End effector and system for processing workpiece

Abstract

There is provided a system for processing a workpiece, comprising: a front end portion; a load lock chamber; one or more processing chambers; at least one transfer chamber; and a storage chamber; one or more workpiece handling robots disposed in the at least one transfer chamber, the one or more workpiece handling robots configured to move the one or more replaceable components between the storage chamber and the one or more processing chambers, where the one or more workpiece handling robots include an end effector configured to move the one or more replaceable components between the storage chamber and the one or more processing chambers; the end effector is configured to support the replaceable component; and a controller configured to control movement of the end effector to approach the processing station in accordance with a robotic arm movement pattern, the robotic arm motion pattern includes extending a first period of time in a first direction, extending a second period of time in a second direction transverse to the first direction, and extending a third period of time in a third direction different from the first and second directions.

Description

[0001] This application is a divisional application of the Chinese application entitled “End effector and system for processing workpieces”, filed on May 13, 2020, with application number 202210475606.5. The Chinese application with application number 202210475606.5 is a divisional application of the Chinese application entitled “Plasma processing equipment with focusing ring adjustment component”, filed on May 13, 2020, with application number 202080004153.7. Technical Field

[0002] The present disclosure relates generally to processing workpieces, and more particularly to end effectors for moving workpieces and replaceable components within a system for processing a workpiece and a system for processing a workpiece. Background Art

[0003] A processing system that exposes a workpiece (e.g., a semiconductor wafer or other suitable substrate) to an overall processing scheme for forming a semiconductor device or other device may perform multiple processing steps, such as plasma processing (e.g., stripping, etching, etc.), thermal processing (e.g., annealing), deposition (e.g., chemical vapor deposition), etc. To perform these processing steps, the system may include one or more robots that move the workpiece multiple times at different times, such as into the system, between various processing chambers, and out of the system. In the processing of semiconductor workpieces, it may sometimes be necessary to perform routine maintenance and / or preventive maintenance on the processing system. In some cases, this may require physical replacement of certain components in the processing system. Summary of the invention

[0004] Various aspects and advantages of the embodiments of the present disclosure will be set forth in the following description, or may be learned from the description, or may be learned through practice of the present disclosure.

[0005] An exemplary embodiment of the present disclosure relates to a system for processing a workpiece, comprising: a front end portion configured to be maintained at atmospheric pressure; a loading lock chamber disposed between the front end portion and a vacuum portion; one or more processing chambers disposed in the vacuum portion, each processing chamber comprising two or more processing stations; at least one transfer chamber disposed in the vacuum portion; and, a storage chamber configured to store one or more replaceable components, coupled to at least one transfer chamber; one or more workpiece handling robots disposed in at least one transfer chamber, the one or more workpiece handling robots configured to move one or more replaceable components between the storage chamber and the one or more processing chambers, wherein the one or more workpiece handling robots include an end effector configured to support the replaceable components; a controller configured to control the movement of the end effector to approach the processing station according to a robot arm motion mode, wherein the robot arm motion mode includes extending a first time period in a first direction, extending a second time period in a second direction transverse to the first direction, and extending a third time period in a third direction different from the first direction and the second direction.

[0006] Other exemplary aspects relate to systems and methods for processing a workpiece.Variations and modifications may be made to the exemplary aspects of the present disclosure.

[0007] These and other features, aspects and advantages of various embodiments will be better understood with reference to the following description and appended claims.The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain relevant principles. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] A detailed discussion of embodiments for one of ordinary skill in the art is set forth in the specification, which refers to the accompanying drawings, in which:

[0009] Figure 1 depicts a plan view of an example processing system according to an exemplary embodiment of the present disclosure;

[0010] Figure 2 depicts a plan view of an example processing system according to an exemplary embodiment of the present disclosure;

[0011] Figure 3 depicts a plan view of an example processing system according to an exemplary embodiment of the present disclosure;

[0012] Figure 4 depicts example transfer locations according to exemplary embodiments of the present disclosure;

[0013] Figure 5 depicts an example workpiece column according to an exemplary embodiment of the present disclosure;

[0014] Figure 6 depicts an example robotic arm motion pattern according to an exemplary embodiment of the present disclosure;

[0015] Figure 7 An example flow chart depicting an example method according to an exemplary embodiment of the present disclosure;

[0016] Figure 8 An example flow chart depicting an example method according to an exemplary embodiment of the present disclosure;

[0017] Fig. 9 depicts a perspective view of an example end effector according to an exemplary embodiment of the present disclosure;

[0018] Fig. 10A Depicted is an exemplary embodiment according to the present disclosure Fig. 9 a perspective view of a first configuration of a support element on an end effector for supporting an example workpiece and a focus ring;

[0019] Fig. 10B Depicted is an exemplary embodiment of the present disclosure. Fig. 10A A side view of a support element on an end effector shown in ;

[0020] Fig.11A Depicted is an exemplary embodiment according to the present disclosure Fig. 9 a perspective view of a second configuration of a support element on an end effector for supporting an exemplary workpiece and a focus ring;

[0021] Fig. 11B Depicted is an exemplary embodiment of the present disclosure. Fig.11A A side view of a support element on an end effector shown in ;

[0022] Fig. 12A Depicted is an exemplary embodiment according to the present disclosure Fig. 9 A partial perspective view of a third configuration of a support element on an end effector for supporting an example workpiece and a focus ring;

[0023] Fig. 12B Depicted is an exemplary embodiment of the present disclosure. Fig. 12A A side view of a support element on an end effector shown in ;

[0024] Fig.13 depicts a perspective view of a focus ring adjustment assembly of an example processing system according to an exemplary embodiment of the present disclosure;

[0025] Fig.14A Depicted is an exemplary embodiment according to the present disclosure Fig.13 a side cross-sectional view of the adjustment assembly shown with the focus ring in a lowered position;

[0026] Fig. 14B Depicted is an exemplary embodiment according to the present disclosure Fig.13 a side cross-sectional view of the adjustment assembly shown with the focus ring in a raised position;

[0027] Fig.15A Depicted is a method for communicating with an exemplary embodiment according to the present disclosure. Fig.13 A cross-sectional view of a first embodiment of a focus ring for use with the adjustment assembly shown;

[0028] Fig. 15B Depicted is a method for communicating with an exemplary embodiment according to the present disclosure. Fig.13 A cross-sectional view of a second embodiment of a focus ring for use with the adjustment assembly shown;

[0029] Fig.16 Depicted is an exemplary embodiment according to the present disclosure Figures 14A-14B A top view of a pin support plate of the adjustment assembly shown in ;

[0030] Fig.17 Depicted is a method for implementing an exemplary embodiment of the present disclosure. Figures 14A-14B A schematic diagram of an actuation system of an adjustment assembly shown in;

[0031] Fig.18 depicts a plasma processing apparatus according to an exemplary embodiment of the present disclosure;

[0032] Fig.19 depicts a focus ring adjustment assembly for maintaining a focus ring of a plasma processing apparatus in a first position according to an exemplary embodiment of the present disclosure; and

[0033] Fig. 20 A focus ring adjustment assembly that maintains a focus ring of a plasma processing apparatus in a second position is depicted according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0034] Reference will now be made in detail to the embodiments, one or more examples of which are shown in the accompanying drawings. Each example is provided by way of illustration of the embodiments rather than by way of limitation of the present disclosure. Indeed, it will be apparent to those skilled in the art that various modifications and variations may be made to the embodiments without departing from the scope or spirit of the present disclosure. For example, a feature shown or described as part of one embodiment may be used together with another embodiment to produce yet another embodiment. Therefore, it is intended that aspects of the present disclosure cover such modifications and variations.

[0035] Exemplary aspects of the present disclosure relate to systems and methods for automatically replacing replaceable components in semiconductor workpiece processing equipment. The systems and methods can provide for manipulating replaceable components through vacuum equipment. Exemplary replaceable components can include focus rings used in plasma processing chambers (e.g., plasma dry etching chambers) for semiconductor workpieces.

[0036] In workpiece handling systems, preventive maintenance may be performed by a trained technician who performs manual labor actions to replace replaceable parts, such as a focus ring in a plasma dry etching chamber. In vacuum processing systems, this may require venting the process chamber to atmosphere and opening the process chamber for entry. This may result in expensive downtime in the semiconductor device manufacturing process. In addition, when the process chamber is opened to the environment, there is an increased potential risk of contamination of other processing components, and other chamber components may need to be removed and / or replaced.

[0037] For example, a process for maintaining semiconductor processing equipment includes monitoring trigger conditions, such as workpiece counts, plasma exposure time (e.g., plasma exposure time for a plasma processing tool), etc. When a trigger condition is generated, the vacuum processing chamber may be taken offline, which reduces the workpiece throughput. A maintenance technician may perform processing chamber adjustments (e.g., plasma cleaning) to place the vacuum processing chamber in a safe open state. After the adjustments, the technician may ventilate the vacuum processing chamber. The technician will open the vacuum processing chamber to enter the interior and begin to remove certain chamber components (e.g., a focus ring). After cleaning all the parts that have not been removed, replacement parts can be added to the processing chamber, and the vacuum processing chamber can be closed and evacuated. Once back online, some qualified workpieces can pass through the vacuum processing chamber. Once the vacuum processing chamber produces successful results, the processing chamber can be returned to semiconductor device production.

[0038] According to exemplary aspects of the present disclosure, a workpiece handling device can be configured to automatically replace certain process chamber components by a robot typically found in a workpiece handling device. More particularly, unused replaceable components can be loaded into a storage area and made accessible to a vacuum transport robot. The robot can dock with the workpiece handling module to remove the consumed (used) chamber components and then replace them with new (unconsumed) chamber components. The used components can then be returned to the storage area where they can be removed without disassembling the workpiece handling chamber.

[0039] In some embodiments, after placing the new (unconsumed) chamber component, the robot can access a test workpiece (e.g., a dummy wafer) stored in a storage area (e.g., on a shelf in the storage area). The robot can transfer the workpiece to the processing module and perform a test process. The system can perform measurements to ensure that the new chamber component has been properly placed. Additionally and / or alternatively, various sensors (e.g., optical sensors) can perform measurements related to the position of the new chamber component to ensure that the new chamber part has been correctly placed. In some embodiments, when placing the new (unconsumed) component in the processing module, an automatic wafer alignment system can be used to adjust the movement of the robot to ensure correct placement.

[0040] In some embodiments, systems and methods according to exemplary aspects of the present disclosure can be used to replace a focus ring used in a plasma processing chamber. The focus ring can be positioned around the periphery of a workpiece supported on a workpiece support (e.g., having a cathode or bias electrode) in a plasma processing apparatus. The focus ring can be used, for example, to shape a plasma near the workpiece. During plasma processing in a plasma processing chamber, the focus ring is exposed to the plasma, and therefore it is exposed to deposition and corrosion. As a result, it may be necessary to periodically replace the focus ring in a plasma processing chamber as part of preventive maintenance of a workpiece processing system.

[0041] Aspects of the present disclosure are discussed with reference to a focus ring as a replaceable component. One of ordinary skill in the art using the disclosure provided herein will appreciate that aspects of the present disclosure may be applicable to replacing other replaceable components in a vacuum processing chamber without departing from the scope of the present disclosure.

[0042] In some embodiments, the system can monitor trigger conditions, such as workpiece counts, plasma exposure time, etc. When the trigger conditions exist, an in-situ plasma dry cleaning process can be implemented to prepare the vacuum processing chamber. Once the in-situ plasma dry cleaning process is completed, a lifting mechanism outside the vacuum processing chamber but coupled to the interior of the chamber can use a set of pins to lift the focus ring around the workpiece support located in the vacuum processing chamber. After lifting the focus ring, a workpiece handling robot can enter the chamber and lift the ring from the pins in a vertical motion. The robot can retract and rotate to place the used focus on a shelf in a storage location. In some embodiments, the workpiece handling robot can hand over the focus ring to a second robot to be placed in a storage location.

[0043] The robot can then move to a different shelf in the storage location and retrieve a new focus ring. After rotating to the vacuum processing module, the robot can reach to the desired location and then drop down to place the focus ring on the lifting pins. After the robot is retracted from the vacuum processing module, the system can lower the lifting pins and drop the ring into a final position around the workpiece support (e.g., including the cathode). Adjusting the plasma can be used to stabilize the processing performance in the workpiece processing chamber, and the vacuum processing chamber can be brought back online for normal operation. Before the processing module is brought back online for normal operation, a test workpiece (e.g., obtained from the storage location) can be used to test the processing module with a test process.

[0044] Exemplary aspects of the present disclosure also include a workpiece handling robot capable of approaching one or more side-by-side processing stations according to a specific robot arm motion pattern. Specifically, the robot arm motion pattern allows the end effector of the workpiece handling robot to enter a processing chamber with side-by-side processing stations and then approach one of the processing stations to transfer a workpiece or replaceable component from the processing station. The robot arm motion pattern may include: moving the end effector in a first time period according to a first direction; moving the end effector in a second time period according to a second direction substantially transverse to the first direction; and moving the end effector in a third time period according to a third direction different from the first direction or the second direction. The end effector can be moved according to the robot arm motion pattern to approach the processing station, and can also be retracted from the processing station according to the same motion. In some embodiments, a sensor (e.g., an optical sensor) as part of, for example, an automatic wafer centering system can be used to automatically control and / or adjust the robot motion in real time to ensure the correct placement of the replaceable component in the processing station.

[0045] According to exemplary aspects of the present disclosure, according to exemplary embodiments of the present disclosure, a robot for conveying a workpiece as part of a workpiece handling system may be adapted to convey a replaceable component (e.g., a focus ring). For example, the robot end effector may have a scraper design to accommodate a workpiece support pad and a replaceable component support pad to support a semiconductor workpiece and a replaceable component. The end effector may include at least one common support pad configured to support a workpiece and a replaceable component. In addition, the end effector may include at least one support pad for supporting a workpiece, the support pad being positioned further away from the axis of the actuator and the distal end of the actuator than at least one other support pad for supporting a replaceable component.

[0046] Exemplary aspects of the present disclosure also include a focus ring adjustment assembly for adjusting the position of the focus ring within the processing chamber for removal and / or installation. Specifically, the adjustment assembly may include a pin configured to lift the focus ring to one or more different vertical positions, for example, to allow the focus ring to be more easily removed from the focus chamber by the end effector and to lower a new focus ring to install the focus ring around the workpiece support. The pin may be configured to contact the vertically highest portion of the underside of the focus ring. Additionally, in some embodiments, the pin may be rotatable to lock the azimuth position of the focus ring, thereby helping to properly center the focus ring relative to the workpiece support.

[0047] The focus ring adjustment assembly may include a lift pin movable in a vertical direction to facilitate movement of a focus ring of a plasma processing apparatus, thereby adjusting a distance between the focus ring and a susceptor configured to support a substrate to be processed. In particular, the lift pin may be located outside an RF zone defined by a bias electrode positioned within the susceptor. The lift pin may also penetrate a ground plane located within the susceptor.

[0048] Various aspects of the present disclosure can provide many technical effects and benefits. For example, the robot arm motion mode provided herein can facilitate access to replaceable parts in a processing chamber with multiple processing stations (e.g., two processing stations). In addition, the storage chamber provided herein allows storage of used replaceable parts and retrieval of new replaceable parts for the processing chamber without having to destroy the overall vacuum of the system. In some embodiments, a test workpiece can be included in the storage chamber for testing replaceable parts after placement. The contact between the pin and the focus ring can prevent the lateral movement of the focus ring when the focus ring is raised or lowered to ensure that the focus ring is precisely concentric with the electrostatic chuck or other workpiece support. The end effector support element provided herein can reduce the total number of parts, which reduces costs and simplifies the control mode for moving the end effector. In addition, the spatial configuration of the support pad on the end effector can utilize the existing opening of the processing chamber to move the replaceable parts into or out of the processing chamber. Positioning the lifting pin outside the RF zone and having the lifting pin penetrate the ground plane can reduce the arc discharge risk associated with applying RF power (e.g., bias power) from the RF source to the bias electrode during plasma processing. Additionally, interference (eg, electrical and mechanical interference) between the lift pins and the focus ring may be reduced.

[0049] An exemplary embodiment of the present disclosure relates to a system for processing a workpiece. The system includes a front end portion configured to be maintained at atmospheric pressure. The system includes a load lock chamber disposed between the front end portion and a vacuum portion. The system includes one or more processing chambers disposed in the vacuum portion. Each processing chamber may include two or more processing stations. At least one transfer chamber may be disposed in the vacuum portion. The system may include a storage chamber configured to store one or more replaceable components and coupled to the at least one transfer chamber. The system may include one or more workpiece handling robots disposed in the at least one transfer chamber. The workpiece handling robot may be configured to move the one or more replaceable components between the storage chamber and the one or more processing chambers. The workpiece handling robot may include an end effector configured to support the replaceable components. The system may include a controller configured to control the movement of the end effector to approach the processing station according to a robot arm motion pattern. The robot arm motion pattern includes extending a first time period in a first direction, extending a second time period in a second direction transverse to the first direction, and extending a third time period in a third direction different from the first direction and the second direction. In some embodiments, the robot arm motion pattern includes retracting the end effector according to the same pattern.

[0050] As used herein, a controller may include one or more control devices, such as one or more processors. The one or more processors may be configured to execute computer-readable instructions stored in one or more storage devices to send control signals to control the operation of various components according to any of the functions, operations, or methods described herein.

[0051] In some embodiments, one or more processing chambers include a first processing chamber and a second processing chamber disposed on opposite sides of the transfer chamber. In some embodiments, one or more processing chambers include a first processing chamber and a second processing chamber disposed on opposite sides of the transfer chamber. One or more processing chambers also include a third processing chamber arranged in a linear arrangement with the first processing chamber and a fourth processing chamber arranged in a linear arrangement with the second processing chamber, so that the third processing chamber and the fourth processing chamber are arranged on opposite sides of the transfer chamber. Each of the first processing chamber, the second processing chamber, the third processing chamber, and the fourth processing chamber may include at least two processing stations. The transfer chamber may include a transfer position configured to support workpieces and replaceable components in a stacked arrangement. In some embodiments, the stacked arrangement includes a plurality of shelves configured to accommodate workpieces and replaceable components. The diameter of the replaceable component may be greater than the diameter of the workpiece.

[0052] In some embodiments, the one or more workpiece handling robots may include a first workpiece handling robot and a second handling robot. The first workpiece handling robot may be configured to transfer workpieces and replaceable components from the workpiece column, the first processing chamber, the second processing chamber, and the transfer position, and the second workpiece handling robot may be configured to transfer workpieces and replaceable components from the storage chamber, the third processing chamber, the fourth processing chamber, and the transfer position to perform automatic processing of workpieces and automatic replacement of replaceable components without breaking vacuum.

[0053] In some embodiments, the processing chamber is configured to perform a plasma etching process using a direct plasma. Two or more processing stations are arranged side by side. The two or more processing stations can be associated with a workpiece support for supporting a workpiece in the processing chamber during processing. The workpiece support includes a pedestal assembly, the pedestal assembly including a substrate, an electrostatic chuck configured to support the workpiece, and a replaceable component, the replaceable component including a focus ring, the focus ring being arranged relative to the electrostatic chuck so that when the workpiece is positioned on the electrostatic chuck, at least a portion of the focus ring at least partially surrounds the periphery of the workpiece.

[0054] In some embodiments, the replaceable component includes a focus ring having a diameter greater than a diameter of the workpiece.

[0055] In some embodiments, the storage compartment includes a plurality of shelves configured to hold used and new replaceable components.

[0056] In some embodiments, the plurality of shelves are coupled to an elevator such that the elevator is configured to move replaceable components up and down within the storage compartment.

[0057] In some embodiments, the storage chamber is a vacuum capable storage chamber that includes one or more access doors configured to allow a workpiece robot to access replaceable components in the storage chamber and one or more access doors configured to allow replacement of new or used components from an atmospheric environment.

[0058] In some embodiments, the workpiece handling robot is configured to transfer one or more replaceable components from the storage chamber to at least two processing stations in the processing chamber using a scissor-like motion.

[0059] Another exemplary embodiment of the present disclosure relates to a system for processing a workpiece. The system includes: a front end portion configured to be maintained at atmospheric pressure; a load lock chamber disposed between the front end portion and the vacuum portion, the load lock chamber including a workpiece column for storing the workpiece; a transfer chamber disposed in the vacuum portion, the vacuum portion having a first workpiece handling robot, a second workpiece handling robot, and a transfer position configured to support the workpiece and the focus ring in a stacked arrangement therein; a first processing chamber, a second processing chamber, a third processing chamber, and a fourth processing chamber, wherein the first processing chamber and the second processing chamber are disposed on opposite sides of the transfer chamber in the vacuum portion, and the third processing chamber and another processing chamber are disposed on opposite sides of the transfer chamber, wherein the third processing chamber is arranged linearly with the first processing chamber, and the fourth processing chamber is arranged linearly with the second processing chamber, wherein each of the first processing chamber, the second processing chamber, the third processing chamber, and the fourth processing chamber includes two or more processing stations arranged side by side. The system may include a storage chamber configured to store one or more focus rings and coupled to the transfer chamber. The first workpiece handling robot and the second workpiece handling robot each include an end effector configured to support the focus ring. The system includes a controller configured to control the movement of the end effector to approach the processing station according to a robot arm motion pattern. The robot arm motion pattern includes extending a first time period in a first direction, extending a second time period in a second direction transverse to the first direction, and extending a third time period in a third direction different from the first direction and the second direction, and retracting backward according to the same robot arm motion pattern. The first workpiece handling robot can be configured to transfer the workpiece and one or more focus rings between the workpiece column, the first processing chamber, the second processing chamber, and the transfer position, and the second workpiece handling robot can be configured to transfer the workpiece and one or more focus rings between the storage chamber, the third processing chamber, the fourth processing chamber, and the transfer position to perform automatic processing of the workpiece and automatic replacement of the focus ring without breaking the vacuum.

[0060] Another exemplary embodiment of the present disclosure relates to a method for replacing a replaceable component in a system for processing a workpiece, the system comprising a transfer chamber having one or more processing chambers configured thereon, wherein each of the one or more processing chambers comprises two or more processing stations arranged side by side, a storage chamber disposed on the transfer chamber, and one or more workpiece handling robots disposed in the transfer chamber, the robot having an arm with an end effector configured thereon. The method may include: removing a used replaceable component from a processing station in the processing chamber with the workpiece handling robot, comprising approaching the processing station according to a robot arm motion pattern, the robot arm motion pattern comprising extending the end effector for a first time period in a first direction, extending for a second time period in a second direction transverse to the first direction, and extending for a third time period in a third direction different from the first direction and the second direction, picking up the used replaceable component and retracting it backwards according to the same pattern; transferring the replaceable component to the storage chamber; removing a new replaceable component from the storage chamber with the workpiece handling robot; and transferring the new replaceable component to the processing station.

[0061] In some embodiments, transferring a new replaceable component to the processing station includes placing the replaceable component in the processing station using a robotic arm motion pattern.

[0062] In some embodiments, transferring replaceable parts to a storage chamber includes using a first workpiece handling robot to transfer used replaceable parts to a stacked arrangement in a transfer position in the transfer chamber, and using a second workpiece handling robot to transfer used replaceable parts from the stacked arrangement in the transfer position to the storage chamber.

[0063] In some embodiments, moving new replaceable parts from a storage chamber using a workpiece handling robot includes using a second workpiece handling robot to transfer the new replaceable parts from the storage chamber to a stacking arrangement in a transfer chamber, and using a first workpiece handling robot to transfer the replaceable parts from a stacking position in the transfer position to a processing station.

[0064] In some embodiments, the stacked arrangement includes a plurality of shelves configured to support one or more replaceable components having a larger diameter than the workpiece.

[0065] Another exemplary embodiment relates to an end effector for moving a workpiece and a replaceable component within a system for processing a workpiece, wherein the end effector extends axially between a proximal end and a distal end. The end effector has an arm portion extending axially between a first arm end and a second arm end, wherein the first arm end is located at the proximal end of the end effector. The end effector also has a scraper portion extending axially between a first scraper end and a second scraper end, wherein the first scraper end is adjacent to the second arm end, and the second scraper end is located at the distal end of the end effector. In addition, the end effector has a first support member extending outward from the upper surface of the scraper portion, a second support member extending outward from the upper surface of the scraper portion, and a common support member extending outward from the upper surface of the arm portion. The common support member and the first support member are configured together to support a workpiece of a first diameter, and the common support member and the second support member are configured together to support a replaceable component of a second diameter.

[0066] In some embodiments, the first diameter can be smaller than the second diameter. Additionally, in one or more embodiments, the second support member can be closer to the proximal end than the first support member.

[0067] Furthermore, in some embodiments, the first support member and the second support member are spaced apart in the longitudinal direction so that a first contact area on the common support member for supporting a workpiece on the first support member is separated from a second contact area on the common support member for supporting a replaceable component on the second support member. In some embodiments, the second contact area can be closer to the proximal end than the first contact area.

[0068] In some embodiments, the first support member and the second support member can be spaced apart along the longitudinal direction so that a first contact area on the common support member for supporting a workpiece on the first support member at least partially overlaps a second contact area on the common support member for supporting a replaceable component on the second support member.

[0069] Another exemplary embodiment of the present disclosure relates to an end effector for moving a workpiece and a replaceable component in a system for processing a workpiece, wherein the end effector extends axially between a proximal end and a distal end. The end effector includes an arm portion extending axially between a first arm end and a second arm end, wherein the first arm end is located at the proximal end of the end effector. The end effector also includes a scraper portion extending axially between a first scraper end and a second scraper end, wherein the first scraper end is adjacent to the second arm end, and the second scraper end is located at the distal end of the end effector. In addition, the end effector includes a first support member extending outwardly from an upper surface of the scraper portion, wherein the first support member is located at a first distance from a longitudinal axis of the end effector along a first direction. In addition, the end effector includes a second support member extending outwardly from an upper surface of the scraper portion, wherein the second support member is located at a second distance from the longitudinal axis of the end effector along the first direction. The first distance is greater than the second distance. In some embodiments, the second support member may be closer to the proximal end than the first support member.

[0070] Some embodiments may include another first support member and another second support member extending outwardly from an upper surface of the arm portion, wherein the first support member and the another first support member are configured to support a workpiece of a first diameter, and the second support member and the another second support member are configured to support a replaceable component of a second diameter.

[0071] In some embodiments, the further second support member may be closer to the distal end than the first support member.

[0072] In some embodiments, the common support member extends outwardly from an upper surface of the arm portion, wherein the common support member and the first support member can be together configured to support a workpiece of a first diameter, and the common support member and the second support member can be together configured to support a replaceable component of a second diameter.

[0073] Furthermore, in some embodiments, the first support member and the second support member may be spaced apart in the longitudinal direction such that a first contact area on the common support member for supporting a workpiece on the first support member is separated from a second contact area on the common support member for supporting a replaceable component on the second support member.

[0074] Additionally, in some embodiments, the second contact area can be closer to the proximal end than the first contact area.

[0075] Additionally, in some embodiments, the first support member and the second support member may be spaced apart in the longitudinal direction such that a first contact area on the common support member for supporting a workpiece on the first support member at least partially overlaps with a second contact area on the common support member for supporting a replaceable component on the second support member.

[0076] Another exemplary embodiment of the present disclosure relates to a focus ring adjustment assembly for a system for processing a workpiece under vacuum, wherein the focus ring extends between an upper side and a lower side in a vertical direction, the lower side has a first surface portion and a second surface portion, and the first surface portion is vertically above the second surface portion. The focus ring adjustment assembly includes a pin extending between a proximal end and a distal end, wherein the distal end is configured to selectively contact the first surface portion of the focus ring. The focus ring adjustment assembly also includes an actuator that is operable to move the pin between an extended position and a retracted position in a vertical direction. The extended position of the pin is associated with the distal end of the pin contacting the first surface of the focus ring and being able to be approached by a workpiece handling robot and moved out of the vacuum processing chamber.

[0077] In some embodiments, the focus ring can be vertically located higher in a vertical direction when the pins are in the extended position relative to when the pins are in the retracted position.

[0078] Some embodiments may include a rotary actuator configured to selectively rotate a pin, wherein rotation of the pin through a predetermined locking angle secures the focus ring to the pin.

[0079] In some embodiments, the pin has a body portion and a flange portion, wherein the body portion extends between a proximal end and a distal end, and the flange portion is spaced apart from the distal end of the pin and extends outwardly from the body portion. The flange portion can be configured to contact a transition surface portion vertically located between a first surface portion and a second surface portion of the focus ring when the distal end of the pin contacts the first surface portion of the focus ring.

[0080] Some embodiments further include a support plate positioned within the vacuum processing chamber and a floating coupling fixed to the proximal end of the pin. The floating coupling can be slidably supported by the support plate so that the floating coupling can move relative to the support plate in a horizontal direction. The actuator can be configured to move the support plate between a raised position and a lowered position in a vertical direction to move the pin between an extended position and a retracted position, wherein the raised position of the support plate can be associated with the extended position of the pin, and the lowered position of the support plate can be associated with the retracted position of the pin.

[0081] In some embodiments, the actuator may be vacuum sealed, wherein the actuator is located outside of the vacuum processing chamber, and the actuator is coupled to the support plate via a connecting shaft extending through an outer wall of the vacuum processing chamber.

[0082] Another exemplary embodiment of the present disclosure relates to a focus ring adjustment assembly for a system for processing a workpiece under vacuum, wherein the focus ring extends between an upper side and a lower side in a vertical direction, and the focus ring has a groove that is recessed inward from the lower side to the upper side. The focus ring adjustment assembly may include a pin extending between a proximal end and a distal end, wherein the distal end may be configured to selectively contact the groove. In addition, the focus ring adjustment assembly may include an actuator that is operable to move the pin between an extended position and a retracted position in a vertical direction. The extended position of the pin may be associated with the distal end of the pin contacting the groove and the focus ring being accessible to and removed from the vacuum processing chamber by a workpiece handling robot.

[0083] In some embodiments, the focus ring may extend radially between the inner surface and the outer surface, wherein the groove is annular around the focus ring and is spaced apart from the inner surface and the outer surface.

[0084] In at least one embodiment, the groove has a first groove portion and a second groove portion, wherein the first groove portion extends from the lower side of the focusing ring to a first distance from the lower side, and the second groove portion extends from the first distance to a second distance from the lower side, wherein the second distance can be less than the thickness of the focusing ring between the upper side and the lower side along the vertical direction.

[0085] In an embodiment, the pin can have a body portion and a flange portion, wherein the body portion extends between a proximal end and a distal end, and the flange portion is spaced apart from the distal end of the pin and extends outwardly from the body portion. The flange portion can be configured to be at least partially received within the first groove portion, and a portion of the pin extending between the flange portion and the distal end can be at least partially received within the second groove portion.

[0086] In some embodiments, the focus ring is vertically located higher in a vertical direction when the pins are in the extended position relative to when the pins are in the retracted position.

[0087] Further, some embodiments may include a support plate positioned within the vacuum processing chamber and adjacent to an outer wall of the vacuum processing chamber; and a floating coupling fixed to a proximal end of the pin. The floating coupling may be slidably supported by the support plate such that the floating coupling may move relative to the support plate in a horizontal direction. The actuator may be configured to move the support plate between a raised position and a lowered position in a vertical direction, thereby moving the pin between an extended position and a retracted position, wherein the raised position of the support plate is associated with the extended position of the pin, and the lowered position of the support plate is associated with the retracted position of the pin.

[0088] Additionally, in some embodiments, the actuator may be vacuum sealed, wherein the actuator is located outside of the vacuum processing chamber, and the actuator is coupled to the support plate via a connecting shaft extending through an outer wall of the vacuum processing chamber.

[0089] Another exemplary embodiment of the present disclosure relates to a plasma processing device. The device may include a processing chamber defining a vertical direction and a lateral direction. The plasma processing device may include a susceptor disposed in the processing chamber. The susceptor may be configured to support a substrate. The plasma processing device may include a radio frequency (RF) bias electrode disposed in the susceptor. The RF bias electrode may extend between a first end of the RF bias electrode and a second end of the RF bias electrode along a lateral direction. The RF bias electrode may define an RF zone extending between a first end of the RF bias electrode and a second end of the RF bias electrode along a lateral direction. In some embodiments, the RF zone may extend from the first end of the RF bias electrode to the second end of the RF bias electrode along a lateral direction. Alternatively or additionally, the RF zone may extend between the RF bias electrode and a dielectric window of the plasma processing device along a vertical direction.

[0090] The plasma processing apparatus may include a focus ring disposed within the processing chamber. The plasma processing apparatus may include a focus ring adjustment assembly, the focus ring adjustment assembly including a lift pin located outside the RF zone. The lift pin may be movable in a vertical direction to move the focus ring between at least a first position and a second position, thereby adjusting a distance between the pedestal and the focus ring in a vertical direction. In some embodiments, when the focus ring is in the first position, the focus ring is located on the pedestal. In addition, the focus ring is spaced a certain distance from the pedestal, that is, when the focus ring is in the second position.

[0091] In some embodiments, the plasma processing apparatus may include a ground plane spaced apart from the RF bias electrode in a vertical direction. The ground plane may extend in a lateral direction between a first end of the ground plane and a second end of the ground plane. In some embodiments, the length of the ground plane in the lateral direction may be greater than the length of the RF bias electrode in the lateral direction. In some embodiments, the lift pins penetrate the ground plane. In some embodiments, the RF bias electrode and the ground plane are disposed within a pedestal.

[0092] In some embodiments, the focus ring adjustment assembly can include an actuator configured to move a lift pin in a vertical direction to move the focus ring between at least a first position and a second position. In some embodiments, the actuator is located outside the processing chamber. In some embodiments, the focus ring adjustment assembly can include a second actuator configured to rotate the lift pin about a vertical direction. In some embodiments, the second actuator is located outside the processing chamber.

[0093] Another exemplary embodiment of the present disclosure relates to a plasma processing device. The device may include a processing chamber defining a vertical direction and a lateral direction. The plasma processing device may include a susceptor disposed in the processing chamber. The susceptor may be configured to support a substrate. The plasma processing device may include a radio frequency (RF) bias electrode disposed in the susceptor. The RF bias electrode may extend between a first end of the RF bias electrode and a second end of the RF bias electrode along a lateral direction. The RF bias electrode may define an RF zone extending between the first end of the RF bias electrode and the second end of the RF bias electrode along a lateral direction. The plasma processing device may include a ground plane spaced apart from the RF bias electrode along a vertical direction. The plasma processing device may include a focus ring disposed in the processing chamber. The plasma processing device may include a focus ring adjustment assembly, the focus ring adjustment assembly including a lift pin passing through the ground plane. The lift pin may be movable in a vertical direction to move the focus ring between at least a first position and a second position, thereby adjusting the distance between the susceptor and the focus ring along a vertical direction. In some embodiments, the lift pin may be located outside the RF zone.

[0094] Referring now to the drawings, exemplary embodiments of the present disclosure will now be described.

[0095] Figure 1 An example workpiece processing system 100 is depicted according to an exemplary embodiment of the present disclosure. The processing system 100 may include a front end portion 112, one or more load lock chambers 114, a transfer chamber 115, and a plurality of processing chambers, including a first processing chamber 120 and a second processing chamber 130. The system may include a first workpiece handling robot 150 for loading and unloading workpieces into and out of the workpiece column 110 in the load lock chamber 114, the first processing chamber 120, and the second processing chamber 130, and / or transferring workpieces between the first processing chamber 120 and the second processing chamber 130.

[0096] The front end portion 112 can be configured to be maintained at atmospheric pressure and can be configured to engage a workpiece input device 118. The workpiece input device 118 can include, for example, a cassette, a front-opening wafer transfer box, or other devices for supporting multiple workpieces. The workpiece input device 118 can be used to provide pre-processed workpieces to the processing system 100, or receive processed workpieces from the processing system 100.

[0097] The front end section 112 may include one or more robots (not shown) for transferring workpieces from the workpiece input device 118 to, for example, the load lock chamber 114, such as to and from the workpiece column 110 in the load lock chamber 114. In one example, the robots in the front end section 112 may transfer pre-processed workpieces to the load lock chamber 114, and may transfer processed workpieces from the load lock chamber 114 to the one or more workpiece input devices 118. Any robot suitable for transferring workpieces may be used in the front end section 112 without departing from the scope of the present disclosure. The workpieces may be transferred to or from the load lock chamber 114 through suitable slots, openings, or apertures.

[0098] The load lock chamber 114 may include a workpiece column 110 configured to support a plurality of workpieces in a stacked arrangement. The workpiece column 110 may include, for example, a plurality of shelves. Each shelf may be configured to support one or more workpieces. In an example embodiment, the workpiece column 110 may include one or more shelves for supporting pre-processed workpieces and one or more shelves for supporting processed workpieces.

[0099] In some embodiments, appropriate valves may be provided with the load lock chamber 114 and other chambers to appropriately adjust the processing pressure for processing the workpiece. In some embodiments, the load lock chamber 114 and the transfer chamber 115 may be maintained at the same pressure. In this embodiment, the load lock chamber 114 does not need to be sealed relative to the transfer chamber 115. In fact, in some embodiments, the load lock chamber 114 and the transfer chamber 115 may be part of the same chamber.

[0100] exist Figure 1 A single load lock chamber 114 is shown in FIG. Using the disclosure provided herein, one of ordinary skill in the art will appreciate that multiple load lock chambers 114 may be used in any of the processing systems described herein without departing from the scope of the present disclosure. For example, the system 100 may include a first load lock chamber for transferring workpieces into a vacuum portion of the system 100, and a second load lock chamber for transferring workpieces out of the vacuum portion of the system 100.

[0101] The first processing chamber 120 and the second processing chamber 130 can be used to perform any of a variety of workpiece processes on the workpiece, such as a vacuum annealing process, a surface treatment process, a dry stripping process, a dry etching process, a deposition process, and other processes. In some embodiments, one or more of the first processing chamber 120 and the second processing chamber 130 can include a plasma-based processing source, such as an inductively coupled plasma (ICP) source, a microwave source, a surface wave plasma source, an ECR plasma source, and a capacitively coupled (parallel plate) plasma source.

[0102] As shown, each of the first process chamber 120 and the second process chamber 130 includes a pair of process stations arranged side by side so that a pair of workpieces can be simultaneously exposed to the same process. More specifically, the first process chamber 120 can include a first process station 122 and a second process station 124 arranged side by side.

[0103] The second processing chamber 130 may include a first processing station 132 and a second processing station 134 arranged side by side. Each processing station may include a workpiece support (e.g., a pedestal) for supporting the workpiece during processing. In some embodiments, each processing station may share a common pedestal with two parts for supporting the workpiece. In some embodiments, the workpiece support may include a pedestal assembly, which includes a substrate, an electrostatic chuck configured to support the workpiece, and a replaceable component. The replaceable component may include a focus ring arranged relative to the electrostatic chuck so that when the workpiece is positioned on the electrostatic chuck, at least a portion of the focus ring at least partially surrounds the periphery of the workpiece. The first processing chamber 120 and / or the second processing chamber 130 can be selectively sealed relative to the transfer chamber 115 for processing.

[0104] The transfer chamber 115 may include a workpiece handling robot 150. The workpiece handling robot 150 may be configured to transfer a workpiece from the workpiece column 110 in the load lock chamber 114 to a processing station in the first processing chamber 120 and / or the second processing chamber 130. The workpiece handling robot 150 may also transfer a workpiece between the first processing chamber 120 and the second processing chamber 130.

[0105] like Figure 1 As shown, the workpiece handling system 100 may include a storage chamber 250 coupled to the transfer chamber 115, and the storage chamber 250 is used to store new and / or used replaceable parts (e.g., focus rings). In some embodiments, the storage chamber is mounted to the back side of the transfer chamber 115. The storage chamber 250 may include a plurality of shelves that are configured to support replaceable parts. The shelves may be configured so that a plurality of replaceable parts can be supported in a vertical / stacked arrangement. In certain embodiments, the shelves may be coupled to an elevator so that the elevator is configured to move the replaceable parts up and down within the storage chamber 250. In some embodiments, the storage chamber 250 may include one or more test workpieces. For example, one or more shelves may be configured to support test workpieces.

[0106] In some embodiments, the storage chamber 250 is a vacuum-capable storage chamber that can be maintained at the same vacuum as the transfer chamber 115. In certain other embodiments, the storage chamber 250 is configured so that it can be sealed relative to the transfer chamber 115. The storage chamber with vacuum capability may include one or more access doors that are configured to allow the workpiece handling robot to access the replaceable components in the storage chamber. For example, the access door is large enough so that the workpiece handling robot can place used replaceable components on a shelf within the storage chamber 250 and can remove new replaceable components from one shelf. Therefore, replaceable components can be placed in or removed from the storage chamber 250 without disrupting the vacuum of the entire system.

[0107] In some embodiments, the storage chamber 250 may include one or more access doors configured to allow replacement of new or used replaceable components from an atmospheric ambient environment. For example, in some embodiments, the storage chamber 250 in communication with the transfer chamber 115 may be sealed so that the transfer chamber 115 is maintained at a desired processing pressure. The storage chamber 250 may then be entered and serviced from the atmospheric environment so that the used replaceable components may be removed from the storage chamber 250 and new replaceable components may be placed in the storage chamber 250. After the maintenance of the storage chamber 250 is completed, any known system for establishing a processing pressure within the storage chamber 250 may be used to restore the storage chamber 250 to the desired processing pressure. Once the desired processing pressure is reached, such as the same processing pressure or vacuum as the transfer chamber 115, the seal of the storage chamber 250 relative to the transfer chamber 115 may be released so that one or more workpiece handling robots may enter the storage chamber 250 again.

[0108] The workpiece handling robot 150 can be configured to transfer replaceable components between the storage chamber 250 and each processing station to automatically replace the replaceable components without breaking the vacuum. For example, the workpiece handling robot 150 can be used to transfer replaceable components from the first processing chamber 120 or the second processing chamber 130 to the storage chamber 250. The workpiece handling robot 150 can also be used to transfer replaceable components from the storage chamber 250 to the first processing chamber 120 or the second processing chamber 130. In some embodiments, the workpiece handling robot 150 can retrieve a used replaceable component from a processing station in the first processing chamber 120 and / or the second processing chamber and transfer the used component to the storage chamber 250. The workpiece handling robot 150 can also retrieve a new replaceable component from the storage chamber 250 and transfer the new replaceable component to a processing station in the first processing chamber 120 or the second processing chamber 130.

[0109] The workpiece handling robot may be coupled to a controller such that the controller may be used to control the workpiece handling robot to transfer new or used replaceable parts to and from the storage and processing chambers 120 and 130. The controller may be configured to perform a robot arm motion pattern 280 (e.g., Figure 6 As shown) controls the movement of the workpiece handling robot 150 to enter one or more processing stations of the first processing chamber 120 or the second processing chamber 130.

[0110] Reference now Figure 2 , the processing system 200 may include additional processing chambers, including a third processing chamber 170 and a fourth processing chamber 180. The third processing chamber 170 is disposed in a linear arrangement with the first processing chamber 120, and the fourth processing chamber 180 is disposed in a linear arrangement with the second processing chamber 130, such that the third processing chamber 170 and the fourth processing chamber 180 are disposed on opposite sides of the transfer chamber 195.

[0111] The third processing chamber 170 and the fourth processing chamber 180 can be used to perform any of a variety of workpiece processes on the workpiece, such as a vacuum annealing process, a thermal treatment process, a surface treatment process, a dry stripping process, a dry etching process, a deposition process, and other processes. In some embodiments, one or more of the third processing chamber 170 and the fourth processing chamber 180 can include a plasma-based processing source, such as an inductively coupled plasma (ICP) source, a microwave source, a surface wave plasma source, an ECR plasma source, and a capacitively coupled (parallel plate) plasma source. In a specific embodiment, a focusing ring can be used in a plasma processing source that is used to provide a direct ion plasma etching process.

[0112] As shown, each of the third processing chamber 170 and the fourth processing chamber 180 includes a pair of processing stations arranged side by side so that a pair of workpieces can be exposed to the same process at the same time. More specifically, the third processing chamber 170 may include a first processing station 172 and a second processing station 174 arranged side by side. The fourth processing chamber 180 may include a first processing station 182 and a second processing station 184 arranged side by side. Each processing station may include a workpiece support (e.g., a pedestal) for supporting the workpiece during processing. In some embodiments, each processing station may share a common pedestal with two parts for supporting the workpiece. In some embodiments, the workpiece support may include a pedestal assembly, which includes a substrate, an electrostatic chuck configured to support the workpiece, and a replaceable component. The replaceable component may include a focus ring arranged relative to the electrostatic chuck so that when the workpiece is positioned on the electrostatic chuck, at least a portion of the focus ring at least partially surrounds the periphery of the workpiece. In some embodiments, the third processing chamber 170 and / or the fourth processing chamber 180 may be selectively sealed relative to the transfer chamber 115 for processing.

[0113] In order to transfer the workpiece to the third processing chamber 170 and the fourth processing chamber 180, the system 200 may also include a transfer position 162 and a second workpiece handling robot 190. The transfer position 162 may be part of the transfer chamber 162, or may be a separate chamber. The transfer position 162 may include a support column 160 for supporting a plurality of workpieces in a stacked arrangement and / or a side-by-side arrangement. For example, the support column 160 may include a plurality of shelves configured to support the workpieces in a stacked vertical arrangement. The first workpiece handling robot 150 may be configured to transfer the workpiece from the workpiece column 110, the first processing chamber 120, or the second processing chamber 130 to the workpiece column 160 at the transfer position 162. The second workpiece handling robot 190 may be configured to transfer the workpiece from the support column 160 at the transfer position 162 to a processing station in the third processing chamber 170 and / or the fourth processing chamber 180. The workpiece handling robot 190 may also transfer the workpiece from the third processing chamber 170 to the fourth processing chamber 180.

[0114] like Figure 2 As shown, the workpiece handling system 200 can include a storage chamber 250 coupled to the transfer chamber, the storage chamber 250 being used to store new and / or used replaceable parts (e.g., focus rings). The storage chamber is mounted to the rear side of the transfer chamber. The workpiece handling robots 150 and 190 can be configured to transfer replaceable parts between various transfer locations and processing stations to automatically replace replaceable parts without breaking vacuum. In some embodiments, the storage chamber 250 can store test workpieces.

[0115] In order to transfer replaceable parts between the first processing chamber 120, the second processing chamber 130 and the storage chamber 250, the system 200 can use the second workpiece handling robot 190 to transfer new or used replaceable parts from the storage chamber 250 to the support column 160 in the transfer position 162. The transfer position 162 can be a part of the transfer chamber 162 or can be a separate chamber. The transfer position 162 may include a support column 160 for supporting a plurality of replaceable parts in a stacked arrangement. For example, the support column 160 may include a plurality of shelves that are configured to support replaceable parts in a stacked vertical arrangement. Therefore, in some embodiments, the support column 160 is configured so that it can support workpieces and replaceable parts in a stacked arrangement. The first workpiece handling robot 150 can be configured to transfer replaceable parts from the support column 160 to the side-by-side processing stations 122 and 124 of the first processing chamber 120 or the side-by-side processing stations 132 and 134 of the second processing chamber 130. The second workpiece handling robot 190 may be configured to transfer replaceable components from the support column 160 in the transfer position 162 to the side-by-side processing stations 172 and 174 in the third processing chamber, the side-by-side processing stations 182 and 184 in the fourth processing chamber 180 , and / or the storage chamber 250 .

[0116] In order to remove the used replaceable parts or provide new replaceable parts to one or more processing stations, the workpiece handling robots 150 and 190 can use the robot arm motion mode. For example, when entering the processing station to transfer the replaceable parts, the controller can be used to control the movement of the end effector on the arm of the workpiece handling robots 150 and 190 to control the movement of the end effector. The workpiece handling robot 150 can use the robot arm motion mode to enter the processing stations 122, 124, 132 and 134. The workpiece handling robot 190 can use the robot arm motion mode to enter the processing stations 172, 174, 182 and 184.

[0117] The processing system 200 includes four processing chambers 120, 130, 170 and 180, and can be configured to process up to eight workpieces at a time. Additional processing stations can be added in a linear manner to provide additional processing capabilities. For example, a fifth processing chamber can be added in a linear arrangement with the third processing chamber 170. A sixth processing chamber can be added in a linear arrangement with the fourth processing chamber 180. Additional transfer positions and workpiece handling robots can be used to transfer workpieces to and from the fifth and sixth processing chambers. By expanding the processing system in a linear manner in this manner, additional processing chambers can be included.

[0118] In certain embodiments, the workpiece storage chamber may be located at other locations within the processing system without departing from the scope of the present disclosure. For example, in some embodiments, the workpiece storage chamber may be located above or below a transfer location (e.g., the transfer location 162 of the processing system 200). Additionally, according to exemplary embodiments of the present disclosure, one or more processing chambers of a workpiece processing system (e.g., a processing station 120, 130, 170, or 180 of the processing system 200) may be replaced with a storage chamber for new and / or used replaceable parts.

[0119] In other embodiments, the storage chamber 250 may be located at other locations within the processing system without departing from the scope of the present disclosure. For example, the storage chamber may be disposed on one or more of the processing chambers 120, 130, 170, and / or 180. The storage chamber may also be located above or below a transfer location (e.g., the transfer location 162 of the processing system 200). In addition, according to exemplary embodiments of the present disclosure, one or more processing chambers of the workpiece processing system (e.g., the processing stations 120, 130, 170, or 180 of the processing system 200) may be replaced with a storage chamber for new and / or used replaceable parts.

[0120] Figure 3An example transport mechanism 260 mounted to a process chamber of a workpiece processing system 200 is depicted according to an exemplary embodiment of the present disclosure. The transport mechanism 260 can be directly coupled to the process chamber 130. In other embodiments, the transport mechanism 260 can be coupled to any process chamber including 120, 130, 170, and / or 180. As shown, the transport mechanism 260 can include a replaceable component storage location 262 (e.g., a shelf) that can be used to store used and new replaceable components (e.g., a focus ring). The transport mechanism 260 can include a robot 270 configured to transport the replaceable components to their appropriate locations in the processing station.

[0121] Figure 4 A side view of an example support column 160 in a transfer position 162 according to an exemplary embodiment of the present disclosure is depicted. As shown, the support column 160 may include a plurality of shelves 161. Each shelf 161 may be configured to support a workpiece 163, such that a plurality of workpieces 163 may be arranged on the support column in a vertical / stacked arrangement. Each shelf 161 may also be configured to support a replaceable component 165, such that a plurality of replaceable components 165 may be arranged on the support column 160 in a vertical / stacked arrangement. Thus, the shelves 161 of the support column 160 are configured such that they may support the workpiece 163 and the replaceable components 165. In some embodiments, the replaceable components 165 may have a larger diameter than the workpiece 163. Thus, the shelves 161 are configured such that they may support the replaceable components 165 having a larger diameter than the workpiece 163. In some embodiments, the replaceable components may include a focus ring. The focus ring used in the system provided herein may have a larger diameter than the workpiece. Therefore, the support column 160 is configured so that it can support a workpiece and a focus ring having a larger diameter.

[0122] In some embodiments, the transfer location may have an opening or aperture all the way through the transfer location so that the workpiece handling robots may transfer workpieces and or replaceable components using direct transfer between robots.

[0123] Figure 5 A side view of an example workpiece column 110 is depicted according to an exemplary embodiment of the present disclosure. As shown, the workpiece column 110 can include a plurality of shelves 111. Each shelf 111 can be configured to support a workpiece 113 such that a plurality of workpieces 113 can be arranged on the workpiece column 110 in a vertically stacked arrangement.

[0124] In some embodiments, alternative methods of conveying replaceable components in a workpiece handling system may be used without departing from the scope of the present disclosure. For example, additional conveying mechanisms (e.g., robots, shuttle mechanisms, multi-axis robots) may be installed to the processing chamber to convey replaceable components into or out of the processing chamber.

[0125] Figure 6 An example robot arm motion pattern according to an exemplary embodiment of the present disclosure is depicted. As shown, the system 100 includes a workpiece handling robot 150 having an arm with an end effector 500. Figure 6 As shown, the end effector 500 can move within the system 100 according to multi-directional movement. For example, the end effector 500 can be located inside the transfer chamber 115. When it is time to retrieve the used replaceable component 165 from one of the side-by-side processing stations (shown as 122 or 124), the end effector 500 can move to one of the processing stations according to the robot arm motion pattern 280.

[0126] The robotic arm motion pattern 280 may include extending for a first time period in a first direction, extending for a second time period in a second direction substantially transverse to the first direction, and extending for a third time period in a third direction different from the first direction and the second direction. As shown, the robotic arm motion pattern 280 may be used to place the end effector 500 into one of the processing stations 122 or 124.

[0127] In some embodiments, the robot arm motion pattern may include extending the end effector 500 in a first direction for a first period of time so that the end effector enters the processing chamber 120. Thus, in some embodiments, extending the end effector 500 in the first direction moves the end effector from the transfer chamber 115 into the processing chamber 120, but does not place the end effector 500 in one of the side-by-side processing stations 122, 124. The end effector 500 may then be moved in a second direction substantially transverse to the first direction to place the end effector 500 in one of the side-by-side processing chambers 122, 124. As used herein, "substantially transverse" or "transverse to" means within about 45° perpendicular to the first direction. In some embodiments, the second direction may range from about 10° to about 70° perpendicular to the first direction, such as 20° to about 60°, such as 30° to about 50°. The end effector 500 may then be moved in a third direction to ensure proper placement of the end effector 500 in the processing station 122 so that retrieval of the used replaceable component can be completed. In some embodiments, the third direction may be within 30° or less of perpendicular to the first direction. In some embodiments, the end effector 500 may also be moved out of the processing station 122 according to the same robotic arm motion pattern. For example, the end effector 500 may be retracted into the transfer chamber 115 according to the same robotic arm motion pattern 280.

[0128] In certain embodiments, the end effector 500 may have a new replaceable component 165 thereon. For example, the end effector 500 may retrieve the new replaceable component 165 from the support column 160 or the storage chamber 250. The end effector 500 having the new replaceable component 165 thereon may then place the new replaceable component 165 into the processing station 122 according to the example robotic arm motion patterns provided herein. For example, the end effector may move in a first direction for a first period of time to enter the processing chamber 120, may move in a second direction transverse to the first direction for a second period of time to enter one of the side-by-side processing stations 122, and may move in a third direction different from the first direction and the second direction for a third period of time to ensure that the new replaceable component 165 is properly placed in one of the side-by-side processing stations 122, 124.

[0129] The robot arm motion patterns 280 disclosed herein can be used by one or more workpiece handling robots of the system. For example, the workpiece handling robots 150 and 190 can both be coupled to a controller capable of executing the robot arm motion patterns 280 described herein. The workpiece handling robots 150 and 190 can use the robot arm motion patterns 280 to access any of the side-by-side processing stations 122, 124, 132, 134, 172, 174, 182, and 184 of the various processing chambers 120, 130, 170, and 180 disclosed herein.

[0130] In some embodiments, the workpiece handling robot can be configured to transfer workpieces and replaceable components using a scissor-like motion. For example, the workpiece handling robot 150 can simultaneously transfer workpieces from the workpiece column in the load lock chamber 114 to two side-by-side processing stations 122 and 124 in the first processing chamber 120 using, for example, a scissor-like motion. Similarly, the workpiece handling robot 150 can simultaneously transfer workpieces from the workpiece column 110 in the load lock chamber 114 to two side-by-side processing stations 132 and 134 in the second processing chamber 130 using, for example, a scissor-like motion. The workpiece handling robot 190 can simultaneously transfer workpieces from the support column 160 in the transfer position 162 to two side-by-side processing stations 172 and 174 in the third processing chamber 170 using, for example, a scissor-like motion. The workpiece handling robot 190 can simultaneously transfer workpieces from the support column 160 in the transfer position 162 to two side-by-side processing stations 182 and 184 in the fourth processing chamber 180 using, for example, a scissor-like motion.

[0131] In some embodiments, the controller can be configured to adjust the motion of the end effector to transfer a replaceable component (e.g., a focus ring) based at least in part on data received from one or more sensors (e.g., sensors associated with an automated wafer centering system). For example, an optical sensor can be used to monitor the motion of the replaceable component during a motion pattern. To ensure proper placement of the replaceable component, while the workpiece handling robot is transferring the replaceable component, the control system can adjust the motion pattern in real time to properly place the replaceable component with reduced error.

[0132] In some embodiments, one or more sensors can be used to determine the position of the replaceable component after being transferred into the processing chamber by the workpiece handling robot. The sensor can include, for example, one or more optical sensors. The controller can be configured to control the workpiece handling robot to adjust the position of the replaceable component when the sensor measurement indicates that the position of the replaceable component is incorrect (e.g., not concentric with the workpiece support).

[0133] Figure 7 A flowchart of an example method (300) according to an exemplary aspect of the present disclosure is depicted. The method (300) includes a method of replacing a replaceable component in a system for processing a workpiece. By way of example, reference will be made to Figure 2 The method (300) is discussed with reference to a system of FIG. 1 . The method (300) can be implemented in any suitable processing device. Figure 7 The steps performed in a specific order for the purpose of illustration and discussion are depicted. It will be appreciated by those of ordinary skill in the art using the disclosure provided herein that the individual steps of any method described herein may be omitted, expanded, performed simultaneously, rearranged, and / or modified in various ways without departing from the scope of the present disclosure. In addition, various steps (not shown) may be performed without departing from the scope of the present disclosure.

[0134] At (302), the method may include removing a used replaceable component 165 from a processing station 122, 124, 132, 134, 172, 174, 182, or 184. The workpiece handling robot 150 may move an end effector 500 thereon from the transfer chamber 115 to the processing chamber 120 and into the processing station 122 according to a robot arm motion pattern. The robot arm motion pattern may include extending the end effector 500 in a first direction for a first time period, extending the end effector 500 in a second direction transverse to the first direction for a second time period, and extending the end effector 500 in a third direction different from the first direction and the second direction for a third time period. Once the end effector 500 is properly placed in the processing chamber 122, the replaceable component may be placed on the end effector 500. In some embodiments, the end effector 500 may lift the replaceable component 165 from an elevated position in the processing station 122. For example, a plurality of pins connected to a lifting mechanism may be used to lift the replaceable component 165 from its processing position to the elevated position. Once in the raised position, the end effector 500 may be easily placed beneath the replaceable component 165 to lift the replaceable component 165 by the one or more pins.

[0135] Once the replaceable component 165 is placed on the end effector 500, the end effector 500 can be retracted into the transfer chamber 115 through the robot arm motion pattern. For example, the end effector 500 with the used replaceable component 165 thereon can be retracted for a third time period according to a third direction different from the first direction and the second direction, retracted for a second time period according to a second direction transverse to the first direction, and retracted for a first time period according to the first direction until the end effector 500 with the replaceable component 165 thereon is positioned back into the transfer chamber 115.

[0136] At (304), the method includes transferring the replaceable components to a storage chamber. Transferring the replaceable components 165 to the storage chamber 250 may include placing the used replaceable components 165 on the support column 160 in the transfer position 162 using the workpiece handling robot 150. For example, the used replaceable components 165 may be placed on one of the shelves 161 located in the support column 160 in a stacked arrangement. Then, the workpiece handling robot 190 may remove the used replaceable components 165 from the shelf 161 on the support column 160 and transfer the replaceable components 165 to the storage chamber 250. The workpiece handling robot 190 may place the used replaceable components 165 on one of the shelves located in the storage chamber 250.

[0137] At (306), the method includes removing a new replaceable component from the storage chamber. The workpiece handling robot 190 may remove a new replaceable component 165 from one of the shelves in the storage chamber 250 and place the new replaceable component on one of the shelves in a stacked arrangement within the support column 160 in the transfer position 162.

[0138] At (308), the method includes transferring the new replaceable component to the processing station. Once the new replaceable component 165 is placed on one of the shelves 161 in the support column 160, the workpiece handling robot 150 can enter the support column 160 to remove the new replaceable component 165. The workpiece handling robot 150 can then be used to place the new replaceable component in one of the side-by-side processing stations according to the robot arm motion pattern. For example, the workpiece handling robot 150 can move the end effector 500 with the new replaceable component 165 thereon from the transfer chamber 115 to the processing chamber 120 and into the processing station 122 according to the robot arm motion pattern. The robot arm motion pattern can include extending the end effector 500 in a first direction for a first time period, extending the end effector 500 in a second direction transverse to the first direction for a second time period, and extending the end effector 500 in a third direction different from the first direction and the second direction for a third time period. Once the end effector 500 is properly positioned in the processing chamber 122, the new replaceable component 165 can be placed in the processing station in any suitable manner. For example, in one embodiment, the replaceable component 165 (e.g., a focus ring) can be placed on a plurality of pins in a raised position. Once securely placed on the pins, the pins can be lowered to place the replaceable component in a desired position within the processing station 122 so that further workpiece processing can be completed.

[0139] Once the replaceable component 165 is placed in the processing station 122, the end effector 500 can be retracted into the transfer chamber 115 via the robotic arm motion pattern 280. For example, the end effector 500 can be retracted for a third time period according to a third direction different from the first direction and the second direction, for a second time period according to a second direction transverse to the first direction, and for a first time period according to the first direction until the end effector 500 is positioned back into the transfer chamber 115.

[0140] In some embodiments, a workpiece handling robot may remove a test workpiece from a storage location. The test workpiece may be transferred to a processing station. A test process may be performed on the test workpiece. Data collected during the test process and / or characteristics of the test workpiece may be monitored to determine proper placement of the replaceable component.

[0141] Advantageously, the method (300) can be performed to allow for automated replacement of replaceable components without having to break the vacuum of the processing system. Furthermore, the method (300) allows for replacement of replaceable components using a workpiece handling robot capable of transferring workpieces and replaceable components that are larger than the workpieces. Furthermore, the robot arm motion pattern allows an end effector of the workpiece handling robot to access one of the side-by-side processing stations so that the replaceable component can be replaced.

[0142] Figure 8 A flowchart of an example method (400) according to an exemplary aspect of the present disclosure is depicted. The method (400) includes a method for processing a workpiece. By way of example, reference will be made to Figure 2 The method (400) is discussed with reference to a system of FIG. 400. The method (400) can be implemented in any suitable processing device. Figure 8 The steps performed in a specific order for the purpose of illustration and discussion are depicted. It will be appreciated by those of ordinary skill in the art using the disclosure provided herein that the individual steps of any method described herein may be omitted, expanded, performed simultaneously, rearranged, and / or modified in various ways without departing from the scope of the present disclosure. In addition, various steps (not shown) may be performed without departing from the scope of the present disclosure.

[0143] At (402), the method includes transferring a plurality of workpieces to a workpiece column in a load lock chamber. For example, the plurality of workpieces may be transferred from a front end portion of a processing system to a workpiece column 110 in a load lock chamber 114. For example, the workpieces may be transferred to the workpiece column 110 using one or more robots associated with the front end portion of the processing system.

[0144] At (404), the method includes transferring the workpiece from the workpiece column to a processing station in the first processing chamber and / or the second processing chamber using the workpiece handling robot. For example, the workpiece handling robot 150 may transfer two workpieces to the processing station 122 and the processing station 124 in the processing chamber 120, respectively.

[0145] At (406), the method includes performing a first process on the plurality of workpieces in the first process chamber and / or the second process chamber. The first process may include, for example, an annealing process, a thermal process, a surface treatment process, a dry stripping process, a dry etching process, a deposition process, or other processes.

[0146] At (408), the method may include transferring the plurality of workpieces to a transfer position using a workpiece handling robot 150. The workpiece handling robot 150 may transfer two workpieces to a processing station 122 and a processing station 124 in the processing chamber 120, respectively. In some embodiments, the workpiece handling robot 150 may transfer the workpieces to a workpiece column 160 located at a transfer position 162.

[0147] At (410), the method may include transferring the plurality of workpieces from the transfer position to at least two processing stations in the third processing chamber and / or the fourth processing chamber using a second workpiece handling robot 190 disposed in the transfer chamber. The third processing chamber may be disposed in a linear arrangement with the first processing chamber, and the fourth processing chamber may be disposed in a linear arrangement with the second processing chamber. For example, the workpiece handling robot 190 may transfer two workpieces from the workpiece column 160 in the transfer position 162 to the processing station 172 and the processing station 174 in the processing chamber 170, respectively.

[0148] At (412), the method may include performing a second process on the plurality of workpieces in the third process chamber and / or the fourth process chamber. The second process may include, for example, an annealing process, a thermal treatment process, a surface treatment process, a dry stripping process, a dry etching process, a deposition process, or other processes.

[0149] At ( 414 ), the method may include transferring the plurality of workpieces back to the transfer location via the workpiece handling robot 190 . For example, the workpiece handling robot 190 may transfer the workpieces from the processing chamber 170 and / or the processing chamber 180 to the workpiece column 160 located at the transfer location 162 .

[0150] At (416), the method may include transferring the processed workpieces back to the workpiece column in the load lock chamber. For example, the workpiece handling robot 150 may transfer two workpieces from the first processing chamber 120 and / or the second processing chamber 130. In some embodiments, the workpiece handling robot 150 may transfer the two workpieces from the transfer position 162 to the workpiece column in the load lock chamber. Then, one or more robots located at the front end of the processing system may transfer the processed workpieces to, for example, a cassette.

[0151] As shown, (404)-(416) can be repeated according to the number of workpieces that need to be processed. After the desired number of workpieces have been processed or another triggering condition occurs, the method can include replacing a replaceable component (418) in the processing station. For example, after undergoing a certain number of processing treatments, it may be necessary to replace a replaceable component such as a focus ring. Replacement of the replaceable component (418) can be achieved by the method 300 provided herein. Therefore, the present system and method allow for automatic processing of workpieces and automatic replacement of replacement components without having to break the vacuum or change the processing pressure of the system.

[0152] Now turn to Figure 9-12B , depicts an exemplary embodiment of an end effector according to an exemplary embodiment of the present disclosure. More particularly, Fig. 9 Depicted is a perspective view of an exemplary end effector for use within the above-described system. Figures 10A-10B Depicted Fig. 9A first configuration of support elements on an end effector for supporting an example workpiece and a focus ring. In addition, Figures 11A-11B Shows Fig. 9 A second configuration of support elements on the end effector for supporting an example workpiece and a focus ring. In addition, Figures 12A-12B Depicted Fig. 9 A partial perspective view of a third configuration of support elements on an end effector for supporting an example workpiece and focus ring.

[0153] like Fig. 9 As shown, the end effector 500 described above with reference to the systems 100 and 200 can extend between the proximal end 504 and the distal end 506 along the longitudinal axis 502 and between the upper surface 500US and the lower surface 500LS along the vertical direction V1. The end effector 500 is substantially symmetrical with respect to the longitudinal axis 502. The end effector 500 includes an arm portion 508 and a scraper portion 510. The arm portion 508 extends substantially along the longitudinal axis 502 between a first arm end 512 and a second arm end 514, wherein the first arm end 512 is at or near the proximal end 504. Similarly, the scraper portion 510 extends between a first scraper end 516 and a second scraper end 518. The first scraper end 516 is at or near the second arm end 514, and the second scraper end 518 is at or near the distal end 506. The end effector 500 is configured to be attached to a robot (e.g., a workpiece handling robot 150, 190) or otherwise actuatable by the robot via its arm portion 508 so that the scraper portion 510 can be guided under a raised workpiece or replaceable component (e.g., a focus ring).

[0154] Typically, the end effector 500 can be configured to separately support a workpiece and a replaceable component, wherein the diameter of the workpiece is different from the diameter of the replaceable component. Fig. 10A , 11A As shown in FIGS. 12A and 12A , the end effector 500 can be configured to support a workpiece 163 having a diameter 163D and a focus ring 165 having an inner diameter 165ID and an outer diameter 165OD. In some embodiments, the diameter 163D of the workpiece 163 is smaller than the outer diameter 165OD of the focus ring 165. The diameter 163D of the workpiece can be larger than the inner diameter 165ID of the focus ring 165. In order to keep the workpiece 163 and the replaceable component stable when being moved independently by the end effector 500, one or more support pads or elements can be provided on the upper surface of the effector 500.

[0155] In one embodiment, for example Fig. 10A and 10BIn the illustrated embodiment, it is desirable to have separate support elements for the workpiece and the focus ring to prevent cross contamination from a used focus ring. For example, a first support element SE1 is provided to support the workpiece 163, and a second support element SE2 is provided to support the focus ring 165. At least one of the first support elements SE1 is positioned on the arm portion 508, and at least another first support element SE1 is positioned on the scraper portion 510. Similarly, at least one of the second support elements SE2 is positioned on the arm portion 508, and at least another second support element SE2 is positioned on the scraper portion 510. In one embodiment, two separate first support elements SE1 are provided on the arm portion 508 and the scraper portion 510, wherein the shapes of the support elements SE1 are similar or identical. In addition, two separate second support elements SE2 are provided on the scraper portion 510, and an elongated second support element SE2 is provided on the arm portion 508. However, any suitable number and shape of support elements SE1, SE2 may be provided on the arm portion 508 instead. For example, one, three or more first support elements SE1, or two or more second support elements SE2 may be provided on the arm portion 508. In addition, the first support element SE1 on the arm portion 508 may alternatively have a plurality of first support elements SE2. Fig. 10A The second support element SE2 is shown in an elongated shape. In addition, the second support element SE2 on the arm portion 508 may alternatively have the same shape as the second support element SE2 on the scraper portion 510.

[0156] The support elements SE1, SE2 are spaced apart so that the first support element SE1 can only support the workpiece and the second support element SE2 can only support the focus ring. Fig. 10B , the first support element SE1 is spaced apart by a distance D1 along the longitudinal axis 502, the second support element SE2 is spaced apart by a distance D2 along the longitudinal axis 502, and the support elements SE1, SE2 on the arm portion 508 and the support elements SE1, SE2 on the scraper portion 510 are spaced apart by a third distance D3, respectively. However, in some embodiments, the support elements SE1, SE2 on the arm portion 508 may alternatively be spaced apart by different distances from the support elements SE1, SE2 on the scraper portion 510. The distances D1, D2, and D3 are selected so that when the workpiece is supported on the first support element SE1, the workpiece does not contact the second support element SE2. Similarly, when the focus ring is supported on the second support element SE2, the focus ring does not contact the first support element SE1.

[0157] In some embodiments, the second support element SE2 on the scraper portion 510 is closer to the distal end 506 of the end effector 500 than the first support element SE1 on the scraper portion 510. Similarly, in one embodiment, the second support element SE2 on the arm portion 508 is closer to the proximal end 504 of the end effector 500 than the first support element SE1 on the arm portion 508.

[0158] Furthermore, in some embodiments, the first support element SE1 on the scraper portion 510 is located farther from the longitudinal axis 502 than the second support element SE2 on the scraper portion 510. For example, the first support element SE1 on the scraper portion 510 is spaced apart from the axis 502 by a first distance L1 in a direction substantially perpendicular to the axis 502, and the second support element SE2 on the scraper portion 510 is spaced apart from the axis 502 by a second distance L2 in a direction substantially perpendicular to the axis 502, wherein the first distance L1 is greater than the second distance L2.

[0159] In another embodiment, for example Fig.11A and 11B In the embodiment shown in , the risk of cross contamination between the used focus ring and the workpiece is relatively low, so that one or more support elements can be configured to support the workpiece and the focus ring. For example, in addition to the first support element SE1 and the second support element SE2 on the scraper portion 510, a common or shared support element CSE1 is provided on the arm portion 508. The shared support element CSE1 is configured to support the workpiece 163 together with the first support element SE1, and to support the focus ring 165 together with the second support element SE2.

[0160] Similar to Fig. 10B ,exist Fig. 11B, the first support element SE1 and the second support element SE2 are spaced apart so that the first support element SE1 and the first contact area CA1 of the common support element CSE1 can only support the workpiece, and the second support element SE2 and the second contact area CA2 of the common support element CSE1 can only support the focus ring. For example, the first support element SE1 and the first contact area CA1 are spaced apart by a distance D1 along the longitudinal axis 502, the second support element SE2 and the second contact area CA2 are spaced apart by a distance D2 along the longitudinal axis 502, and the support elements SE1, SE2 on the arm portion 508 and the contact areas CA1, CA2 on the scraper portion 510 are spaced apart by a third distance D3, respectively. However, in some embodiments, the contact areas CA1, CA2 on the arm portion 508 may alternatively be spaced apart from the support elements SE1, SE2 on the scraper portion 510 by different distances. The distances D1, D2, and D3 are selected so that when the workpiece is supported on the first support element SE1 and the first contact area CA1, the workpiece does not contact the second support element SE2 or the second contact area CA2. Similarly, when the focus ring is supported on the second support element SE2 and the second contact area CA2, the focus ring does not contact the first support element SE1 or the first contact area CA1. Thus, the first contact area CA1 for supporting the workpiece 163 is separated from or does not overlap the second contact area CA2 for supporting the focus ring 165.

[0161] As described above, in some embodiments, the second support element SE2 on the scraper portion 510 is located closer to the distal end 506 of the end effector 500 than the first support element SE1 on the scraper portion 510. Similarly, in one embodiment, the second contact area CA2 is located closer to the proximal end 504 of the end effector 500 than the first contact area CA1 of the common support element CSE1 on the arm portion 508.

[0162] Furthermore, in some embodiments, the first support element SE1 on the scraper portion 510 is located farther from the longitudinal axis 502 than the second support element SE2 on the scraper portion 510. For example, the first support element SE1 on the scraper portion 510 is spaced apart from the axis 502 by a first distance L1 in a direction substantially perpendicular to the axis 502, and the second support element SE2 on the scraper portion 510 is spaced apart from the axis 502 by a second distance L2 in a direction substantially perpendicular to the axis 502, wherein the first distance L1 is greater than the second distance L2.

[0163] Alternatively, in some embodiments, for example Fig. 12A and 12B In the embodiment shown, the first and second contact areas CA1, CA2 at least partially overlap. Fig. 12AAs shown, the workpiece and the focus ring, which are respectively supported on the end effector 500, are configured to be supported on a common contact area CCA on a common support element CSE1. Fig. 12B As shown, the first support element SE1 and the common contact area CCA are spaced apart by a distance D1 along the longitudinal axis 502, the second support element SE2 and the common contact area CCA are spaced apart by a distance D2 along the longitudinal axis 502, and the support elements SE1, SE2 on the arm portion 508 are spaced apart by a third distance D3'. The distances D1, D2, and D3' are selected so that when a workpiece is supported on the first support element SE1 or the focus ring is supported on the second support element SE2, the workpiece and the focus ring contact the common contact area CCA. In this way, when the common contact area CCA is allowed, the common support element CSE1 can be smaller than when separate contact areas (e.g., contact areas CA1, CA2) are used.

[0164] Fig. 12A and 12B The embodiment of the end effector 500 shown may be used in other ways. Fig.11A and 11B The illustrated embodiments of the end effector 500 are configured identically. For example, as described above, in some embodiments, the second support element SE2 on the scraper portion 510 is positioned closer to the distal end 506 of the end effector 500 than the first support element SE1 on the scraper portion 510. Additionally, in embodiments, the first support element SE1 on the scraper portion 510 is positioned farther from the longitudinal axis 502 than the second support element SE2 on the scraper portion 510. For example, the first support element SE1 on the scraper portion 510 may be spaced apart from the axis 502 by a first distance in a direction substantially perpendicular to the axis 502, and the second support element SE2 on the scraper portion 510 may be spaced apart from the axis 502 by a second distance in a direction substantially perpendicular to the axis 502, wherein the first distance is greater than the second distance.

[0165] Reference now Figure 13-17 , depicts an exemplary embodiment of the above-mentioned adjustment assembly for a workpiece processing station. In particular, Fig.13 A focus ring adjustment assembly of an example processing system is depicted. Fig.14A Depicted Fig.13 A side cross-sectional view of the adjustment assembly is shown with the focus ring in the lowered position. Similarly, Fig. 14B Depicted Fig.13 A side cross-sectional view of the adjustment assembly is shown with the focus ring in a raised position. In addition, Fig.15A Depicted with Fig.13 A cross-sectional view of a first embodiment of a focus ring for use with an adjustment assembly is shown, and Fig. 15B Depicted with Fig.13A cross-sectional view of a second embodiment of a focus ring for use with an adjustment assembly is shown. Fig.16 Depicted Figures 14A-14B A top view of the pin support plate of the adjustment assembly shown in FIG. Fig.17 Depicted is a diagram for use according to an example embodiment of the present disclosure Figures 14A-14B Schematic diagram of the actuation system of the adjustment assembly shown in .

[0166] As described above, the workpiece processing system (e.g., system 100, 200) includes a workpiece support (e.g., station 122, 124, 132, 134) within a processing chamber (e.g., 120, 130, 170, 180) configured to support a workpiece (e.g., workpiece 113, 163) during a process processing step. Fig.13 As shown, the focus ring 165 is positioned around the periphery or outer diameter of a workpiece supported on a workpiece support 163. The focus ring 165 can be used, for example, to shape a plasma near the workpiece. During plasma processing in a plasma processing chamber, the focus ring 165 is exposed to the plasma and, therefore, to deposition and corrosion. As a result, the focus ring 165 may need to be periodically replaced in a plasma processing chamber as part of preventative maintenance. A focus ring adjustment assembly 600 is provided that allows the focus ring 165 to be moved between a working position or processing position and one or more elevated positions in which the focus ring 165 is not easily accessible for removal from the processing chamber. In at least one elevated position, the focus ring is more accessible for removal from the processing chamber.

[0167] The focus ring adjustment assembly 600 includes a plurality of pins for supporting the focus ring. Fig.14A and 14B As shown, the focus ring 165 is supported by pins 602 (only one of which is shown). Each pin 602 extends between a proximal end 602P and a distal end 602D, wherein the distal end 602D is configured to contact the focus ring 165. As will be described in more detail below, the pins 602 can be configured to selectively contact a portion of the focus ring 165 (e.g., in a groove) such that lateral movement of the ring 165 on the pins 602 is at least partially prevented or reduced. The assembly 600 also includes a lifting mechanism that can be used to raise or lower the pins 602 to raise the focus ring 165 from the processing position to the raised position or to lower the focus ring 165 to the processing position, respectively. In the processing position, the pins 602 can no longer contact the focus ring, and the focus ring 165 can be supported by the base (e.g., a step structure in the base). As will be described in more detail below, assembly 600 also includes floating couplings 604 slidably received within a pin support plate 606 , wherein a proximal end 602P of each pin 602 is coupled to a corresponding one of the floating couplings 604 , and wherein the pin support plate 606 is movable to raise or lower the pin 602 .

[0168] In one embodiment, Fig.15A As shown, the focus ring 165A has a stepped cross-sectional profile. More specifically, the focus ring 165A extends between the upper side 165US and the lower side 165LS along the vertical direction V1, wherein the lower side 165LS has a first surface portion P1, a second surface portion P2, and a transition portion T1 between the first surface portion P1 and the second surface portion P2. The first surface portion P1 is vertically above the second surface portion P2. In some embodiments, the first surface portion P1 is radially outside the second surface portion P2. The distal end 602D of the pin 602 is configured to selectively contact the first surface portion P1 (e.g., one or more grooves in the first surface portion P1), thereby preventing the focus ring 165A from sliding laterally and becoming at least partially out of position from the pin 602. In addition, the first surface portion P1 is substantially flat, so that the distal end 602D of the pin 602 is in full contact with the first surface portion P1 (e.g., one or more grooves or slots in the first surface portion P1).

[0169] In some embodiments, the focus ring has three back radial slots to receive pins 602. This configuration can fix the position of the focus ring 165A, allowing the focus ring to be accurately centered on the base and can also prevent lateral movement. The back radial slots can also allow the focus ring to thermally expand when supported by the pins 602. In some embodiments, the focus ring may include a back annular groove. The back annular groove extends annularly around the back surface of the focus ring. The back annular groove may include an outer diameter and an inner diameter. The pin 602 can be configured to contact the outer diameter. During thermal expansion of the focus ring, the pin 602 may no longer contact the outer diameter, but instead slide radially in the groove in a direction toward the inner diameter to accommodate the thermal expansion of the focus ring.

[0170] In some embodiments, Fig. 15BAs shown, the focus ring 165B has a cross-sectional profile with grooves. More specifically, the focus ring 165B extends between the upper side 165US' and the lower side 165LS' along the vertical direction V1, and extends between the inner surface 165IS' and the outer surface 165OS' along the radial direction, wherein the groove G1 is recessed into the lower side 165LS' so that it is spaced apart from the inner surface 165IS' and the outer surface 165OS'. The groove G1 may be an annular groove that extends annularly all the way around the focus ring 165B. The distal end 602D of the pin 602 is configured to selectively contact at least a portion of the groove G1. The groove G1 defines a first groove portion extending a first distance VD1 from the lower side 165LS' and a second groove portion extending a second distance VD2 from the lower side 165LS'. The second distance VD2 is less than the thickness of the focus ring 165B defined between the upper side 165US' and the lower side 165LS' along the vertical direction V1. The first surface portion P1' is located at a first distance VD1 from the lower side 165LS', the second surface portion P2' is located at a second distance VD2 from the lower side 165LS', the first transition portion T1' extends between the first surface portion P1' and the lower side 165LS', and the second transition portion T2' extends between the first surface portion P1' and the second surface portion P2'. The second surface portion P2' is vertically above the first surface portion P1'. The distal end 602D of the pin 602 is configured to selectively contact at least one of the second surface portion P2' or the second transition portion T2'. The second surface portion P2' is substantially flat so that the distal end 602D of the pin 602 can completely contact the second surface portion P2'. In addition, in some embodiments, the pin 602 has a main body portion MB extending between its proximal end 602P and the distal end 602D and a flange portion FP extending outwardly from the main body portion MB at an offset distance OH1 from the distal end 602D. The diameter 602D2 of the flange portion FP is greater than the diameter 602D1 of the body portion MB of the pin 602. The flange portion FP is configured to contact at least one of the first surface portion P1' or the first transition portion T1'. In this way, the focus ring 165B is prevented from sliding laterally and becoming at least partially out of position from the pin 602.

[0171] Additionally or alternatively, in some embodiments, the shape of the groove G1 of the focus ring 165B, the shape of the pin 602, or both are configured such that rotation of the pin 602 stabilizes or secures the focus ring 165B to the pin 602. For example, rotation of the pin 602 through a predetermined locking angle may secure the focus ring 165B to the pin 602.

[0172] exist Fig.166. A top view of a suitable pin support plate is shown in FIG. The pin support plate 606 has a plurality of floating coupling slots 608 that are circumferentially spaced around the perimeter of the pin support plate 606. The slots 608 extend generally radially outward from the outer perimeter of the plate 606. However, in some embodiments, the slots 608 may extend radially inward from the inner perimeter of the plate 606. Each floating coupling slot 608 is configured to receive a corresponding one of the floating couplings 604. For example, each floating coupling slot 608 has a slot width W1 that is greater than the outer diameter 604D1 of the floating coupling 604, but less than the outer diameter 604D2 of a flange portion of the floating coupling 604 that extends outward from the outer diameter 604D1 of the floating coupling 604. Thus, when mounted within the floating coupling slot 608, the flange portion of the floating coupling 604 may rest on an upper surface of the floating coupling slot 608. Thus, such a floating coupling slot 608 may allow the pin 602 to move slightly laterally along the x-axis and / or y-axis in a horizontal plane relative to the focus ring 165 or workpiece support.

[0173] The pin support plate 606 is configured to be actuated between a lowered position and one or more raised positions so that the focus ring 165 is moved between the processing position and the one or more raised positions, respectively. Fig.14A As shown, the pin support plate 606 is in its lowered position relative to the main support rod 620 fixed within the processing chamber and the support ring 622 fixed to the main support rod 620. In such a lowered position of the pin support plate 606, the pins 602 supported on the pin support plate 606 by the floating coupling 604 are in their retracted position so that the focus ring 165 is in its processing position and supported by the workpiece support. In some embodiments, the pins 602 can be moved by the pin support plate 606 so that the pins 602 do not contact the focus ring 165 when they are in their retracted position. However, in other embodiments, when the pins 602 are in their retracted position, they can remain in contact with the focus ring 165.

[0174] The pin support plate 606 can move relative to the main support rod 620 and the support ring 622 Fig. 14B606 is vertically higher in its raised position than in its lowered position. When the pin support plate 606 is moved to such a raised position, the pins 602 supported on the pin support plate 606 by the floating coupling 604 are moved in the vertical direction to their extended positions, so that the focus ring 165 is moved to its raised position above the workpiece support. When the pins 602 are in their extended positions, the focus ring 165 is vertically positioned higher in the vertical direction V1 than when the pins 602 are in their retracted positions. Once in the raised position, an end effector (e.g., end effector 500) can be easily placed under the focus ring 165 to lift the focus ring 165 from one or more pins 602 and out of the chamber.

[0175] like Fig.17 As shown, the assembly 600 also includes a plate actuator 624 for moving the pin support plate 606. The plate actuator 624 is positioned outside the processing chamber and is vacuum sealed. More specifically, the plate actuator 624 has a vacuum sealed housing 626, which is coupled to the outer wall EXT1 of the processing chamber; and a connecting shaft 628, which extends through the outer wall EXT1 of the processing chamber in the vacuum sealed housing 626. The connecting shaft 628 supports the pin support plate 606 and can be moved relative to the outer wall EXT1 by an actuator mechanism 632. The actuator mechanism 632 is configured to move the connecting shaft 628 between a first position associated with the pin support plate 606 in a lowered position along the vertical direction and a second position associated with the pin support plate 606 in an ascending position along the vertical direction, and / or one or more different vertical positions. The actuator mechanism 632 can be configured as any suitable actuator for moving the connecting shaft 628 between the first position and the second position. For example, in some embodiments, the actuator mechanism 632 is configured as a linear actuator, a rotary actuator, etc. By positioning the actuator mechanism 632 outside of the processing chamber, the mechanism 632 can be repaired or replaced without affecting the vacuum of the processing chamber.

[0176] The focus ring 165 can be configured to be installed in the chamber at a specific azimuth orientation relative to the workpiece support. Typically, the focus ring 165 is positioned in a storage chamber (e.g., storage chamber 250) to have the proper azimuth orientation when removed from the storage chamber for installation in the processing chamber. However, in some embodiments, it is desirable to further adjust the azimuth position of the focus ring 165. In such embodiments, the storage chamber and / or the end effector for moving the focus ring 165 may include one or more features for adjusting the azimuth position of the focus ring 165.

[0177] Reference now Fig.18, a plasma processing device 700 according to an exemplary embodiment of the present disclosure is provided. The plasma processing device 700 may include a processing chamber 701 defining a vertical direction V and a lateral direction L. The plasma processing device 700 may include a susceptor 704 disposed in an interior space 702 of the processing chamber 701. The susceptor 704 may be configured to support a substrate 706, such as a semiconductor wafer, in the interior space 702. A dielectric window 710 is located above the susceptor 704 and serves as a ceiling of the interior space 702. The dielectric window 710 includes a central portion 712 and an angled peripheral portion 714. The dielectric window 710 includes a space for a showerhead 720 in the central portion 712 to feed a processing gas into the interior space 702.

[0178] In some embodiments, the plasma processing apparatus 700 may include a plurality of inductive elements, such as a primary inductive element 730 and a secondary inductive element 740, for generating an inductive plasma in the interior space 702. The primary inductive element 730 and the secondary inductive element 740 may each include a coil or an antenna element, which, when supplied with RF power, may induce plasma in a process gas in the interior space 702 of the process chamber 701. For example, a first RF generator 760 may be configured to provide electromagnetic energy to the primary inductive element 730 through a matching network 762. A second RF generator 770 may be configured to provide electromagnetic energy to the secondary inductive element 740 through a matching network 772.

[0179] Although the present disclosure refers to a primary inductive element and a secondary inductive element, it will be understood by those of ordinary skill in the art that the terms primary and secondary are used for convenience only. The secondary coil may be operated independently of the primary coil. The primary coil may be operated independently of the secondary coil. Additionally, in some embodiments, a plasma processing apparatus may have only a single inductive coupling element.

[0180] In some embodiments, the plasma processing apparatus 700 can include a metal shield 752 disposed around the secondary inductive element 740. In this manner, the metal shield 752 separates the primary inductive element 730 and the secondary inductive element 740 to reduce crosstalk between the primary inductive element 730 and the secondary inductive element 740.

[0181] In some embodiments, the plasma processing apparatus 700 can include a first Faraday shield 754 disposed between the primary inductive element 730 and the dielectric window 710. The first Faraday shield 754 can be a slotted metal shield that reduces capacitive coupling between the primary inductive element 730 and the process chamber 701. As shown, the first Faraday shield 754 can be mounted over an angled portion of the dielectric window 710.

[0182] In some embodiments, the metal shield 752 and the first Faraday shield 754 can form a single body 750 for ease of manufacturing and other purposes. The multi-turn coil of the primary inductive element 730 can be located adjacent to the first Faraday shield 754 of the single body 750. The secondary inductive element 740 can be located near the metal shield 752 of the single body 750, for example, between the metal shield 752 and the dielectric window 710.

[0183] The arrangement of the primary inductive element 130 and the secondary inductive element 140 on opposite sides of the metal shield 752 allows the primary inductive element 730 and the secondary inductive element 740 to have different structural configurations and perform different functions. For example, the primary inductive element 730 may include a multi-turn coil located near the peripheral portion of the process chamber 701. The primary inductive element 730 may be used for basic plasma generation and reliable startup during the inherent transient ignition stage. The primary inductive element 730 may be coupled to a powerful RF generator and an expensive auto-tuning matching network, and may operate at an increased RF frequency (e.g., about 13.56 MHz). As used herein, the term "about" refers to a range of values ​​within 20% of the stated value.

[0184] In some embodiments, the secondary inductive element 740 can be used for correction and auxiliary functions as well as for improving the stability of the plasma during steady-state operation. In addition, because the secondary inductive element 740 can be used primarily for correction and auxiliary functions as well as for improving the stability of the plasma during steady-state operation, the secondary inductive element 740 does not have to be coupled to a powerful RF generator like the primary inductive element 730, and thus can be designed differently and cost-effectively to overcome the difficulties associated with previous designs. As discussed in detail below, the secondary inductive element 740 can also be operated at a lower frequency (e.g., about 2 MHz), thereby allowing the secondary inductive element 740 to be very compact and fit into the limited space on top of the dielectric window.

[0185] In some embodiments, the primary inductive element 730 and the secondary inductive element 740 may be operated at different frequencies. The frequencies may be sufficiently different to reduce crosstalk in the plasma between the primary inductive element 730 and the secondary inductive element 740. For example, the frequency applied to the primary inductive element 730 may be at least about 1.5 times the frequency applied to the secondary inductive element 730. In some embodiments, the frequency applied to the primary inductive element 730 may be about 13.56 MHz, and the frequency applied to the secondary inductive element 740 may be in the range of about 1.75 MHz to about 2.15 MHz. Other suitable frequencies may also be used, such as about 400 kHz, about 4 MHz, and about 27 MHz. Although the present disclosure is discussed with reference to the primary inductive element 730 operating at a higher frequency relative to the secondary inductive element 740, it will be understood by a person of ordinary skill in the art using the disclosure provided herein that the secondary inductive element 740 may be operated at a higher frequency without departing from the scope of the present disclosure.

[0186] In some embodiments, the secondary inductive element 740 may include a planar coil 742 and a magnetic flux concentrator 744. The magnetic flux concentrator 744 may be made of a ferrite material. Using a magnetic flux concentrator with an appropriate coil may allow the secondary inductive element 740 to have high plasma coupling and good energy transfer efficiency, and may significantly reduce its coupling with the metal shield 752. Using a lower frequency (e.g., about 2 MHz) on the secondary inductive element 740 may increase the skin layer, which also improves the plasma heating efficiency.

[0187] In some embodiments, the primary inductive element 730 and the secondary inductive element 740 can carry different functions. For example, the primary inductive element 730 can be used to perform the basic function of plasma generation during ignition and provide sufficient priming for the secondary inductive element 740. The primary inductive element 730 can have coupling to both the plasma and the grounded shield to stabilize the plasma potential. The first Faraday shield 754 associated with the primary inductive element 730 avoids window sputtering and can be used to provide coupling to the grounded shield.

[0188] The additional coil can be operated in the presence of a good plasma start provided by the primary inductive element 730, and therefore, the additional coil preferably has good plasma coupling and good energy transfer efficiency to the plasma. The secondary inductive element 740 including the flux concentrator 744 provides both good flux transfer to the plasma volume and good decoupling of the secondary inductive element 740 from the surrounding metal shield 752. The symmetrical driving of the flux concentrator 744 and the secondary inductive element 740 further reduces the voltage amplitude between the coil ends and the surrounding ground elements. This can reduce sputtering of the dome, but at the same time introduces some small capacitive coupling to the plasma, which can be used to assist ignition. In some embodiments, a second Faraday shield can be used in conjunction with the secondary inductive element 740 to reduce the capacitive coupling of the secondary inductive element 740.

[0189] In some embodiments, the plasma processing apparatus 700 may include a radio frequency (RF) bias electrode 760 disposed within the processing chamber 701. The plasma processing apparatus 700 may also include a ground plane 770 disposed within the processing chamber 701 such that the ground plane 770 is spaced apart from the RF bias electrode 760 along a vertical direction V. As shown, in some embodiments, the RF bias electrode 760 and the ground plane 770 may be disposed within the susceptor 704.

[0190] In some embodiments, the RF bias electrode 760 can be coupled to an RF power generator 780 via a suitable matching network 782. When the RF power generator 780 provides RF energy to the RF bias electrode 760, a plasma can be generated from the mixture in the process chamber 701 to be directly exposed to the substrate 706. In some embodiments, the RF bias electrode 760 can define an RF zone 762 extending between a first end 764 of the RF bias electrode 760 and a second end 766 of the RF bias electrode 760 along a lateral direction L. For example, in some embodiments, the RF zone 762 can span from the first end 764 of the RF bias electrode 760 to the second end 766 of the RF bias electrode 760 along the lateral direction L. The RF zone 762 can further extend between the RF bias electrode 760 and the dielectric window 710 along a vertical direction V.

[0191] It should be understood that the length of the ground plane 770 along the lateral direction L is greater than the length of the RF bias electrode 760 along the lateral direction L. In this way, the ground plane 770 can direct the RF energy emitted by the RF bias electrode 760 toward the substrate 706 .

[0192] Reference now Fig.19 and 20 , a plasma processing device 700 ( Fig.18) of the focus ring 790. As shown in the figure, the focus ring adjustment assembly 800 includes a lifting pin 810 that can move along the vertical direction V to make the focus ring 790 at least in the first position ( Fig.19 ) and the second position ( Fig. 20 ), thereby adjusting the distance between the focus ring 790 and the base 704 along the vertical direction V. For example, when the focus ring 790 is in the first position ( Fig.19 ), the focus ring 790 can be spaced apart from the base 704 by a first distance D1 (e.g., zero or very close to zero, so that the focus ring is supported on the base 704). In addition, when the focus ring 790 is in the second position ( Fig. 20 ), the focus ring 790 can be spaced apart from the base 704 by a second distance D2. As shown, the second distance D2 can be different from the first distance D1. In particular, the second distance D2 can be greater than the first distance D1. In this manner, the focus ring adjustment assembly 800, and in particular the pin 810 thereof, can move the focus ring 790 from the first position ( Fig.19 ) moves to the second position ( Fig. 20 ) to facilitate the use of, for example, the above reference Figures 9 to 12B The end effector in question moves the focus ring 790 out of the process chamber 701 .

[0193] As shown, the lift pins 810 can be located outside of the RF zone 762 defined by the RF bias electrode 760. In addition, the lift pins 810 can penetrate the ground plane 770. For example, in some embodiments, the lift pins 810 can extend through openings defined by the ground plane 770. It should be appreciated that positioning the lift pins 810 outside of the RF zone 762 and additionally having the lift pins 810 penetrate the ground plane 770 can reduce arcing risks associated with applying RF power (e.g., bias power) from the RF power generator 780 to the RF bias electrode 760 during plasma processing. In addition, interference (e.g., electrical and mechanical interference) between the lift pins 810 and the focus ring 790 can be reduced.

[0194] In some embodiments, the focus ring adjustment assembly 800 may include an actuator 820 configured to move the lift pin 810 along the vertical direction V to facilitate the focus ring 790 to be adjusted between at least the first position ( Fig.19 ) and the second position ( Fig. 20 ). As shown in the figure, the actuator 820 can be located outside the processing chamber 701. In addition, the focus ring adjustment assembly 800 can include a second actuator 822, which is configured to rotate the lifting pin 810 around the vertical direction V. As shown in the figure, the second actuator 822 can be located outside the processing chamber 701.

[0195] Although the subject matter has been described in detail with respect to specific exemplary embodiments of the subject matter, it should be understood that those skilled in the art can easily generate replacements, modifications and equivalents of such embodiments after understanding the foregoing. Therefore, the scope of the present disclosure is by way of example rather than by way of limitation, and the present disclosure does not exclude such modifications, modifications and / or additions to the subject matter that would be obvious to those of ordinary skill in the art.

Claims

1. A system for processing a workpiece, comprising: a front end portion configured to be maintained at atmospheric pressure; a load lock chamber disposed between the front end portion and the vacuum portion; one or more processing chambers disposed in the vacuum portion, each processing chamber comprising two or more processing stations; at least one transfer chamber disposed in the vacuum portion; and a storage chamber configured to store one or more replaceable components, coupled to the at least one transfer chamber; one or more workpiece handling robots disposed in the at least one transfer chamber, the one or more workpiece handling robots being configured to move the one or more replaceable components between the storage chamber and the one or more processing chambers, wherein the one or more workpiece handling robots include an end effector configured to support a replaceable component; a controller configured to control movement of the end effector to approach the processing station according to a robot arm motion pattern, wherein the robot arm motion pattern includes extending a first time period in a first direction, extending a second time period in a second direction transverse to the first direction, and extending a third time period in a third direction different from the first direction and the second direction.

2. The system according to claim 1, wherein: The robot arm motion pattern includes retracting the end effector according to the same pattern.

3. The system according to claim 1, wherein: The one or more process chambers include a first process chamber and a second process chamber disposed on opposite sides of the transfer chamber.

4. The system according to claim 1, wherein: The one or more processing chambers include a first processing chamber and a second processing chamber arranged on opposite sides of the transfer chamber, and the one or more processing chambers also include a third processing chamber arranged in a linear arrangement with the first processing chamber and a fourth processing chamber arranged in a linear arrangement with the second processing chamber, so that the third processing chamber and the fourth processing chamber are arranged on opposite sides of the transfer chamber, wherein each of the first processing chamber, the second processing chamber, the third processing chamber and the fourth processing chamber includes at least two processing stations, and wherein the transfer chamber includes a transfer position, which is configured to support workpieces and replaceable parts in a stacked arrangement.

5. The system according to claim 4, wherein: The one or more workpiece handling robots include a first workpiece handling robot and a second handling robot, the first workpiece handling robot being configured to transfer workpieces and replaceable parts from the workpiece column, the first processing chamber, the second processing chamber and the transfer position, and the second workpiece handling robot being configured to transfer workpieces and replaceable parts from the storage chamber, the third processing chamber, the fourth processing chamber and the transfer position to perform automatic processing of the workpiece and automatic replacement of replaceable parts without destroying the vacuum.

6. The system according to claim 4, wherein: The stacking arrangement includes a plurality of shelves configured to accommodate workpieces and replaceable components, the replaceable components having a diameter greater than a diameter of the workpieces.

7. The system according to claim 1, wherein: The processing chamber is configured to perform a plasma etching process using direct plasma.

8. The system according to claim 1, wherein: The two or more processing stations are arranged side by side.

9. The system according to claim 8, wherein: The two or more processing stations are associated with a workpiece support for supporting a workpiece during processing in the processing chamber, wherein the workpiece support includes a pedestal assembly, the pedestal assembly including a base plate, an electrostatic chuck configured to support the workpiece, and a replaceable component, the replaceable component including a focus ring, the focus ring being arranged relative to the electrostatic chuck so that when the workpiece is positioned on the electrostatic chuck, at least a portion of the focus ring at least partially surrounds a periphery of the workpiece.

10. The system according to claim 1, wherein: The replaceable component includes a focus ring having a diameter greater than a diameter of the workpiece.

11. The system according to claim 1, wherein: The storage chamber includes a plurality of shelves configured to accommodate used replaceable components and new replaceable components.

12. The system according to claim 11, wherein: The plurality of shelves are coupled to an elevator such that the elevator is configured to move replaceable components up and down within the storage compartment.

13. The system of claim 1, wherein: The storage chamber is a storage chamber with vacuum capability, and the storage chamber includes one or more access doors configured to allow the workpiece robot to approach the replaceable parts in the storage chamber and one or more access doors configured to allow new replaceable parts or used replaceable parts to be replaced from the atmospheric environment.

14. The system of claim 1, wherein: The workpiece handling robot is configured to transfer one or more replaceable components from the storage chamber to at least two processing stations in the processing chamber using a scissor-type motion.

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