Structure and method for sealing semiconductor wafer and transformer

Abstract

The invention discloses a semiconductor wafer and transformer sealing structure which comprises a first packaging substrate, the top of the first packaging substrate is fixedly connected with a second packaging substrate, the top of the second packaging substrate is provided with a limiting column, and a transmission assembly is arranged between the first packaging substrate and the limiting column. According to the structure for sealing the semiconductor wafer and the transformer, the top plate, the connecting rod, the limiting clamping block, the square groove and the limiting groove are additionally arranged on the original basis, so that when two packaging substrates are mounted, the limiting clamping block at the bottom of the connecting rod penetrates into the square groove and reaches the limiting groove; and then a top plate is rotated to drive a connecting rod and a limiting clamping block to rotate in a limiting groove, so that the limiting clamping block is clamped to the inner wall of the top of the limiting groove, the top plate is rotated during fixing and disassembling, the limiting clamping block is taken out of the limiting groove, disassembling is achieved, and waste of time of workers is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of transformers, and in particular to a structure in which a semiconductor wafer and a transformer are sealed together. Background Art

[0002] A planar transformer is an instrument with the characteristics of high frequency, low shape, small height and high operating frequency. The planar transformer is composed of an iron core and a winding.

[0003] The above disadvantages:

[0004] When sealing a traditional planar transformer, a copper sheet and a PCB board are installed between two packaging substrates, and then the two packaging substrates are fixed by glue. However, after using the transformer for a long time, it is inevitable that the transformer will be damaged. When the transformer is damaged, it needs to be disassembled from the main board, and then the packaging substrate is opened for inspection. A lot of time will be wasted when opening the two packaging substrates bonded with glue. Summary of the invention

[0005] The object of the present invention is to provide a structure for sealing a semiconductor wafer and a transformer to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a structure for sealing a semiconductor wafer and a transformer, comprising a first packaging substrate, a second packaging substrate is fixedly connected to the top of the first packaging substrate, a limiting column is arranged on the top of the second packaging substrate, a transmission component is arranged between the first packaging substrate and the limiting column, a clamping component for fixing the position of the limiting column is arranged at the connection between the limiting column and the second packaging substrate, the clamping component comprises a top plate rotatably inserted and connected to the top of the limiting column, a connecting rod is fixedly connected to the bottom of the top plate, a limiting clamping block is fixedly connected to the bottom of the connecting rod, a square groove is opened on the top of the second packaging substrate, a limiting groove is opened on the inner wall of the bottom end of the square groove, and the limiting clamping block is clamped at the bottom of the limiting groove.

[0007] Preferably, the connecting rod is slidably inserted and connected to the bottom of the limiting column, and the connecting rod is slidably inserted and connected to the inside of the square groove.

[0008] Preferably, a cross groove for rotating the top plate is provided on the top of the top plate.

[0009] Preferably, the transmission component includes a coated copper sheet arranged at the bottom of the limiting column, a PCB board is arranged on the top of the first packaging substrate, the PCB board is arranged at the bottom of the coated copper sheet, the second packaging substrate is inserted and connected in the middle of the coated copper sheet, and the second packaging substrate is inserted and connected in the middle of the PCB board.

[0010] Preferably, first connecting blocks are provided on both sides of the coated copper sheet, and second connecting blocks are provided on both sides of the PCB board.

[0011] Preferably, a PIN needle is sleeved on the middle part of the plurality of first connection blocks, and the plurality of PIN needles are respectively inserted and connected to the middle part of the plurality of second connection blocks.

[0012] Preferably, the front and back sides of the top of the first packaging substrate are fixedly connected with first limit blocks, the coated copper sheet is arranged on the opposite side of the two first limit blocks, the front and back sides of the bottom of the limit column are fixedly connected with second limit blocks, and the PCB board is arranged on the opposite side of the two second limit blocks.

[0013] Preferably, a supporting groove is formed on one side opposite to the two first limiting blocks, and the two second limiting blocks are respectively arranged on the top of the two supporting grooves.

[0014] Preferably, the first packaging substrate and the outer walls of the limiting pillars are both covered with insulating tape.

[0015] A method for installing a structure in which a semiconductor wafer and a transformer are sealed together comprises the following steps:

[0016] The first step is to sleeve the coated copper sheet and the PCB board on the middle part of the second packaging substrate;

[0017] The second step is to insert the limit card block into the inside of the square groove until the limit card block enters the limit groove;

[0018] The third step is to take out the cross cutter and insert it into the cross slot, rotate the cross cutter, drive the top plate to rotate through the cross slot, thereby drive the connecting rod to rotate through the top plate, and the connecting rod drives the limit block to rotate inside the limit slot, so that the limit block is clamped inside the limit slot, and the limit column is clamped on the top of the second packaging substrate through the limit block.

[0019] Technical effects and advantages of the present invention:

[0020] The structure of sealing the semiconductor wafer and the transformer together adds a top plate, a connecting rod, a limit card block, a square groove and a limit groove on the original basis. This arrangement realizes that when installing two packaging substrates, the limit card block at the bottom of the connecting rod is inserted into the square groove to reach the limit groove, and then the top plate is rotated to drive the connecting rod and the limit card block to rotate in the limit groove through the top plate, so that the limit card block is connected to the inner wall of the top of the limit groove to fix it. When disassembling, the top plate is rotated to take the limit card block out of the limit groove, so as to realize disassembly and avoid wasting the time of the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0022] Figure 2 It is a schematic diagram of the three-dimensional structure of the substrate of the present invention.

[0023] Figure 3 It is a front cross-sectional structural schematic diagram of the present invention.

[0024] Figure 4 It is a schematic diagram of the side sectional structure of the present invention.

[0025] Figure 5 It is a schematic diagram of the cross-sectional structure of the connecting rod of the present invention.

[0026] In the figure: 1. first packaging substrate; 2. limiting column; 3. second packaging substrate; 4. top plate; 5. connecting rod; 6. square groove; 7. limiting groove; 8. limiting block; 9. cross groove; 10. coated copper sheet; 11. PCB board; 12. first connecting block; 13. second connecting block; 14. PIN needle; 15. first limiting block; 16. second limiting block; 17. insulating glue. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] The present invention provides Figure 1-5 The structure shown in the figure is a semiconductor wafer and transformer sealed structure, including a first packaging substrate 1, a second packaging substrate 3 is fixedly connected to the top of the first packaging substrate 1, a limiting column 2 is arranged on the top of the second packaging substrate 3, a transmission component is arranged between the first packaging substrate 1 and the limiting column 2, and a clamping component for fixing the position of the limiting column 2 is arranged at the connection between the limiting column 2 and the second packaging substrate 3, the clamping component includes a top plate 4 rotatably inserted and connected to the top of the limiting column 2, a connecting rod 5 is fixedly connected to the bottom of the top plate 4, and a limiting clamping block 8 is fixedly connected to the bottom of the connecting rod 5, a square groove 6 is opened on the top of the second packaging substrate 3, and a limiting groove 7 is opened on the inner wall of the bottom end of the square groove 6, and the limiting clamping block 8 is clamped at the bottom of the limiting groove 7.

[0029] It should be noted that the cross-section of the square groove 6 is larger than the cross-section of the limit block 8, so that the limit block 8 can slide in the square groove 6. The cross-section of the limit groove 7 is circular. When the limit block 8 rotates inside the limit groove 7, the limit block 8 is clamped by the limit groove 7.

[0030] Furthermore, when installing the first packaging substrate 1 and the second packaging substrate 3, the limit block 8 at the bottom of the connecting rod 5 is inserted into the square groove 6 to reach the limit groove 7, and then the top plate 4 is rotated to drive the connecting rod 5 and the limit block 8 to rotate in the limit groove 7 through the top plate 4, so that the limit block 8 is clamped on the inner wall at the top of the limit groove 7 to fix it. When disassembling, the top plate 4 is rotated to take the limit block 8 out of the limit groove 7, thereby realizing disassembly and avoiding wasting the staff's time.

[0031] Specifically, the connecting rod 5 is slidably inserted and connected to the bottom of the limiting column 2 , and the connecting rod 5 is slidably inserted and connected to the inside of the square groove 6 .

[0032] It should be noted that the limit block 8 is connected to the top plate 4 via a connecting rod 5 .

[0033] Specifically, a cross slot 9 for rotating the top plate 4 is formed on the top of the top plate 4 .

[0034] Furthermore, by inserting a cross cutter into the cross slot 9 and rotating the cross cutter, the top plate 4 is driven to rotate through the cross slot 9, thereby driving the connecting rod 5 to rotate through the top plate 4, and the connecting rod 5 drives the limiting block 8 to rotate inside the limiting slot 7.

[0035] Specifically, the transmission component includes a coated copper sheet 10 arranged at the bottom of the limit column 2, a PCB board 11 is arranged on the top of the first packaging substrate 1, the PCB board 11 is arranged at the bottom of the coated copper sheet 10, the second packaging substrate 3 is inserted and connected in the middle of the coated copper sheet 10, and the second packaging substrate 3 is inserted and connected in the middle of the PCB board 11.

[0036] It should be noted that the PCB board 11 is a printed circuit board. The circuit on the PCB board is made of semiconductor wafers, thereby avoiding the need for SMT patches after the circuit is made of traditional resistors and capacitors, thereby reducing the thermal resistance of the semiconductor chip. It is also called a printed circuit board. The PCB board 11 is a support for electronic components, and the PCB board 11 is also a carrier for the electrical connection of electronic components. The PCB board 11 can provide mechanical support for the fixed assembly of various components, and realize the wiring, electrical connection and electrical insulation between electronic components; the coated copper sheet 10 is a substrate material in the manufacture of printed circuit boards, and has the functions of interconnection, insulation and support in the printed circuit board, and has a great influence on the signal transmission speed, energy loss and characteristic impedance in the circuit, so the various performances of the PCB board 11 depend to a large extent on the coated copper sheet 10.

[0037] Specifically, first connection blocks 12 are disposed on both sides of the coated copper sheet 10 , and second connection blocks 13 are disposed on both sides of the PCB board 11 .

[0038] Specifically, the middle parts of the plurality of first connection blocks 12 are sleeved with PIN needles 14 , and the plurality of PIN needles 14 are respectively inserted and connected to the middle parts of the plurality of second connection blocks 13 .

[0039] It should be noted that, in this configuration, the coated copper sheet 10 is connected to the PCB board 11 via the PIN pin 14 .

[0040] Specifically, the front and back sides of the top of the first packaging substrate 1 are fixedly connected with the first limit blocks 15, the coated copper sheet 10 is arranged on the opposite side of the two first limit blocks 15, the front and back sides of the bottom of the limit column 2 are fixedly connected with the second limit blocks 16, and the PCB board 11 is arranged on the opposite side of the two second limit blocks 16.

[0041] Specifically, a supporting groove is formed on one side opposite to the two first limiting blocks 15 , and the two second limiting blocks 16 are respectively disposed on the top of the two supporting grooves.

[0042] It should be noted that the second packaging substrate 3 is clamped in the supporting groove on the first limiting block 15 through the second limiting block 16 .

[0043] Specifically, the outer walls of the first packaging substrate 1 and the limiting pillars 2 are both covered with insulating tape 17 .

[0044] It should be noted that the winding insulating tape 17 is used to prevent the transformer frame edge from scratching the transformer winding wire in the future; it can also increase the winding density, enhance the stability of the winding, enhance the insulation strength between the windings, and enhance heat dissipation.

[0045] A method for installing a structure in which a semiconductor wafer and a transformer are sealed together includes the following steps:

[0046] The first step is to sleeve the coated copper sheet 10 and the PCB board 11 on the middle part of the second packaging substrate 3;

[0047] The second step is to insert the limit block 8 into the interior of the square groove 6 until the limit block 8 enters the limit groove 7;

[0048] The third step is to take out the cross knife and insert it into the cross slot 9, rotate the cross knife, drive the top plate 4 to rotate through the cross slot 9, and then drive the connecting rod 5 to rotate through the top plate 4, and the connecting rod 5 drives the limit block 8 to rotate inside the limit slot 7, so that the limit block 8 is clamped inside the limit slot 7, and the limit column 2 is clamped on the top of the second packaging substrate 3 through the limit block 8.

[0049] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A structure for sealing a semiconductor wafer and a transformer, comprising a first packaging substrate (1), the top of the first packaging substrate (1) being fixedly connected to a second packaging substrate (3), the top of the second packaging substrate (3) being provided with a limiting column (2), characterized in that: A transmission component is provided between the first packaging substrate (1) and the limiting column (2); a clamping component for fixing the position of the limiting column (2) is provided at the connection between the limiting column (2) and the second packaging substrate (3); the clamping component comprises a top plate (4) rotatably inserted and connected to the top of the limiting column (2); a connecting rod (5) is fixedly connected to the bottom of the top plate (4); a limiting clamping block (8) is fixedly connected to the bottom of the connecting rod (5); a square groove (6) is provided on the top of the second packaging substrate (3); a limiting groove (7) is provided on the inner wall at the bottom end of the square groove (6); and the limiting clamping block (8) is clamped to the bottom of the limiting groove (7).

2. The structure of semiconductor wafer and transformer sealing according to claim 1, characterized in that: The connecting rod (5) is slidably inserted and connected to the bottom of the limiting column (2), and the connecting rod (5) is slidably inserted and connected to the inside of the square groove (6).

3. The structure of semiconductor wafer and transformer sealing according to claim 1, characterized in that: A cross groove (9) for rotating the top plate (4) is provided on the top of the top plate (4).

4. The structure of semiconductor wafer and transformer sealing according to claim 1, characterized in that: The transmission component comprises a coated copper sheet (10) arranged at the bottom of the limiting column (2); a PCB board (11) is arranged on the top of the first packaging substrate (1); the PCB board (11) is arranged at the bottom of the coated copper sheet (10); the second packaging substrate (3) is inserted and connected in the middle of the coated copper sheet (10); and the second packaging substrate (3) is inserted and connected in the middle of the PCB board (11).

5. The structure of semiconductor wafer and transformer sealing according to claim 4, characterized in that: First connection blocks (12) are provided on both sides of the coated copper sheet (10), and second connection blocks (13) are provided on both sides of the PCB board (11).

6. The structure of semiconductor wafer and transformer sealing according to claim 1, characterized in that: The middle parts of the plurality of first connection blocks (12) are sleeved with PIN needles (14), and the plurality of PIN needles (14) are respectively inserted and connected to the middle parts of the plurality of second connection blocks (13).

7. The structure of semiconductor wafer and transformer sealing according to claim 4, characterized in that: The front and back sides of the top of the first packaging substrate (1) are both fixedly connected with first limit blocks (15), the coated copper sheet (10) is arranged on opposite sides of the two first limit blocks (15), the front and back sides of the bottom of the limit column (2) are both fixedly connected with second limit blocks (16), and the PCB board (11) is arranged on opposite sides of the two second limit blocks (16).

8. The structure of semiconductor wafer and transformer sealing according to claim 7, characterized in that: The two first limit blocks (15) are each provided with a supporting groove on one side opposite to the other, and the two second limit blocks (16) are respectively arranged on the top of the two supporting grooves.

9. The structure of semiconductor wafer and transformer sealing according to claim 1, characterized in that: The outer walls of the first packaging substrate (1) and the limiting pillar (2) are both covered with insulating tape (17).

10. A method for installing a structure in which a semiconductor wafer and a transformer are sealed together, characterized in that: The sealing structure according to any one of claims 1 to 9 is included, and the installation method comprises the following steps: The first step is to sleeve the coated copper sheet (10) and the PCB board (11) on the middle part of the second packaging substrate (3); The second step is to insert the limit block (8) into the interior of the square groove (6) until the limit block (8) enters the limit groove (7); The third step is to take out the cross-shaped knife and insert it into the cross groove (9), rotate the cross-shaped knife, and drive the top plate (4) to rotate through the cross groove (9), thereby driving the connecting rod (5) to rotate through the top plate (4), and the connecting rod (5) drives the limit clamping block (8) to rotate inside the limit groove (7), so that the limit clamping block (8) is clamped inside the limit groove (7), and the limit column (2) is clamped on the top of the second packaging substrate (3) through the limit clamping block (8).

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