Radio frequency device and semiconductor coating equipment

Abstract

The invention provides a radio frequency device and semiconductor coating equipment, the radio frequency device comprises a radio frequency connecting rod and a radio frequency filter, the radio frequency filter comprises a connecting piece and a bottom plate, the connecting piece comprises a connecting part, an elastic part and a supporting part fixedly connected with the bottom plate, the top end of the connecting part is fixedly connected with the radio frequency connecting rod, the connecting part and the supporting part are arranged in a spaced mode, the two ends of the elastic part are connected with the connecting part and the supporting part respectively, and the elastic part is used for releasing stress of the radio frequency connecting rod. The connecting part of the connecting piece is fixedly connected with the radio frequency connecting rod, the supporting part supports the connecting part and the elastic part, the elastic part is connected with the connecting part and the supporting part, and the stress of the radio frequency connecting rod is released through the elastic effect of the elastic part. Therefore, the damage rate of the radio frequency connecting rod is reduced, and the service life is prolonged.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor production, and in particular to a radio frequency device and semiconductor coating equipment. Background Art

[0002] Semiconductor coating technology is a key technology for forming thin films with specific functions on the surface of semiconductors. This process is usually carried out in a vacuum environment. Metals, non-metals or other compound materials are deposited in the form of gas phase on the surface of semiconductor materials by physical or chemical methods to form a dense film. These films play a vital role in the manufacturing process of semiconductor devices and play a decisive role in the performance, structural integrity, miniaturization and integration of the devices.

[0003] Current semiconductor coating equipment is mainly divided into two categories: physical vapor deposition (PVD) and chemical vapor deposition (CVD). In CVD technology, especially plasma enhanced chemical vapor deposition (PECVD) technology, radio frequency is used to generate plasma to excite chemical sources. At this stage, RF connecting rods are generally fixedly connected to RF filters by direct insertion and hard connection. However, RF connecting rods will deform under the influence of thermal expansion and contraction. Direct insertion and hard connection will cause the stress of RF connecting rods to be unable to be released, which will easily cause the root of RF connecting rods to be damaged by force, affecting the service life of the equipment. Summary of the invention

[0004] The embodiments of the present invention provide a radio frequency device and a semiconductor coating device to release the stress of a radio frequency connecting rod, reduce the damage rate of the radio frequency connecting rod, and increase the service life.

[0005] The present invention provides a radio frequency device, comprising:

[0006] RF connecting rod;

[0007] A radio frequency filter comprises a connector and a base plate, wherein the connector comprises a connecting portion, an elastic portion and a supporting portion fixedly connected to the base plate, the top end of the connecting portion is fixedly connected to the radio frequency connecting rod, the connecting portion and the supporting portion are spaced apart, and two ends of the elastic portion are respectively connected to the connecting portion and the supporting portion, and the elastic portion is used to release the stress of the radio frequency connecting rod.

[0008] In the radio frequency device provided by the present invention, the radio frequency device also includes a support rod, one end of which is adjustably connected to the base plate, and the other end of which extends toward the connecting portion; wherein the support rod is adjusted upward to lift the connecting portion.

[0009] In the radio frequency device provided by the present invention, the bottom end of the connecting portion is provided with an upwardly recessed receiving groove, one end of the support rod is located in the receiving groove, and when the support rod is lifted upward, the support rod abuts against the receiving groove.

[0010] In the radio frequency device provided by the present invention, the bottom plate is provided with a support block, the support block is protruding upward, a fixing hole is provided at the top end of the support block, and the fixing hole is adjustably connected to one end of the support rod.

[0011] In the radio frequency device provided by the present invention, the fixing hole and the support rod are threadedly connected.

[0012] In the radio frequency device provided by the present invention, the support rod is made of insulating material.

[0013] In the radio frequency device provided by the present invention, the elastic part is a spring sheet, and the two ends of the spring sheet are respectively fixedly connected to the connecting part and the supporting part. A protrusion is provided in the middle of the spring sheet, and the protrusion protrudes outward in a direction away from the central plane of the connecting part.

[0014] In the radio frequency device provided by the present invention, the spring piece is made of beryllium copper.

[0015] In the radio frequency device provided by the present invention, the outer side of the spring sheet is plated with a conductive layer, and the conductive layer is used to conduct radio frequency current.

[0016] The present invention also provides a semiconductor coating device, which includes any of the above-mentioned radio frequency devices.

[0017] In the present application, the RF connecting rod is fixedly connected through the connecting part of the connecting piece, the supporting part supports the connecting part and the elastic part, the elastic part connects the connecting part and the supporting part, and the stress of the RF connecting rod is released through the elastic action of the elastic part, thereby reducing the damage rate of the RF connecting rod and increasing the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0019] Figure 1 is a structural diagram of a radio frequency device in an embodiment of the present invention;

[0020] Figure 2 is a cross-sectional view of a radio frequency device according to an embodiment of the present invention;

[0021] Figure 3 A structural diagram of a semiconductor coating device according to an embodiment of the present invention;

[0022] Figure 4 is a cross-sectional view of a semiconductor coating device according to an embodiment of the present invention;

[0023] Figure 5 Another cross-sectional view of the semiconductor coating device in the embodiment of the present invention.

[0024] The reference numerals in the figures are:

[0025] 1. RF device; 10. RF connecting rod; 20. RF filter; 21. Connector; 211. Connecting part; 2111. Accommodating groove; 212. Elastic part; 2121. Protruding part; 213. Support part; 22. Bottom plate; 221. Support block; 2211. Fixing hole; 30. Support rod. DETAILED DESCRIPTION

[0026] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. Now, in conjunction with the accompanying drawings, the preferred embodiments of the present invention are described in detail.

[0027] Reference Figures 1 to 5 As shown, it shows an embodiment of the radio frequency device 1 and semiconductor coating equipment of the present invention. The radio frequency device 1 includes a radio frequency connecting rod 10 and a radio frequency filter 20, and the radio frequency filter 20 includes a connecting member 21 and a bottom plate 22. The connecting member 21 includes a connecting portion 211, an elastic portion 212, and a supporting portion 213 fixedly connected to the bottom plate 22. The top of the connecting portion 211 is fixedly connected to the radio frequency connecting rod 10, and the connecting portion 211 and the supporting portion 213 are spaced apart, and the two ends of the elastic portion 212 are respectively connected to the connecting portion 211 and the supporting portion 213, and the elastic portion 212 is used to release the stress of the radio frequency connecting rod 10.

[0028] Specifically, in semiconductor production equipment, especially in the coating stage, the heating plate heats the wafer so that the reaction gas forms a thin film on the surface of the wafer. Heating wires, RF electrode nets and other structural parts are buried inside the heating plate, which are extended to the bottom of the heating plate in the form of rods, that is, through the RF connecting rod 10, the upper end of the RF connecting rod 10 is connected to the internal RF electrode net of the heating plate; the lower end of the RF connecting rod 10 is connected to the RF filter 20 in a plug-in manner, and the bottom of the RF filter 20 is connected to the RF impedance regulator. The bottom of the heating plate is connected to the RF filter 20 in a plug-in manner, thereby realizing that the current and RF can be extended outside the cavity, which is convenient for processing the circuit. The RF connecting rod 10 is easily deformed and thus stress occurs due to the influence of thermal expansion and contraction. If the stress is not released in time, it is easy to cause the damage of the RF connecting rod 10.

[0029] The present invention provides a radio frequency device 1, which is used in semiconductor coating equipment to release the stress generated by the radio frequency connecting rod 10; the radio frequency device 1 includes a radio frequency connecting rod 10 and a radio frequency filter 20, and the bottom end of the radio frequency connecting rod 10 is plugged into the radio frequency connector to extend the current and radio frequency outside the cavity, which is convenient for processing the circuit. The radio frequency filter 20 includes a connector 21 and a bottom plate 22, and the bottom plate 22 is used to support other structural parts of the radio frequency filter 20, and the connector 21 is fixedly arranged above the bottom plate 22, and the top of the connector 21 is fixedly connected to the radio frequency heating rod; the connector 21 includes a connecting part 211, an elastic part 212 and a supporting part 213, and the supporting part 213 is fixedly connected to the bottom plate 22, that is, the supporting part 213 is fixedly fixed above the bottom plate 22, and is used to support the elastic part 212 and the connecting part 211 and other structural parts; the top of the connecting part 211 is connected to the radio frequency heating rod. The RF connecting rod 10 is fixedly connected, and the connecting part 211 and the supporting part 213 are arranged at intervals, and the connecting part 211 is used to fix the RF connecting rod 10; the connecting part 211 and the supporting part 213 are connected by the elastic part 212, that is, the two ends of the elastic part 212 are respectively connected to the connecting part 211 and the supporting part 213, and the elastic part 212 is elastic and is used to release the stress of the RF connecting rod 10; when the semiconductor coating equipment is working, the RF connecting rod 10 generates stress, and the stress is guided to the connecting part 211 until it is released at the elastic part 212.

[0030] In the present application, the RF connecting rod 10 is fixedly connected by the connecting portion 211 of the connecting piece 21, the supporting portion 213 supports the connecting portion 211 and the elastic portion 212, the elastic portion 212 connects the connecting portion 211 and the supporting portion 213, and the stress of the RF connecting rod 10 is released through the elastic action of the elastic portion 212, thereby reducing the damage rate of the RF connecting rod 10 and improving the service life.

[0031] In one embodiment, referring to Figures 1 to 4As shown, the RF device 1 also includes a support rod 30, one end of which is adjustably connected to the bottom plate 22, and the other end extends in the direction of the connecting portion 211; wherein, the support rod 30 is adjusted upward to lift the connecting portion 211. Specifically, the connecting member 21 is fixed to the RF connecting rod 10 in a plug-in manner, one end of the connecting member 21 is located in the internal space of the machine of the RF filter 20, and the other end passes through the machine of the RF filter 20 and is located above the RF filter 20, and is connected to the heating plate; one end of the connecting portion 211 of the connecting member 21 is located in the internal space of the machine of the RF filter 20, and the other end passes through the top end of the machine of the RF filter 20 and is located above the machine of the RF filter 20, the top end of the connecting portion 211 is plug-fixed with the RF connecting rod 10, the bottom end of the connecting portion 211 is fixedly connected to the elastic portion 212, and the connecting portion 211 The RF device 1 is spaced apart from the support portion 213. To ensure that the top end of the connection portion 211 can be plugged and fixed with the RF connection rod 10, the RF device 1 also includes a support rod 30. The support rod 30 is used to lift the connection portion 211 upward from the bottom end of the connection portion 211 so that the connection portion 211 moves upward, thereby allowing the top end of the connection portion 211 to be plugged and fixed with the RF connection rod 10; one end of the support rod 30 is adjustably connected to the bottom plate 22, and the other end is extended in the direction of the connection portion 211, that is, the support rod 30 is fixed on the bottom plate 22 and adjustably connected to the bottom plate 22, so that the height of the support rod 30 can be adjusted.

[0032] Among them, when assembling the connecting part 211 and the RF connecting rod 10, the support rod 30 is adjusted upward so that the top end of the support rod 30 abuts against the bottom end of the connecting part 211, and the connecting part 211 is lifted upward so that the connecting part 211 moves upward, that is, the connecting part 211 moves toward the direction of the RF connecting rod 10, so that the top end of the connecting part 211 is plugged and fixed with the RF connecting rod 10; after the assembly is completed, the support rod 30 is adjusted downward so that the top end of the support rod 30 does not abut against the bottom end of the connecting part 211, so that the support rod 30 does not apply a force to the connecting part 211. At this time, the connecting part 211 is fixedly connected to the supporting part 213 only through the elastic part 212, that is, the connecting part 211 is supported only by the elastic part 212 and the supporting part 213, so as to ensure that the stress generated by the RF connecting rod 10 can only flow from the connecting part 211 to the elastic part 212 and be released on the elastic part 212.

[0033] In this embodiment, the support rod 30 is moved upward to fix the connection between the connecting portion 211 and the RF connecting rod 10. After fixation, the support rod 30 is moved downward to ensure that the connecting portion 211 is only connected to the elastic portion 212 on the supporting portion 213, so that all stress is released on the elastic portion 212. The RF device 1 is easy to assemble, has high assembly efficiency, good stress release effect, and high structural stability.

[0034] In a specific embodiment, refer to Figure 2 and Figure 4 As shown, the bottom end of the connecting portion 211 is provided with an upwardly recessed receiving groove 2111, one end of the support rod 30 is located in the receiving groove 2111, and when the support rod 30 is lifted upward, the support rod 30 abuts against the receiving groove 2111. Specifically, the bottom end of the support rod 30 is connected to the bottom plate 22, and the support rod 30 can move up and down relative to the bottom plate 22, and when the support rod 30 is lifted upward, it abuts against the bottom end of the connecting portion 211, thereby lifting the connecting portion 211, and a receiving groove 2111 is provided at the bottom end of the connecting portion 211, and the receiving groove 2111 is formed by the bottom end of the connecting portion 211 being recessed downward, and the receiving groove 2111 is used to accommodate the support rod 30, so that one end of the support rod 30 is connected to the bottom plate 22, and the other end extends into the receiving groove 2111, and when the support rod 30 is lifted upward, the support rod 30 abuts against the receiving groove 21 11, thereby applying an upward force to the connecting portion 211, so that the connecting portion 211 moves upward and then plugs into the RF connecting rod 10; but in a normal state, that is, after the connecting portion 211 and the RF connecting rod 10 are assembled, the support rod 30 needs to be adjusted downward, so that although one end of the support rod 30 is located in the accommodating groove 2111, it does not abut against the groove wall of the accommodating groove 2111, so that the support rod 30 does not apply a force to the connecting portion 211, and has no connection relationship with the connecting portion 211, so as to ensure that the stress of the RF connecting rod 10 is transferred to the connecting portion 211 and then flows to the elastic portion 212 to be released.

[0035] The accommodating groove 2111 limits one end of the support rod 30 therein, thereby ensuring that the support rod 30 is vertically located between the connecting portion 211 and the base plate 22, preventing the support rod 30 from directly falling off when it is separated from the base plate 22, thereby improving the structural stability of the radio frequency device 1, and the accommodating groove 2111 can ensure the direction of the support rod 30 when it moves up and down, preventing the support rod 30 from deviating from the movement direction.

[0036] In one embodiment, referring to Figures 1 to 5As shown, the bottom plate 22 is provided with a support block 221, and the support block 221 is protruding upward. A fixing hole 2211 is provided at the top of the support block 221, and the fixing hole 2211 is adjustably connected to one end of the support rod 30. Specifically, the base plate 22 is provided with a support block 221, and the support block 221 is protruding upward from the upper surface of the base plate 22, and the support block 221 is used to support the support rod 30 and the support portion 213. The top of the support block 221 is provided with a fixing hole 2211, and the fixing hole 2211 is formed by the top of the support block 221 being recessed downward, and the fixing hole 2211 is adjustably connected to one end of the support rod 30, and the other end of the support rod 30 is located in the accommodating cavity, so the fixing hole 2211 and the accommodating cavity jointly limit the support rod 30 between the connecting portion 211 and the support block 221, thereby ensuring the movement direction of the support rod 30 and improving the stability of the connection between the support rod 30 and the base plate 22.

[0037] More specifically, the support portion 213 is fixed on the support block 221 and is disposed adjacent to the fixing hole 2211 to improve the structural stability of the radio frequency device 1 .

[0038] In a specific embodiment, the fixing hole 2211 and the support rod 30 are threadedly connected (not shown in the figure). Specifically, a thread is provided on the hole wall of the fixing hole 2211, and a thread is provided at the bottom end of the support rod 30 along its height direction. Through the threaded connection between the support rod 30 and the fixing hole 2211, the support rod 30 can be adjustably fixed on the support block 221, so that the support rod 30 is rotated downward to realize the upward lifting of the connecting portion 211, so that the connecting portion 211 is plugged and fixed with the RF connecting rod 10, and then the support rod 30 is rotated downward so that the support rod 30 does not abut against the connecting portion 211. The support rod 30 is fixed on the bottom plate 22 by the connection with the fixing hole 2211, thereby ensuring the stability of the support rod 30 and improving the stress release effect. The adjustment method of the support rod 30 is simple and the operation efficiency is high.

[0039] In one embodiment, the support rod 30 is made of insulating material. Specifically, the support rod 30 is only used to support the connecting portion 211, and the connecting portion 211 is plugged and fixed with the RF connecting rod 10 when the RF device 1 is assembled; the support rod 30 is made of insulating material, that is, the support rod 30 is an insulating part, so as to ensure the safety during assembly and avoid conduction; at the same time, when the device is working, it is ensured that the current, radio frequency, etc. all flow from the connecting portion 211 to the elastic portion 212 and then to the supporting portion 213 to avoid affecting the operation of the device.

[0040] In a specific embodiment, refer to Figures 1 to 5 As shown, the elastic part 212 is a spring sheet, and the two ends of the spring sheet are respectively fixedly connected to the connecting part 211 and the supporting part 213, and a protrusion 2121 is provided in the middle of the spring sheet, and the protrusion 2121 is formed to protrude outward in a direction away from the central plane of the connecting part 211. Specifically, the elastic part 212 is a spring sheet, and the spring sheet has elasticity, and the two ends of the spring sheet are respectively fixedly connected to the connecting part 211 and the supporting part 213, and a protrusion 2121 is provided in the middle of the spring sheet, and the protrusion 2121 is formed to protrude outward in a direction away from the central plane of the connecting part 211, and the central plane of the connecting part 211 refers to a plane formed by the central position of the connecting part 211 along its height direction, so the protrusion 2121 protrudes outward on one side of the connecting part 211, that is, the structure of the spring sheet is a "C"-shaped structure, thereby improving the elastic effect of the spring sheet and improving the degree and efficiency of stress release.

[0041] More specifically, the connecting portion 211 and the supporting portion 213 are relatively arranged on both sides of the RF filter 20, and the spring pieces protrude from the connecting portion 211 and the supporting portion 213 in the middle, that is, the spring pieces are located on one side of the connecting portion 211 and the supporting portion 213 to improve the stress release effect.

[0042] In one embodiment, the shrapnel is made of beryllium copper. Specifically, beryllium copper is a supersaturated solid solution copper-based alloy, which is a good combination of mechanical properties, physical properties, chemical properties and corrosion resistance, and the strength limit, elastic limit, yield limit and fatigue limit of beryllium copper can reach the same level as special steel, and it also has high electrical conductivity, high thermal conductivity, high hardness and wear resistance, as well as high creep resistance and corrosion resistance. Therefore, in this embodiment, the shrapnel is made of beryllium copper, so that the shrapnel can better release the stress generated by the RF connecting rod 10, improve the release effect, reduce the damage of the RF connecting rod 10, and increase the service life.

[0043] In a specific embodiment, the outer side of the spring sheet is plated with a conductive layer, and the conductive layer is used to guide the RF current. Specifically, the RF current of the RF connecting rod 10 flows to the spring sheet through the connecting portion 211. In order to improve the conductivity of the spring sheet, a conductive layer is plated on the outer side of the spring sheet, thereby better guiding the RF current from the supporting portion 213 to the RF impedance adjuster.

[0044] In this embodiment, the conductive layer is made of silver, and the silver is plated on the outside of the shrapnel, so that beryllium copper is used inside the shrapnel material to play a role of mechanical support and rebound, while silver is plated outside to conduct radio frequency current and improve conductivity.

[0045] In one embodiment, an anti-oxidation layer is plated on the outer side of the conductive layer, and the anti-oxidation layer is used to prevent the shrapnel from being oxidized. Specifically, an anti-oxidation layer is plated on the outer side of the conductive layer, and the anti-oxidation layer is used to prevent the shrapnel from being oxidized, so as to increase the service life of the shrapnel.

[0046] In this embodiment, the anti-oxidation layer is plated on the outer side of the conductive layer by gold plating, thereby preventing oxidation.

[0047] Reference Figures 3 to 5 As shown, this embodiment also provides a semiconductor coating device, which includes a radio frequency device 1. The radio frequency device 1 can adopt any radio frequency device 1 provided by the present invention. Since the previous specification has already made a detailed introduction to the specific structure and working principle of the radio frequency device 1, it will not be repeated here for the sake of brevity of the specification.

[0048] The semiconductor coating equipment in this embodiment adopts the RF device 1 provided by the present invention, so the stress generated by the RF connecting rod 10 can be released on the elastic part 212 to avoid damage to the RF connecting rod 10, thereby increasing the service life of the semiconductor coating equipment.

[0049] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A radio frequency device, characterized in that: include: RF connecting rod; A radio frequency filter comprises a connector and a base plate, wherein the connector comprises a connecting portion, an elastic portion and a supporting portion fixedly connected to the base plate, the top end of the connecting portion is fixedly connected to the radio frequency connecting rod, the connecting portion and the supporting portion are spaced apart, and two ends of the elastic portion are respectively connected to the connecting portion and the supporting portion, and the elastic portion is used to release the stress of the radio frequency connecting rod.

2. The radio frequency device according to claim 1, characterized in that: The radio frequency device further comprises a support rod, one end of which is adjustably connected to the bottom plate, and the other end of which extends toward the connecting portion; wherein the support rod is adjusted upward to lift the connecting portion.

3. The radio frequency device according to claim 2, characterized in that: The bottom end of the connecting portion is provided with an upwardly recessed receiving groove, one end of the support rod is located in the receiving groove, and when the support rod is lifted upward, the support rod abuts against the receiving groove.

4. The radio frequency device according to claim 2, characterized in that: The bottom plate is provided with a support block, which is protruding upwards. The top of the support block is provided with a fixing hole, and the fixing hole is adjustably connected to one end of the support rod.

5. The radio frequency device according to claim 4, characterized in that: The fixing hole and the supporting rod are threadedly connected.

6. The radio frequency device according to any one of claims 2 to 5, characterized in that: The support rod is made of insulating material.

7. The radio frequency device according to claim 1, characterized in that: The elastic part is a spring sheet, and two ends of the spring sheet are respectively fixedly connected to the connecting part and the supporting part. A protrusion is provided in the middle of the spring sheet, and the protrusion is formed to protrude outward in a direction away from the central plane of the connecting part.

8. The radio frequency device according to claim 7, characterized in that: The shrapnel is made of beryllium copper.

9. The radio frequency device according to claim 7, characterized in that: The outer side of the spring sheet is plated with a conductive layer, and the conductive layer is used to conduct radio frequency current.

10. A semiconductor coating device, characterized in that: A radio frequency device comprising any one of claims 1 to 9.

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