Display module and display device

Abstract

The invention provides a display module and a display device. The display module comprises a display panel and a flexible circuit board, the display panel comprises a plane part and a first binding part located on one side of the plane part, the flexible circuit board comprises a flexible main body and a supporting piece arranged on one side of the flexible main body, the flexible main body is provided with a second binding part connected with the first binding part in a binding mode, and the supporting piece is connected with the second binding part in a binding mode. The rigidity of the supporting piece is smaller than or equal to the rigidity of the flexible body. According to the flexible circuit board, the rigidity of the supporting piece in the flexible circuit board is reduced, so that the rigidity of the supporting piece is smaller than or equal to the rigidity of the flexible main body, the yield strength of the supporting piece is reduced, and the technical problem that the supporting piece is separated from the display panel due to edge warping of the supporting piece is solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] In existing display devices, the flexible circuit board is usually bound and connected to the binding area of ​​the display panel in the display device to transmit data signals, and after the flexible circuit board is bound and connected to the binding terminal in the display panel, it is usually fixed on the side of the display panel away from the light emitting surface.

[0003] However, since the design of existing display modules is usually to achieve easy folding and thin modules, the thickness and modulus of each layer in the module are designed to be small, resulting in a decrease in the impact resistance of the flexible circuit board; and when the rigidity of the flexible circuit board increases, the edges of the flexible circuit board are prone to warping. Summary of the invention

[0004] The present application provides a display module and a display device to improve the technical problem of warping of the edge of a flexible circuit board in an existing display module.

[0005] To solve the above-mentioned problems, the technical solutions provided by this application are as follows:

[0006] The present application proposes a display module, which includes:

[0007] The display panel comprises a plane portion and a first binding portion located on one side of the plane portion;

[0008] A flexible circuit board comprises a flexible main body and a support member arranged on one side of the flexible main body, wherein the flexible main body is provided with a second binding portion which is bound and connected to the first binding portion;

[0009] Wherein, the rigidity of the support member is less than or equal to the rigidity of the flexible body.

[0010] Optionally, the support member includes a first part, a second part and a third part which are arranged along the width direction of the display panel and are connected to each other;

[0011] Wherein, the stiffness of the second part is greater than the stiffness of the first part, or / and, the stiffness of the second part is greater than the stiffness of the third part.

[0012] Optionally, the flexible circuit board further comprises a functional element arranged on a side of the flexible body away from the support member;

[0013] The first part is arranged close to the functional element, the third part is arranged far away from the functional element, and the rigidity of the first part is smaller than the rigidity of the third part.

[0014] Optionally, the second binding portion and the flexible body corresponding to the support member both include single-layer boards, and the number of single-layer boards in the flexible body corresponding to the support member is greater than the number of single-layer boards in the second binding portion.

[0015] Optionally, a plurality of grooves are formed on a side of the support member facing the flexible body, and a depth of the grooves is less than or equal to a thickness of the support member.

[0016] Optionally, in a top view of the support member, the sum of the areas of the plurality of grooves is less than or equal to one half of the area of ​​the support member.

[0017] Optionally, the depth of the groove is less than or equal to half of the thickness of the support member.

[0018] Optionally, in a top view of the support member, the shape of the groove is at least one of a capsule, a circle, a triangle or a quadrilateral.

[0019] Optionally, the support member has a thickness ranging from 30 μm to 100 μm.

[0020] Optionally, the display module further includes:

[0021] A first back plate, disposed on a first side of the planar portion close to the first binding portion;

[0022] A first supporting layer is arranged on a side of the first back plate away from the planar portion;

[0023] The surface of the support member away from the flexible body is bonded to the first support layer through a first adhesive material, and the surface of the support member close to the flexible body is bonded to the second flexible body through a second adhesive material.

[0024] Optionally, the first adhesive material is a pressure-sensitive adhesive, and the second adhesive material is a thermosetting adhesive.

[0025] Optionally, the material of the support member and the material of the first support layer are both steel sheets, and the rigidity of the support member is smaller than the rigidity of the first support layer.

[0026] The present application also proposes a display device, which includes the above-mentioned display panel.

[0027] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0029] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0030] Figure 1 A cross-sectional view of a display module provided in an embodiment of the present application;

[0031] Figure 2 A cross-sectional view of a display panel provided in an embodiment of the present application;

[0032] Figure 3 A structural diagram of a flexible body in a flexible circuit board provided in an embodiment of the present application;

[0033] Figure 4 A front view of a flexible circuit board provided in an embodiment of the present application;

[0034] Figure 5 A first top view of the support member provided in an embodiment of the present application;

[0035] Figure 6 A second top view of the support member provided in an embodiment of the present application;

[0036] Figure 7 A third top view of the support member provided in the embodiment of the present application;

[0037] Figure 8 A first front view structural diagram of a support member provided in an embodiment of the present application;

[0038] Fig. 9 A second front view structural diagram of a support member provided in an embodiment of the present application;

[0039] Fig.10 A fourth top view of the support member provided in the embodiment of the present application;

[0040] Fig.11 A third front view structural diagram of the support member provided in the embodiment of the present application;

[0041] Fig.12 A fifth top view of the support member provided in the embodiment of the present application;

[0042] Fig.13 This is a fourth front view structural diagram of the support member provided in an embodiment of the present application. DETAILED DESCRIPTION

[0043] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0044] See also Figures 1 to 9 The present application proposes a display module 100 , which includes a display panel 200 and a flexible circuit board 300 bound and connected to the display panel 200 .

[0045] In this embodiment, the display panel 200 includes a planar portion 10a and a first binding portion 10b located on one side of the planar portion 10a, the flexible circuit board 300 includes a flexible body 310 and a support member 320 arranged on one side of the flexible body 310, and the flexible body 310 is provided with a second binding portion 310a bound and connected to the first binding portion 10b.

[0046] In this embodiment, the rigidity of the support member 320 is less than or equal to the rigidity of the flexible body 310 .

[0047] Since the thickness and modulus of each laminated layer in the existing display module 100 are designed to be small, the impact resistance of the flexible circuit board 300 is reduced, and when the rigidity of the flexible circuit board 300 increases, the edge of the flexible circuit board 300 is prone to warping. The present application reduces the rigidity of the support member 320 in the flexible circuit board 300 so that the rigidity of the support member 320 is less than or equal to the rigidity of the flexible body 310, thereby reducing the yield strength of the support member 320 and avoiding the technical problem of separation from the display panel 200 due to the warping of the edge of the support member 320.

[0048] It should be noted that the display panel 200 of the present application may be a flexible display panel 200 , such as a static bending display panel 200 and a dynamic bending display panel 200 .

[0049] It should be noted that the display panel 200 of the present application can be an organic light-emitting display panel 200, Mini LED, Micro LED or other small-sized light-emitting devices. The following embodiments are described using the organic light-emitting display panel 200 as an example.

[0050] The technical solution of the present application is now described in conjunction with specific embodiments.

[0051] See also Figure 1The display panel 200 may include a display layer 10, and the display layer 10 may include a base substrate 110, an array driving layer 150 disposed on the base substrate 110, a pixel definition layer 160 disposed on the array driving layer 150, a light emitting device layer 170 disposed on the same layer as the pixel definition layer 160, an encapsulation layer 180 disposed on the pixel definition layer 160, a polarizer layer 20 disposed on the encapsulation layer 180, an optical adhesive layer 30, an ultra-thin glass layer 40, a first protective layer 50 and a second protective layer 60.

[0052] In this embodiment, the display panel 200 may further include a touch layer 190 . The touch layer 190 may be disposed on the encapsulation layer 180 or between the encapsulation layer 180 and the base substrate 110 , which is not specifically limited in this application.

[0053] In this embodiment, the base substrate 110 is used to support various film layers disposed on the base substrate 110, and the base substrate 110 may be a flexible substrate that can be bent, folded, rolled, etc. Examples of flexible materials for the flexible substrate include polyimide (PI), but are not limited to polyimide (PI).

[0054] In this embodiment, the array driving layer 150 may include a plurality of thin film transistors, which may be of an etch barrier type, a back channel etch type, or may be divided into a bottom gate thin film transistor, a top gate thin film transistor, etc. according to the position of the gate electrode and the active layer, or may be divided into an N-type thin film transistor, a P-type thin film transistor according to the performance of the thin film transistor.

[0055] For example, Figure 2 The thin film transistor shown in the figure is a top-gate thin film transistor, which may include a shading unit 151 disposed on a substrate, a buffer layer 152 disposed on the shading unit 151, an active layer 153 disposed on the buffer layer 152, a gate insulating layer 154 disposed on the active layer 153, a gate layer 155 disposed on the gate insulating layer 154, an inter-insulating layer 156 disposed on the gate layer 155, a source-drain electrode layer 157 disposed on the inter-insulating layer 156, and a planar layer 158 disposed on the source-drain electrode layer 157; in this embodiment, the inter-insulating layer 156 may be laid as a whole layer, or may be formed in the same photomask process with the gate layer 155 as shown in the structure shown in the figure. Figure 2 The structure of the thin film transistor is only an example of the present application, and other types of thin film transistors are also applicable to the present application.

[0056] See also Figure 2The light emitting device layer 170 may further include an anode layer 171 disposed on the planar layer 158, a light emitting layer 172 disposed on the anode layer 171, and a cathode layer 173 disposed on the light emitting layer 172. The anode layer 171 includes a plurality of anodes, the pixel definition layer 160 includes a plurality of pixel openings corresponding to the plurality of anodes, and each pixel opening corresponds to exposing the upper surface of an anode, and the light emitting layer 172 may include a plurality of light emitting pixels corresponding to the plurality of anodes.

[0057] See also Figure 2 The encapsulation layer 180 covers the pixel definition layer 160 and continuously covers multiple pixel openings and multiple light-emitting pixels; wherein the encapsulation layer 180 may include at least a first inorganic encapsulation layer 181, a first organic encapsulation layer 182 and a second inorganic encapsulation layer 183 stacked on the pixel definition layer 160.

[0058] See also Figure 2 The touch layer 190 may include a first touch metal layer and a second touch metal layer disposed on the encapsulation layer 180, and an insulating layer disposed between the first touch metal layer and the second touch metal layer. The touch layer 190 provided in the embodiment of the present application may be a mutual capacitance type or a self capacitance type, and the type and structure of the specific touch layer 190 may be selected according to actual needs.

[0059] See also Figure 1 The display module 100 further includes a first backplane 121 and a second backplane 122 which are disposed on a side of the display panel 200 away from the light emitting surface and are separately disposed. The first backplane 121 and the second backplane 122 are disposed on the non-light emitting side of the display module 100 to support the display panel 200. The materials of the first backplane 121 and the second backplane 122 may include polyethylene terephthalate or the like.

[0060] See also Figure 1 The display module 100 further includes a supporting functional layer disposed on a side of the backplane away from the display layer 10, the supporting functional layer is used to cooperate with the backplane to support the display panel 200, and plays a role in heat dissipation of the display panel 200. The supporting functional layer may include a plurality of stacked sub-layers, such as a first supporting layer 131, a second supporting layer 132, and a buffer 140 located between the first supporting layer 131 and the first backplane 121, the first supporting layer 131 and the first backplane 121 are bonded by an adhesive layer, the second supporting layer 132 and the second backplane 122 are bonded by an adhesive layer, the material of the first supporting layer 131 may be stainless steel, the material of the second supporting layer 132 may be steel sheet or polyethylene terephthalate (PET), etc., and the material of the buffer 140 may include foam or polyimide (PI) having relatively large elastic deformation performance.

[0061] It should be noted that the ends of the second back plate 122 and the second supporting layer 132 close to the flexible circuit board 300 may be flush with the edge of the first binding portion 10 b , or retracted from the edge of the first binding portion 10 b .

[0062] It should be noted that both the first protective layer 50 and the second protective layer 60 are protective films with built-in optical adhesive, and the second protective layer 60 is a replaceable protective film.

[0063] It should be noted that the display panel 200 further includes a third protective layer 70 covering the bending portion 10c, a portion of the planar portion 10a and a portion of the first binding portion 10b. The third protective layer 70 may be ultraviolet optical adhesive.

[0064] See also Figure 1 The display layer 10 includes a planar portion 10a, a first binding portion 10b located on one side of the planar portion 10a, and a bending portion 10c connecting the planar portion 10a and the first binding portion 10b, the first binding portion 10b is bent to the side of the display panel 200 away from the light emitting direction, and the side of the first binding portion 10b close to the planar portion 10a is bonded to the second back panel 122.

[0065] See also Figure 1 The flexible circuit board 300 may include a flexible body 310 and a support member 320 disposed on one side of the flexible body 310. The support member 320 may be disposed between the flexible body 310 and the first support layer 131. The surface of the support member 320 close to the flexible body 310 may be bonded to the flexible body 310 by a viscous adhesive such as a second adhesive material 342. The surface of the support member 320 away from the flexible body 310 may be bonded to the first support layer 131 by a viscous adhesive such as a first adhesive material 341.

[0066] In this embodiment, the first adhesive material 341 may be a pressure-sensitive adhesive, and the second adhesive material 342 may be a thermosetting adhesive.

[0067] In this embodiment, the flexible body 310 may include multiple single-layer plates 400, for example Figure 3 The flexible body 310 in the embodiment may be a three-layer single-layer plate 400, for example Figure 1 In the structure, a single-layer board 400 of the present application can extend to the first binding portion 10b and be bound and connected to the first binding portion 10b, and the extended section of the single-layer board 400 serves as the second binding portion 310a of the flexible circuit board 300.

[0068] exist Figure 3In the structure, each single-layer board 400 may include an insulating substrate 410, a first conductive layer 420, a first insulating layer 440, a second conductive layer 430 and a second insulating layer 450. The first conductive layer 420 is arranged on a surface of the insulating substrate 410 close to the display panel 200, the first insulating layer 440 is arranged on a surface of the first conductive layer 420 close to the display panel 200, the second conductive layer 430 is arranged on a surface of the insulating substrate 410 away from the display panel 200, and the second insulating layer 450 is arranged on a surface of the second conductive layer 430 close to the display panel 200.

[0069] In this embodiment, the material of the insulating substrate 410 can be a flexible insulating material such as polyimide, the first conductive layer 420 and the second conductive layer 430 can be made of a metal material with good conductivity such as copper, and the material of the first insulating layer 440 and the second insulating layer 450 can be a flexible insulating material such as polyimide.

[0070] exist Figure 3 In the structure, the first conductive layer 420 can be formed by stacking two copper layers, and an insulating adhesive 460 is provided between the first insulating layer 440 and the first conductive layer 420 and between the second insulating layer 450 and the second conductive layer 430, and the insulating layer and the conductive layer are bonded by the insulating adhesive 460; at the same time, an electromagnetic shielding layer 470 is also provided on the surface of the outermost first insulating layer 440 and the second insulating layer 450 to shield the interference of external electrical signals to the inside of the flexible circuit board 300.

[0071] exist Figure 3 In the structure, two adjacent single-layer boards 400 can share an insulating layer, for example, the second insulating layer 450 of the middle single-layer board 400 and the first insulating layer 440 of the upper single-layer board 400 are shared, and the first insulating layer 440 of the middle single-layer board 400 and the second insulating layer 450 of the lower single-layer board 400 are shared.

[0072] See also Figure 1 A functional element 330 is further provided on a side of the flexible body 310 away from the support member 320 . The functional element 330 may be a device such as a resistor or a capacitor.

[0073] Due to the provision of the support member 320 , the rigidity of the flexible circuit board 300 is increased, and the impact resistance of the flexible circuit board 300 is improved. However, due to the high yield strength of the support member 320 , the edge of the support member 320 is prone to warping, resulting in the separation of the support member 320 from the first support layer 131 .

[0074] See also Figure 4The support member 320 includes a first part 321, a second part 322 and a third part 323 which are arranged and connected along the width direction of the display panel 200, and the stiffness of the second part 322 is greater than the stiffness of the first part 321, or / and the stiffness of the second part 322 is greater than the stiffness of the third part 323.

[0075] In this embodiment, the area where the support member 320 is separated from the first support layer 131 is mainly concentrated at the two ends of the support member 320 along the width direction of the display panel 200. For example, when the first portion 321 is warped, the present application can only reduce the stiffness of the first portion 321, and the second portion 322 and the third portion 323 do not need to be processed; when the third portion 323 is warped, the present application can only reduce the stiffness of the third portion 323, and the first portion 321 and the second portion 322 do not need to be processed; when the first portion 321 and the third portion 323 are warped at the same time, the present application can simultaneously reduce the stiffness of the first portion 321 and the third portion 323 to reduce the yield strength of the first portion 321 and the third portion 323, avoid the warping of the first portion 321 and the third portion 323, and avoid the technical problem of the separation of the flexible circuit board 300 from the first support layer 131 while ensuring the impact resistance of the flexible circuit board 300.

[0076] See also Figure 4 The first part 321 is arranged close to the functional element 330 , the third part 323 is arranged far away from the functional element 330 , and the stiffness of the first part 321 is smaller than the stiffness of the third part 323 .

[0077] In this embodiment, since it is necessary to apply a certain pressure on the flexible circuit board 300 to make the flexible circuit board 300 adhere to the first supporting layer 131, the first part 321 is arranged close to the functional element 330, or the first part 321 partially overlaps with the functional element 330, and pressure cannot be applied to the area where the functional element 330 is located. Therefore, the pressure applied to the first part 321 is less than the pressure applied to the third part 323. Therefore, compared with the third part 323, the area where the first part 321 is located is more prone to warping; the present application further reduces the stiffness of the first part 321 so that the stiffness of the first part 321 is less than the stiffness of the third part 323, so as to reduce the yield strength of the first part 321 and avoid warping of the first part 321. On the premise of ensuring the impact resistance of the flexible circuit board 300, the separation of the flexible circuit board 300 and the first supporting layer 131 is avoided.

[0078] In order to improve the rigidity of the support member 320 , the present application may perform patterning on the support member 320 .

[0079] In this embodiment, the support member 320 may be provided with a plurality of grooves 320a on one side facing the flexible body 310; Figures 5 to 7 In the embodiment, the first portion 321, the second portion 322 and the third portion 323 of the support member 320 are all provided with the grooves 320a, and the grooves 320a are evenly distributed.

[0080] In this embodiment, in the top view of the support member 320, the shape of the groove 320a is at least one of a capsule shape, a circle, a triangle or a quadrilateral. Figure 5 The shape of the groove 320a in the embodiment can be a capsule shape. Figure 6 The shape of the groove 320a in the embodiment can be circular. Figure 7 The shape of the groove 320a can be triangular.

[0081] In this embodiment, the depth of the groove 320a can be less than or equal to the thickness of the support member 320, that is, according to the rigidity requirement of the support member 320, the groove 320a of the present application can be fully etched or half etched. When the depth of the groove 320a is equal to the thickness of the support member 320, the groove 320a is formed by a full etching process, and when the depth of the groove 320a is less than the thickness of the support member 320, the groove 320a is formed by a half etching process.

[0082] For example, since the rigidity of the second part 322 is greater than the rigidity of the third part 323 and the rigidity of the first part 321, the groove 320a may be provided only in the first part 321 and the third part 323 to reduce the rigidity of the first part 321 and the third part 323; when the rigidity of the first part 321 is less than the rigidity of the third part 323, the rigidity of the second part 322 is the largest and the rigidity of the first part 321 is the smallest. In the present application, the groove 320a in the third part 323 may be half-etched and the groove 320a in the first part 322 may be fully etched to further reduce the rigidity of the first part 321. For details, please refer to Figure 8 .

[0083] In this embodiment, the grooves 320a are provided in the first portion 321, the second portion 322 and the third portion 323, and the grooves 320a are evenly distributed. The depth of the groove 320a of the second portion 322 may be less than the depth of the groove 320a of the third portion 323, and the depth of the groove 320a of the first portion 321 may be greater than the depth of the groove 320a of the third portion 323. For details, please refer to Fig. 9 .

[0084] In this embodiment, the grooves 320a are provided in the first part 321, the second part 322 and the third part 323, and the depth of the grooves 320a is equal to the thickness of the support member 320, that is, the number of the grooves 320a provided in the second part 322 under the same area is the least, the number of the grooves 320a provided in the first part 321 under the same area is the largest, and the number of the grooves 320a provided in the third part 323 under the same area is in the middle; or, when the number of the grooves 320a per unit area is the same, the area of ​​the grooves 320a in the second part 322 is the smallest, the area of ​​the grooves 320a in the third part 323 is in the middle, and the area of ​​the grooves 320a in the first part 321 is the largest.

[0085] In this example, see Fig.10 Since the first part 321 is prone to warping, the present application may only set the groove 320a in the first part 321, and the second part 322 and the third part 323 do not need to be etched.

[0086] In this embodiment, under the premise that the impact resistance of the flexible circuit board 300 meets the requirements, the present application can also reduce the stiffness of the second part 322, so that the stiffness of the flexible body 310 gradually decreases in the direction from the third part 323 to the first part 321. For example, see Fig.11 In the direction from the third portion 323 to the first portion 321, the depth of the groove 320a may gradually increase; for example, see Fig.12 In the direction from the third portion 323 to the first portion 321 , the area of ​​the groove 320 a may gradually increase.

[0087] When the depth of the groove 320a is equal to the thickness of the support member 320, that is, the groove 320a is prepared using a full etching process, the surface area of ​​the support member 320 close to the first support layer 131 will be reduced, and the bonding area between the support member 320 and the pressure-sensitive adhesive will be reduced, thereby reducing the adhesion between the support member 320 and the first support layer 131.

[0088] In this embodiment, when the depth of the groove 320 a is equal to the thickness of the support member 320 , in a top view of the support member 320 , the sum of the areas of the plurality of grooves 320 a is less than or equal to half of the area of ​​the support member 320 .

[0089] In this embodiment, when the rigidity of the support member 320 is reduced, the present application can make the sum of the areas of the plurality of grooves 320a less than or equal to one half of the area of ​​the support member 320, thereby reducing the yield strength of the support member 320, ensuring the adhesion between the support member 320 and the first support layer 131, and avoiding the technical problem of separation of the support member 320 from the display panel 200 due to edge warping of the support member 320.

[0090] When the groove 320a is formed by a half-etching process, if the depth of the groove 320a is too large, etching marks will appear on the surface of the support member 320 close to the first support layer 131, resulting in reduced adhesion between the support member 320 and the first support layer 131.

[0091] In this example, see Fig.13 , the present application can make the depth H1 of the groove 320a less than or equal to half of the thickness H2 of the support member 320. The provision of the groove 320a reduces the rigidity of the support member 320, and avoids the appearance of etching marks on the surface of the support member 320 close to the first support layer 131, thereby ensuring the adhesion between the support member 320 and the first support layer 131, and avoiding the technical problem of separation of the support member 320 from the display panel 200 due to the warping of the edge of the support member 320.

[0092] In this embodiment, the thickness of the support member 320 ranges from 30 μm to 100 μm. For example, the thickness of the support member 320 may be 50 μm.

[0093] In this embodiment, the support member 320 may be made of metal material. For example, the support member 320 and the first support layer 131 may both be made of steel sheets, and the stiffness of the support member 320 is less than that of the first support layer 131 .

[0094] It should be noted that the present application also proposes a display device, which includes the above-mentioned display panel, and the display device of the present application can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, etc.

[0095] The present application provides a display module and a display device; the display module includes a display panel and a flexible circuit board, the display panel includes a plane portion and a first binding portion located on one side of the plane portion, the flexible circuit board includes a flexible body and a support member arranged on one side of the flexible body, the flexible body is provided with a second binding portion bound to the first binding portion, and the stiffness of the support member is less than or equal to the stiffness of the flexible body; the present application reduces the stiffness of the support member in the flexible circuit board so that the stiffness of the support member is less than or equal to the stiffness of the flexible body, thereby reducing the yield strength of the support member and avoiding the technical problem of separation of the support member from the display panel due to warping of the edge of the support member.

[0096] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0097] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0098] In the above embodiments, the structures shown in the drawings are only schematic diagrams, and the specific structure of the display panel of the present application is mainly based on the description.

[0099] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0100] The above are only preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A display module, characterized in that: include: The display panel comprises a plane portion and a first binding portion located on one side of the plane portion; A flexible circuit board comprises a flexible main body and a support member arranged on one side of the flexible main body, wherein the flexible main body is provided with a second binding portion which is bound and connected to the first binding portion; Wherein, the rigidity of the support member is less than or equal to the rigidity of the flexible body.

2. The display module according to claim 1, characterized in that: The support member includes a first portion, a second portion and a third portion which are arranged along the width direction of the display panel and are connected to each other; Wherein, the stiffness of the second part is greater than the stiffness of the first part, or / and, the stiffness of the second part is greater than the stiffness of the third part.

3. The display module according to claim 2, characterized in that: The flexible circuit board further comprises a functional element arranged on a side of the flexible body away from the support member; The first part is arranged close to the functional element, the third part is arranged far away from the functional element, and the rigidity of the first part is smaller than the rigidity of the third part.

4. The display module according to claim 1, characterized in that: The second binding portion and the flexible body corresponding to the support member both include single-layer boards, and the number of single-layer boards in the flexible body corresponding to the support member is greater than the number of single-layer boards in the second binding portion.

5. The display module according to any one of claims 1 to 4, characterized in that: A plurality of grooves are formed on one side of the support member facing the flexible body, and the depth of the grooves is less than or equal to the thickness of the support member.

6. The display module according to claim 5, characterized in that: In a top view of the support member, the sum of the areas of the plurality of grooves is less than or equal to one half of the area of ​​the support member, and the depth of the grooves is less than or equal to one half of the thickness of the support member.

7. The display module according to any one of claims 1 to 4, characterized in that: The display module also includes: A first back plate, disposed on a first side of the planar portion close to the first binding portion; A first supporting layer is arranged on a side of the first back plate away from the planar portion; The surface of the support member away from the flexible body is bonded to the first support layer through a first adhesive material, and the surface of the support member close to the flexible body is bonded to the second flexible body through a second adhesive material.

8. The display module according to claim 7, characterized in that: The first adhesive material is a pressure-sensitive adhesive, and the second adhesive material is a thermosetting adhesive.

9. The display module according to claim 7, characterized in that: The material of the support member and the material of the first support layer are both steel sheets, and the rigidity of the support member is smaller than the rigidity of the first support layer.

10. A display device, characterized in that: The display device comprises the display module according to any one of claims 1 to 9.

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