Cooling method, system, device, equipment and medium

Abstract

The invention discloses a cooling method, system, device and equipment and a medium, and relates to the technical field of electronic equipment. The method comprises the steps that a main processor obtains the current temperature of the electronic equipment, and the electronic equipment comprises the main processor and an auxiliary processor; a target processor obtains a current load scene, wherein the target processor is one of a main processor and an auxiliary processor; the target processor determines a cooling strategy according to the current load scene and the current temperature; and the target processor executes the cooling strategy. According to the method, the main processor and / or the auxiliary processor can adaptively execute the cooling strategy according to the current load scene and the temperature, so that the electronic equipment is dynamically cooled. The invention discloses a method for reducing the temperature of electronic equipment.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and more specifically, to a cooling method, a cooling system, a cooling device, an electronic device, and a computer-readable storage medium. Background Art

[0002] With the development of science and technology and economy, various head-mounted devices (such as VR, AR, XR and MR, etc.) have been used more and more widely. For example, vehicle drivers wear smart glasses that display navigation maps for driving reference.

[0003] At present, there is a problem that the temperature of head-mounted devices exceeds the allowable temperature range due to long operation time. This will cause the head-mounted devices to operate unstably. Therefore, how to reduce the temperature of head-mounted devices has become one of the technical problems that need to be solved urgently. Summary of the invention

[0004] One object of the present application is to provide a new technical solution for cooling.

[0005] According to a first aspect of the present application, a cooling method is provided, comprising:

[0006] The main processor acquires the current temperature of the electronic device, wherein the electronic device includes the main processor and the auxiliary processor;

[0007] The target processor acquires the current load scenario, the target processor being one of the main processor or the auxiliary processor;

[0008] The target processor determines a cooling strategy according to the current load scenario and the current temperature;

[0009] The target processor executes the cooling strategy.

[0010] Optionally, the target processor determines a cooling strategy according to the current load scenario and the current temperature, including:

[0011] The current load scenario is a first load scenario, the main processor as the target processor obtains the current load scenario, and the main processor determines a first cooling strategy of the main processor according to the first load scenario and the current temperature;

[0012] The target processor executes the cooling strategy, including:

[0013] The main processor executes a first cooling strategy of the main processor;

[0014] The method further includes: the main processor notifying the auxiliary processor that the current temperature and the current load scenario are the first load scenario;

[0015] The auxiliary processor determines a first cooling strategy for the auxiliary processor according to the first load scenario and the current temperature;

[0016] The auxiliary processor executes a first cooling strategy of the auxiliary processor.

[0017] Optionally, the target processor determines a cooling strategy according to the current load scenario and the current temperature, including:

[0018] The current load scenario is a second load scenario, the main processor as a target processor obtains the current load scenario, and the main processor determines a second cooling strategy of the main processor and a second cooling strategy of the auxiliary processor according to the second load scenario and the current temperature;

[0019] The target processor executes the cooling strategy, including:

[0020] The main processor executes a second cooling strategy of the main processor;

[0021] The method further includes: the main processor sending the second cooling strategy of the auxiliary processor to the auxiliary processor;

[0022] The auxiliary processor executes a second temperature reduction strategy of the auxiliary processor.

[0023] Optionally, the target processor determines a cooling strategy according to the current load scenario and the current temperature, including:

[0024] The current load scenario is a third load scenario, the auxiliary processor, as a target processor, obtains the current load scenario, and the auxiliary processor obtains the current temperature from the main processor;

[0025] The auxiliary processor determines a third cooling strategy of the auxiliary processor according to a third load scenario and a current temperature;

[0026] The target processor executes the cooling strategy, including:

[0027] The auxiliary processor executes a third temperature reduction strategy of the auxiliary processor.

[0028] Optionally, the target processor obtains a current load scenario, including:

[0029] In a case where the current temperature of the electronic device is greater than a temperature threshold, the target processor assists the processor in acquiring a current load scenario.

[0030] Optionally, the main processor acquires the current temperature of the electronic device, including:

[0031] The main processor obtains the current temperature of the main processor;

[0032] The auxiliary processor acquires the current temperature of the auxiliary processor and sends the current temperature of the auxiliary processor to the main processor;

[0033] The main processor determines the current temperature of the electronic device according to the current temperature of the main processor and the current temperature of the auxiliary processor.

[0034] According to a second aspect of the present application, a cooling system is provided, the cooling system comprising: a main processor and an auxiliary processor, wherein:

[0035] The main processor is used to obtain the current temperature of the electronic device, and the electronic device includes the main processor and the auxiliary processor;

[0036] The target processor is used to obtain the current load scenario, and the target processor is one of the main processor or the auxiliary processor;

[0037] The target processor is used to determine a cooling strategy according to the current load scenario and the current temperature, and the target processor is one of the main processor or the auxiliary processor;

[0038] The target processor is used to execute the cooling strategy.

[0039] According to a third aspect of the present application, a cooling device is provided, comprising:

[0040] A first acquisition module, used to acquire a current temperature of an electronic device, wherein the electronic device includes a main processor and an auxiliary processor;

[0041] The second acquisition module is used to acquire the current load scenario;

[0042] A determination module, used to determine a cooling strategy according to the current load scenario and the current temperature;

[0043] An execution module is used to execute the cooling strategy.

[0044] According to a fourth aspect of the present application, an electronic device is provided, the electronic device comprising the cooling device according to the third aspect;

[0045] Alternatively, the electronic device includes the cooling system as described in the second aspect;

[0046] The electronic device includes a memory, a main processor, and an auxiliary processor, the memory is used to store computer instructions, and the main processor and / or the auxiliary processor are used to call the computer instructions from the memory to execute the cooling method as described in any one of the first aspects.

[0047] According to a fifth aspect of the present application, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the temperature reduction method according to any one of the first aspects is implemented.

[0048] The embodiment of the present application provides a cooling method, which includes: the main processor obtains the current temperature of the electronic device, and the electronic device includes a main processor and an auxiliary processor; the main processor or the auxiliary processor obtains the current load scenario; the target processor determines the cooling strategy according to the current load scenario and the current temperature, and the target processor obtains the current load scenario, and the target processor is the main processor or the auxiliary processor; the target processor executes the cooling strategy. This method can realize the main processor and / or auxiliary processor to adaptively execute the cooling strategy according to the current load scenario and temperature, thereby realizing dynamic cooling of the electronic device. That is to say, the embodiment of the present application provides a method for reducing the temperature of an electronic device.

[0049] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0051] Figure 1 A hardware configuration of an electronic device for implementing a cooling method according to an embodiment of the present application is provided. Figure 1 ;

[0052] Figure 2 A schematic diagram of a cooling method according to an embodiment of the present invention Figure 1 ;

[0053] Figure 3 A schematic diagram of a cooling method according to an embodiment of the present invention Figure 2 ;

[0054] Figure 4 A schematic diagram of a cooling method according to an embodiment of the present invention Figure 3 ;

[0055] Figure 5 A schematic diagram of a cooling method according to an embodiment of the present invention Figure 4 ;

[0056] Figure 6 is a structural schematic diagram of a cooling device provided according to an embodiment of the present application;

[0057] Figure 7 A hardware configuration of an electronic device for implementing a cooling method according to an embodiment of the present application is provided. Figure 2 . DETAILED DESCRIPTION

[0058] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0059] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0060] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0061] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0062] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0063] Figure 1 A hardware configuration of an electronic device for implementing a cooling method according to an embodiment of the present application is provided. Figure 1 .

[0064] The electronic device 1000 may be a terminal or a server. Further, the terminal may be a head mounted device (such as an AR device, an MR device, and a VR device), a portable computer, a tablet computer, a PDA, etc. The server may be a cloud server, etc.

[0065] The electronic device 1000 may include a processor 1100, a memory 1200, an interface device 1300, a communication device 1400, a display device 1500, an input device 1600, a speaker 1700, a microphone 1800, and the like. The processor 1100 may be a central processing unit CPU, a microprocessor MCU, and the like. The memory 1200 may include, for example, a ROM (read-only memory), a RAM (random access memory), a non-volatile memory such as a hard disk, and the like. The interface device 1300 may include, for example, a USB interface, an earphone interface, and the like. The communication device 1400 may, for example, be capable of wired or wireless communication. The display device 1500 may be, for example, a liquid crystal display screen, a touch display screen, and the like. The input device 1600 may include, for example, a touch screen, a keyboard, and the like. The user may input / output voice information through the speaker 1700 and the microphone 1800. The processor 1100 includes a main processor 1110 and an auxiliary processor 1120.

[0066] Despite Figure 1 Multiple devices are shown for the electronic device 1000, but the present application may only involve some of the devices, for example, the electronic device 1000 only involves the memory 1200 and the processor 1100.

[0067] In the embodiment of the present application, the memory 1200 of the electronic device 1000 is used to store instructions, and the instructions are used to control the processor 1100 to execute the cooling method provided in the embodiment of the present application.

[0068] In the above description, the technician can design instructions according to the scheme disclosed in this application. How instructions control the processor to operate is well known in the art, so it will not be described in detail here.

[0069] The present application embodiment provides a cooling method, such as Figure 2 As shown, the method includes the following S2100-S2400:

[0070] S2100. The main processor obtains the current temperature of the electronic device.

[0071] The electronic device includes a main processor and an auxiliary processor.

[0072] In an embodiment of the present application, the main processor and the auxiliary processor are communicatively connected. In an exemplary embodiment, the main processor and the auxiliary processor are communicatively connected via an SPI interface.

[0073] In one embodiment of the present application, a temperature sensor may be provided on the electronic device at a position that may represent the temperature of the electronic device, and the main processor may obtain the current temperature of the electronic device based on the temperature currently collected by the temperature sensor.

[0074] In another embodiment of the present application, the above S2100 may also be implemented by the following S2110-S2130:

[0075] S2110. The main processor obtains the current temperature of the main processor.

[0076] In one embodiment of the present application, a temperature sensor may be disposed inside or on the surface of the main processor, and the main processor may obtain the current temperature of the main processor according to the temperature currently collected by the temperature sensor.

[0077] Of course, other methods may also be used to obtain the current temperature of the main processor, which is not limited in the present embodiment of the application.

[0078] S2120. The auxiliary processor obtains the current temperature of the auxiliary processor and sends the current temperature of the auxiliary processor to the main processor.

[0079] In the embodiment of the present application, the way in which the auxiliary processor obtains the current temperature of the auxiliary processor can refer to the way in which the main processor obtains the current temperature of the main processor in the above S2110, which will not be repeated here.

[0080] And, after acquiring the current temperature of the auxiliary processor, the auxiliary processor sends the current temperature of the auxiliary processor to the main processor, so that the main processor can determine the current temperature of the electronic device.

[0081] S2130: The main processor determines the current temperature of the electronic device according to the current temperature of the main processor and the current temperature of the auxiliary processor.

[0082] In one embodiment of the present application, the above S2130 may be specifically implemented as follows: the main processor fits the current temperature of the main processor and the current temperature of the auxiliary processor according to a pre-trained algorithm to obtain the current temperature of the electronic device. The pre-trained algorithm may be exemplarily a neural network model pre-trained according to a training sample, and a training sample includes the actual temperature of the main processor, the actual temperature of the auxiliary processor, and the corresponding actual temperature of the electronic device at the same time.

[0083] S2200. The target processor obtains a current load scenario.

[0084] The target processor is one of the main processor and the auxiliary processor.

[0085] In the embodiment of the present application, the processor that obtains the current load scenario is used as the target processor. Specifically, when the main processor obtains the current load scenario, the main processor is used as the target processor. When the auxiliary processor obtains the current load scenario, the auxiliary processor is used as the target processor.

[0086] In the embodiment of the present application, the load scenario is used to describe the load level of the processor of the electronic device during operation.

[0087] In one embodiment of the present application, the load scenario can be divided into a high load scenario, a medium load scenario, and a low load scenario according to the computing resource usage. The computing resource usage corresponding to the high load scenario is greater than the computing resource usage corresponding to the medium load scenario, and the computing resource usage corresponding to the medium load scenario is greater than the computing resource usage corresponding to the low load scenario.

[0088] Of course, the load scenarios can also be divided into more levels of load scenarios.

[0089] It is understandable that different applications have different resource usage. Therefore, a mapping relationship between applications and load scenarios can be pre-established based on the resource usage corresponding to the applications. And the mapping relationship is stored in the electronic device. Among them, the application can be embodied in the electronic device in the form of an identifier. Based on this, the specific implementation of the above S2200 can be:

[0090] The target processor obtains the application currently running on the electronic device, and determines the current load scenario according to the currently running application and the above mapping relationship.

[0091] In an example, the above mapping relationship can be: game applications correspond to high-load scenarios; audio applications, video applications and camera applications correspond to medium-load scenarios; sports (such as pedometer) applications, settings applications and menu applications correspond to low-load scenarios.

[0092] It should be further explained that in the design of the main and auxiliary dual processors, for applications corresponding to high-load scenarios, they are run by the main processor, and the main processor instructs the auxiliary processor to assist the main processor in running. For applications corresponding to medium-load scenarios, they are run by the main processor. For applications corresponding to low-load scenarios, they are run by the auxiliary processor. And, no matter which of the high-load scenarios, medium-load scenarios, and low-load scenarios, the auxiliary processor is required to provide basic data (such as sensor data).

[0093] For example, taking the electronic device as VR glasses, for a game application, during the operation of the main processor, the main processor will instruct the auxiliary processor to assist in certain operations to increase the running speed of the game application. The auxiliary processor collects IMU data, and the main processor calls IMU data to complete the operation of the game application.

[0094] For another example, the electronic device is a VR device, and the VR device is connected to the user's smartphone via Bluetooth. For video applications, the auxiliary processor receives video data from the mobile phone based on the Bluetooth connection and sends it to the main processor. The processor runs the video application and plays the video data received from the auxiliary processor.

[0095] Based on the above content, it can be known that when the current load scene is a high load scene and a medium load scene, the main processor can obtain the current load scene, while the auxiliary processor cannot. When the current scene is a low load scene, the auxiliary processor can obtain the current load scene, while the main processor cannot obtain the current load scene. Based on this, when the current load scene is a high load scene or a low load scene, the main processor can obtain the current load scene. At this time, the main processor is the target processor. Correspondingly, when the current load scene is a low load scene, the auxiliary processor can obtain the current load scene. At this time, the auxiliary processor is the target processor.

[0096] In addition, in one embodiment of the present application, the above S2200 can be specifically implemented by the following S2210:

[0097] S2210: When the current temperature of the electronic device is greater than a temperature threshold, the target processor obtains a current load scenario.

[0098] In the embodiment of the present application, the temperature threshold is the maximum temperature of the electronic device when it is operating stably.

[0099] In one example, the temperature threshold is 65°C.

[0100] It should be noted that the embodiment of the present application does not limit the specific value of the temperature threshold.

[0101] Corresponding to the above S2210, when the current temperature of the electronic device is less than or equal to the temperature threshold, the above step S2100 is repeatedly executed to monitor the current temperature of the electronic device.

[0102] In the embodiment of the present application, when the current temperature of the electronic device is greater than the temperature threshold, it indicates that the temperature of the electronic device is unstable. At this time, the target processor obtains the current load scenario and then executes the following S2300 to cool the electronic device. In this way, unnecessary computing overhead of the electronic device can be avoided.

[0103] S2300. The target processor determines a cooling strategy according to a current load scenario and a current temperature.

[0104] S2400. The target processor executes a cooling strategy.

[0105] In the embodiment of the present application, the high load scenario is recorded as the first load scenario, the medium load scenario is recorded as the second load scenario, and the low load scenario is recorded as the third load scenario. Corresponding to the three different load scenarios, the above S2300 can be implemented in the following three ways:

[0106] Method 1: Figure 3 As shown, when the current load scenario is the first load scenario, the above S2300 is implemented by the following S2310:

[0107] S2310: The current load scenario is a first load scenario. The main processor, as a target processor, obtains the current load scenario. The main processor determines a first cooling strategy of the main processor according to the first load scenario and the current temperature.

[0108] In the embodiment of the present application, the electronic device pre-stores cooling strategies corresponding to different first load scenarios in different temperature ranges.

[0109] The cooling strategy is specifically an event that can reduce the temperature of the electronic device, and can be set based on experience. Specifically, the cooling strategy corresponding to the main processor is specifically an event that can be executed by the main processor to reduce the temperature of the electronic device. The cooling strategy corresponding to the auxiliary processor is specifically an event that can be executed by the auxiliary processor to reduce the temperature of the electronic device.

[0110] The cooling strategy corresponding to the temperature range corresponding to the higher temperature can reduce the temperature of the electronic device to a higher degree. In the cooling strategies corresponding to different temperature ranges of the same first load scenario, the number of specific cooling strategies is different, and / or the parameter values ​​corresponding to the same cooling strategy are different.

[0111] In an example, the cooling strategy corresponding to the first load scenario within a temperature range may be: reducing the CPU frequency by a preset ratio, reducing the GPU frequency by a preset ratio, reducing the main display brightness by a preset ratio, reducing the charging current by a preset ratio, reducing the camera contrast by a preset ratio, etc.

[0112] Combined with the above description, in an example, for the same first load scenario, the cooling strategy corresponding to the temperature range [T1, T2) is: CPU frequency reduced by 20%, GPU frequency reduced by 20%, main display brightness reduced by 20%, charging current reduced by 20%, and camera contrast reduced by 20%. The cooling strategy corresponding to the temperature range [T2, T3) is: CPU frequency reduced by 30%, GPU frequency reduced by 30%, main display brightness reduced by 30%, charging current reduced by 30%, and camera contrast reduced by 30%. Alternatively, the cooling strategy corresponding to the temperature range [T2, T3) is: CPU frequency reduced by 20%, GPU frequency reduced by 20%, and main display brightness reduced by 20%. Among them, T3>T2>T1.

[0113] In combination with the above content, the specific implementation of the above S2310 is: the main processor searches for the cooling strategy that matches the first load scenario obtained based on the above S2200 and the current temperature obtained based on the above S2100 from the cooling strategies corresponding to the different first load scenarios in different temperature ranges stored in advance, and uses the cooling strategy as the first cooling strategy. Based on this, the above S2400 is specifically implemented by the following S2410:

[0114] S2410: The target processor executes a first cooling strategy.

[0115] In the embodiment of the present application, the electronic device can be cooled down through the above S2410.

[0116] In the embodiment of the present application, since the first load scenario is a high load scenario, the electronic device heats up quickly. At this time, in order to cool down the electronic device faster, the cooling method provided in the embodiment of the present application further includes the following S2510 to S2512:

[0117] S2510: The main processor notifies the auxiliary processor that the current temperature and the current load scenario are the first load scenario.

[0118] S2511. The auxiliary processor determines a first cooling strategy for the auxiliary processor according to the first load scenario and the current temperature.

[0119] In the embodiment of the present application, the specific implementation of the above S2511 is similar to the specific implementation of the above S2310, which will not be repeated here.

[0120] S2512: The auxiliary processor executes a first cooling strategy for the auxiliary processor.

[0121] Method 2: Figure 4 As shown, when the current load scenario is the first load scenario, the above S2300 is implemented by the following S2320:

[0122] S2320: The current load scenario is the second load scenario. The main processor, as the target processor, obtains the current load scenario. The main processor determines a second cooling strategy for the main processor and a second cooling strategy for the auxiliary processor according to the second load scenario and the current temperature.

[0123] In the embodiment of the present application, since the second load scenario is a medium load scenario, the electronic device heats up relatively quickly. In addition, the electronic device pre-stores the cooling strategies of the main processor and the auxiliary processor corresponding to different second load scenarios in different temperature ranges.

[0124] Compared with the cooling strategy of the main processor corresponding to the first load scenario in a temperature range, the cooling strategy of the main processor corresponding to the second load scenario in the same temperature range can reduce the temperature of the electronic device to a lower degree.

[0125] Compared with the cooling strategy of the auxiliary processor corresponding to the first load scenario in a temperature range, the cooling strategy of the auxiliary processor corresponding to the second load scenario in the same temperature range can reduce the temperature of the electronic device to a lower degree.

[0126] Furthermore, the specific implementation of the above S2320 is as follows: the main processor searches for the cooling strategies of the main processor and the cooling strategies of the auxiliary processor corresponding to the second load scenario in different temperature ranges in the pre-stored different second load scenarios, and finds the cooling strategy of the main processor and the cooling strategy of the auxiliary processor that match the second load scenario obtained in the above S2200 and the temperature obtained in the above S2100, and uses the cooling strategy of the main processor as the second cooling strategy of the main processor, and uses the cooling strategy of the auxiliary processor as the second cooling strategy of the auxiliary processor. Based on this, the above S2400 is specifically implemented by the following S2420:

[0127] S2420: The main processor executes a second cooling strategy of the main processor.

[0128] Based on the above content, the cooling method provided in the embodiment of the present application further includes the following S2520 and S2521:

[0129] S2520: The main processor sends the second cooling strategy of the auxiliary processor to the auxiliary processor.

[0130] S2521. The auxiliary processor executes a second cooling strategy for the auxiliary processor.

[0131] Method 3: If Figure 5 As shown, when the current load scenario is the third load scenario, the above S2300 is implemented by the following S2330 and S2331:

[0132] S2330: The current load scenario is the third load scenario. The auxiliary processor, as the target processor, obtains the current load scenario. The auxiliary processor obtains the current temperature from the main processor.

[0133] S2331. The auxiliary processor determines a third cooling strategy for the auxiliary processor according to the third load scenario and the current temperature.

[0134] In the embodiment of the present application, since the third load scenario is a low load scenario, the temperature rise speed of the electronic device is slow.

[0135] For the auxiliary processor, compared with the cooling strategy of the auxiliary processor corresponding to the second load scenario in a temperature range, the cooling strategy of the auxiliary processor corresponding to the third load scenario in the same temperature range can reduce the temperature of the electronic device to a lower degree.

[0136] Furthermore, the specific implementation of the above S2331 is similar to the specific implementation of the above S2310, and will not be repeated here.

[0137] Based on the above S2331, the above S2400 is specifically implemented as follows S2430:

[0138] S2430: The auxiliary processor executes the third cooling strategy of the auxiliary processor.

[0139] In combination with the above content, it can be seen that in the embodiment of the present application, according to the current load scenario and the current temperature, the main processor and / or the auxiliary processor adaptively execute the cooling strategy, thereby realizing dynamic cooling of the electronic device. That is to say, the embodiment of the present application provides a method for reducing the temperature of the electronic device.

[0140] The embodiment of the present application provides a cooling method, which includes: the main processor obtains the current temperature of the electronic device, and the electronic device includes a main processor and an auxiliary processor; the main processor or the auxiliary processor obtains the current load scenario; the target processor determines the cooling strategy according to the current load scenario and the current temperature, and the target processor obtains the current load scenario, and the target processor is the main processor or the auxiliary processor; the target processor executes the cooling strategy. This method can realize the main processor and / or auxiliary processor to adaptively execute the cooling strategy according to the current load scenario and temperature, thereby realizing dynamic cooling of the electronic device. That is to say, the embodiment of the present application provides a method for reducing the temperature of an electronic device.

[0141] The embodiment of the present application also provides a cooling system, including: a main processor and an auxiliary processor, wherein:

[0142] The main processor is used to obtain the current temperature of the electronic device, and the electronic device includes the main processor and the auxiliary processor;

[0143] The target processor is used to obtain the current load scenario, and the target processor is the main processor or the auxiliary processor;

[0144] The target processor is used to determine a cooling strategy according to the current load scenario and the current temperature, and the target processor is one of the main processor or the auxiliary processor;

[0145] The target processor is used to execute the cooling strategy.

[0146] In one embodiment of the present application, the current load scenario is a first load scenario, the main processor as the target processor obtains the current load scenario, and the main processor is used to determine a first cooling strategy of the main processor according to the first load scenario and the current temperature;

[0147] The main processor is specifically used to execute a first cooling strategy of the main processor;

[0148] The main processor is further used to notify the auxiliary processor that the current temperature and the current load scenario are the first load scenario;

[0149] The auxiliary processor is used to determine a first cooling strategy for the auxiliary processor according to the first load scenario and the current temperature;

[0150] The auxiliary processor is used to execute a first temperature reduction strategy of the auxiliary processor.

[0151] In one embodiment of the present application, the current load scenario is a second load scenario, the main processor acquires the current load scenario as a target processor, and the main processor is used to determine a second cooling strategy of the main processor and a second cooling strategy of the auxiliary processor according to the second load scenario and the current temperature;

[0152] The main processor is specifically used to execute the second cooling strategy of the main processor;

[0153] The main processor is also used to send the second cooling strategy of the auxiliary processor to the auxiliary processor;

[0154] The auxiliary processor is further configured to execute a second temperature reduction strategy for the auxiliary processor.

[0155] In one embodiment of the present application, the current load scenario is a third load scenario, the auxiliary processor acquires the current load scenario as a target processor, and the auxiliary processor is further used to acquire the current temperature from the main processor;

[0156] The auxiliary processor is further used to determine a third cooling strategy of the auxiliary processor according to a third load scenario and a current temperature;

[0157] The auxiliary processor is specifically configured to execute a third cooling strategy of the auxiliary processor.

[0158] In one embodiment of the present application, the target processor is specifically configured to obtain a current load scenario when the current temperature of the electronic device is greater than a temperature threshold.

[0159] In one embodiment of the present application, the main processor is specifically used to obtain the current temperature of the main processor;

[0160] The auxiliary processor is used to obtain the current temperature of the auxiliary processor and send the current temperature of the auxiliary processor to the main processor;

[0161] The main processor is used to determine the current temperature of the electronic device according to the current temperature of the main processor and the current temperature of the auxiliary processor.

[0162] The present application also provides a cooling device 600, such as Figure 6 As shown, including:

[0163] A first acquisition module 610, configured to acquire a current temperature of an electronic device, wherein the electronic device includes a main processor and an auxiliary processor;

[0164] The second acquisition module 620 is used to acquire the current load scenario;

[0165] A determination module 630, configured to determine a cooling strategy according to the current load scenario and the current temperature;

[0166] The execution module 640 is used to execute the cooling strategy.

[0167] An embodiment of the present application provides a cooling device, which includes: a first acquisition module, used to obtain the current temperature of an electronic device, wherein the electronic device includes a main processor and an auxiliary processor; a second acquisition module, used to obtain a current load scenario; a determination module, used to determine a cooling strategy based on the current load scenario and the current temperature, wherein the target processor is one of the main processor or the auxiliary processor; and an execution module, used to execute the cooling strategy.

[0168] The device can realize that the main processor and / or auxiliary processor can adaptively execute the cooling strategy according to the current load scenario and temperature, thereby realizing dynamic cooling of the electronic equipment.

[0169] In one embodiment of the present application, the determination module 630 is specifically used to:

[0170] The current load scenario is a first load scenario, the main processor as the target processor obtains the current load scenario, and determines a first cooling strategy of the main processor according to the first load scenario and the current temperature;

[0171] The execution module 640 is specifically used to execute the first cooling strategy of the main processor;

[0172] In the embodiment of the present application, the cooling device 600 provided in the embodiment of the present application further includes:

[0173] a notification module, configured to notify the auxiliary processor of the current temperature and the current load scenario being a first load scenario;

[0174] The determination module 630 is further configured to determine a first cooling strategy for the auxiliary processor according to the first load scenario and the current temperature;

[0175] The execution module 640 is further configured to execute the first cooling strategy of the auxiliary processor.

[0176] In one embodiment of the present application, the determination module 630 is specifically used to: the current load scenario is the second load scenario, and according to the second load scenario and the current temperature, determine the second cooling strategy of the main processor and the second cooling strategy of the auxiliary processor;

[0177] The execution module 640 is specifically used to execute the second cooling strategy of the main processor;

[0178] The notification module is further used to send the second cooling strategy of the auxiliary processor to the auxiliary processor;

[0179] The execution module 640 is further configured to execute a second cooling strategy of the auxiliary processor.

[0180] In one embodiment of the present application, the determination module 630 is specifically configured to: the current load scenario is a third load scenario, and the current temperature is obtained from the main processor;

[0181] Determining a third cooling strategy for the auxiliary processor according to a third load scenario and a current temperature;

[0182] The execution module 640 is specifically configured to execute the third cooling strategy of the auxiliary processor.

[0183] In one embodiment of the present application, the second acquisition module 620 is specifically used for:

[0184] When the current temperature of the electronic device is greater than a temperature threshold, the main processor or the auxiliary processor obtains a current load scenario.

[0185] In one embodiment of the present application, the first acquisition module 610 is specifically used for:

[0186] Obtaining the current temperature of the main processor;

[0187] Acquire the current temperature of the auxiliary processor, and send the current temperature of the auxiliary processor to the main processor;

[0188] The current temperature of the electronic device is determined according to the current temperature of the main processor and the current temperature of the auxiliary processor.

[0189] The embodiment of the present application further provides an electronic device 700, which includes any one of the cooling devices provided in the above device embodiments.

[0190] Alternatively, the electronic device includes any cooling system provided by the above system embodiments.

[0191] Or, if Figure 7 As shown, it includes: a memory 710, a main processor 720, and an auxiliary processor 730, the memory 710 is used to store computer instructions, and the main processor 720 and / or the auxiliary processor 730 are used to call the computer instructions from the memory 710 to execute the cooling method as described in any one of the above method embodiments.

[0192] An embodiment of the present application further provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the temperature reduction method according to any one of the above method embodiments is implemented.

[0193] The present application may be a system, a method and / or a computer program product. The computer program product may include a computer-readable storage medium carrying computer-readable program instructions for causing a processor to implement various aspects of the present application.

[0194] A computer-readable storage medium may be a tangible device that can hold and store instructions used by an instruction execution device. A computer-readable storage medium may be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. More specific examples of computer-readable storage media (a non-exhaustive list) include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disk read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanical encoding device, such as a punch card or a raised structure in a groove on which instructions are stored, and any suitable combination of the foregoing. As used herein, a computer-readable storage medium is not to be interpreted as a transient signal per se, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagating through a waveguide or other transmission medium (e.g., a light pulse through a fiber optic cable), or an electrical signal transmitted through a wire.

[0195] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to each computing / processing device, or downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include copper transmission cables, optical fiber transmissions, wireless transmissions, routers, firewalls, switches, gateway computers, and / or edge servers. The network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in the computer-readable storage medium in each computing / processing device.

[0196] The computer program instructions for performing the operation of the present application can be assembler instructions, instruction set architecture (ISA) instructions, machine instructions, machine-related instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages, such as Smalltalk, C++, etc., and conventional procedural programming languages, such as "C" language or similar programming languages. Computer-readable program instructions can be executed completely on a user's computer, partially on a user's computer, executed as an independent software package, partially on a user's computer, partially on a remote computer, or completely on a remote computer or server. In the case of a remote computer, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (for example, using an Internet service provider to connect through the Internet). In some embodiments, by using the state information of a computer-readable program instruction to personalize an electronic circuit, such as a programmable logic circuit, a field programmable gate array (FPGA) or a programmable logic array (PLA), the electronic circuit can execute a computer-readable program instruction, thereby realizing various aspects of the present application.

[0197] Various aspects of the present application are described herein with reference to the flowcharts and / or block diagrams of the methods, devices (systems) and computer program products according to the embodiments of the present application. It should be understood that each box in the flowchart and / or block diagram and the combination of each box in the flowchart and / or block diagram can be implemented by computer-readable program instructions.

[0198] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, thereby producing a machine, so that when these instructions are executed by the processor of the computer or other programmable data processing device, a device that implements the functions / actions specified in one or more boxes in the flowchart and / or block diagram is generated. These computer-readable program instructions can also be stored in a computer-readable storage medium, and these instructions cause the computer, programmable data processing device, and / or other equipment to work in a specific manner, so that the computer-readable medium storing the instructions includes a manufactured product, which includes instructions for implementing various aspects of the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0199] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device so that a series of operating steps are performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to implement the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0200] The flowchart and block diagram in the accompanying drawings show the possible architecture, function and operation of the system, method and computer program product according to multiple embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a part of a module, program segment or instruction, and the part of the module, program segment or instruction contains one or more executable instructions for realizing the specified logical function. In some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of the boxes in the block diagram and / or flowchart can be implemented by a dedicated hardware-based system that performs the specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions. It is well known to those skilled in the art that it is equivalent to implement it by hardware, implement it by software, and implement it by combining software and hardware.

[0201] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein. The scope of the present application is defined by the appended claims.

Claims

1. A cooling method, characterized in that: include: The main processor acquires the current temperature of the electronic device, wherein the electronic device includes the main processor and the auxiliary processor; The target processor acquires the current load scenario, the target processor being one of the main processor or the auxiliary processor; The target processor determines a cooling strategy according to the current load scenario and the current temperature; The target processor executes the cooling strategy.

2. The cooling method according to claim 1, characterized in that: The target processor determines a cooling strategy according to the current load scenario and the current temperature, including: The current load scenario is a first load scenario, the main processor as the target processor obtains the current load scenario, and the main processor determines a first cooling strategy of the main processor according to the first load scenario and the current temperature; The target processor executes the cooling strategy, including: The main processor executes a first cooling strategy of the main processor; The method further includes: the main processor notifying the auxiliary processor that the current temperature and the current load scenario are the first load scenario; The auxiliary processor determines a first cooling strategy for the auxiliary processor according to the first load scenario and the current temperature; The auxiliary processor executes a first cooling strategy of the auxiliary processor.

3. The cooling method according to claim 1, characterized in that: The target processor determines a cooling strategy according to the current load scenario and the current temperature, including: The current load scenario is a second load scenario, the main processor as a target processor obtains the current load scenario, and the main processor determines a second cooling strategy of the main processor and a second cooling strategy of the auxiliary processor according to the second load scenario and the current temperature; The target processor executes the cooling strategy, including: The main processor executes a second cooling strategy of the main processor; The method further includes: the main processor sending the second cooling strategy of the auxiliary processor to the auxiliary processor; The auxiliary processor executes a second temperature reduction strategy of the auxiliary processor.

4. The method according to claim 1, characterized in that: The target processor determines a cooling strategy according to the current load scenario and the current temperature, including: The current load scenario is a third load scenario, the auxiliary processor, as a target processor, obtains the current load scenario, and the auxiliary processor obtains the current temperature from the main processor; The auxiliary processor determines a third cooling strategy of the auxiliary processor according to a third load scenario and a current temperature; The target processor executes the cooling strategy, including: The auxiliary processor executes a third temperature reduction strategy of the auxiliary processor.

5. The method according to claim 1, characterized in that The target processor obtains the current load scenario, including: In a case where the current temperature of the electronic device is greater than a temperature threshold, the target processor assists the processor in acquiring a current load scenario.

6. The method according to claim 1, characterized in that The main processor obtains the current temperature of the electronic device, including: The main processor obtains the current temperature of the main processor; The auxiliary processor acquires the current temperature of the auxiliary processor and sends the current temperature of the auxiliary processor to the main processor; The main processor determines the current temperature of the electronic device according to the current temperature of the main processor and the current temperature of the auxiliary processor.

7. A cooling system, characterized in that: The cooling system comprises: a main processor and an auxiliary processor, wherein: The main processor is used to obtain the current temperature of the electronic device, and the electronic device includes the main processor and the auxiliary processor; The target processor is used to obtain the current load scenario, and the target processor is one of the main processor or the auxiliary processor; The target processor is used to determine a cooling strategy according to the current load scenario and the current temperature, and the target processor is one of the main processor or the auxiliary processor; The target processor is used to execute the cooling strategy.

8. A cooling device, characterized in that: include: A first acquisition module, used to acquire a current temperature of an electronic device, wherein the electronic device includes a main processor and an auxiliary processor; The second acquisition module is used to acquire the current load scenario; A determination module, used to determine a cooling strategy according to the current load scenario and the current temperature; An execution module is used to execute the cooling strategy.

9. An electronic device, characterized in that: The electronic device comprises the cooling device according to claim 8; Alternatively, the electronic device comprises the cooling system as claimed in claim 7; The electronic device includes a memory, a main processor, and an auxiliary processor, the memory is used to store computer instructions, and the main processor and / or the auxiliary processor are used to call the computer instructions from the memory to execute the cooling method according to any one of claims 1-6.

10. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and when the computer program is executed by a processor, the temperature reduction method according to any one of claims 1 to 6 is implemented.

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