Active heat dissipation computer host carrying solid state disk

Abstract

The invention provides an active heat dissipation computer host carrying a solid state disk, and belongs to the field of computer hosts, the active heat dissipation computer host comprises a case and a base at the bottom of the case, a mainboard assembly is arranged in the center of the interior of the case, and a heat dissipation assembly is arranged between the case and the mainboard assembly. According to the invention, by arranging the heat conduction pipe, the transmission pipe, the fan blades, the servo motor and the heat dissipation block, the heat conduction pipe, the transmission pipe, the fan blades and the heat dissipation block all have high heat conductivity coefficients, heat generated by the solid state disk can be rapidly absorbed, meanwhile, the heat transfer direction is controllable, and the outer surface and the inner surface of the heat conduction pipe can be in contact with air; the opening part of the side wall of the heat conduction pipe is attached to the flow guide cover, it is guaranteed that the airflow blown out of the heat conduction pipe flows to the flow guide cover in a concentrated mode, meanwhile, the noise transmission direction is limited, noise is blocked by the flow guide cover, energy of sound waves can be reduced, and the heat dissipation effect is improved. Therefore, the noise reduction effect is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of computer host, and in particular to an active heat dissipation computer host equipped with a solid state hard disk. Background Art

[0002] The mainframe is one of the basic units of a computer. It provides a structured environment to accommodate and connect all other computing resources and devices. It usually contains motherboards, CPUs, memory, graphics cards, etc. With the development of technology, the mainframe has evolved from traditional desktops to today's compact PCs, with a wide variety of options and configurations. Due to its compact design and space limitation, compact PCs often have prominent heat dissipation issues, especially for high-speed solid-state hard disks. In the prior art, an active heat dissipation computer host equipped with a solid-state hard disk with announcement number CN118819262B provides a solution, which uses a heat dissipation fan to dissipate heat for the solid-state hard disk in an abnormal state, thereby preventing the solid-state hard disk from being damaged by continuous high heat. However, when the device is in use, the cooling fan dissipates heat to the SSD mounting plate and the SSD through airflow. The surface area of ​​the SSD and the SSD mounting plate is small, and the area for heat exchange with the air is small, resulting in problems such as noise and temperature being difficult to control. To this end, an active heat dissipation computer host equipped with a solid state hard disk is proposed. Summary of the invention

[0003] In view of this, the purpose of the present application is to provide an active heat dissipation computer host equipped with a solid-state hard disk to quickly dissipate the heat generated by the solid-state hard disk into the ambient air.

[0004] In order to solve the above technical problems, this application provides the following technical solutions: An active heat dissipation computer host equipped with a solid state hard disk comprises a chassis and a base at the bottom thereof, a mainboard assembly is arranged at the inner center of the chassis, and a heat dissipation assembly is arranged between the chassis and the mainboard assembly; The chassis comprises: a middle frame, a side cover and a porous plate, wherein the side cover is arranged at one side opening of the middle frame, and the porous plate is arranged at the other side opening of the middle frame; The motherboard assembly includes: a mounting plate, a heat pipe, a solid state hard disk and a cooling fan, wherein the heat pipe is attached to one side of the surface of the mounting plate, the solid state hard disk is clamped to the other side of the surface of the mounting plate, and the cooling fan is arranged at an end corner position of the mounting plate; The heat dissipation component includes: a heat conducting pipe, a grid plate, a transmission pipe, a fan blade, a servo motor, an extrusion, a heat conducting block and a heat dissipation block. The heat conducting pipe is arranged in contact with the inner wall of the middle frame, the two grid plates are respectively arranged on both sides of the inner cavity of the heat conducting pipe, the transmission pipe is rotatably arranged to penetrate the grid plate, the fan blade is sleeved on both ends of the transmission pipe, the servo motor is arranged inside the heat conducting pipe, the servo motor and the transmission pipe establish a transmission relationship, the extrusion is arranged on the outside of the transmission pipe, the heat conducting block is arranged between the two grid plates, the heat dissipation block is arranged on the outside of the heat conducting pipe, and the heat dissipation block is attached to the outside of the solid state drive.

[0005] Preferably, the middle frame is arranged in the middle position of the side wall of the side cover, a heat dissipation channel is arranged between the outer side wall of the middle frame and the side cover, and an air outlet matching the heat dissipation fan is arranged on the middle frame.

[0006] Preferably, the mounting plate is arranged at the center of the middle frame, a groove is arranged at the end corner of the mounting plate, a guide cover is arranged in the end corner groove of the mounting plate, the guide cover includes two air outlets with an angle of 90 degrees, an air inlet is arranged on the side of the guide cover facing the porous plate, and the cooling fan is arranged in the guide cover; The heat conducting pipe is arranged in close contact with the air guide cover, and the opening of the side wall of the heat conducting pipe is communicated with the inner cavity of the air guide cover.

[0007] Preferably, a heat sink is arranged in the air outlet of the air guide cover, the side wall opening of the heat pipe is arranged opposite to the heat sink, and the end of the heat pipe is attached to the outer side wall of the heat sink.

[0008] Preferably, the heat-conducting pipe is a hollow rectangular parallelepiped structure, the heat-conducting pipe includes openings at both ends, the grid plate is hollowed out, and the diameter of the hollow hole of the grid plate is smaller than the diameter of the heat-conducting block.

[0009] Preferably, the transmission tube is a hollow circular tube structure, the transmission tube is rotatably connected to the grid plate via a bearing, and a circular hole is provided on the outer side wall of the transmission tube.

[0010] Preferably, the extrusion piece is a spiral structure, the diameter of the extrusion piece is half the diameter of the inner cavity of the heat conduction pipe, and the outer side wall of the extrusion piece is provided with ventilation holes.

[0011] Preferably, the heat conductive block is a spherical structure.

[0012] Preferably, a thermal pad is attached to the inner side wall of the heat-conducting pipe, and the side wall of the thermal pad is attached to the side wall of the grid plate.

[0013] Preferably, the thermally conductive pad is a tubular structure, and the thickness of the thermally conductive pad is half of the diameter of the thermally conductive block.

[0014] Compared with the prior art, this application has at least the following beneficial effects:

[0015] In the present invention, a heat pipe, a transmission pipe, a fan blade, a servo motor and a heat sink are provided. The heat pipe, the transmission pipe, the fan blade and the heat sink all have high thermal conductivity, can quickly absorb the heat generated by the solid state hard disk, and at the same time make the heat transfer direction controllable. The outer surface and the inner surface of the heat pipe can be in contact with the air, thereby ensuring a good heat exchange area. The airflow in the heat pipe is controllable and concentrated, and has a stable heat dissipation effect. The opening portion of the side wall of the heat pipe fits the air guide cover, ensuring that the airflow blown out of the heat pipe is concentrated to flow to the air guide cover, and at the same time limiting the direction of noise propagation. The noise is blocked by the air guide cover, which can reduce the energy of the sound wave, thereby achieving the effect of noise reduction.

[0016] In the present invention, a heat-conducting pipe, a heat-conducting block, an extrusion piece and a grid plate are provided, and a channel for air flow is provided between two adjacent heat-conducting blocks. At the same time, the heat-conducting block and the air have a good heat exchange area. The activity space of the heat-conducting block is limited by the heat-conducting pipe, so that the heat transfer direction is controllable. When the heat-conducting block is squeezed by the extrusion piece, the heat-conducting block is displaced, and the flowing heat-conducting block can be in more sufficient contact with the air. At the same time, the channel for air flow is further increased, the air flow velocity in the heat-conducting pipe is guaranteed, and the heat dissipation effect is enhanced.

[0017] In the present invention, by arranging heat pipes and heat pads, the heat pads are soft in texture and have a high thermal conductivity, so that good heat exchange can be achieved between the heat pipes, the heat pads and the heat blocks. The heat pads can absorb sound waves, reduce the reflection of sound waves, disperse and weaken the propagation of sound waves, thereby suppressing the loudness of noise.

[0018] In the present invention, a heat-conducting block is provided, the heat-conducting block has a high thermal conductivity and can absorb the heat emitted by the solid-state hard disk. The spherical heat-conducting block has a low rolling resistance and can transfer the heat to the air through displacement. The activity space of the heat-conducting block is limited by the heat-conducting pipe, so that the heat transfer direction is controllable to reduce the influence of heat on other electronic components on the mainboard assembly. The heat-conducting blocks are closely arranged, and the gaps between two adjacent heat-conducting blocks are densely distributed. Therefore, when the noise passes through the heat-conducting blocks, it is constantly reflected, and the energy carried by the sound waves is constantly weakened, so as to achieve the effect of suppressing the noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure in this application; Figure 2 Schematic diagram of the porous plate structure in this application; Figure 3 This is a schematic diagram of the mounting plate structure in this application; Figure 4 This is a schematic diagram of the heat pipe structure in this application; Figure 5 This is a schematic diagram of the cross-sectional structure of the heat pipe in this application; Figure 6 This is a schematic diagram of the structure of the extrusion part in this application; Figure 7 This is a schematic diagram of the thermal pad structure in this application; Figure 8 This is a schematic diagram of the structure of the air deflector in this application; [Reference Signs] 1. Chassis; 101. Middle frame; 102. Side cover; 103. Perforated plate; 2. Base; 3. Mounting plate; 301. Heat pipe; 302. Solid state drive; 303. Cooling fan; 304. Air guide cover; 3041. Heat sink; 4. Heat pipe; 401. Grille plate; 402. Drive pipe; 403. Fan blade; 404. Servo motor; 405. Extrusion; 406. Heat block; 407. Heat sink; 408. Thermal pad. DETAILED DESCRIPTION

[0020] The following is a detailed description of the active heat dissipation computer host equipped with a solid state drive provided by the present invention in conjunction with the accompanying drawings and specific embodiments. At the same time, it is explained here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art may also adopt other alternative methods to implement some known technologies; and the accompanying drawings are only for a more specific description of the embodiments, and are not intended to specifically limit the present invention.

[0021] like Figure 1 , Figure 2 , Figure 3 and Figure 4 An active heat dissipation computer host equipped with a solid state drive is shown, and an embodiment of the present application provides, comprising a chassis 1 and a base 2 at the bottom thereof, a motherboard assembly is arranged at the inner center of the chassis 1, and a heat dissipation assembly is arranged between the chassis 1 and the motherboard assembly; The chassis 1 includes: a middle frame 101, a side cover 102 and a porous plate 103, wherein the side cover 102 is arranged at one opening of the middle frame 101, and the porous plate 103 is arranged at the other opening of the middle frame 101; The motherboard assembly includes: a mounting plate 3, a heat pipe 301, a solid state drive 302 and a cooling fan 303, wherein the heat pipe 301 is attached to one side of the surface of the mounting plate 3, the solid state drive 302 is clamped to the other side of the surface of the mounting plate 3, and the cooling fan 303 is arranged at an end corner position of the mounting plate 3; The heat dissipation component includes: a heat pipe 4, a grid plate 401, a transmission pipe 402, a fan blade 403, a servo motor 404, an extrusion piece 405, a heat conduction block 406 and a heat dissipation block 407. The heat pipe 4 is attached to the inner wall of the middle frame 101. Two grid plates 401 are respectively arranged on both sides of the inner cavity of the heat pipe 4. The transmission pipe 402 can rotatably penetrate the grid plate 401. The fan blade 403 is sleeved on both ends of the transmission pipe 402. The servo motor 404 is arranged inside the heat pipe 4. The servo motor 404 establishes a transmission relationship with the transmission pipe 402. The extrusion piece 405 is arranged on the outside of the transmission pipe 402. The heat conduction block 406 is arranged between the two grid plates 401. The heat dissipation block 407 is arranged on the outside of the heat pipe 4. The heat dissipation block 407 is attached to the outside of the solid state drive 302. The servo motor 404 is provided with a matching power supply and controller. In actual use, the heat generated by the solid state hard disk 302 is conducted to the heat sink 407 with a high thermal conductivity. The portion of the heat sink 407 that is attached to the heat pipe 4 can absorb heat quickly. At the same time, a heat sink 407 that is attached to the surface of the solid state hard disk 302 is provided with a heat dissipation groove to increase the surface area and improve the heat exchange area between the heat sink 407 and the air.

[0022] The heat is transferred to the heat conducting block 406 which also has a high thermal conductivity through the heat dissipation block 407. The transmission tube 402 is driven to rotate by the servo motor 404. The two fan blades 403 on both sides of the transmission tube 402 rotate. The fan blades 403 squeeze the air during the rotation, so that the external air enters the heat conducting tube 4 through the porous plate 103. The impurities in the air are intercepted by the grid plate 401 to reduce the problem of impurities adhering to the surface of the heat conducting tube 4 and hindering the heat dissipation. The flowing air exchanges heat with the heat conducting tube 4 to achieve the effect of heat dissipation. The outer surface and the inner surface of the heat pipe 4 can both be in contact with the air, thereby ensuring a good heat exchange area. At the same time, the heat pipe 4 has a high thermal conductivity, which can quickly absorb the heat generated by the solid state drive 302 and quickly dissipate the heat to the external environment of the chassis 1; During the rotation of the transmission tube 402, the extrusion member 405 is driven to reciprocate. The extrusion member 405 has an inclined surface, so it can squeeze the air, accelerate the airflow in the heat pipe 4, and achieve the effect of increasing the wind pressure and air volume, further enhancing the heat dissipation effect; At the same time, a heat-conducting block 406 with a high thermal conductivity is also provided in the heat-conducting tube 4. The heat-conducting block 406 can quickly absorb the heat on the heat-conducting tube 4. The heat-conducting block 406 is filled in the inner cavity of the heat-conducting tube 4, thereby ensuring that the heat-conducting blocks 406 can fit each other. The two heat-conducting blocks 406 that fit each other can quickly exchange the heat carried by each other. At the same time, when air flows in the heat-conducting tube 4, a channel for air flow is provided between two adjacent heat-conducting blocks 406, so that the heat of the heat-conducting blocks 406 can be dissipated to the outside through the air flow. At the same time, the activity space of the heat conducting block 406 is limited by the heat conducting pipe 4, so that the heat transfer direction can be controlled to reduce the influence of heat on other electronic components on the mainboard assembly. When the heat conducting block 406 is squeezed by the extrusion piece 405, the heat conducting block 406 is displaced, and the flowing heat conducting block 406 can be more fully in contact with the air, and at the same time, the air flow channel is further increased to ensure the air flow rate in the heat conducting pipe 4. At the same time, the heat conducting blocks 406 are closely arranged, and the gaps between two adjacent heat conducting blocks 406 are densely distributed, so that the noise is constantly reflected when passing through the heat conducting blocks 406, and the energy carried by the sound waves is constantly weakened, thereby achieving the effect of suppressing noise; At the same time, the transmission tube 402 and the extrusion piece 405 both have high thermal conductivity, which can also be used to transfer heat. At the same time, the part in contact with the air has a good heat exchange area, thus being able to meet the heat dissipation requirements.

[0023] In this embodiment, Figures 3 to 8 As shown, the middle frame 101 is arranged in the middle of the side wall of the side cover 102, a heat dissipation channel is arranged between the outer wall of the middle frame 101 and the side cover 102, and an air outlet matching the heat dissipation fan 303 is arranged on the middle frame 101; The middle frame 101 is disposed between the side cover 102 and the porous plate 103. The middle frame 101 is shielded by the side cover 102 and the porous plate 103, so it is not easily affected by external impact and has a high safety factor. Meanwhile, the middle frame 101 is made of metal, which has good mechanical strength and is not easily deformed by impact. The heat dissipation channel between the middle frame 101 and the side cover 102 can be used to limit the air flow direction, thereby facilitating the removal of heat accumulated on the middle frame 101 and achieving a heat dissipation effect. The heat dissipation fan 303 provided on the middle frame 101 is used to dissipate the heat accumulated on the heat pipe 301 to the ambient air. At the same time, the opening of the heat pipe 4 is provided on the air outlet path of the heat dissipation fan 303, so that the air blown by the heat dissipation fan 303 is effectively utilized to achieve the effect of heat dissipation of the heat pipe 4. The airflow blown out of the heat pipe 4 can merge into the airflow discharged by the heat dissipation fan 303 , and the airflow is controllable and concentrated, thereby improving the user experience.

[0024] The mounting plate 3 is arranged at the center of the middle frame 101, and a groove is arranged at the end corner of the mounting plate 3. A guide cover 304 is arranged in the end corner groove of the mounting plate 3. The guide cover 304 includes two air outlets at an angle of 90 degrees. The guide cover 304 is provided with an air inlet on one side facing the porous plate 103, and the cooling fan 303 is arranged in the guide cover 304; The heat conducting pipe 4 is arranged in close contact with the air guide cover 304, and the opening of the side wall of the heat conducting pipe 4 is connected with the inner cavity of the air guide cover 304; The air guide cover 304 can collect the airflow discharged by the cooling fan 303, so that the airflow flows in a concentrated manner. At the same time, two air outlets are provided, which can match two independently working heat pipes 301, thereby increasing the heat dissipation area and improving the heat dissipation effect. At the same time, the two air outlets of the air guide cover 304 are orthogonally distributed, and the two air flows do not intersect, thereby preventing the air flows from interfering with each other and improving the user experience; The cooling fan 303 is arranged inside the air deflector 304, and the cooling fan 303 is shielded by the air deflector 304 to improve the safety factor and ensure the stable and safe operation of the cooling fan 303. At the same time, the air deflector 304 can block the noise of the cooling fan 303 from being transmitted to the outside during operation, thereby achieving a noise reduction effect.

[0025] The opening of the side wall of the heat conducting pipe 4 is fitted with the air guide cover 304 to ensure that the airflow blown out of the heat conducting pipe 4 is concentrated and flows toward the air guide cover 304. At the same time, the direction of noise propagation is limited. The noise is blocked by the air guide cover 304, which can reduce the energy of the sound wave, thereby achieving the effect of noise reduction.

[0026] A heat sink 3041 is disposed in the air outlet of the air guide cover 304, the side wall opening of the heat pipe 4 is disposed opposite to the heat sink 3041, and the end of the heat pipe 301 is attached to the outer side wall of the heat sink 3041; The heat sink 3041 increases the heat exchange area between the air guide cover 304 and the air, which helps to improve the heat dissipation effect of the heat pipe 4 and the air guide cover 304. At the same time, the end of the heat pipe 301 is attached to the heat sink 3041, which can quickly cool the heat pipe 301. When the heat pipe 301 is attached to the CPU and the GPU, it can bring heat dissipation effect to the CPU and the GPU. At the same time, the heat sink 3041 further increases the resistance and path of noise sound wave propagation, which can effectively reduce the energy of the noise sound wave and achieve the effect of noise reduction.

[0027] The heat conducting pipe 4 is a hollow rectangular parallelepiped structure, and the heat conducting pipe 4 includes openings at both ends. The grid plate 401 is hollowed out, and the diameter of the hollow hole of the grid plate 401 is smaller than the diameter of the heat conducting block 406; The heat pipe 4 has openings at both ends for air circulation. The fan blades 403 are arranged in the inner cavity of the heat pipe 4. The noise is weakened by the inner wall of the heat pipe 4 to reduce the noise problem. The grille plate 401 is arranged on the air flow path. The grille plate 401 can filter impurities in the air flow, absorb the energy of the noise, and limit the position of the heat conductive block 406, while supporting the stable rotation of the transmission pipe 402.

[0028] The transmission tube 402 is a hollow circular tube structure, and the transmission tube 402 is rotatably connected to the grid plate 401 through a bearing, and a circular hole is provided on the outer wall of the transmission tube 402; The inner cavity of the transmission tube 402 can provide air flow. When the fan blades 403 are working, airflow is generated in the inner cavity of the heat pipe 4. The airflow enters the transmission tube 402 through the outer circular hole of the transmission tube 402, thereby ensuring that the air flow inside the heat pipe 4 remains stable, thereby ensuring the heat dissipation effect of the heat pipe 4.

[0029] The extrusion piece 405 is a spiral structure, the diameter of the extrusion piece 405 is half of the inner diameter of the heat conducting tube 4, and the outer wall of the extrusion piece 405 is provided with a vent hole; The extrusion piece 405 can effectively drive the heat conducting block 406 to move, so that the heat conducting block 406 can fully exchange heat with the air. The heat conducting block 406 filled in the heat conducting pipe 4 has a large surface area, so that good heat conduction and heat dissipation effects can be achieved. The extrusion piece 405 drives the heat conducting block 406 to flow inside the heat conducting pipe 4 . Meanwhile, the through holes of the extrusion piece 405 itself can allow air to flow, provide an air flow path, and make the air flow and mix well, thereby improving the heat dissipation effect.

[0030] The heat conducting block 406 is a spherical structure; In the case of the same volume, the spherical structure has a larger surface area and smaller rolling resistance than other structures. The heat conducting block 406 has a large surface area, so it has a good heat exchange area with the air. The contact surface between two adjacent heat conductive blocks 406 is point contact, so the influence on the air flow can be controlled. At the same time, the surface of the heat conductive block 406 is smooth and has a small rolling resistance, so it can move smoothly and move well in the heat dissipation airflow to achieve the heat dissipation effect.

[0031] The inner wall of the heat pipe 4 is attached with a heat pad 408, and the side wall of the heat pad 408 is attached to the side wall of the grid plate 401; The thermal pad 408 is soft and has a high thermal conductivity. Since the thermal pad 408 is elastic, the thermal pad 408 can wrap the thermal block 406 to ensure a good heat exchange area and meet the need for rapid heat conduction. At the same time, the thermal pad 408 can absorb sound waves, reduce the reflection of sound waves, disperse and weaken the propagation of sound waves. The soft texture of the thermal pad 408 makes the sound waves attenuate when propagating inside it, thereby reducing the loudness of the noise; At the same time, the thermal pad 408 can reduce vibration. The thermal pad 408 can isolate the vibration caused by the collision between the thermal blocks 406 or the collision between the thermal blocks 406 and the heat pipe 4, thereby reducing noise.

[0032] The thermal pad 408 is a tubular structure, and the thickness of the thermal pad 408 is half of the diameter of the thermal block 406; The cross-section of the thermal pad 408 is square, which can fit the inner wall of the heat pipe 4, provide good protection for the inner wall of the heat pipe 4, reduce noise and vibration problems, and meet the needs of heat conduction. Its thickness is only half of the diameter of the thermal block 406, so that the thermal block 406 can move smoothly relative to the thermal pad 408.

[0033] The technical solution provided by the present invention is that when it is actually used, the heat generated by the solid state hard disk 302 is transferred to the heat conductive block 406, and the transmission tube 402 is driven to rotate by the servo motor 404, and the two fan blades 403 on both sides of the transmission tube 402 rotate. During the rotation of the fan blades 403, the air is squeezed, so that the external air enters the heat conductive tube 4 through the porous plate 103, and the impurities in the air are intercepted by the grid plate 401; The outer surface and the inner surface of the heat pipe 4 can be in contact with the air to dissipate heat, and the heat conducting block 406 can quickly absorb the heat on the heat conducting pipe 4. When there is airflow in the heat conducting pipe 4, a channel for airflow is provided between two adjacent heat conducting blocks 406, so that the heat of the heat conducting blocks 406 can be dissipated to the outside through the airflow. When the heat conducting block 406 is squeezed by the extrusion piece 405, the heat conducting block 406 is displaced, and the flowing heat conducting block 406 can be in more sufficient contact with the air, and at the same time, the air flow channel is further increased, thereby ensuring the air flow velocity in the heat conducting pipe 4; At the same time, the transmission tube 402 and the extrusion piece 405 both have high thermal conductivity, which can also be used to transfer heat. At the same time, the part in contact with the air has a good heat exchange area, thus being able to meet the heat dissipation requirements.

[0034] The present invention covers any substitution, modification, equivalent method and scheme made on the essence and scope of the present invention. In order to make the public have a thorough understanding of the present invention, specific details are described in detail in the following preferred embodiments of the present invention, but those skilled in the art can fully understand the present invention without the description of these details. In addition, in order to avoid unnecessary confusion about the essence of the present invention, well-known methods, processes, procedures, components and circuits are not described in detail.

[0035] A person skilled in the art will appreciate that all or part of the steps in the above-mentioned embodiment method can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc.

[0036] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. An active heat dissipation computer host equipped with a solid state hard disk, comprising a chassis (1) and a base (2) at the bottom thereof, characterized in that: A mainboard assembly is arranged at the inner center of the chassis (1), and a heat dissipation assembly is arranged between the chassis (1) and the mainboard assembly; The chassis (1) comprises: a middle frame (101), a side cover (102) and a porous plate (103), wherein the side cover (102) is arranged at an opening on one side of the middle frame (101), and the porous plate (103) is arranged at an opening on the other side of the middle frame (101); The motherboard assembly comprises: a mounting plate (3), a heat pipe (301), a solid state hard disk (302) and a cooling fan (303), wherein the heat pipe (301) is attached to one side of the surface of the mounting plate (3), the solid state hard disk (302) is snap-connected to the other side of the surface of the mounting plate (3), and the cooling fan (303) is arranged at an end angle position of the mounting plate (3); The heat dissipation assembly comprises: a heat conducting pipe (4), a grid plate (401), a transmission pipe (402), a fan blade (403), a servo motor (404), an extrusion piece (405), a heat conducting block (406) and a heat dissipation block (407); the heat conducting pipe (4) is arranged to be attached to the inner wall of the middle frame (101); the two grid plates (401) are respectively arranged on both sides of the inner cavity of the heat conducting pipe (4); the transmission pipe (402) is rotatably arranged to penetrate the grid plate (401); the fan blade (403) is arranged to be attached to the inner wall of the middle frame (101); 3) are sleeved on both ends of the transmission tube (402), the servo motor (404) is arranged inside the heat conducting tube (4), the servo motor (404) and the transmission tube (402) establish a transmission relationship, the extrusion piece (405) is arranged outside the transmission tube (402), the heat conducting block (406) is arranged between the two grid plates (401), the heat dissipation block (407) is arranged outside the heat conducting tube (4), and the heat dissipation block (407) is attached to the outside of the solid state drive (302).

2. The active heat dissipation computer host equipped with a solid state drive according to claim 1, characterized in that: The middle frame (101) is arranged in the middle of the side wall of the side cover (102), a heat dissipation channel is arranged between the outer wall of the middle frame (101) and the side cover (102), and an air outlet matching the heat dissipation fan (303) is arranged on the middle frame (101).

3. The active heat dissipation computer host equipped with a solid state drive according to claim 1, characterized in that: The mounting plate (3) is arranged at the center position of the middle frame (101); a groove is arranged at the end corner position of the mounting plate (3); a guide cover (304) is arranged in the end corner groove of the mounting plate (3); the guide cover (304) comprises two air outlets with an included angle of 90 degrees; an air inlet is arranged on a side of the guide cover (304) facing the porous plate (103); and the cooling fan (303) is arranged in the guide cover (304); The heat conducting pipe (4) is arranged in close contact with the air guide cover (304), and the side wall opening of the heat conducting pipe (4) is in communication with the inner cavity of the air guide cover (304).

4. The active heat dissipation computer host equipped with a solid state hard disk according to claim 3, characterized in that: A heat sink (3041) is arranged in the air outlet of the air guide cover (304), the side wall opening of the heat pipe (4) is arranged directly opposite to the heat sink (3041), and the end of the heat pipe (301) is attached to the outer side wall of the heat sink (3041).

5. The active heat dissipation computer host equipped with a solid state drive according to claim 1, characterized in that: The heat conducting pipe (4) is a hollow rectangular parallelepiped structure, the heat conducting pipe (4) comprises openings at both ends, the grid plate (401) is hollowed out, and the diameter of the hollow hole of the grid plate (401) is smaller than the diameter of the heat conducting block (406).

6. The active heat dissipation computer host equipped with a solid state drive according to claim 1, characterized in that: The transmission tube (402) is a hollow circular tube structure; the transmission tube (402) is rotatably connected to the grid plate (401) via a bearing; and a circular hole is provided on the outer side wall of the transmission tube (402).

7. The active heat dissipation computer host equipped with a solid state hard disk according to claim 1, characterized in that: The extruded part (405) is a spiral structure, the diameter of the extruded part (405) is half the diameter of the inner cavity of the heat conducting pipe (4), and the outer side wall of the extruded part (405) is provided with a vent hole.

8. The active heat dissipation computer host equipped with a solid state hard disk according to claim 1, characterized in that: The heat conducting block (406) is a spherical structure.

9. The active heat dissipation computer host equipped with a solid state drive according to claim 1, characterized in that: The inner side wall of the heat-conducting pipe (4) is bonded with a heat-conducting pad (408), and the side wall of the heat-conducting pad (408) is bonded to the side wall of the grid plate (401).

10. The active heat dissipation computer host equipped with a solid state hard disk according to claim 9, characterized in that: The thermally conductive pad (408) is a tubular structure, and the thickness of the thermally conductive pad (408) is half the diameter of the thermally conductive block (406).

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