Semiconductor chip processing equipment and method

Abstract

The invention relates to the field of chip processing, in particular to semiconductor chip processing equipment and method, and the semiconductor chip processing equipment is characterized in that the semiconductor chip processing equipment comprises a feeding device used for conveying materials; the transferring device is located at the discharging end of the feeding device; the material receiving device is located at the discharging end of the transferring device; a conveying device; the adjusting device is located at the feeding end of the conveying device; the first detection device is located above the conveying device; a material storage device I; a smearing device; a material storage device II; the vibration device is located at the discharging end of the second storage device; the adsorption device is located above the vibration device, and a plurality of adsorption grooves are formed in the adsorption device; the second detection device is located on the moving path of the adsorption device; the cleaning device is positioned between the detection device II and the vibration device; the third detection device is located at the discharging end of the conveying device; the material moving device is located at the discharging end of the conveying device; a discharging device; and a collecting device. The method has the effect of improving the chip processing efficiency.

Description

Technical Field

[0001] The present application relates to the field of chip processing, and in particular to a semiconductor chip processing device and method. Background Art

[0002] There are solder balls installed on the chip. The solder balls are mainly used to connect the chip's pads with the package substrate to achieve signal transmission and power supply between the chip and the external circuit. The solder balls can also play a role in heat dissipation and provide support for the chip to keep it stable during the packaging process and reduce the damage to the chip caused by external impact.

[0003] The existing chip installation solder ball operations usually include: screen printing, laser ball planting, etc. Screen printing prints solder paste onto the substrate pad through a steel mesh template, and reflow soldering heats the solder paste to a molten state, forming a spherical shape under the action of surface tension. Laser ball planting is to store the prepared solder balls in the machine, transport the solder balls to the designated position of the pad through N2, and then use a laser to heat the solder balls. After the solder balls are cooled, the chip is firmly combined. Among the above methods, although the printing method has low cost, it is difficult to install small solder balls and the uniformity is poor. Laser installation is inefficient and costly. Summary of the invention

[0004] In order to improve chip processing efficiency and improve chip processing quality, the present application provides a semiconductor chip processing device and method.

[0005] The present application provides a semiconductor chip processing device and method, which adopts the following technical solutions:

[0006] A semiconductor chip processing device and method, including a feeding device for conveying materials;

[0007] A transfer device, located at the discharge end of the feeding device, used to receive the material on the feeding device;

[0008] A material receiving device, located at the discharge end of the transfer device, used to receive the material on the transfer device;

[0009] A conveying device, used for conveying materials on the receiving device;

[0010] An adjustment device, located at the feed end of the conveyor, is used to adjust the position of the material;

[0011] The first detection device is located above the conveying device and is used to detect whether the chip position is adjusted properly. If the detection is passed, the conveying device continues to convey the material; if the detection is not passed, the conveying device returns the material to the adjustment device for further adjustment;

[0012] Material storage device 1, used for storing solder paste;

[0013] A coating device for coating solder paste on the chip;

[0014] Stocking device 2, used for loading solder balls;

[0015] The vibration device is located at the second discharge end of the storage device and is used to evenly disperse the solder balls;

[0016] An adsorption device, used for adsorbing the solder balls on the vibration device, wherein the adsorption device is provided with a plurality of adsorption slots;

[0017] The second detection device is located in the moving path of the adsorption device, and is used to detect whether the solder balls on the adsorption device are completely adsorbed; if the detection is passed, the adsorption device moves to the top of the material to discharge the material; if the detection fails, the adsorption device needs to return to re-adsorb;

[0018] A cleaning device, located between the second detection device and the vibration device, is used to clean excess solder balls on the adsorption device;

[0019] Detection device three, located at the discharge end of the conveyor device, is used to detect whether the solder balls on the chip are installed properly;

[0020] The material moving device is located at the discharging end of the conveying device and is used to move the material for discharging;

[0021] A discharging device, used for collecting chips that have passed the third detection of the detection device;

[0022] The collecting device is used to collect chips with problems detected by the detecting device three.

[0023] By adopting the above technical scheme, the feeding device transmits the material, the transfer device receives the material on the feeding device, and the receiving device transports the material to the conveying device, thereby improving the conveying efficiency of the product and reducing the manual handling time; the detection device one, the detection device two and the detection device three respectively perform processing detection on each processing node of the material, effectively improving the processing quality of the product, and at the same time facilitating the unified processing of problematic materials and facilitating the subsequent product to trace the source of the problem; the adsorption device facilitates the unified installation of solder balls, improves the installation efficiency of solder balls, and reduces the installation time of solder balls. The detection device two improves the installation quality of solder balls and ensures the integrity of the number of solder ball installations.

[0024] Preferably, the feeding device includes a mounting frame, a material table arranged on the mounting frame, a conveyor belt arranged on the material table, and a baffle plate arranged on the mounting frame and located on both sides of the material table in the length direction, and the conveyor belt plate is located between the two baffle plates.

[0025] Preferably, the transfer device includes a transfer cylinder located at the discharge end of the feeding device, a transfer seat arranged at the piston end of the transfer cylinder, a linear motor arranged on the transfer seat, and a material receiving seat arranged on the linear motor. The piston end of the transfer cylinder moves back and forth along the conveying direction of the feeding device, and the linear motor is used to drive the material receiving seat to move up and down.

[0026] Preferably, the material receiving device includes a material receiving bracket, a linear motor 2 arranged on the material receiving bracket, a material receiving seat 2 arranged on the linear motor 2, a positioning plate arranged on the bottom surface of the material receiving seat 2 and located on both sides of the length direction of the material receiving seat 2, an adjustment component and a clamping component arranged on the material receiving seat 2, the positioning plate is provided with a positioning groove along the length direction on the side facing the material, the moving path of the linear motor 2 is from the transfer device to the conveying device, the adjustment component is used to adjust the distance between the two positioning plates, and the clamping component is used to clamp and guide the material into the positioning groove.

[0027] Preferably, the adjusting device includes a linear motor three, an adjusting seat arranged on the linear motor three, an adjusting cylinder one arranged on the adjusting seat and an adjusting piece one arranged at the piston end of the adjusting cylinder one, the adjusting cylinder one is used to drive the adjusting piece one to move up and down, the linear motor three is used to drive the adjusting seat to move along the width direction of the conveying device, the adjusting seat is provided with a mounting platform for installing the adjusting cylinder one, the adjusting piece one includes an adjusting cylinder two arranged on the adjusting seat, an adjusting plate arranged at the piston end of the adjusting cylinder one and a plurality of adjusting rods arranged on the bottom surface of the adjusting plate, the piston end of the adjusting cylinder two is connected to the mounting platform, and the moving direction of the piston of the adjusting cylinder two is consistent with the conveying direction of the conveying device.

[0028] Preferably, the detection device includes a support seat, a linear motor four arranged on the support seat and located above the conveying device, a detection seat one arranged on the linear motor four, a detection cylinder one arranged on the detection seat one, and a detection camera one arranged on the piston end of the detection cylinder one, the detection cylinder one is used to drive the detection camera to move up and down, and the linear motor four is driven reciprocatingly along the width direction of the conveying device.

[0029] Preferably, the material storage device 1 includes a material storage seat 1 and a material storage box 1 arranged on the material storage seat 1, and the top surface of the material storage box 1 is open; the smearing device includes a mounting seat, a linear motor 5 arranged on the mounting seat, a fixed seat arranged on the linear motor 5, a linear motor 6 arranged on the fixed seat, a smearing seat arranged on the linear motor 6 and a smearing block arranged on the smearing seat, the linear motor 5 is used to drive the smearing block to move from the material storage device 1 to the conveying device, and the linear motor 6 is used to drive the smearing block to move up and down.

[0030] Preferably, a recovery device is further provided between the material storage device 1 and the conveying device, and the recovery device includes a recovery seat, a contact plane arranged on the recovery seat, a baffle 2 arranged on the recovery seat and located on both sides of the length direction of the contact plane, and a scraping assembly arranged on the recovery seat, a recovery box is provided at one end of the recovery seat away from the scraping assembly, and the end of the contact plane close to the recovery box is inclined downward.

[0031] Preferably, the second material storage device comprises a second material storage seat, a second material storage box arranged on the second material storage seat and a pushing cylinder arranged on the second material storage seat, and the pushing cylinder is used to push the material storage box to unload materials.

[0032] Preferably, the vibration device includes a vibration seat, a vibration plate disposed on the vibration seat, and a vibration member disposed on the vibration seat and located below the vibration plate, wherein the vibration member is used to drive the vibration plate to vibrate.

[0033] Preferably, the adsorption device includes a linear motor seven, an adsorption seat arranged on the linear motor seven, a linear motor eight arranged on the adsorption seat, a mounting block arranged on the linear motor eight, a rotating motor arranged on the mounting block and an adsorption block arranged at the output end of the rotating motor. The linear motor seven is used to drive the adsorption block to reciprocate between the material storage device two and the conveying device, the vibration device is located in the moving path of the linear motor seven, the linear motor eight is used to drive the adsorption block to move up and down, and the adsorption groove is located on the adsorption block.

[0034] Preferably, the cleaning device comprises a cleaning frame and a cleaning tube arranged on the cleaning frame, one end of the cleaning tube is sealed, the other end of the cleaning tube is connected to a vacuum pump, and a long groove is opened along the length direction on one side of the cleaning tube facing the adsorption block.

[0035] Preferably, the detection device 2 includes a detection seat 2 and a detection camera 2 arranged on the detection seat 2; the detection device 3 includes a detection seat 3, a linear motor 9 arranged on the detection seat 3 and extending along the width direction of the conveying device, a fixed frame arranged on the linear motor 9, a linear motor 10 arranged on the fixed frame and a detection camera 3 arranged on the linear motor 10, the linear motor 9 is used to drive the detection camera 3 to move along the width direction of the conveying device, and the linear motor 10 drives the detection camera 3 to move up and down.

[0036] On the other hand, the present application also discloses a semiconductor chip processing method, which adopts the following technical solution:

[0037] A semiconductor chip processing method, comprising any one of the above processing equipment, further comprising the following steps: material preparation: placing a plurality of chips into a material tray in sequence, and arranging the surface to be installed with solder balls facing upward, and then placing the filled material tray into a material box, and a plurality of grooves for positioning the material tray are provided on both sides of the material box, and when the material box is full, the material box is placed on a feeding device, and the feeding device feeds the material;

[0038] Feeding: After the feeding device transports the material tray to the discharge end, the transfer device receives the material box on the feeding device, and the transfer device aligns the open end of the material box with the receiving device. The receiving device takes out the material tray in the material box and then places it on the conveying device;

[0039] Material inspection: After the receiving device places the chip on the conveying device, the adjusting device first adjusts the position of the chip in the tray to ensure the uniformity of the chip position. After the adjusting device completes the adjustment, the conveying device conveys the tray to the bottom of the detection device for position detection. The detection device detects the chip position to check whether there is an error in the chip position. If the chip position is incorrect, the adjusting device adjusts it again; if the chip position is correct, the conveying device transfers the tray to the next processing point;

[0040] Apply solder paste: The conveyor conveys the material tray (the chips in the material tray are all adjusted in position) to the working area of ​​the coating device, the coating device moves to a place of the material storage device, moves down to dip in the solder paste, and then moves to the conveyor and applies the solder paste to the material tray on the conveyor. The coating device applies the solder paste to the groove of the chip; after the coating device is finished, the excess solder paste needs to be scraped off and then dipped again;

[0041] Install solder balls: The conveying device conveys the chip coated with solder paste to the installation area of ​​the adsorption device, and the storage device 2 places the solder balls in the vibration device. The vibration device disperses the solder balls by vibration, and the adsorption device moves to the top of the vibration device to adsorb the solder balls. The solder balls are adsorbed into the adsorption tank through vacuum. After the adsorption device completes the adsorption, the adsorption device moves to the cleaning device, and the cleaning device removes the excess solder balls at the adsorption end of the adsorption device. After the cleaning is completed, the adsorption device moves to the detection device 2 for detection. The detection device 2 mainly detects whether the solder balls adsorbed on the adsorption device are complete. If the detection device 2 detects that the solder balls on the adsorption device are not completely adsorbed, the adsorption device will be re-adsorbed. It returns to the vibration device to adsorb the solder balls, and then passes through the cleaning device to clean it again, and passes through the detection device 2 to detect that it passes the detection, and moves to the conveying device. If it fails the detection, the above adsorption, cleaning and detection operations are repeated; if the detection device 2 detects that there is a problem with the quality of the solder balls on the adsorption device, a material tray for loading the problematic solder balls is installed, and the adsorption device moves to the material tray, and the problematic solder balls are placed in the material tray, and then the adsorption device adsorbs the solder balls again, and passes through the cleaning device to clean it, and passes through the detection device 2; if the detection device 2 detects that the adsorption of the solder balls on the adsorption device is intact, it moves directly to the conveying device and installs the solder balls in the grooves of the chip;

[0042] Discharging: After the solder balls are installed on the chip, the conveying device conveys the chip to the discharging end, where it is inspected by the detection device three. The material tray through which the chip is detected is moved to the discharging device by the material transfer device two. When the detection device three detects the material tray with the problematic chip, the material transfer device two transfers the material tray to the collection device, which is then recycled and processed by the staff.

[0043] To sum up, the feeding device, transfer device, material receiving device and conveying device can effectively improve the material conveying efficiency, improve the overall material processing efficiency, reduce the number of manual handling times, and reduce the manual handling cost; the adjusting device can improve the position uniformity of subsequent material processing, thereby improving the material processing quality; the detection device one, the detection device two and the detection device can improve the material processing quality, ensure the quality and efficiency of the material installation of solder balls, and save the material processing cost; the adsorption device can improve the installation efficiency of solder balls; the cleaning device and the detection device two can improve the quality of the solder balls installed by the adsorption device, and ensure the installation integrity of the solder balls. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 This is a schematic diagram of the structure of a semiconductor chip processing device in this application. Figure 1 ;

[0045] Figure 2 This is a schematic diagram of the structure of a semiconductor chip processing device in this application. Figure 2 ;

[0046] Figure 3This is a schematic diagram of the structure of a semiconductor chip processing device in this application. Figure 3 ;

[0047] Figure 4 This is a schematic diagram of the structure of a semiconductor chip processing device in this application. Figure 4 ;

[0048] Figure 5 This is a schematic diagram of the structure of a semiconductor chip processing device in this application. Figure 5 ;

[0049] Figure 6 This is a schematic diagram of the structure of a semiconductor chip processing device in this application. Figure 6 ;

[0050] Figure 7 This is a schematic diagram of the structure of a semiconductor chip processing device in this application. Figure 7 ;

[0051] Figure 8 This is a schematic diagram of the structure of a semiconductor chip processing device in this application. Figure 8 ;

[0052] Fig. 9 This is a schematic diagram of the structure of a semiconductor chip processing device in this application. Figure 9 .

[0053] Description of reference numerals: 1. base; 2. feeding device; 21. mounting frame; 22. material table; 23. conveyor belt 1; 24. baffle 1; 3. transfer device; 31. transfer cylinder; 32. transfer seat; 33. linear motor 1; 34. material receiving seat 1; 4. material receiving device; 41. material receiving bracket; 42. linear motor 2; 43. material receiving seat 2; 44. positioning plate; 441. positioning groove; 45. adjustment component; 46. clamping component; 461. driving member 1; 462. lifting cylinder; 463. clamping seat; 464. clamping claw; 5. conveying device; 6. adjustment device; 61. linear motor 3; 62. adjustment seat; 63. Adjustment cylinder 1; 64. Adjustment member 1; 641. Adjustment cylinder 2; 642. Adjustment plate; 643. Adjustment rod; 7. Detection device 1; 71. Support seat; 72. Linear motor 4; 73. Detection seat 1; 74. Detection cylinder 1; 75. Detection camera 1; 8. Material storage device 1; 81. Material storage seat 1; 82. Material storage box 1; 9. Coating device; 91. Mounting seat; 92. Linear motor 5; 93. Fixed seat; 94. Linear motor 6; 95. Coating seat; 96. Coating block; 10. Material storage device 2; 101. Material storage seat 2; 102. Material storage box 2; 103. Push cylinder; 11. Vibration device ;111, vibration seat;112, vibration plate;113, vibration member;12, adsorption device;121, linear motor seven;122, adsorption seat;123, linear motor eight;124, mounting block;125, rotating motor;126, adsorption block;13, detection device two;131, detection seat two;132, detection camera two;14, cleaning device;141, cleaning rack;142, cleaning tube;1421, long slot;15, detection device three;151, detection seat three;152, linear motor nine;153, fixing rack;154, linear motor ten;155, detection camera three;16, material moving device; 161. Support frame; 162. Linear motor eleven; 163. Material transfer seat; 164. Material transfer cylinder; 165. Pushing member; 166. Pushing block; 167. Material transfer plate; 1671. Limiting groove; 17. Discharging device; 171. Mounting plate; 1711. Material blocking plate; 172. Conveyor belt two; 18. Collecting device; 181. Collecting seat; 182. Clamping plate; 183. Material blocking rod; 19. Mounting table; 20. Recovery device; 201. Recovery seat; 202. Contact plane; 203. Baffle two; 204. Scraping assembly; 25. Recovery box; 26. Adjusting member two; 27. Material tray; 28. Pushing assembly. DETAILED DESCRIPTION

[0054] The following is combined with Figure 1-Figure 9 The present invention is further described in the following examples. The following examples are only used to more clearly illustrate the technical solution of the present application, and cannot be used to limit the protection scope of the present application.

[0055] In the description of the present application, it should be noted that the orientations or positional relationships indicated by “center”, “up”, “down”, “left”, “right”, “vertical”, “horizontal”, “inside”, “outside”, etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0056] The present application discloses a semiconductor chip processing device and method. Figure 1 and Figure 2 , including a feeding device 2, a transfer device 3, a receiving device 4, a conveying device 5 and a discharging device 17 arranged in sequence along the chip processing path. The feeding device 2 is used to load and convey materials. The transfer device 3 is located at the discharging end of the feeding device 2 and is used to receive materials on the feeding device 2. The receiving device 4 is located at the discharging end of the transfer device 3 and is used to receive materials on the transfer device 3, and then drive the materials to be placed on the feeding end of the conveying device 5. An adjusting device 6 is provided above the discharging end of the conveying device 5, and the adjusting device 6 adjusts the position of the materials on the conveying device 5.

[0057] Reference Figure 1 and Figure 3 , a detection device 7 is also installed above the conveying device 5, and the detection device 7 is used to detect whether the material position adjusted by the adjustment device 6 is accurately placed. The materials of this application are chips and trays for loading chips. The chips are provided with grooves for loading solder balls, and the trays are provided with grooves for positioning chips. The chips are placed on the trays with the side with the grooves facing upwards, so as to facilitate the subsequent installation of solder balls on the chips. In the specific implementation process, the materials can also be set to the corresponding products according to the processing requirements.

[0058] Reference Figure 1 and Figure 4After the detection device 17 completes the chip detection, the conveying device 5 transports the tray of chips that have passed the detection. The present application also includes a storage device 18 for storing solder paste, and a coating device 9 for applying solder paste on the chip. After the conveying device 5 moves the tray to the processing area of ​​the coating device 9, the coating device 9 first moves to the storage device 18 to dip the solder paste, and then moves to the conveying device 5 to dip the solder paste into the chip groove. The present application also includes a storage device 2 10 for loading solder balls, a vibration device 11 for dispersing solder balls, and an adsorption device 12 for adsorbing solder balls. The conveying device 5 transports the chip coated with solder paste to the solder ball installation area, and the storage device 2 10 places the solder balls on the vibration device 11. The vibration device 11 vibrates and disperses the solder balls, so that the adsorption device 12 can adsorb the solder balls. An adsorption groove is opened on the adsorption device 12 corresponding to the chip groove, and the corresponding adsorption groove adsorbs the solder balls. After the adsorption device 12 adsorbs the solder balls, it places the solder balls on the material of the conveying device 5.

[0059] Reference Figure 1 and Figure 4 , when the adsorption device 12 completes the adsorption, in order to avoid the appearance of excess solder balls or incomplete adsorption of solder balls on the adsorption device 12, the present application also includes a cleaning device 14 and a detection device 13. The cleaning device 14 is used to clean the adsorption device 12 that has adsorbed the solder balls, and clean up the excess solder balls on the surface of the adsorption device 12. After the cleaning is completed, the adsorption device 12 moves to the detection device 13 for detection. The detection device 13 is used to detect whether the solder balls on the adsorption device 12 are completely adsorbed and whether the quality of the solder balls is normal. If there is a problem with the solder balls, the present application is also equipped with a material tray 27 for loading the problematic solder balls. The adsorption device 12 moves to the material tray 27, places the problematic solder balls into the material tray 27, and then returns to the vibration device 11 to adsorb the solder balls. When the detection device 13 passes the detection, the adsorption device 12 moves to the top of the chip to discharge the material, and then the conveying device 5 drives the chip to continue moving. In order to further ensure the placement quality of the solder balls on the chip, the present application also includes a detection device 3 15 and a material moving device 16. The detection device 3 15 is located at the discharge end of the conveying device 5 and is used to detect whether the solder balls on the chip are installed intact; the chips that pass the detection are moved by the material moving device 16 2 to the discharge device 17 for discharge, and the chips with problems are moved by the material moving device 16 2 to another storage area. The present application is provided with a collection device 18 for collecting the problem chips.

[0060] Reference Figure 1 and Figure 2, the various structural components of the present application are installed on the base 1, which is convenient for maintenance, installation of equipment and protection of the floor of the processing area. In the specific implementation process, they can also be directly installed or placed on the ground or on a bracket. In the embodiment of the present application, the feeding device 2 is located at the feeding end of the base 1 and extends along the width direction of the base 1. The feeding device 2 includes a mounting frame 21, a material table 22 mounted on the mounting frame 21 and extending along the length direction of the mounting frame 21, a conveyor belt 23 mounted on the material table 22, and a baffle 24 arranged on the mounting frame 21 and located on both sides of the length direction of the material table 22. The baffle 24 is used to improve the stability of the material on the conveyor belt 23. The conveyor belt 23 of the present application is arranged in several groups to improve the stability of material transportation. In the embodiment of the present application, two groups of material tables 22 are arranged to form a two-layer material transportation area, which is convenient to increase the storage space of the feeding device 2.

[0061] Reference Figure 1 and Figure 2 The transfer device 3 is located at the discharge end of the feeding device 2. The transfer device 3 includes a transfer cylinder 31 arranged along the width direction of the base 1, a transfer seat 32 arranged at the piston end of the transfer cylinder 31, a linear motor 33 arranged on the transfer seat 32, and a material receiving seat 34 arranged at the output end of the linear motor 33. The moving direction of the piston end of the transfer cylinder 31 is consistent with the conveying direction of the conveyor belt 23. The linear motor 33 is used to drive the material receiving seat 34 to move up and down. The transfer cylinder 31 is used to drive the material receiving seat 34 to move toward the feeding device 2, so that the material receiving seat 34 can receive the material on the feeding device 2. The discharge end of the mounting frame 21 is provided with a pushing component 28, which is located at the end of the transfer device 3 away from the material receiving device 4. The pushing component 28 includes a cylinder and a pushing rod arranged at the piston end of the cylinder. The side of the pushing rod facing the material is provided with a groove for positioning the material.

[0062] Reference Figure 2 and Figure 3, the pushing component 28 pushes the material toward the material receiving device 4, which includes a material receiving bracket 41 installed on the base 1, a linear motor 42 arranged on the material receiving bracket 41 and arranged along the width direction of the base 1, a material receiving seat 43 arranged at the output end of the linear motor 42, a positioning plate 44 arranged at the bottom of the material receiving seat 43 and located on both sides of the length direction of the material receiving seat 43, an adjustment component 45 arranged on the material receiving seat 43 and used to adjust the distance between the two positioning plates 44, and a clamping component 46 for clamping and pulling the material. The two positioning plates 44 extend along the length direction of the base 1 and are used to position the two sides of the length direction of the material. A positioning groove 441 is opened on the side of the positioning plate 44 facing the material along the length direction. The positioning groove 441 is funnel-shaped at one end facing the material, and the width of the end where the material enters is wider, which is convenient for the material to enter the positioning groove 441, thereby improving the positioning effect of the positioning plate 44 on the material. The adjustment component 45 can be a double-headed cylinder, the piston ends of which are respectively connected to the corresponding positioning plates 44, and the double-headed cylinder drives the positioning plates 44 to move closer to or away from each other; the adjustment component 45 can also be two groups of cylinders or a combination of a motor and a screw rod.

[0063] Reference Figure 3 and Figure 4 The clamping assembly 46 includes a driving member 461 arranged on the base 1 and extending along the length direction of the base 1, a lifting cylinder 462 arranged on the driving member 461, a clamping seat 463 arranged at the piston end of the lifting cylinder 462, and a clamping claw 464 arranged on the clamping seat 463. The driving member 461 in the embodiment of the present application is a linear driving structure such as a cylinder or a motor, a screw rod combination or a linear motor, which is mainly used for the clamping claw 464 to clamp the material and drive the material to move along the length direction of the positioning plate 44. The two positioning plates 44 position the two sides of the material, and then the linear motor 2 42 drives the material to move toward the conveying device 5. The conveying device 5 includes a driving member 2 arranged along the length direction of the base 1 and a conveying seat installed on the driving member 2. The driving member 2 is a linear motor. In order to improve the stability of the movement of the conveying seat, the base 1 is provided with a slide rail along the length direction, and the conveying seat is provided with a slider located on the slide rail. The driving member 2 drives the conveying seat to move along the length direction of the base 1. In the specific implementation process, the conveying device 5 can directly use a conveyor belt or a motor, a screw rod or a motor, a gear, a rack and other linear drive structures, which are mainly used to drive the material to move in a linear manner to facilitate the control of the conveying switch.

[0064] Reference Figure 3 and Figure 4After the receiving device 4 transfers the material to the feeding end of the conveying device 5, the feeding end of the conveying device 5 is provided with an adjusting device 6 to adjust the material position to ensure that the subsequent material processing is in a uniform position. The adjusting device 6 includes a linear motor 3 61 mounted on the receiving bracket 41, an adjusting seat 62 mounted on the linear motor 3 61, an adjusting member 1 64 located on the bottom surface of the adjusting seat 62, and an adjusting cylinder 1 63 mounted on the adjusting seat 62 and used to drive the adjusting member 1 64 to move up and down. The adjusting member 1 64 includes an adjusting plate 642 installed at the piston end of the adjusting cylinder 1 63, an adjusting cylinder 2 641 installed on the adjusting seat 62 and having a driving direction consistent with the moving direction of the conveying device 5, and a plurality of adjusting rods 643 installed on the bottom surface of the adjusting plate 642. In the embodiment of the present application, a mounting platform 19 is installed on the adjusting seat 62, and the adjusting cylinder 2 641 is installed on the mounting platform 19 to drive the mounting platform 19 to reciprocate along the conveying direction of the conveying device 5; the adjusting cylinder 1 63 is installed on the mounting platform 19, so that the adjusting cylinder 1 63 drives the adjusting plate 642 to move up and down. The width of the bottom end of the adjusting rod 643 gradually decreases downward, and a plurality of adjusting rods 643 are arranged corresponding to the material position. The adjusting rod 643 is located at the end of the material away from the discharge end of the conveying device 5. The linear motor 3 61 drives the adjusting seat 62 to move to the top of the material on the conveying device 5, and then the adjusting cylinder 1 63 drives the adjusting rod 643 to move downward and plug into the end of the material, and the adjusting cylinder 2 641 drives the adjusting rod 643 to push the material to move.

[0065] Reference Figure 4 and Figure 5 After the material position is adjusted, in order to ensure the uniformity of the material position adjustment, the detection device 7 detects the material to detect whether the material position is adjusted in place. The detection device 7 includes a support seat 71 installed on the base 1, a linear motor 72 installed on the support seat 71 and located above the conveying device 5, a detection seat 73 installed on the linear motor 72, a detection cylinder 74 installed on the detection seat 73, and a detection camera 75 arranged at the piston end of the detection cylinder 74. The linear motor 72 extends along the width direction of the base 1. The linear motor 72 is used to drive the detection camera 75 to move along the width direction of the conveying device 5, and is used to drive the detection camera 75 to detect the materials one by one. The detection cylinder 74 is used to drive the detection camera 75 to move up and down, which is convenient for the detection camera 75 to focus and improve the detection accuracy of the detection camera 75. The material that passes the detection is continuously conveyed by the conveying device 5 to apply solder paste.

[0066] Reference Figure 4 and Figure 5The material storage device 8 includes a material storage seat 81 disposed on the base 1 and a material storage box 82 disposed on the material storage seat 81 and used to store solder paste. The top surface of the material storage box 82 is open, so that the smearing block 96 can dip the solder paste. The material storage seat is also provided with a smoothing component for smoothing the solder paste. The smoothing component includes a smoothing block located above the material storage box 82 and a driving member 3 disposed on the material storage seat 81 and used to drive the smoothing block to move along the length direction of the material storage box. The driving member 3 can be a linear driving structure such as a cylinder or a linear motor. The smearing device 9 includes a mounting seat 91 mounted on the base 1, a linear motor 5 92 mounted on the mounting seat 91, a fixed seat 93 mounted on the linear motor 5 92, a linear motor 6 94 arranged on the fixed seat 93, a smearing seat 95 arranged on the linear motor 6 94, and a smearing block 96 arranged on the smearing seat 95. The linear motor 5 92 is arranged along the width direction of the base 1, and the material storage device 1 8 is located on the moving path of the linear motor 5 92. The base 1 is also equipped with a recovery device 20 for collecting excess solder paste on the smearing device 9. The linear motor 6 94 drives the smearing seat 95 to move up and down, so that the smearing block 96 can dip the solder paste. In the embodiment of the present application, the bottom surface of the smearing block 96 is provided with a plurality of protrusions corresponding to the grooves on the material, which are used to smear the solder paste in the grooves of the material; in the specific implementation process, if the material is provided with protrusions, the corresponding protrusions are provided with grooves on the smearing block 96, and the corresponding smearing method is mainly set according to the position where the solder paste needs to be applied to the material.

[0067] Reference Figure 4 and Figure 5The recovery device 20 is located on the transmission path of the linear motor 5 92. The recovery device 20 includes a recovery seat 201 installed on the base 1, a contact plane 202 installed on the recovery seat 201, a baffle 203 installed on the recovery seat 201 and located on both sides of the length direction of the contact plane 202, and a scraping component 204 installed on the recovery seat 201 and used for scraping the solder paste on the contact plane 202. The scraping component 204 is located at one end of the contact plane 202. A recovery box 25 is provided on the recovery seat 201 at one end of the contact plane 202 away from the scraping component 204, and a baffle 3 is provided at one end of the recovery box 25 away from the contact plane 202. The scraping assembly 204 includes a scraper located on the contact plane 202 and a driving member 4 arranged on the recovery seat 201 and used to drive the scraper to move along the length direction of the contact plane 202. The driving member 4 is a linear motor or a cylinder or a linear driving structure such as a motor and a lead screw. The driving member 4 drives the scraper to scrape the solder paste on the contact plane 202. The end of the contact plane 202 close to the recovery box 25 is sloped to facilitate the solder paste to flow into the recovery box 25. The linear motor 5 92 drives the smearing block 96 to move to the material storage box 1 82, and the linear motor 6 94 drives the smearing block 96 to dip the solder paste in the material storage box 1 82. Then the linear motor 5 92 drives the smearing block 96 that dips the solder paste to move to the material on the conveying device 5, and then the linear motor 6 94 drives the smearing block 96 to press down the contact material to smear the solder paste on the material. After the coating is completed, the linear motor 5 92 drives the coating block 96 to move to the contact plane 202, and the coating block 96 presses down to adhere the excess solder paste to the contact plane 202, and then the driving member 4 drives the scraper to scrape the solder paste on the contact plane 202 into the recovery box 25.

[0068] Reference Figure 6 and Figure 7After the material on the conveying device 5 is coated with solder paste, the conveying device 5 conveys the material to the solder ball installation step. The storage device 10 includes a storage seat 101, a storage box 102 arranged on the storage seat 101, and a push cylinder 103 arranged on the storage seat 101 and used to push the storage box to unload materials. The storage box 102 is used to load solder balls. The top surface of the storage box 102 is provided with an openable and closable box cover, and the end of the storage box 102 facing the vibration device 11 is provided with a discharge port. The storage box 102 is installed with a cover plate located at the discharge port, and the upper end of the cover plate is hinged to the storage box 102 through a rotating shaft. The push cylinder 103 is located at the end of the storage box 102 away from the discharge port. The piston end of the push cylinder 103 is provided with a push sleeve, which is located at the lower end of the storage box 102. The push sleeve is used to reduce the wear of the push cylinder 103 on the storage box 102. The second storage seat 101 is provided with ears for positioning the second storage box 102, and the two sides of the second storage box 102 are connected to the ears through a rotating shaft. The second storage seat 101 is also provided with a guide plate located below the second storage box 102 and used to receive the solder balls at the discharge port. The guide plate is arranged downwardly, and the downward end is arranged toward the vibration device 11, and is used to guide the solder balls into the vibration device 11.

[0069] Reference Figure 6 and Figure 7 The vibration device 11 includes a vibration seat 111, a vibration disk 112 arranged on the vibration seat 111, and a vibration member 113 arranged on the vibration seat 111 and located below the vibration disk 112. The vibration seat 111 is installed on the base 1. The vibration member 113 includes a vibration motor installed on the vibration seat 111 and an eccentric block arranged at the output end of the vibration motor. The vibration disk 112 is driven to vibrate by the vibration member 113, and the tin balls in the vibration disk 112 are vibrated and dispersed, which is convenient for the subsequent adsorption device 12 to adsorb. In the embodiment of the present application, the outer wall of the vibration seat 111 is surrounded by a recovery disk located below the vibration disk 112. The outer peripheral size of the recovery disk is larger than the outer peripheral size of the vibration disk 112, and it is mainly used to collect fallen tin balls; the recovery disk of the present application is an enlarged size of the same proportion as the vibration disk 112, and the recovery effect is good, which prevents the tin balls from falling around and interfering with the processing environment.

[0070] Reference Figure 6 and Figure 7The adsorption device 12 includes a linear motor 7 121 installed on one side of the mounting seat 91 in the length direction, an adsorption seat 122 arranged on the linear motor 7 121, a linear motor 8 123 installed on the adsorption seat 122, a mounting block 124 installed on the linear motor 8 123, a rotary motor 125 arranged on the mounting block 124, and an adsorption block 126 arranged on the rotary motor 125. The adsorption device 12 is provided with a plurality of adsorption slots corresponding to the grooves of the material. The adsorption slots are installed on the adsorption block 126. The adsorption slots are located at the positions where the solder balls need to be installed on the materials corresponding to the adsorption block 126. The adsorption end of the adsorption slot is in an arc shape, which is convenient for adsorption and positioning of the solder balls. A vacuum suction pipe is connected to the end of the adsorption slot away from the adsorption end, and the vacuum suction pipe is connected to a vacuum pumping device, which is convenient for the adsorption slot to adsorb the solder balls. After the solder balls are absorbed in the adsorption slot, the excess solder balls cannot enter the adsorption slot again.

[0071] Reference Figure 6 and Figure 7 , the linear motor 7 121 extends along the width direction of the base 1, the vibration device 11, the detection device 2 13 and the cleaning device 14 are all located on the moving path of the linear motor 7 121, the linear motor 7 121 drives the adsorption seat 122 to move from the vibration device 11 to the conveying device 5, and the linear motor 8 123 is used to drive the mounting block 124 to move up and down, so that the adsorption block 126 can adsorb the solder balls, and the subsequent cleaning device 14 can clean the adsorption block 126. The rotating motor 125 is used to rotate the adsorption block 126, so that the adsorption block 126 rotates to correspond to the placement direction of the vibration plate 112, and the subsequent adsorption block 126 corresponds to the material placement direction, so that the adsorption block 126 can discharge or absorb materials.

[0072] Reference Figure 7 and Figure 8 The cleaning device 14 is located between the detection device 13 and the vibration device 11. After the adsorption block 126 adsorbs the solder balls, it first goes to the cleaning device 14 to clean the excess solder balls, and then moves to the detection device 13 for detection. The cleaning device 14 includes a cleaning frame 141 and a cleaning pipe 142 installed on the cleaning frame 141. The cleaning pipe 142 is connected to a vacuum pump. The cleaning pipe 142 is provided with a long groove 1421 along the length direction on one side facing the adsorption block 126. After the adsorption block 126 passes through the cleaning pipe 142, the long groove 1421 adsorbs the adsorption block 126. The solder balls that are not in the adsorption groove are not positioned by the suction force of the adsorption groove, which is convenient for the long groove 1421 to collect the solder balls, and it is convenient to collect the excess solder balls on the adsorption block 126.

[0073] Reference Figure 7 and Figure 8The detection device 13 includes a detection seat 131 and a detection camera 132 installed on the detection seat 131. The detection seat 131 is installed on the base 1, and the detection surface of the detection camera 132 is set toward the adsorption end of the adsorption block 126. The detection camera 132 is used to detect whether the adsorption slots on the adsorption block 126 are all adsorbed with solder balls, and at the same time detect whether the solder balls have surface defects and other problems. The adsorption block 126 that passes the inspection is moved to the material on the conveying device 5 by the linear motor 121, and the linear motor 123 drives the adsorption block 126 to approach the material, and then places the solder ball on the material.

[0074] Reference Figure 7 and Figure 8 After the solder balls are installed on the material, the material is transported by the conveying device 5 to the detection device 3 15 for final inspection to detect the quality of the solder balls installed on the material. The detection device 3 15 includes a detection seat 3 151, a linear motor 9 152 installed on the detection seat 3 151 and extending along the width direction of the conveying device 5, a fixed frame 153 arranged on the linear motor 9 152, a linear motor 10 154 arranged on the fixed frame 153, and a detection camera 3 155 arranged on the linear motor 10 154. The linear motor 9 152 is used to drive the detection camera 3 155 to move along the width direction of the base 1, so as to detect the materials on the conveying device 5 in turn. The linear motor 10 154 is used to drive the detection camera 3 155 to approach the material, so as to facilitate the detection camera 3 155 to detect the installation quality of the solder balls on the material. The material that passes the inspection is transported to the discharging end by the conveying device 5, and the material moving device 16 is used to receive the material and send the material to the discharging device 17; the material with problems detected is received by the receiving device 4 to the collecting device 18.

[0075] Reference Figure 8 and Fig. 9 The material moving device 16 comprises a support frame 161, a linear motor 11 162 arranged on the support frame 161, a material moving seat 163 arranged on the linear motor 11 162, a material moving cylinder 164 arranged on the material moving seat 163, a pusher 165 arranged at the piston end of the material moving cylinder 164, a pusher block 166 arranged at one end of the pusher 165, and a material moving plate 167 arranged at the bottom of the material moving seat 163 and used for positioning the two sides of the material in the length direction, and the pusher block 166 is located at one end of the material moving plate 167 and located between the two material moving plates 167. The material moving plate 167 has a limiting groove 1671 arranged along the length direction on one side facing the material, and the limiting groove 1671 is funnel-shaped at one end close to the conveying device 5, and the wider end is arranged toward the conveying device 5.

[0076] Reference Figure 8 and Fig. 9The discharging device 17 includes a mounting plate 171 and a conveyor belt 172 disposed on the mounting plate 171. A material blocking plate 1711 is disposed at one end of the mounting plate 171 away from the conveyor 5. A position sensor can be installed at each processing node of the device of the present application to detect the material position and improve the accuracy of the position of each node. The collecting device 18 includes a collecting seat 181, a clamping plate 182 disposed on the collecting seat 181 and used to position the two sides of the material, and a material blocking rod 183 disposed on the side of the collecting seat 181 away from the conveyor 5. The collecting seat 181 is provided with an adjusting member 26 for adjusting the distance between the two clamping plates 182. The adjusting member 26 can be a double-headed cylinder or a motor, a bidirectional screw, etc. When the adjusting member 26 is a double-headed cylinder, the clamping plate 182 is located at the piston end of the double-headed cylinder, and the distance between the two clamping plates 182 is controlled by the double-headed cylinder.

[0077] The implementation principle of a semiconductor chip processing device in the embodiment of the present application is as follows: the feeding device 2 is used to convey materials and also serves as a material storage device. Multiple groups of materials can be placed on the feeding device 2. When the equipment is in operation, the conveyor belt 23 can feed the materials in sequence. The transfer device 3 receives the materials on the feeding device 2 and aligns the materials with the discharge end of the receiving device 4, so that the receiving device 4 can receive the materials. After receiving the materials, the receiving device 4 transfers the materials to the conveying device 5. After the materials are placed, they continue to return to the feed end to receive the materials.

[0078] The material on the conveyor 5 first needs to be adjusted in position. The adjustment device 6 adjusts the position of the material on the conveyor 5 to ensure the uniformity of the subsequent processing position of the material and improve the accuracy of subsequent operations. After the adjustment of the adjustment device 6 is completed, the detection device 7 detects whether the adjusted position of the material is intact. At this time, there are two results: 1. There is still a deviation in the position of the material. At this time, the conveyor 5 returns the material to the adjustment device 6 for position adjustment, and continues to detect after adjustment; 2. The material position is adjusted intact, and the conveyor 5 directly transfers the material to the next processing node. In order to save adjustment time and improve overall processing efficiency, multiple groups of conveyor 5 are set to speed up the transmission efficiency and shorten the waiting time of subsequent steps.

[0079] The conveying device 5 conveys the material that has passed the inspection to the processing node for applying solder paste. The applying device 9 moves to the storage device 8 to dip the solder paste, and then moves to the conveying device 5, moves down to dip the solder paste on the surface of the material. Then the applying device 9 returns to the storage device 8. Before returning, the applying device 9 needs to dip the excess solder paste on the applying block 96 into the recovery device 20, and then perform the next dipping operation. Improve the subsequent application quality of solder paste, avoid excess solder paste overflow, and improve the chip processing quality.

[0080] After the material is coated with solder paste, solder balls need to be installed. The conveying device 5 conveys the material to the solder ball installation area. The adsorption device 12 moves to the front of the vibration device 11. The storage device 10 pours the solder balls into the vibration device 11. The vibration device 11 vibrates and disperses the solder balls. Then the adsorption device 12 moves to the top of the vibration device 11 to adsorb the solder balls. Through vacuum adsorption, after the solder balls enter the adsorption tank, the adsorption end of the adsorption tank is blocked by the solder balls, and the adsorption source is closed. At this time, the adsorption tank will not adsorb excess solder balls. Due to the small size of the solder balls, under the influence of static electricity, the excess solder balls will adhere to the bottom of the adsorption block 126. At this time, the excess solder balls need to be cleaned up. The adsorption device 12 moves to the cleaning device 14 for cleaning. The cleaning device 14 vacuum adsorbs the excess solder balls through the long groove 1421. Since the excess solder balls are not positioned by the adsorption force of the adsorption tank, the long groove 1421 can easily clean the excess solder balls.

[0081] After the cleaning device 14 completes the cleaning, the adsorption device 12 moves to the detection device 13 for detection and processing to detect whether the several adsorption slots at the bottom of the adsorption block 126 are all adsorbed with solder balls. At this time, three situations may occur: 1. The detection passes, and the adsorption device 12 moves directly to the top of the material of the conveying device 5 to discharge the material; 2. The detection fails. The reason for the failure is that the adsorption is not complete, and some adsorption slots are empty. At this time, the adsorption device 12 moves to the vibration device 11 for re-supplementation of adsorption. After adsorption, it moves to the cleaning device 14 for cleaning, and the detection device 13 detects; 3. The detection fails. The reason for the failure is that there are quality problems with the solder balls, such as damage and deformation on the surface of the solder balls. The adsorption device 12 moves to the material tray 27, places the batch of solder balls in the material tray 27, and then returns to the vibration device 11 to adsorb a new batch of solder balls, and then performs the cleaning and detection operation process again.

[0082] The adsorption device 12 that passes the inspection directly installs the solder ball on the material of the conveying device 5. The conveying device 5 conveys the installed material to the detection device 3 15 for inspection to detect the quality of the material solder ball installation. At this time, there are two conditions: 1. The inspection passes, and the material is directly placed in the discharge device 17 by the material transfer device 16 for storage; 2. The inspection fails, and the material is moved to the collection device 18 by the material transfer device 16 for processing by the staff.

[0083] This application can install solder balls in batches to improve product processing efficiency; each node of this application is equipped with detection results to improve product processing quality, reduce the cost of manual inspection, save processing time, and improve production efficiency.

[0084] The present application also discloses a semiconductor chip processing method, which includes the semiconductor chip processing device described above, and further includes the following steps:

[0085] Prepare materials: Place several chips in the tray in sequence. A groove for installing solder balls is provided on one side of the chip. Several grooves for placing chips are evenly provided in the tray. The chips are placed in the grooves with the surface to be installed with solder balls facing upward. Then, the filled tray is placed in the material box. Several grooves for positioning the tray are provided on both sides of the material box. Multiple trays can be installed in the material box in sequence. When the material box is full, the material box is placed on the feeding device 2, and the feeding device 2 feeds the materials.

[0086] Feeding: After the feeding device 2 transports the material tray to the discharge end, the transfer device 3 receives the material box on the feeding device 2, and the transfer device 3 aligns the open end of the material box with the receiving device 4. The pushing component 28 pushes the material tray toward the receiving device 4, and then the receiving device 4 takes out the material tray and places it on the conveying device 5;

[0087] Material inspection: After the receiving device 4 places the chip on the conveying device 5, the adjusting device 6 first adjusts the position of the chip in the tray to ensure the uniformity of the chip position; after the adjusting device 6 completes the adjustment, the conveying device 5 conveys the tray to the bottom of the detection device 7 for position detection, and the detection device 7 detects the chip position to check whether there is any chip position error; if the detection fails, the conveying device 5 conveys it back to the adjusting device 6 for adjustment again; if the detection passes, the conveying device 5 transfers the tray to the next processing point;

[0088] Apply solder paste: the conveying device 5 conveys the material tray (the chips in the material tray are all adjusted in position) to the working area of ​​the coating device 9, the coating device 9 moves to the material storage device 8, moves down to dip the solder paste, and then moves to the conveying device 5 and applies the solder paste to the material tray on the conveying device 5. The coating device 9 applies the solder paste to the groove of the chip; after the coating device 9 completes the coating, the coating device 9 moves to the recovery device 20, the coating block 96 moves down to dip the excess solder paste onto the contact plane 202, reduces the excess solder paste on the coating block 96, and then moves back to the material storage device 8 for re-dipping;

[0089] Install solder balls: The conveying device 5 conveys the chip coated with solder paste to the installation area of ​​the adsorption device 12, and the storage device 10 places the solder balls in the vibration device 11. The vibration device 11 disperses the solder balls by vibration, and the adsorption device 12 moves to the top of the vibration device 11 to adsorb the solder balls. The solder balls are adsorbed into the adsorption tank by vacuum. After the adsorption device 12 completes the adsorption, the adsorption device 12 moves to the cleaning device 14, and the cleaning device 14 removes the excess solder balls at the adsorption end of the adsorption device 12. After the cleaning is completed;

[0090] Detection of solder ball adsorption quality: the adsorption device 12 moves to the detection device 13 for detection. The detection device 13 mainly detects whether the solder balls adsorbed on the adsorption device 12 are complete. First, if the detection device 13 detects that the adsorption of the solder balls on the adsorption device 12 is incomplete, the adsorption device 12 returns to the vibration device 11 to adsorb the solder balls, and is cleaned again by the cleaning device 14. The detection of the detection device 13 is passed. If the detection passes, it moves to the conveying device 5. If the detection fails, the above adsorption, cleaning and detection operations are repeated. Second, if the detection device 13 detects that there is a problem with the quality of the solder balls on the adsorption device 12, the detection device moves the adsorption device 12 to the excess material tray 27, places the problematic solder balls in the material tray 27, and then the adsorption device 12 re-adsorbs the solder balls, and then is cleaned by the cleaning device 14, and the detection of the detection device 13 is performed. Third, if the detection device 13 detects that the adsorption of the solder balls on the adsorption device 12 is intact, it moves directly to the conveying device 5 and installs the solder balls in the grooves of the chip.

[0091] Discharging: After the solder balls are installed on the chip, the conveying device 5 conveys the chip to the discharging end, where it is inspected by the detecting device 3 15. The material tray through which the chip is detected is moved by the material transfer device 16 2 to the discharging device 17. The detecting device 3 15 detects the material tray with the problematic chip, and the material transfer device 16 2 conveys the material tray to the collecting device 18, which is then recycled and processed by the staff.

[0092] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A semiconductor chip processing equipment, characterized in that: It comprises a feeding device (2) for conveying materials; A transfer device (3), located at the discharge end of the feeding device (2), and used for receiving materials on the feeding device (2); A material receiving device (4), located at the material discharging end of the transfer device (3), and used for receiving the material on the transfer device (3); A conveying device (5) for conveying materials on the material receiving device (4); An adjusting device (6), located at the feeding end of the conveying device (5), for adjusting the position of the material; A detection device (7) is located above the conveying device (5) and is used to detect whether the chip position is properly adjusted. If the detection is passed, the conveying device (5) continues to convey the material; if the detection is not passed, the conveying device (5) returns the material to the adjustment device (6) for further adjustment; A material storage device (8) for storing solder paste; A coating device (9), used for coating solder paste on the chip; A storage device 2 (10) for loading solder balls; A vibration device (11), located at the discharge end of the second storage device (10), for evenly dispersing the solder balls; An adsorption device (12) is used to adsorb the solder balls on the vibration device (11), and the adsorption device (12) is provided with a plurality of adsorption grooves; The second detection device (13) is located in the moving path of the adsorption device (12) and is used to detect whether the solder balls on the adsorption device (12) are completely adsorbed; if the detection is passed, the adsorption device (12) moves to the top of the material to discharge the material; if the detection is not passed, the adsorption device (12) needs to return to re-adsorb; A cleaning device (14), located between the second detection device (13) and the vibration device (11), is used to clean excess solder balls on the adsorption device (12); A detection device 3 (15), located at the discharge end of the conveying device (5), is used to detect whether the solder balls on the chip are properly installed; A material moving device (16), located at the discharge end of the conveying device (5), for moving materials for discharge; A discharging device (17) for collecting chips that have passed the detection of the third detection device (15); The collecting device (18) is used to collect chips detected to have problems by the detecting device three (15).

2. A semiconductor chip processing equipment according to claim 1, characterized in that: The feeding device (2) comprises a mounting frame (21), a material table (22) arranged on the mounting frame (21), a conveyor belt (23) arranged on the material table (22), and baffle plates (24) arranged on the mounting frame (21) and located on both sides of the material table (22) in the length direction, wherein the conveyor belt (23) is located between the two baffle plates (24).

3. The semiconductor chip processing equipment according to claim 1, characterized in that: The transfer device (3) comprises a transfer cylinder (31) located at the discharge end of the feeding device (2), a transfer seat (32) arranged at the piston end of the transfer cylinder (31), a linear motor (33) arranged on the transfer seat (32), and a material receiving seat (34) arranged on the linear motor (33); the piston end of the transfer cylinder (31) reciprocates along the conveying direction of the feeding device (2), and the linear motor (33) is used to drive the material receiving seat (34) to move up and down.

4. The semiconductor chip processing equipment according to claim 1, characterized in that: The material receiving device (4) comprises a material receiving bracket (41), a second linear motor (42) arranged on the material receiving bracket (41), a second material receiving seat (43) arranged on the second linear motor (42), a positioning plate (44) arranged on the bottom surface of the second material receiving seat (43) and located on both sides of the second material receiving seat (43) in the length direction, an adjustment component (45) and a clamping component (46) arranged on the second material receiving seat (43), wherein a positioning groove (441) is provided on the side of the positioning plate (44) facing the material along the length direction, the moving path of the second linear motor (42) is from the transfer device (3) to the conveying device (5), the adjustment component (45) is used to adjust the distance between the two positioning plates (44), and the clamping component (46) is used to clamp and guide the material into the positioning groove (441).

5. The semiconductor chip processing equipment according to claim 1, characterized in that: The adjusting device (6) comprises a linear motor (61), an adjusting seat (62) arranged on the linear motor (61), an adjusting cylinder (63) arranged on the adjusting seat (62), and an adjusting member (64) arranged at the piston end of the adjusting cylinder (63), wherein the adjusting cylinder (63) is used to drive the adjusting member (64) to move up and down, the linear motor (61) is used to drive the adjusting seat (62) to move along the width direction of the conveying device (5), and the adjusting seat (62) is provided with a plurality of adjusting members. A mounting platform (19) for mounting an adjusting cylinder (63) is provided, the adjusting member (64) comprising an adjusting cylinder (641) arranged on an adjusting seat (62), an adjusting plate (642) arranged at the piston end of the adjusting cylinder (63), and a plurality of adjusting rods (643) arranged on the bottom surface of the adjusting plate (642), the piston end of the adjusting cylinder (641) being connected to the mounting platform (19), and the moving direction of the piston of the adjusting cylinder (641) being consistent with the conveying direction of the conveying device (5).

6. The semiconductor chip processing equipment according to claim 1, characterized in that: The detection device (7) comprises a support seat (71), a linear motor (72) disposed on the support seat (71) and located above the conveying device (5), a detection seat (73) disposed on the linear motor (72), a detection cylinder (74) disposed on the detection seat (73), and a detection camera (75) disposed at the piston end of the detection cylinder (74), wherein the detection cylinder (74) is used to drive the detection camera to move up and down, and the linear motor (72) is driven to reciprocate along the width direction of the conveying device (5).

7. The semiconductor chip processing equipment according to claim 1, characterized in that: The material storage device (8) comprises a material storage seat (81) and a material storage box (82) arranged on the material storage seat (81), and the top surface of the material storage box (82) is open; the smearing device (9) comprises a mounting seat (91), a linear motor (92) arranged on the mounting seat (91), a fixed seat (93) arranged on the linear motor (92), a linear motor (94) arranged on the fixed seat (93), a smearing seat (95) arranged on the linear motor (94), and a smearing block (96) arranged on the smearing seat (95), the linear motor (92) is used to drive the smearing block (96) to move from the material storage device (8) to the conveying device (5), and the linear motor (94) is used to drive the smearing block (96) to move up and down.

8. The semiconductor chip processing equipment according to claim 1, characterized in that: A recovery device (20) is also provided between the material storage device (8) and the conveying device (5), the recovery device (20) comprising a recovery seat (201), a contact plane (202) arranged on the recovery seat (201), a baffle plate (203) arranged on the recovery seat (201) and located on both sides of the contact plane (202) in the length direction, and a scraping assembly (204) arranged on the recovery seat (201), a recovery box (25) is provided at one end of the recovery seat (201) away from the scraping assembly (204), and an end of the contact plane (202) close to the recovery box (25) is in a downwardly inclined slope.

9. The semiconductor chip processing equipment according to claim 1, characterized in that: The material storage device 2 (10) comprises a material storage seat 2 (101), a material storage box 2 (102) arranged on the material storage seat 2 (101), and a pushing cylinder (103) arranged on the material storage seat 2 (101), wherein the pushing cylinder (103) is used to push the material storage box to unload materials.

10. The semiconductor chip processing equipment according to claim 1, characterized in that: The vibration device (11) comprises a vibration seat (111), a vibration plate (112) arranged on the vibration seat (111), and a vibration member (113) arranged on the vibration seat (111) and located below the vibration plate (112); the vibration member (113) is used to drive the vibration plate (112) to vibrate.

11. The semiconductor chip processing equipment according to claim 1, characterized in that: The adsorption device (12) comprises a linear motor (7) (121), an adsorption seat (122) arranged on the linear motor (7) (121), a linear motor (8) (123) arranged on the adsorption seat (122), a mounting block (124) arranged on the linear motor (8) (123), a rotating motor (125) arranged on the mounting block (124), and an adsorption block (126) arranged at the output end of the rotating motor (125); the linear motor (7) (121) is used to drive the adsorption block (126) to reciprocate between the material storage device (2) (10) and the conveying device (5); the vibration device (11) is located on the moving path of the linear motor (7) (121); the linear motor (8) (123) is used to drive the adsorption block (126) to move up and down; and the adsorption groove is located on the adsorption block (126).

12. The semiconductor chip processing equipment according to claim 1, characterized in that: The cleaning device (14) comprises a cleaning frame (141) and a cleaning tube (142) arranged on the cleaning frame (141); one end of the cleaning tube (142) is sealed, and the other end of the cleaning tube (142) is connected to a vacuum pumping device; a long groove (1421) is provided along the length direction on one side of the cleaning tube (142) facing the adsorption block (126).

13. The semiconductor chip processing equipment according to claim 1, characterized in that: The detection device 2 (13) comprises a detection seat 2 (131) and a detection camera 2 (132) arranged on the detection seat 2 (131); the detection device 3 (15) comprises a detection seat 3 (151), a linear motor 9 (152) arranged on the detection seat 3 (151) and extending along the width direction of the conveying device (5), a fixing frame (153) arranged on the linear motor 9 (152), a linear motor 10 (154) arranged on the fixing frame (153) and a detection camera 3 (155) arranged on the linear motor 10 (154), wherein the linear motor 9 (152) is used to drive the detection camera 3 (155) to move along the width direction of the conveying device (5), and the linear motor 10 (154) drives the detection camera 3 (155) to move up and down.

14. A semiconductor chip processing method, characterized in that: The method comprises any one of the above processing equipment, and further comprises the following steps: Material preparation: placing a plurality of chips in a material tray in sequence, and arranging the surface on which solder balls are to be installed facing upwards, and then placing the filled material tray in a material box, with a plurality of grooves for positioning the material tray being provided on both sides of the material box. When the material box is full, the material box is placed on a feeding device (2), and the feeding device (2) feeds the material; Feeding: After the feeding device (2) transports the material tray to the discharge end, the transfer device (3) receives the material box on the feeding device (2), and the transfer device (3) aligns the open end of the material box with the receiving device (4). The receiving device (4) takes out the material tray in the material box and then places it on the conveying device (5). Material inspection: After the receiving device (4) places the chip on the conveying device (5), the adjusting device (6) first adjusts the position of the chip in the tray to ensure the uniformity of the chip position. After the adjusting device (6) completes the adjustment, the conveying device (5) conveys the tray to the bottom of the detection device (7) for position detection. The detection device (7) detects the chip position to check whether there is an error in the chip position. If the chip position is incorrect, the adjusting device (6) adjusts it again; if the chip position is correct, the conveying device (5) transfers the tray to the next processing point; Applying solder paste: the conveying device (5) conveys the material tray (the chips in the material tray are all adjusted in position) to the working area of ​​the applying device (9), the applying device (9) moves to the material storage device (8), moves down to dip in the solder paste, and then moves to the conveying device (5) and applies the solder paste to the material tray on the conveying device (5). The applying device (9) applies the solder paste to the grooves of the chip; after the applying device (9) has finished applying, it is necessary to scrape off the excess solder paste and then dip it again; Installing solder balls: the conveying device (5) conveys the chip coated with solder paste to the installation area of ​​the adsorption device (12), the storage device (10) places the solder balls in the vibration device (11), the vibration device (11) disperses the solder balls by vibration, the adsorption device (12) moves to the top of the vibration device (11), adsorbs the solder balls, and the solder balls are adsorbed into the adsorption tank by vacuum; after the adsorption device (12) completes adsorption, the adsorption device (12) moves to the cleaning device (14), and the cleaning device (14) removes the excess solder balls at the adsorption end of the adsorption device (12). After the cleaning is completed; the adsorption device (12) moves to the detection device (13) for detection, and the detection device (13) mainly detects whether the solder balls adsorbed on the adsorption device (12) are complete; if the detection device (13) detects that the solder balls on the adsorption device (12) are not completely adsorbed, the adsorption device (12) is removed. The device (12) returns to the vibration device (11) to adsorb the solder balls, and then passes through the cleaning device (14) for cleaning, and passes through the detection device (13). If the detection passes, it moves to the conveying device (5). If the detection fails, the above adsorption, cleaning and detection operations are repeated. If the detection device (13) detects that the solder balls on the adsorption device (12) have quality problems, a material tray (27) for loading the problematic solder balls is installed, and the adsorption device (12) moves to the material tray (27) to place the problematic solder balls in the material tray (27). Then, the adsorption device (12) adsorbs the solder balls again, passes through the cleaning device (14) for cleaning, and passes through the detection device (13). If the detection device (13) detects that the solder balls on the adsorption device (12) are adsorbed intactly, it moves directly to the conveying device (5) to install the solder balls in the grooves of the chip. Discharging: After the solder balls are installed on the chip, the conveying device (5) conveys the chip to the discharging end, where it is inspected by the detection device three (15). The material tray through which the chip is detected is moved by the material transfer device (16) two to the discharging device (17); the detection device three (15) detects the material tray with the problematic chip, and the material transfer device (16) two transfers the material tray to the collection device (18), which is then recycled and processed by the staff.

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