Electronic device

Abstract

The invention discloses an electronic device which comprises a first substrate, a second substrate, a first circuit and a second circuit. The first substrate has a top surface, a bottom surface and a side surface between the top surface and the bottom surface. The second substrate is opposite to the first substrate. The first circuit is arranged on the top surface of the first substrate, and the top surface faces the second substrate. The second circuit is disposed on the first substrate and extends from the side surface to the bottom surface, and the second circuit extends to the second substrate. The first line is coupled with the second line.

Description

[0001] This application is a divisional application of the invention patent application with an application date of October 12, 2021, application number 202111188770.X, and invention name “electronic device”. Technical Field

[0002] The invention relates to an electronic device, in particular to a spliced ​​electronic device with an embedded test circuit. Background Art

[0003] With the popularity of visual information transmission devices, many manufacturers have actively developed and researched electronic display devices. And with the improvement of living standards, large-size, high-quality display panels are popular. Since the size of a single display panel is limited, in order to obtain a larger display panel, today's large-size display devices are mostly spliced ​​together with multiple display panels.

[0004] However, the spliced ​​display panel has no border area and outer lead bonders (OLB). There is no pad for flexible printed circuit (FPC), chip on film (COF) or integrated circuit (IC) on the front of the glass. Therefore, a solution is needed to save the active area of ​​the display panel and set a test circuit on the substrate to monitor the resistance of the display panel. Summary of the invention

[0005] The embodiment discloses an electronic device, comprising a first substrate, a second substrate, a first circuit and a second circuit. The first substrate has a top surface, a bottom surface and a side surface between the top surface and the bottom surface. The second substrate is opposite to the first substrate. The first circuit is arranged on the top surface of the first substrate, and the top surface faces the second substrate. The second circuit is arranged on the first substrate, extending from the side surface to the bottom surface, and the second circuit extends to the second substrate. The first circuit is coupled to the second circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1A and Figure 1B is a schematic diagram of a display panel in an embodiment.

[0007] Figure 2A and Figure 2B is a schematic diagram of a display panel in another embodiment.

[0008] Figure 3A and Figure 3B is a schematic diagram of a display panel in another embodiment.

[0009] Figure 4A , Figure 4B and Figure 4C is a schematic diagram of a display panel in another embodiment.

[0010] Figure 5 It is a schematic diagram of the measurement principle of the line resistance in the display panel of the embodiment.

[0011] Figure 6 It is a schematic diagram of the measurement principle of the line resistance of the display panel in another embodiment.

[0012] Description of reference numerals: 100, 200, 300, 400 - display panel; 102, 202, 302, 402 - top surface; 104, 204, 304, 404 - bottom surface; 106, 206, 306, 406 - side surface; 110, 170, 210, 270 310,370,410,470-substrate; 120,220,320,420-test circuit; 122,222,322,422,522,622,124,224,324,424,524,624,660,665-line; 131,132,133,134,231,232,233,331,332,333,334,431,432,433,434,531,532,631,632-pad; 126,127,128,226,326,327,328,3 29,426,427,428-bridge; 141,142,241,242,341,342,441,442,443,444,541,542,641,642-current terminal; 151,152,251,252,351,352,451,452,551,552,651,652-voltage terminal; 150,250,350,450,550,650-voltmeter; 140,240,340,440,540,640-ammeter; 460-printed circuit board; 465-flexible printed circuit. DETAILED DESCRIPTION

[0013] The structure, number of components, number of layers, position distribution, proportion, etc. of the icons are only examples to help explain and understand the embodiments, and are not used to limit the form and scope of the embodiments. If the first, second, etc. are mentioned in this article, they are only used to separate different components, and do not limit the order or importance of the process.

[0014] Certain words are used throughout the specification and claims of the present invention to refer to specific components. It should be understood by those skilled in the art that electronic equipment manufacturers may refer to the same components by different names. It is not intended to distinguish between components that have the same function but different names. In the following specification and claims, the words "having" and "including" are open-ended words and should therefore be interpreted as "including but not limited to...".

[0015] It should be understood that when an element or film layer is defined as being disposed "on" or "connected to" another element or film layer, it may be directly on or directly connected to the other element or layer, or there may be other intervening elements or film layers (indirect contact) between the two. Conversely, when an element is defined as being "directly" "on" or "directly connected to" another element or film layer, there may be no intervening elements or film layers between the two.

[0016] The terms "about," "equal," "equal," or "substantially the same" typically mean within 20% of a given value or range, or within 10%, 5%, 3%, 2%, 1% or 0.5% of a given value or range.

[0017] In addition, the term "in the range from a first value to a second value" means that the range includes the first value, the second value, and other values ​​therebetween. Although terms such as first, second, third, etc. can be used to describe different constituent elements, these constituent elements are not limited by these terms. These terms are only used to distinguish constituent elements from other constituent elements in the specification. Claims may not use the same terms, but may use terms such as first, second, third, etc. to indicate the order in which elements are defined. Therefore, in the following description, the first constituent element may be the second constituent element in the claim.

[0018] It should be noted that the following embodiments may replace, reorganize, or mix the technical features in several different embodiments to complete other embodiments without departing from the spirit of the present invention or causing any conflicts.

[0019] The electronic device may include a display device, a backlight device, an antenna device, a sensing device or a splicing device, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The display device may be a non-self-luminous display device or a self-luminous display device. The antenna device may be a liquid crystal antenna device or a non-liquid crystal antenna device, and the sensing device may be a sensing device for sensing capacitance, light, heat or ultrasound, but is not limited thereto. The electronic components included in the electronic device may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode may include a light emitting diode or a photodiode. The light emitting diode may include, for example, an organic light emitting diode (OLED), a sub-millimeter light emitting diode (mini LED), a micro light emitting diode (micro LED) or a quantum dot light emitting diode (quantum dot LED), but is not limited thereto. The splicing device may be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device may be any combination of the foregoing, but is not limited thereto. The following description will take a display panel as an electronic device to illustrate the present invention, but the present invention is not limited thereto.

[0020] Figure 1A and Figure 1B is a schematic diagram of a display panel 100 in an embodiment. Figure 1A is a top view of the back plate of the display panel 100 . Figure 1B 1 is a side view of the display panel 100. The display panel 100 includes a substrate 110 (or a backplane), and the substrate 110 includes a top surface 102, a bottom surface 104, and a side surface 106 between the top surface 102 and the bottom surface 104. A test circuit 120 is disposed on the substrate 110. The test circuit 120 includes a first circuit 122 located on the top surface 102 and a second circuit 124 located on the side surface 106. The first circuit 122 and the second circuit 124 are coupled at the boundary between the top surface 102 and the side surface 106.

[0021] The first line 122 may be formed of a metal, such as but not limited to copper (Cu), molybdenum (Mo), titanium (Ti), and aluminum (Al). The second line 124 may be formed of a metal, such as but not limited to silver (Ag) and copper (Cu). The first line 122 and the second line 124 are combined together to form four pads: a first pad 131, a second pad 132, a third pad 133, and a fourth pad 134. On the top surface 102, the second pad 132 is coupled to the third pad 133, and the third pad 133 is coupled to the fourth pad 134 through the first bridge 126, the second pad 132, and the second bridge 127. On the side surface, the first pad 131 is coupled to the second pad 132 through the third bridge 128. The second line 124 may extend to another substrate 170 opposite to the substrate 110. The substrate 170 may be a transparent cover or an optical substrate, which includes a color filter, a wavelength conversion layer, or a combination thereof. In more detail, the wavelength conversion layer includes quantum dots, fluorescent or phosphorescent materials. In another embodiment of the present invention, the substrate 170 may be omitted.

[0022] The contact resistance R of the first line 122 and the second line 124 is measured by the current terminals 141 and 142 and the voltage terminals 151 and 152. The current terminal and the voltage terminal may be formed on a printed circuit board assembly (PCBA) and coupled to an element on the bottom surface 104 of the substrate 110. In another embodiment of the present invention, the current terminals 141 and 142 and the voltage terminals 151 and 152 may be formed on the bottom surface 104 of the substrate 110. The voltmeter 150 is used to measure voltage, and the ammeter 140 is used to measure current. The contact resistance R may be obtained by the following formula:

[0023]

[0024] V1-V2 is the voltage difference between the voltage terminals 151 and 152, which can be measured by the voltmeter 150. I is the current flowing from the current terminal 141 to the current terminal 142, which can be measured by the ammeter 140.

[0025] Figure 2A and Figure 2B is a schematic diagram of a display panel 200 in another embodiment. Figure 2A is a top view of the back plate of the display panel 200, Figure 2B2 is a side view of the display panel 200. The display panel 200 includes a substrate 210 (or a backplane), and the substrate 210 (or a backplane) has a top surface 202, a bottom surface 204, and a side surface 206 located between the top surface 202 and the bottom surface 204. A test circuit 220 is disposed on the substrate 210. The test circuit 220 includes a first circuit 222 located on the top surface 202 and a second circuit 224 located on the side surface 206. The first circuit 222 and the second circuit 224 are electrically coupled at the boundary between the top surface 202 and the side surface 206.

[0026] The first line 222 may be formed of a metal, such as but not limited to copper (Cu), molybdenum (Mo), titanium (Ti) and aluminum (Al). The second line 224 may be formed of a metal, such as but not limited to silver (Ag) and copper (Cu). The first line 222 and the second line 224 are combined together to form three pads: a first pad 231, a second pad 232 and a third pad 233. On the top surface 202, the first pad 231 is coupled to the second pad 232 through a first bridge 226, and the second pad 232 is coupled to the third pad 233 through a second bridge 227. The second line 224 may extend to another substrate 270 opposite to the substrate 210. The substrate 270 may be a transparent cover or an optical substrate, which includes a color filter, a wavelength conversion layer or a combination thereof. In more detail, the wavelength conversion layer includes quantum dots, fluorescent or phosphorescent materials. The substrate 270 may be omitted in another embodiment of the present invention.

[0027] The contact resistance R of the first line 222 and the second line 224 is measured by the current terminals 241 and 242 and the voltage terminals 251 and 252. The current terminal and the voltage terminal may be formed on a printed circuit board, and the printed circuit board is coupled to the bottom surface 204 of the substrate 210. In another embodiment of the present invention, the current terminals 241 and 242 and the voltage terminals 251 and 252 may be formed on the bottom surface 204 of the substrate 210. The voltmeter 250 is used to measure the voltage, and the ammeter 240 is used to measure the current. The contact resistance of the line structure can be obtained in the same manner as described above.

[0028] Figure 3A and Figure 3B is a schematic diagram of a display panel 300 according to another embodiment. Figure 3A is a top view of the back plate of the display panel 300, Figure 3B 300 is a side view of the display panel 300. The display panel 300 includes a substrate 310 (or a backplane), and the substrate 310 (or a backplane) has a top surface 302, a bottom surface 304, and a side surface 306 located between the top surface 302 and the bottom surface 304. A test circuit 320 is disposed on the substrate 310. The test circuit 320 includes a first circuit 322 located on the top surface 302 and a second circuit 324 located on the side surface 306. The first circuit 322 and the second circuit 324 are electrically coupled at a boundary between the top surface 302 and the side surface 306.

[0029] The first line 322 may be formed of a metal, such as but not limited to copper (Cu), molybdenum (Mo), titanium (Ti) and aluminum (Al). The second line 324 may be formed of a metal, such as but not limited to silver (Ag) and copper (Cu). The first line 322 and the second line 324 are coupled together to form four pads: a first pad 331, a second pad 332, a third pad 333 and a fourth pad 334. On the top surface 302, the first pad 331 is coupled to the second pad 332 through the first bridge 326, the second pad 332 is coupled to the third pad 333 through the second bridge 327, and the third pad 333 is coupled to the fourth pad 334 through the third bridge 328. On the side surface 306, the first pad 331 is coupled to the second pad 332 through the fourth bridge 329, and the third pad 333 is coupled to the fourth pad 334 through the fifth bridge 330. The second line 324 may extend to another substrate 370, and the substrate 310 is opposite to the other substrate 370. The substrate 370 may be a transparent cover or an optical substrate, which includes a color filter, a wavelength conversion layer or a combination thereof. In more detail, the wavelength conversion layer includes quantum dots, fluorescent or phosphor materials. In another embodiment of the present invention, the substrate 370 may be omitted.

[0030] The contact resistance of the first line 322 and the second line 324 can be measured by the current terminals 341 and 342 and the voltage terminals 351 and 352. The current terminal and the voltage terminal can be formed on a printed circuit board, and the printed circuit board can be combined with the bottom surface 304 of the substrate 310. In another embodiment of the present invention, the current terminals 341 and 342 and the voltage terminals 351 and 352 can be formed on the bottom surface 304 of the substrate 310. The voltmeter 350 is used to measure the voltage, and the ammeter 340 is used to measure the current. The contact resistance of the line structure can be obtained in the same manner as described above.

[0031] Figure 4A , Figure 4B and Figure 4C is a schematic diagram of a display panel 400 according to another embodiment. Figure 4A is a top view of the back plate of the display panel 400, Figure 4B 4 is a side view of the display panel 400. The display panel 400 includes a substrate 410 (or a backplane), and the substrate 410 (or a backplane) has a top surface 402, a bottom surface 404, and a side surface 406 located between the top surface 402 and the bottom surface 404. A test circuit 420 is disposed on the substrate 410. The test circuit 420 includes a first circuit 422 located on the top surface 402 and a second circuit 424 located on the side surface 406. The first circuit 422 and the second circuit 424 are electrically coupled at the boundary between the top surface 402 and the side surface 406.

[0032] The first line 422 may be formed of a metal, such as but not limited to copper (Cu), molybdenum (Mo), titanium (Ti) and aluminum (Al). The second line 424 may be formed of a metal, such as but not limited to silver (Ag) and copper (Cu). The first line 422 and the second line 424 are coupled together to form four pads: a first pad 431, a second pad 432, a third pad 433 and a fourth pad 434. On the top surface 402, the second pad 432 is coupled to the third pad 433 through the first bridge 426, and the third pad 433 is coupled to the fourth pad 434 through the second bridge 427. On the side 406, the first pad 431 is coupled to the second pad 432 through the third bridge 428, and the second line 424 may extend to another substrate 470 opposite to the substrate 410. The substrate 470 may be a transparent cover or an optical substrate, which includes a color filter, a wavelength conversion layer or a combination thereof. In more detail, the wavelength conversion layer includes quantum dots, fluorescent or phosphor materials. In another embodiment of the present invention, the substrate 470 may be omitted.

[0033] The contact resistance of the first line 422 and the second line 424 is measured by current terminals 441 and 442 and voltage terminals 451 and 452. The current terminal and the voltage terminal may be formed on a printed circuit board, and the printed circuit board is coupled to the bottom surface 404 of the substrate 410. In another embodiment of the present invention, the current terminals 441 and 442 and the voltage terminals 451 and 452 may be formed on the bottom surface 404 of the substrate 410. The voltmeter 450 is used to measure the voltage, and the ammeter 440 is used to measure the current. The contact resistance of the line structure can be obtained in the same manner as described above.

[0034] Figure 4C 4 is a bottom view of the back plate of the display panel 400. The printed circuit board 460 is bonded to the substrate 410 through the flexible printed circuit 465. The current terminals 441, 442, 443 and 444 and the voltage terminals 451 and 452 are formed on the printed circuit board 460. The line resistance of the line structure between the current terminal and the voltage terminal and the pad can be measured through the current terminals 443 and 444 and the voltage terminals 451 and 452.

[0035] Figure 5Schematic diagram of the measurement principle of the line resistance in the display panel of the embodiment. The first pad 531 is coupled to the second pad 532 through the first line 522 on the top surface. The first line 522 has a resistance R1. The second line 524 extends from the side to the bottom surface. The second line 524 has a resistance R2. The second line 524 is coupled to the first line 522 through the first pad 531 and the second pad 532. The contact point between the first pad 531 and the second line 524 and the contact point between the second pad 532 and the second line 524 are at the boundary of the top surface and the side surface. The voltmeter 550 is used to measure the voltage, and the ammeter 540 is used to measure the current. Assuming that the contact resistance between the first line 522 and the second line 524 is much smaller than the resistance R2 of the second line 524, and the resistance R1 of the first line is also much smaller than the resistance R2 of the second line 524, the resistance R of the line structure can be obtained by the following formula:

[0036]

[0037] R1<<R2

[0038] V1-V2 is the voltage difference between voltage terminals 551 and 552 and is measured by voltmeter 550. I is the current flowing from current terminal 542 to current terminal 541 and is measured by ammeter 540.

[0039] Figure 6 6 is a schematic diagram of the measurement principle of the line resistance of the display panel in another embodiment. The first pad 631 is coupled to the second pad 632 through the first line 622 on the top surface. The first line 622 has a resistance R1. The second line 624 extends from the side to the bottom surface. The second line 624 has a resistance R2. The second line 624 is coupled to the first line 622 through the first pad 631 and the second pad 632. The contact point between the first pad 631 and the second line 624 and the contact point between the second pad 632 and the second line 624 are at the boundary between the top surface and the side surface. The third line 665 is formed on the flexible printed circuit and has a resistance R3. The fourth line 660 is formed on the printed circuit board and has a resistance R4. The voltmeter 650 is used to measure the voltage, and the ammeter 640 is used to measure the current. Assuming that the contact resistance between the first line 622 and the second line 624 is much smaller than the resistance R2, R3 or R4 of the line structure, and the resistance R1 of the first line 622 is also much smaller than the resistance R2, R3 or R4 of the line structure, the resistance R of the line structure can be obtained by the following formula:

[0040]

[0041] R1<<R2,R3,R4

[0042] V1-V2 is the voltage difference between voltage terminals 651 and 652 and is measured by voltmeter 650. I is the current flowing from current terminal 642 to current terminal 641 and is measured by ammeter 640.

[0043] In summary, the display panel of the embodiment provides an innovative design that can save space in the effective area and provide a test circuit disposed on the substrate. The test circuit can be used to monitor the contact resistance between the first and second circuits on the top surface of the display panel and the substrate, as well as the circuit resistance on the side and bottom surfaces.

[0044] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An electronic device, characterized in that: Include: A first substrate having a top surface, a bottom surface, and a side surface between the top surface and the bottom surface; a second substrate, opposite to the first substrate; A first circuit is disposed on the top surface of the first substrate, and the top surface faces the second substrate; and A second circuit is disposed on the first substrate and extends from the side surface to the bottom surface, and the second circuit extends to the second substrate; The first circuit is coupled to the second circuit.

2. The electronic device according to claim 1, characterized in that: The first circuit and the second circuit are coupled at a boundary between the top surface and the side surface.

3. The electronic device according to claim 1, characterized in that: The first line contacts the second line.

4. The electronic device according to claim 1, characterized in that: The invention also includes a flexible printed circuit bonded to the bottom surface of the first substrate, wherein the flexible printed circuit includes a third circuit coupled to the second circuit.

5. The electronic device according to claim 4, characterized in that: The device also includes a printed circuit board joined to the flexible printed circuit, wherein the printed circuit board includes a fourth circuit coupled to the third circuit.

6. The electronic device according to claim 1, characterized in that: The second substrate is an optical substrate, and the optical substrate includes a color filter, a wavelength conversion layer or a combination thereof.

7. The electronic device according to claim 1, characterized in that: The first line includes metal.

8. The electronic device according to claim 7, characterized in that: The metal includes copper, molybdenum, titanium or aluminum.

9. The electronic device according to claim 1, characterized in that: The second line includes metal.

10. The electronic device according to claim 9, characterized in that: The metal includes silver or copper.

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