Position calibration method

Abstract

The embodiment of the application provides a position calibration method, which is used for calibrating a drying device, and the drying device further comprises a bearing disc, a spray rod and a support arm, the bearing disc is used for bearing a wafer when the drying device dries the wafer, the spray rod is used for spraying fluid to the wafer, the spray rod is arranged on the support arm, and the support arm is used for adjusting the position of the spray rod; the position calibration method comprises a calibration disc and a nozzle pointing piece; the calibration disc is used for being assembled between the spray rod and the bearing disc and is parallel to the bearing disc, and an identification area is arranged on the side of the calibration disc close to the spray rod; the nozzle pointing piece is detachably connected to the spray rod, the nozzle pointing piece has a tip end located on a spraying path of the spray rod, the position of the spray rod on the support arm is adjusted, the tip end of the nozzle pointing piece driven by the spray rod is aligned with the identification area, and the position of the nozzle of the spray rod is calibrated. According to the scheme, the difficulty of calibrating the position of the spray rod is reduced.

Description

Technical Field

[0001] This application relates to the field of wafer drying technology, and more particularly to a position calibration method. Background Technology

[0002] To improve the surface quality of semiconductor wafers, they must be dried after cleaning to remove as many deionized water spots or residues as possible from the wafer surface, thus minimizing the risk of defects caused by impurities on the wafer surface.

[0003] Current drying equipment includes a cavity, a disk, and a spray bar. The disk and spray bar are located inside the cavity. During the use of the drying equipment, the wafer to be dried can be fixed on the disk to keep the wafer in place inside the cavity. Then, the spray bar is automatically controlled to move to the initial position and move from the initial position. At the same time, the disk is controlled to rotate, and the spray bar sprays fluid onto the wafer to achieve cleaning and drying of the wafer.

[0004] However, the above process requires accurate calibration of the initial position of the spray bar. Currently, this is achieved by staff directly observing whether the fluid sprayed from the spray bar falls into the preset area of ​​the disk. Since a wafer needs to be placed between the nozzle of the spray bar and the disk, the distance between the nozzle of the spray bar and the disk is relatively large, and the space inside the cavity is limited. Therefore, the positional error between the fluid landing point estimated by observation and the preset area is relatively large, making the calibration process difficult. Summary of the Invention

[0005] In view of this, embodiments of this application provide a location calibration method to at least partially solve the above-mentioned problems.

[0006] According to a first aspect of the present application, a position calibration method is provided for calibrating a drying device. The drying device further includes a support plate, a spray bar, and a support arm. The support plate is used to support a wafer when the drying device dries a wafer. The spray bar is used to spray fluid onto the wafer. The spray bar is disposed on the support arm, and the support arm is used to adjust the position of the spray bar. The position calibration method includes a calibration disk and a nozzle guide. The calibration disk is assembled between the spray bar and the support plate and is parallel to the support plate. A marking area is provided on the side of the calibration disk near the spray bar. The nozzle guide is detachably connected to the spray bar and has a tip located on the spray path of the spray bar. By adjusting the position of the spray bar on the support arm, the spray bar drives the tip of the nozzle guide to align with the marking area, thereby calibrating the position of the nozzle of the spray bar.

[0007] According to a second aspect of the embodiments of this application, a position calibration method is provided, which is based on the position calibration method described in the first aspect above. The position calibration method includes: mounting the calibration disk on the carrier disk; mounting the nozzle pointing member on the spray bar; and adjusting the position of the spray bar on the support arm to move the tip of the nozzle pointing member until the tip is aligned with the marking area on the calibration disk.

[0008] In this embodiment, when calibrating the position of the nozzle of the spray bar using a position calibration method, the calibration plate can be installed on the carrier plate first, and then the position of the spray bar can be adjusted by the support arm until the nozzle of the spray bar moves to the vicinity of the marked area on the calibration plate. Then, the nozzle guide is installed on the spray bar, and the position of the spray bar on the support arm is adjusted so that the spray bar moves the tip until the tip aligns with the marked area, thereby calibrating the position of the nozzle of the spray bar. After the tip aligns with the marked area, the spray bar and the support arm can be fixed relative to each other, the calibration plate can be removed from the carrier plate, the wafer can be installed on the carrier plate, and the nozzle guide can be removed from the spray bar so that the wafer can be dried subsequently. Therefore, the position calibration of the nozzle of the spray bar before wafer drying is achieved by observing whether the tip of the nozzle guide is aligned with the marked area on the calibration plate. The tip of the nozzle guide is on the gas injection path of the spray bar, making the distance between the tip of the nozzle guide and the calibration plate smaller. This reduces the error in estimating whether the tip of the nozzle guide is aligned with the marked area on the calibration plate, making the position calibration of the nozzle of the spray bar more accurate. Thus, the difficulty of calibrating the position of the spray bar is reduced. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0010] Figure 1 This is a schematic diagram of the structure of a drying device according to an embodiment of this application;

[0011] Figure 2 This is a schematic flowchart of a location calibration scheme according to an embodiment of this application;

[0012] Figure 3 This is a schematic diagram showing the positions of each component during the calibration process according to one embodiment of this application;

[0013] Figure 4 This is a schematic diagram of the calibration disk according to one embodiment of this application;

[0014] Figure 5 This is a schematic diagram of the structure of a nozzle pointing component according to an embodiment of this application;

[0015] Figure 6 This is a schematic diagram of the detection seat in a parallel position according to an embodiment of this application;

[0016] Figure 7 This is a schematic diagram of another embodiment of the present application where the detection seat is not in a parallel position;

[0017] Figure 8 This is a flowchart illustrating a location calibration scheme according to another embodiment of this application.

[0018] Explanation of reference numerals in the attached figures:

[0019] 1. Carrier plate; 2. Spray bar; 21. First straight bar; 22. Second straight bar; 3. Calibration plate; 31. Marking area; 32. Support column; 321. Detection seat; 4. Nozzle guide; 41. Tip; 42. Clamp; 5. Cavity; 6. Retaining ring; 61. Target side; 7. Support rod. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0021] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0022] This application provides a position calibration method for calibrating drying equipment. The drying equipment can be a drying equipment based on the Marangoni effect or a drying equipment based on rotary drying, etc. Drying equipment involving nozzles is within the protection scope of this application.

[0023] Figure 1 This is a schematic diagram of a drying apparatus according to one embodiment of this application. Figure 1As shown, the drying equipment also includes a support plate 1, a spray bar 2, and a support arm. The support plate 1 can be disc-shaped. The support plate 1 is used to support the wafer when the drying equipment dries the wafer, and also to drive the wafer to rotate around the wafer axis when the drying equipment dries the wafer. The spray bar 2 is used to spray fluid onto the wafer when the drying equipment dries the wafer. The spray bar 2 is mounted on the support arm. The position of the spray bar 2 on the support arm can be adjusted before the drying equipment dries the wafer. The support arm is used to adjust the position of the spray bar 2 before and during the drying equipment dries the wafer. The position calibration method is used to calibrate the initial position of the nozzle of the spray bar 2 before the drying equipment dries the wafer, so as to calibrate the initial landing point of the fluid sprayed by the spray bar 2 on the wafer mounted on the support plate 1 when the drying equipment dries the wafer. After calibration, the calibration plate and other components are removed from the drying equipment. The fluid sprayed by the spray bar 2 can be a liquid or a gas. Liquids include deionized water or rinsing solutions containing deionized water, and gases include dry gases containing surfactants. The specific composition of the fluid sprayed by the spray bar 2 is not limited in this embodiment.

[0024] Before using the drying equipment to dry the wafer, the position of the nozzle of the spray bar 2 must first be calibrated using a position calibration method. It should be noted that the calibration method provided in this application can be completed before the drying equipment leaves the factory, or it can be completed during the wafer drying interval after the equipment leaves the factory. After one calibration, the drying equipment can be used continuously, and it can be determined whether to perform calibration again based on whether the drying effect is unsatisfactory.

[0025] The specific calibration process can be as follows: control the movement of the calibration disc and fix it on the carrier plate, parallel to the carrier plate, and set an identification area on the side of the calibration disc near the spray bar; control the movement of the nozzle pointing component and install it on the spray bar, the nozzle pointing component has a tip located on the spray path of the spray bar; adjust the position of the spray bar on the support arm through the drive device, so that the spray bar drives the tip of the nozzle pointing component to move until the signal acquisition device determines that the tip is aligned with the identification area on the calibration disc.

[0026] The position of the spray bar 2 is adjusted by the support arm until the tip is aligned with the marked area on the calibration plate, as determined by the signal acquisition device. Then, the adjustment of the spray bar 2 position via the drive device is stopped, thus calibrating the nozzle position of the spray bar 2. After removing the relevant components used in the position calibration method from the drying equipment, the wafer is dried using the drying equipment. The specific drying process is as follows: The wafer to be dried is fixed on the carrier plate 1, and the carrier plate 1 is controlled to rotate the wafer around its axis. Simultaneously, the spray bar 2 is controlled to spray fluid onto the wafer. The position of the spray bar 2 is reciprocated by the support arm to control the spray bar 2 to spray fluid onto the wafer while the wafer and the spray bar 2 are in relative motion, thus achieving wafer drying.

[0027] The location calibration method will be described in detail below through several embodiments.

[0028] Figure 2 This is a schematic diagram of a position calibration method according to an embodiment of this application. Figure 3 This is a schematic diagram showing the positions of each component during the calibration process. For example... Figure 2 As shown, the position calibration method includes:

[0029] S1. Control the movement of the calibration disk and fix it on the carrier disk, and make it parallel to the carrier disk.

[0030] The calibration disc has a marking area on the side near the spray bar.

[0031] In this embodiment, the calibration disk is the same size as the wafer. During calibration, the calibration disk can be transferred to the drying equipment by a robotic arm in the equipment in a manner similar to transferring a wafer, and the calibration disk can be moved and fixedly installed on the carrier disk.

[0032] S2. Control the movement of the nozzle pointing component and install it on the spray bar.

[0033] The nozzle guide has a tip located on the spray path of the spray bar.

[0034] The nozzle pointing component can be connected to the calibration plate via a robotic arm, or the nozzle pointing component and the calibration plate can be fixed on the same base, and the nozzle pointing component can be set on the base via a moving platform.

[0035] S3. Adjust the position of the spray bar on the support arm through the drive device, so that the spray bar drives the tip of the nozzle pointing part to move until the signal acquisition device determines that the tip is aligned with the marked area on the calibration plate.

[0036] In this embodiment, the driving device can be the same as the driving device used to adjust the spray bar in the drying device. After the calibration plate is fixed on the support plate, the moving platform can be controlled to move the nozzle pointing component and install it on the spray bar. After installation on the spray bar, the moving platform releases the position restriction on the nozzle pointing component, and the connecting part on the moving platform that is adapted to the nozzle pointing component moves with the nozzle pointing component. Alternatively, after the calibration plate is fixed on the support plate, the robotic arm can be controlled to move the nozzle pointing component and install it on the spray bar. After installation on the spray bar, the robotic arm releases its joint lock to release the position restriction on the nozzle pointing component, and the robotic arm is driven by the nozzle pointing component.

[0037] In another implementation, after controlling the movement of the nozzle pointing component and mounting it on the spray bar, the robotic arm or moving platform used to fix the nozzle pointing component can be reused as a drive device to control the movement of the nozzle pointing component and drive the spray bar to move synchronously.

[0038] As the nozzle guide moves, the tip of the nozzle boom continuously acquires signals through a signal acquisition device until it is confirmed that the tip is aligned with the marked area on the calibration plate. Specifically, the signal acquisition device can be a camera, used to capture images of the nozzle guide and the marked area. It can automatically identify whether the tip is aligned with the marked area based on the captured images, or present the captured images to the operator for confirmation.

[0039] In addition, after calibration, the calibration disc and other components used should be removed from the drying equipment. The process of removing the calibration disc and nozzle pointer can be the reverse of the installation process.

[0040] like Figure 3 As shown, the main components involved in this position calibration method, excluding the drying equipment, include a calibration disk 3 and a nozzle guide 4. The shape and size of the calibration disk 3 are almost identical to those of the wafer to be dried. The calibration disk 3 is used to assemble between the spray bar 2 and the carrier disk 1. The calibration disk 3 is parallel to the carrier disk 1. When the calibration disk 3 is assembled between the spray bar 2 and the carrier disk 1, it can be detachably connected to the carrier disk 1. For example, a positioning post can be provided on the side of the calibration disk 3 near the carrier disk 1, and a positioning hole can be provided on the side of the carrier disk 1 near the calibration disk 3. The calibration disk 3 and the carrier disk 1 are connected by the positioning post and the positioning hole. Specifically, it can be as follows: Figure 4 As shown, a positioning post a is fixedly connected to the side of the calibration plate 3 near the support plate 1. Based on this, a positioning hole is provided on the side of the support plate 1 near the calibration plate 3 to engage with the positioning post a. A marking area 31 is provided on the side of the calibration plate 3 near the spray bar 2. The size of the marking area 31 can be set according to the size of the nozzle of the spray bar 2; for example, the marking area 31 can be a circular area with a diameter of 1mm to 5mm. The nozzle guide 4 is detachably connected to the spray bar 2, for example, by clamping it onto the spray bar 2. Figure 5 As shown, the nozzle guide 4 has a tip 41 located on the spray path of the spray bar 2. The part of the nozzle guide 4 other than the tip 41 can be cylindrical or tubular. The tip 41 is integrally connected to one end of the cylindrical or tubular part. The length of the nozzle guide 4 can be 0.2mm to 0.7mm. When the nozzle of the spray bar 2 is calibrated, the position of the spray bar 2 on the support arm can be adjusted so that the spray bar 2 drives the tip 41 of the nozzle guide 4 to align with the marking area 31.

[0041] It should be noted that there can be one or more spray bars 2, and a single spray bar 2 can have one or more nozzles. For example, there can be two spray bars 2, each with one nozzle. The fluid ejected from the nozzle of the first spray bar 2 is liquid, and the fluid ejected from the nozzle of the second spray bar 2 is gas. When there are multiple spray bars 2, or when there is one spray bar 2 with multiple nozzles, the calibration disk 3 has a marking area 31 corresponding to each nozzle on the side away from the spray bar 2. The following explanation will take the case where each spray bar 2 has one nozzle as an example.

[0042] In this embodiment, when calibrating the position of the nozzle of the spray bar 2 using a position calibration method, the calibration disk 3 can be installed on the carrier disk 1 first, and then the position of the spray bar 2 can be adjusted by the support arm until the nozzle of the spray bar 2 moves to the vicinity of the marking area 31 on the calibration disk 3. Then, the nozzle pointing component 4 is installed on the spray bar 2, and the position of the spray bar 2 on the support arm is adjusted so that the spray bar 2 drives the tip 41 to move until the tip 41 is aligned with the marking area 31, thereby calibrating the position of the nozzle of the spray bar 2. After the tip 41 is aligned with the marking area 31, the spray bar 2 and the support arm can be fixed relative to each other, the calibration disk 3 can be removed from the carrier disk 1, the wafer can be fixed to the carrier disk 1, and the nozzle pointing component 4 can be removed from the spray bar 2 so that the wafer can be dried subsequently. Therefore, the position calibration of the nozzle of the spray bar 2 before drying the wafer is achieved by observing whether the tip 41 of the nozzle guide 4 is aligned with the marking area 31 on the calibration disk 3. The tip 41 of the nozzle guide 4 is on the gas injection path of the spray bar 2, so that the distance between the tip 41 of the nozzle guide 4 and the calibration disk 3 is small. This makes the error of estimating whether the tip 41 of the nozzle guide 4 is aligned with the marking area 31 on the calibration disk 3 smaller, that is, the position calibration of the nozzle of the spray bar 2 is more accurate. Therefore, the difficulty of calibrating the position of the spray bar 2 is reduced.

[0043] Furthermore, the embodiments of this application can make the initial landing point of the fluid on the wafer during wafer drying smaller than the ideal landing point, and thus the landing path of the fluid on the wafer during wafer drying smaller than the ideal landing path, thereby achieving more comprehensive drying of the wafer surface, reducing the possibility of defects such as defects in the wafer center area, edge area, or random defects, and improving the quality of the dried wafer.

[0044] In one possible implementation, such as Figure 1 As shown, the drying equipment also includes a box-shaped cavity 5 and an annular retaining ring 6. The retaining ring 6 can be circular, and the axis of the retaining ring 6, the axis of the calibration disk 3, and the axis of the bearing disk 1 coincide. The retaining ring 6 is fixedly connected inside the cavity 5. The calibration disk 3 and the bearing disk 1 are located within the space surrounded by the retaining ring 6. The wall of the cavity 5 can be provided with a clearance opening to facilitate calibration and drying operations. Figure 1 The cavity 5 has partially concealed its walls, including the walls with clearance openings. A translation drive is provided on the cavity 5. The translation drive is used to drive the bearing plate 1 to move relative to the retaining ring 6 in a direction perpendicular to the bearing plate 1. The translation drive can be a cylinder or a lead screw, etc., and this embodiment does not limit this.

[0045] In this embodiment, when mounting the calibration disk 3 onto the carrier disk 1, the carrier disk 1 can first be moved from inside the space surrounded by the retaining ring 6 to outside the space surrounded by the retaining ring 6 by a translational drive, and then the calibration disk 3 can be connected to the carrier disk 1. After the connection is completed, the carrier disk 1 can be moved again by the translational drive to move the calibration disk 3 from outside the space surrounded by the retaining ring 6 to inside the space surrounded by the retaining ring 6. When removing the calibration disk 3 from the carrier disk 1, the carrier disk 1 can first be moved from inside the space surrounded by the retaining ring 6 to outside the space surrounded by the retaining ring 6 by a translational drive, and then the calibration disk 3 can be removed from the carrier disk 1. The wafer to be dried is then fixed on the carrier disk 1, and the carrier disk 1 can be moved again by the translational drive to move the calibration disk 3 from outside the space surrounded by the retaining ring 6 to inside the space surrounded by the retaining ring 6. Thus, by setting a translational drive to move the carrier disk 1 relative to the retaining ring 6 in a direction perpendicular to the carrier disk 1, it is easier to load and unload the calibration disk 3 onto the carrier disk 1, improving the efficiency of loading and unloading the calibration disk 3.

[0046] In one possible implementation, such as Figure 6 and Figure 7 As shown, a plurality of support columns 32 are provided along the circumference of the calibration disk 3 at the edge of the side away from the bearing disk 1. The support columns 32 can be integrally connected or fixedly connected to the calibration disk 3. The end face of the support column 32 away from the calibration disk 3 is located outside the space surrounded by the retaining ring 6 or flush with the target side 61 of the retaining ring 6. The target side 61 of the retaining ring 6 is an annular side of the retaining ring 6. The calibration disk 3 is closer to the target side 61 of the retaining ring 6 than the bearing disk 1. A detection seat 321 is provided on the end face of the support column 32 away from the calibration disk 3. The detection seat 321 can be in the shape of a long strip plate. This embodiment of the application does not limit this. The first end of the detection seat 321 is opposite to the target side 61 of the retaining ring 6.

[0047] In the embodiments of this application, see Figure 8 When calibrating the position of the spray bar 2 using the position calibration method, after the calibration plate 3 is installed on the carrier plate 1, and before the position of the spray bar 2 is adjusted by the support arm so that the nozzle of the spray bar 2 moves to the vicinity of the marking area 31 on the calibration plate 3, the position calibration method further includes: S4, collecting the distance between the first end of the detection seat and the target side of the retaining ring by the signal acquisition device to detect the parallelism of the carrier plate relative to the retaining ring.

[0048] By testing the distance between the first end of the test seat 321 and the target side 61 of the retaining ring 6, and based on the distance between the first end of each test seat 321 and the target side 61 of the retaining ring 6, the parallelism of the calibration disk 3 relative to the retaining ring 6 is determined. When the parallelism is poor (for example, when the flatness of the plane composed of all the test seats 321 is greater than or equal to 0 mm to 0.08 mm), the rotating component that drives the bearing disk 1 to rotate (for example, the rotating component is a motor, and a corresponding shim can be added between the motor mount and the motor body) can be adjusted to adjust the parallelism of the bearing disk 1 relative to the retaining ring 6, thereby adjusting the parallelism of the calibration disk 3 relative to the retaining ring 6. Thus, the parallelism of the calibration disk 3 relative to the retaining ring 6 can be improved by the test seat 321, which in turn can improve the parallelism of the wafer relative to the retaining ring 6 during drying.

[0049] It should be noted that before or during the movement of the translation drive component driving the carrier plate 1 to move the calibration plate 3 relative to the retaining ring 6 in a direction perpendicular to the carrier plate 1, the first end of the detection seat 321 can be moved relative to the retaining ring 6 to a position that avoids the retaining ring 6.

[0050] In one possible implementation, such as Figure 6 and Figure 7 The diagram shows the detection seat 321 in a parallel position and a non-parallel position. The detection seat 321 is magnetically attracted to the end face of the support column 32 away from the calibration disk 3. The magnetic attraction force of each detection seat 321 can be in the range of 1N to 5N. The second end of the detection seat 321 is rotatably connected to the end face of the support column 32 away from the calibration disk 3. The rotation axis of the second end of the detection seat 321 is perpendicular to the axis of the calibration disk 3. The second end of the detection seat 321 is used to rotate relative to the support column 32 when the end face of the support column 32 away from the calibration disk 3 is located in the space surrounded by the retaining ring 6 during the process of the translation drive driving the bearing disk 1 to move the calibration disk 3 from inside the space surrounded by the retaining ring 6 to outside the space surrounded by the retaining ring 6. When the end face of the support column 32 away from the calibration disk 3 is located in the space surrounded by the retaining ring 6, the first end of the detection seat 321 rotates relative to the support column 32 under the squeezing force of the retaining ring 6. The detection seat 321 rotates from a parallel position to a non-parallel position so that the first end of the detection seat 321 can avoid the retaining ring 6.

[0051] Therefore, when the calibration plate 3 drives the test seat 321 to move relative to the retaining ring 6, the first end of the test seat 321 can automatically avoid the retaining ring 6, which can reduce the possibility of damage to the test seat 321 and the retaining ring 6 when the calibration plate 3 drives the test seat 321 to move relative to the retaining ring 6 due to accidental contact.

[0052] In one possible implementation, the side of the calibration disk 3 near the spray bar 2 is frosted. Thus, using a frosted surface on the calibration disk 3 can reduce interference caused by ambient light, making it easier to observe the marking area 31 within the box-shaped cavity 5.

[0053] Optionally, the marking disc can be made of transparent frosted PVC (Polyvinyl chloride). The marking area 31 can be marked by injecting a clean paint with high color and background recognition by making an opening on the back of the marking disc (i.e. the part of the marking disc near the carrier disc 1), which reduces the contamination of the internal chamber of the box-shaped cavity 5, and the colored paint helps to determine the position of the tip 41, further reducing the difficulty of calibration.

[0054] Optionally, the nozzle guide 4 can be made of materials such as POM (Polyoxymethylene) or PPS (Polyphenylene sulfide), which have the advantages of being pollution-free and self-lubricating.

[0055] In one possible implementation, the position calibration method further includes: controlling the nozzle pointing element 4 to move in a direction parallel to the gas injection path of the spray bar 2 and to slide in connection with the spray bar 2.

[0056] The sliding distance can be in the millimeter range, for example, from 0mm to 15mm. Thus, during the installation of the nozzle guide 4, the nozzle guide 4 can be slid relative to the spray bar 2 according to the distance between the nozzle and the calibration plate 3, so as to adjust the distance between the tip 41 of the nozzle guide 4 and the nozzle of the spray bar 2, thereby improving the applicability of the nozzle guide 4.

[0057] In one possible implementation, such as Figure 1 and Figure 3 As shown, the spray bar 2 includes a first straight rod 21, which is cylindrical in shape and its length is parallel to the gas injection path of the spray bar 2; step S2 includes: clamping the nozzle pointing component at any position outside the first straight rod.

[0058] The nozzle guide 4 is connected to a clamp 42. The clamp 42 and the nozzle guide 4 can be connected by a fixed connection, a detachable connection or an integral connection. The clamp 42 is used to clamp at any position outside the first straight rod 21.

[0059] In this embodiment, the nozzle guide 4 can slide relative to the spray rod 2 by clamping the clamp 42 at different positions outside the first straight rod 21. In addition, the nozzle guide 4 is connected to the spray rod 2 by clamping the clamp 42, which facilitates the connection between the nozzle guide 4 and the spray rod 2.

[0060] Optionally, the clamp may include two clamping plates connected by a hinge shaft and a torsion spring to achieve the clamping function of the clamp, and the clamping force of the clamp may be from 0.12 NM to 0.2 NM.

[0061] In one possible implementation, such as Figure 1 As shown, the spray bar 2 also includes a second straight rod 22, which is cylindrical in shape and its length direction is perpendicular to the length direction of the first straight rod 21. The first end of the second straight rod 22 is connected to the first end of the first straight rod 21, and the second end of the first straight rod 21 is the nozzle of the spray bar 2. Step S3 includes: adjusting the length of the second straight rod extending out of the support arm and its rotation angle relative to the support arm, thereby moving the tip of the nozzle pointing member until the tip is aligned with the marking area on the calibration plate.

[0062] In this embodiment, when adjusting the position of the spray bar 2 on the support arm, the second straight rod 22 can be extended or retracted relative to the support arm, and the second straight rod 22 can also be rotated relative to the support arm to adjust the intersection of the second straight rod 22 with respect to the support arm, thereby achieving fine adjustment of the nozzle position relative to the support arm. As a result, the tip 41 can be more easily aligned with the marking area 31, further reducing the difficulty of calibrating the position of the spray bar 2.

[0063] In one possible implementation, such as Figure 1 and Figure 3 As shown, the support arm includes a support rod 7 and a drive device that reuses the rotation drive component of the drying equipment. The support rod 7 is located outside the calibration plate 3 on the side away from the bearing plate 1, and outside the space surrounded by the retaining ring 6. The length direction of the support rod 7 is parallel to the length direction of the second straight rod 22. The second end of the second straight rod 22 is slidably connected to the first end of the support rod 7 along the length direction of the second straight rod 22, and the second end of the second straight rod 22 is rotatably connected to the first end of the support rod 7 about the axis of the second straight rod 22. A locking member is provided on the support rod 7, which is used to fix the second straight rod 22 and the support rod relatively after the tip 41 is aligned with the marking area 31. 7. To ensure that the spray bar 2 and the support rod 7 are relatively fixed during wafer drying, the specific structure of the locking component is not limited in this embodiment. The second end of the support rod 7 is rotatably connected to the cavity 5 in a direction perpendicular to the length of the support rod 7. The rotation drive is connected to the support rod 7 and the cavity 5. The rotation drive is used to drive the support rod 7 to rotate relative to the cavity 5 during the adjustment of the spray bar 2 to move the tip 41, so that the tip 41 of the nozzle pointing component 4 driven by the spray bar 2 is aligned with the marking area 31. The rotation drive is, for example, a motor. The accuracy of the rotation of the support rod 7 relative to the cavity 5 can be from 0.1° to 0.3°.

[0064] In this embodiment of the application, during the process of calibrating the nozzle position of the spray bar 2, when adjusting the position of the spray bar 2 by means of the support arm, the rotation drive is controlled to drive the support rod 7 to rotate relative to the cavity 5, thereby the support rod 7 can drive the spray bar 2 to move. The support arm has a simple structure, is easy to implement and has a low cost.

[0065] In one possible implementation, the rotation drive is also used to drive the support rod 7 to rotate relative to the cavity 5 when the drying equipment dries the wafer.

[0066] In this embodiment, when adjusting the position of the spray bar 2 via the support arm during the wafer drying process, the rotation drive is controlled to drive the support rod 7 to rotate relative to the cavity 5, thereby the support rod 7 can drive the spray bar 2 to move. Thus, at least part of the way of adjusting the position of the spray bar 2 during the calibration of the nozzle position of the spray bar 2 and the way of adjusting the position of the spray bar 2 during the wafer drying process are both achieved through the support rod 7, which can make the support arm smaller, simpler in structure, and lower in cost.

[0067] The position calibration method provided in this embodiment can reduce the time spent on the nozzle calibration process by nearly 10 times, greatly improving the nozzle calibration efficiency and equipment maintenance efficiency. It also reduces the influence of the operator's subjective judgment on the calibration results and improves the nozzle calibration accuracy by more than double.

[0068] The specific implementation of the above-mentioned position calibration method has been described in the above-mentioned device embodiments, and will not be repeated here in the embodiments of this application.

[0069] It should be noted that the position calibration method in this embodiment is based on the position calibration method in the aforementioned device embodiment and has the beneficial effects of the corresponding device embodiment, which will not be repeated here.

[0070] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0071] Finally, it should be noted that the above are merely preferred embodiments of the present invention, used only to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention are included within the scope of protection of the present invention.

Claims

1. A position calibration method, characterized in that, For calibrating drying equipment, the drying equipment includes a support plate, a spray bar, and a support arm. The support plate is used to support the wafer when the drying equipment dries the wafer. The spray bar is used to spray fluid onto the wafer. The spray bar is disposed on the support arm, and the support arm is used to adjust the position of the spray bar. The position calibration method includes a calibration disk and a nozzle pointing device; Position calibration methods include: The calibration disc is moved and fixedly installed on the carrier plate, and is parallel to the carrier plate. The calibration disc has an marking area on its side near the spray bar. A nozzle guide is controlled to move and is mounted on the spray bar, the nozzle guide having a tip located in the spray path of the spray bar; The position of the spray bar on the support arm is adjusted by the drive device, so that the spray bar drives the tip of the nozzle pointing component to move until the signal acquisition device determines that the tip is aligned with the marked area on the calibration plate.

2. The method according to claim 1, characterized in that, The nozzle pointing component is controlled to move in a direction parallel to the gas injection path of the spray bar and is slidably connected to the spray bar.

3. The method according to claim 2, characterized in that, The spray bar includes a first straight rod, the length direction of which is parallel to the gas injection path of the spray bar. Mounting the nozzle pointing element on the spray bar includes: The nozzle pointing component is clamped at any position outside the first straight rod.

4. The method according to claim 3, characterized in that, The spray bar also includes a second straight rod, the first end of which is connected to the first end of the first straight rod, the second end of which is connected to the support arm, and the second end of the first straight rod is the nozzle of the spray bar; The step of adjusting the position of the spray bar on the support arm, causing the spray bar to move the tip of the nozzle pointing component until the tip is aligned with the marked area on the calibration plate, includes: Adjust the length of the second straight rod extending from the support arm and its rotation angle relative to the support arm to move the tip of the nozzle pointing component until the tip is aligned with the marking area on the calibration plate.

5. The method according to claim 4, characterized in that, The drying equipment further includes a cavity, the support arm includes a support rod, and the driving device includes a rotation driving component; The length direction of the support rod is parallel to the length direction of the second straight rod. The second end of the second straight rod is slidably connected to the first end of the support rod along the length direction of the second straight rod, and the second end of the second straight rod is rotatably connected to the first end of the support rod about the axis of the second straight rod. A locking member is provided on the support rod. The locking member is used to fix the second straight rod and the support rod relatively after the tip is aligned with the marking area. The second end of the support rod is rotatably connected to the cavity about a direction perpendicular to the length direction of the support rod. The rotation drive is connected to the support rod and the cavity. The rotation drive is used to drive the support rod to rotate relative to the cavity, so that the spray bar drives the tip of the nozzle pointing member to align with the marking area.

6. The method according to claim 5, characterized in that, The rotation drive is also used to drive the support rod to rotate relative to the cavity when the drying equipment dries the wafer.

7. The method according to claim 1, characterized in that, The drying equipment also includes a box-shaped cavity and an annular retaining ring, the retaining ring being connected to the cavity, and the calibration plate and the carrier plate being located within the space surrounded by the retaining ring; The cavity is provided with a translation drive, which is used to drive the carrier plate to move relative to the retaining ring in a direction perpendicular to the carrier plate.

8. The method according to claim 7, characterized in that, Multiple support columns are arranged along the circumference of the calibration disk at the edge of the side away from the carrier disk. The end face of the support column away from the calibration disk is located outside the space surrounded by the retaining ring or flush with the target side of the retaining ring. The target side of the retaining ring is an annular side of the retaining ring. The calibration disk is closer to the target side of the retaining ring than the carrier disk. A detection seat is provided on the end face of the support column away from the calibration plate, and the first end of the detection seat is opposite to the target side of the retaining ring; The method further includes: The parallelism of the detection seat is acquired by the signal acquisition device to detect the parallelism of the carrier plate.

9. The method according to claim 8, characterized in that, The detection seat is magnetically attached to the end face of the support column away from the calibration disk; The second end of the detection seat is rotatably connected to the support column. The second end of the detection seat is used to rotate relative to the support column when the end face of the support column away from the calibration disk is located in the space surrounded by the retaining ring during the process of the translation drive driving the bearing disk to move the calibration disk. Under the squeezing force of the retaining ring on the first end of the detection seat, the second end of the detection seat rotates relative to the support column.

Images