Transparent screen based on semiconductor metal transparent wire transparent screen comprehensive manufacturing technology

Abstract

The invention discloses a transparent screen based on a semiconductor metal transparent wire transparent screen comprehensive manufacturing technology, the transparent screen comprises a base material, a positive electrode power line, a negative electrode power line, a signal line and a display unit, the base material is provided with more than one display unit installation position, and the positive electrode power line, the negative electrode power line and the signal line are arranged on the base material. The positive power supply end of each display unit installation position is connected with the positive power line, the negative power supply end of each display unit installation position is connected with the negative power line, the signal end of each display unit installation position is connected with the signal end of the adjacent display unit installation position through a signal line, and the display units are installed at the display unit installation positions. The chips can realize a bidirectional control data transmission function through head-to-tail connection, and when one chip is damaged, a transmission path of control data can be changed, data is transmitted from a standby end, and normal transmission is ensured. Moreover, a parallel power supply mode is adopted, and the problem that the overall brightness is not uniform enough can be solved.

Description

Technical Field

[0001] The invention discloses an LED transparent screen, in particular a transparent screen based on a comprehensive manufacturing technology of a semiconductor metal transparent wire transparent screen, belonging to the technical field of large-scale display equipment. Background Art

[0002] LED transparent screen is based on the traditional LED display screen, with improved patch manufacturing technology, lamp bead packaging and control system, and added hollow design structure. The LED power supply provides power, the control system conveys instructions, the driver IC provides display programs, the LED lamp beads display information, and the gaps between the parallel light strips are used to form a transparent effect.

[0003] LED transparent screens are widely used in commercial advertising, cultural entertainment, exhibitions, transportation hubs, and architectural decoration due to their high transparency, special-shaped design, high-definition display, easy maintenance, light weight and convenience, energy saving and high efficiency.

[0004] The transparent screens in the prior art are all connected to the central controller through connecting lines. A row of lamp beads form a light bar. The lamp bead forms include an integrated lamp drive structure and a separate lamp drive structure. At present, all transparent screens are connected in series with the entire light bar. This structure has its inherent defects. On the one hand, once one of the lamp beads in the series light string structure is damaged, the entire light bar will emit abnormal light, or appear as a black line, or as a bright line of a special single color, etc. Moreover, due to the existence of line loss and voltage drop, the brightness of the lamp beads close to the driver position will be relatively high, and the brightness of the lamp beads far away from the driver position will be relatively dark, resulting in uneven overall brightness. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the LED transparent screen in the prior art that adopts the series connection, the present invention provides a new transparent screen based on the comprehensive manufacturing technology of semiconductor metal transparent wire transparent screen, which adopts a combination of thick and thin wiring method and powers the chip in parallel, which can solve the problem of uneven LED brightness.

[0006] The combination of thick and thin in the present invention can also solve the shortcoming of low brightness of conventional displays. The thick lines can cope with high power consumption and achieve high brightness display, while the thin lines provide low brightness. This combination can also achieve energy-saving effects together with the internal drive IC system through stability and alternation of high and low power consumption.

[0007] The technical solution adopted by the present invention to solve its technical problems is: a transparent screen based on the comprehensive manufacturing technology of semiconductor metal transparent wire transparent screen, the transparent screen includes a substrate, a positive power line, a negative power line, a signal line and a display unit, more than one display unit installation position is arranged on the substrate, the positive power line, the negative power line and the signal line are arranged on the substrate, the positive power end of each display unit installation position is respectively connected to the positive power line, the negative power end of each display unit installation position is respectively connected to the negative power line, the signal end of the display unit installation position is connected to the signal end of the adjacent display unit installation position through the signal line, and the display unit is installed at the display unit installation position.

[0008] The technical solution adopted by the present invention to solve the technical problem further includes: The display unit installation positions are arranged in a matrix form, a positive power line is arranged on one side of each row of display unit installation positions, a negative power line is arranged on the other side of each row of display unit installation positions, and a signal line is arranged between the display unit installation positions in the row.

[0009] The sizes of the positive power line and the negative power line are larger than those of the control line.

[0010] The display unit adopts an LED lamp with integrated lamp driver, or may also adopt an LED wafer with integrated lamp driver. When the display unit adopts an LED lamp, the LED lamp is directly welded to the display unit installation position on the substrate; when the display unit adopts an LED wafer, the LED wafer is directly bonded to the display unit installation position on the substrate in a face-up or flip-down manner.

[0011] The display unit adopts a three-pin, four-pin, five-pin or six-pin design. When the three-pin design is adopted, one pin is a positive power pin, one pin is a negative power pin, and the other is an I / O pin. The positive power pin is connected to the positive power line, the negative power pin is connected to the negative power line, and the I / O pins of each display unit are connected to the signal line through the signal line; when the four-pin design is adopted, one pin is a positive power pin, one pin is a negative power pin, and the other two are I / O pins. The two I / O pins have input and output functions. The positive power pin is connected to the positive power line, the negative power pin is connected to the negative power line, and the I / O pin is connected to the I / O pin of the adjacent display unit through the signal line; when the five-pin design is adopted, one pin is A positive power pin, one pin is a negative power pin, and the other three are I / O pins. One side includes one I / O pin and the other side includes two I / O pins. The three I / O pins all have input and output functions. The positive power pin is connected to the positive power line, and the negative power pin is connected to the negative power line. An I / O pin on a single side is connected to the two I / O pins of the adjacent display unit through signal lines. When a six-pin design is adopted, one pin is a positive power pin, one pin is a negative power pin, and the other four are I / O pins. The four I / O pins all have input and output functions. The positive power pin is connected to the positive power line, the negative power pin is connected to the negative power line, and the I / O pin is connected to the I / O pin of the adjacent display unit through signal lines.

[0012] A controller is installed at one end of the substrate, an I / O pin at one end of the first display unit close to the controller is connected to the controller, the I / O pins of the other display units are connected in series through signal lines, and the I / O pin at one end of the last display unit is connected to the controller to form a closed-loop control circuit.

[0013] The substrate is a rigid substrate or a flexible substrate. The rigid substrate is a paper substrate composited with phenolic resin and paper fiber, an epoxy glass cloth substrate (FR-4), a composite substrate (CEM), an aluminum substrate, a stainless steel substrate, a copper substrate, a ceramic substrate or a glass substrate. The flexible substrate is a polyester film board, a polyimide (PI) board, a polytetrafluoroethylene (PTFE) substrate or a polyimide glass fiber cloth laminate.

[0014] The display unit adopts a lamp-driven integrated structure, the substrate adopts a single-sided copper-clad plate, and the positive power line, the negative power line, the signal line and the display unit installation position are all arranged on the same surface.

[0015] The substrate and the display unit are covered with a flexible film.

[0016] The transparent screen is divided into Class A modules and Class B modules for separate processing. The arrangement direction of the RGB three-color LED lamp beads or RGB three-color LED wafers on the Class A modules is opposite to that of the RGB three-color LED lamp beads or RGB three-color LED wafers on the Class B modules.

[0017] The beneficial effects of the present invention are as follows: the chip (including LED lamp and driver chip) in the present invention can realize the bidirectional control data transmission function by connecting head to tail. When one of the chips is broken, the transmission path of the control data can be changed to transmit data from the spare end to ensure normal transmission. If there is a cold solder joint or a short circuit in the power supply or ground of a single chip, only the lamp bead is affected and the lamp bead will turn black, which will not affect the lighting of other lamp beads. Moreover, the present invention adopts a parallel power supply form to solve the problem of uneven overall brightness.

[0018] The present invention will be further described below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the connection structure of a first embodiment of the driving circuit of the present invention.

[0020] Figure 2 This is a schematic diagram of the connection structure of the second embodiment of the driving circuit of the present invention.

[0021] Figure 3 This is a schematic diagram of the structure of a six-pin LED lamp in the present invention.

[0022] Figure 4 It is a schematic diagram of the structure of a four-pin LED lamp in the present invention.

[0023] Figure 5 This is a schematic diagram of the control circuit connection of the first embodiment of the six-pin LED lamp (connected one by one) in the present invention.

[0024] Figure 6 This is a schematic diagram of the control circuit connection of the first embodiment of the four-pin LED lamp (connected one by one) in the present invention.

[0025] Figure 7 This is a schematic diagram of the control circuit connection of the second embodiment of the six-pin LED lamp (connected end to end) in the present invention.

[0026] Figure 8 This is a schematic diagram of the control circuit connection of the second embodiment of the four-pin LED lamp (connected end to end) in the present invention.

[0027] In the figure, 1-substrate, 2-positive power line, 3-negative power line, 4-signal line, 5-display unit installation position, 6-reinforcement grid. DETAILED DESCRIPTION

[0028] This embodiment is a preferred implementation mode of the present invention. Other embodiments whose principles and basic structures are the same or similar to those of this embodiment are within the protection scope of the present invention.

[0029] Please refer to the attached Figure 1 To Attachment Figure 8 The present invention mainly protects a transparent screen based on a comprehensive manufacturing technology of a semiconductor metal transparent wire transparent screen, which mainly includes a substrate 1, a positive power line 2, a negative power line 3, a signal line 4 and a display unit. The substrate 1 is provided with more than one display unit installation position 5, and the positive power line 2, the negative power line 3 and the signal line 4 are arranged on the substrate 1. The positive power end of each display unit installation position 5 is respectively connected to the positive power line 2, and the negative power end of each display unit installation position 5 is respectively connected to the negative power line 3. The signal end of the display unit installation position 5 is connected to the signal end of the adjacent display unit installation position 5 through the signal line 4. The display unit is installed at the display unit installation position 5, thereby forming a connection mode of parallel power supply and series control to ensure that the brightness of the LED lamp can be unified regardless of the distance from the controller, and the brightness unevenness will not occur.

[0030] In this embodiment, a reinforcing grid 6 is fixedly provided on the substrate 1 to reinforce the structure of the substrate 1, improve its tensile strength, and effectively prevent damage to the substrate 1, especially the circuits on the substrate 1.

[0031] In this embodiment, the reinforcing grid 6 is disposed in a non-circuit area on the substrate 1 , which does not affect the normal connection of the circuit and the transmission of power and signals.

[0032] Preferably, a first reinforcement line parallel to the positive power line 2 is arranged on the outside of the positive power line 2, and a first auxiliary reinforcement line is arranged between the first reinforcement line and the positive power line 2, and the first auxiliary reinforcement line connects the first reinforcement line with the positive power line 2 together, and the first reinforcement line can not only play a role of auxiliary reinforcement, but also play a role of auxiliary conduction, so that the conduction current of the positive power line 2 is increased; a second reinforcement line parallel to the negative power line 3 is arranged on the outside of the negative power line 3, and a second auxiliary reinforcement line is arranged between the second reinforcement line and the negative power line 3, and the second auxiliary reinforcement line connects the second reinforcement line with the negative power line 3 together, and the second reinforcement line can not only play a role of auxiliary reinforcement, but also play a role of auxiliary conduction, so that the conduction current of the negative power line 3 is increased.

[0033] Further preferably, a third reinforcing line parallel to the positive power line 2 is provided inside the positive power line 2. A third auxiliary reinforcing line is provided between the third reinforcing line and the positive power line 2, and the third auxiliary reinforcing line connects the third reinforcing line and the positive power line 2 together. The third reinforcing line can not only play an auxiliary strengthening role but also play an auxiliary conduction role, increasing the conduction current of the positive power line 2. A fourth reinforcing line parallel to the negative power line 3 is provided inside the negative power line 3. A fourth auxiliary reinforcing line is provided between the fourth reinforcing line and the negative power line 3, and the fourth auxiliary reinforcing line connects the fourth reinforcing line and the negative power line 3 together. The fourth reinforcing line can not only play an auxiliary strengthening role but also play an auxiliary conduction role, increasing the conduction current of the negative power line 3.

[0034] In addition to the above structure, reinforcing lines can also be provided at other appropriate positions on the base material 1, and the reinforcing lines are conductively connected to the adjacent power lines or pads in the vicinity.

[0035] In this embodiment, the first auxiliary reinforcing line, the second auxiliary reinforcing line, the third auxiliary reinforcing line, and the fourth auxiliary reinforcing line can adopt a structure perpendicular to the corresponding power line, or can adopt a certain inclination angle (such as: 45°) with the corresponding power line, and the latter can adopt a grid structure.

[0036] In this embodiment, the display unit mounting positions 5 are arranged in an N×M matrix form on the base material 1, that is, N rows of display unit mounting positions 5 are provided on the base material 1, and M display unit mounting positions 5 are provided in each row, or it can be understood that M columns of display unit mounting positions 5 are provided on the base material 1, and N display unit mounting positions 5 are provided in each column. Among them, both N and M are integers greater than or equal to 1. In specific implementation, the display unit mounting positions 5 on the base material 1 can also adopt other arrangement methods, such as: three adjacent display unit mounting positions 5 are arranged in a "pin" shape, etc., or other conventional arrangement methods can be adopted.

[0037] Since the display unit mounting positions 5 are arranged in a matrix form, a row and column structure is formed on the base material 1. The positive power line 2 is provided on one side of each row of display unit mounting positions 5, and the negative power line 3 is provided on the other side of each row of display unit mounting positions 5. The signal line 4 is provided between the display unit mounting positions 5 within the row. Since the driving current of the LED lamp is much larger than the control current, the positive power line 2 and the negative power line 3 in this embodiment are larger in size than the control line to meet the requirements of the driving current. The control line is designed to be thinner, which is more conducive to the realization of the transparent screen. The simplest manifestation is that the widths of the positive power line 2 and the negative power line 3 are greater than the width of the control line. In specific implementation, the sizes of the positive power line 2 and the negative power line 3 can also be increased by increasing the thickness of the positive power line 2 and the negative power line 3.

[0038] In this embodiment, the display unit adopts an LED lamp with integrated lamp driver (which has its own drive and control circuit inside, or can also be called a chip with an LED lamp), or can also adopt an LED wafer with integrated lamp driver (which has its own drive and control circuit inside, or can also be called a chip with an LED lamp). When the display unit adopts an LED lamp, since the LED lamp has been packaged, during assembly, the LED lamp is directly welded to the display unit installation position 5 on the substrate 1; when the display unit adopts an LED wafer, since the LED wafer has not been packaged, during assembly, the LED wafer is directly bonded to the display unit installation position 5 on the substrate 1, and the bonding can be done by a positive bonding method or a flip-chip bonding method.

[0039] In this embodiment, the display unit adopts a three-pin, four-pin, five-pin or six-pin design. When the three-pin design is adopted, one of the pins is a positive power pin, one pin is a negative power pin, and the other is an I / O pin. The positive power pin is connected to the positive power line 2, the negative power pin is connected to the negative power line 3, and the I / O pins of each display unit are connected to the signal line 4 through the signal line 4; when the four-pin design is adopted, one of the pins is a positive power pin, one pin is a negative power pin, and the other two are I / O pins. Both I / O pins have input and output functions. The positive power pin is connected to the positive power line 2, the negative power pin is connected to the negative power line 3, and the I / O pin is connected to the I / O pin of the adjacent display unit through the signal line 4; when the five-pin design is adopted, one of the pins is a positive power pin, one pin is a negative power pin, and the other two are I / O pins. One pin is a positive power pin, one pin is a negative power pin, and the other three are I / O pins. One side includes one I / O pin and the other side includes two I / O pins. The three I / O pins all have input and output functions. The positive power pin is connected to the positive power line 2, the negative power pin is connected to the negative power line 3, and an I / O pin on a single side is connected to the two I / O pins of the adjacent display unit through the signal line 4; when a six-pin design is adopted, one pin is a positive power pin, one pin is a negative power pin, and the other four are I / O pins. The four I / O pins all have input and output functions. The positive power pin is connected to the positive power line 2, the negative power pin is connected to the negative power line 3, and the I / O pin is connected to the I / O pin of the adjacent display unit through the signal line 4.

[0040] The display unit most commonly adopts a four-pin or six-pin design. When the four-pin design is adopted, one pin is the positive power pin, one pin is the negative power pin (also known as the ground pin), and the other two are I / O pins. Both I / O pins have input and output functions. The positive power pin is connected to the positive power line 2, the negative power pin is connected to the negative power line 3, and the I / O pin is connected to the I / O pin of the adjacent display unit through the signal line 4; when the six-pin design is adopted, one pin is the positive power pin, one pin is the negative power pin (also known as the ground pin), and the other four are I / O pins. Both I / O pins have input and output functions. The positive power pin is connected to the positive power line 2, the negative power pin is connected to the negative power line 3, and the I / O pin is connected to the I / O pin of the adjacent display unit through the signal line 4.

[0041] When the above structure is connected into a light string, the I / O pin at one end of the first display unit close to the controller is connected to the controller, the I / O pins of the other display units are connected in series through the signal line 4 to form a string, and the I / O pin at one end of the last display unit is connected to the controller, thereby forming a closed-loop control circuit. Under normal conditions, the control signal is output from the controller to the first display unit, and the first display unit outputs the control signal to the second display unit, and so on, until the last display unit. Once one of the display units is damaged, the display units before the damaged display unit are controlled by the forward-transmitted control signal, and the display units after the damaged display unit are controlled by the reverse-transmitted control signal transmitted from the last display unit. The redundant control design adopted in the present invention can only display an abnormality at that point when any display unit is damaged, without causing the entire display to be abnormal.

[0042] In this embodiment, the substrate 1 can be a rigid substrate 1 or a flexible substrate 1. The rigid substrate 1 can be a paper substrate 1 composited with phenolic resin and paper fiber, an epoxy glass cloth substrate 1 (FR-4), a composite substrate 1 (CEM), an aluminum substrate 1, a stainless steel substrate 1, a copper substrate 1, a ceramic substrate 1 or a glass substrate 1, etc. The flexible substrate 1 can be a polyester film board, a polyimide (PI) board, a polytetrafluoroethylene (PTFE) substrate 1 or a polyimide glass fiber cloth laminate, etc.

[0043] In this embodiment, the display unit may adopt an RGB lamp bead with integrated lamp driver or a positive-mounted or inverted light-emitting diode wafer.

[0044] In this embodiment, the display unit adopts an integrated lamp drive structure, so the circuit structure is not complicated. In this embodiment, the substrate 1 can adopt a single-sided copper clad plate to meet the needs, and the positive power line 2, the negative power line 3, the signal line 4 and the display unit installation position 5 (i.e., the welding position or the bonding position) are all arranged on the same surface.

[0045] In this embodiment, the substrate 1 and the display unit are covered with a flexible film to protect them without affecting the light transmission effect.

[0046] The transparent screen in the present invention can be made into a module of standard structure, which can be spliced ​​on site to form the entire transparent screen. The transparent screen module adopts a rectangular structure, and the controller is set at the edge of the short side on one side. When it is spliced, the controller can be located on the left and right sides of the entire transparent screen, or on the upper and lower sides of the entire transparent screen. It is used as a frame and will not affect the transparent effect of the middle area of ​​the transparent screen.

[0047] In this embodiment, when the transparent screen is a color screen, the display unit uses RGB three-color LED lamp beads or RGB three-color LED wafers. The three lamp beads or three wafers on the RGB three-color LED lamp beads or RGB three-color LED wafers are usually arranged in a "one" shape, or "pink" arranged by themselves. The transparent screen module can be divided into Class A modules and Class B modules for separate processing. The arrangement direction of the RGB three-color LED lamp beads or RGB three-color LED wafers on the Class A modules is opposite to that of the RGB three-color LED lamp beads or RGB three-color LED wafers on the Class B modules. Taking the arrangement of three lamp beads in the shape of "one" as an example, when the three lamp beads in the Class A module are welded, the method is "R, G, B", then the three lamp beads in the Class B module should be welded in the method of "B, G, R". During assembly, the Class A module and the Class B module are relatively arranged, that is, the Class B module is equivalent to being rotated 180° relative to the Class A module. After the three lamp beads "B, G, R" in the Class B module are rotated 180°, there is no "R, G, B", which can be just extended along the arrangement method of the Class A module, and will not cause display abnormalities at the joints.

[0048] The chip (including LED lamp and driver chip) in the present invention can realize the bidirectional control data transmission function by connecting head to tail. When one of the chips is broken, the transmission path of the control data can be changed to transmit data from the spare end to ensure normal transmission. If there is a cold solder joint or a short circuit in the power supply or ground of a single chip, only the lamp bead will be affected and the lamp bead will turn black, which will not affect the lighting of other lamp beads. In addition, the present invention adopts a parallel power supply form to solve the problem of uneven overall brightness.

[0049] The combination of thick and thin in the present invention can also solve the shortcoming of low brightness of conventional displays. The thick lines can cope with high power consumption and achieve high brightness display, while the thin lines provide low brightness. This combination can also achieve energy-saving effects together with the internal drive IC system through stability and alternation of high and low power consumption.

Claims

1. A transparent screen based on the integrated manufacturing technology of semiconductor metal transparent wire transparent screen, characterized by: The transparent screen includes a substrate, a positive power line, a negative power line, a signal line and a display unit. More than one display unit installation position is arranged on the substrate. The positive power line, the negative power line and the signal line are arranged on the substrate. The positive power end of each display unit installation position is respectively connected to the positive power line, and the negative power end of each display unit installation position is respectively connected to the negative power line. The signal end of the display unit installation position is connected to the signal end of the adjacent display unit installation position through the signal line, and the display unit is installed at the display unit installation position.

2. The transparent screen based on the semiconductor metal transparent wire transparent screen integrated manufacturing technology according to claim 1 is characterized by: The display unit installation positions are arranged in a matrix form, a positive power line is arranged on one side of each row of display unit installation positions, a negative power line is arranged on the other side of each row of display unit installation positions, and a signal line is arranged between the display unit installation positions in the row.

3. The transparent screen based on the semiconductor metal transparent wire transparent screen integrated manufacturing technology according to claim 1 is characterized by: The sizes of the positive power line and the negative power line are larger than those of the control line.

4. The transparent screen based on the semiconductor metal transparent wire transparent screen integrated manufacturing technology according to claim 1 is characterized by: The display unit adopts an LED lamp with integrated lamp driver, or may also adopt an LED wafer with integrated lamp driver. When the display unit adopts an LED lamp, the LED lamp is directly welded to the display unit installation position on the substrate; when the display unit adopts an LED wafer, the LED wafer is directly bonded to the display unit installation position on the substrate in a face-up or flip-down manner.

5. The transparent screen based on the semiconductor metal transparent wire transparent screen integrated manufacturing technology according to claim 1 is characterized by: The display unit adopts a three-pin, four-pin, five-pin or six-pin design. When the three-pin design is adopted, one pin is a positive power pin, one pin is a negative power pin, and the other is an I / O pin. The positive power pin is connected to the positive power line, the negative power pin is connected to the negative power line, and the I / O pins of each display unit are connected to the signal line through the signal line; when the four-pin design is adopted, one pin is a positive power pin, one pin is a negative power pin, and the other two are I / O pins. The two I / O pins have input and output functions. The positive power pin is connected to the positive power line, the negative power pin is connected to the negative power line, and the I / O pin is connected to the I / O pin of the adjacent display unit through the signal line; when the five-pin design is adopted, one pin is A positive power pin, one pin is a negative power pin, and the other three are I / O pins. One side includes one I / O pin and the other side includes two I / O pins. The three I / O pins all have input and output functions. The positive power pin is connected to the positive power line, and the negative power pin is connected to the negative power line. An I / O pin on a single side is connected to the two I / O pins of the adjacent display unit through signal lines. When a six-pin design is adopted, one pin is a positive power pin, one pin is a negative power pin, and the other four are I / O pins. The four I / O pins all have input and output functions. The positive power pin is connected to the positive power line, the negative power pin is connected to the negative power line, and the I / O pin is connected to the I / O pin of the adjacent display unit through signal lines.

6. The transparent screen based on the semiconductor metal transparent wire transparent screen integrated manufacturing technology according to claim 1 is characterized by: A controller is installed at one end of the substrate, an I / O pin at one end of the first display unit close to the controller is connected to the controller, the I / O pins of the other display units are connected in series through signal lines, and the I / O pin at one end of the last display unit is connected to the controller to form a closed-loop control circuit.

7. The transparent screen based on the semiconductor metal transparent wire transparent screen integrated manufacturing technology according to claim 1 is characterized by: The substrate is a rigid substrate or a flexible substrate. The rigid substrate is a paper substrate composited with phenolic resin and paper fiber, an epoxy glass cloth substrate (FR-4), a composite substrate (CEM), an aluminum substrate, a stainless steel substrate, a copper substrate, a ceramic substrate or a glass substrate. The flexible substrate is a polyester film board, a polyimide (PI) board, a polytetrafluoroethylene (PTFE) substrate or a polyimide glass fiber cloth laminate.

8. The transparent screen based on the semiconductor metal transparent wire transparent screen integrated manufacturing technology according to claim 1 is characterized by: The display unit adopts a lamp-driven integrated structure, the substrate adopts a single-sided copper-clad plate, and the positive power line, the negative power line, the signal line and the display unit installation position are all arranged on the same surface.

9. The transparent screen based on the semiconductor metal transparent wire transparent screen integrated manufacturing technology according to claim 1 is characterized by: The substrate and the display unit are covered with a flexible film.

10. The transparent screen based on the semiconductor metal transparent wire transparent screen integrated manufacturing technology according to claim 1 is characterized by: The transparent screen is divided into Class A modules and Class B modules for separate processing. The arrangement direction of the RGB three-color LED lamp beads or RGB three-color LED wafers on the Class A modules is opposite to that of the RGB three-color LED lamp beads or RGB three-color LED wafers on the Class B modules.

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