Single-wafer multi-layer recovery anti-back-splashing cavity and wafer etching device

Abstract

The invention relates to a single-wafer multi-layer recovery anti-back-splashing cavity and a wafer etching device, which are characterized in that a plurality of liquid medicine recovery cavities are arranged in a shell, and flow guide plates on the liquid medicine recovery cavities move in the vertical direction to cooperatively form recovery channels communicated with inlets of liquid medicine recovery cavities or seal the liquid medicine recovery cavities; the liquid medicine recycling device has the advantages that the liquid medicine can be recycled independently, residual liquid medicine on each flow guide plate can be guided into the waste liquid recycling cavity in the shell by the aid of the second flow guide parts on the flow guide plates, the residual liquid medicine at the ends of the flow guide plates can be prevented from dripping into the liquid medicine recycling cavity on the lower layer, and accordingly cross contamination of the liquid medicine can be completely eradicated.

Description

Technical Field

[0001] The invention relates to a single-wafer multi-layer recovery anti-splashback cavity and a wafer etching device, belonging to the technical field of wafer processing. Background Art

[0002] Wafer processing generally includes processes such as coating, exposure, development, groove etching, and electrophoresis. The purpose of etching is to react the silicon in a specific area on the wafer surface with the etching solution to form a groove. In the prior art, in the single-wafer etching process, in order to improve the process efficiency and process yield, multiple different processes are often carried out at the same workstation. Since the etching agent used in each process is recovered, and the existing liquid recovery chamber is only suitable for the recovery of a single liquid, when recovering multiple liquids, the liquid recovery chamber needs to be cleaned, which is cumbersome to operate and still easily leads to cross-contamination of liquids. Summary of the invention

[0003] The object of the present invention is to provide a single wafer multi-layer recovery anti-splashback chamber and a wafer etching device to solve the above problems.

[0004] To achieve the above object, the present invention provides the following technical solution: a single wafer multi-layer recovery anti-splashback chamber, the single wafer multi-layer recovery anti-splashback chamber comprising:

[0005] A housing in which a wafer fixing assembly is disposed, and a waste liquid recovery chamber is formed on the periphery of the wafer fixing assembly;

[0006] A plurality of liquid medicine recovery chambers are provided, wherein a liquid medicine recovery chamber is formed therein, and the plurality of liquid medicine recovery chambers are arranged in sequence in a manner that one part is arranged above the entrance of another liquid medicine recovery chamber, and are configured to move in a vertical direction to open or close the liquid medicine recovery chamber of another liquid medicine recovery chamber, and the plurality of liquid medicine recovery chambers are configured to move in a vertical direction to open or close the recovery port of the waste liquid recovery chamber, and a guide plate is formed at the entrance of the liquid medicine recovery chamber extending obliquely toward the top of the wafer fixing assembly, the guide plate includes a first guide portion for guiding flow toward the liquid medicine recovery chamber and a second guide portion for guiding flow toward the wafer fixing assembly, and the ends of the plurality of second guide portions are arranged from bottom to top in a trend of gradually approaching the wafer fixing assembly.

[0007] Furthermore, the first guide portion includes a first guide surface formed at the top thereof and a second guide surface formed at the bottom thereof, the first guide surface being used to guide the medicine liquid toward the medicine liquid recovery chamber thereof, and the second guide surface being used to guide the medicine liquid toward the medicine liquid recovery chamber below or the waste liquid recovery chamber.

[0008] Furthermore, the guide surfaces formed at the top and bottom of the second guide portion are used to guide the chemical liquid toward the waste liquid recovery chamber, and an edge falling slope is formed at the end, the top of the edge falling slope is arranged close to the wafer fixing assembly, and the projections of several edge falling slopes in the vertical direction do not overlap.

[0009] Furthermore, a recovery baffle is provided in the medicine liquid recovery chamber of the uppermost layer, and the recovery baffle is configured to move in the vertical direction to approach or move away from the guide plate of the uppermost layer to open or close the entrance of the medicine liquid recovery chamber of the uppermost layer.

[0010] Furthermore, the recovery ports of the waste liquid recovery chamber and several of the liquid medicine recovery chambers are independently connected to recovery components.

[0011] Furthermore, the wafer fixing assembly includes a fixing seat and a vacuum motor spindle arranged in the fixing seat, and the vacuum motor spindle is used to absorb and fix the wafer and drive the wafer to rotate.

[0012] Furthermore, an impeller structure is arranged on the main shaft of the vacuum motor between the wafer and the fixing seat.

[0013] Furthermore, a vacuum suction cup is arranged on the vacuum motor main shaft, and the impeller structure is formed on the vacuum suction cup.

[0014] Furthermore, a plurality of guide areas with gradually increasing inclination angles are sequentially formed on the top of the fixing seat from a position close to the vacuum machine main axis toward a direction away from the vacuum machine main axis.

[0015] The present invention also provides a wafer etching device, which includes the single-wafer multi-layer recovery anti-splashback cavity as described above.

[0016] The beneficial effects of the present invention are as follows: the present application realizes the separate recovery of different medicines by arranging a plurality of medicine recovery chambers in a shell, and by moving the guide plates on the medicine recovery chambers in the vertical direction to cooperate in forming a recovery channel connected to the entrance of the medicine recovery chamber or a closed medicine recovery chamber, and utilizes the second guide portion on the guide plate to guide the medicine remaining on each guide plate to the waste liquid recovery chamber in the shell, thereby avoiding the residual medicine at the end of the guide plate from dripping into the lower medicine recovery chamber, thereby eliminating cross-contamination of the medicines.

[0017] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1A schematic diagram of the internal structure of a single-wafer multi-layer recovery anti-splashback chamber shown in an embodiment of the present application;

[0019] Figure 2 for Figure 1 Schematic diagram of the structure of the middle guide plate and the recovery baffle;

[0020] Figure 3 for Figure 1 Waste liquid recovery status diagram of the anti-splashback chamber for multi-layer recovery of a single wafer;

[0021] Figure 4 for Figure 1 A liquid recovery status diagram of a single wafer multi-layer recovery anti-splashback chamber;

[0022] Figure 5 for Figure 1 Another liquid recovery status diagram of the single wafer multi-layer recovery anti-splashback chamber. DETAILED DESCRIPTION

[0023] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0024] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] Please refer to Figure 1 to Figure 2A single-wafer multi-layer recovery and anti-splashback chamber is shown in an embodiment of the present application. The single-wafer multi-layer recovery and anti-splashback chamber includes a shell 10 and a plurality of liquid recovery chambers 20 arranged in the shell 10. A plurality of liquid guns 60 are arranged above the single-wafer multi-layer recovery and anti-splashback chamber, which are used to provide the wafer 50 with the liquid or cleaning water required for etching.

[0027] A wafer fixing assembly is disposed in the housing, and a waste liquid recovery chamber 11 is formed around the wafer fixing assembly;

[0028] A liquid medicine recovery chamber 21 is formed in the liquid medicine recovery chamber 20, and a plurality of liquid medicine recovery chambers 20 are arranged in sequence in a manner that one of the parts is arranged above the entrance of another liquid medicine recovery chamber 20, and are configured to move in the vertical direction to open or close the liquid medicine recovery chamber 21 of another liquid medicine recovery chamber 20, and a plurality of liquid medicine recovery chambers 20 are configured to move in the vertical direction to open or close the recovery port of the waste liquid recovery chamber 11, and a guide plate 22 is formed at the entrance of the liquid medicine recovery chamber 20, extending obliquely toward the top of the wafer fixing assembly, and the guide plate 22 includes a first guide portion 221 that guides toward the liquid medicine recovery chamber 21 and a first guide portion 222 that guides toward the wafer fixing assembly, and the ends of the plurality of first guide portions 222 are arranged from bottom to top in a trend of gradually approaching the wafer fixing assembly. Among them, the liquid medicine recovery chamber 20 moves in the vertical direction as an existing lifting structure, which is sufficient for driving the liquid medicine recovery chamber 20 to move up and down, and will not be described in detail here.

[0029] Please refer to Figures 3 to 5 In this embodiment, two liquid medicine recovery chambers 20 are provided, namely, an inner liquid medicine recovery chamber 20a and an outer liquid medicine recovery chamber 20b. The bottom of the inner liquid medicine recovery chamber 20a is in contact with the housing 10 to divide the waste liquid recovery chamber into two parts, wherein a waste liquid recovery port is provided in the waste liquid recovery chamber 11 located at the bottom of the inner liquid medicine recovery chamber 20a, and the waste liquid recovery port is used to transport the waste liquid to other places for storage, and the part located between the inner liquid medicine recovery chamber 20a and the wafer fixing assembly is used to recover part of the liquid medicine that cannot be collected in the liquid medicine recovery chamber 21 or the waste water formed when washing the wafer 50 during the etching process. The outer liquid medicine recovery chamber 20b is arranged outside the inner liquid medicine recovery chamber 20a, and the bottom of its guide plate 22 extends downward into the inner liquid medicine recovery chamber 20a, so as to directly guide the liquid medicine into the liquid medicine recovery chamber 21. The guide plates 22 of the inner and outer drug liquid recovery chambers 20a and 20b can be completely attached to block the drug liquid recovery chamber 21 of the inner drug liquid recovery chamber 20a when the inner and outer drug liquid recovery chambers 20a and 20b move in the vertical direction, or can be relatively far away to form a drug liquid recovery channel connected to the entrance of the drug liquid recovery chamber 21. Figure 3It is a state diagram of the single wafer multi-layer recovery anti-splashback chamber when the waste liquid recovery chamber 11 recovers waste liquid, Figure 4 is a state diagram of the single wafer multi-layer recovery anti-splashback cavity when the inner liquid recovery cavity 20a recovers liquid, Figure 4 This is a state diagram of the single wafer multi-layer recovery anti-splashback chamber when the external liquid recovery chamber 20b recovers liquid. The arrangement direction and number of the liquid recovery chamber 20 can be set as needed and are not specifically limited here.

[0030] In this embodiment, the first guide portion 221 includes a first guide surface formed at the top thereof and a second guide surface formed at the bottom thereof, the first guide surface is used to guide the liquid medicine toward its own liquid medicine recovery chamber 21, and the second guide surface is used to guide the liquid medicine toward the liquid medicine recovery chamber 21 below or the waste liquid recovery chamber 11. The first guide surface and the second guide surface are inclined surfaces, and when the liquid medicine falls on the first guide surface and the second guide surface, it can naturally fall into the liquid medicine recovery chamber 21 under the action of gravity.

[0031] In this embodiment, the guide surfaces formed at the top and bottom of the first guide portion 222 are used to guide the liquid medicine toward the waste liquid recovery chamber 11, and an edge falling slope 2221 is formed at the end, the top of the edge falling slope 2221 is arranged close to the wafer fixing assembly, and the projections of several edge falling slopes 2221 in the vertical direction do not overlap. The length of the first guide portion 222 is much shorter than the first guide plate 22, and is integrally formed with the first guide plate 22. The angle between the edge falling slope 2221 and the vertical direction can be set to any value as needed. Preferably, the angle between the edge falling slope 2221 and the vertical direction is less than 25°, which is the best range, and it has the best effect of guiding the residual liquid medicine to drip into the waste liquid recovery chamber 11.

[0032] In this embodiment, a recovery baffle 23 is disposed in the uppermost liquid recovery chamber 20, and the recovery baffle 23 is configured to move in the vertical direction to approach or move away from the uppermost guide plate 22 to open or close the entrance of the uppermost liquid recovery chamber 21. The structure of the recovery baffle 23 is similar to that of the guide plate 22. When the recovery baffle 23 moves to the lowest position, its top is just slightly lower than the end of the wafer 50, so that the guide plate 22 can receive the liquid and guide it.

[0033] In this embodiment, the recovery ports of the waste liquid recovery chamber 11 and the several liquid medicine recovery chambers 21 are independently connected to recovery components. By separately setting up recovery components, waste liquid and different liquid medicines can be recovered and stored separately to avoid cross contamination. The recovery components are prior art and will not be described in detail here.

[0034] In the present embodiment, the wafer fixing assembly includes a fixing seat 30 and a wafer 40 disposed in the fixing seat 30, and the wafer 40 is used to adsorb and fix the wafer 50 and drive the wafer 50 to rotate. During the etching process, the wafer 40 drives the wafer 50 to rotate to complete the etching while the centrifugal force is used to throw the liquid medicine to the bottom of the recovery baffle 23 or the guide plate 22, so that it is recovered into the liquid medicine recovery chamber 21 through the recovery channel, and the cleaning process is operated in the same way, thereby realizing the recovery of the liquid medicine or waste liquid. During the collection process, at least one end of the guide plate 22 and the recovery baffle 23 is higher than the end of the wafer 50 to ensure the recovery effect of the liquid medicine or waste liquid. The wafer 40 is a prior art, which is used to drive the wafer 50 to rotate to cooperate with the etching operation, and will not be described in detail here.

[0035] In another embodiment, an impeller structure 42 is disposed on the wafer 40 between the wafer 50 and the fixing base 30. The wafer 40 drives the impeller structure 42 to rotate, thereby forming an airflow to blow the drug solution or waste liquid splashing toward the fixing base 30 away from the fixing base 30, so as to avoid accumulation on the top of the fixing base 30 or penetration into the fixing base 30 along the wafer 40.

[0036] In another embodiment, a vacuum suction cup 41 is provided on the wafer 40, and an impeller structure 42 is formed on the vacuum suction cup 41. The vacuum suction cup 41 is formed with an adsorption hole and is connected to a vacuum generator, and a negative pressure is generated by the vacuum generator to adsorb and fix the wafer 50 on the vacuum suction cup 41, which is a prior art and will not be described in detail here. The impeller structure 42 is provided on the vacuum suction cup 41, which can effectively reduce the distance between the wafer 50 and the fixing seat 30 and reduce the space for the liquid to splash back.

[0037] In another embodiment, a plurality of guide areas with gradually increasing inclination angles are sequentially formed on the top of the fixing seat 30 from a position close to the vacuum machine main axis toward a direction away from the vacuum machine main axis. There are three guide areas, namely, an air pressure concentration area 51, an air blowing guide area 52 and a gravity guide area 53. The air pressure concentration area 51 is arranged close to the axis of the fixed seat 30, with a small inclination angle, generally not higher than 5°, and the rotating airflow brought out by the impeller is concentrated and strengthened through the space between the bottom of the wafer 50 and the surface of the fixed seat 30; the air blowing guide area 52 is located below the gap between the guide plate 22 and the end of the wafer 50, and is easy to receive the splashed liquid or waste liquid during operation. The accumulated liquid or waste liquid is guided to the outer gravity guide area 53 through the combined action of the slope gravity guidance and the inner rotating airflow, generally between 35°-45°; the gravity guide area 53 is connected between the air blowing guide area 52 and the bottom of the shell 10. Since the gravity guide area 53 requires a larger angle to ensure that the liquid or waste liquid drips downward, the angle is generally not less than 75°, so that the liquid or waste liquid can be quickly collected to the bottom of the waste liquid recovery chamber 11. Of course, the number and angle of the guide areas may also be other values, which are not specifically limited here.

[0038] The present invention also provides a wafer etching device, which includes the single-wafer multi-layer recovery anti-splashback cavity as described above.

[0039] The present application realizes the separate recovery of different medicines by arranging a plurality of medicine recovery chambers in a shell, and by moving the guide plates on the medicine recovery chambers in the vertical direction to cooperate in forming a recovery channel connected to the entrance of the medicine recovery chamber or closing the medicine recovery chamber, and utilizes the second guide portion on the guide plate to guide the medicine remaining on each guide plate to the waste liquid recovery chamber in the shell, thereby preventing the residual medicine at the end of the guide plate from dripping into the lower medicine recovery chamber, thereby eliminating cross-contamination of the medicines.

[0040] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0041] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A single wafer multi-layer recovery anti-splashback chamber, characterized in that: The single wafer multi-layer recovery anti-splashback chamber comprises: A housing in which a wafer fixing assembly is disposed, and a waste liquid recovery chamber is formed on the periphery of the wafer fixing assembly; A plurality of liquid medicine recovery chambers are provided, wherein a liquid medicine recovery chamber is formed therein, and the plurality of liquid medicine recovery chambers are arranged in sequence in a manner that one part is arranged above the entrance of another liquid medicine recovery chamber, and are configured to move in a vertical direction to open or close the liquid medicine recovery chamber of another liquid medicine recovery chamber, and the plurality of liquid medicine recovery chambers are configured to move in a vertical direction to open or close the recovery port of the waste liquid recovery chamber, and a guide plate is formed at the entrance of the liquid medicine recovery chamber extending obliquely toward the top of the wafer fixing assembly, the guide plate includes a first guide portion for guiding flow toward the liquid medicine recovery chamber and a second guide portion for guiding flow toward the wafer fixing assembly, and the ends of the plurality of second guide portions are arranged from bottom to top in a trend of gradually approaching the wafer fixing assembly.

2. The single wafer multi-layer recovery anti-splashback chamber according to claim 1, characterized in that: The first guide portion includes a first guide surface formed at the top thereof and a second guide surface formed at the bottom thereof, the first guide surface being used to guide the drug liquid toward the drug liquid recovery chamber thereof, and the second guide surface being used to guide the drug liquid toward the drug liquid recovery chamber below or the waste liquid recovery chamber.

3. The single wafer multi-layer recovery anti-splashback chamber according to claim 2, characterized in that: The guide surfaces formed at the top and bottom of the second guide part are used to guide the chemical liquid toward the waste liquid recovery chamber, and the ends are formed with edge falling slopes, the top of the edge falling slopes are arranged close to the wafer fixing assembly, and the projections of several edge falling slopes in the vertical direction do not overlap.

4. The single wafer multi-layer recovery anti-splashback chamber according to claim 1, characterized in that: A recovery baffle is provided in the uppermost medicine liquid recovery chamber, and the recovery baffle is configured to move in a vertical direction to approach or move away from the uppermost guide plate to open or close the entrance of the uppermost medicine liquid recovery chamber.

5. The single wafer multi-layer recovery anti-splashback chamber according to claim 1, characterized in that: The recovery ports of the waste liquid recovery chamber and a plurality of the liquid medicine recovery chambers are independently connected to a recovery component.

6. The single wafer multi-layer recovery anti-splashback chamber according to claim 1, characterized in that: The wafer fixing assembly comprises a fixing seat and a vacuum motor spindle arranged in the fixing seat, and the vacuum motor spindle is used for adsorbing and fixing the wafer and driving the wafer to rotate.

7. The single wafer multi-layer recovery anti-splashback chamber according to claim 6, characterized in that: An impeller structure is arranged on the main shaft of the vacuum motor between the wafer and the fixing seat.

8. The single wafer multi-layer recovery anti-splashback chamber according to claim 7, characterized in that: A vacuum suction cup is arranged on the vacuum motor main shaft, and the impeller structure is formed on the vacuum suction cup.

9. The single wafer multi-layer recovery anti-splashback chamber according to claim 6, characterized in that: A plurality of guide areas with gradually increasing inclination angles are sequentially formed on the top of the fixing seat from a position close to the vacuum machine main axis toward a direction away from the vacuum machine main axis.

10. A wafer etching device, characterized in that: It comprises a single wafer multi-layer recovery anti-splashback chamber as described in any one of claims 1 to 9.

Images