Packaging equipment for device-level pressure sensor production
By designing the packaging equipment for device-level pressure sensor production, using the robotic arm and clamping components for precise operation, uniform connection and efficient packaging between the sensor and the chip are achieved, solving the problems of uneven distribution of adhesive glue and low manual operation efficiency in the prior art.
Patent Information
- Application Number
- CN202411966876.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2025-03-28
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
In the packaging process of device-level pressure sensors, uneven distribution of adhesive bonds leads to an angle between the sensor and the chip, affecting the packaging effect. It is easy to damage the sensor when manually cleaning the adhesive bonds, and the detection and connection effect depends on manual labor and low efficiency.
A packaging equipment for the production of device-level pressure sensors is designed, using robotic arms and clamping components for precise clamping and installation, using an electric heating plate to control the adhesive distribution, automatic operation is achieved through the camera and display screen, and after the packaging is completed, the connection effect is detected through the pressure sensor to automatically clean the adhesive on the outside.
It realizes a more uniform connection between the sensor and the chip, improves packaging quality, reduces the risk and time of manual operation, and improves detection efficiency and accuracy.
Smart Images
Figure CN119725173A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of device-level pressure sensor production, and in particular to packaging equipment for device-level pressure sensor production. Background Art
[0002] The device-level sensor packaging process refers to packaging the sensor chip into a reliable shell to protect the chip from the influence of the external environment and provide a signal interface. The packaging process technology plays a vital role in modern electronic equipment. When performing the packaging operation, the chip to be processed is placed on the workbench, the robotic arm is started, and the corresponding assembly operation is performed. The overall automation and intelligence are high; In the actual processing process, a robot arm is used to place the sensor directly on the chip, and the sensor and the chip are fixed together by adhesive. When fixing, they are mainly fixed by extrusion. The distribution of the adhesive is relatively fixed, which may cause a certain angle between the sensor and the chip, affecting the normal packaging effect. After the processing is completed, it is necessary to manually clean the adhesive that may flow to the outside of the sensor and the chip. At this time, the adhesive and the sensor are in a fixed state. When cleaning the adhesive, it is very likely to cause damage to the sensor, which is time-consuming, labor-intensive and very troublesome. At the same time, after the packaging is completed, it is necessary to manually detect the connection effect between the sensor and the chip. The manual detection has a general effect. Therefore, a packaging device for the production of device-level pressure sensors is provided. Summary of the invention
[0003] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a packaging device for producing a device-level pressure sensor.
[0004] The present invention adopts the following technical solutions: A packaging device for producing device-level pressure sensors, comprising a workbench, wherein a fixed plate is fixedly connected to the side wall of the workbench, a telescopic sleeve is fixedly connected to the lower side of the fixed plate, a first connecting plate is fixedly connected to the lower side of the telescopic sleeve, a camera is fixedly connected to the lower side of the first connecting plate, two mechanical arms are symmetrically fixedly installed on the lower side of the first connecting plate, a clamping assembly is installed at the ends of the two mechanical arms, the clamping assembly comprises a second connecting plate fixedly installed at the ends of the mechanical arms, two sliding frames are slidably connected to the side walls of the second connecting plate, a slide plate is fixedly connected to the side walls of the two sliding frames, a third connecting plate is slidably connected in the slide plate, a fourth connecting plate is fixedly connected to the lower side of the third connecting plate, a clamp plate is slidably connected in the fourth connecting plate, a baffle is fixedly connected to the side wall of the clamp plate, and a control assembly for controlling the movement of the third connecting plate is installed on the side wall of the second connecting plate.
[0005] Preferably, the control component includes a fixed frame fixedly mounted on the side wall of the second connecting plate, a motor fixedly mounted in the fixed frame, an output end of the motor fixedly connected to a rotating shaft, an outer side of the rotating shaft fixedly connected to a first gear, both side walls of the two skateboards fixedly connected to a first rack, and the first gear and the first rack mesh with each other.
[0006] Preferably, a shaking assembly is installed in the skateboard, and the shaking assembly includes a square rod fixedly installed in the skateboard, the square rod slidably passes through the third connecting plate, and the first spring is fixedly connected between the side walls on both sides of the third connecting plate and the inner wall of the skateboard, a rotating rod is rotatably passed through the third connecting plate, and the side wall of the rotating rod is fixedly connected to the rotating plate, and a plurality of baffles are evenly fixedly connected in the skateboard, one end of the rotating rod extends into the fourth connecting plate, and the rotating rod is located in the fourth connecting plate. One end is fixedly connected to the second gear, and a torsion spring is fixedly connected between the second gear and the fourth connecting plate, and a second rack is slidably connected in the fourth connecting plate, and the second gear and the second rack are meshed, and the side wall of the second rack is fixedly connected to the fifth connecting plate, and the second spring is fixedly connected between the fifth connecting plate and the fourth connecting plate, and a pressure sensor is fixedly connected between the fifth connecting plate and the fourth connecting plate.
[0007] Preferably, the cleaning assembly includes an eighth connecting plate fixedly mounted on the lower side of the splint, the eighth connecting plate slides through the fourth connecting plate, the lower side of the eighth connecting plate is fixedly connected to a third rack, the lower side of the fourth connecting plate is uniformly rotatably connected to a plurality of connecting rods, the outer sides of the plurality of connecting rods are fixedly connected to a third gear, the third gear and the third rack are meshed with each other, and the outer sides of the plurality of connecting rods are fixedly connected to a cleaning plate.
[0008] Preferably, the lower side of the fourth connecting plate is fixedly connected to the seventh connecting plate, the lower side of the seventh connecting plate is fixedly connected to the sixth connecting plate, the side wall of the sixth connecting plate is provided with a plurality of grooves, and the number and position of the plurality of grooves are opposite to the connecting rod.
[0009] Preferably, the side wall of the groove is arc-shaped.
[0010] Preferably, the outer surface of the cleaning plate is smooth.
[0011] The beneficial effects of the present invention are: 1. First, under the action of the clamping device, the sensor can be clamped. When the sensor and the chip are glued together, the sensor can be slightly shaken. The adhesive is located between the sensor and the chip, which can make the adhesive distribution more uniform, thereby better connecting the sensor and the chip together, thereby maintaining the packaging quality; 2. After the packaging is completed, the motor can be started again. At this time, the clamping plate and the sensor are against each other, and the clamping plate will not move relative to the fifth connecting plate, so the second spring will be compressed, and the pressure sensor will send a corresponding electrical signal. During this process, if the electrical signal sent by the pressure sensor is small, it means that the connection between the sensor and the chip is poor, thereby completing the detection operation of the connection effect between the sensor and the chip; 3. Finally, during the installation of the sensor, when the splint moves, the cleaning plate will rotate, and the glue on the outside of the cleaning plate and the sensor and chip will be against each other, which will drive the glue to move and disconnect the glue on the outside of the sensor and chip from the sensor, thus cleaning the glue on the outside of the sensor and chip and reducing the workload of subsequent staff. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 A schematic diagram of the structure of a packaging device for producing a device-level pressure sensor proposed by the present invention; Figure 2 A schematic diagram of the structure of a mechanical arm in a packaging device for producing a device-level pressure sensor proposed by the present invention; Figure 3 A schematic diagram of the connection between a second connecting plate and a slide frame in a packaging device for producing a device-level pressure sensor proposed by the present invention; Figure 4 A schematic diagram of the top view and cross-sectional connection of a slide plate in a packaging device for producing a device-level pressure sensor proposed by the present invention; Figure 5 for Figure 4 A magnified view of the structure at center A; Figure 6 A top view and cross-sectional connection diagram of a fourth connecting plate in a packaging device for producing a device-level pressure sensor proposed by the present invention; Figure 7 A schematic diagram showing the connection of the fourth connecting plate from another angle in a packaging device for producing a device-level pressure sensor proposed by the present invention; Figure 8 A schematic diagram of the connection between the third rack and the third gear in a packaging device for producing a device-level pressure sensor proposed by the present invention; Fig. 9 This is a schematic structural diagram of a sixth connecting board in a packaging device for producing a device-level pressure sensor proposed by the present invention.
[0013] In the figure: 1 workbench, 2 fixed plate, 3 telescopic sleeve, 4 first connecting plate, 5 camera, 6 mechanical arm, 7 second connecting plate, 8 sliding frame, 9 sliding plate, 10 third connecting plate, 11 fourth connecting plate, 12 clamping plate, 13 baffle, 14 fixed frame, 15 motor, 16 rotating shaft, 17 first gear, 18 first rack, 19 square rod, 20 first spring, 21 rotating rod, 22 baffle, 23 rotating plate, 24 second gear, 25 second rack, 26 fifth connecting plate, 27 second spring, 28 pressure sensor, 29 torsion spring, 30 sixth connecting plate, 31 connecting rod, 32 cleaning plate, 33 seventh connecting plate, 34 eighth connecting plate, 35 third rack, 36 third gear, 37 groove. DETAILED DESCRIPTION
[0014] See also Figure 1-Figure 9 , a device-level pressure sensor production packaging equipment, including a workbench 1, a display screen is fixedly installed on the side wall of the workbench 1, a plurality of transmission shafts are fixedly installed in the workbench 1, the outer sides of the plurality of transmission shafts are sleeved with the same transmission belt, an electric heating plate is installed in the workbench 1, one end of the electric heating plate is located in the transmission belt, a fixed plate 2 is fixedly connected to the side wall of the workbench 1, a telescopic sleeve 3 is fixedly connected to the lower side of the fixed plate 2, a first connecting plate 4 is fixedly connected to the lower side of the telescopic sleeve 3, a camera 5 is fixedly connected to the lower side of the first connecting plate 4, and two mechanical arms 6 are symmetrically fixedly installed on the lower side of the first connecting plate 4; First, the electric heating plate is located at the lower side of the camera 5 and opposite to the camera 5. Then, the movement of the mechanical arm 6, the rotation of the transmission shaft, and the switch of the electric heating plate can be controlled through the display screen. When the device-level pressure sensor needs to be packaged, the chip is placed on the transmission belt, and the driving device is started to drive the transmission shaft to operate the rotating shaft 16, drive the transmission belt to move, and transport the chip to the lower side of the camera 5. The sensor is installed on the chip through the mechanical arm 6. In this process, the electric heating plate is started to melt the adhesive applied to the outside of the chip and the sensor. After the sensor is installed, the electric heating plate is turned off to solidify the adhesive, and then the transmission shaft is started again to allow the transmission belt to move the processed chip and sensor from the lower side of the camera 5. Then the processed chip and sensor are taken out as a whole. In the above working process, the camera 5 is used to complete the shooting operation of the chip and the sensor, and the data is transmitted to the display screen. The staff can make adjustments by watching the display screen. All the above work is prior art and no unnecessary elaboration is made. like Figure 2 , Figure 3, the ends of the two mechanical arms 6 are both installed with a clamping assembly, the clamping assembly includes a second connecting plate 7 fixedly installed on the ends of the mechanical arms 6, the side walls of the second connecting plate 7 are slidably connected to two sliding frames 8, the side walls of the two sliding frames 8 are both fixedly connected to a slide plate 9, a third connecting plate 10 is slidably connected in the slide plate 9, a fourth connecting plate 11 is fixedly connected to the lower side of the third connecting plate 10, a clamping plate 12 is slidably connected in the fourth connecting plate 11, a blocking rod 13 is fixedly connected to the side wall of the clamping plate 12, a control assembly for controlling the movement of the third connecting plate 10 is installed on the side wall of the second connecting plate 7, the control assembly includes a fixed frame 14 fixedly installed on the side wall of the second connecting plate 7, a motor 15 is fixedly installed in the fixed frame 14, a rotating shaft 16 is fixedly connected to the output end of the motor 15, a first gear 17 is fixedly connected to the outer side of the rotating shaft 16, and a first rack 18 is fixedly connected to the side walls of the two slide plates 9, and the first gear 17 is meshed with the first rack 18; First, Figure 2 Based on the direction, the third connecting plate 10 and the slide plate 9 are connected for front-to-back sliding, and the fourth connecting plate 11 and the clamping plate 12 are connected for left-right sliding. When the sensor needs to be clamped, the motor 15 is started, and the motor 15 drives the rotating shaft 16 to rotate clockwise. The rotating shaft 16 drives the slide plate 9 to move toward each other through the first gear 17 and the first rack 18. The slide plate 9 drives the fourth connecting plate 11 to move toward each other through the third connecting plate 10, and the fourth connecting plate 11 drives the clamping plate 12 to move toward each other until the sensor is located on the outside of the blocking rod 13 and between the two clamping plates 12, thereby completing the clamping operation of the sensor, and then using the robot arm 6 to place the sensor on the upper side of the chip, and start the packaging operation.
[0015] like Figure 4 , Figure 5 , Figure 6 , a shaking assembly is installed in the skateboard 9, and the shaking assembly includes a square rod 19 fixedly installed in the skateboard 9, the square rod 19 slides through the third connecting plate 10, and the first spring 20 is fixedly connected between the side walls on both sides of the third connecting plate 10 and the inner wall of the skateboard 9, and a rotating rod 21 is rotated through the third connecting plate 10, and a rotating plate 23 is fixedly connected to the side wall of the rotating rod 21. A plurality of baffles 22 are evenly fixedly connected in the skateboard 9, one end of the rotating rod 21 extends into the fourth connecting plate 11, and the rotating rod 21 is located in the fourth connecting plate 11. One end is fixedly connected to a second gear 24, and a torsion spring 29 is fixedly connected between the second gear 24 and the fourth connecting plate 11. A second rack 25 is slidably connected in the fourth connecting plate 11, and the second gear 24 and the second rack 25 are meshed. A fifth connecting plate 26 is fixedly connected to the side wall of the second rack 25, and a second spring 27 is fixedly connected between the fifth connecting plate 26 and the fourth connecting plate 11, and a pressure sensor 28 is fixedly connected between the fifth connecting plate 26 and the fourth connecting plate 11; First, the pressure sensor 28 is a device or apparatus that can sense pressure signals and convert pressure signals into usable output electrical signals according to certain rules. Secondly, when the sensor is placed on the chip using the robotic arm 6, the motor 15 can be started again. The motor 15 drives the rotating shaft 16 to rotate clockwise. The rotating shaft 16 drives the slide plate 9 to move toward each other through the first gear 17 and the first rack 18. The slide plate 9 drives the fourth connecting plate 11 to move toward each other through the third connecting plate 10. The fourth connecting plate 11 drives the splint 12 to move toward each other, but at this time the splint 12 and the sensor are against each other. Under the obstruction of the sensor, the splint 12 will not move, so the fourth connecting plate 11 and the third connecting plate 10 will not move either. Therefore, the slide plate 9 will move relative to the third connecting plate 10, so Figure 4 The left and right sides are symmetrically arranged. Therefore, the third connecting plate 10 on the left side is used for explanation. That is, the third connecting plate 10 moves leftward relative to the slide plate 9, and the third connecting plate 10 compresses the first spring 20 on the left side and stretches the first spring 20 on the right side. At the same time, the third connecting plate 10 drives the rotating rod 21 to move. In the process of moving the rotating rod 21 and the rotating plate 23, when the rotating plate 23 and the baffle plate 22 are against each other, the baffle plate 22 hinders the rotating plate 23 and the rotating rod 21. The rotating rod 21 drives the second gear 24 to rotate counterclockwise, so that Figure 6 Based on the direction, Figure 4 The fourth connecting plate 11 on the left side and Figure 6The fourth connecting plate 11 on the left side is opposite, and the second gear 24 stretches the torsion spring 29 while driving the second rack 25 to move downward and upward along the fourth connecting plate 11, and the second rack 25 drives the fifth connecting plate 26 to move downward and upward, and the fifth connecting plate 26 drives the clamping plate 12 to move downward and upward through the second spring 27. When the rotating plate 23 and the baffle plate 22 are disconnected, at this time, under the action of the torsion spring 29, the rotating rod 21 will return to its original position relative to the fourth connecting plate 11, and the second gear 24 will rotate clockwise and counterclockwise, and the second gear 24 will drive the second rack 25 to move upward and downward, and the second rack 25 will pass through the clamping plate 1 again through the second spring 27. 2 moves up and down, wherein, since the third connecting plate 10 and the second rack 25 on the left and right sides are symmetrically arranged, the right clamping plate 12 and the left and right clamping plates 12 also move in the same direction, thereby causing the clamping plate 12 to move back and forth during this process, and the clamping plate 12 drives the sensor to move back and forth. During the process of gluing the sensor and the chip, the shaking sensor can make the glue between the sensor and the chip mix better, reduce the possibility of an angle between the sensor and the chip, and thus ensure the packaging quality. After the packaging is completed, the electric heating plate is turned off first to quickly reduce the temperature of the sensor and the outside of the chip, so that the sensor The device and the chip are quickly adhered together. After the glue solidifies, the motor 15 is started again. The motor 15 drives the shaft 16 to rotate counterclockwise. The shaft 16 drives the slide plate 9 to move away from each other through the first gear 17 and the first rack 18. In this process, the elastic force of the first spring 20 and the second spring 27 will be released first, so that the third connecting plate 10 will move relative to the slide plate 9, and the slide plate 9 will drive the rotating rod 21 to move. When the rotating plate 23 and the baffle 22 are against each other, the baffle 22 will hinder the rotating plate 23 and the rotating rod 21. The rotating rod 21 drives the second gear 24 clockwise. As the needle rotates, the second gear 24 stretches the torsion spring 29 and drives the second rack 25 to move up and down. The second rack 25 drives the fifth connecting plate 26 to move up and down. However, at this time, the clamp 12 and the sensor are against each other, and because the sensor is adhered to the chip at this time, the clamp 12 will not move relative to the fifth connecting plate 26, so it will compress the second spring 27 and cause the pressure sensor 28 to send out a corresponding electrical signal. During this process, if the electrical signal sent by the pressure sensor 28 is small, it means that the connection between the sensor and the chip is poor, thereby completing the detection operation of the connection effect between the sensor and the chip.
[0016] like Figure 7 , Figure 8 , Fig. 9The cleaning assembly includes an eighth connecting plate 34 fixedly mounted on the lower side of the clamping plate 12, the eighth connecting plate 34 slides through the fourth connecting plate 11, the lower side of the eighth connecting plate 34 is fixedly connected to the third rack 35, the lower side of the fourth connecting plate 11 is evenly rotatably connected to a plurality of connecting rods 31, the outer sides of the plurality of connecting rods 31 are fixedly connected to the third gear 36, the third gear 36 and the third rack 35 are meshed, the outer sides of the plurality of connecting rods 31 are fixedly connected to the cleaning plate 32, the lower side of the fourth connecting plate 11 is fixedly connected to the seventh connecting plate 33, the lower side of the seventh connecting plate 33 is fixedly connected to the sixth connecting plate 30, the side wall of the sixth connecting plate 30 is provided with a plurality of grooves 37, the number and position of the plurality of grooves 37 are opposite to the connecting rod 31, the side wall of the groove 37 is arc-shaped, and the outer surface of the cleaning plate 32 is smooth; First, the center of the arc surface of the side wall of the groove 37 is concentric with the connecting rod 31. Secondly, the outer surface of the cleaning plate 32 is smoothly set. Therefore, when the cleaning plate 32 is cleaning, the possibility of glue sticking to the outside of the cleaning plate 32 can be reduced, so that the cleaning operation can be better performed. Then, during the installation of the sensor, when the splint 12 moves, the splint 12 will drive the eighth connecting plate 34 to move back and forth, and the eighth connecting plate 34 will drive the third rack 35 to move back and forth. The third rack 35 drives the third gear 36 to rotate back and forth, and the third gear 36 drives the connecting rod 31 and the cleaning plate 32 to rotate back and forth. In the initial state, the cleaning plate 32 and the sensor are in a vertical state. During the rotation of the cleaning plate 32, the cleaning plate 32 and the glue on the outside of the sensor and the chip will be offset, which will drive the glue to move, so that the glue on the outside of the sensor and the chip and the sensor are disconnected, forming a cleaning effect on the glue on the outside of the sensor and the chip, reducing the workload of subsequent staff.
[0017] In the present invention, when it is necessary to perform packaging operation on the device-level pressure sensor, the chip is placed on the transmission belt, the rotating shaft 16 is started, the transmission belt is driven to move, the chip is transported to the lower side of the camera 5, and the sensor is installed on the chip by the mechanical arm 6. In this process, the electric heating plate is started to melt the adhesive applied on the outside of the chip and the sensor. After the sensor is installed, the electric heating plate is turned off to solidify the adhesive, and then the rotating shaft 16 is started again to make the transmission belt move the processed chip and sensor out from the lower side of the camera 5, and then the processed chip and sensor are taken out as a whole. In the above working process, the camera 5 completes the shooting operation of the chip and the sensor, and the data is transmitted to the display screen. The staff can make adjustments by watching the display screen. All the above work is prior art and no unnecessary elaboration is made. When the sensor needs to be clamped, the motor 15 is started, and the motor 15 drives the shaft 16 to rotate clockwise. The shaft 16 drives the slide plate 9 to move toward each other through the first gear 17 and the first rack 18. The slide plate 9 drives the fourth connecting plate 11 to move toward each other through the third connecting plate 10. The fourth connecting plate 11 drives the clamping plate 12 to move toward each other until the sensor is located outside the blocking rod 13 and between the two clamping plates 12, thereby completing the clamping operation of the sensor. Then, the robot arm 6 is used to place the sensor on the upper side of the chip, and the packaging operation can be started. When the sensor is placed on the chip by using the robot arm 6, the motor 15 can be started again, and the motor 15 drives the shaft 16 to rotate clockwise. The shaft 16 drives the slide plate 9 to move toward each other through the first gear 17 and the first rack 18. The slide plate 9 drives the fourth connecting plate 11 to move toward each other through the third connecting plate 10. The fourth connecting plate 11 drives the clamping plate 12 to move toward each other. However, at this time, the clamping plate 12 and the sensor are against each other. Under the obstruction of the sensor, the clamping plate 12 will not move, so the fourth connecting plate 11 and the third connecting plate 10 will not move either. Therefore, the slide plate 9 will move relative to the third connecting plate 10. Figure 4The third connecting plate 10 is based on the direction of rotation, that is, the third connecting plate 10 moves downward relative to the sliding plate 9, the third connecting plate 10 compresses the first spring 20 on the lower side and stretches the first spring 20 on the upper side. At the same time, the third connecting plate 10 drives the rotating rod 21 to move. In the process of moving the rotating rod 21 and the rotating plate 23, when the rotating plate 23 and the baffle plate 22 are against each other, the baffle plate 22 will cause the rotating plate 23 and the rotating rod 21 to rotate counterclockwise, and the rotating rod 21 drives the second gear 24 to rotate counterclockwise. While the second gear 24 stretches the torsion spring 29, it drives the second rack 25 to move leftward. The second rack 25 drives the fifth connecting plate 26 to move leftward. The fifth connecting plate 26 drives the clamping plate 12 to move leftward through the second spring 27. When the rotating plate 23 and the baffle plate 22 are disconnected, the rotating rod 21 returns to its original position relative to the fourth connecting plate 11 under the action of the torsion spring 29. The second gear 24 rotates clockwise, and the second gear 24 drives the second rack 25 to move rightward. The second rack 25 moves rightward again through the second spring 27, which causes the clamping plate 12 to move back and forth left and right in the process again. The clamping plate 12 drives the sensor to move back and forth left and right. In the process of gluing the sensor and the chip, the shaking sensor can make the glue between the sensor and the chip better mixed, reducing the gap between the sensor and the chip. There is a possibility of an angle, thereby ensuring the packaging quality. After the packaging is completed, the electric heating plate is turned off first to quickly reduce the temperature of the sensor and the outside of the chip, so that the sensor and the chip are quickly adhered together. After the glue solidifies, the motor 15 is started again. The motor 15 drives the shaft 16 to rotate counterclockwise. The shaft 16 drives the slide plate 9 to move away from each other through the first gear 17 and the first rack 18. In this process, the elastic force of the second spring 27 will be released first, so that the third connecting plate 10 will move relative to the slide plate 9, and the slide plate 9 will drive the rotating rod 21 to move. When the rotating plate 23 and the baffle plate 22 are against each other, under the obstruction of the baffle plate 22, it will lead The rotating plate 23 and the rotating rod 21 rotate clockwise, and the rotating rod 21 drives the second gear 24 to rotate clockwise. The second gear 24 stretches the torsion spring 29 and drives the second rack 25 to move rightward. The second rack 25 drives the fifth connecting plate 26 to move rightward. However, at this time, the clamping plate 12 and the sensor are against each other, and the clamping plate 12 will not move relative to the fifth connecting plate 26. Therefore, the second spring 27 is compressed, and the pressure sensor 28 is caused to send a corresponding electrical signal. In this process, if the electrical signal sent by the pressure sensor 28 is small, it means that the connection effect between the sensor and the chip is poor, thereby completing the detection operation of the connection effect between the sensor and the chip. During the installation of the sensor, when the splint 12 moves, the splint 12 will drive the eighth connecting plate 34 to move back and forth, the eighth connecting plate 34 will drive the third rack 35 to move back and forth, the third rack 35 will drive the third gear 36 to rotate back and forth, and the third gear 36 will drive the connecting rod 31 and the cleaning plate 32 to rotate back and forth. In the initial state, the cleaning plate 32 and the sensor are in a vertical state. During the rotation of the cleaning plate 32, the cleaning plate 32 will be against the glue on the outside of the sensor and the chip, which will drive the glue to move, so that the glue on the outside of the sensor and the chip and the sensor are disconnected, forming a cleaning effect on the glue on the outside of the sensor and the chip, thereby reducing the workload of subsequent staff.
Claims
1. A packaging device for producing a device-level pressure sensor, comprising a workbench (1), characterized in that: The side wall of the workbench (1) is fixedly connected to a fixed plate (2), the lower side of the fixed plate (2) is fixedly connected to a telescopic sleeve (3), the lower side of the telescopic sleeve (3) is fixedly connected to a first connecting plate (4), the lower side of the first connecting plate (4) is fixedly connected to a camera (5), and the lower side of the first connecting plate (4) is symmetrically fixedly mounted with two mechanical arms (6), the ends of the two mechanical arms (6) are both mounted with a clamping assembly, the clamping assembly comprising a second connecting plate (7) fixedly mounted on the ends of the mechanical arms (6), the first connecting plate (4) is fixedly mounted to the ends of the mechanical arms (6), and the second connecting plate (7) is fixedly mounted on the ends of the mechanical arms (6). The side walls of the second connecting plate (7) are slidably connected to two sliding frames (8), the side walls of the two sliding frames (8) are fixedly connected to a slide plate (9), a third connecting plate (10) is slidably connected inside the slide plate (9), a fourth connecting plate (11) is fixedly connected to the lower side of the third connecting plate (10), a clamping plate (12) is slidably connected inside the fourth connecting plate (11), a blocking rod (13) is fixedly connected to the side wall of the clamping plate (12), and a control component for controlling the movement of the third connecting plate (10) is installed on the side wall of the second connecting plate (7).
2. The device-level pressure sensor production packaging equipment according to claim 1, characterized in that: The control assembly comprises a fixed frame (14) fixedly mounted on the side wall of the second connecting plate (7), a motor (15) fixedly mounted in the fixed frame (14), an output end of the motor (15) fixedly connected to a rotating shaft (16), an outer side of the rotating shaft (16) fixedly connected to a first gear (17), and the side walls of the two slide plates (9) are both fixedly connected to a first rack (18), and the first gear (17) and the first rack (18) are meshed.
3. The device-level pressure sensor production packaging equipment according to claim 2, characterized in that: A shaking assembly is installed in the slide plate (9), and the shaking assembly comprises a square rod (19) fixedly installed in the slide plate (9), the square rod (19) slidably penetrates the third connecting plate (10), and first springs (20) are fixedly connected between the side walls of both sides of the third connecting plate (10) and the inner wall of the slide plate (9), a rotating rod (21) is rotatably penetrated in the third connecting plate (10), and a rotating plate (23) is fixedly connected to the side wall of the rotating rod (21), and a plurality of baffles (22) are evenly fixedly connected in the slide plate (9), one end of the rotating rod (21) extends into the fourth connecting plate (11), and the rotating rod (21) is fixedly connected to the inner wall of the slide plate (9). ) is located in a fourth connecting plate (11), one end of which is fixedly connected to a second gear (24), a torsion spring (29) is fixedly connected between the second gear (24) and the fourth connecting plate (11), a second rack (25) is slidably connected to the fourth connecting plate (11), the second gear (24) and the second rack (25) are meshed, a fifth connecting plate (26) is fixedly connected to the side wall of the second rack (25), a second spring (27) is fixedly connected between the fifth connecting plate (26) and the fourth connecting plate (11), and a pressure sensor (28) is fixedly connected between the fifth connecting plate (26) and the fourth connecting plate (11).
4. The device-level pressure sensor production packaging equipment according to claim 3, characterized in that: The cleaning assembly comprises an eighth connecting plate (34) fixedly mounted on the lower side of the clamping plate (12); the eighth connecting plate (34) slides through the fourth connecting plate (11); a third rack (35) is fixedly connected to the lower side of the eighth connecting plate (34); a plurality of connecting rods (31) are evenly rotatably connected to the lower side of the fourth connecting plate (11); a third gear (36) is fixedly connected to the outer side of the plurality of connecting rods (31); the third gear (36) and the third rack (35) are meshed with each other; and a cleaning plate (32) is fixedly connected to the outer side of the plurality of connecting rods (31).
5. The packaging equipment for producing a device-level pressure sensor according to claim 4, characterized in that: The lower side of the fourth connecting plate (11) is fixedly connected to a seventh connecting plate (33), the lower side of the seventh connecting plate (33) is fixedly connected to a sixth connecting plate (30), the side wall of the sixth connecting plate (30) is provided with a plurality of grooves (37), the number and position of the plurality of grooves (37) being opposite to the connecting rod (31).
6. The device-level pressure sensor production packaging equipment according to claim 5, characterized in that: The side wall of the groove (37) is arranged in an arc shape.
7. The device-level pressure sensor production packaging equipment according to claim 4, characterized in that: The outer surface of the cleaning plate (32) is smooth.