optimized according to the heat source distribution of the computing module 400 and the power module 300 to ensure the best heat dissipation effect. The internal cavities of the housing assembly 100 can be interconnected, and the inner shell 10 and the outer shell 20 can define a connected heat dissipation duct based on the heat source module of the computing device 1. The airflow generated by the fan 200 can effectively pass through the duct to take away the heat generated by the computing module 400 and the power module 300 during operation. The bottom of the inner shell 10 may have a bottom open area connected to the accommodating cavity 10a, and the side of the inner shell 10 may have a side open area connected to the accommodating cavity 10a. The bottom open area can be connected to the air inlet 20c of the outer shell 20, and the side open area can be connected to the air outlet 20b.

[0242] For example, see Figure 4 The bottom open area and the side open area of ​​the inner shell 10 can be set corresponding to the air inlet 20c and the air outlet 20b of the fan 200, and the size of the bottom open area and the side open area of ​​the inner shell 10 can be larger than the size of the air inlet 20c and the air outlet 20b of the fan 200. The size of the air inlet 20c and the air outlet 20b of the outer shell 20 can be set corresponding to the size of the bottom open area and the side open area of ​​the inner shell 10. Specifically, the area of ​​the air inlet 20c and the air outlet 20b of the outer shell 20 can be larger than the area of ​​the bottom open area and the side open area of ​​the inner shell 10.

[0243] It should be noted that the above examples do not constitute a limitation of the present application. The outer shell 20 and the inner shell 10 can achieve air flow communication through the open areas at the bottom and sides. When the fan 200 performs the heat dissipation task, the airflow can enter from the air inlet 20c of the outer shell 20, enter the accommodating cavity 10a of the inner shell 10 through the bottom open area of ​​the inner shell 10, take away the heat generated by the operation of the computing module 400, and then pass through the side open area of ​​the inner shell 10 and finally be discharged from the air outlet 20b of the outer shell 20.

[0244] In the embodiment of the present application, the inner shell 10 and the outer shell 20 may be equipped with multiple temperature sensors at key positions of the computing module 400 and the power module 300, for real-time monitoring of the temperature of the computing module 400 and the power module 300, and feedback to the control module 500. The fan 200 may be connected to the control module of the computing device 1, and the control module 500 may automatically adjust the speed of the fan 200 according to the real-time temperature monitoring data, to ensure that the computing device 1 can maintain the optimal temperature under different workloads.

[0245] For example, Figure 5B A bottom view of a computing device according to another embodiment of the present application is exemplarily provided, such as Figure 5B As shown, an ambient temperature detection unit 70 may be provided at the bottom of the housing 20 for detecting the ambient temperature of the environment in which the computing device 1 is located. The ambient temperature detection unit 70 is electrically connected to the control module 500 to transmit the ambient temperature detection result to the control module 500, and the control module 500 may control the working parameters of the fan 200 according to the ambient temperature detection result. For example, when the ambient temperature detection result is lower than the temperature threshold, the control module 500 may control the fan 200 to increase the rotation speed to improve the heat exchange efficiency between the airflow and the computing module 400, or the control module 500 may control the computing module 400 to increase the computing power to increase the heat generation of the computing module 400, thereby increasing the air outlet temperature of the computing device 1, and further improving the heating effect in a low temperature environment.

[0246] In one embodiment, Figure 2As shown, an air outlet baffle 22 is detachably installed at the air outlet 20b of the outer shell 20, and an air outlet filter assembly (not shown in the figure) may be provided on the air outlet baffle 22; and / or, an air inlet baffle 23 is detachably installed at the air inlet 20c of the outer shell 20, and an air inlet filter assembly 24 may be provided on the air inlet baffle 23.

[0247] In the examples of this application, see Figure 2 In order to protect the internal components of the computing device 1 and ensure the efficiency and cleanliness of the air flow, the housing 20 of the housing assembly 100 is detachably mounted with an air inlet baffle 23 or an air outlet baffle 22 at the air inlet 20c or the air outlet 20b. The air inlet baffle 23 and the air outlet baffle 22 may be respectively provided with an air inlet filter assembly 24 and an air outlet filter assembly (not shown in the figure). Exemplarily, in terms of the connection sequence, the air outlet baffle 22 and the air inlet baffle 23 may be installed first, and then the air inlet filter assembly 24 and the air outlet filter assembly may be fixed on the corresponding baffles.

[0248] For example, the air inlet baffle 23 and the air outlet baffle 22 can be designed as a window structure with a grille or a shutter window structure, and the arrangement layout or inclination angle of the grille and the shutter blades can be fixed or flexibly adjusted to guide the inlet and outlet airflow, thereby flexibly changing the direction of the air inlet and outlet. The material of the air inlet baffle 23, the air outlet baffle 22 and the filter assembly can be selected from high temperature resistant and corrosion resistant metals or polymer materials to ensure stability and durability in long-term use.

[0249] For example, multiple temperature sensors may be installed at key positions of the air inlet 20c and the air outlet 20b to detect the air inlet temperature of the housing assembly 100 at the air inlet 20c and the air outlet temperature at the air outlet 20b in real time, and feed back to the control module 500. In the application scenario where the computing device 1 is used as a heating device, the fan 200 and the computing module 400 may be connected to the control module 500 of the computing device 1, and the control module 500 may automatically adjust the operating power of the computing module 400 and the speed of the fan 200 according to the real-time temperature monitoring data to meet the corresponding heating demand within the normal operation range of the computing device 1.

[0250] Exemplarily, an electric heating device may be provided at the air outlet 20b of the shell assembly 100 to supplement heating with the exhausted warm air. A heat collection device such as a hot air guide duct may be provided at the air outlet baffle 22 to concentrate the heat of the exhausted warm air for heating. An auxiliary fan may also be installed at the air outlet 20b to enhance the flow of hot air and ensure that the heat can be effectively transferred to the location that requires heating.

[0251] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art may set any form of guide structure or heating device at the air outlet 20b to optimize the air outlet effect of the computing device 1 or increase the air outlet temperature of the computing device 1.

[0252] In one embodiment, Figure 5B As shown, an air inlet filter assembly 24 is provided at the air inlet 20c at the bottom of the housing assembly 100. The air inlet filter assembly 24 is detachably connected to the bottom of the housing assembly 100 to cover the air inlet 20c. The air inlet filter assembly 24 is used to filter the air entering the air inlet 20c.

[0253] Fig. 6A A schematic diagram of the structure of an air inlet filter assembly of a computing device according to an embodiment of the present application is provided as an example. Figure 6B A side view of an air inlet filter assembly of a computing device according to an embodiment of the present application is exemplarily provided. Figure 6C An exploded structural diagram of an air inlet filter assembly of a computing device according to an embodiment of the present application is provided as an example. FIG. 6A to FIG. 6C As shown, the air inlet filter assembly 24 includes a first clamping plate 241, a filter element 242, and a second clamping plate 243 stacked in a direction away from the air inlet 20c. An extrusion space is formed between the first clamping plate 241 and the second clamping plate 243, and the filter element 242 is disposed in the extrusion space between the first clamping plate 241 and the second clamping plate 243.

[0254] In some examples, the air inlet filter assembly 24 can be detachably connected to the bottom of the housing assembly 100 through a snap-fit ​​structure. For example, the surface of the first snap-fit ​​plate 241 adjacent to the housing assembly 100 can be provided with a plurality of snap-fit ​​protrusions, and the surface of the bottom of the housing assembly 100 can be provided with a plurality of snap-fit ​​holes, and the plurality of snap-fit ​​protrusions are snap-fitted into the plurality of snap-fit ​​holes one by one, so as to realize the installation of the air inlet filter assembly 24 at the bottom of the housing assembly 100.

[0255] In other examples, the air inlet filter assembly 24 and the bottom of the housing assembly 100 can be detachably connected by magnetic attraction. Figure 6C As shown, the air inlet filter assembly 24 may further include a plurality of magnetic members 244, and the plurality of magnetic members 244 are evenly distributed on the first engaging plate 241 and / or the second engaging plate 243. The shell assembly 100 may be made of metal, and the air inlet filter assembly 24 is magnetically adsorbed to the shell assembly 100 by the plurality of magnetic members 244, thereby realizing a detachable connection between the two.

[0256] It should be noted that the above description is only exemplary and cannot be construed as limiting the embodiments of the present application. In other examples of the present application, the air inlet filter assembly 24 can also be detachably connected to the bottom of the housing assembly 100 by fasteners such as screws.

[0257] Exemplarily, the first engaging plate 241 and the second engaging plate 243 may be connected in a detachable manner.

[0258] In some examples, the first snap-fit ​​plate 241 and the second snap-fit ​​plate 243 may be detachably connected via a snap-fit ​​structure.

[0259] In some other examples, the first clamping plate 241 and the second clamping plate 243 may be detachably connected by fasteners such as screws.

[0260] With such arrangement, after the computing device 1 has been used for a period of time, the first snap-fit ​​plate 241 and the second snap-fit ​​plate 243 can be disassembled, and the filter element 242 sandwiched therebetween can be taken out for cleaning or replacement to ensure the filtering capacity of the air inlet filter assembly 24 .

[0261] It should be noted that the above is only an exemplary description and cannot be understood as a limitation of the embodiments of the present application. Regarding the connection method between the first clamping plate 241 and the second clamping plate 243, those skilled in the art may also adopt any other form of detachable connection method. In addition, the first clamping plate 241 and the second clamping plate 243 may also be connected in a non-detachable connection manner, for example, they may be fixedly connected by ultrasonic welding.

[0262] Exemplarily, the filter element 242 may be made of filter cotton of a certain thickness, with a plurality of tiny cavity structures formed inside the filter cotton. The cavity structures are used to accommodate dust and other fine impurities trapped during the passage of air.

[0263] For example, see Fig. 6A The first clamping plate 241 and the second clamping plate 243 respectively have a plurality of hollowed-out ventilation areas 245, which are arranged through the thickness direction of the first clamping plate 241 and the second clamping plate 243 to connect the upper surface and the lower surface of the first clamping plate 241 and the second clamping plate 243. The plurality of ventilation areas 245 on the first clamping plate 241 correspond to the plurality of ventilation areas 245 on the second clamping plate 243 one by one. In this way, air can sequentially pass through the plurality of ventilation areas on the second clamping plate 243, the filter element 242 and the plurality of ventilation areas on the first clamping plate 241 and enter the air inlet 20c.

[0264] In some examples, the cross-sectional shape of the ventilation area 245 on the first clamping plate 241 and the second clamping plate 243 may be a regular hexagon or a portion of a regular hexagon.

[0265] In some other examples, the cross-sectional shape of the ventilation area 245 on the first clamping plate 241 and the second clamping plate 243 may be a regular pentagon or a part of a regular pentagon.

[0266] In some other examples, the cross-sectional shape of the ventilation area 245 on the first clamping plate 241 and the second clamping plate 243 may be a triangle or a part of a triangle.

[0267] In some other examples, the cross-sectional shape of the ventilation area 245 on the first clamping plate 241 and the second clamping plate 243 may be circular or elliptical.

[0268] It should be noted that the above is only an exemplary description, and the cross-sectional shape of the ventilation area 245 on the first snap-fit ​​plate 241 and the second snap-fit ​​plate 243 can be flexibly set according to actual conditions in the art, for example, any geometric shape such as a heptagon or octagon can be used.

[0269] For example, the first side surface of the first clamping plate 241 adjacent to the second clamping plate 243 can be set to an uneven non-planar surface, and the second side surface of the second clamping plate 243 adjacent to the first clamping plate 241 can also be set to an uneven non-planar surface, and the shape of the first side surface of the first clamping plate 241 matches the shape of the second side surface of the second clamping plate 243, so that the filter element 242 pressed between the first clamping plate 241 and the second clamping plate 243 is uneven and non-flat. The thickness of the filter element 242 in different areas is similar.

[0270] In some examples, a first side surface of the first snap-fitting plate 241 adjacent to the second snap-fitting plate 243 and a second side surface of the second snap-fitting plate 243 adjacent to the first snap-fitting plate 241 may be configured to be wavy, so that the overall shape of the filter element 242 is wavy.

[0271] In other examples, a first side surface of the first snap-fit ​​plate 241 adjacent to the second snap-fit ​​plate 243 and a second side surface of the second snap-fit ​​plate 243 adjacent to the first snap-fit ​​plate 241 may be configured to be sawtooth-shaped, so that the overall shape of the filter element 242 is sawtooth-shaped.

[0272] Such a configuration can increase the surface area of ​​the filter element 242 , thereby increasing the filtering area of ​​the air by the filter element 242 , and further improving the filtering effect of the air inlet filter assembly 24 .

[0273] In one embodiment, Figure 3As shown, the housing assembly 100 may further include a mounting side plate 30, which is detachably mounted on the first mounting opening 20a to seal the first mounting opening 20a. The mounting side plate 30 may be made of a high-strength, corrosion-resistant material, such as aluminum alloy or stainless steel, to ensure its stability and durability in long-term use. The mounting side plate 30 may be mounted on the first mounting opening 20a to seal the outer shell 20 of the housing assembly 100 after the inner shell 10 is slidably mounted on the cavity of the outer shell 20.

[0274] For example, through holes corresponding to the positions of the first limiting column 123 and the second limiting column 212 may be arranged on the mounting side plate 30. When assembling the mounting side plate 30, screws may be passed through the through holes and tightened and fixed to the screw holes on the first limiting column 123 and the second limiting column 212 to achieve a firm connection between the inner shell 10 or the outer shell 20 and the mounting side plate 30. This bolt fixing method can further enhance the connection strength between the inner shell 10, the outer shell 20 and the mounting side plate 30.

[0275] In one embodiment, Figure 3 As shown, the end of the fan 200 adjacent to the first installation opening 20a may be provided with a snap-fitting protrusion 210, and the installation side plate 30 may be provided with a penetrating first snap-fitting hole 30a, and the first snap-fitting hole 30a and the snap-fitting protrusion 210 of the fan 200 may form a snap-fitting fit.

[0276] For example, the end of the fan 200 adjacent to the first installation opening 20a may be provided with a snap-on protrusion 210. After the fan 200 is disposed in the installation slot 10b of the inner shell 10 along the first direction L1, one end of the snap-on protrusion 210 may protrude from the frame of the inner shell 10 along the first direction L1. After the inner shell 10 is slidably mounted in the cavity of the outer shell 20, the snap-on protrusion 210 may also protrude from the end of the outer shell 20 adjacent to the first installation opening 20a accordingly.

[0277] For example, the housing assembly 100 can be sealed by the mounting side plate 30 with a through-mounted snap-in hole. Specifically, the snap-in protrusion 210 of the fan 200 can be aligned with the first snap-in hole 30a on the mounting side plate 30, and the snap-in protrusion 210 can be embedded in the first snap-in hole 30a by applying a certain pressure to form a stable snap-in fit, ensuring that the fan 200 is securely fixed on the mounting side plate 30, while facilitating disassembly and maintenance.

[0278] In one embodiment, Figure 3 As shown, the mounting side plate 30 may be provided with a through-hole 30 c for passing cables connecting the control module 500 and the power module 300 . The control module 500 is disposed outside the accommodating cavity 10 a of the inner shell 10 .

[0279] In the embodiment of the present application, the computing device 1 may further include a control module 500. Exemplarily, the control module 500 of the computing device 1 is a module that implements functions such as power control, temperature monitoring management, and data communication. Components such as the power module 300, the computing module 400, and the heat dissipation module may be electrically connected to the control module 500 via cables, and the control module 500 performs system monitoring and task management.

[0280] In some examples, the control module 500 is used to automatically adjust the operating power of the computing module 400 and the speed of the fan 200 according to the real-time temperature monitoring data to ensure that the computing device 1 can maintain an optimal temperature under different workloads. The mounting side panel 30 may be provided with a wire hole 30c for passing the cable connecting the control module 500 and the power module 300. The periphery of the wire hole 30c may be made of soft material and insulated to prevent the cable from being worn and short-circuited.

[0281] In some examples, the wireless communication unit 60 of the control module 500 may be arranged on the bottom wall of the housing 20. Specifically, the communication module of the control module 500 may be a Bluetooth device or a wireless WIFI connection device, etc. In addition, the bottom wall of the housing 20 may also integrate a power input unit 301, a switch unit 302, an ambient temperature detection unit 70, etc., which is not specifically limited in the embodiment of the present application.

[0282] Fig.13 An exploded structural diagram of a control module of a computing device according to an embodiment of the present application is provided as an example. Figure 3 and Fig.13 As shown, the control module 500 may further include a control box 510. The control box 510 may have a snap-fit ​​protrusion 5121 on one side adjacent to the mounting side plate 30. The mounting side plate 30 may have a penetrating second snap-fit ​​hole 30b, and the snap-fit ​​protrusion 5121 and the second snap-fit ​​hole 30b form a snap-fit ​​fit.

[0283] For example, see Figure 3 and Fig.13, the control box 510 may have a snap-fitting protrusion 5121 on one side adjacent to the mounting side plate 30, and a correspondingly arranged through second snap-fitting hole 30b may be opened on the top of the mounting side plate 30. The embodiment of the present application does not specifically limit the number, shape and setting position of the snap-fitting protrusion 5121 and the second snap-fitting hole 30b. After the mounting side plate 30 is installed in the first mounting opening 20a of the housing 20, the snap-fitting protrusion 5121 of the control box 510 may be aligned with the second snap-fitting hole 30b on the mounting side plate 30, and the snap-fitting protrusion 5121 may be embedded in the second snap-fitting hole 30b by applying a certain pressure to form a stable snap-fitting fit, ensuring that the control box 510 is securely fixed on the mounting side plate 30, and is arranged in the mounting space extending from the housing 20 along the first direction L1, thereby completing the installation of the control module 500 of the computing device 1, and facilitating disassembly and maintenance.

[0284] Through the above-mentioned implementation, the snap-fit ​​design of the mounting side panel 30, the fan 200 and the control module 500 not only ensures the stable installation of the fan 200 and the control module 500, but also facilitates the disassembly and maintenance of the fan 200 and the control module 500. The independent installation space design of the control module 500 provides sufficient installation space and also keeps the control module 500 physically isolated from the accommodating cavity 10a of the inner shell 10, which is convenient for maintenance and heat dissipation. The design of the wire hole 30c ensures the neat wiring of the cables, further improving the overall performance of the computing device 1.

[0285] In one embodiment, Figure 2 and Figure 3 As shown, the outer shell 20 has a second installation opening (not shown in the figure) on the other side in the first direction L1. The housing assembly 100 further includes a cover side plate 40, which is detachably mounted on the second installation opening to seal the second installation opening. Exemplarily, the cover side plate 40 can be used to be installed on the second installation opening to seal the outer shell 20 of the housing assembly 100 after the inner shell 10 is slidably mounted on the cavity of the outer shell 20.

[0286] For example, see Figure 2 , a through hole corresponding to the position of the second limiting column 212 can be arranged on the cover side plate 40. When assembling the cover side plate 40, the bolts can be passed through the through holes and screwed through the screw holes on the second limiting column 212 to achieve a firm connection between the housing 20 and the cover side plate 40. This bolt fixing method can further enhance the connection strength between the housing 20 and the cover side plate 40.

[0287] In this way, the computing device 1 provided in the embodiment of the present application integrates the computing module 400, the power module 300, the fan 200, etc. in the inner and outer double-layer protective shell, thereby improving the integration of the computing device 1. By means of sliding installation, the inner shell 10 can be easily installed and removed, which improves the maintenance convenience of the device and achieves a good heat dissipation effect in the limited space of the computing device 1.

[0288] Fig.11A A schematic diagram of a three-dimensional structure of a computing device according to an embodiment of the present application at a viewing angle is exemplarily provided. Fig. 11B A schematic diagram of a three-dimensional structure of a computing device according to an embodiment of the present application at a viewing angle is provided as an example. Fig.11A and Fig. 11B As shown, in one embodiment, the cover side plate 40 and the control module 500 are respectively located on opposite sides of the housing 20 in the first direction L1, the cover side plate 40 is provided with a snap-fit ​​portion 41, and the control module 500 is provided with a snap-fit ​​portion 513. In two computing devices 1 arranged adjacent to each other along the first direction L1, the snap-fit ​​portion 41 of one computing device 1 is snap-fitted with the snap-fit ​​portion 513 of the other computing device 1.

[0289] In an embodiment of the present application, a plurality of computing devices 1 may be integrated to form a computing device cluster. Exemplarily, a plurality of computing devices 1 may be arranged adjacent to each other along a first direction L1, and each computing device 1 has a first end and a second end in the first direction, wherein the control module 500 of the computing device 1 is disposed at the first end, and the cover side plate 40 of the computing device 1 is disposed at the second end. In two adjacent computing devices 1, the second end of the first computing device is adjacent to the first end of the second computing device, and the snap-fit ​​portion 41 on the cover side plate 40 of the first computing device forms a snap-fit ​​with the snap-fit ​​portion 513 on the control module 500 of the second computing device.

[0290] In some examples, the clamping portion 41 may be formed by the outer wall of the cover side plate 40 protruding outward, and the clamping fitting portion 513 may be formed by the outer wall of the control module 500 being recessed inward. Thus, the clamping portion 41 may be inserted into the clamping fitting portion 513 to form a clamping fit.

[0291] In other examples, the clamping portion 41 may be formed by the outer wall of the cover side plate 40 being recessed inwardly, and the clamping fitting portion 513 may be formed by the outer wall of the control module 500 being protruded outwardly. Thus, the clamping fitting portion 513 may be inserted into the clamping portion 41 to form a clamping fit.

[0292] It should be noted that the above is only an exemplary description and cannot be understood as a limitation of the present application. In other examples of the present application, the snap-fit ​​portion 41 and the snap-fit ​​portion 513 may also adopt any other structure, and those skilled in the art may flexibly set it according to actual conditions. For example, one of the snap-fit ​​portion 41 and the snap-fit ​​portion 513 may be a protruding structure, and the other may be a matching snap-fit ​​structure. For another example, the snap-fit ​​portion 41 and the snap-fit ​​portion 513 may also adopt magnetic parts that have magnetic attraction to each other, and the two are mutually attracted by magnetic force so that two adjacent computing devices 1 can be relatively fixed.

[0293] In addition, the number of the clamping parts 41 and the clamping matching parts 513 can be one or more groups correspondingly arranged, and those skilled in the art can flexibly arrange them according to actual conditions. For example, the number of the clamping parts 41 and the clamping matching parts 513 can be one respectively, the clamping part 41 is arranged in the central area of ​​the cover side plate 40, and the clamping matching parts 513 are arranged in the central area of ​​the control module 500. For another example, the number of the clamping parts 41 can be multiple, and the multiple clamping parts 41 are arranged circumferentially adjacent to the outer periphery of the cover side plate 40, and the number of the clamping matching parts 513 can be multiple, and the multiple clamping matching parts 513 are arranged circumferentially adjacent to the outer periphery of the control module 500.

[0294] Fig.12 An exemplary assembly diagram of a control module and a housing assembly of a computing device according to an embodiment of the present application is provided, as shown in FIG. Fig.12 As shown, for example, the cover side plate 40 is further provided with a plurality of first hooks 42, which are provided on the inner side wall of the cover side plate 40, and are arranged circumferentially adjacent to the outer periphery of the cover side plate 40. The first hooks 42 are used to form a snap connection with the inner side wall of the housing assembly 100 adjacent to the second installation opening, so as to ensure the tightness of the connection of the cover side plate 40 at the second installation opening.

[0295] In one embodiment, Figure 1 and Fig.12 As shown, the housing assembly 100 further includes a plurality of supports 50 disposed at the bottom of the housing 20 .

[0296] Exemplarily, the support 50 is detachably connected to the bottom of the housing 20 .

[0297] In some examples, such as Fig.12 As shown, a plurality of second hooks 51 are provided at the top of the support 50, and a plurality of slots (not shown in the figure) are provided at the bottom of the shell 20. The plurality of second hooks 51 are engaged with the plurality of slots in a one-to-one correspondence to realize a detachable connection of the support 50 at the bottom of the shell 20.

[0298] In other examples, such as Figure 5BAs shown, the support 50 is provided with a through hole for passing a fastening screw 53 so that the fastening screw 53 forms a threaded connection with a screw hole (not shown) at the bottom of the housing 20 to achieve a detachable connection of the support 50 at the bottom of the housing 20.

[0299] Regarding the connection mode between the support 50 and the bottom of the housing 20, those skilled in the art can flexibly set it according to actual conditions, for example, a detachable connection mode in which a hook structure and a fastener cooperate can be adopted.

[0300] For example, Figure 5B As shown, the bottom of the support 50 may also be provided with an elastic support pad 52, and the number of the elastic support pads 52 may be multiple. In this way, the support 50 may contact the ground or other supporting planes through the elastic support pad 52, thereby achieving a certain shock-absorbing effect on the computing device 1. The material of the elastic support pad 52 may be any material with elastic properties such as rubber, and the embodiment of the present application does not specifically limit this.

[0301] In one embodiment, Fig.12 As shown, the outer shell 20 may have an extension portion extending along the first direction L1 , and the extension portion may define an installation space 25 . The installation space 25 and the inner shell 10 may be adjacent to each other in the first direction L1 , and the installation space 25 may be used to install the control module 500 .

[0302] For example, see Figure 2 and Fig.12 , the two side walls 12 of the housing 20 along the second direction L2 and the bottom wall of the housing 20 may extend outward along the first direction L1, and the extended portion may define an installation space 25 for installing the control module 500 of the computing device 1. The top of the installation space 25 may be open. In this way, the control module 500 can be installed in the installation space 25 from above. When the control module 500 needs to be repaired or replaced, the module can be taken out from the top for processing without disassembling other components, which simplifies the installation and maintenance process.

[0303] In one embodiment, Figure 3 and Fig.13 As shown, the computing device 1 further includes a control module 500. The control module 500 may include a control box 510 and a control circuit board 530. The control box 510 may define an installation cavity 511a inside, and the control box 510 may be detachably installed in the housing assembly 100 of the computing device 1. The control circuit board 530 may be disposed in the installation cavity 511a, and the control circuit board 530 is used to be electrically connected to the computing module 400 and the power module 300 in the housing assembly 100.

[0304] In the embodiment of the present application, the computing device 1 may include a plurality of functional modules such as a control module 500, a computing module 400, a power module 300, a fan 200, and a housing assembly 100 integrating the above functional modules. The housing assembly 100 may be used to provide an installation base and external protection for the functional modules of the computing device 1.

[0305] Exemplarily, the computing module 400, the power module 300 and the fan 200 can be integrated and arranged inside the housing assembly 100. The housing assembly 100 defines a cavity and an air inlet and an air outlet connected to the cavity. The fan 200 is arranged in the cavity to generate an airflow flowing from the air inlet to the air outlet. The airflow flows through the computing module 400 and the power module 300, thereby taking away the heat generated by the computing module 400 and the power module 300 during operation, thereby cooling the computing module 400 and the power module 300. At the same time, after the heated airflow forms warm air and flows out from the air outlet, it can be used to heat the external environment of the computing device 1, thereby realizing effective utilization of the heat generated by the computing module 400 and the power module 300.

[0306] In the embodiment of the present application, the control circuit board 530 is electrically connected to the computing module 400, the power module 300 and the fan 200. The power module 300 is used to supply power to the control circuit board 530, the computing module 400 and the power module 300. The control circuit board 530 is used to control the working parameters of the computing module 400 and the fan 200, such as controlling the operation frequency of the computing board 410 of the computing module 400 and controlling the speed of the fan 200.

[0307] Exemplarily, the control circuit board 530 can control the rotation speed of the fan 200 according to the operation frequency of the computing board 410. For example, when the operation frequency of the computing board 410 increases, the rotation speed of the fan 200 is increased accordingly to increase the flow rate of the airflow, thereby improving the heat dissipation efficiency of the computing board 410 when the operation frequency of the computing board 410 increases and the heat generation increases; conversely, when the operation frequency of the computing board 410 decreases, the rotation speed of the fan 200 is reduced accordingly to reduce the flow rate of the airflow, thereby reducing the heat dissipation efficiency of the computing board 410 when the operation frequency of the computing board 410 decreases and the heat generation decreases, thereby saving energy consumption of the computing device.

[0308] It should be noted that the above control method of the control circuit board 530 is only an exemplary description and should not be construed as a limitation on the present application. Those skilled in the art may flexibly set the control method of the control circuit board 530 according to actual conditions.

[0309] In other examples of the present application, the control circuit board 530 may also control the working parameters of the computing module 400 and the fan 200 according to the external environment temperature of the computing device 400. For example, when the external environment temperature is lower than the preset temperature, the control circuit board 530 may increase the heat generation of the computing board 410 and the flow rate of the airflow generated by the fan 200 by increasing the operation frequency of the computing board 410 and the rotation speed of the fan 200, thereby increasing the air volume and air temperature of the computing device 1, and further improving the heating effect of the computing device 1.

[0310] In the embodiment of the present application, the control box 510 is detachably mounted on the housing assembly 100 and is located outside the cavity of the housing assembly 100. In this way, the control circuit board 530 does not occupy the internal space of the housing assembly 100, thereby isolating the control circuit board 530 from the computing module 400, the power module 300 and the fan 200.

[0311] In some examples, the control box 510 and the housing assembly 100 may be detachably connected via screws or other types of fasteners.

[0312] In other examples, the control box 510 and the housing assembly 100 may be detachably connected via a snap-fit ​​structure.

[0313] It should be noted that the above detachable connection between the control box 510 and the housing assembly 100 is only an exemplary description and cannot be understood as a limitation of the present application. Those skilled in the art can flexibly set it according to actual conditions. For example, in other examples of the present application, the control box 510 and the housing assembly 100 can be detachably connected through a magnetic attraction component.

[0314] According to the control module 500 of the embodiment of the present application, a control box 510 for installing a control circuit board 530 is provided, and the control box 510 is detachably installed on the shell assembly 100. On the one hand, the control circuit board 510 can be decoupled from other modules of the computing device 1, thereby realizing a modular setting of the control module 500, which is beneficial for subsequent users to perform maintenance and upgrades according to needs, thereby improving the scalability of the computing device 1. On the other hand, the control module 500 is physically isolated from other modules of the computing device 1, thereby preventing the adverse effects of heat generated by the computing module 400 on the control circuit board 530, thereby improving the stability of the operation of the computing device 1, reducing the occupation of the internal space of the shell assembly 100, thereby reducing the external dimensions of the shell assembly 100, thereby improving the integration of the computing device 1.

[0315] In some examples, the housing 511 of the control box 510 may be made of metal material, such as aluminum alloy or steel, etc. The use of metal material can ensure that the control box 510 has high strength and effectively protects the internal components.

[0316] In other examples, the housing 511 of the control box 510 may be made of polymer materials, such as plastic or resin, etc. Selecting polymer materials can make the control box 510 lighter and cheaper, and is suitable for application scenarios with high requirements for weight and cost control.

[0317] It should be noted that the above material selection for the shell 511 of the control box 510 is only for illustration and does not constitute a limitation to the present application. Those skilled in the art can flexibly set it according to actual conditions.

[0318] In the embodiment of the present application, the control circuit board 530 may be a printed circuit board (PCB), and the control circuit board 530 may be electrically connected to the computing module 400 and the power module 300 in the housing assembly 100 through a flexible printed circuit board (FPC) or other flexible cables. By adopting a thin, bend-resistant and high-transmission FPC or other flexible cables, it is possible to adapt to the complex layout of the modules inside the housing assembly 100, avoid electrical connection failures caused by cable bending or stretching, and simplify the wiring structure. The control circuit board 530 may be connected to the computing module 400 and the power module 300 in the housing assembly 100 through a standardized electrical connection interface.

[0319] Exemplarily, a vertical connector with a self-locking function can be further provided on the control circuit board 530, and the cables extending from functional modules such as the computing module 400 and the power module 300 can communicate electrically with the control circuit board 530 through gold fingers adapted to the vertical connector to ensure stable and efficient signal transmission.

[0320] It should be noted that the above example of electrical connection between the control circuit board 530 and the computing module 400 and the power module 300 is for illustration only and does not constitute a limitation to the present application. Those skilled in the art may flexibly set it according to actual conditions.

[0321] In some examples, the working parameters of each module of the computing module 400 can be dynamically adjusted according to the real-time load condition of the computing device 1 by setting a reasonable control logic for the control circuit board 530, so that the fan 200 can be used as a cooling device for the computing device 1. The control module 500 can be used to form an electrical connection with the computing module 400, the power module 300 and the fan 200 in the housing assembly 100, and can be used to execute the control module 500 of the various modules of the computing device 1 to achieve dynamic adjustment of the heat dissipation system. Specifically, multiple load detection modules, such as temperature sensors, current sensors, etc., can be installed at key positions of the computing module 400 and the power module 300 to monitor the load conditions of the computing module 400 and the power module 300 in real time and feedback to the control circuit board 530. When it is detected that the load conditions such as temperature or current reach a set threshold, the control module 500 can adjust the speed of the fan 200 or start additional heat dissipation devices to improve the heat dissipation efficiency. Conversely, when the load is reduced, the control module 500 can send a signal to indicate to reduce the fan speed or temporarily shut down the air cooling system, thereby saving energy consumption and reducing noise. It should be noted that the above is only an example and does not constitute a limitation to the present application.

[0322] In other examples, by setting a reasonable control logic for the control circuit board 530, the computing module 400 and the fan 200 are used as a heating device, and the heat generated by the computing module 400 is effectively used for heating while the heat dissipation of the computing device 1 is realized. It should be noted that the control module 500 can be used to form an electrical connection with the computing module 400, the power module 300 and the fan 200 in the housing assembly 100, and can be used to execute an intelligent heating system that coordinates the various modules of the computing device 1 to realize the heating function. Figure 1 As shown, the airflow generated by the fan 200 can flow through the computing module 400 to form warm air, and the warm air can be discharged through the air outlet 20b of the shell 20 of the shell assembly 100 for heating. Specifically, the air inlet 20c of the shell assembly 100 can be opened on the bottom wall of the shell 20, and the air outlet 20b can be opened on the side wall of the shell 20. A plurality of temperature sensors can be installed at key positions of the air inlet 20c and the air outlet 20b of the shell assembly 100 to detect the air inlet temperature of the shell assembly 100 at the air inlet 20c and the air outlet temperature at the air outlet 20b in real time, and feed back to the control module 500 of the control module 500. In the application scenario where the computing device 1 is used as a heating device, the fan 200, the computing module 400, and the power module 300 can be connected to the control module 500 of the control module 500. The control module 500 can automatically adjust the operating power of the computing module 400 and the speed of the fan 200, or control the on and off of the power supply according to the specified temperature requirements input by the user and the real-time temperature monitoring data, so as to meet the corresponding heating needs within the normal operating range of the computing device 1.

[0323] For example, when the air outlet temperature does not reach the user-specified temperature, the control module 500 may appropriately increase the computing load within the normal operating range of the computing device 1, or reduce the speed of the fan 200, or temporarily shut down the air cooling system, thereby meeting the user's heating needs. When the air outlet temperature is higher than the user-specified temperature, the control module 500 may appropriately reduce the computing load within the normal operating range of the computing device 1, or increase the speed of the fan 200, thereby meeting the user's temperature requirements. In other examples, when the user has no heating needs, the ambient temperature is low, and the computing load is small, the control module 500 may send a signal to instruct to reduce the fan speed or temporarily shut down the air cooling system, thereby reducing energy consumption and improving energy efficiency.

[0324] In some specific examples, an electric heating device may be provided at the air outlet 20b of the housing assembly 100 to provide supplementary heating in conjunction with the exhausted warm air.

[0325] In other specific examples, a heat collection device such as a hot air guide duct can be set at the air outlet 20b to concentrate the heat of the exhausted warm air for heating, and an auxiliary fan can also be installed at the air outlet 20b to enhance the flow of hot air and ensure that the heat can be effectively transferred to the location that needs heating.

[0326] It should be noted that the above-mentioned heating method and heating structure are only for illustration and do not constitute a limitation to the present application.

[0327] In this way, the control module 500 for the computing device 1 of the embodiment of the present application can be electrically connected to other functional modules of the computing device 1, and can dynamically adjust the heat dissipation system according to the real-time load conditions of other functional modules and the heating needs of the user, thereby achieving heating while ensuring the stable operation of the computing device 1.

[0328] In one embodiment, Fig.13 As shown, the control box 510 may include a shell 511 and a side cover plate 512. The shell 511 may define a mounting cavity 511a and a side opening communicating with the mounting cavity 511a. The side cover plate 512 may be detachably mounted on the side opening.

[0329] Exemplarily, the control box 510 is detachably mounted on the outside of the inner shell 10 of the housing assembly 100 along one side of the first direction L1. The inner shell 10 of the housing assembly 100 may be a rectangular parallelepiped frame structure, and the first direction L1 may be a direction parallel to the length direction of the inner shell 10, wherein the length direction of the inner shell 10 may be understood as a straight line direction extending from one end of the longest side of the inner shell 10 to the other end. The control box 510 may include a housing 511 and a side cover plate 512, and the interior of the housing 511 may define an installation cavity 511a, and the control circuit board 530 may be installed in the installation cavity 511a of the housing 511. A side opening may be provided on one side of the housing 511 along the first direction L1, and the side cover plate 512 may be detachably mounted on the side opening to achieve the closure of the control box 510. It should be noted that the above description of the structure and direction of the inner shell 10 is only exemplary and does not constitute a limitation to the present application.

[0330] For example, the housing 511 may be provided with a plurality of positioning posts 5113 extending in a direction toward the side cover plate 512, and the plurality of positioning posts 5113 may be symmetrically arranged on both sides along the second direction L2. The control circuit board 530 may be provided with a plurality of positioning holes 530a corresponding to the plurality of positioning posts 5113 one by one, and the positioning holes 530a may be used for the positioning posts 5113 to pass through. The cross-sectional shape of the positioning holes 530a may be circular or elliptical.

[0331] Exemplarily, the number of the positioning posts 5113 may be 4, and they may be respectively arranged adjacent to the 4 vertex corners of the control circuit board 530. The number of the positioning holes 530a on the control circuit board 530 may be 4, and they may be respectively arranged in one-to-one correspondence with the 4 positioning posts 5113, so as to allow the corresponding positioning posts 5113 to pass through, thereby achieving the installation and fixation of the control circuit board 530 relative to the housing 511. The side cover plate 512 may be provided with a plurality of mounting holes 512c, and the plurality of mounting holes 512c may be arranged in one-to-one correspondence with the plurality of positioning posts 5113. In the process of installing the side cover plate 512 on the housing 511, the positioning posts 5113 may be inserted into the mounting holes 512c, so as to achieve the installation and sealing of the control box as a whole.

[0332] Through the above-mentioned implementation, a detachable connection between the housing 511 and the side cover plate 512 is achieved, and the convenience of assembly and disassembly between the two is improved.

[0333] In one embodiment, Fig.13 As shown, the side cover plate 512 may be provided with a through-hole 512a, which can be used for the cables of the power module 300 to pass through and be electrically connected to the control circuit board 530. The size and shape of the through-hole 512a can be optimized and designed according to actual application requirements, and are not specifically limited in the embodiments of the present application.

[0334] In some examples, the inner circumference of the wire hole 512a can be in an arc shape, such as a circle or an ellipse. This arrangement can avoid the appearance of angular structures on the inner circumference of the wire hole 512, thereby reducing the wear of the inner circumference on the cable, thereby providing a certain degree of protection for the cable.

[0335] In other examples, the inner circumference of the cable hole 512a may be provided with a soft material and insulated to prevent the cable from being worn or short-circuited.

[0336] In some other examples, a dustproof gasket may be attached to the inner circumference of the wire hole 512a to prevent dust from entering the interior of the housing 511 and protect the safety and reliability of the internal electronic components.

[0337] It should be noted that the above description is only exemplary and cannot be construed as limiting the embodiments of the present application. To prevent the wire hole 512a from damaging the cable, the inner circumference of the wire hole 512a can be flexibly configured by those skilled in the art according to actual conditions.

[0338] In one embodiment, Figure 2 and Fig.13 As shown, the computing device 1 may further include a fan 200 disposed in the housing assembly 100, and the end of the fan 200 may have a snap-fitting protrusion 210. A snap-fitting hole 512b may also be provided on the side cover plate 512, and the shape of the snap-fitting hole 512b may be adapted to the shape of the snap-fitting protrusion 210, so as to form a snap-fitting fit with the snap-fitting protrusion 210.

[0339] For example, after the fan 200 is installed on the housing assembly 100 along the first direction L1, the snap-fitting protrusion 210 of the fan 200 may protrude from one side of the housing assembly 100 along the first direction L1. The snap-fitting hole 512b on the side cover plate 512 may be aligned with the snap-fitting protrusion 210 at the end of the fan 200, and the snap-fitting protrusion 210 may be embedded in the snap-fitting hole 512b by applying a certain pressure to form a stable snap-fitting fit, thereby ensuring that the control module 500 is stably installed on the housing assembly 100, and facilitating the subsequent disassembly and maintenance of the control module 500.

[0340] In some examples, the shape of the engaging protrusion 210 may be circular or elliptical, and the shape of the engaging hole 512 b may be circular or elliptical to match the engaging protrusion 210 .

[0341] In other examples, the shape of the snap-fitting protrusion 210 may be a polygon, such as a triangle or a quadrilateral, and the shape of the snap-fitting hole 512 b may be a circle or an ellipse that matches the snap-fitting protrusion 210 .

[0342] It should be noted that the above-mentioned shapes of the snap-in hole 512b and the snap-in protrusion 210 are only for illustration and do not constitute a limitation to the present application. Those skilled in the art may flexibly set the shapes of the snap-in hole 512b and the snap-in protrusion 210 according to actual conditions to achieve the effect that the two can form a plug-in fit.

[0343] In one embodiment, Fig.13 As shown, the side cover plate 512 may have a recessed portion 5122 , which may be recessed in a direction toward the mounting cavity 511 a . The recessed portion 5122 may define a cable storage groove, and the wire passing hole 512a and the snap-in hole 512b may be disposed in the recessed portion 5122 .

[0344] For example, the recessed portion 5122 may be formed by a portion of the side cover plate 512 adjacent to the central region being recessed in a direction toward the installation cavity 511a. The side of the cable storage slot defined by the recessed portion 5122 away from the installation cavity 511a is open, and the installation side plate 30 of the housing assembly 100 is used to close the open, so that the cable storage slot forms a relatively closed space.

[0345] Through the above implementation, the cable storage groove can provide additional space for arranging and storing cables, making the cables more neat and orderly during the wiring process.

[0346] In one embodiment, Figure 3 and Fig.13 As shown, a latching hole 30b may be provided on one side of the shell assembly 100 adjacent to the control box 510, and a latching protrusion 5121 may be provided on one side of the side cover plate 512 adjacent to the shell assembly 100, and the latching protrusion 5121 may be used to form a latching fit with the latching hole 30b; or, a latching protrusion may be provided on one side of the shell assembly 100 adjacent to the control box 510, and a latching hole may be provided on the side cover plate 512, and the latching hole may be used to form a latching fit with the latching protrusion.

[0347] For example, when a latch hole 30b is provided on one side of the housing assembly 100 adjacent to the control box 510 and a latch protrusion 5121 is provided on the side cover plate 512, the latch protrusion 5121 of the control box 510 can be aligned with the latch hole 30b on the side of the housing assembly 100 adjacent to the control box 510, and the latch protrusion 5121 is embedded in the latch hole 30b by applying a certain pressure to form a stable latch fit. The number, shape and opening position of the latch hole 30b and the latch protrusion 5121 are not specifically limited in the present embodiment.

[0348] Through the above implementation, it can be ensured that the control module 500 is stably fixed on the housing assembly 100, and at the same time, it is convenient for the subsequent disassembly and maintenance of the control module 500.

[0349] In one embodiment, the housing 511 may include an upper shell 5111 and a lower shell 5112, and the bottom of the upper shell 5111 may be connected to the top of the lower shell 5112; wherein the material of the upper shell 5111 may be a transparent material.

[0350] Exemplarily, part or all of the upper shell 5111 may be made of a transparent material, and the transparent material may specifically be tempered glass, plastic, etc., so that at least part of the upper shell 5111 can allow light to pass through to form a transparent upper shell.

[0351] In one embodiment, Fig.13 As shown, the control module 500 may further include a display screen 520 , which may be disposed in the mounting cavity 511 a and electrically connected to the control circuit board 530 , and a display area of ​​the display screen 520 is disposed opposite to the upper shell 5111 .

[0352] Exemplarily, the housing 511 of the control box 510 may include an upper housing 5111 and a lower housing 5112. The control module 500 may further include a display screen 520, which may be disposed in the mounting cavity 511a and electrically connected to the control circuit board 530. The transparent upper housing 5111 may be disposed opposite to the display area of ​​the display screen 520 to display the working information of the control module 500.

[0353] In the embodiment of the present application, the display screen 520 can be an LED display screen or a liquid crystal display screen, etc. The embodiment of the present application does not specifically limit the type of the display screen 520, and those skilled in the art can flexibly set it according to actual conditions.

[0354] Through the above implementation, the display screen 520 can be electrically connected to the control circuit board 530 through the flexible printed circuit board, which can adapt to the compact installation space in the control box 510 while ensuring stable and efficient signal transmission.

[0355] In one embodiment, see Fig.12 The shell assembly 100 reserves an installation space 25 for the control module 500. The bottom of the installation space 25 can be formed by extending the bottom wall and side walls of the shell 20 to provide support for the installation of the control module 500. The top of the installation space can be open to cooperate with the transparent upper shell 5111 of the control box 510 to display the working information of the control module 500. Such a setting can increase the visualization and aesthetics of the control module 500.

[0356] In this way, in the computing device 1 provided in the embodiment of the present application, the control module 500 can be detachably installed in the shell assembly 100 of the computing device 1, thereby realizing the modularization of the system control of the computing device 1, facilitating the user's subsequent maintenance and upgrade according to needs, and improving the scalability of the computing device 1.

[0357] Fig.11A A schematic diagram of a three-dimensional structure of a computing device according to an embodiment of the present application at a viewing angle is exemplarily provided. Fig. 11B A schematic diagram of a three-dimensional structure of a computing device according to an embodiment of the present application at a viewing angle is provided as an example. Fig.11A and Fig. 11B As shown, in one embodiment, the outer side wall of the control box 510 of the control module 500 is provided with a snap-fitting portion 513 , and the snap-fitting portion 513 is provided correspondingly to the snap-fitting portion 41 on the cover side plate 40 of the housing assembly 100 .

[0358] Exemplarily, the cover side plate 40 and the control module 500 are respectively located on opposite sides of the housing 20 in the first direction L1, the cover side plate 40 is provided with a snap-fit ​​portion 41, and the outer side wall of the control box 510 is provided with a snap-fit ​​portion 513. In two computing devices 1 arranged adjacently along the first direction L1, the snap-fit ​​portion 41 of one computing device 1 is snap-fitted with the snap-fit ​​portion 513 of the other computing device 1.

[0359] In an embodiment of the present application, a plurality of computing devices 1 may be integrated to form a computing device cluster. Exemplarily, a plurality of computing devices 1 may be arranged adjacent to each other along a first direction L1, and each computing device 1 has a first end and a second end in the first direction, wherein the control module 500 of the computing device 1 is disposed at the first end, and the cover side plate 40 of the computing device 1 is disposed at the second end. In two adjacent computing devices 1, the second end of the first computing device is adjacent to the first end of the second computing device, and the snap-fit ​​portion 41 on the cover side plate 40 of the first computing device forms a snap-fit ​​with the snap-fit ​​portion 513 on the control box 510 of the second computing device.

[0360] In some examples, the clamping portion 41 may be formed by protruding outward from the outer wall of the cover side plate 40 to form a protruding structure, and the clamping fitting portion 513 may be formed by recessing inward from the outer wall of the control box 510 to form a groove structure. Thus, the clamping portion 41 may be inserted into the clamping fitting portion 513 to form a clamping fit.

[0361] In other examples, the clamping portion 41 may be formed by being recessed inwardly from the outer wall of the cover side plate 40 to form a recessed structure, and the clamping fitting portion 513 may be formed by being protruded outwardly from the outer wall of the control module 500 to form a protruding structure. Thus, the clamping fitting portion 513 may be inserted into the clamping portion 41 to form a clamping fit.

[0362] It should be noted that the above is only an exemplary description and cannot be understood as a limitation of the present application. In other examples of the present application, the snap-fit ​​portion 41 and the snap-fit ​​portion 513 may also adopt any other structure, and those skilled in the art may flexibly set it according to actual conditions. For example, one of the snap-fit ​​portion 41 and the snap-fit ​​portion 513 may be a protruding structure, and the other may be a matching snap-fit ​​structure. For another example, the snap-fit ​​portion 41 and the snap-fit ​​portion 513 may also adopt magnetic parts that have magnetic attraction to each other, and the two are mutually adsorbed by magnetic force so that two adjacent computing devices 1 can be relatively fixed.

[0363] In addition, the number of the clamping parts 41 and the clamping fitting parts 513 can be one or more groups correspondingly arranged, and those skilled in the art can flexibly arrange them according to actual conditions. For example, the number of the clamping parts 41 and the clamping fitting parts 513 can be one respectively, the clamping part 41 is arranged in the central area of ​​the cover side plate 40, and the clamping fitting parts 513 are arranged in the central area of ​​the control box 510. For another example, the number of the clamping parts 41 can be multiple, and the multiple clamping parts 41 are arranged circumferentially adjacent to the outer periphery of the cover side plate 40, and the number of the clamping fitting parts 513 can be multiple, and the multiple clamping fitting parts 513 are arranged circumferentially adjacent to the outer periphery of the control box 510.

[0364] Fig.14 A schematic diagram of the three-dimensional structure of a computing board of a computing device according to an embodiment of the present application is exemplarily provided. Fig.15 An exemplary front view of a computing board of a computing device according to an embodiment of the present application is provided, as shown in FIG. Fig.14 and Fig.15 As shown, in one embodiment, the computing board 410 of the computing module 100 includes a board 410a and a plurality of computing units 410b, wherein the plurality of computing units 410b are arranged on the side surface of the board 410a, the length direction of the board 410a is parallel to the first direction L1, and the width direction of the board is parallel to the vertical direction. The vertical direction may be a direction perpendicular to the first direction L1 and the second direction L2, respectively.

[0365] In an embodiment of the present application, the computing board 410 may be a hardware device or module for providing computing power, which may be applied to high-performance computing (HPC), artificial intelligence (AI) training, data centers, and other fields. The board 410a may be a printed circuit board. The computing unit may be a CPU (Central Processing Unit) chip, a GPU (Graphic Processing Unit) chip, an FPGA (Field Programmable Gate Array) chip, an ASIC (Application-Specific Integrated Circuit, ASIC) chip, an NPU (Neural Processing Unit) chip, and a TPU (Tensor Processing Unit) chip. At least one of the chips.

[0366] Exemplarily, the multiple computing units 410b used by the computing board 410 are the same.

[0367] In some examples, the computing board 410 may use multiple computing units 410b of the same model.

[0368] In other examples, the computing board 410 may use multiple computing units 410b of the same size.

[0369] In other examples, the computing board 410 may use multiple computing units 410b with the same specifications.

[0370] In other examples, the computing board 410 may use multiple computing units 410b with the same functions.

[0371] It should be noted that the above is only an exemplary description. In other examples of the present application, multiple computing units 410b having the same model, size, specification and at least two parameters of function may also be used.

[0372] Exemplarily, the shape of the plate body 410a may be rectangular, the length direction of the plate body 410a refers to the extension direction of the edge of the longer side of the plate body, and the width direction of the plate body 410a refers to the extension direction of the edge of the shorter side of the plate body. The plane where the plate body 410a is located may be arranged perpendicular to the second direction L2, the length direction of the plate body 410a is arranged parallel to the first direction L1, and the width direction of the plate body 410a is arranged parallel to the vertical direction. Among them, the first direction L1 may be the length direction of the housing assembly 100, the second direction L2 may be the width direction of the housing assembly 100, and the vertical direction may be a direction perpendicular to the first direction L1 and the second direction L2, respectively.

[0373] It should be noted that by arranging the plate 410a in the interior of the housing assembly 100 with the length direction of the plate 410a parallel to the first direction L1 and the width direction parallel to the vertical direction, the internal space of the housing assembly 100 can be fully utilized, and while reducing the occupation of the internal space of the housing assembly 100 by the plate 410a, the area of ​​the plate 410a can be maximized, thereby increasing the area of ​​the arrangement area of ​​the computing unit 410b, and then increasing the number of arrangement of the computing unit 410b, and improving the computing performance of the computing board 410. In addition, by arranging the plane where the computing board is located parallel to the vertical direction, during the operation of the fan 200, the wind resistance generated by the computing board 410 to the air flow flowing from the air inlet 20c to the air outlet 20b can be reduced, ensuring that the air flow has a higher flow rate when flowing through the computing board 410, thereby ensuring the cooling efficiency of the computing board 410.

[0374] In one embodiment, the ratio of the width dimension of the plate body 410a to the length dimension of the plate body 410a is less than or equal to 1 / 6.

[0375] It is understood that the width dimension of the plate body 410a refers to the dimension of the plate body 410a in the width direction, and the length dimension of the plate body 410a refers to the dimension of the plate body 410a in the length direction. The specific values ​​of the width dimension and the length dimension of the plate body 410a and the ratio of the two can be set accordingly according to the overall shape and size of the housing assembly 100 and the shape and size of its internal cavity.

[0376] For example, Figure 1As shown, the overall shape of the shell assembly 100 can be generally rectangular, and the length dimension of the shell assembly 100 in the first direction L1 is greater than the height dimension of the shell assembly 100 in the vertical direction. Correspondingly, the shape of the cavity inside the shell assembly 100 can be generally rectangular, and the length dimension of the cavity in the first direction L1 is greater than the height dimension of the cavity in the vertical direction. In order to enable the plate body 410a to maximize the use of the cavity space inside the shell assembly 100, in the embodiment of the present application, the length direction of the plate body 410a can be set to be parallel to the first direction L1, the width direction of the plate body 410a can be set to be parallel to the vertical direction, and the length dimension of the plate body 410a is greater than its width dimension. Among them, the ratio of the width dimension of the plate body 410a to its length dimension can be set to be less than or equal to 1 / 6.

[0377] In some examples, the ratio of the width dimension of the plate body 410a to its length dimension may be set to 1 / 6, that is, the length-to-width ratio of the plate body 410a is 6.

[0378] In some other examples, the ratio of the width dimension of the plate body 410a to its length dimension may be set to 1 / 8, that is, the length-to-width ratio of the plate body 410a is 8.

[0379] In some further examples, the ratio of the width dimension of the plate body 410a to its length dimension may be set to 1 / 10, that is, the length-to-width ratio of the plate body 410a is 10.

[0380] It should be noted that the above description is only exemplary and cannot be construed as limiting the present application. Regarding the length and width of the plate 410a and the ratio thereof, those skilled in the art can set the length and width of the plate 410a accordingly according to the shape and size of the cavity of the housing assembly 100 to improve the space utilization of the plate 410a in the internal cavity of the housing assembly 100.

[0381] In one embodiment, Fig.14 and Fig.15 As shown, a plurality of computing units 410b are disposed on the side surface of the plate body 410a, and the plurality of computing units 410b are arranged in at least one row, and the plurality of computing units 410b in each row are adjacently arranged along the length direction of the plate body 410a.

[0382] It should be noted that, since the length of the plate 410a is greater than its width, in order to maximize the number of computing units 410b arranged on the side surface of the plate 410a with limited area, the row direction of the plurality of computing units 410b arranged in rows can be arranged parallel to the length direction of the plate. In this way, the number of computing units 410b in each row can be maximized.

[0383] In some examples, the plurality of computing units 410 b may be arranged in a row, and the plurality of computing units 410 b in the row are adjacently arranged along a direction parallel to the length direction of the plate body 410 a .

[0384] In a specific example, the plurality of computing units 410b in the row can be arranged in the center in the width direction of the plate body 410a, so that each computing unit 410b in the row is equidistant from two side edges extending in the length direction of the plate body 410a. In this arrangement, the heat generated by the computing unit 410b during operation can be uniformly dissipated to both sides in the width direction of the plate body 410a, thereby improving the temperature consistency of the plate body 410a and avoiding local concentration of heat.

[0385] In another specific example, the plurality of computing units in the row may also be arranged non-centrally in the width direction of the plate body 410a, so that the distances between each computing unit 410b in the row and the two side edges extending in the length direction of the plate body 410a are not equal. For example, the distance between each computing unit 410b in the row and the upper side edge extending in the length direction of the plate body 410a is greater than the distance between each computing unit 410b in the row and the lower side edge extending in the length direction of the plate body 410a. For another example, the distance between each computing unit 410b in the row and the upper side edge extending in the length direction of the plate body 410a is less than the distance between each computing unit 410b in the row and the lower side edge extending in the length direction of the plate body 410a.

[0386] It should be noted that the above description is only exemplary and cannot be construed as limiting the present application. In other examples of the present application, the plurality of computing units 410b may also be arranged in columns on the board 410a, and the column direction may be parallel to the width direction of the board 410a.

[0387] In one embodiment, Fig.14 and Fig.15 As shown, multiple computing units 410b are arranged in two rows, multiple computing units in each row are adjacently arranged along a direction parallel to the length direction of the plate 410a, and the two rows of computing units are spaced apart in the width direction of the plate 410a.

[0388] In some examples, the two rows of computing units are arranged symmetrically about the center line in the width direction of the board 410a, so that the distances between the two rows of computing units and the side edges of the board 410a adjacent to each other are equal. In this way, the two rows of computing units can be evenly arranged on the board 410a, thereby improving the temperature uniformity of the computing board 410.

[0389] In other examples, two rows of computing units are arranged asymmetrically about the center line in the width direction of the board 410a, wherein the distance between the first row of computing units 4101 adjacent to the upper edge of the board 410a and the upper edge of the board 410a is greater than the distance between the second row of computing units 4102 adjacent to the lower edge of the board 410a and the lower edge of the board 410a. It should be noted that, in the process of the airflow flowing upward from the air inlet 20c to the air outlet 20b, the airflow has a better cooling effect on the second row of computing units 4102 located upstream of the airflow than on the first row of computing units 4101 located downstream of the airflow. By setting the distance between the first row of computing units 4101 and the upper edge of the board 410a to be greater than the distance between the second row of computing units 4102 and the lower edge of the board 410b, the board 410a can reserve a larger heat dissipation space for the first row of computing units 4101 than for the second row of computing units 4102, thereby balancing the cooling capacity for the two rows of computing units, so that the cooling capacity of the two rows of computing units is as consistent as possible, thereby improving the temperature uniformity of the computing board 410.

[0390] It should be noted that the above is only an exemplary description and cannot be understood as a limitation of the present application. In other examples of the present application, the multiple computing units 410b can also be arranged in two columns, and the multiple computing units in each column can be arranged adjacent to each other in a direction parallel to the width direction of the plate body 410a, and the two columns of computing units are arranged at intervals in the length direction of the plate body 410a. In addition, the two columns of computing units can be arranged symmetrically or asymmetrically about the center line in the length direction of the plate body 410a.

[0391] In the embodiment of the present application, the numbers of computing units 410b respectively included in two rows of computing units may be equal or unequal.

[0392] In some examples, the number of computing units 410b included in the first row of computing units 4101 adjacent to the upper edge of the board 410a is equal to the number of computing units 410b included in the second row of computing units 4102 adjacent to the lower edge of the board 410a.

[0393] In some other examples, the number of computing units 410b included in the first row of computing units 4101 adjacent to the upper side of the board 410a is greater than the number of computing units 410b included in the second row of computing units 4102 adjacent to the lower edge of the board 410a. The spacing between any two adjacent computing units 410b in the first row of computing units 4101 is less than the spacing between any two adjacent computing units 410b in the second row of computing units 4102.

[0394] In some further examples, the number of computing units 410b included in the first row of computing units 4101 adjacent to the upper side of the board 410a is less than the number of computing units 410b included in the second row of computing units 4102 adjacent to the lower edge of the board 410a. The spacing between any two adjacent computing units 410b in the first row of computing units 4101 is greater than the spacing between any two adjacent computing units 410b in the second row of computing units 4102.

[0395] In a specific example, the ratio of the width dimension to the length dimension of the plate body 410a may be 1 / 8. The two rows of computing units may be arranged symmetrically about the center line in the width direction of the plate body. The number of computing units 410b included in the first row of computing units 4101 and the number of computing units 410b included in the second row of computing units 4102 may be equal, and are 33 respectively. The spacing between any two adjacent computing units 410b in the first row of computing units 4101 is equal to the spacing between any two adjacent computing units 410b in the second row of computing units 4102.

[0396] It should be noted that the above description is only an exemplary description and should not be construed as limiting the present application. The number of rows of the computing units 410b on the board 410a and the number of computing units 410b in each row can be flexibly set by those skilled in the art according to the size of the computing units 410b and the size of the board 410a.

[0397] In one embodiment, two rows of computing units are arranged in series.

[0398] In the embodiment of the present application, the multiple computing units 410b in the first row of computing units 4101 can be sequentially arranged in series, and the multiple computing units 410b in the second row of computing units 4102 can be sequentially arranged in series. In addition, the first row of computing units 4101 and the second row of computing units 4102 can be arranged in parallel or in series.

[0399] Exemplarily, the computing board 410 may further include a conductive row 417, which may be disposed on the surface of the board body 410a. The number of the conductive rows 417 may be two, and the two conductive rows 417 are respectively disposed corresponding to the two rows of computing units, and each conductive row 417 may extend along the length direction of the board body 410a.

[0400] In some examples, the conductive row 417 may be an integral structure, and the multiple computing units 410 b in each row of computing units are electrically connected to the conductive row 417 via pads, so that the multiple computing units 410 b in each row of computing units are connected in series.

[0401] In other examples, the conductive row 417 may include a plurality of conductive sheets arranged adjacent to each other along the length direction of the board 410a. In each row of computing units, any two adjacent computing units 410b are electrically connected via the conductive sheets, so that the plurality of computing units 410b in each row of computing units are connected in series.

[0402] In some examples, the material of the conductive bus 417 may be copper, and the conductive bus 417 may specifically be a copper bus.

[0403] In some other examples, the material of the conductive bar 417 may be aluminum, and the conductive bar 417 may specifically be an aluminum bar.

[0404] In some other examples, the material of the conductive row 417 may be silver, and the conductive row 417 may specifically be a silver row.

[0405] Regarding the material selection of the conductive bar 417, those skilled in the art may use any type of conductive material currently known or to be known in the future, such as gold, platinum or conductive polymers with conductive properties.

[0406] In one embodiment, the board 410a includes a first end 410a1 and a second end 410a2 that are oppositely arranged in its length direction, and the computing unit 410b adjacent to the second end 410a2 in the first row of computing units 4101 is electrically connected to the computing unit 410b adjacent to the second end 410a2 in the second row of computing units 4102 through the first conductive member 415.

[0407] In some examples, the first conductive member 415 may be an integral structural member, and the computing units in the first row of computing units 4101 adjacent to the second end 410a2 and the computing units in the second row of computing units 4102 adjacent to the second end 410a2 are electrically connected to the first conductive member 415 respectively, thereby connecting the first row of computing units 4101 and the second row of computing units 4102 in series.

[0408] In other examples, the first conductive member 415 may include a plurality of conductive monomers arranged adjacent to each other along the width direction of the board body 410a, and the plurality of conductive monomers are electrically connected in sequence through conductive lines on the board body 410a, and the computing unit 410b adjacent to the second end 410a2 in the first row of computing units 4101 is electrically connected to a conductive sheet adjacent to the upper edge of the board body 410a among the plurality of conductive sheets, and the computing unit 410b adjacent to the second end 410a2 in the second row of computing units 4102 is electrically connected to a conductive sheet adjacent to the lower edge of the board body 410a among the plurality of conductive sheets, thereby connecting the first row of computing units 4101 and the second row of computing units 4102 in series.

[0409] By way of example, the first conductive member 415 may be made of copper, aluminum or silver.

[0410] It should be noted that the above is only an exemplary description. Regarding the material selection of the first conductive member 415, those skilled in the art may adopt any type of conductive material currently known or to be known in the future, such as gold, platinum or conductive polymers with conductive properties.

[0411] In one embodiment, Fig.15 As shown, the first end 410a1 of the board body 410a is provided with a plug end 411, and the plug end 411 is used for plugging and matching with the plug interface of the power module 300.

[0412] Through the above implementation, the hash board 410 and the power module 300 do not need to be connected by wires, which simplifies the connection method between the hash board 410 and the power module 300, improves the convenience of disassembly and assembly between the two, and facilitates subsequent inspection and maintenance.

[0413] In one implementation, the computing units in the first row of computing units 4101 adjacent to the first end 410a1 and the computing units in the second row of computing units 4102 adjacent to the first end 410a1 are electrically connected to the plug-in end via the second conductive member 416 .

[0414] Exemplarily, the plug-in terminal 411 may include a positive terminal 411a and a negative terminal 411b, and the second conductive member 416 may include a positive conductive member 416a and a negative conductive member 416b, wherein the positive conductive member 416a is electrically connected to the positive terminal 411a, and the negative conductive member 416b is electrically connected to the negative terminal 411b.

[0415] In some examples, the positive electrode power connection terminal 411a is disposed adjacent to the upper edge of the plate body 410a, and the negative electrode power connection terminal 411b is disposed adjacent to the lower edge of the plate body 410a. The positive electrode conductive member 416a is disposed adjacent to the upper edge of the plate body 410a, and the negative electrode conductive member 416b is disposed adjacent to the lower edge of the plate body 410a. The positive electrode conductive member 416a is electrically connected to the positive electrode power connection terminal 411a, and the positive electrode conductive member 416a is electrically connected to the computing unit 410b adjacent to the first end 410a1 of the first row of computing units 4101. The negative electrode conductive member 416b is electrically connected to the negative electrode power connection terminal 411b, and the negative electrode conductive member 416b is electrically connected to the computing unit 410b adjacent to the first end 410a1 of the second row of computing units 4102. With this arrangement, the current can flow from the computing unit 410b adjacent to the first end 410a1 of the first row of computing units 4101 to the computing unit 410b adjacent to the second end 410a2, and then flow from the computing unit 410b adjacent to the second end 410a2 of the second row of computing units 4102 to the computing unit 410b adjacent to the first end 410a1.

[0416] In other examples, the negative electrode power connection terminal 411b is disposed adjacent to the upper edge of the plate body 410a, and the positive electrode power connection terminal 411a is disposed adjacent to the lower edge of the plate body 410a. The negative electrode conductive member 416b is disposed adjacent to the upper edge of the plate body 410a, and the positive electrode conductive member 416a is disposed adjacent to the lower edge of the plate body 410a. The positive electrode conductive member 416a is electrically connected to the positive electrode power connection terminal 411a, and the positive electrode conductive member 416a is electrically connected to the computing unit 410b adjacent to the first end 410a1 of the second row computing unit 4102. The negative electrode conductive member 416b is electrically connected to the negative electrode power connection terminal 411b, and the negative electrode conductive member 416b is electrically connected to the computing unit 410b adjacent to the first end 410a1 of the first row computing unit 4101. With this arrangement, the current can flow from the computing unit 410b of the second row of computing units 4102 adjacent to the first end 410a1 to the computing unit 410b adjacent to the second end 410a2, and then flow from the computing unit 410b of the first row of computing units 4101 adjacent to the second end 410a2 to the computing unit 410b adjacent to the first end 410a1.

[0417] By way of example, the second conductive member 416 may be made of copper, aluminum or silver.

[0418] It should be noted that the above is only an exemplary description. Regarding the material selection of the first conductive member 415, those skilled in the art may adopt any type of conductive material currently known or to be known in the future, such as gold, platinum or conductive polymers with conductive properties.

[0419] Fig.16 An enlarged schematic diagram of a local structure of a computing board of a computing device according to an embodiment of the present application is provided as an example. Fig.16 As shown, illustratively, the positive electrode terminal 411a and the positive electrode conductive member 416a may be electrically connected via a conductive row 417. The conductive row 417 may be an integral structural member; or, the conductive row 417 may include a plurality of conductive sheets electrically connected in sequence, with a gap between two adjacent conductive sheets, and electrically connected via wiring on the plate body 410a.

[0420] In one embodiment, Fig.16 As shown, the plug-in terminal 411 is also provided with a spare connection terminal 419a.

[0421] Exemplarily, the spare connection terminal 419a may be disposed between the positive terminal 411a and the negative terminal 411b. The size of the spare connection terminal 419a in the first direction L1 is greater than or equal to the size of the positive terminal 411a and the negative terminal 411b in the first direction L1.

[0422] It should be noted that the standby connection terminal 419a is electrically insulated from the positive power connection terminal 411a, the negative power connection terminal 411b, the positive conductive member 416a, the negative conductive member 416b, the computing unit 410b and other components on the board 410a, that is, the standby connection terminal 419a is not conductive with any component on the board 410a. The standby connection terminal 419a is used to act as a standby power connection terminal by being electrically connected to either the positive power connection terminal 411a or the negative power connection terminal 411b in the event of damage or failure of the positive power connection terminal 411a or the negative power connection terminal 411b.

[0423] Such a configuration can improve the maintenance convenience of the hash board 410 in the event of a failure.

[0424] In one embodiment, Fig.16 As shown, the plug-in end 411 is also provided with a detection connection end 419b.

[0425] Exemplarily, the detection connection terminal 419b is disposed between the positive power connection terminal 411a and the negative power connection terminal 411b. The detection connection terminal 419b and the standby power connection terminal are arranged side by side and spaced apart.

[0426] The distance between the edge of the detection connection terminal 419b adjacent to the first end 410a1 of the plate body 410a and the edge of the plate body 410a at the first end 410a1 is greater than the distance between the edge of the positive and negative power terminals 411a and 411b adjacent to the first end 410a1 of the plate body 410a and the edge of the plate body 410a at the first end 410a1. In other words, the edge of the detection connection terminal 419b adjacent to the first end 410a1 of the plate body 410a is disposed farther from the edge of the plate body 410a at the first end 410a1 than the edge of the positive and negative power terminals 411a and 411b adjacent to the first end 410a1 of the plate body 410a.

[0427] The distance between the edge of the detection connection terminal 419b away from the first end 410a1 of the plate body 410a and the edge of the plate body 410a at the first end 410a1 is equal to the distance between the edge of the positive and negative power terminals 411a and 411b away from the first end 410a1 of the plate body 410a and the edge of the plate body 410a at the first end 410a1. In other words, the edge of the detection connection terminal 419b away from the first end 410a1 of the plate body 410a is flush with the edge of the positive and negative power terminals 411a and 411b away from the first end 410a1 of the plate body 410a.

[0428] Exemplarily, a terminal corresponding to the detection connection terminal 419b is provided in the plug interface 303 of the power module 300. When the plug terminal 411 is not fully plugged into the plug interface 303 of the power module 300 and the detection connection terminal 419b does not form an electrical contact with the terminal in the plug interface 303, the detection connection terminal 419b outputs a first level signal. When the plug terminal 411 is fully plugged into the plug interface 303 of the power module 300 and the detection connection terminal 419b forms an electrical connection with the corresponding terminal in the plug interface 303 of the power module 300, the detection connection terminal 419b outputs a second level signal. Among them, one of the first level signal and the second level signal can be a low level signal, and the other can be a high level signal.

[0429] Therefore, according to the level signal output by the detection connection terminal 419b, it can be determined whether the plug-in terminal 411 of the power board 410 is plugged into the plug interface 303 of the power module 300, thereby realizing the detection of whether the power board 410 and the power module are assembled in place.

[0430] In one embodiment, Fig.15 As shown, the width of the plate body 410 a is greater than the width of the plug end 411 .

[0431] Exemplarily, the plug end 411 is formed by extending outward from the side edge of the first end 410a1 of the plate body 410a, and two side edges of the plug end 411 oppositely arranged in the width direction thereof have a cross-sectional difference with the two side edges in the width direction of the plate body 410a.

[0432] It should be noted that the plug end 411 is used to be electrically connected to the plug interface 303 of the power module 300. Since the plug interface 303 of the power module 300 adopts a standardized electrical connection interface, the width dimension of the plug end 411 needs to be set accordingly according to the standardized electrical connection interface. By setting the width dimension of the board body 410a to be larger than the width dimension of the plug end 411, the board body 410a can have a larger heat dissipation area in its width direction, thereby improving the heat dissipation capacity of the board body 410a itself.

[0433] In one embodiment, the board body 410 a is provided with a plurality of connection holes 412 , and the connection holes 412 are used for fasteners to pass through so as to install the heat dissipation structure 420 on the board body 410 a .

[0434] Exemplarily, the plurality of computing units 410b are arranged in two rows, and the two rows of computing units 410b are arranged at intervals in the width direction of the plate 410a. The plurality of connection holes 412 are arranged between the two rows of computing units, and the plurality of connection holes 412 are arranged at intervals along the first direction L1.

[0435] In some examples, the plurality of connection holes 412 may be arranged on a center line of the plate body 410a in the width direction. The plurality of connection holes 412 may be arranged at equal intervals.

[0436] In the embodiments of the present application, Figure 7 As shown, the heat dissipation structure 420 is thermally connected to the computing board 410. For example, the heat dissipation structure 420 is in contact with the computing board 410, or there is a small gap between the two, so that the heat dissipation structure 420 and the computing board 410 can exchange heat. During the operation of the computing board 410, the heat dissipation structure 420 absorbs the heat generated by the computing board 410 and conducts the heat to the cavity inside the housing assembly 100.

[0437] Exemplarily, the heat dissipation structure 420 may include a heat dissipation plate and a heat dissipation fin group arranged on the heat dissipation plate. The heat dissipation plate and the heat dissipation fin group may be two pairs, and the two pairs of heat dissipation plates and heat dissipation fin groups are respectively arranged on opposite sides of the plate body 410a. Each heat dissipation fin group includes a plurality of heat dissipation fins 421 arranged at intervals. A plurality of through holes corresponding to the plurality of connection holes 412 are provided on the heat dissipation plate, and fasteners pass through the through holes and are connected to the corresponding connection holes 412 to fix the heat dissipation plate to the surface of the plate body 410a.

[0438] Exemplarily, a guide gap may be defined between two adjacent heat dissipation fins 421 in each heat dissipation fin group, and an extension direction of the guide gap may be arranged parallel to the vertical direction.

[0439] Exemplarily, in each heat dissipation fin group, a plurality of heat dissipation fins 421 may be arranged side by side along the first direction L1, and any two adjacent heat dissipation fins are spaced from each other. The heat dissipation fins 421 may be in the form of sheets, and the plane where the heat dissipation fins 421 are located is arranged parallel to the vertical direction. Thus, a guide gap may be defined between two adjacent heat dissipation fins 421, and when the airflow flows through the heat dissipation fin group, it can quickly pass through the guide gap, which increases the contact area between the airflow and the heat dissipation fins 421 on the one hand, and ensures the flow rate of the airflow on the other hand, thereby increasing the heat exchange efficiency between the airflow and the heat dissipation structure 420.

[0440] In some examples, the heat dissipation structure 420 may include a heat dissipation fin group, which is disposed on a side surface of the computing board 410 where a computing unit is disposed, and the heat dissipation fin group may include a plurality of heat dissipation fins 421 disposed at intervals.

[0441] In other examples, the heat dissipation structure 420 may include two heat dissipation fin groups, and the two heat dissipation fin groups may be respectively arranged on opposite sides of the computing board 410, and each heat dissipation fin group may include a plurality of heat dissipation fins 421 arranged at intervals.

[0442] In a specific example, the heat dissipation structure 420 may include two heat dissipation fin groups arranged in parallel along the first direction L1 and thermally connected to the computing board 410. Among them, the two heat dissipation fin groups may be respectively arranged on opposite sides of the computing board 410 along the second direction L2, and each heat dissipation fin group may include a plurality of heat dissipation fins 421 arranged at intervals. The material of the heat dissipation fins 421 can be selected from metals with strong thermal conductivity, such as aluminum, copper and silver, and the surface of the heat dissipation fins 421 can be processed, such as coating with a thermal conductive coating or increasing the surface roughness, to further improve the heat dissipation efficiency. In addition, the thickness and spacing of the heat dissipation fins 421 can be designed by those skilled in the art according to specific heat dissipation requirements. The embodiment of the present application does not impose specific restrictions on the material, thickness, etc. of the heat dissipation fins 421, so as to achieve the role of ensuring heat dissipation performance.

[0443] In one embodiment, Figures 14 to 16 As shown, the computing board 410 also includes a first connector 413, and the first connector 413 is used for communicating with the data line of the control circuit board 530.

[0444] In the embodiment of the present application, the control circuit board 530 issues computing tasks and sends data to be processed to the computing board 410 through the data line. After the computing board 410 receives the computing tasks and data to be processed through the first connector 413, the multiple computing units 410b perform computing processing step by step. Among them, the computing processing order of the multiple computing units 410b is set opposite to the series direction of power transmission.

[0445] For example, the first connector 413 may be disposed adjacent to the first end 410a1 of the plate body 410a. The first connector 413 may be located between the positive electrode conductive member 416a and the negative electrode conductive member 416b.

[0446] With such configuration, the distance between the first connector 413 and the plug-in end 411 can be shortened, thereby shortening the wiring length between the first connector 413 and the plug-in end 411 .

[0447] In some examples, the first connector 413 can be centrally disposed between the positive conductor 416a and the negative conductor 416b.

[0448] In some other examples, the first connector 413 may be disposed between the positive conductive member 416 a and the negative conductive member 416 b , and the first connector 413 is disposed adjacent to the positive conductive member 416 a .

[0449] In some further examples, the first connector 413 may be disposed between the positive conductive member 416 a and the negative conductive member 416 b , and the first connector 413 is disposed adjacent to the negative conductive member 416 b .

[0450] It should be noted that the above description is only an exemplary description, and those skilled in the art can flexibly set the specific location of the first connector 413 on the board 410a according to actual conditions.

[0451] In one embodiment, Figures 14 to 16 As shown, the computing board 410 also includes a second connector 414, which is used to electrically connect to the cable of the temperature detection unit of the computing device 1.

[0452] In the embodiment of the present application, the computing device 1 may have multiple temperature detection units, which are distributed at different locations of the computing device 1 .

[0453] In some examples, an ambient temperature detection unit 70 may be disposed at the bottom of the housing assembly 100 of the computing device 1 for detecting the ambient temperature of the environment in which the computing device 1 is located.

[0454] In other examples, a temperature detection unit may be provided at the air inlet 20c and / or the air outlet 20b of the computing device 1 to detect the air inlet temperature and / or air outlet temperature of the computing device 1 .

[0455] In some other examples, the computing board 410 of the computing device 1 may also be provided with a temperature detection unit for detecting the temperature of the computing board 410 during operation. Fig.14 As shown, the computing board 410 also includes a temperature sensor 418, which can be disposed at the center of the board 410a so that the temperature value detected by the temperature sensor 418 conforms to the average temperature of the board 410a.

[0456] It should be noted that the above is only an exemplary description and cannot be understood as a limitation of the present application. In other examples of the present application, those skilled in the art can flexibly set the location of the temperature detection unit according to actual conditions. For example, the temperature detection unit can be set at the bottom of the housing assembly 100, the air inlet 20c, the air outlet 20b, and multiple locations in the computing board 410. In addition, the temperature detection unit can also be set at other locations of the computing device, such as inside the control module 500.

[0457] In some examples, the computing board 410 can supply power to the temperature detection unit via a cable connected to the second connector 414 .

[0458] In other examples, the computing board 410 can not only supply power to the temperature detection unit via a cable connected to the second connector 414, but also receive a temperature detection result from the temperature detection unit via a cable connected to the second connector 414, and transmit the temperature detection result to the control module 500 of the computing device 1.

[0459] Exemplarily, the control module 500 controls the working parameters of the computing board 410 and the fan 200 according to the temperature detection result. For example, when the temperature detection result of the ambient temperature detection unit 70 is lower than the corresponding temperature threshold, the control module 500 can control the computing board 410 to increase the operating frequency or control the fan 200 to increase the speed so that the temperature of the warm air discharged from the air outlet 20b increases. For another example, when the temperature of the temperature sensor 418 is higher than the corresponding temperature threshold, the control module 500 can control the computing board 410 to reduce the operating frequency or control the fan 200 to increase the speed to reduce the heat generated by the computing board 410 or improve the air cooling effect of the fan 200 on the computing board 410.

[0460] Other components of the computing device in the above embodiment may adopt various technical solutions known to ordinary technicians in the field now and in the future, and will not be described in detail here.

[0461] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0462] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0463] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0464] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0465] It should be noted that although the various steps of the method in the present application are described in a specific order in the accompanying drawings, this does not require or imply that these steps must be performed in this specific order, or that all the steps shown must be performed to achieve the desired results. Additionally or alternatively, some steps can be omitted, multiple steps can be combined into one step for execution, and / or one step can be decomposed into multiple steps for execution, etc. The above-mentioned drawings are only schematic illustrations of the processing included in the method according to the exemplary embodiments of the present application, and are not intended to be limiting. It is easy to understand that the processing shown in the above-mentioned drawings does not indicate or limit the time sequence of these processing. In addition, it is also easy to understand that these processing can be, for example, performed synchronously or asynchronously in multiple modules.

[0466] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0467] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A computing device, characterized in that include: A shell assembly defines a cavity inside, and the shell assembly is provided with an air inlet and an air outlet communicated with the cavity; A computing module is disposed in the cavity; A fan is disposed in the cavity and is used to generate an airflow flowing from the air inlet to the air outlet, and the airflow flows through the computing module.

2. The computing device according to claim 1, wherein: The air outlet is arranged on the side of the housing assembly.

3. The computing device according to claim 2, characterized in that The fan is arranged on the upper side of the computing module, and the air outlet is arranged adjacent to the top of the housing assembly.

4. The computing device according to claim 3, characterized in that The air inlet is arranged on the side of the housing assembly.

5. The computing device according to claim 4, characterized in that The air inlet and the air outlet are arranged on different sides of the shell assembly.

6. The computing device according to claim 4, characterized in that The air inlet and the air outlet are arranged on the same side of the housing assembly.

7. The computing device according to claim 4, characterized in that The air inlet is arranged adjacent to the bottom of the housing assembly.

8. The computing device according to claim 3, characterized in that The air inlet is arranged at the bottom of the shell assembly.

9. The computing device according to claim 1, wherein: The computing module includes a computing board and a heat dissipation structure, and the heat dissipation structure is thermally connected to the computing board.

10. The computing device according to claim 9, characterized in that The plane where the computing board is located is arranged parallel to the vertical direction.

11. The computing device according to claim 10, characterized in that The heat dissipation structure includes at least one heat dissipation fin group, and the heat dissipation fin group is arranged on at least one side of the computing board. Each of the heat dissipation fin groups includes a plurality of heat dissipation fins arranged at intervals.

12. The computing device according to claim 11, characterized in that A flow guiding gap is defined between two adjacent heat dissipating fins in the heat dissipating fin group, and an extension direction of the flow guiding gap is arranged parallel to the vertical direction.

13. The computing device according to claim 11, characterized in that The end of each heat dissipation fin in each heat dissipation fin group away from the computing board is spaced apart from the inner wall of the cavity.

14. The computing device according to claim 11, characterized in that The number of the heat dissipation fin groups is two, and the two heat dissipation fin groups are respectively arranged on opposite sides of the computing board.

15. The computing device according to claim 9, characterized in that The heat dissipation structure also includes a plurality of support beams arranged at the bottom of the computing board, the plurality of support beams are arranged at intervals along the first direction, and each of the support beams is supported on the bottom wall of the cavity.

16. The computing device according to claim 1, wherein: The fan has an air flow inlet and an air flow outlet, wherein the air flow inlet is arranged adjacent to the air inlet, and the air flow outlet is arranged adjacent to the air outlet; an air inlet direction of the air flow inlet and an air outlet direction of the air flow outlet form an angle.

17. The computing device according to claim 16, characterized in that The fan comprises a cross-flow fan, and the air inlet direction of the air flow inlet and the air outlet direction of the air flow outlet are perpendicular to each other.

18. The computing device according to claim 1, wherein: Also includes: The power module is arranged in the cavity, the power fan is arranged side by side with the computing module in the first direction of the housing assembly, and the airflow generated by the fan flows through the power module and the computing module.

19. The computing device according to claim 18, characterized in that The power module has a plug interface, and the computing board of the computing module has a plug end, and the plug end is plugged and matched with the plug interface to electrically connect the computing board to the power module.

20. The computing device according to any one of claims 1 to 19, characterized in that: The housing assembly comprises an inner shell, and the computing module, the fan and the power module are integrated in the inner shell.

21. The computing device of claim 20, wherein: The housing assembly further includes an outer shell, the interior of which defines the cavity, a first mounting opening is provided on one side of the outer shell in a first direction, and the inner shell is slidably mounted in the cavity through the first mounting opening.

22. The computing device of claim 21, wherein: The inner shell defines an accommodating cavity inside, and the computing module and the power module are arranged side by side in the accommodating cavity along the first direction; the top of the inner shell defines an installation groove, and the fan is arranged in the installation groove.

23. The computing device of claim 22, wherein: A first side baffle and a second side baffle are disposed on the top of the inner shell. The first side baffle and the second side baffle are disposed opposite to each other in the second direction. The mounting groove is defined between the first side baffle and the second side baffle.

24. The computing device of claim 23, wherein: The first side baffle plate and the second side baffle plate are respectively in contact with the outer wall surface of the fan.

25. The computing device of claim 23, wherein: The inner shell has two side walls arranged opposite to each other in the second direction, and the inner wall surfaces of the two side walls are respectively provided with supporting ribs, and the two supporting ribs are respectively arranged adjacent to the top of the inner shell; wherein the mounting groove is jointly defined by the first side baffle plate, the second side baffle plate and the two supporting ribs.

26. The computing device of claim 25, wherein: The supporting ribs are formed by the inner wall surface of the side wall protruding inwardly, and the length direction of the supporting ribs is parallel to the first direction.

27. The computing device of claim 26, wherein: The two side walls of the inner shell are respectively provided with limit folded edges, and the limit folded edges extend downwardly from the side walls in a direction toward the inner wall surface of the outer shell.

28. The computing device of claim 27, wherein: The two inner wall surfaces of the outer shell opposite to each other in the second direction are respectively provided with stoppers, and the stoppers extend upwardly obliquely from the inner wall surface of the outer shell in a direction toward the outer wall surface of the inner shell, and the stoppers are located at the lower side of the limiting folded edge.

29. The computing device of claim 22, wherein: The bottom of the inner shell has a bottom open area connected to the accommodating cavity, and the side of the inner shell has a side open area connected to the accommodating cavity. The bottom open area is connected to the air inlet correspondingly, and the side open area is connected to the air outlet correspondingly.

30. The computing device of claim 21, wherein: The housing assembly further comprises: The mounting side plate is detachably mounted on the first mounting opening and is used to close the first mounting opening.

31. The computing device of claim 30, wherein: The end of the fan adjacent to the first installation opening is provided with a snap-fitting protrusion, and the installation side plate is provided with a penetrating first snap-fitting hole, and the first snap-fitting hole forms a snap-fitting fit with the snap-fitting protrusion of the fan.

32. The computing device of claim 30, wherein: The mounting side plate is provided with a through-hole for passing a wire through the hole, and the through-hole is used for passing a wire connecting the control module and the power module through the hole. The control module is arranged outside the accommodating cavity of the inner shell.

33. The computing device of claim 32, wherein: The outer shell has an extending portion extending along a first direction, the extending portion defines an installation space, and the installation space is adjacent to the inner shell in the first direction, and the installation space is used to install the control module.

34. The computing device of claim 33, wherein: The top of the installation space is open.

35. The computing device of claim 21, wherein: The other side of the shell in the first direction is provided with a second installation opening; the shell assembly further comprises a sealing side plate, which is detachably mounted on the second installation opening to seal the second installation opening.

36. The computing device of claim 35, wherein: The cover side panel and the control module are respectively located on opposite sides of the shell in the first direction, the cover side panel is provided with a snap-fitting portion, and the control module is provided with a snap-fitting portion; in two computing devices arranged adjacent to each other along the first direction, the snap-fitting portion of one of the computing devices forms a snap-fitting with the snap-fitting portion of the other computing device.

37. The computing device according to any one of claims 1 to 19, characterized in that: Also includes: The control module includes a control box and a control circuit board. The control box defines an installation cavity inside. The control box is detachably installed on the housing assembly. The control circuit board is arranged in the installation cavity. The control circuit board is used to be electrically connected to the computing module and the power supply module respectively.

38. The computing device of claim 37, wherein: The control box comprises a shell and a side cover plate, wherein the shell defines the installation cavity and a lateral opening communicating with the installation cavity, and the side cover plate is detachably mounted on the lateral opening.

39. The computing device of claim 38, wherein: The side cover plate is provided with a through-hole for passing a cable of the power module through and electrically connecting the cable to the control circuit board.

40. The computing device of claim 39, wherein: The end of the fan is provided with a snap-fitting protrusion; the side cover plate is also provided with a snap-fitting hole, the shape of which is adapted to the shape of the snap-fitting protrusion, and the snap-fitting hole is used to form a snap-fitting fit with the snap-fitting protrusion.

41. The computing device of claim 40, wherein: The side cover plate has a recessed portion, which is recessed in a direction toward the installation cavity. The recessed portion defines a cable storage groove, and the wire passing hole and the clamping hole are both arranged in the recessed portion.

42. The computing device of claim 38, wherein: A clamping hole is provided on one side of the housing assembly adjacent to the control box, and a clamping protrusion is provided on one side of the side cover plate adjacent to the housing assembly, and the clamping protrusion is used to form a clamping fit with the clamping hole; or, A snap-fitting protrusion is provided on one side of the housing assembly adjacent to the control box, and a snap-fitting hole is provided on the side cover plate. The snap-fitting hole is used to form a snap-fitting fit with the snap-fitting protrusion.

43. The computing device of claim 38, wherein: The shell comprises an upper shell and a lower shell, the bottom of the upper shell is connected to the top of the lower shell; wherein the material of the upper shell is a transparent material.

44. The computing device of claim 43, wherein: The control module further comprises a display screen, which is arranged in the installation cavity and electrically connected to the control circuit board, and a display area of ​​the display screen is arranged opposite to the upper shell.

45. The computing device of claim 37, wherein: The outer side wall of the control box of the control module is provided with a snap-fitting portion, and the snap-fitting portion is arranged correspondingly to the snap-fitting portion on the cover side plate of the housing assembly.

46. ​​The computing device of claim 45, wherein: The clamping portion is a protruding structure, and the clamping matching portion is a groove structure; or, the clamping portion is a groove structure, and the clamping matching portion is a protruding structure.

47. The computing device according to any one of claims 1 to 19, characterized in that The computing board of the computing module includes a board body and a plurality of computing units, wherein the plurality of computing units are arranged on a side surface of the board body, a length direction of the board body is parallel to a first direction, and a width direction of the board body is parallel to a vertical direction.

48. The computing device of claim 47, wherein: The ratio of the width dimension of the plate body to the length dimension of the plate body is less than or equal to 1 / 6.

49. The computing device of claim 47, wherein: The plurality of computing units are disposed on a side surface of the plate body, and the plurality of computing units are arranged in at least one row, and the plurality of computing units in each row are adjacently arranged along a length direction of the plate body.

50. The computing device of claim 47, wherein: The plurality of computing units are arranged in two rows, and the computing units in the two rows are spaced apart in the width direction of the plate.

51. The computing device of claim 50, wherein: The two rows of computing units are arranged in series.

52. The computing device of claim 51, wherein: The plate body includes a first end and a second end which are arranged opposite to each other in the length direction thereof, and a computing unit in a first row of computing units adjacent to the second end is electrically connected to a computing unit in a second row of computing units adjacent to the second end through a first conductive member.

53. The computing device of claim 52, wherein: The first end of the board body is provided with a plug-in end, and the plug-in end is used for plugging and matching with the plug interface of the power module.

54. The computing device of claim 53, wherein: The computing units in the first row of computing units adjacent to the first end and the computing units in the second row of computing units adjacent to the first end are electrically connected to the plug-in end through a second conductive member.

55. The computing device of claim 53, wherein: The width of the plate body is greater than the width of the plug end.

56. The computing device of claim 47, wherein: The plate body is provided with a plurality of connection holes, and the connection holes are used for fasteners to pass through so as to install the heat dissipation structure on the plate body.

57. The computing device of claim 56, wherein: The plurality of computing units are arranged in two rows, and the computing units in the two rows are spaced apart in the width direction of the plate; wherein the plurality of connection holes are arranged between the computing units in the two rows, and the plurality of connection holes are spaced apart along the first direction.

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