Treatment device for recycling guide tape of buffer layer of high-temperature superconducting tape

Abstract

The invention relates to the technical field of high-temperature superconducting strip preparation, and aims to solve the technical problems of high cost and low efficiency. In order to solve the technical problem, the invention provides the treatment device for recycling the buffer layer leading tape of the high-temperature superconducting tape. The device comprises a transmission assembly used for realizing transmission of a to-be-processed leading tape; a rewinder; the leading tape processing assembly comprises a deplating processing part and a drying part which are sequentially arranged in the leading tape conveying direction, the deplating processing part is arranged close to the outlet end, and the drying part is arranged close to the inlet end; an alkaline solution is arranged in a deplating tank of the deplating treatment part; the leading tape to be treated enters the deplating tank from the outlet end for deplating treatment; the to-be-treated leading tape enters the first cleaning part to clean the stripping solution on the to-be-treated leading tape; the leading tape to be treated enters the drying part from the first cleaning part, and water mist on the leading tape to be treated is dried; a leading tape to be processed enters the tape rewinder from the inlet end. The production cost is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of high-temperature superconducting tape preparation, in particular to a processing device for recycling the buffer layer lead tape of a high-temperature superconducting tape. Background Art

[0002] Superconducting technology has undergone a long period of research and development since it was discovered in 1911. In 1986, Berndts and Mueller discovered high-temperature superconducting materials, opening a new chapter in the research of high-temperature superconducting materials. Since then, scientists have continued to explore superconducting materials with higher critical temperatures.

[0003] High-temperature superconducting materials can operate at higher temperatures than traditional low-temperature superconducting materials, usually above liquid nitrogen temperature (about -196°C), which reduces refrigeration costs and makes superconducting technology more economical and feasible in practical applications. For example, in the medical field, superconducting technology is used to manufacture high-resolution MRI equipment; in the power industry, high-temperature superconducting cables can achieve long-distance, low-loss power transmission. The application of high-temperature superconducting materials helps to reduce energy loss and environmental impact, improve energy utilization efficiency, and is of great significance to the sustainable development of society. Although high-temperature superconducting materials have great potential, their large-scale application still faces challenges such as material preparation, cost control, and technical stability, which require continuous technological innovation to overcome.

[0004] High-temperature superconducting tapes are usually composed of a base tape, a buffer layer, a superconducting layer, a silver layer and a protective layer. The base tape is made of Hastelloy alloy, and the surface roughness is reduced to less than 1nm after the electrolytic polishing process. After the base tape is polished (i.e., polished tape), the buffer layer is vacuum evaporated. The functional layer (superconducting layer) is vapor-deposited on the buffer layer, and the buffer layer plays an important role in the practical application of superconducting tapes: 1. Prevent atomic diffusion: The buffer layer can prevent the metal atoms in the base tape from diffusing into the superconducting layer, and can also prevent the oxygen atoms in the superconducting layer from diffusing into the base tape, thereby maintaining the chemical stability and performance of the superconducting layer. 2. Provide a textured substrate: The buffer layer provides a substrate with a biaxial texture for the epitaxial growth of the superconducting layer, which helps the superconducting layer to form a highly oriented crystal structure, which is crucial for improving the critical current density (Jc) of the superconducting layer. 3. Reduce the mismatch of thermal expansion coefficients: The difference in thermal expansion coefficients between different materials may lead to the generation of thermal stress. The buffer layer can play a transitional role, reduce the difference in thermal expansion coefficients between the base tape and the superconducting layer, and reduce thermal stress. 4. Improve mechanical properties: The buffer layer can improve the overall mechanical properties of the tape, especially in the transverse direction (thickness direction), and enhance the tape's ability to resist peeling and delamination. 5. Reduce stress concentration: When the superconducting tape is subjected to bending or electromagnetic force, the buffer layer helps to disperse stress and avoid damage to the superconducting layer caused by stress concentration. 6. Promote uniform growth of the superconducting layer: The presence of the buffer layer helps the uniformity of the superconducting layer during epitaxial growth, improving the overall quality and consistency of the superconducting tape.

[0005] The buffer layer of high-temperature superconducting tape prepared by our company is made of aluminum oxide (Al2O3), yttrium oxide (Y2O3), magnesium oxide (MgO) and lanthanum manganese oxide (LMnO) as the base, and is prepared by vacuum sputtering process of vacuum radio frequency sputtering equipment. The process requires connecting 30~100 meters of lead tape for process debugging before producing the buffer layer. The lead tape is generally made of the same material as the buffer layer, such as Hastelloy.

[0006] When vacuum RF sputtering equipment is used to prepare the production buffer layer, the role of the lead debugging is mainly reflected in the following aspects: (1) Ensure continuity: In the process of preparing the production buffer layer material, the lead debugging ensures the continuity of the sputtering process and avoids the degradation of film quality or production interruption caused by discontinuous material supply. (2) Improve the uniformity of the film layer: By accurately controlling the speed of the lead and the sputtering parameters, the film thickness and composition of the production buffer layer material can be ensured to be uniform over the entire length of the tape. (3) Optimize sputtering conditions: The lead debugging allows the operator to adjust the sputtering power, gas pressure and other parameters according to the actual sputtering situation to optimize the sputtering conditions and improve the film quality and production efficiency. (4) Prevent material defects: In the process of preparing the production buffer layer material, the lead debugging helps to reduce film defects such as pinholes and cracks caused by equipment instability or improper operation. (5) Ensure stable operation of the equipment: The lead debugging helps to monitor and maintain the stability of the equipment during long-term operation and promptly discover and solve possible problems. (6) Realize complex structures: For production buffer layer materials that require multiple layers or have specific structures, lead debugging can accurately control the thickness and composition of each layer to achieve complex film structure design. (7) Improve material utilization: By optimizing the path and speed of the lead, the utilization rate of the target material can be improved and material waste can be reduced. (8) Ensure safe production: In the preparation process of the production buffer layer material, lead debugging helps to monitor and control the safety risks that may arise in the production process and ensure the safety of the production process. In actual applications, the specific role of lead debugging may vary depending on the design of the equipment, the characteristics of the material, and the specific requirements of production. Through precise lead debugging, the quality of the long strip material and the stability of the production process can be ensured.

[0007] As production capacity increases, the amount of lead tape used also increases. At present, the lead tape used for magnetron sputtering of the buffer layer in the process of preparing high-temperature superconducting tape is a one-time consumption, which is not conducive to cost control and leads to increased production costs. Therefore, it is particularly important to develop a lead tape that can be used for recycling and debugging. Summary of the invention

[0008] Therefore, the technical problem to be solved by the present invention is to overcome the above-mentioned problems existing in the prior art.

[0009] In order to solve the above technical problems, the present invention provides a processing device for recycling the buffer layer lead of a high-temperature superconducting tape, comprising: A transmission component, used to realize the transmission of the leader to be processed; The tape rewinding machine is provided with an outlet end, an inlet end and two tape reels; the two tape reels are respectively arranged near the outlet end and the inlet end; the tape reels rotate to wind the leader tape to be processed; The leader processing assembly comprises a stripping processing component and a drying component sequentially arranged along the leader transmission direction, wherein the stripping processing component is arranged near the outlet end, and the drying component is arranged near the inlet end; the stripping processing component comprises a stripping tank and a first cleaning part arranged at a side of the stripping tank away from the outlet end, wherein an alkaline solution is arranged in the stripping tank; Among them, the leader tape to be processed enters the deplating tank from the outlet end for deplating treatment; the leader tape to be processed enters the first cleaning section to clean the deplating liquid on the leader tape to be processed; the leader tape to be processed enters the drying component from the first cleaning section to dry the water mist on the leader tape to be processed; the dried leader tape to be processed enters the rewinding machine from the inlet end.

[0010] In one embodiment of the present invention, the alkaline solution is sodium hydroxide, and the concentration of sodium hydroxide is 0.1 mol / L~20 mol / L; the working temperature of the alkaline solution is 15°C~70°C.

[0011] In one embodiment of the present invention, the leader processing assembly also includes a passivation processing component arranged between the stripping processing component and the drying component; the passivation processing component includes a passivation tank and a second cleaning part arranged in sequence along the leader transmission direction, and a passivation liquid is provided in the passivation tank for passivating the leader to be processed after the stripping treatment; the second cleaning part is used to clean the passivation liquid and water marks on the leader to be processed.

[0012] In one embodiment of the present invention, the passivation solution is a nitric acid solution, the concentration of the nitric acid solution is 1% to 30%, and the working temperature of the nitric acid solution is 15° C. to 70° C.

[0013] In one embodiment of the present invention, the second cleaning portion has the same structure as the first cleaning portion.

[0014] In one embodiment of the present invention, the first cleaning section includes a water knife and an air knife sequentially arranged along the conveying direction of the leader; the water knife is arranged close to the deplating tank.

[0015] In one embodiment of the present invention, the temperature of the drying component is 50°C-200°C.

[0016] In one embodiment of the present invention, the leader processing assembly is arranged on one side of the rewinding machine along the Y direction; the stripping processing component, the passivation processing component and the drying component are arranged in a U shape.

[0017] In one embodiment of the present invention, the transmission component includes multiple transmission guide wheels and a power unit; transmission guide wheels are respectively provided at both ends of the stripping treatment component, and transmission guide wheels are also respectively provided at both ends of the drying component. The lead tape to be processed is passed through multiple transmission guide wheels along the lead tape transmission direction; the power unit is connected to the transmission guide wheel, and is used to drive the transmission guide wheel to rotate to realize the transmission of the lead tape to be processed.

[0018] In one embodiment of the present invention, the transmission guide wheels at both ends of the stripping treatment component are staggered in the X direction; and the transmission guide wheels at both ends of the drying component are staggered in the X direction.

[0019] The above technical solution of the present invention has the following advantages compared with the prior art: The processing device for recycling the buffer layer lead tape of the high-temperature superconducting tape described in the present invention has an alkaline solution in the deplating tank that can deplating the aluminum oxide, yttrium oxide and magnesium oxide on the used lead tape (lead tape to be processed), and then the alkaline solution remaining on the surface of the treated lead tape is cleaned and the water marks are processed by the first cleaning part, and then the drying component dries the watermarks on the surface of the lead tape, so that the lead tape meets the use requirements. In this process, the lead tape is unwound through one of the two reels, and then passes through the deplating processing component and the drying component in sequence through the transmission component, and then the treated qualified lead tape is reeled in through the other reel of the two reels, so as to facilitate the recycling of the lead tape. It can be seen that the present application changes the lead tape from a disposable consumable to a recyclable one, and the lead tape can be used continuously under the premise that the lead tape is not damaged or deformed by external force, which greatly reduces the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to make the content of the present invention more clearly understood, the present invention is further described in detail below according to specific embodiments of the present invention in conjunction with the accompanying drawings, wherein: Figure 1 It is a structural schematic diagram of a processing device for recycling the buffer layer lead tape of a high-temperature superconducting tape in a preferred embodiment of the present invention; Description of the reference numerals in the specification: 100, transmission component; 110, transmission guide wheel; 200, rewinding machine; 210, outlet end; 220, inlet end; 230, reel; 240, first control panel; 300, leader processing assembly; 310, stripping processing component; 311, stripping tank; 312, first cleaning section; 3121, water knife; 3122, air knife; 320, drying section; 330, passivation processing component; 331, passivation tank; 332, second cleaning section; 340, second control panel. DETAILED DESCRIPTION

[0021] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0022] High-temperature superconducting tapes generally use Hastelloy alloy as the substrate. The price of Hastelloy alloy tapes of the same specifications is ten to twenty times that of ordinary stainless steel tapes, which is extremely expensive. In the production of vacuum coating process, Hastelloy alloy tapes (i.e., lead tapes) made of the same material as the long tapes are used as lead tape debugging processes. However, the existing lead tapes are all disposable, with high production costs; in addition, since debugging is required before each process, a large number of lead tapes will inevitably be produced.

[0023] It needs debugging every time it is used, the process is complicated and the production efficiency is low.

[0024] Reference Figure 1 As shown, an embodiment of the present invention provides a processing device for recycling the buffer layer lead of a high-temperature superconducting tape, comprising: A transmission component 100, used to realize the transmission of the leader tape to be processed (not shown in the figure); The rewinding machine 200 is provided with an outlet end 210, an inlet end 220 and two tape reels 230; the two tape reels 230 are respectively arranged near the outlet end 210 and the inlet end 220; the tape reels 230 rotate to wind up the leader tape to be processed; the two tape reels 230 are respectively a first tape reel and a second tape reel, the first tape reel and the second tape reel are rotatable and used to retract and release the leader tape. The height of the first tape reel and the second tape reel are flush.

[0025] The leader processing assembly 300 includes a stripping processing component 310 and a drying component 320 sequentially arranged along the leader transmission direction, wherein the stripping processing component 310 is arranged close to the outlet end 210, and the drying component 320 is arranged close to the inlet end 220; the stripping processing component 310 includes a stripping tank 311 and a first cleaning portion 312 arranged in the stripping tank 311 on a side away from the outlet end 210, and an alkaline solution is provided in the stripping tank 311; in some embodiments, the stripping tank 311 is an ultrasonic stripping tank 311.

[0026] Among them, the lead tape to be processed enters the deplating tank 311 from the outlet end 210 for deplating treatment; the lead tape to be processed enters the first cleaning section 312 to clean the deplating liquid on the lead tape to be processed; the lead tape to be processed enters the drying component 320 from the first cleaning section 312 to dry the water mist on the lead tape to be processed; the dried lead tape to be processed enters the rewinding machine 200 from the inlet end 220.

[0027] Specifically, the alkaline solution in the deplating tank 311 of the present application can deplating the aluminum oxide, yttrium oxide and magnesium oxide on the used leader tape (lead tape to be processed), and then the alkaline solution remaining on the surface of the treated leader tape is cleaned and the water marks are processed through the first cleaning part 312, and then the drying component 320 dries the watermarks on the surface of the leader tape, so that the leader tape meets the use requirements. In this process, the leader tape is unwound through one of the two reels 230, and then passes through the deplating processing component 310 and the drying component 320 in sequence through the transmission component 100, and then the leader tape that has been treated and qualified is taken up through the other reel of the two reels 230, so as to facilitate the recycling of the leader tape. It can be seen that the present application changes the leader tape from a disposable consumable to a recyclable one, and the leader tape can be used continuously under the premise that the leader tape is not damaged or deformed by external force, which greatly reduces the production cost.

[0028] Furthermore, the alkaline solution is sodium hydroxide, and the concentration of sodium hydroxide is 0.1 mol / L~20 mol / L; the working temperature of the alkaline solution is 15°C~70°C.

[0029] Specifically, during stripping, the aluminum oxide, yttrium oxide, and magnesium oxide on the surface of the leader react chemically with the stripping solution (sodium hydroxide) as follows: Al2O3+2NaOH→2NaAlO2+H2O Y2O3+6NaOH→2Na3Y(OH)3 MgO+H20(hot water)→Mg(OH)2 It can be seen that the present application uses an alkaline solution (sodium hydroxide) to remove aluminum oxide, yttrium oxide, and magnesium oxide from the surface of the used leader, and the effect is better at this concentration and working temperature.

[0030] During the production process, in order to prevent the leader tape (made of stainless steel) from contacting the external environment and affecting the production quality, a protective film is often plated on the surface of the leader tape. In order to ensure that the leader tape after the circulation treatment can also meet this requirement, the leader tape processing assembly 300 also includes a passivation treatment component 330 arranged between the stripping treatment component 310 and the drying component 320; the passivation treatment component 330 includes a passivation tank 331 and a second cleaning part 332 arranged in sequence along the transmission direction of the leader tape, and a passivation liquid is provided in the passivation tank 331, which is used to passivate the leader tape to be treated after the stripping treatment. The second cleaning part 332 is used to clean the passivation liquid and water marks on the leader tape to be treated. Specifically, in this embodiment, during passivation, the nitric acid solution in the passivation tank 331 reacts with the chromium element on the surface of the leader tape (stainless steel) to form a dense layer of chromium oxide ( ) film. This film is very thin, but it can effectively isolate the metal from the external environment, protect the surface of the strip, and prevent corrosion caused by oxidation and water vapor. Thus, it meets the use requirements of the leader.

[0031] Furthermore, the passivation solution is a nitric acid solution, the concentration of the nitric acid solution is 1%~30%, and the working temperature of the nitric acid solution is 15℃~70℃.

[0032] Specifically, the treatment effect is better at this concentration and working temperature.

[0033] Furthermore, the first cleaning section 312 includes a water knife 3121 and an air knife 3122 sequentially arranged along the conveying direction of the lead tape; the water knife 3121 is arranged close to the deplating tank 311. In some embodiments, the second cleaning section 332 has the same structure as the first cleaning section 312. Specifically, the water knife 3121 is used to clean the deplating solution or passivation solution remaining on the lead tape; the air knife 3122 is used to blow dry the water marks remaining on the lead tape from the previous water knife 3121. In this embodiment, the air knife 3122 is used to blow off the large water droplets remaining on the lead tape in the previous process, and then dry it. If the drying part 320 is directly entered for drying without the process of the air knife 3122, there will be marks after drying, which will affect the deposition of the buffer layer.

[0034] Further, the temperature of the drying component 320 is 50° C. to 200° C. Specifically, this temperature has a better drying effect and reduces energy consumption.

[0035] Furthermore, the leader processing assembly 300 is disposed on one side of the rewinding machine 200 along the Y direction; the stripping processing component 310, the passivation processing component 330 and the drying component 320 are arranged in a U shape.

[0036] Specifically, the U-shaped arrangement can reduce the floor space and make the layout more reasonable.

[0037] Furthermore, the transmission component 100 includes a plurality of transmission guide wheels 110 and a power unit (for example, a servo motor; not shown in the figure); transmission guide wheels 110 are respectively provided at both ends of the stripping treatment component 310, and transmission guide wheels 110 are also respectively provided at both ends of the drying component 320. The lead tape to be processed is passed through a plurality of transmission guide wheels 110 along the lead tape transmission direction; the power unit is connected to the transmission guide wheel 110, and is used to drive the transmission guide wheel 110 to rotate to realize the transmission of the lead tape to be processed.

[0038] Specifically, this embodiment realizes the transmission of the leader tape to be processed and the change of the transmission direction of the leader tape to be processed through the transmission guide wheel 110, and the structure is stable and reliable. In some embodiments, the transmission speed of the leader tape to be processed is 0.1m / min~10m / min.

[0039] Furthermore, the transmission guide wheels 110 at both ends of the stripping treatment component 310 are staggered in the X direction; and the transmission guide wheels 110 at both ends of the drying component 320 are staggered in the X direction.

[0040] Specifically, this embodiment makes it easier to tension the leader belt to be processed on the transmission guide wheel 110, thereby preventing the leader belt to be processed from becoming loose on the transmission guide wheel 110 and affecting the operation.

[0041] In some embodiments, the tape rewinding machine 200 further includes a first control panel 240 for controlling the speed and tension of the leader tape to be processed.

[0042] In some embodiments, the leader processing assembly 300 further includes a second control panel 340 for operating and controlling the temperature of the stripping tank 311 , the drying component 320 , and the passivation tank 331 .

[0043] The present application is divided into two independent sections (i.e., the rewinding machine 200 and the lead processing assembly 300). When stripping is required, the two parts can be assembled and used together. When there is no stripping requirement, the two parts can be separated and used as the rewinding machine 200. The entire device is easy to assemble and split and easy to move, which reduces the idle time of the equipment.

[0044] In some embodiments, a polished tape (new tape), a tape that has been debugged and used in a normal process, and a tape that has been de-plated according to the present application are taken for energy dispersive spectroscopy (EDS) testing, and the Al, Y, and Mg content can be used to determine whether the tape is completely de-plated.

[0045] 1. Polishing belt surface element detection data (surface elements), see Table 1.

[0046] Table 1

[0047] 2. Under normal process (MgO process, ALY process): the following is a comparison table of surface element detection data of the used leader tape and the used leader tape after deplating treatment by this application.

[0048] 2.1 is the comparison of the surface element detection data of the lead tape under the MgO process, see Table 2.

[0049] Table 2

[0050] 2.2 is the comparison of the surface element detection data of the lead tape under the ALY (aluminum oxide and yttrium oxide) process, see Table 3.

[0051] Table 3

[0052] Referring to Tables 1 to 3 above, the present application can restore the used leader tape to the state of the polished base tape by deplating. The test shows that there is no film layer remaining on the surface of the polished base tape after deplating, and the roughness does not change, so it can be used for the debugging of the next buffer layer process. It can be seen that the leader tape after deplating meets the requirements for reuse, and the leader tape can be recycled to reduce product costs.

[0053] The polished tape (new tape) and the tape that has been stripped by this application were taken and the surface roughness was tested using an atomic force microscope. The results are shown in Table 4 below: Table 4

[0054] The use requirement of the leader tape is: the roughness is less than 1 nm. As shown in Table 4, the leader tape subjected to the deplating treatment of the present application can meet the requirements for reuse.

[0055] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the present invention.

Claims

1. A processing device for recycling high-temperature superconducting tape buffer layer lead tape, characterized in that: include: A transmission component, used to realize the transmission of the leader to be processed; The tape rewinding machine is provided with an outlet end, an inlet end and two tape reels; the two tape reels are respectively arranged near the outlet end and the inlet end; the tape reels rotate to wind the leader tape to be processed; The leader processing assembly comprises a stripping processing component and a drying component sequentially arranged along the leader transmission direction, wherein the stripping processing component is arranged close to the outlet end, and the drying component is arranged close to the inlet end; the stripping processing component comprises a stripping tank and a first cleaning part arranged in the stripping tank away from the outlet end, wherein an alkaline solution is arranged in the stripping tank; Among them, the leader tape to be processed enters the deplating tank from the outlet end for deplating treatment; the leader tape to be processed enters the first cleaning part to clean the deplating liquid on the leader tape to be processed; the leader tape to be processed enters the drying part from the first cleaning part to dry the water mist on the leader tape to be processed; the dried leader tape to be processed enters the rewinding machine from the inlet end.

2. The processing device for recycling the buffer layer lead tape of high-temperature superconducting tape according to claim 1, characterized in that: The alkaline solution is sodium hydroxide, and the concentration of the sodium hydroxide is 0.1 mol / L to 20 mol / L; the working temperature of the alkaline solution is 15° C. to 70° C.

3. The processing device for recycling high-temperature superconducting tape buffer layer lead tape according to claim 1, characterized in that: The leader tape processing assembly also includes a passivation processing component arranged between the stripping processing component and the drying component; the passivation processing component includes a passivation tank and a second cleaning part arranged in sequence along the leader tape transmission direction, and the passivation tank is provided with a passivation liquid for passivating the leader tape to be processed after the stripping treatment; the second cleaning part is used to clean the passivation liquid and water marks on the leader tape to be processed.

4. The processing device for recycling high-temperature superconducting tape buffer layer lead tape according to claim 3, characterized in that: The passivation solution is a nitric acid solution, the concentration of the nitric acid solution is 1% to 30%, and the working temperature of the nitric acid solution is 15° C. to 70° C.

5. The processing device for recycling high-temperature superconducting tape buffer layer lead tape according to claim 3, characterized in that: The second cleaning part has the same structure as the first cleaning part.

6. The processing device for recycling high-temperature superconducting tape buffer layer lead tape according to claim 3, characterized in that: The leader processing component is arranged at one side of the rewinding machine along the Y direction; the stripping processing component, the passivation processing component and the drying component are arranged in a U shape.

7. The processing device for recycling high-temperature superconducting tape buffer layer lead tape according to claim 1, characterized in that: The first cleaning part includes a water knife and an air knife which are sequentially arranged along the conveying direction of the leader; the water knife is arranged close to the deplating tank.

8. The processing device for recycling high-temperature superconducting tape buffer layer lead tape according to claim 1, characterized in that: The temperature of the drying component is 50°C to 200°C.

9. The processing device for recycling high-temperature superconducting tape buffer layer lead tape according to claim 1, characterized in that: The transmission assembly includes a plurality of transmission guide wheels and a power unit; the two ends of the stripping treatment component are respectively provided with the transmission guide wheels, and the two ends of the drying component are also respectively provided with the transmission guide wheels, and the leader belt to be processed is passed through the plurality of transmission guide wheels along the leader belt transmission direction; The power unit is connected to the transmission guide wheel and is used to drive the transmission guide wheel to rotate to realize the transmission of the lead belt to be processed.

10. The processing device for recycling high-temperature superconducting tape buffer layer lead tape according to claim 9, characterized in that: The transmission guide wheels at both ends of the stripping treatment component are staggered in the X direction; the transmission guide wheels at both ends of the drying component are staggered in the X direction.

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