Liquid cooling heat dissipation device and server

Abstract

The invention discloses a liquid cooling heat dissipation device and a server, and relates to the technical field of server heat dissipation. The processor heat exchange mechanism is communicated with the main heat exchange runner through a quick connector assembly; when only the processor needs to be replaced, the heat exchange mechanism of the processor can be independently dismounted and mounted by disconnecting the quick connector assembly; the memory heat exchange mechanism comprises a fixing shaft, a quick locking assembly and a plurality of memory heat exchange sub-plates, the memory heat exchange sub-plates are arranged on the fixing shaft in a penetrating mode, and the quick locking assembly is used for making the memory heat exchange sub-plates abut against the main heat exchange flow channel so that the memory heat exchange sub-plates can exchange heat with the main heat exchange flow channel; when the memory needs to be replaced, the memory can be taken out and replaced by a new memory only by opening the quick locking assembly and rotating the memory heat exchange daughter board around the fixed shaft, and the memory heat exchange daughter board does not need to be taken down for disassembly and assembly. According to the invention, independent disassembly, assembly and maintenance of the processor and the memory are supported, and the flexibility, convenience and safety of production, test and operation and maintenance are greatly improved.

Description

Technical Field

[0001] The present application relates to the technical field of server heat dissipation, and in particular to a liquid cooling device and a server. Background Art

[0002] With the economic development of society, especially with the development of artificial intelligence technology, higher demands are placed on the computing power of IT equipment such as servers. At the same time, higher requirements are also placed on the deployment density of IT equipment such as servers. This makes liquid cooling technology the best choice to meet the high-density and high-power consumption heat dissipation needs of servers.

[0003] However, in the related art, since the arrangement design of processors and memory in servers is becoming more and more compact, the liquid cooling device for dissipating heat from the servers has the problem of difficulty in installation, operation and maintenance. Summary of the invention

[0004] The present application provides a liquid cooling device and a server to at least solve the problems of difficult installation and operation and maintenance in the related art.

[0005] The present application provides a liquid cooling device, comprising:

[0006] Main heat exchange flow channel;

[0007] A processor heat exchange mechanism, used for cooling the processor, the processor heat exchange mechanism is detachably connected to the main heat exchange flow channel through a quick connector assembly, so that the processor heat exchange mechanism is connected to the main heat exchange flow channel;

[0008] The memory heat exchange mechanism includes a fixed shaft, a quick locking assembly and multiple memory heat exchange sub-plates. The memory heat exchange sub-plates are inserted into the fixed shaft so that the memory heat exchange sub-plates can rotate around the fixed shaft and slide axially along the fixed shaft. The memory heat exchange sub-plates are used to clamp corresponding memory. The quick locking assembly is used to fix the multiple memory heat exchange sub-plates and abut against the main heat exchange flow channel so that the memory heat exchange sub-plates can exchange heat with the main heat exchange flow channel.

[0009] The present application also provides a server, comprising the above-mentioned liquid cooling device.

[0010] Through the liquid cooling device of the present application, the processor heat exchange mechanism is detachably connected to the main heat exchange flow channel by using a quick connector assembly. Therefore, when only the processor or the processor heat exchange mechanism needs to be replaced, the quick connector assembly is used to realize the quick connection and disconnection of the processor heat exchange mechanism and the main heat exchange flow channel, and then the processor heat exchange mechanism is removed and installed separately, without the need to remove the memory heat exchange mechanism and the memory together; and the memory heat exchange sub-plate is passed through the fixed axis and fixed by the quick locking assembly and abuts against the main heat exchange flow channel, and the memory heat exchange sub-plate is clamped with the corresponding memory. Therefore, when the memory needs to be replaced, it is only necessary to open the quick locking assembly and rotate the memory heat exchange sub-plate corresponding to the memory around the fixed axis to remove the memory and replace it with a new memory, without removing the memory heat exchange sub-plate for disassembly and assembly; the memory heat exchange sub-plate is passed through the fixed axis, so the memory heat exchange sub-plate can move freely along the axial direction of the fixed axis. During actual assembly, the memory heat exchange sub-plate can adapt to the position of the memory and accurately adjust its own position to ensure the best fit with the memory. This application supports independent disassembly and maintenance of the processor and memory, greatly improving the flexibility, maintainability, convenience and safety of production, testing and operation and maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0012] Figure 1 A schematic diagram of the structure of a server provided in an embodiment of the present application;

[0013] Figure 2 for Figure 1 A schematic diagram of the structure of a liquid cooling device of the server shown;

[0014] Figure 3 for Figure 2 The structural schematic diagram of the liquid cooling device shown;

[0015] Figure 4 for Figure 2 A schematic diagram of a partially exploded structure of a liquid cooling device of the server shown;

[0016] Figure 5 for Figure 3 A schematic diagram of the structure of the main heat exchange channel of the liquid cooling device shown;

[0017] Figure 6 for Figure 5 A structural schematic diagram of the main heat exchange flow channel from another perspective;

[0018] Figure 7 for Figure 5 A schematic diagram of a partial exploded structure of the main heat exchange flow channel shown;

[0019] Figure 8 for Figure 7 An enlarged structural schematic diagram of the main heat exchange flow channel is shown;

[0020] Fig. 9 for Figure 5 A cross-sectional view of the main heat exchange flow channel shown;

[0021] Fig.10 for Figure 3 A schematic diagram of the structure of a memory heat exchange sub-board of a liquid cooling device shown;

[0022] Fig.11 for Fig.10 One of the partial exploded structural diagrams of the memory heat exchange sub-board shown;

[0023] Fig.12 for Fig.10 The second schematic diagram of the partial decomposition structure of the memory heat exchange sub-board shown;

[0024] Fig.13 for Fig.10 The structural schematic diagram of the main cold plate of the memory heat exchange sub-plate shown;

[0025] Fig.14 for Fig.10 A schematic structural diagram of the memory heat exchange sub-board from another perspective;

[0026] Fig.15 for Fig.10 A cross-sectional view of the memory heat exchange sub-plate shown;

[0027] Fig.16 for Figure 3 A schematic diagram of the structure of a memory heat exchange mechanism of a liquid cooling device shown;

[0028] Fig.17 for Fig.16 The schematic diagram of the structure of the internal heat exchange mechanism when it is assembled is shown;

[0029] Fig.18 for Fig.16 The schematic diagram of the structure of the internal heat exchange mechanism after assembly is shown;

[0030] Fig.19 for Fig.18 A schematic diagram of the structure of the quick locking assembly of the internal heat exchange mechanism shown;

[0031] Fig. 20 for Fig.18 A schematic structural diagram of the memory heat exchange mechanism after assembly from another perspective;

[0032] Fig.21 for Figure 3 A partially exploded structural schematic diagram of a liquid leakage detection mechanism of a liquid cooling device shown;

[0033] Fig. 22 for Fig.21 A partially enlarged structural schematic diagram of a liquid leakage detection mechanism is shown;

[0034] Fig.23 for Figure 3 The schematic diagram of the structure of the liquid cooling device during assembly is shown.

[0035] The above drawings include the following reference numerals:

[0036] 100-liquid cooling device; 10-main heat exchange flow channel; 11-main heat exchange sub-flow channel; 111-first main heat exchange sub-flow channel; 112-second main heat exchange sub-flow channel; 113-third main heat exchange sub-flow channel; 114-liquid separation port; 115-liquid collection port; 116-sub-flow channel joint; 12-connecting pipeline; 121-first branch connecting pipeline; 122-second branch connecting pipeline; 13-cover plate; 131-flow channel cavity; 132-rib structure; 133-heat conduction groove; 134-heat exchange pad; 14-bottom plate; 141-shovel tooth structure; 15-inlet; 16-outlet; 17-second positioning hole; 18-second loose Screws that do not come off; 19-fixing seat; 20-processor heat exchange mechanism; 21-quick connector assembly; 211-liquid inlet quick connector; 212-liquid outlet quick connector; 22-fastening screw hole; 23-processor heat exchange connecting pipeline; 24-processor liquid inlet pipeline; 25-processor liquid outlet pipeline; 30-memory heat exchange mechanism; 31-fixing shaft; 32-quick locking assembly; 321-pressure rod bracket; 322-pressure rod; 323-locking buckle; 3231-locking pin; 3232-guide ramp; 324-locking plate; 3241-blocking plate; 3242-pick plate; 325-limiting screw; 326-pressure rod sleeve; 327-spring; 328-protruding structure; 33-memory heat exchange sub-board; 331-main cold plate; 3311-base plate; 3312-reinforcement frame; 3313-limiting groove; 3314-heat pipe groove; 3315-heat pipe; 3316-guide pin; 332-secondary cold plate; 3321-thermal pad groove; 3322-guide hole; 333-thermal pad; 334-locking switch assembly; 3341-cam wrench; 3342-cam shaft; 3343-pressing slider; 3344-guide shaft; 3345-cam part; 3346-handle part; 3347-compression spring; 3348-guide groove; 3 349-guide block; 335-anti-scratch film; 336-through hole; 40-leakage detection mechanism; 41-first guide groove; 42-detection wire groove; 43-leakage detection line; 44-second guide groove; 50-supply and return liquid joint assembly; 51-liquid inlet pipeline; 52-return liquid pipeline; 80-cold plate bracket; 81-first positioning pin; 82-first captive screw; 83-second positioning pin; 84-bracket screw hole; 200-server; 201-motherboard; 202-processor; 203-memory; 204-first positioning hole; 205-motherboard screw hole; 206-supply and return liquid quick connector; 207-stud. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0038] It should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. The terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. The terms "parallel", "perpendicular" and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either one. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0039] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0040] like Figure 1 , Figure 2 and Figure 3As shown, the liquid cooling device 100 provided in the embodiment of the present application is used in a server 200. The server 200 includes a motherboard 201, a processor 202, a memory 203 and a liquid cooling device 100. The processor 202 and the memory 203 are arranged on the motherboard 201. The liquid cooling device 100 is used to perform liquid cooling on the processor 202 and the memory 203.

[0041] In some possible implementations, the processor 202 includes a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit).

[0042] In some possible implementations, the server 200 is a dual-way general-purpose server.

[0043] The liquid cooling device 100 includes a main heat exchange channel 10, a processor heat exchange mechanism 20 and a memory heat exchange mechanism 30. The main heat exchange channel 10 is used to communicate with the coolant flow path. The processor heat exchange mechanism 20 is in communication with the main heat exchange channel 10. The processor heat exchange mechanism 20 is disposed on the processor 202, and is used to cool down the processor 202. The memory heat exchange mechanism 30 is in heat exchange contact with the main heat exchange channel 10. The memory heat exchange mechanism 30 is sandwiched with the memory 203, and is used to cool down the memory 203.

[0044] In some possible implementations, the processor heat exchange mechanism 20 is detachably connected to the main heat exchange channel 10 via a quick connector assembly 21 , so that the processor heat exchange mechanism 20 is in communication with the main heat exchange channel 10 .

[0045] Please also see Figure 5 In some possible implementations, the memory heat exchange mechanism 30 includes a fixed shaft 31, a quick locking assembly 32, and a plurality of memory heat exchange sub-plates 33. The memory heat exchange sub-plates 33 are inserted into the fixed shaft 31 so that the memory heat exchange sub-plates 33 rotate around the fixed shaft 31 and slide axially along the fixed shaft 31. The memory heat exchange sub-plates 33 are used to be clamped in the corresponding memory 203, and the quick locking assembly 32 is used to fix the plurality of memory heat exchange sub-plates 33 and abut against the main heat exchange flow channel 10 so that the memory heat exchange sub-plates 33 and the main heat exchange flow channel 10 can exchange heat.

[0046] Specifically, the quick locking assembly 32 applies pressure to the memory heat exchange sub-plate 33 so that the memory heat exchange sub-plate 33 is pressed against the main heat exchange channel 10 , thereby enabling the memory heat exchange sub-plate 33 to exchange heat with the main heat exchange channel 10 .

[0047] In some possible implementations, multiple memories 203 are arranged in sequence on the main board 201, the axial direction of the fixed shaft 31 is parallel to the arrangement direction of the multiple memories 203, the quick locking assembly 32 is arranged on one side of the memory 203, and along the arrangement direction of the multiple memories 203, the multiple memory heat exchange sub-plates 33 rotated on the fixed shaft 31 are pressed onto the corresponding memory 203.

[0048] Since the processor heat exchange mechanism 20 is connected to the main heat exchange channel 10 by using the quick connector assembly 21, when only the processor 202 or the processor heat exchange mechanism 20 needs to be replaced, the processor heat exchange mechanism 20 and the main heat exchange channel 10 can be quickly connected and disconnected by the quick connector assembly 21, and then the processor heat exchange mechanism 20 can be disassembled and installed separately without the need to disassemble it together with the memory heat exchange mechanism 30 and the memory 203.

[0049] The memory heat exchange sub-plate 33 is passed through the fixed shaft 31 and fixed by the quick locking component 32 and abuts against the main heat exchange flow channel 10. The memory heat exchange sub-plate 33 is clamped with the corresponding memory 203. Therefore, when the memory 203 needs to be replaced, it is only necessary to simply open the quick locking component 32 and rotate the memory heat exchange sub-plate 33 corresponding to the memory 203 around the fixed shaft 31 to remove the memory 203 and replace it with a new memory 203. There is no need to remove the memory heat exchange sub-plate 33 for disassembly and assembly, which greatly simplifies the replacement process of the memory 203; the memory heat exchange sub-plate 33 is passed through the fixed shaft 31, so the memory heat exchange sub-plate 33 can move freely on the fixed shaft 31. During actual assembly, the memory heat exchange sub-plate 33 can adapt and accurately adjust its own position according to the position of the memory 203 to ensure the best contact and heat exchange efficiency between the memory heat exchange sub-plate 33 and the memory 203, achieve the best adaptation, improve the structural compatibility and reliability of the memory heat exchange sub-plate 33, and improve the heat dissipation effect.

[0050] In the case where only the memory heat exchange mechanism 30 needs to be replaced, that is, the memory 203 uses air cooling, there is no need to disassemble the processor heat exchange mechanism 20, disconnect the quick connector assembly 21, and disassemble the main heat exchange channel 10 and the memory heat exchange mechanism 30 and other related components. It is only necessary to connect the two supply and return liquid pipelines to the cabinet manifold through the quick connector assembly 21 to conduct the cooling liquid, which can save the time of replacing the processor heat exchange mechanism 20 and applying thermal grease.

[0051] Since the liquid cooling heat dissipation device 100 of the present application supports independent disassembly and maintenance of the processor 202 and the memory 203, the operation and maintenance personnel can replace and maintain components more quickly, reducing the number of unnecessary disassembly and assembly of the electronic components required for heat dissipation, greatly improving the flexibility, maintainability, convenience and safety of production, testing and operation and maintenance, reducing downtime, improving the availability and maintenance efficiency of the server 200, and improving the structural compatibility and reliability of the memory heat exchange mechanism 30, which can meet various operation and maintenance scenarios of the data center, and is conducive to reducing the failure rate of liquid cooling parts and electronic components, and reducing development and operation and maintenance costs.

[0052] At the same time, the application of the quick connector assembly 21 and the quick locking assembly 32 realizes tool-free installation, reduces the risk of misoperation during the disassembly and assembly process, and enhances the safety and reliability of the system.

[0053] In some possible implementations, the quick connector assembly 21 includes a liquid inlet quick connector 211 and a liquid outlet quick connector 212. The liquid inlet quick connector 211 connects one side of the main heat exchange channel 10 with the processor heat exchange mechanism 20, and the liquid outlet quick connector 212 connects the other side of the main heat exchange channel 10 with the processor heat exchange mechanism 20.

[0054] The design of the liquid inlet quick connector 211 and the liquid outlet quick connector 212 ensures that the coolant can efficiently circulate between the main heat exchange channel 10 and the processor heat exchange mechanism 20, taking away the heat generated by the processor 202, and achieving efficient heat dissipation. The design of the liquid inlet quick connector 211 and the liquid outlet quick connector 212 provides flexible system configuration options, allowing users to adjust the flow path and direction of the coolant according to specific needs to adapt to different heat dissipation requirements.

[0055] The quick connector assembly 21 allows the user to easily connect and disconnect the liquid pipeline of the processor heat exchange mechanism 20, simplifies the installation and removal process of the system, and improves the convenience and efficiency of operation. The quick connector usually has good sealing performance, which can effectively reduce the risk of liquid leakage and ensure the safety and reliability of the system.

[0056] Please also see Figure 4 In some possible implementations, the liquid cooling device 100 includes a plurality of processor heat exchange mechanisms 20 , and adjacent processor heat exchange mechanisms 20 are connected via a processor heat exchange connecting pipeline 23 .

[0057] The multiple processor heat exchange mechanisms 20 are connected through the processor heat exchange connecting pipeline 23, and the coolant can circulate between the various processor heat exchange mechanisms 20 to ensure uniform temperature distribution in the system and avoid local overheating. The series design of multiple processor heat exchange mechanisms 20 can optimize the flow path of the coolant, improve the heat exchange efficiency, and ensure that each processor 202 can obtain sufficient cooling effect. The modular design of multiple processor heat exchange mechanisms 20 and the processor heat exchange connecting pipeline 23 facilitates the expansion and upgrade of the system, supports application scenarios of different scales and complexities, and reduces manufacturing and maintenance costs.

[0058] In some possible implementations, the liquid cooling device 100 includes two processor heat exchange mechanisms 20. The liquid inlet quick connector 211 is connected to one of the processor heat exchange mechanisms 20 through the processor liquid inlet pipeline 24, the two processor heat exchange mechanisms 20 are connected to each other through the processor heat exchange connecting pipeline 23, and the other processor heat exchange mechanism 20 is connected to the liquid outlet quick connector 212 through the processor liquid outlet pipeline 25, thereby connecting the two processor heat exchange mechanisms 20 to the main heat exchange flow channel 10.

[0059] The cooling liquid on one side of the main heat exchange channel 10 is divided into two branches through the liquid inlet quick connector 211. The first branch enters the liquid inlet quick connector 211 from the main heat exchange channel 10, then enters the first processor heat exchange mechanism 20 through the processor liquid inlet pipeline 24, then enters the second processor heat exchange mechanism 20 through the processor heat exchange connecting pipeline 23, and finally flows into the liquid outlet quick connector 212 through the processor liquid outlet pipeline 25, and flows to the other side of the main heat exchange channel 10. The second branch passes through the three groups of the first main heat exchange sub-channel 111, the second main heat exchange sub-channel 112 and the third main heat exchange sub-channel 113 in sequence, and absorbs the heat conducted by the internal heat exchange mechanism 30, then merges with the first branch, and returns to the liquid supply and return quick connector 206 through the liquid return pipeline 52, forming a complete liquid loop in the server 200.

[0060] In some possible implementations, the main heat exchange channel 10 includes a plurality of main heat exchange sub-channels 11 , and the plurality of main heat exchange sub-channels 11 are connected in sequence via a connecting pipeline 12 .

[0061] In some possible implementations, the main heat exchange channel 10 includes a first main heat exchange sub-channel 111, a second main heat exchange sub-channel 112, and a third main heat exchange sub-channel 113. The connecting pipeline 12 includes a first branch connecting pipeline 121 and a second branch connecting pipeline 122. The first main heat exchange sub-channel 111 is connected to the second main heat exchange sub-channel 112 through the first branch connecting pipeline 121, and the second main heat exchange sub-channel 112 is connected to the third main heat exchange sub-channel 113 through the second branch connecting pipeline 122.

[0062] By dividing the main heat exchange channel 10 into a plurality of sub-channels, segmented heat dissipation can be achieved. Each sub-channel can focus on heat management of a specific area or component, thereby improving the overall heat dissipation efficiency.

[0063] In some possible implementations, the first main heat exchange sub-channel 111 and the third main heat exchange sub-channel 113 are located in the same row and are arranged opposite to the second main heat exchange sub-channel 112 .

[0064] In some possible implementations, the first main heat exchange sub-channel 111 and the third main heat exchange sub-channel 113 are located at the rear side of the processor 202 and the memory 203, and the second main heat exchange sub-channel 112 is located at the front side of the processor 202 and the memory 203. The first main heat exchange sub-channel 111 is connected to the processor heat exchange mechanism 20 through the quick connector assembly 21, and the third main heat exchange sub-channel 113 is connected to the processor heat exchange mechanism 20 through the quick connector assembly 21, so that the fluid in the main heat exchange channel 10 is diverted to the processor heat exchange mechanism 20.

[0065] Please also see Figure 6 In some possible implementations, a liquid separation port 114 is provided on the first main heat exchange sub-channel 111, and a liquid collection port 115 is provided on the third main heat exchange sub-channel 113. The liquid inlet quick connector 211 is connected to the liquid separation port 114, and the liquid outlet quick connector 212 is connected to the liquid collection port 115.

[0066] When the liquid inlet quick connector 211 and the liquid outlet quick connector 212 are in the connected state, the first branch enters the liquid inlet quick connector 211 from the liquid outlet 114 on the side wall of the first main heat exchange sub-channel 111, and the cooling liquid enters the two processor heat exchange mechanisms 20 successively through the processor liquid inlet pipeline 24 and the processor heat exchange connection pipeline 23, continuously taking away the heat generated by the processor 202 chip when it is working, so as to ensure that the temperature of the processor 202 chip is always within the normal range. Subsequently, the cooling liquid passes through the processor liquid outlet pipeline 25 and the liquid outlet quick connector 212 in turn to reach the liquid collection port 115 on the third main heat exchange sub-channel 113.

[0067] The second branch passes through the flow channel in the first main heat exchange sub-channel 111 at the rear side, and after changing the flow direction of the coolant through the first branch connecting pipe 121, it reaches the second main heat exchange sub-channel 112 near the front side of the chassis. After the coolant absorbs the heat transferred from the internal heat exchange sub-plate 33 in the front second main heat exchange sub-channel 112 and flows out, it reaches the third main heat exchange sub-channel 113 at the rear side through the second branch connecting pipe 122. Subsequently, it flows along the flow channel in the third main heat exchange sub-channel 113 at the rear side, and merges with the coolant of the first branch at the liquid collection port 115.

[0068] In some possible implementations, a sub-channel joint 116 is provided at one end of the first main heat exchange sub-channel 111 that is opposite to the third main heat exchange sub-channel 113 and at both ends of the second main heat exchange sub-channel 112. The sub-channel joint 116 of the first main heat exchange sub-channel 111 is connected to the sub-channel joint 116 on one side of the second main heat exchange sub-channel 112 through a first branch connection pipeline 121. The sub-channel joint 116 on the other side of the second main heat exchange sub-channel 112 is connected to the sub-channel joint 116 of the third main heat exchange sub-channel 113 through a second branch connection pipeline 122.

[0069] Please also see Figure 7 , Figure 8 and Fig. 9 In some possible implementations, the main heat exchange sub-channel 11 includes a cover plate 13 and a bottom plate 14. The cover plate 13 is provided with a channel cavity 131, and the bottom plate 14 covers the channel cavity 131. The processor heat exchange mechanism 20 is connected to the channel cavity 131, and the memory heat exchange sub-plate 33 abuts against the cover plate 13.

[0070] The combination of the cover plate 13 and the bottom plate 14 provides a closed and stable structure, ensuring the integrity and sealing of the flow channel cavity 131, preventing leakage of the coolant, and improving the reliability of the system. At the same time, the design of the flow channel cavity 131 can optimize the fluid path according to specific heat dissipation requirements, ensuring that the coolant contacts the heat source to the greatest extent during the flow process, thereby improving the heat exchange efficiency.

[0071] The design of the flow channel cavity 131 allows the coolant to flow inside the cover plate 13 and directly connect with the processor heat exchange mechanism 20, thereby achieving efficient heat exchange, and can quickly remove the heat generated by the processor 202, thereby improving the heat dissipation efficiency. Due to the direct connection design between the processor heat exchange mechanism 20 and the flow channel cavity 131, the processor heat exchange mechanism 20 can be easily disassembled and replaced during maintenance without affecting the installation of the memory heat exchange sub-board 33, thereby improving the maintainability of the system.

[0072] The memory heat exchange sub-plate 33 is directly abutted against the cover plate 13, so that the memory heat exchange sub-plate 33 can more flexibly exchange heat with the coolant in the flow channel cavity 131, reducing the thermal resistance in the heat transfer path, so that the heat generated by the memory 203 can be transferred to the coolant more quickly.

[0073] In some possible implementations, a rib structure 132 is disposed in the flow channel cavity 131 . The rib structure 132 protrudes from the flow channel cavity 131 and is disposed along an extension direction of the flow channel cavity 131 .

[0074] The rib structure 132 increases the surface area in the flow channel cavity 131, thereby expanding the contact area between the coolant and the flow channel wall, improving the heat exchange efficiency, and allowing heat to be transferred from the heat source to the coolant more quickly. The rib structure 132 can guide the flow path of the coolant in the flow channel cavity 131, ensuring that the fluid is evenly distributed throughout the flow channel, avoiding the occurrence of flow dead zones or local overheating.

[0075] At the same time, the rib structure 132 can disturb the flow of the coolant and promote the formation of turbulence. Compared with laminar flow, the fluid in the turbulent state has a higher heat transfer capacity, thereby improving the convection heat exchange between the flow channel cavity 131 and the coolant, and can more effectively remove heat.

[0076] The rib structure 132 not only helps to improve the heat exchange efficiency, but also can enhance the structural strength of the flow channel cavity 131, play the role of reinforcing ribs, improve the ability of the flow channel cavity 131 to resist liquid pressure, and prevent deformation or rupture under high pressure conditions.

[0077] The shape and spacing of the rib structure 132 can be designed and adjusted according to specific heat dissipation requirements to achieve the best heat management effect.

[0078] In some possible implementations, the bottom plate 14 is provided with a scooping structure 141, which is arranged in the flow channel cavity 131 along the extension direction of the flow channel cavity 131. The scooping structure 141 is distributed directly below the contact area between the flow channel cavity 131 and the memory heat exchange sub-plate 33.

[0079] The shovel structure 141 increases the surface area in the flow channel cavity 131, thereby expanding the contact area between the coolant and the flow channel wall, improving the heat exchange efficiency, and allowing heat to be transferred from the heat source to the coolant more quickly. The shovel structure 141 can guide the flow path of the coolant in the flow channel cavity 131, ensuring that the fluid is evenly distributed throughout the flow channel, avoiding the occurrence of flow dead zones or local overheating.

[0080] At the same time, the shovel tooth structure 141 can disturb the flow of the coolant and promote the formation of turbulence. Compared with laminar flow, the fluid in the turbulent state has a higher heat transfer capacity and can take away heat more effectively.

[0081] The scraper tooth structure 141 not only helps to improve the heat exchange efficiency, but also can enhance the structural strength of the flow channel cavity 131, improve its pressure resistance, and prevent deformation or rupture under high pressure conditions.

[0082] The shape, length, height and spacing of the shovel tooth structure 141 can be designed and adjusted according to specific heat dissipation requirements to achieve the best thermal management effect.

[0083] In some possible implementations, the rib structure 132 is located in the middle of the flow channel cavity 131 to divide the flow channel cavity 131 into two parts. A plurality of shovel tooth structures 141 are respectively located in the flow channel cavity 131 on both sides. The tooth tops of the shovel tooth structures 141 are welded together with the cover plate 13 to further divert the flow channel cavity 131 to form a plurality of microchannels.

[0084] In some possible implementations, the first main heat exchange sub-channel 111 is provided with an inlet 15. The third main heat exchange sub-channel 113 is provided with an outlet 16. The inlet 15 and the outlet 16 are respectively located in the middle of the first main heat exchange sub-channel 111 and the third main heat exchange sub-channel 113, and the rib structure 132 is used to divide the flow channel cavity 131 of the first main heat exchange sub-channel 111 and the third main heat exchange sub-channel 113 into a baffle structure.

[0085] After the coolant enters the first main heat exchange sub-channel 111 from the inlet 15, a part of the liquid enters the liquid inlet quick connector 211 through the liquid separator 114 to form a first branch, and the other part flows along the channel cavity 131 of the first main heat exchange sub-channel 111 to form a second branch. After flowing in the first main heat exchange sub-channel 111 toward the third main heat exchange sub-channel 113, it is deflected once and flows in a direction away from the third main heat exchange sub-channel 113, and then passes through the sub-channel connector 116 to enter the first branch connecting pipeline 121, and after passing through the second main heat exchange sub-channel 112, it reaches the third main heat exchange sub-channel 113 on the rear side through the second branch connecting pipeline 122. Subsequently, it flows along the flow channel in the third main heat exchange sub-channel 113 on the rear side toward the first main heat exchange sub-channel 111 , and after one deflection, it merges with the coolant in the first branch at the liquid collection port 115 , and flows out of the main heat exchange channel 10 through the outlet 16 .

[0086] In some possible implementations, the fixed shaft 31 is disposed on the cover plate 13 , and the axial direction of the fixed shaft 31 is the same as the extension direction of the flow channel cavity 131 in the cover plate 13 , so that multiple memory heat exchange sub-plates 33 are arranged in sequence along the extension direction of the flow channel cavity 131 .

[0087] Please also see Fig.10 In some possible implementations, multiple memory heat exchange sub-boards 33 are divided into two groups along the length direction of the memory 203. The two groups of memory heat exchange sub-boards 33 are arranged opposite to each other, and along the length direction of the memory 203, each group of memory heat exchange sub-boards 33 is respectively clamped at one end of the corresponding memory 203. The memory heat exchange sub-boards 33 at both ends are mutually axially symmetrical structures, and are combined into a set of memory heat exchange sub-boards 33 to dissipate heat for a memory 203 together.

[0088] By dividing the memory heat exchange sub-board 33 into two groups and clamping one end of the memory 203 along the length direction of the memory 203, the length of the memory heat exchange sub-board 33 is reduced. Since the length of the memory heat exchange sub-board 33 is reduced, the ability to resist stress bending and deformation is improved, which can effectively increase the rigidity of each memory heat exchange sub-board 33, reduce the deformation risk of the memory heat exchange sub-board 33 during the process of fitting and plugging and unplugging with the memory 203, improve the stability of the overall structure, and help to maintain good contact between the memory heat exchange sub-board 33 and the memory 203 during installation and removal, ensuring heat dissipation performance. At the same time, the disconnected area between the two memory heat exchange sub-boards 33 can also effectively prevent the chip protruding from the center of the memory 203 from being squeezed and damaged during plugging and unplugging.

[0089] The memory heat exchange sub-plate 33 is connected to the main heat exchange flow channel 10 via the fixed shaft 31, so the memory heat exchange sub-plate 33 can move freely on the fixed shaft 31. During actual assembly, the memory heat exchange sub-plate 33 can adapt and accurately adjust its position according to the position of the memory 203, which can effectively solve the impact of poor fit between the memory heat exchange sub-plate 33 and the memory 203 caused by the assembly tolerance of related components in the server 200, and ensure the best fit with the memory 203.

[0090] Please also see Fig.11 , Fig.12 , Fig.13 and Fig.14 In some possible implementations, the memory heat exchange sub-plate 33 includes a main cold plate 331, a secondary cold plate 332, a thermal pad 333 and a locking switch assembly 334. Along the thickness direction of the memory 203, the main cold plate 331 is located on one side of the memory 203. The secondary cold plate 332 is movably disposed on the main cold plate 331 and is located on the other side of the memory 203. The thermal pad 333 is disposed on the side of the main cold plate 331 and the secondary cold plate 332 facing the memory 203. The main cold plate 331 and the secondary cold plate 332 are penetrated on the fixed shaft 31. The locking switch assembly 334 is disposed on the main cold plate 331, and the locking switch assembly 334 is used to drive the secondary cold plate 332 to move toward the main cold plate 331, so as to press the thermal pad 333 on the secondary cold plate 332 and the main cold plate 331 onto the memory 203.

[0091] The thermal pad 333 is arranged on the side of the main cold plate 331 and the auxiliary cold plate 332 facing the memory 203, ensuring good thermal contact between the memory heat exchange sub-plate 33 and the memory 203, improving the heat conduction efficiency, and being able to more effectively transfer the heat generated by the memory 203 to the memory heat exchange sub-plate 33 for heat dissipation.

[0092] The auxiliary cold plate 332 can be movably arranged on the main cold plate 331 and adjusted by the locking switch assembly 334, allowing adjustment according to the actual thickness of the memory 203 during installation to ensure close contact between the memory heat exchange sub-plate 33 and the memory 203.

[0093] The locking switch assembly 334 can drive the auxiliary cold plate 332 to move toward the main cold plate 331 to achieve rapid locking, simplifying the installation and removal process of the memory heat exchange sub-board 33, reducing the operation time, and improving the operation and maintenance efficiency. Through the adjustment of the locking switch assembly 334, it is possible to provide appropriate pressing force to avoid excessive mechanical stress on the memory 203, thereby reducing the risk of damage to the memory 203. The locking switch assembly 334 improves the overall reliability of the system and ensures that the memory heat exchange sub-board 33 can maintain good thermal contact with the memory 203 under various operating conditions.

[0094] The memory heat exchange sub-board 33 can improve the structural compatibility, reliability and operational flexibility of the memory cold plate, and solve the problems of the current memory 203 being difficult to plug and unplug, the heat dissipation surface having poor contact, and the cumbersome steps of replacing the memory 203. The memory heat exchange sub-board 33 is designed to be split at both ends, that is, two groups of memory heat exchange sub-boards 33 with a length of about half the length of the memory 203 are combined to achieve the heat dissipation of each memory 203. Each group of memory heat exchange sub-boards 33 is designed with a locking switch assembly 334 for quick locking, which not only provides an adjustable spring force to ensure that the thermal pad 333 fits well with the memory 203 and the required pressing force, but also can realize the manual quick locking and unlocking of the memory heat exchange sub-board 33 and the memory 203, while reducing the failure rate of the memory 203 and further improving its service life.

[0095] In some possible implementations, the main cold plate 331 includes a base plate 3311 and a reinforcement frame 3312. The base plate 3311 is inserted into the fixed shaft 31, the reinforcement frame 3312 is disposed on the base plate 3311, the auxiliary cold plate 332 is movably disposed on the reinforcement frame 3312, and the locking switch assembly 334 is disposed on the reinforcement frame 3312.

[0096] In some possible implementations, the reinforcement frame 3312 is designed at the top of the substrate 3311. On the one hand, it is used to strengthen the rigidity of the substrate 3311 to prevent deformation caused by squeezing with the memory 203 during use; on the other hand, the reinforcement frame 3312 can provide an installation hole for the locking switch assembly 334, and will not interfere with the memory 203 during operation.

[0097] The introduction of the reinforcement frame 3312 improves the overall rigidity and strength of the main cold plate 331, reduces the possible deformation of the memory heat exchange sub-board 33 during installation and use, ensures the stable contact between the memory heat exchange sub-board 33 and the memory 203, and improves the heat dissipation efficiency. The reinforcement frame 3312 helps to evenly distribute the pressure applied to the locking switch assembly 334 during the locking process, avoids excessive local stress on the memory 203, and reduces the risk of damage to the memory 203.

[0098] In some possible implementations, a limiting groove 3313 is provided on the substrate 3311 , and the limiting groove 3313 is used to accommodate the thermal pad 333 .

[0099] The limiting groove 3313 provides a clear installation position for the thermal pad 333, ensuring the precise positioning of the thermal pad 333 between the main cold plate 331 and the memory 203, helping to maintain the effective contact area of ​​the thermal pad 333 and improve the heat conduction efficiency. The limiting groove 3313 can also effectively prevent the thermal pad 333 from moving or sliding during installation and use, ensuring that the thermal pad 333 is always in the best position, avoiding the degradation of heat dissipation performance due to position offset.

[0100] The limiting groove 3313 provides a fixed position for the thermal pad 333, which simplifies the installation process, reduces the possibility of installation errors, and improves the operation efficiency. At the same time, the limiting groove 3313 can also protect the edge of the thermal pad 333 to a certain extent, reduce damage caused by mechanical stress or friction, and thus extend the service life of the thermal pad 333.

[0101] In some possible implementations, a heat pipe groove 3314 is provided on a side of the substrate 3311 away from the limiting groove 3313 , and the heat pipe groove 3314 is used to embed the heat pipe 3315 .

[0102] The heat pipe 3315 is an efficient heat conduction device that can quickly transfer heat. By embedding the heat pipe 3315 on the substrate 3311, heat can be transferred more quickly from the memory 203 area to other parts, thereby improving the heat dissipation efficiency of the main cold plate 331.

[0103] The design of the heat pipe groove 3314 allows the heat pipe 3315 to be tightly embedded in the base plate 3311, ensuring that the heat is evenly distributed along the length of the heat pipe 3315, which helps to avoid local overheating and improve the temperature uniformity of the memory 203. The heat pipe 3315 is embedded in the base plate 3311 through the heat pipe groove 3314, making the main cold plate 331 more compact and not significantly increasing the volume of the memory heat exchange sub-plate 33. The heat pipe groove 3314 ensures close contact between the heat pipe 3315 and the base plate 3311, reducing the thermal resistance in the heat transfer path and improving the heat conduction efficiency.

[0104] In some possible implementations, a thermal pad groove 3321 is provided on a side of the auxiliary cold plate 332 facing the memory 203 , and the thermal pad groove 3321 is used to accommodate the thermal pad 333 .

[0105] The thermal pad groove 3321 provides a clear installation position for the thermal pad 333, ensuring the precise positioning of the thermal pad 333 between the auxiliary cold plate 332 and the memory 203, helping to maintain the effective contact area of ​​the thermal pad 333 and improve the heat conduction efficiency. The thermal pad groove 3321 can also effectively prevent the thermal pad 333 from moving or sliding during installation and use, ensuring that the thermal pad 333 is always in the best position, avoiding the degradation of heat dissipation performance due to position offset.

[0106] The thermal pad groove 3321 provides a fixed position for the thermal pad 333, simplifies the installation process, reduces the possibility of installation errors, and improves the operation efficiency. At the same time, the thermal pad groove 3321 can also protect the edge of the thermal pad 333 to a certain extent, reduce damage caused by mechanical stress or friction, and thus extend the service life of the thermal pad 333.

[0107] The hardness of the thermal pad 333 on the main cold plate 331 and the auxiliary cold plate 332 is the same, so the force applied by the locking switch assembly 334 on the main cold plate 331 and the auxiliary cold plate 332 is the same, so the locking force on the two sides of the memory 203 is also consistent, avoiding the different contact methods or size deviations on the two sides of the memory 203 in the previous solution. The different forces caused by the memory 203 tilting to one side avoid stress damage to the gold fingers of the memory 203 and the memory slot, which is beneficial to reducing the failure rate of the memory 203 and further improving its service life.

[0108] In some possible implementations, one of the primary cold plate 331 and the secondary cold plate 332 is provided with a guide pin 3316 , and the other is provided with a guide hole 3322 relative to the guide pin 3316 .

[0109] The design of the guide pins 3316 and the guide holes 3322 ensures that the main cold plate 331 and the auxiliary cold plate 332 can be accurately aligned during installation, which helps to ensure good contact between the memory heat exchange sub-plate 33 and the memory 203 and improve the heat conduction efficiency.

[0110] The guide pins 3316 and the guide holes 3322 provide a simple and effective alignment mechanism, making the installation process more intuitive and convenient, reducing the possibility of installation errors and improving operation efficiency. During use, the guide pins 3316 and the guide holes 3322 can effectively prevent the relative misalignment of the main cold plate 331 and the auxiliary cold plate 332, ensuring that the memory heat exchange sub-plate 33 maintains a stable structure during operation.

[0111] In some possible implementations, the base plate 3311 and the auxiliary cold plate 332 are provided with through holes 336 for passing the fixed shaft 31. The through holes 336 cooperate with the fixed shaft 31 to form a hinge structure, so that the base plate 3311 and the auxiliary cold plate 332 can rotate on the fixed shaft 31.

[0112] In some possible implementations, there is no heat pipe groove on the auxiliary cold plate 332 , so its thickness can be appropriately reduced to meet the spacing requirement of the memory 203 .

[0113] Please also see Fig.15 In some possible implementations, the locking switch assembly 334 includes a cam wrench 3341, a cam shaft 3342, a clamping slider 3343, and a guide shaft 3344. The cam wrench 3341 is rotatably disposed on the reinforcement frame 3312 through the cam shaft 3342. The guide shaft 3344 is disposed on the reinforcement frame 3312. The auxiliary cold plate 332 is penetrated on the guide shaft 3344, and the clamping slider 3343 is disposed on the auxiliary cold plate 332 and faces the cam wrench 3341. The cam wrench 3341 is used to push the clamping slider 3343 to move along the axial direction of the guide shaft 3344, so that the auxiliary cold plate 332 moves toward the main cold plate 331.

[0114] When the memory heat exchange sub-plate 33 is installed on the memory 203, the main cold plate 331 and the auxiliary cold plate 332 rotate together around the fixed shaft 31 to the two sides of the memory 203 until they are in contact with the main heat exchange sub-channel 11. At this time, the quick locking assembly 32 is lowered and locked, and finally the cam wrench 3341 is pulled from the vertical position to the horizontal position to lock. During the process, the cam of the cam wrench 3341 rotates from the small diameter to the large diameter, pushing the clamping slider 3343 to translate along the guide shaft 3344. In the above process, the clamping slider 3343 will drive the auxiliary cold plate 332 to translate, and the thermal pad 333 on the main cold plate 331 and the auxiliary cold plate 332 will first contact the memory 203. As the main cold plate 331 and the auxiliary cold plate 332 continue to translate and clamp the memory 203 under the thrust of the cam, the thermal pad 333 can be further compressed to ensure that the required pre-tightening force is met between the thermal pad 333 and the memory 203, thereby reducing the contact thermal resistance and achieving the best heat dissipation effect.

[0115] The tight fit and unlocking of the memory heat exchange sub-board 33 and the memory 203 only requires the cam wrench 3341 to be pulled, which is fast and reliable, effectively reducing the failure rate and operation time of electronic component replacement. The use of the cam wrench 3341 makes the locking and unlocking process simple and intuitive, and the operator can quickly complete the installation and removal of the memory heat exchange sub-board 33 and the memory 203, thereby improving the operation efficiency.

[0116] The cam wrench 3341 can accurately control the movement of the clamping slider 3343 through the rotation of the cam shaft 3342, allowing accurate clamping force to be applied to the auxiliary cold plate 332 to ensure good thermal contact between the memory heat exchange sub-plate 33 and the memory 203.

[0117] The guide shaft 3344 provides a stable sliding path to prevent the auxiliary cold plate 332 from deflecting or tilting during movement, thereby ensuring the stability of the memory heat exchange sub-plate 33. Through the cam mechanism, the clamping slider 3343 can move smoothly along the axial direction of the guide shaft 3344, ensuring that the force applied to the auxiliary cold plate 332 is uniform, reducing local stress concentration and reducing the risk of damage to the memory 203.

[0118] In some possible implementations, the cam wrench 3341 has a cam portion 3345 and a handle portion 3346 . The cam portion 3345 is rotatably disposed on the cam shaft 3342 and abuts against the clamping slider 3343 . The handle portion 3346 is connected to the cam portion 3345 .

[0119] The cam portion 3345 can convert rotational motion into linear motion by abutting against the clamping slider 3343, thereby accurately controlling the clamping force applied to the auxiliary cold plate 332, helping to ensure good thermal contact between the memory heat exchange sub-plate 33 and the memory 203, and improving heat dissipation efficiency.

[0120] The handle 3346 provides an interface that is easy to grasp and operate, so that the user can easily rotate the cam wrench 3341, thereby improving the efficiency of installation and removal and reducing the operation time. By adjusting the rotation angle of the handle 3346, the user can easily adjust the size of the clamping force, allowing for flexible adjustment according to specific installation requirements to ensure the best clamping effect.

[0121] In some possible implementations, the mating surfaces of the cam portion 3345 and the clamping slider 3343 are arc surfaces, which can ensure smooth sliding during the mating process.

[0122] In some possible implementations, the locking switch assembly 334 also includes a compression spring 3347, which is sleeved on the guide shaft 3344 and located on the side of the clamping slider 3343 away from the cam wrench 3341, and one side of the compression spring 3347 is connected to the reinforcement frame 3312, and the other side is connected to the clamping slider 3343.

[0123] The compression spring 3347 provides a buffer mechanism that can absorb and alleviate mechanical shock and vibration that may occur during installation and use, helping to protect the memory heat exchange sub-board 33 and memory 203 and extend their service life.

[0124] The difference between the large diameter and the small diameter of the cam portion 3345 is the horizontal displacement of the auxiliary cold plate 332, based on which the parameters such as the compression amount of the thermal pad 333 can be further calculated, which is convenient for design and selection. When it is necessary to operate or unlock the memory heat exchange sub-board 33, pull the cam wrench 3341 from the horizontal position to the vertical position, that is, open the locking switch device. During the process, the cam portion 3345 rotates from the large diameter to the small diameter, and the compression spring 3347 pushes the clamping slider 3343 to move in the direction of release during the rebound process. At this time, the thermal pads 333 of the main cold plate 331 and the auxiliary cold plate 332 and the memory 203 change from a compressed state to a non-contact state. Therefore, after unlocking the quick locking assembly 32, opening the memory slot switch can make the memory 203 smoothly pulled out from the motherboard 201, realizing tool-free and quick replacement.

[0125] In some possible implementations, one of the clamping slider 3343 and the guide shaft 3344 is provided with a guide groove 3348 , and the other is provided with a guide block 3349 relative to the guide groove 3348 .

[0126] The coordinated use of the guide groove 3348 and the guide block 3349 can ensure that the main cold plate 331 and the auxiliary cold plate 332 will not tilt during the translation process, thereby improving the accuracy of fitting with the memory 203.

[0127] The combination of the guide groove 3348 and the guide block 3349 ensures the precise linear movement of the clamping slider 3343 along the guide shaft 3344, helps to prevent the clamping slider 3343 from deflecting or tilting during movement, and ensures that the applied clamping force is uniform and stable. The design of the guide groove 3348 and the guide block 3349 provides a clear movement path, reduces friction and wear between the clamping slider 3343 and other components, and thus extends the service life of the components. The precise guide mechanism improves the reliability of the locking and unlocking operations, ensures that each operation can achieve the expected clamping effect, and enhances the overall reliability of the system.

[0128] In some possible implementations, the memory heat exchange sub-plate 33 further includes an anti-scratch film 335 , and the anti-scratch film 335 is attached to the thermal pad 333 , the main cold plate 331 , and the auxiliary cold plate 332 .

[0129] The anti-scratch film 335 can effectively protect the thermal pad 333 and the surface of the main cold plate 331 and the auxiliary cold plate 332, reduce friction during installation, and prevent scratches, wear or other physical damage during installation, operation and maintenance, thereby extending the service life of the component, maintaining the integrity and thermal conductivity of the thermal pad 333, and ensuring that heat can be efficiently transferred from the memory 203 to the memory heat exchange sub-board 33.

[0130] The anti-scratch film 335 can also prevent dust, grease and other contaminants from adhering to the thermal pad 333 and the surfaces of the main cold plate 331 and the auxiliary cold plate 332, keeping the components clean and improving the heat dissipation efficiency. The presence of the anti-scratch film 335 makes the cleaning and maintenance process simpler, and the user can easily wipe off the dirt on the film without worrying about damaging the thermal pad 333 or the surfaces of the main cold plate 331 and the auxiliary cold plate 332.

[0131] In some possible implementations, a heat conducting groove 133 is provided on the cover plate 13 , a heat exchanging pad 134 is provided in the heat conducting groove 133 , and the internal memory heat exchanging sub-plate 33 abuts against the heat exchanging pad 134 .

[0132] The design of the heat conduction groove 133 can reduce the thermal resistance of the heat of the memory 203 being transferred to the main heat exchange sub-channel 11 through the memory heat exchange sub-plate 33. On the one hand, it can reduce the wall thickness of the heat conduction area of ​​the main heat exchange sub-channel 11 here and reduce its thermal resistance. On the other hand, it can better fix the position of the heat exchange pad 134 to prevent it from moving, wrinkling or falling off after being compressed, thereby increasing its service life.

[0133] The heat exchange pad 134 can effectively fill the gap between the memory heat exchange sub-plate 33 and the cover plate 13 in the heat conduction area, ensure close contact between the two, reduce contact thermal resistance, improve heat conduction efficiency, and transfer the heat generated by the memory 203 to the cover plate 13 more quickly for heat dissipation.

[0134] The combined design of the heat conducting groove 133 and the heat exchange pad 134 reduces the thermal resistance in the heat transfer path, ensuring that heat can be efficiently transferred from the memory heat exchange sub-board 33 to the cover plate 13 .

[0135] The heat conducting groove 133 provides a clear location to place the heat exchange pad 134, which simplifies the installation process, ensures the correct positioning of the heat exchange pad 134, and improves operating efficiency.

[0136] The heat exchange pad 134 has a certain flexibility and can compensate for possible unevenness on the surfaces of the memory heat exchange sub-plate 33 and the cover plate 13, thereby increasing the contact area and heat conduction efficiency.

[0137] Please also see Fig.16 , Fig.17 , Fig.18 , Fig.19 and Fig. 20In some possible implementations, the quick locking assembly 32 includes a pressure rod bracket 321, a pressure rod 322, a lock 323, and a locking plate 324. The lock 323 is arranged on the main heat exchange flow channel 10, one end of the pressure rod 322 is rotatably arranged on the pressure rod bracket 321, and the other end of the pressure rod 322 is provided with a locking plate 324. The lock 323 cooperates with the locking plate 324 to lock the pressure rod 322 and make the pressure rod 322 abut against the side of the memory heat exchange sub-plate 33 away from the main heat exchange flow channel 10, so that the memory heat exchange sub-plate 33 abuts against the main heat exchange flow channel 10.

[0138] The quick locking assembly 32 is used to apply a certain locking force to the memory heat exchange sub-plate 33, so as to further improve the heat conduction efficiency between the memory heat exchange sub-plate 33 and the main heat exchange sub-channel 11 and reduce the contact thermal resistance.

[0139] The design of the quick locking assembly 32 allows the user to quickly lock or release the memory heat exchange sub-plate 33 by simply operating the pressure rod 322, which greatly simplifies the installation and disassembly process and improves the operating efficiency.

[0140] The lock buckle 323 and the lock plate 324 cooperate to provide a stable mechanical connection, ensuring that the pressure rod 322 can firmly hold the memory heat exchange sub-plate 33 against the main heat exchange flow channel 10 to prevent loosening or displacement during use. The design of the pressure rod 322 makes the force applied to the memory heat exchange sub-plate 33 uniform, ensuring good contact between the memory heat exchange sub-plate 33 and the main heat exchange flow channel 10, and improving the heat conduction efficiency.

[0141] In some possible implementations, the pressure rod support 321 and the lock buckle 323 are respectively arranged on the main heat exchange flow channel 10 and are located on both sides of the plurality of sequentially arranged memories 203. When the lock buckle 323 cooperates with the lock sheet 324, the extension direction of the pressure rod 322 is the same as the direction in which the plurality of memories 203 are sequentially arranged, thereby simultaneously pressing the plurality of memory heat exchange sub-plates 33 against the corresponding memories 203.

[0142] In some possible implementations, the quick locking assembly 32 further includes a limiting screw 325 . The limiting screw 325 is disposed on the pressure rod bracket 321 , and a pressure rod sleeve 326 is disposed at one end of the pressure rod 322 , and the pressure rod sleeve 326 is passed through the limiting screw 325 .

[0143] The limit screw 325 provides a clear limit function to ensure that the pressure rod 322 remains in a predetermined position during operation, which helps to ensure a stable connection between the memory heat exchange sub-plate 33 and the main heat exchange flow channel 10. By limiting the movement range of the pressure rod 322, the limit screw 325 can prevent excessive force, thereby avoiding damage to the memory heat exchange sub-plate 33 and other components.

[0144] The pressure rod sleeve 326 is passed through the limiting screw 325 to provide additional support and guidance, thereby enhancing the stability of the pressure rod 322 and reducing possible shaking or deviation during operation.

[0145] In some possible implementations, a spring sheet 327 is provided on one side of the pressure rod 322 facing the memory heat exchange sub-plate 33 , and a protrusion structure 328 is provided on the spring sheet 327 opposite to the memory heat exchange sub-plate 33 .

[0146] The spring piece 327 has a certain elasticity and can provide additional cushioning and support when the pressure rod 322 applies force, adapt to slight dimensional changes caused by thermal expansion or other factors, and ensure stable contact between the memory heat exchange sub-plate 33 and the main heat exchange channel 10. The spring piece 327 and the protruding structure 328 help to improve the heat conduction efficiency and enhance the heat dissipation effect.

[0147] The protruding structure 328 can concentrate the force on a specific area, ensuring that the pressure applied to the memory heat exchange sub-plate 33 is uniform, reducing local stress concentration and lowering the risk of component damage.

[0148] The height of the protruding structure 328 on the corresponding spring sheet 327 can be designed according to the required compression amount of the heat exchange pad 134. When the pressure rod 322 is lowered and locked, the protruding structure 328 on the spring sheet 327 will squeeze the memory heat exchange sub-plate 33, so that the spring sheet 327 will produce elastic deformation and generate a certain elastic force acting on the memory heat exchange sub-plate 33. The force is transmitted through the memory heat exchange sub-plate 33 and compresses the heat exchange pad 134 in the heat conduction groove 133 to meet its buckling force requirements.

[0149] In some possible implementations, the lock buckle 323 includes a locking pin 3231 and a guide slope 3232. The locking piece 324 is provided with a blocking piece 3241 and a paddle 3242. The locking pin 3231 and the blocking piece 3241 are limited and matched, and the paddle 3242 is connected to the blocking piece 3241. When the pressure rod 322 is pressed until the locking pin 3231 and the blocking piece 3241 are limited, locking can be achieved. When the paddle 3242 is toggled to disengage the locking pin 3231 from the blocking piece 3241, unlocking can be achieved, and tool-free installation is achieved, thereby improving operation efficiency.

[0150] The limiting cooperation between the locking pin 3231 and the blocking piece 3241 provides a stable locking mechanism, ensuring that the pressure rod 322 will not loosen when in the locked position, thereby maintaining a stable connection between the memory heat exchange sub-plate 33 and the main heat exchange flow channel 10. The guide bevel 3232 helps to guide the locking piece 324 into the correct position, reducing the need for precise alignment during operation, making the locking and unlocking process smoother and more intuitive. The presence of the guide bevel 3232 also reduces the direct friction between the locking piece 324 and the locking pin 3231, reducing wear and extending the service life of the component. The design of the paddle 3242 allows the user to quickly release the locking mechanism with a simple action, simplifying the disassembly process and improving operational efficiency.

[0151] In this solution, by unlocking the quick locking assembly 32 and the locking switch assembly 334, the memory heat exchange sub-plate 33 can be rotated and lifted along the fixed axis 31, so that the memory slot switch is completely exposed, and there is no device blocking the upper area, which is convenient for the operator to directly unlock the memory slot switch. This effectively solves the difficulty of the existing solution in which the memory slot switch needs to be unlocked through the gap between adjacent memory cold plates using tools, greatly improving the operating efficiency and safety.

[0152] Please also see Fig.21 and Fig. 22 In some possible implementations, the liquid cooling device 100 further includes a liquid leakage detection mechanism 40, and the liquid leakage detection mechanism 40 includes a processor liquid leakage detection component and a memory liquid leakage detection component.

[0153] The liquid leakage detection mechanism 40 can quickly detect any leakage in the liquid cooling system, and promptly sound an alarm or take automatic protective measures to prevent damage caused by liquid leakage. The processor 202 and the memory 203 are key components in the computer system. The liquid leakage detection mechanism 40 specifically monitors these areas, which helps to protect these key components from liquid damage and extend their service life. By quickly detecting and responding to the leakage problem, the system can repair the problem before it expands, reduce unexpected downtime caused by liquid leakage, and improve the availability of the system. The liquid leakage detection mechanism 40 can be integrated with the system's automated management and monitoring system to achieve real-time monitoring and automated response to the liquid cooling system and improve management efficiency. In order to meet the flexibility requirements, the processor leakage detection component and the memory leakage detection component are independently designed, and each has an independent signal interface connected to the mainboard 201.

[0154] In some possible implementations, the processor leakage detection component includes a processor heat exchange mechanism detection component, a processor heat exchange mechanism and connecting pipeline connection detection component, and a processor heat exchange mechanism connecting pipeline detection component.

[0155] The processor leakage detection component is connected at the processor heat exchange mechanism joint welding place, the processor heat exchange mechanism and the connection pipe connection place, and the processor heat exchange mechanism connection pipe, the maintenance joint connection pipe below, etc. The leakage detection line can be fixed to the cold plate, joints and other metal parts by winding along the outer diameter of the metal parts, acetate tape, waterproof tape or buckle, and the leakage detection line can be fixed to the connection pipe by wrapping the leakage detection line and the connection pipe inside the heat shrink sleeve and then heat shrinking it.

[0156] By setting up multiple detection parts at key locations, the system can fully monitor the processor heat exchange mechanism, connecting pipes and their connection points to ensure that any potential leakage problems can be discovered in time. Comprehensive leakage detection improves the overall reliability of the liquid cooling system, ensures safe operation under various operating conditions, and reduces the risk of failure caused by liquid leakage.

[0157] In some possible implementations, the liquid cooling device 100 further includes a cold plate bracket 80, and the memory leakage detection component includes a first guide groove 41, a detection line groove 42, and a leakage detection line 43. The main heat exchange flow channel 10 is arranged on the cold plate bracket 80, and the cold plate bracket 80 is provided with a detection line groove 42 and a plurality of first guide grooves 41 on the side facing the main heat exchange flow channel 10. The plurality of first guide grooves 41 are arranged at intervals, the detection line groove 42 connects the plurality of first guide grooves 41, and the leakage detection line 43 is arranged in the detection line groove 42. The first guide groove 41 is used to collect and guide the leaked liquid in the main heat exchange flow channel 10 to prevent the leaked liquid in the main heat exchange flow channel 10 from spreading to the main board 201 and damaging the circuit. The detection line groove 42 is used to place and protect the leakage detection line 43 to prevent it from being damaged by pulling or friction, and to receive the leaked liquid guided by the first guide groove 41. Once liquid leakage is detected, the electrical signal of the leakage detection line 43 changes and triggers an alarm. After receiving the alarm signal, the server management module immediately issues an instruction to shut down the server power to avoid loss of equipment and data.

[0158] If the memory leakage detection component follows the laying scheme of the processor leakage detection component, it is necessary to fix the leakage detection line and the main heat exchange sub-channel 11 with tape to detect the leakage of liquid. However, in actual use, due to the different structure of the memory heat exchange sub-board 33 and the need to frequently operate the memory 203, it is difficult to fix the leakage detection line on the memory heat exchange sub-board 33 flatly and firmly in the above way. It is easy for the leakage detection line to loosen or shift and interfere with the switch of the memory slot during the opening and closing process, causing the leakage detection line to be damaged due to wear and pulling, and the memory slot switch cannot be locked due to interference, resulting in the failure of the memory 203 to be installed in place. If the number of fixed tapes is increased, part of the leaked liquid will be absorbed and isolated, affecting the accuracy of the leakage detection system. Therefore, the memory leakage detection component in this solution takes into account the convenience of installation and operation and maintenance and the accuracy of the detection function at the same time.

[0159] The arrangement of multiple first guide grooves 41 can effectively guide any potential leakage to a specific detection line groove 42, ensuring that the leakage can be quickly collected and detected, and reducing the diffusion of liquid in the system. By arranging multiple spaced first guide grooves 41 and detection line grooves 42 on the cold plate bracket 80, the system can cover a larger area, ensuring that leakage at any position can be detected, and improving the overall detection coverage. The connection design of the detection line groove 42 and the multiple first guide grooves 41 enables the leakage detection line 43 to quickly detect the liquid in any first guide groove 41, provide a timely leakage alarm, and prevent the liquid from causing damage to the system. Efficient and reliable leakage detection can be achieved in a limited space, it is not easy to interfere with the memory 203, it is firmly fixed and has good contact, it is not easy to be damaged during installation and operation, reducing the difficulty of production and operation and maintenance operations, effectively improving the detection accuracy and installation and operation efficiency, and saving server downtime.

[0160] In some possible implementations, a fixing seat 19 is provided on the main heat exchange flow channel 10 , and the fixing seat 19 is used to connect with the quick connector assembly 21 .

[0161] The fixing seat 19 is provided with a connector, one of which is a female connector and the other is a male connector of the quick connector assembly 21 . The quick connector assembly 21 can be connected by docking the two.

[0162] In some possible implementations, a second guide groove 44 penetrating the main heat exchange flow channel 10 is provided on the main heat exchange flow channel 10 below the quick connector assembly 21 , and the second guide groove 44 is connected to the detection line groove 42 .

[0163] The setting of the second guide groove 44 can effectively guide any leakage from the quick connector assembly 21, so that it quickly flows into the detection line groove 42, thereby improving the efficiency of leakage detection. By connecting the second guide groove 44 with the detection line groove 42, the system can cover a larger detection area, not only limited to the memory 203 area, but also including the area near the quick connector assembly 21, to ensure comprehensive monitoring. Since the second guide groove 44 directly penetrates the main heat exchange flow channel 10, any leakage can be quickly guided to the leakage detection line 43 in the detection line groove 42. Therefore, when the quick connector assembly 21 leaks, the leaking liquid will drip on the surface of the main heat exchange flow channel 10 under the action of gravity. When the liquid accumulates to a certain volume, it will flow along the second guide groove 44 to the detection line groove 42. The leakage detection line 43 arranged in the detection line groove 42 will immediately trigger an alarm after being soaked, thereby achieving a quick response and reducing the potential damage of the liquid to the system. This design makes the leakage detection system more integrated and simplified, reduces the need for additional sensors or complex wiring, and reduces system complexity and cost.

[0164] In some possible implementations, the width of the second guide groove 44 covers the range where leakage may occur in the quick connector assembly 21, that is, the width of the second guide groove 44 is larger than the gap between the female connector and the male connector, thereby enabling a more comprehensive detection of leakage in the quick connector assembly 21.

[0165] In some possible implementations, the inlet 15 is arranged adjacent to one of the fixed seats 19, and the outlet 16 is arranged adjacent to the other fixed seat 19. The length of the second guide groove 44 covers the inlet 15 and one of the fixed seats 19, or the outlet 16 and the fixed seat 19, so as to simultaneously detect leakage at the inlet 15 and the fixed seat 19, or the outlet 16 and the fixed seat 19.

[0166] The leakage detection mechanism 40 of the present application effectively solves the leakage detection problem of the quick connector connection failure in the quick connector assembly 21 in a limited space. For active parts such as quick connectors, it is necessary to connect during operation and disconnect during maintenance, and the accuracy and service life of its leakage detection are crucial. If the leakage detection line is directly laid along the connection direction of the quick connector and fixed to it as a whole, it is necessary to have a terminal in the middle of the leakage detection line to enable connection and disconnection. Therefore, in actual use, before the quick connector needs to be unlocked and disconnected, the leakage detection line terminal here must be disconnected first, and after the quick connector is connected and locked, the leakage detection line terminal here needs to be connected again. The above operation steps will inevitably increase the difficulty and time of the operation, and a little carelessness will cause the leakage detection line to be pulled by external force and damaged. At the same time, the shape of the quick connector is often a continuous curved surface in the axial direction, and the leakage detection line is difficult to fit well and fix with the quick connector, and the problem of not being able to cover the entire area of ​​droplet leakage will also lead to low detection accuracy. The leakage detection mechanism 40 of the present solution not only avoids the complicated leakage detection line loop entangled on the memory heat exchange sub-board 33, solves the interference problem that is easy to occur in practical applications, but also effectively improves the detection accuracy and installation and operation and maintenance efficiency, saving server downtime.

[0167] In some possible implementations, the cold plate bracket 80 is provided with a first positioning pin 81 and a first captive screw 82 , the first positioning pin 81 corresponds to the first positioning hole 204 on the mainboard 201 , and the first captive screw 82 corresponds to the mainboard screw hole 205 on the mainboard.

[0168] The first locating pin 81 corresponds to the locating hole 204 on the mainboard, ensuring that the cold plate bracket 80 can be accurately positioned on the mainboard 201, which helps to ensure the correct alignment of the cold plate bracket 80 with the processor 202 or other components, thereby optimizing the heat conduction efficiency. The design of the first locating pin 81 and the first captive screw 82 makes the installation process simpler and more intuitive, reduces the possibility of installation errors, improves operational efficiency, and facilitates maintenance and replacement of the cold plate bracket 80 and related components. Users can easily remove and reinstall these components, reducing maintenance costs. Users can easily fix the cold plate bracket 80 in place without complicated adjustments. The design of the first captive screw 82 ensures that the screw will not fall off during installation and maintenance, reducing the risk of losing the screw, while ensuring that the cold plate bracket 80 remains stable during use to prevent loosening due to vibration or movement.

[0169] In some possible implementations, the main heat exchange flow channel 10 is provided with a second positioning hole 17 and a second captive screw 18, and the cold plate bracket 80 is provided with a second positioning pin 83 and a bracket screw hole 84, the second positioning pin 83 corresponds to the second positioning hole 17, and the second captive screw 18 corresponds to the bracket screw hole 84.

[0170] The second positioning pin 83 corresponds to the second positioning hole 17 , ensuring the precise alignment of the cold plate bracket 80 and the main heat exchange flow channel 10 , which helps to optimize the liquid flow path and heat conduction efficiency, and ensures efficient operation of the system.

[0171] The design of the second locating pin 83 and the second captive screw 18 makes the installation process simpler and more intuitive. The user can easily fix the main heat exchange channel 10 to the cold plate bracket 80 without complicated adjustments, reducing the possibility of installation errors, facilitating the maintenance and replacement of the main heat exchange channel 10 and related components. The user can easily remove and reinstall these components to reduce maintenance costs. The design of the second captive screw 18 ensures that the screw will not fall off during installation and maintenance, reducing the risk of losing the screw and the screwdriver slipping, while ensuring that the main heat exchange channel 10 remains stable during use to prevent loosening due to vibration or movement.

[0172] In some possible implementations, the liquid cooling device 100 further includes a liquid supply and return joint assembly 50 , which is connected to the main heat exchange channel 10 , and is mainly used for opening and closing the cooling liquid flow path in the server 200 .

[0173] The introduction of the liquid supply and return joint assembly 50 allows the coolant to circulate in the main heat exchange flow channel 10, taking away the heat generated by electronic components such as the processor 202 and the memory 203, thereby achieving efficient thermal management and heat dissipation. The liquid supply and return joint assembly 50 can be integrated with an external cooling system (such as a chiller or a radiator) to provide a flexible heat dissipation solution to adapt to different application requirements and environmental conditions. Through continuous liquid circulation, the liquid cooling device 100 can maintain a stable temperature in the system, prevent overheating, and improve the performance and reliability of electronic equipment.

[0174] In some possible implementations, the supply and return liquid joint assembly 50 is fixed on the leftmost side of the rear window of the server 200, and is connected to the cabinet-end water distributor through the supply and return liquid quick joint 206, so that the cooling liquid circuit is opened, thereby achieving water and electricity separation with the power module on the right side of the server 200 to the greatest extent.

[0175] In some possible implementations, the liquid supply and return joint assembly 50 includes a liquid inlet pipeline 51 and a liquid return pipeline 52 , wherein the liquid inlet pipeline 51 is connected to one side of the main heat exchange channel 10 , and the liquid return pipeline 52 is connected to the other side of the main heat exchange channel 10 .

[0176] The coolant enters the liquid cooling device 100 of the server 200 through the liquid supply and return quick connector 206, and reaches the first main heat exchange sub-channel 111 through the liquid inlet pipeline 51. The coolant flowing out of the third main heat exchange sub-channel 113 is returned to the liquid supply and return quick connector 206 through the liquid return pipeline 52, thereby completing the entire circulation process of the coolant in the server 200.

[0177] By connecting the liquid inlet pipe 51 and the liquid return pipe 52 to the two sides of the main heat exchange channel 10, a complete circulation path is formed to ensure that the coolant can effectively flow through the entire main heat exchange channel 10, remove the heat generated by the equipment, and achieve efficient heat exchange. This design allows flexible configuration of the flow direction and flow rate of the coolant to adapt to different heat dissipation requirements and system configurations, providing greater design and application flexibility.

[0178] In some possible implementations, the processor heat exchange mechanism 20 is provided with a fastening screw hole 22 , and the fastening screw hole 22 corresponds to the stud 207 of the chip socket on the mainboard 201 .

[0179] The corresponding design of the fastening screw hole 22 and the stud 207 ensures that the processor heat exchange mechanism 20 can be firmly fixed on the motherboard 201 to prevent loosening or displacement during use, ensures good contact between the processor heat exchange mechanism 20 and the processor 202, helps to optimize the heat conduction efficiency, and quickly transfers the heat generated by the processor 202 to the processor heat exchange mechanism 20 for heat dissipation.

[0180] The corresponding design of the fastening screw hole 22 and the stud 207 also makes the installation process of the processor heat exchange mechanism 20 simpler and more intuitive, reduces the possibility of installation errors, and improves operating efficiency. The design of the fastening screw hole 22 facilitates the maintenance and replacement of the processor 202 or the processor heat exchange mechanism 20, and the user can easily remove and reinstall the components, reducing maintenance costs.

[0181] By means of the rationally distributed fastening screw holes 22 , the pressure applied to the processor heat exchange mechanism 20 can be effectively dispersed, stress concentration can be reduced, and the risk of component damage can be lowered.

[0182] Please also see Fig.23During installation, the first step is to install the cold plate bracket 80, align all the first positioning pins 81 on the cold plate bracket 80 and put them into the first positioning holes 204 on the main board 201. At this time, the first captive screw 82 can also be aligned with the main board screw hole 205, and the first captive screw 82 is fastened in place. The second step is to lift the pressure rod 322 and rotate all the memory heat exchange sub-plates 33 around the fixed axis 31 to the maximum elevation position. At this time, the pressure rod 322 is lowered and locked. Then all the memory heat exchange sub-plates 33 are rotated in the opposite direction around the fixed axis 31 and lean on the pressure rod 322. The pressure rod 322 plays a role in blocking and limiting the memory heat exchange sub-plate 33, limiting its further falling. The third step is to align the second positioning hole 17 on the main heat exchange channel 10 with the second positioning pin 83 on the cold plate bracket 80, and lower the main heat exchange channel 10 and the memory heat exchange sub-plate 33 together. At this time, the second captive screw 18 on the main heat exchange flow channel 10 is also aligned with the bracket screw hole 84 on the cold plate bracket 80, and the second captive screw 18 is fastened in place. Then, the liquid supply and return joint assembly 50 is fixed to the rear window of the chassis by screw fastening. The fourth step is to install the memory heat exchange sub-board 33, insert the memory 203, and lift the pressure rod 322, rotate all the memory heat exchange sub-boards 33 around the fixed axis 31 to the position covering the memory 203 particles, then lower and lock the pressure rod 322, and finally turn the locking switch assembly 334 to press the memory 203. The fifth step is to install the processor heat exchange mechanism 20, align the fastening screw hole 22 of the processor heat exchange mechanism 20 with the stud 207 of the chip socket on the motherboard 201, and slowly lower it horizontally, and tighten all the fastening screw holes 22 according to the required torque. Then fix the processor heat exchange connection pipeline 23, and connect the liquid inlet quick connector 211 and the liquid outlet quick connector 212. The sixth step is to install the leakage detection line signal interface. The installation of the entire liquid cooling system can be completed by connecting the leakage detection line signal interfaces of the processor heat exchange mechanism 20 and the memory heat exchange sub-board 33 to the main board 201 according to the bit numbers.

[0183] The liquid cooling device 100 provided in the embodiment of the present application includes a main heat exchange channel 10, a processor heat exchange mechanism 20 and a memory heat exchange mechanism 30. The processor heat exchange mechanism 20 is arranged on the processor 202, and the processor heat exchange mechanism 20 is connected to the main heat exchange channel 10 through a quick connector assembly 21. The memory heat exchange mechanism 30 includes a fixed shaft 31, a quick locking assembly 32 and a plurality of memory heat exchange sub-plates 33. The memory heat exchange sub-plates 33 are passed through the fixed shaft 31 and clamped with corresponding memory 203. The quick locking assembly 32 is used to fix the memory heat exchange sub-plates 33 and abut against the main heat exchange channel 10, so that the memory heat exchange sub-plates 33 and the main heat exchange channel 10 can exchange heat.

[0184] Since the processor heat exchange mechanism 20 is connected to the main heat exchange channel 10 by using the quick connector assembly 21, when only the processor 202 or the processor heat exchange mechanism 20 needs to be replaced, the processor heat exchange mechanism 20 and the main heat exchange channel 10 can be quickly connected and disconnected by the quick connector assembly 21, and then the processor heat exchange mechanism 20 can be disassembled and installed separately without the need to disassemble it together with the memory heat exchange mechanism 30 and the memory 203.

[0185] The memory heat exchange sub-plate 33 is passed through the fixed shaft 31 and is fixed by the quick locking component 32 and abuts against the main heat exchange flow channel 10. The memory heat exchange sub-plate 33 is clamped with the corresponding memory 203. Therefore, when the memory 203 needs to be replaced, it is only necessary to simply open the quick locking component 32 and rotate the memory heat exchange sub-plate 33 corresponding to the memory 203 around the fixed shaft 31 to remove the memory 203 and replace it with a new memory 203. There is no need to remove the memory heat exchange sub-plate 33 for disassembly and assembly, which greatly simplifies the replacement process of the memory 203; the memory heat exchange sub-plate 33 is passed through the fixed shaft 31, so the memory heat exchange sub-plate 33 can move freely on the fixed shaft 31. During actual assembly, the memory heat exchange sub-plate 33 can adapt to the position of the memory 203 and accurately adjust its own position to ensure the best contact and heat exchange efficiency between the memory heat exchange sub-plate 33 and the memory 203, achieve the best adaptation, and improve the heat dissipation effect.

[0186] Since the liquid cooling device 100 of the present application supports independent disassembly and maintenance of the processor 202 and the memory 203, operation and maintenance personnel can replace and maintain components more quickly, which greatly improves the flexibility, maintainability, convenience and safety of production, testing and operation and maintenance, reduces downtime, and improves the availability and maintenance efficiency of the server 200.

[0187] In addition, an embodiment of the present application also provides a server 200, including a motherboard 201, a processor 202, a memory 203 and the above-mentioned liquid cooling device 100, the processor 202 and the memory 203 are arranged on the motherboard 201, and the liquid cooling device 100 is used to dissipate heat for the processor 202 and the memory 203.

[0188] Since the server 200 in this embodiment includes the liquid cooling device 100 described in any of the above embodiments, the server 200 includes the structure and beneficial effects of the liquid cooling device 100, and this embodiment will not be further described here.

[0189] The above is a detailed introduction to a liquid cooling device and server provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A liquid cooling device, characterized in that: include: Main heat exchange flow channel; A processor heat exchange mechanism, used for dissipating heat from the processor, the processor heat exchange mechanism being detachably connected to the main heat exchange flow channel via a quick connector assembly so that the processor heat exchange mechanism is in communication with the main heat exchange flow channel; The memory heat exchange mechanism includes a fixed shaft, a quick locking assembly and multiple memory heat exchange sub-plates. The memory heat exchange sub-plates are inserted into the fixed shaft so that the memory heat exchange sub-plates can rotate around the fixed shaft and slide axially along the fixed shaft. The memory heat exchange sub-plates are used to clamp corresponding memory. The quick locking assembly is used to fix the multiple memory heat exchange sub-plates and abut against the main heat exchange flow channel so that the memory heat exchange sub-plates can exchange heat with the main heat exchange flow channel.

2. The liquid cooling device according to claim 1, characterized in that: The main heat exchange flow channel includes a plurality of main heat exchange sub-flow channels, and the plurality of main heat exchange sub-flow channels are connected in sequence through connecting pipelines.

3. The liquid cooling device according to claim 2, characterized in that: The main heat exchange channel includes a first main heat exchange sub-channel, a second main heat exchange sub-channel and a third main heat exchange sub-channel, and the connecting pipeline includes a first branch connecting pipeline and a second branch connecting pipeline. The first main heat exchange sub-channel is connected to the second main heat exchange sub-channel through the first branch connecting pipeline, and the second main heat exchange sub-channel is connected to the third main heat exchange sub-channel through the second branch connecting pipeline.

4. The liquid cooling device according to claim 3, characterized in that: The first main heat exchange sub-channel is provided with a liquid separation port, the third main heat exchange sub-channel is provided with a liquid collection port, the quick connector assembly includes a liquid inlet quick connector and a liquid outlet quick connector, the liquid inlet quick connector is connected to the liquid separation port, and the liquid outlet quick connector is connected to the liquid collection port.

5. The liquid cooling device according to claim 3, characterized in that: The liquid cooling device also includes a liquid supply and return joint assembly, and the liquid supply and return joint assembly is connected to the main heat exchange flow channel.

6. The liquid cooling device according to claim 5, characterized in that: The liquid supply and return joint assembly includes a liquid inlet pipeline and a liquid return pipeline, the liquid inlet pipeline is communicated with the first main heat exchange sub-channel, and the liquid return pipeline is communicated with the third main heat exchange sub-channel.

7. The liquid cooling device according to claim 2, characterized in that: The main heat exchange sub-channel includes a cover plate and a bottom plate, the cover plate is provided with a channel cavity, the bottom plate covers the channel cavity, the processor heat exchange mechanism is connected with the channel cavity, and the memory heat exchange sub-plate abuts against the cover plate.

8. The liquid cooling device according to claim 7, characterized in that: A rib structure is provided in the flow channel cavity, and the rib structure is arranged along the extension direction of the flow channel cavity.

9. The liquid cooling device according to claim 7, characterized in that: The bottom plate is provided with a shovel tooth structure, and the shovel tooth structure is arranged in the flow channel cavity along the extension direction of the flow channel cavity.

10. The liquid cooling device according to claim 7, characterized in that: The cover plate is provided with a heat conduction groove, a heat exchange pad is provided in the heat conduction groove, and the memory heat exchange sub-plate abuts against the heat exchange pad.

11. The liquid cooling device according to any one of claims 1 to 10, characterized in that: The quick connector assembly includes a liquid inlet quick connector and a liquid outlet quick connector. The liquid inlet quick connector connects one side of the main heat exchange channel with the processor heat exchange mechanism, and the liquid outlet quick connector connects the other side of the main heat exchange channel with the processor heat exchange mechanism.

12. The liquid cooling device according to claim 11, characterized in that: The liquid cooling device includes a plurality of the processor heat exchange mechanisms, and adjacent processor heat exchange mechanisms are connected via a processor heat exchange connecting pipeline.

13. The liquid cooling device according to claim 12, characterized in that: The liquid cooling device includes two processor heat exchange mechanisms, the liquid inlet quick connector is connected to one of the processor heat exchange mechanisms through a processor liquid inlet pipeline, the two processor heat exchange mechanisms are connected through the processor heat exchange connecting pipeline, and the other processor heat exchange mechanism is connected to the liquid outlet quick connector through a processor liquid outlet pipeline.

14. The liquid cooling device according to claim 1, characterized in that: The plurality of memory heat exchange sub-plates are divided into two groups along the length direction of the memory. The two groups of memory heat exchange sub-plates are arranged opposite to each other, and along the length direction of the memory, each group of memory heat exchange sub-plates is respectively clamped at one end corresponding to the memory.

15. The liquid cooling device according to claim 1, characterized in that: The memory heat exchange sub-plate includes a main cold plate, a secondary cold plate, a thermal pad and a locking switch assembly. Along the thickness direction of the memory, the main cold plate is located on one side of the memory, the secondary cold plate is movably arranged on the main cold plate and is located on the other side of the memory, the thermal pad is arranged on the side of the main cold plate and the secondary cold plate facing the memory, the main cold plate and the secondary cold plate are penetrated on the fixed shaft, the locking switch assembly is arranged on the main cold plate, and the locking switch assembly is used to drive the secondary cold plate to move toward the main cold plate to press the thermal pads on the secondary cold plate and the main cold plate onto the memory.

16. The liquid cooling device according to claim 15, characterized in that: The locking switch assembly includes a cam wrench, a cam shaft, a clamping slider, and a guide shaft. The cam wrench is rotatably arranged on the main cold plate by the cam shaft. The guide shaft is arranged on the main cold plate. The secondary cold plate is penetrated by the guide shaft. The clamping slider is arranged on the secondary cold plate and faces the cam wrench. The cam wrench is used to push the clamping slider to move axially along the guide shaft so that the secondary cold plate moves toward the main cold plate.

17. The liquid cooling device according to claim 16, characterized in that: The locking switch assembly also includes a compression spring, which is sleeved on the guide shaft and located on the side of the clamping slide away from the cam wrench. One side of the compression spring is connected to the main cold plate, and the other side is connected to the clamping slide.

18. The liquid cooling device according to claim 15, characterized in that: The memory heat exchange sub-plate further includes an anti-scratch film, and the anti-scratch film is attached to the thermal pad, the main cold plate and the auxiliary cold plate.

19. The liquid cooling device according to claim 1, characterized in that: The quick locking assembly includes a pressure rod bracket, a pressure rod, a locking buckle, and a locking plate. The locking buckle is arranged on the main heat exchange flow channel. One end of the pressure rod is rotatably arranged on the pressure rod bracket. The other end of the pressure rod is provided with the locking plate. The locking buckle cooperates with the locking plate to lock the pressure rod and make the pressure rod abut against the side of the memory heat exchange sub-plate away from the main heat exchange flow channel so that the memory heat exchange sub-plate abuts against the main heat exchange flow channel.

20. The liquid cooling device according to claim 19, characterized in that: A spring sheet is provided on one side of the pressure rod facing the memory heat exchange sub-plate, and a protruding structure is provided on the spring sheet relative to the memory heat exchange sub-plate.

21. The liquid cooling device according to claim 1, characterized in that: The liquid cooling device also includes a liquid leakage detection mechanism, which includes a processor liquid leakage detection component and a memory liquid leakage detection component.

22. The liquid cooling device according to claim 21, characterized in that: The liquid-cooled heat dissipation device also includes a cold plate bracket, the memory leakage detection component includes a first guide groove, a detection line groove and a leakage detection line, the main heat exchange flow channel is arranged on the cold plate bracket, and the cold plate bracket is provided with the detection line groove and multiple first guide grooves on the side facing the main heat exchange flow channel, the multiple first guide grooves are arranged at intervals, the detection line groove connects multiple first guide grooves, and the leakage detection line is arranged in the detection line groove.

23. The liquid cooling device according to claim 22, characterized in that: A fixing seat is provided on the main heat exchange flow channel, and the fixing seat is used to be connected with the quick connector assembly.

24. The liquid cooling device according to claim 23, characterized in that: The main heat exchange flow channel below the quick connector assembly is provided with a second guide groove penetrating the main heat exchange flow channel, and the second guide groove is communicated with the detection line groove.

25. A server, characterized in that: Comprising a liquid cooling heat dissipation device as described in any one of claims 1-24.

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