Apparatus for transporting substrate, and power supply method in apparatus for transporting substrate

Abstract

The invention provides an apparatus for transporting a substrate and a power supply method in the apparatus for transporting the substrate. The apparatus for transporting the substrate includes: a tiled block portion which forms a moving surface of a region for transporting the substrate and is provided with a plurality of first coils for forming a magnetic field on the moving surface by power supplied from a power supply portion; and a substrate transfer module which is provided with a plurality of magnets, and which is configured so as to be capable of moving on a moving surface by magnetic suspension using the repulsive force, and which is provided with a substrate holding unit for holding a substrate to be transferred, the substrate transfer module being configured so as to be capable of moving on the moving surface by means of magnetic suspension using the repulsive force, the substrate holding unit being configured so as to be capable of moving on the moving surface by means of magnetic suspension using the repulsive force. The substrate conveying module is configured to include a second coil for supplying power, the second coil being configured to wirelessly supply power to a power consuming device provided in the substrate conveying module while the substrate conveying module is moving on the moving surface, using an electromotive force acting between the magnetic field formed by the first coil and the second coil.

Description

Technical Field

[0001] The present disclosure relates to an apparatus for conveying a substrate and a power supply method in the apparatus for conveying a substrate. Background Art

[0002] For example, in an apparatus (substrate processing apparatus) that processes a semiconductor wafer (hereinafter, also referred to as a "wafer") as a substrate, the wafer is transported between a carrier that accommodates the wafer and a substrate processing chamber in which the wafer is processed. When transporting the wafer, substrate transport mechanisms of various structures are used.

[0003] The applicant is developing a substrate processing apparatus that uses a substrate transfer module utilizing magnetic levitation to transfer a substrate.

[0004] As a device using magnetic levitation, for example, the following structure is described in Patent Document 1: a first magnet is provided on the floor portion of the substrate transfer chamber, and a second magnet is provided on the substrate transfer module, and magnetic levitation is performed using the repulsive force between the first magnet and the second magnet. It is described that the second magnet is an electromagnet powered by a battery provided in the substrate transfer module, and a control signal related to power supply control can be obtained through wireless communication. However, the specific structure related to power supply control is not described.

[0005] Patent Document 2 describes a technique related to the arrangement of a magnet array in a displacement device including a stator including a coil and a movable stage including a magnet array, wherein the stator and the movable stage are relatively moved.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2022-36757

[0009] Patent Document 2: Japanese Patent Application No. 2014-531189 Summary of the invention

[0010] Problem that the invention aims to solve

[0011] The present disclosure provides a technology for wirelessly powering a power-consuming device provided in a substrate transfer module that transfers a substrate using magnetic levitation in an apparatus for transferring a substrate.

[0012] Solutions for solving problems

[0013] The present invention discloses a device for conveying a substrate, comprising:

[0014] a tiling block portion constituting a moving surface of a region for conveying the substrate, and provided with a plurality of first coils for forming a magnetic field on the moving surface by power supply from a power supply portion; and

[0015] A substrate transport module, comprising a plurality of magnets, wherein repulsive force acts between the plurality of magnets and the magnetic field, the substrate transport module being configured to be movable on the moving surface by magnetic levitation utilizing the repulsive force, and comprising a substrate holding portion for holding a substrate to be transported,

[0016] Among them, the substrate conveying module has a second coil for power supply, and the second coil is used to utilize the electromotive force acting between the magnetic field formed by the first coil and the second coil to wirelessly power the power-consuming equipment arranged in the substrate conveying module while the substrate conveying module moves on the moving surface.

[0017] Effects of the Invention

[0018] According to the present disclosure, in an apparatus for conveying a substrate, it is possible to wirelessly power a power-consuming device provided in a substrate conveying module that conveys a substrate using magnetic levitation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a top view showing a configuration example of a substrate processing system.

[0020] Figure 2 1 and 2 are a plan view, a side view, and a bottom view showing a configuration example of a substrate transfer module.

[0021] Figure 3 It is a perspective view showing a configuration example of a first coil provided in a tile block portion and a main body portion of a substrate transport module.

[0022] Figure 4 It is a longitudinal sectional side view showing a configuration example of a first coil and a magnet of a substrate transport module.

[0023] Figure 5 It is a perspective view showing a schematic configuration example of a tiling block unit and a substrate transport module.

[0024] Figure 6 This is a block diagram showing the electrical configuration of a system for wirelessly powering a sensor provided in a substrate transport module.

[0025] Fig. 7A This is a first side view showing the function of the first coil and the substrate transport module.

[0026] Figure 7B This is a second side view showing the function of the first coil and the substrate transport module.

[0027] Fig. 8A It is a first plan view showing an operation example of the substrate transfer module.

[0028] Figure 8B It is a second plan view showing an operation example of the substrate transfer module.

[0029] Fig. 9 It is a top view showing an operation example of the substrate transport module.

[0030] Fig. 10A This is a first explanatory diagram for explaining the functions of the first coil and the second coil for powering the substrate transport module.

[0031] Fig. 10B This is a second explanatory diagram for explaining the functions of the first coil and the second coil of the substrate transport module.

[0032] Fig.11 1 is a first characteristic diagram showing the relationship between the moving speed and the angular velocity of the substrate transport module.

[0033] Fig.12 It is a top view showing the rotation operation of the substrate transfer module.

[0034] Fig.13 This is a second characteristic diagram showing an example of controlling the current with respect to the rotation angle of the substrate transport module.

[0035] Fig.14 This is a first flowchart showing an example of power supply control of the substrate transport module.

[0036] Fig.15 This is a second flowchart showing an example of power supply control of the substrate transport module.

[0037] Fig.16 It is a bottom view showing another example of the substrate transfer module.

[0038] Fig.17 It is a top view showing another example of the substrate transfer module.

[0039] Fig.18 It is a plan view showing another example of the first coil.

[0040] Fig.19 It is a top view showing another example of the first coil. DETAILED DESCRIPTION

[0041] <Substrate processing system>

[0042] Below, refer to Figure 1 , a configuration example of a substrate processing system 1 forming an apparatus for transferring a substrate according to an embodiment of the present disclosure will be described.

[0043] exist Figure 1 , a multi-chamber type substrate processing system 1 having a plurality of substrate processing chambers 11 for processing wafers W is illustrated. As shown in the figure, in the substrate processing system 1, an atmospheric transfer chamber 12, a load lock chamber 13, and a substrate transfer chamber 14 are arranged along the front-to-back direction. In addition, a plurality of substrate processing chambers 11 are respectively provided in the left and right directions of the substrate transfer chamber 14. In the following, in the substrate processing system 1, the front-to-back direction is set as the "X direction", the left-to-right direction horizontally intersecting the front-to-back direction is set as the "Y direction", and the atmospheric transfer chamber 12 side is set as the near front side and the substrate transfer chamber 14 side is set as the back side in the front-to-back direction.

[0044] A load port 121 is provided near the front side of the atmospheric transfer chamber 12, and the load port 121 is loaded with a carrier C for accommodating a wafer W to be processed. As the carrier C, for example, a FOUP (Front Opening Unified Pod) or the like can be used. The atmospheric transfer chamber 12 is an atmospheric pressure (normal pressure) atmosphere, and a transfer mechanism 122 is provided inside the atmospheric transfer chamber 12, and the atmospheric transfer chamber 12 is configured to transfer the wafer W between the carrier C and the load lock chamber 13.

[0045] The load lock chamber 13 is configured to be switchable between an atmospheric pressure atmosphere and a vacuum atmosphere, and includes a transfer stage 130 on which the wafer W is placed and lift pins 131 .

[0046] like Figure 1 As shown, the substrate transfer chamber 14 is composed of a housing that is long in the front-to-back direction and has a rectangular shape when viewed from above, and is provided with a tile block portion 16, which constitutes a moving surface 15 of the area for transferring the wafer W. The tile block portion 16 is provided on the entire floor of the substrate transfer chamber 14, and the moving surface 15 constitutes the floor of the substrate transfer chamber 14. In this example, the substrate processing chamber 11 is configured to process the wafer W in a vacuum atmosphere, and the inside of the substrate transfer chamber 14 is decompressed to a vacuum atmosphere by a vacuum exhaust mechanism (not shown).

[0047] For example, four substrate processing chambers 11 are connected to the left and right sides of the substrate transfer chamber 14, and openings 110 are formed between the substrate transfer chamber 14 and the substrate processing chamber 11, respectively. The openings 110 are used to transfer wafers W to the substrate processing chamber 11. Figure 1 In the figure, reference numerals G1 , G2 , and G3 denote gate valves for opening and closing a transfer port for the wafer W, such as the opening 110 .

[0048] Furthermore, a substrate transfer module (hereinafter referred to as “transfer module”) 2 is provided inside the substrate transfer chamber 14 . The substrate transfer module 2 transfers the wafer W between the load lock chamber 13 and each substrate processing chamber 11 .

[0049] For example, the length of the short side direction of the substrate transfer chamber 14 is a size that allows two transfer modules 2 holding wafers W to pass closely in a state of being arranged side by side. In the substrate transfer chamber 14, multiple transfer modules 2 are used to transfer wafers W. In this example, multiple first coils 3 are set on the tile block portion 16 forming the moving surface 15, and the transfer module 2 is configured to move using magnetic levitation using the repulsive force between the first coil 3. The detailed structure of the first coil 3 and the transfer module 2 will be described later.

[0050] Each substrate processing chamber 11 is decompressed to a vacuum atmosphere by a vacuum exhaust mechanism (not shown). A mounting table 111 and lift pins 112 are provided inside each substrate processing chamber 11, and a wafer W is subjected to a predetermined process while being mounted on the mounting table 111. The lift pins 112 and 131 are configured to lift the wafer W from below and hold the wafer W to transfer the wafer W. Examples of the process performed on the wafer W include etching, film forming, cleaning, and ashing.

[0051] <Control Unit>

[0052] The substrate processing system 1 includes a control unit 5. The control unit 5 is composed of a computer including a CPU and a storage unit, and is used to control the various parts of the substrate processing system 1. A program in which a group of steps (commands) for controlling the actions of the substrate processing chamber 11 is recorded in the storage unit. The program is stored in a storage medium such as a hard disk, an optical disk, a magneto-optical disk, a memory card, a non-volatile memory, and is installed from the storage medium to the computer. In addition, a program for moving and powering the conveying module 2 is also stored in the storage unit. The control unit 5 constitutes the power supply control unit 501 described later, and is configured to also control functions related to the movement and wireless power supply of the conveying module 2.

[0053] An example of conveying wafers W in such a substrate processing system 1 is briefly described. The wafers W in the carrier C placed on the load port 121 are conveyed to the load lock chamber 13 of the atmospheric pressure atmosphere by the conveying mechanism 122. Then, after the atmospheric pressure atmosphere in the load lock chamber 13 is switched to the vacuum atmosphere, the wafers W in the load lock chamber 13 are conveyed to the substrate processing chamber 11 where the wafers W are processed by the conveying module 2.

[0054] In the substrate processing chamber 11 , the wafer W placed on the mounting table 111 is heated to a preset temperature as required, and a processing gas is supplied into the substrate processing chamber 11 if a processing gas supply unit is provided. In this way, the wafer W is subjected to a desired process.

[0055] After the wafer W is processed, the wafer W is transported from the substrate processing chamber 11 to the load lock chamber 13 in the reverse process of the loading process. After the atmosphere of the load lock chamber 13 is switched to the atmospheric pressure atmosphere, the wafer W is returned to the predetermined carrier C by the transport mechanism 122 .

[0056] <Substrate transfer module>

[0057] In the substrate processing system 1 having the above-described schematic structure, the transfer module 2 is configured to be movable in the substrate transfer chamber 14 by magnetic levitation. In addition, the transfer module 2 not only performs the transfer of the wafer W, but also has a function of wirelessly powering the power consuming equipment provided in the transfer module 2. Next, the structure of the equipment related to the transfer of the wafer W using the transfer module 2 and the wireless power supply will be described.

[0058] Figure 2 (a) shows a top view of the transport module 2 , (b) shows a side view of the transport module 2 , and (c) shows a bottom view of the transport module 2 .

[0059] As shown in these figures, the transport module 2 includes a main body 21 and a fork 22, which is provided to extend in a direction (horizontal direction) along the moving surface 15 with the main body 21 as a base end. In addition, a substrate holding portion 23 is formed at the front end of the fork 22, and the substrate holding portion 23 holds the wafer W to be transported horizontally. The substrate holding portion 23 is configured to surround the three lift pins 131 and 112 provided in the load lock chamber 13 and the substrate processing chamber 11 from the side.

[0060] Fork 22 is configured to have a length such that, when main body 21 is located in substrate transfer chamber 14, fork 22 can be inserted into substrate processing chamber 11 through opening 110 opened by gate valve G3 to transfer wafer W to mounting table 111. Figure 2 , Figure 3 As shown in FIG. 1 , the conveying module 2 is described using a coordinate system (X′, Y′, Z′) set in the module 2. In the coordinate system, the protruding direction of the fork 22 is set as the front-to-back direction (X′ direction), and the front end side of the fork 22 is set as the front in the front-to-back direction. In addition, the direction horizontally intersecting the front-to-back direction is set as the left-right direction (Y′ direction).

[0061] The main body 21 is provided with a magnet 4 (see Figure 3 ), a repulsive force acts between the magnet 4 and the magnetic field formed in the tile block portion 16 described later. In addition, a power-consuming device such as a sensor 51 is provided in the conveying module 2. As the sensor 51, a position sensor, an acceleration sensor, a tilt sensor, a temperature sensor, etc. can be exemplified. In this example, Figure 2As shown in (b) and (c) of FIG. 1 , for example, a position sensor 511 is provided on the lower surface of the front end side of the substrate holding portion 23 , and a tilt sensor 512 is provided inside the main body portion 21 .

[0062] Furthermore, for example, a second coil 6 is provided at a position near the substrate holding portion 23 on the lower surface side of the fork 22, and the second coil 6 is used to wirelessly power the sensor 51. In this way, the second coil 6 and the magnet 4 are arranged at positions that do not overlap each other when viewed from the moving surface 15. Figure 2 As shown in (b), a battery 52 is provided on the upper surface of the main body 21 of the conveying module 2. The battery 52 stores the power supplied via the second coil 6 and supplies the power to the sensor 51. The second coil 6 is electrically connected to the battery 52, and the battery 52 is electrically connected to the sensor 51. The battery 52 in this example stores power for the sensor 51, so a small capacity is sufficient, and a small and lightweight battery can be used. For example, if an example of the battery 52 is given, the capacity is 1000mAh and the weight is about 20g to 25g when the power consumption of the sensor 51 is assumed to be about 3W.

[0063] <Tile Block Section>

[0064] Next, refer to Figure 3 , Figure 4 and Figure 5 The tile block portion 16 constituting the moving surface 15 of the substrate transfer chamber 14 will be described. Figure 5 As schematically shown, the floor (moving surface 15) of the substrate transfer chamber 14 is composed of a tile portion 16. Figure 5 Although the tiling block section 16 is depicted on a portion of the moving surface 15 , the tiling block section 16 is actually provided on the entire floor of the substrate transfer chamber 14 .

[0065] The tile block 16 is described later. Fig. 8A , Figure 8B As also shown in FIG. 1 , a plurality of rectangular tiled block units T are arranged vertically and horizontally in a plan view, and a plurality of first coils 3 are respectively provided inside each tiled block unit T. These first coils 3 form a magnetic field on the moving surface 15 by power supply from a power supply unit 34 forming a DC power supply unit.

[0066] Reference Figure 3 and Figure 4 The first coil 3 will be described. Figure 4 It is along Figure 3 As shown in these figures, a plurality of first coils 3 are provided in the tile block portion 16, and the plurality of first coils 3 are arranged so as to extend in different directions along the moving surface 15 when viewed from a vertical axis intersecting the moving surface 15.

[0067] If used Figure 1 As described above, in the substrate processing system 1, the X direction and the Y direction are set in a common horizontal plane. The first coil 3 in this example is provided linearly in a manner extending along the X direction set in the horizontal plane and the Y direction set in the horizontal plane and orthogonal to the X direction. Hereinafter, the first coil 3 extending along the Y direction is sometimes referred to as the A coil 31, and the first coil 3 extending along the X direction is sometimes referred to as the B coil 32. Figure 3 In the figure, for the convenience of illustration, the A coil 31 is represented by a dotted line, and the B coil 32 is represented by a solid line. In addition, the setting of the XY direction is not limited to this example, and can also be set as follows as needed: the first coil 3 is configured to be centered on the vertical axis from Figure 1 The example shown is rotated 45°, 90°, and 135° clockwise and extends along these directions respectively (described later). Fig.18 ).

[0068] The area where the first coil 3 is set is the entire moving area of ​​the transport module 2 from the delivery position of the wafer W with the atmospheric transport chamber 12 (the position facing the load lock chamber 13) to the front of the substrate processing chamber 11, and the surface of this moving area corresponds to the moving surface 15. In addition, when the moving area is set so that the transport module 2 enters the load lock chamber 13 and the substrate processing chamber 11 to move, the first coil 3 is also set on the floor of these load lock chambers 13 and substrate processing chambers 11. Figure 3 A portion of this movement area is shown in FIG.

[0069] A large number of A coils 31 are provided, and the large number of A coils 31 are arranged to be spaced apart from each other in the X direction and extend in the Y direction. In addition, a large number of B coils 32 are provided, and the large number of B coils 32 are arranged to be spaced apart from each other in the Y direction and extend in the X direction. These A coils 31 and B coils 32 are respectively composed of coil windings a and b.

[0070] like Figure 4 As schematically shown, the coil windings a and b constituting the A coil 31 and the B coil 32 are stacked alternately, for example, and the stacked coil windings a and b are insulated from each other by the insulating layer 33. Such a stacked structure of the coil windings a, the coil windings b and the insulating layer 33 is formed by, for example, a printed circuit board. Figure 4 The number of stacked layers of the coil windings a and b shown is merely an example and can be appropriately changed as needed.

[0071] The coil windings stacked up and down are as follows Figure 4As shown in the figure, one end side or the other end side in the Y direction is electrically connected to one end side or the other end side of the coil winding a arranged on the upper layer side or the lower layer side. In this way, when observing the YZ longitudinal section, the stacked coil windings a are connected in a spiral shape, for example, and their two ends are respectively connected to the power supply part 34, thereby forming the A coil 31.

[0072] Similarly, one end or the other end of the coil winding b stacked up and down in the X direction is electrically connected to one end or the other end of the coil winding b arranged on the upper layer side or the lower layer side. In this way, when observing the XZ longitudinal section, the stacked coil winding b is connected in a spiral shape, for example, and its two ends are respectively connected to the power supply unit 34, thereby forming the B coil 32. In addition, Figure 3 and Figure 5 , the uppermost coil windings a and b of the A coil 31 and the B coil 32 are shown.

[0073] Furthermore, the power supply unit 34 is configured to supply power to the selected A coil 31 and B coil 32 based on the instruction of the control unit 5 (power supply control unit 501), thereby forming a magnetic field on the upper surface of the tiled block unit 16 in the area where the A coil 31 and B coil 32 to which power is supplied are arranged. Figure 4 Only one power supply unit 34 corresponding to one A coil 31 is described in the figure, but a plurality of power supply units 34 are provided in the substrate processing system 1. Figure 6 As shown, a switching element 712 is provided between the power supply unit 34 and the A coil 31 and the B coil 32. Thus, for example, the first coil 3 provided in the tiled block unit 16 can be powered in units of one coil winding a and b.

[0074] In the plurality of tile block units T, the A coils 31 and B coils 32 are arranged in the same manner. Furthermore, by arranging the tile block units T on the floor of the substrate transfer chamber 14, the A coils 31 and B coils 32 provided in the adjacent tile block units T are connected, respectively, so that the A coils 31 and B coils 32 are arranged on the entire moving surface 15 as the floor.

[0075] Moreover, for example Figure 5 As shown, each tile block unit T constituting the tile block unit 16 is assigned an address of tile block unit T1...Tn...Tnn. Moreover, the A coil 31 provided in each tile block unit T is also assigned an address of a1, a2...an, respectively, and similarly, the B coil 32 is also assigned an address of b1, b2...bn, respectively. In this way, a common address is assigned to the first coil 3 of each tile block unit T. In the control unit 5, it is configured to select the address of the tile block unit T and the address of the first coil 3, and to supply power to the A coil 31 and the B coil 32 of the selected address via the power supply unit 34 and the switching element 712.

[0076] Next, the main body 21 of the transport module 2 will be described. Figure 3 As shown, the main body 21 is, for example, configured to be square in plan view, and a plurality of magnets 4 (41, 42, 43, 44) are provided inside the main body 21, in this example, four magnets 4. The magnets 4 are configured to act in a repulsive force with the magnetic field formed by the first coil 3. These magnets 4 are, for example, formed to be identical to each other in a rectangular shape in plan view, and these magnets 4 are embedded in the square main body 21 and arranged along the four sides of the outer edge of the main body 21.

[0077] Each of these magnets 4 is composed of a plurality of, for example, nine, permanent magnets 45 arranged in, for example, a Halbach arrangement. Figure 4 In FIG. 4 , nine permanent magnets 45 and their magnetization directions (magnetization directions) are schematically shown for the magnet 44 as a representative. Figure 3 When the conveying module 2 is arranged so that the fork 22 faces the front side in the X' direction as shown, the nine permanent magnets 45 of the magnets 43 and 44 are arranged along the Y' direction, and the magnetization directions of these permanent magnets 45 are in a state of facing the direction orthogonal to the X' direction. Similarly, the nine permanent magnets 45 of the magnets 41 and 42 are arranged along the X' direction, and the magnetization directions of these permanent magnets 45 are in a state of facing the direction orthogonal to the Y' direction.

[0078] In the transport module 2 thus constructed, the A coil 31 and the B coil 32 located below the area where the magnets 4 (41, 42, 43, 44) are arranged are selected, and electric power flowing in a predetermined direction is supplied. As a result, a repulsive force is generated between the magnetic field formed by the first coil 3 and the magnetic field of the magnet 4, and the main body 21 is moved by the repulsive force. For example, Figure 3 In the embodiment, when power is supplied to the A coil 31 , the main body 21 moves in the X direction, and when power is supplied to the B coil 32 , the main body 21 moves in the Y direction.

[0079] In this way, the position of the magnetic field generated in the A coil 31 and the B coil 32, the magnitude of the magnetic force, and the direction of the magnetic field are adjusted. Then, by controlling the magnetic field, the suspension amount (suspension distance) of the main body 21 from the moving surface 15, the orientation of the main body 21, and the moving direction are adjusted. As a result, the main body 21 can be made to take a desired posture on the moving surface 15 and move in a desired direction.

[0080] Furthermore, a plurality of Hall elements (position detection sensors) not shown are provided in the tile portion 16. The Hall element is an example of a magnetic sensor and is a sensor for detecting the position and orientation of the main body 21. The moving speed of the main body 21 can also be detected by the Hall element.

[0081] As described above, the transfer module 2 is configured to be movable in the X direction, the Y direction, the Z direction, and the θ direction in the substrate transfer chamber 14, and can move with a high degree of freedom in the substrate transfer chamber 14. Therefore, a mechanism is required that can supply power to the sensor 51 mounted on the transfer module 2 in a manner that does not affect the transfer operation of the transfer module 2.

[0082] Here, as a power supply method, a configuration of carrying a large-capacity battery that has been charged in advance or a configuration of power supply via a wire can be considered. However, in these methods, the weight of the battery and the length of the cable may become a problem, and the operating performance of the transport module 2 may be reduced.

[0083] In addition, as a method of wireless power supply, it is also possible to consider a structure in which the transport module is stopped at a pre-set power supply point to supply power, a structure in which a power transmission unit is set on the floor of the substrate transport chamber along the transport path of the wafer W, and a structure in which power is transmitted by radiating microwave band radio waves from the power transmission unit. However, if the transport module is stopped, productivity may decrease, and if a power transmission unit is set along the transport path, the transport path will be restricted. In addition, in the structure in which a new power transmission unit is set on the ground, it is necessary to significantly increase the existing equipment. In addition, regarding the use of microwave band radio waves, reflections are generated when radio waves are emitted in the substrate processing chamber, and there are points where power cannot be supplied due to the influence of standing waves, and there is a concern that stable power supply cannot be performed.

[0084] In view of such circumstances, the present disclosure focuses on utilizing the first coil 3 provided in the substrate transfer chamber 14 for wireless power supply on the transfer module 2 side.

[0085] (Second coil of the transport module)

[0086] As described above, the transport module 2 includes the second coil 6 for wireless power supply. The second coil 6 is formed by winding a coil wire 62 around a base 61 made of a magnetic material such as ferrite. Figure 2 In the example shown, the base 61 is formed in a rectangular parallelepiped shape, and is arranged so that its long side direction intersects with the front-to-back direction (X′ direction) of the fork 22. Moreover, the coil winding 62 is wound on the base 61 along the long side. The second coil 6 formed in this way has an opening surface 63 that opens toward the X′ direction. An example of the size of the base 61 is that the short side (length in the X′ direction) is 10 mm to 200 mm, the long side (length in the Y′ direction) is 100 mm to 300 mm, the height (length in the Z′ direction) is a few mm, and the weight is 50 g to 100 g. In addition, it is configured so that when the conveying module 2 is not suspended relative to the tiling block portion 16, for example, a gap is formed between the upper surface of the tiling block portion 16 and the lower surface of the second coil 6.

[0087] Figure 61 is a block diagram showing the electrical configuration of a system for wirelessly powering the conveying module 2. The diagram shows the configurations of a power supply mechanism 71 on the tile unit 16 side and a power receiving mechanism 72 on the conveying module 2 side.

[0088] The power supply mechanism 71 on the tile portion 16 side includes a power supply unit 34 including a DC power supply unit, a DC / AC conversion circuit 711 , a power supply control unit 501 , a switching element 712 , and a first coil 3 (A coil 31 and B coil 32 ).

[0089] The power supply control unit 501 is configured to switch the power supply state of each first coil 3 (31, 32) provided in the tile block unit 16 from the power supply unit 34 according to the position of the magnet 4 of the conveying module 2 moving on the moving surface 15 and the position of the second coil 6. As the power supply state to the first coil 3, a driving mode for moving the conveying module 2, a wireless power supply mode for supplying power to the second coil 6, and a standby mode for not supplying power are set.

[0090] Furthermore, in the driving mode, the DC power supplied from the power supply unit 34 is supplied to the selected A coil 31 and B coil 32 via the switching element 712 .

[0091] In the wireless power supply mode, the DC power supplied from the power supply unit 34 is converted into AC power by the DC / AC conversion circuit 711 and supplied to the selected A coil 31 or B coil 32 via the power supply control unit 501 and the switching element 712 .

[0092] Furthermore, in the standby mode, electric power is not supplied from the power supply unit 34 to the A coil 31 and the B coil 32 .

[0093] On the other hand, the power receiving mechanism 72 on the conveying module 2 side includes the second coil 6, an AC / DC (direct current alternating current) conversion circuit 721, a voltage regulator 722, and a battery 52. ​​The AC / DC conversion circuit 721 is a circuit that converts AC power into DC power, and the voltage regulator 722 adjusts the voltage of the DC power converted by the AC / DC conversion circuit 721. In this way, as described later, the AC electromotive force generated between the first coil 3 and the second coil 6 is converted into DC power by the AC / DC conversion circuit 721 and the voltage is adjusted by the voltage regulator 722 and stored in the battery 52. ​​In addition, it is configured to supply power from the battery 52 to the sensor 51 (position sensor 511, tilt sensor 512) to implement detection of the position of the substrate holding portion 23, the tilt of the main body 21, etc.

[0094] Next, refer to Figure 5 , Fig. 7A , Figure 7BThe control of the power supply state of the first coil 3 is explained. These figures show a state in which the transfer module 2 arranges the fork 22 in a posture parallel to the X direction in the substrate transfer chamber 14 and moves in the X direction. Figure 5 In FIG. 1 , the coils 31 and 32 in the A coil 31 and the B coil 32 of the tile block 16 in the driving mode and the coil 31 in the wireless power supply mode are shown by thick solid lines, and the coils in the standby mode are shown by thin solid lines. Figure 5 2 shows a tile unit T which is a part of the tile section 16 , and the power supply state of all the coils 31 and 32 provided in the tile section 16 is allocated to one of the driving mode, the wireless power supply mode and the standby mode.

[0095] In addition, Fig. 7A , Figure 7B Schematically shows the power supply state of the A coil 31 when the conveying module 2 moves on the moving surface 15. Regarding the power supply state, "0" represents the driving mode, "●" represents the wireless power supply mode, and "×" represents the standby mode. In this way, the power supply state of each A coil 31 is set as follows: the A coil 31 in the lower area of ​​the main body 21 is in the driving mode, the A coil 31 in the lower area of ​​the second coil 6 is in the wireless power supply mode, and the other A coils 31 are in the standby mode. Then, along with the movement of the main body 21, the power supply state of each A coil 31, that is, the position of the coil 31 set to the driving mode, the wireless power supply mode, and the standby mode changes.

[0096] As described above, the main body 21 can detect the presence of a Hall element, for example. Figure 5 The position shown is P 0 , based on the position, the A coil 31 set to the driving mode is selected. For example, the position P 0 For example, it is the center position of the main body 21 when viewed from above. 0 For example, the projection area of ​​the main body 21 is grasped, and the first coil 3 (31, 32) in the area corresponding to the projection area is selected as the coil set to the driving mode.

[0097] exist Figure 5 In the embodiment, for the sake of convenience, both the A coil 31 and the B coil 32 are set to the driving mode, but one or both of the A coil 31 and the B coil 32 are selected based on the moving direction of the transport module 2. In addition, for the area corresponding to the projection area, if the main body 21 can be moved in the desired direction by supplying power to the first coil 3 (31, 32) in the area, the area can be larger or smaller than the actual projection area.

[0098] For example, based on the position P of the main body 210 The position P of the second coil 6 is obtained by calculation based on the coordinate information. Figure 5 The position P of the second coil 6 shown is the center position of the opening surface 63, for example, the center position of the base 61 of the second coil 6 when viewed from above. Based on the position P, the projection area of ​​the second coil 6 is grasped, and the first coil 3 (31, 32) in the area corresponding to the projection area is selected as the coil set to the wireless power supply mode. The coil set to the wireless power supply mode in this example is one of the A coil 31 and the B coil 32. Figure 5 and Fig. 7A , Figure 7B In the example shown, this is the A coil 31 .

[0099] The first coil 3 set to the wireless power supply mode is supplied with AC power as described above, and a magnetic field is formed on the moving surface 15 through the first coil 3. Then, the magnetic field formed on the moving surface 15 by the AC power supplied to the first coil 3 changes, and the alternating electromotive force between the first coil 3 and the second coil 6 acts. As a result, an induced current is generated in the second coil 6, and the induced current is supplied to the AC / DC conversion circuit 721. For the first coil 3 set to the wireless power supply mode, if an electromotive force can be generated between the first coil 3 and the second coil 6 by supplying power to the first coil 3 in the area, it can be one or more first coils 3 (coil windings a, b). In addition, if the action of the first coil 3 set to the driving mode is not hindered, the first coil 3 in a range larger than the projection area of ​​the second coil 6 can also be set to the wireless power supply mode.

[0100] As described above, as the conveying module 2 moves, the power supply state of the first coil 3 provided in the tile block portion 16 is controlled according to the position of the magnet 4 and the position of the second coil 6, thereby wirelessly powering the sensor 51 of the moving conveying module 2. Fig. 8A , Figure 8B As shown, the transport operation of the wafer W performed by the transport module 2 includes translation movement and rotation movement. Fig. 8A , Figure 8B The operation of transferring the wafer W in the substrate processing chamber 11 to the load lock chamber 13 by the transfer module 2 is shown.

[0101] First, if Fig. 8A As shown, the wafer W is transferred from the substrate processing chamber 11 to the substrate transfer chamber 14. During the transfer operation, as shown in (1), the wafer W is moved around the center position P of the main body 21. 0 The rotational movement of is combined with the translational movement in the X and Y directions. Figure 8BAs shown, in the substrate transfer chamber 14 as well, the wafer W is transferred to the load lock chamber 13 by causing the main body 21 to move translationally in the Y direction (2) and then in the X direction (3). In this way, the transfer module 2 transfers the wafer W by a combination of translational movement and rotational movement, and during the translational movement, the movement speed is changed in such a manner that the movement is accelerated at the start, then moves at a substantially constant speed, and decelerates toward the stop of the movement.

[0102] The magnitude of the electromotive force obtained between the first coil 3 and the second coil 6 of the tiling block portion 16 is affected by the magnetic flux of the second coil 6, but the magnetic flux changes due to the moving speed and rotation angle of the conveying module 2. Therefore, there is a concern that the electromotive force may change along with the conveying action of the conveying module 2. On the other hand, in this embodiment, when the electromotive force is accumulated in the battery 52, a voltage regulator 722 is provided to perform voltage regulation. An upper limit value of the voltage of the input DC power is set to the voltage regulator 722. From this point of view, it is preferable to suppress the variation of the electromotive force. Therefore, in the present disclosure, in the power supply control unit 501, control for suppressing the variation of the electromotive force is implemented during translational movement and rotational movement, respectively.

[0103] <Constantiation of electromotive force during translation>

[0104] Fig. 9 The fork 22 of the transport module 2 is arranged in a posture parallel to the X direction, and the main body 21 is arranged in a V direction in the X direction. M (m / s) for translational movement. In the figure, the horizontal axis represents the X direction, the vertical axis represents the Y direction, and an represents the top layer of the coil winding of the A coil 31 directly below the position P of the second coil 6. Hereinafter, the A coil 31 is sometimes recorded as the A coil an, and the B coil 32 is sometimes recorded as the B coil bn.

[0105] Fig. 10A , Fig. 10B The AC power I is supplied to the A coil 31 and the B coil 32 respectively. X ,I Y The magnetic flux B that penetrates the opening surface 63 of the second coil 6 at this time. In these figures, the coil arranged in the direction of generating the magnetic flux B is the A coil 31. Fig. 10A and Fig. 10B In the embodiment, the directions of the AC power supplied to the A coil 31 and the B coil 32 are different, and the directions of the magnetic flux B are different.

[0106] Then, in the second coil 6, an electromotive force V is generated along with the change of the magnetic flux B penetrating the opening surface 63. Here, in the wireless power supply mode, the power supply unit 34 supplies AC power to the first coil 3 of the tile block unit 16 (for example, in the case of the A coil arranged along the X direction, IX =A X sinωt), and AC power based on electromagnetic induction can also be obtained on the second coil 6 side through the magnetic field that changes with time according to the AC power.

[0107] On the other hand, while the transport module 2 is moving, the second coil 6 moves relative to the first coil 3 of the tile portion 16 , so this movement also changes the magnetic flux B and changes the electromotive force V in the second coil 6 .

[0108] As described above, it is preferable to suppress the change of the electromotive force V generated by the movement of the transport module 2 to be as small as possible. Therefore, the power supply control unit 501 performs the following control: according to the movement speed V when the transport module 2 is moved horizontally M , to adjust the AC power supplied from the power supply unit 34 to the first coil 3. Specifically, as the conveying module 2 is relative to the first coil 3 (in the direction of the magnetic flux B that passes through the opening surface 63 of the second coil 6), Fig. 10A , Fig. 10B Where A coil 31) moving speed V M Power control that increases the frequency of AC power and reduces it.

[0109] Next, the content of the power control will be described.

[0110] like Fig. 9 As shown, when it is assumed that the transport module 2 moves at a speed V M When the second coil 6 moves linearly in the X direction, the magnetic flux B penetrating the opening 63 of the second coil 6 is expressed by the following formula (1).

[0111] B(x, t) = Asin(ωt+2πV Mt / λ)…(1)

[0112] Where A is a constant, λ is a wavelength, ω is an angular velocity (ω=2πfsw), and fsw is a frequency. M and ω are originally functions that depend on time, but are defined as constants for simplicity this time.

[0113] On the other hand, when the magnetic flux per unit area penetrating the opening 63 of the second coil 6 is denoted by Φ, since Φ=B, the electromotive force V is expressed by the following formula (2).

[0114] V=-N·dΦ / dt

[0115] =A(ω+2πV M / λ)cos(ωt+2πV Mt / λ)…(2)

[0116] Wherein, N is the number of turns of the second coil.

[0117] When the relationship of the following formula (3) is obtained from the above formula (2), the electromotive force V is constant.

[0118] ω+2πVM / λ=consT…(3)

[0119] Fig.11 Let A = 0.01, λ = 10 × 10 -3 An example of formula (3) in the case of Fig.11 The horizontal axis is the moving speed V of the transport module 2 M (m / s), and the vertical axis is the angular velocity ω. According to the figure, as the moving speed V M The value of the angular velocity ω of the AC power supplied from the power supply unit 34 decreases linearly. It can be seen from this that the average electromotive force (the voltage after the AC / DC conversion circuit 721 converts the AC power) in the second coil 6 can be made constant (the variation of the electromotive force can be suppressed). Since the angular velocity ω = 2πfsw, the power supply control unit 501 controls the moving speed V of the conveying module 2 by M The frequency fsw of the AC power supplied to the A coil an directly below the second coil 6 is increased and controlled to be lowered, thereby suppressing the variation of the electromotive force V.

[0120] Here, the case where the conveying module 2 moves in the X direction with the fork 22 in a posture parallel to the X direction is described as an example, but the case where the conveying module 2 moves in the Y direction with the fork 22 in a posture parallel to the Y direction is also the same. In this case, the coil arranged in the direction of generating the magnetic flux B penetrating the opening surface 63 of the second coil 6 is the B coil 32. In addition, the power supply control unit 501 is configured to supply AC power to the B coil 32, and to increase the moving speed V of the conveying module 2 accordingly. M The frequency of the AC power is increased and controlled to decrease.

[0121] In addition, there are also cases where the transport module 2 moves in a diagonal translation direction, or where the main body 21 does not change its orientation but rotates around a center point. In these movements, the following control is performed: according to the moving speed V M The magnitudes of the components in the X and Y directions of the coil 31 and the coil 32 are changed.

[0122] Furthermore, suppressing the variation of electromotive force means suppressing the variation of electromotive force within the range not exceeding the upper limit of the voltage of the voltage regulator 722, and setting the variation range of electromotive force according to the upper limit of the voltage, for example, including ±20% from the average value of electromotive force.

[0123] <Constantization of electromotive force during rotational motion>

[0124] Next, refer to Fig.12 and Fig.13 The following describes power control by the power supply control unit 501 when the transport module 2 is rotated around a vertical rotation axis on the moving surface 15 (ground) in the wireless power supply mode.

[0125] The power supply control unit 501 is configured to perform control to select a coil for performing wireless power supply that can generate a magnetic flux B penetrating the opening surface 63 of the second coil 6 from among the A coil 31 and the B coil 32 according to the rotational movement of the transport module 2 .

[0126] Fig.12 The diagram schematically shows the position of the main body 21 relative to the X direction at a position P from the position of the fork 22 of the transfer module 2 being parallel to the X direction. 0 In the figure, the horizontal axis is the X direction, the vertical axis is the Y direction, an represents the coil winding of the A coil 31 directly below the position P of the second coil 6, and bn represents the coil winding of the B coil 32.

[0127] In this figure, the coil used to perform the wireless power supply is A coil 31, as shown in FIG. Fig.12 As shown, the angle θ formed is the direction of the magnetic flux B penetrating the opening surface 63 of the second coil 6 ( Fig.12 The direction indicated by the dotted arrow in FIG. 1 ) and the arrangement direction of the A coil 31 for performing wireless power supply ( Fig.12 The angle formed by the X direction.

[0128] If used Figure 3 , Figure 4 , Figure 5 As described in the above description, a plurality of A coils 31 and B coils 32 are respectively arranged on the moving surface 15 (tile block portion 16) in different directions such as the X direction and the Y direction. When the conveying module 2 rotates, the magnetic flux B penetrating the opening surface 63 of the second coil 6 is affected by the magnetic field formed by these A coils 31 and B coils 32. In the following description, it is assumed that I is supplied to the A coil 31. X (=A X sinωt), and supplies I to the B coil 32 Y (=A Y sinωt) is a common frequency electric power.

[0129] exist Fig.12 In the transport module 2 shown, the magnetic flux B in the X, Y and Z directions penetrating the opening surface 63 of the second coil 6 at a rotation angle θ around the vertical axis (Z axis) with the X direction as a reference (0°) is expressed by the following formula (4).

[0130] B=(μoAX sinωt / 2πZo,-μoA Y sinωt / 2πZo,0)…(4)

[0131] Among them, μ 0 is the magnetic permeability in vacuum, Z 0 YesP 0 The vertical Z component of the vector relative to the origin.

[0132] Therefore, when a unit vector oriented in the normal direction with respect to the opening surface 63 of the second coil 6 is assumed to be n=(cosθ, sinθ, 0), the magnetic flux Φ penetrating the second coil 6 is expressed by the following equation (5).

[0133] Φ=μosinωt / 2πZo·(A X cosθ-A Y sinθ)…(5)

[0134] Therefore, the electromotive force V in the second coil 6 is expressed by the following formula (6).

[0135] V=-NdΦ / dt

[0136] =-N·μoωsiωωt / 2πZo·(A X cosθ-A Y sinθ)…(6)

[0137] When the relationship (7) below is obtained from the above equation (6), the electromotive force is constant.

[0138] A X cosθ-A Y sinθ=const…(7)

[0139] Here, there is cos 2 θ+sin 2 The relationship of θ=1.

[0140] Therefore, according to the rotation angle θ of the transport module 2, for example, the current value I of the power supplied to the A coil 31 and the B coil 32 respectively x (=A X sinωt), I Y (=A Y sinωt) to control their respective power so that the maximum current value is A X = cosθ、A Y =-sinθ.

[0141] On the other hand, during the rotation of the transport module 2, the distance between the A coil 31 or the B coil 32 controlled by the wireless power supply mode and the magnet 4 provided in the main body 21 is sometimes close. In this case, it is necessary to suppress the influence of the magnetic field formed around the A coil 31 / B coil 32 powered by the wireless power supply mode on the motion control of the transport module 2.

[0142] Therefore, during the rotation operation, the wireless power supply coil may be switched from the B coil 32 / A coil 31 close to the magnet 4 in the main body 21 to the B coil 32 / A coil 31 far from the magnet 4 according to the rotation angle θ of the transport module 2 .

[0143] For example, Fig.13 The maximum current value A when the A coil 31 / B coil 32 used in wireless power supply is switched at a timing when the rotation angle (angle θ formed with the X direction) is 45°+n·90° (n=0, 1, 2, 3) is shown. X , A Y changes.

[0144] In this case, the maximum current values ​​A and B are obtained by calculating equations (4) to (7) so that the power supply control is performed using either the A coil 31 or the B coil 32. X , A Y In addition, the maximum current value A in the figure X , A Y The sign indicates the direction of the current flowing in the A coil 31 / B coil 32. X Set the positive direction of the Y axis to positive, A Y Set the direction of the positive X-axis to positive.

[0145] Like this, Fig.13 The main body 21 is shown Fig.12 An example of the selection of coil A an and coil B bn in order to suppress the change of electromotive force V in the case of rotational motion shown, and the maximum current value of the AC power supplied to the selected coil A an and coil B bn. In the figure, the horizontal axis is the rotation angle (the angle θ formed), and the vertical axis is the maximum current value of the AC power. In the AC power supplied to coil A an and coil B bn, for coil A an, the thick solid line indicates the case where the power supply is "on", and the thin solid line indicates the case where the power supply is "off". In addition, for coil B bn, the thick dotted line indicates the case where the power supply is "on", and the thin dotted line indicates the case where the power supply is "off".

[0146] As shown in the figure, at a rotation angle of, for example, θ=45°+n·90° (n=an integer including 0, 1, 2, and 3), one of the A coil 31 and the B coil 32 is selected as the coil to supply AC power. That is, each first coil 3 is selected so that AC power is supplied to the A coil an when 0°≤θ<45°, AC power is supplied to the B coil bn when 45°≤θ<135°, AC power is supplied to the A coil an when 135°≤θ<225°, AC power is supplied to the B coil bn when 225°≤θ<315°, and AC power is supplied to the A coil an until 315°≤θ<360°(0°).

[0147] Then, based on the maximum current value A X , A Y The following control is performed based on the result obtained by the rotation angle θ: the closer the rotation angle θ is to 45°±n·90° (n=0, 1, 2, 3), the closer the AC power supplied to the A coil an and the B coil bn is to A. X , A Y Thus, the maximum current value A is supplied to coil A an and coil B bn at θ=45°+n·90° (n=integer including 0, 1, 2, 3) where the magnetic field of coil A an and coil B bn is minimized. X , A Y The AC power is used to suppress the drop of the electromotive force at that position and suppress the change of the total electromotive force. Fig.13 The control example is just one example, and the magnitude of the current is appropriately set in consideration of conditions such as the arrangement of the first coil 3 and the upper limit voltage value of the voltage regulator 722.

[0148] Next, refer to Fig.14 and Fig.15 The flowchart shown is used to illustrate the functions related to wireless power supply.

[0149] First, the position P of the main body 21 of the transport module 2 is obtained. 0 (Step S11). As described above, the position P of the main body 21 is 0 is detected by the Hall element provided in the tile block portion 16. Then, in step S12, the detected position P is determined. 0 Whether it is around the A coil an and the B coil bn, that is, whether the A coil an and the B coil bn are the coils directly below the main body 21. Then, if "yes", the process proceeds to step S13, the power supply state of the A coil an and the B coil bn is switched to the drive mode, and the drive control of the conveying module 2 is executed (step S14).

[0150] On the other hand, if the answer is "No", the process proceeds to step S15 to determine whether the position P of the second coil 6 is around the A coil an and the B coil bn, that is, to determine whether the A coil an and the B coil bn are coils directly below the second coil 6. As described above, the position P of the second coil 6 is based on the position P of the main body 21. 0 Then, if it is "yes", it goes to step S16, switches the power supply state of the A coil an and the B coil bn to the wireless power supply mode, and enters the power supply control (step S20). If it is "no", it goes to step S17, switches the power supply state of the A coil an and the B coil bn to the standby mode (step 17).

[0151] For power supply control, it is determined in step S21 whether the angle θ formed is less than 45°+n·90° (n=0, 1, 2, 3). If it is "yes", the process proceeds to step S22 to make the A coil an effective. If it is "no", the process proceeds to step S23 to make the B coil bn effective. Effectiveness means selecting the A coil an (B coil bn) as the coil for supplying AC power, and supplying AC power to the selected A coil an (B coil bn).

[0152] Next, in step S24, based on the moving speed V of the transport module 2 M , to set the frequency of the AC power supplied to the activated coil. And, in step S25, the magnitude of the AC power supplied to the activated coil is set based on the angle θ formed by the conveying module 2. In this way, the activated A coil an (B coil bn) is supplied with AC power of controlled frequency and magnitude.

[0153] In this way, the position P of the main body 21 of the transport module 2 is changed 0 The power supply state of the corresponding first coil 3 is switched to the driving mode, and the power supply state of the first coil 3 corresponding to the position P of the second coil 6 is switched to the wireless power supply mode, and is driven in the driving mode and the wireless power supply mode respectively.

[0154] According to this embodiment, the second coil 6 is provided in the conveying module 2 and the electromotive force acting between the second coil 6 and the magnetic field formed by the first coil 3 of the tile block 16 is used, so that wireless power can be supplied to the power consuming equipment provided in the conveying module 2. Therefore, by providing the second coil 6 in the conveying module 2 and controlling the power supply state of the first coil 3 of the tile block 16 as in the past, wireless power supply can be performed by changing the software without changing the hardware.

[0155] Furthermore, the power consuming devices can be wirelessly powered while the transport module 2 moves on the moving surface 15. Therefore, wireless power can be powered in real time in the moving area of ​​the transport module 2 following the free movement of the transport module 2 in the X, Y, Z, and θ directions.

[0156] Furthermore, with respect to the power supply state of each first coil 3 of the tiling block 16, the first coil 3 corresponding to the position of the magnet 4 of the conveying module 2 is switched to the driving mode, the first coil 3 corresponding to the position of the second coil 6 is switched to the wireless power supply mode, and the other first coils 3 are switched to the standby mode. The tiling block 16 is filled with coils in a manner that covers the entire movable range of the conveying module 2, and the first coil 3 used for the floating movement of the conveying module 2 is only the first coil 3 directly below the main body 21.

[0157] Therefore, there is no need to provide a new coil for wireless power supply, and the existing tile block unit 16 can be used to simultaneously perform the movement of the transfer module 2 and wireless power supply. In this way, the transfer operation of the wafer W by the transfer module 2 and wireless power supply can be taken into account, so power supply can be provided in a manner that suppresses a decrease in productivity.

[0158] In addition, the magnet 4 and the second coil 6 provided in the main body 21 are arranged at positions that do not overlap each other when viewed from the moving surface 15. Therefore, the driving of the main body 21 using the magnet 4 and the wireless power supply using the second coil 6 can be independently operated while suppressing mutual interference.

[0159] Furthermore, when AC power is supplied to the first coil 3 of the tiling block portion 16, the frequency is controlled according to the moving speed of the conveying module 2. Thus, in the translational movement of the conveying module 2, even if the moving speed changes, the variation of the electromotive force is suppressed. In addition, the magnitude of the AC power is controlled according to the rotation angle of the conveying module 2. Thus, even in the rotational movement of the conveying module 2, the variation of the electromotive force is suppressed. Therefore, in the moving area of ​​the conveying module 2, power transmission with suppressed variation of the electromotive force can be performed at any position, and real-time and highly stable wireless power supply can be performed during the movement of the conveying module 2.

[0160] Furthermore, in the above-described embodiment, even when the storage battery 52 for storing the power supplied via the second coil 6 is provided, the storage battery 52 is a storage battery for storing the power of the sensor 51. Therefore, it is not necessary to provide a large-capacity storage battery, and thus it is possible to use a small and lightweight storage battery 52. ​​Therefore, even if the storage battery 52 is provided in the transport module 2, the possibility of affecting the mobility of the transport module 2 is small.

[0161] <Other Examples of Second Coil>

[0162] Next, refer to Fig.16 and Fig.17 As shown in these figures, the shape and installation position of the second coil can be set arbitrarily.

[0163] Fig.16 A bottom view of the conveying module 2 is shown. The second coil 81 of this example is arranged on the lower surface of the fork 22 at a position close to the substrate holding portion 23, and the base 82 is formed by a rectangular annular body when viewed from above. The coil winding 83 is configured to be wound between the opening portion 821 and the outer wall portion 822 of the base 82, and the opening surface of the second coil 81 faces the circumference of the base 82. In addition, it is also possible to have a structure in which the coil winding 83 is wound in the circumferential direction along the outer wall portion 822 of the base 82. In this case, the opening surface of the second coil 81 is configured to face the Z′ direction.

[0164] in addition, Fig.17 FIG. 2 shows a top view of the transport module 2, showing an example in which the second coil 84 is provided in the main body 21. In this example, the base 85 of the second coil 84 is provided in a manner surrounding the side wall of the main body 21, and is formed of a rectangular ring body when viewed from above. Fig.16 The second coil 81 shown is also wound between the opening 851 and the outer wall 852 of the base 85 , and may be wound in the circumferential direction along the outer wall of the base 85 .

[0165] Even in these examples, the second coils 81 and 84 are arranged at positions that do not overlap with the magnets 4 provided on the main body 21 when viewed from the moving surface 15. Therefore, the conveying module 2 can be moved and the sensor 51 provided on the conveying module 2 can be wirelessly powered by switching the power supply state of each first coil 3 provided on the tile block 16 between the driving mode, the wireless power supply mode, and the standby mode.

[0166] <Other Examples of the First Coil>

[0167] Furthermore, the first coil provided in the tile block portion 16 is not limited to the above-mentioned example. For example, the plurality of coils arranged in the tile block portion 16 so as to extend in different directions along the moving surface 15 when viewed from a vertical axis intersecting the moving surface 15 may be as follows: Fig.18 The structure shown.

[0168] Fig.18The tile block portion 16 of the example shown has a C coil and a D coil in addition to the A coil 31 (a1, a2...an) and the B coil 32 (b1, b2...bn) provided as described above. The C coil (c1, c2...cn) is formed to be arranged along the Y direction and extends in the direction of the angle θ1 formed relative to the Y direction, and the D coil (d1, d2...dn) is formed to be arranged along the Y direction and extends in the direction of the angle θ2 formed relative to the Y direction. Fig.18 In the example shown, the formed angles θ1 and θ2 are both set to 45°.

[0169] In this example as well, the transport module 2 can wirelessly power the power consuming devices provided in the transport module 2 using the electromotive force acting between the magnetic fields formed by the A coil, the B coil, the C coil, and the D coil provided in the tile portion 16 .

[0170] Furthermore, in the wireless power supply mode, the power supplied to the first coil 3 provided in the tile portion 16 may be not only AC but also DC. Fig.19 Shows that Figure 2 The fork 22 of the transfer module 2 of the structure shown is arranged in parallel with the X direction and is translated in the X direction, and the power supply state of the A coil 31 (a1, a2, ..., an) is set to the wireless power supply mode.

[0171] In this structure, for example, for the A coil 31, a supply voltage of I is set for each plurality of coils. X The current towards the group 1 and supply-I X Then, these groups 1 and 2 are alternately arranged in the X direction.

[0172] When the transport module 2 is moved in the X direction at a moving speed V M During translational movement, when the second coil 6 passes through the area of ​​group 1 and the area of ​​group 2, the direction of the magnetic flux B passing through the second coil 6 is as shown in Fig.19 Therefore, due to the movement of the conveying module 2, the magnetic flux between the first coil 3 and the second coil 6 of the tile block 16 changes, thereby obtaining an electromotive force. In this way, even when DC power is supplied to the first coil 3 of the tile block 16, the conveying module 2 can be wirelessly powered.

[0173] As described above, in the present disclosure, as the first coil 3 provided in the tile block portion 16, the driving coil for driving the conveying module 2 and the second coil for wireless power supply for wireless power supply may be provided separately in the tile block portion 16. In this case, it is not necessary to switch the power supply state of the first coil 3 to the driving mode, the wireless power supply mode, and the standby mode, so the control becomes easy.

[0174] In addition, as power consuming devices provided in the transport module 2, in addition to the various sensors 51 such as the position sensor 511 and the tilt sensor 512 described above, there can be exemplified cameras and electromagnets when the magnet provided in the main body 21 is an electromagnet.

[0175] Furthermore, the storage battery 52 does not necessarily have to be provided in the transport module 2 , and the electromotive force obtained by the second coil 6 may be converted into direct current power by, for example, the AC / DC conversion circuit 721 and then directly supplied to the sensor 51 .

[0176] When the storage battery 52 is provided, the electromotive force obtained by the second coil 6 can be stored. Therefore, when the conveying module 2 moves on the moving surface 15, it is not necessary to set the power supply state of the first coil 3 of the tile block portion 16 corresponding to the second coil 6 to the wireless power supply mode. For example, when the storage battery 52 has a large amount of power, it is also possible to set the second coil 6 not to be wirelessly powered, and to supply power from the storage battery 52 to the sensor 51 to drive the sensor 51.

[0177] As described above, by supplying AC power to the first coil 3, the electromotive force of the AC between the first coil 3 and the second coil 6 acts. Therefore, the electromotive force is generated not only when the conveying module 2 moves on the moving surface 15, but also when it stops. Therefore, in the case where the storage battery 52 is provided, for example, the electromotive force obtained by the second coil 6 can be stored during the period when the conveying module 2 stops waiting for the conveying of the wafer W. Moreover, it is also possible to use the second coil 6 without wireless power supply during the period when the conveying module 2 moves to convey the wafer W, but to supply power to the sensor 51 from the storage battery 52 to drive the sensor 51.

[0178] The coils provided in the tile block portion 16 are not limited to the above-mentioned examples. Other configurations may be used as long as a magnetic field can be formed on the moving surface 15 of the substrate transfer chamber 14 by supplying power. For example, coils wound helically around a vertical axis may be arranged.

[0179] Furthermore, in the above description, an example is described in which addresses are assigned to the tiled block units T constituting the tiled block section 16, and the A coils 31 and B coils 32 in the tiled block units T are assigned addresses common to the tiled block units T. The present invention is not limited to this example, and different coil addresses may be assigned to all the A coils 31 and B coils 32 covering the entire moving surface 15 of the substrate transfer chamber 14, and coils set to the respective modes in the power supply state may be selected based on the coil addresses.

[0180] In addition, the substrate processing chamber 11 is not limited to a structure in which wafers are processed in a vacuum atmosphere, but may be configured to process wafers in an atmospheric pressure atmosphere. Therefore, the substrate transfer chamber 14 may also be an atmospheric pressure atmosphere.

[0181] Furthermore, the main body 21 of the transport module 2 is not limited to a rectangular structure in a plan view, and may be circular in a plan view.

[0182] The embodiments disclosed herein are to be considered in all respects as illustrative and non-restrictive. The above embodiments may be omitted, replaced, or modified in various ways without departing from the appended claims and the gist thereof.

[0183] Description of Reference Numerals

[0184] W: wafer; 15: moving surface; 16: tiling block; 2: substrate transport module; 23: substrate holding part; 3: first coil; 34: power supply part; 51: sensor (power consuming device); 6: second coil; 31: A coil; 32: B coil.

Claims

1. A device for conveying a substrate, comprising: a tiling block portion constituting a moving surface of a region for conveying the substrate, and provided with a plurality of first coils for forming a magnetic field on the moving surface by power supply from a power supply portion; and A substrate transport module, comprising a plurality of magnets, wherein repulsive force acts between the plurality of magnets and the magnetic field, the substrate transport module being configured to be movable on the moving surface by magnetic levitation utilizing the repulsive force, and comprising a substrate holding portion for holding a substrate to be transported, in, The substrate transport module includes a second coil for power supply, and the second coil is used to utilize the electromotive force acting between the magnetic field formed by the first coil and the second coil to wirelessly power a power-consuming device arranged in the substrate transport module while the substrate transport module moves on the moving surface.

2. The device according to claim 1, wherein: In the substrate transport module, the magnet and the second coil are arranged at positions that do not overlap each other when viewed from the moving surface. It also includes a power supply control unit, which switches the power supply state of each of the first coils arranged on the tiling block portion from the power supply unit between a driving mode for moving the substrate transport module, a wireless power supply mode for supplying power to the second coil, and a standby mode in which no power is supplied, according to the position of the magnet of the substrate transport module moving on the moving surface and the position of the second coil.

3. The device according to claim 2, wherein: The power supply unit is configured to supply AC power to the first coil, and the power supply control unit performs the following control in the wireless power supply mode to suppress the variation of the electromotive force: as the moving speed of the substrate conveying module relative to the first coil configured in the direction of generating a magnetic flux passing through the opening surface of the second coil increases, the frequency of the AC power decreases.

4. The device according to claim 2, wherein: A plurality of first coils are provided on the tile block, and the plurality of first coils are arranged so as to extend in mutually different directions along the moving surface when viewed from a vertical axis intersecting the moving surface, The power supply unit is configured to supply AC power to the first coil, and the power supply control unit performs the following control in the wireless power supply mode in order to suppress the variation of the electromotive force: according to the rotational movement of the substrate transport module around the vertical axis, the maximum current value of the AC power for the first coil configured to extend in one direction, or for a plurality of the first coils configured to extend in different directions, is changed.

5. The device according to claim 2, wherein: A plurality of first coils are provided on the tile block, and the plurality of first coils are arranged so as to extend in mutually different directions along the moving surface when viewed from a vertical axis intersecting the moving surface, The power supply unit is configured to supply AC power to the first coil, and the power supply control unit performs the following control in the wireless power supply mode to avoid the influence of the magnetic field formed in the second coil on the moving movement of the substrate conveying module: according to the rotational movement of the substrate conveying module around the vertical axis, the first coil used in the wireless power supply mode is switched from the first coil configured to extend in a direction close to the magnet of the substrate conveying module to the first coil configured to extend in a direction away from the magnet.

6. The device according to claim 1, wherein: The substrate transport module comprises: a main body on which the magnet is arranged; and a fork which is arranged to extend in a direction along the moving surface with the main body as a base end, and the substrate holding portion is formed at the front end of the fork, wherein the second coil is arranged on the fork.

7. The device according to claim 1, wherein: The substrate transport module includes a storage battery that stores the power supplied via the second coil and supplies the power to the power consuming device.

8. The device according to claim 7, wherein: The substrate transport module includes an AC-DC conversion circuit and a voltage regulator between the second coil and the battery. The AC-DC conversion circuit converts the AC power supplied by the second coil into DC power, and the voltage regulator adjusts the voltage of the DC power converted by the AC-DC conversion circuit.

9. The device according to claim 1, wherein: The power consuming device is a sensor provided in the substrate transport module.

10. A power supply method in a substrate conveying device, the power supply method comprising the following steps: Using a tiling block portion and a substrate transport module constituting a moving surface of an area for transporting the substrate, the substrate transport module is moved on the moving surface by magnetic levitation using a repulsive force, the tiling block portion is provided with a plurality of first coils that form a magnetic field on the moving surface by power supply from a power supply portion, the substrate transport module includes a substrate holding portion and a plurality of magnets, the repulsive force acts between the plurality of magnets and the magnetic field, and the substrate holding portion is used to hold a substrate to be transported; and Using a second coil for power supply arranged in the substrate conveying module, the electromotive force acting between the magnetic field formed by the first coil and the second coil is used to wirelessly power the power-consuming equipment arranged in the substrate conveying module during the implementation of the process of moving the substrate conveying module on the moving surface.

11. The method according to claim 10, wherein: In the substrate transport module, the magnet and the second coil are arranged at positions that do not overlap each other when viewed from the moving surface. It also includes the following steps: during the implementation of the step of moving the substrate conveying module on the movable surface, according to the position of the magnet of the substrate conveying module and the position of the second coil, for each of the first coils arranged in the tiling block portion, the power supply state from the power supply portion is switched between a driving mode for moving the substrate conveying module, a wireless power supply mode for supplying power to the second coil, and a standby mode without power supply.

12. The method according to claim 11, wherein: The power supply unit is configured to supply AC power to the first coil. In the process of switching the power supply state from the power supply unit, in the wireless power supply mode, the following control is performed to suppress the change of the electromotive force: as the moving speed of the substrate conveying module relative to the first coil configured in the direction of generating a magnetic flux passing through the opening surface of the second coil increases, the frequency of the AC power is reduced.

13. The method according to claim 11, wherein: A plurality of first coils are provided on the tile block, and the plurality of first coils are arranged so as to extend in mutually different directions along the moving surface when viewed from a vertical axis intersecting the moving surface, The power supply unit is configured to supply AC power to the first coil. In the process of switching the power supply state from the power supply unit, in the wireless power supply mode, the following control is performed to suppress the variation of the electromotive force: according to the rotational movement of the substrate transport module around the vertical axis, the maximum current value of the AC power for the first coil configured to extend in one direction, or for a plurality of the first coils configured to extend in different directions, is changed.

14. The method according to claim 11, wherein: A plurality of first coils are provided on the tile block, and the plurality of first coils are arranged so as to extend in mutually different directions along the moving surface when viewed from a vertical axis intersecting the moving surface, In the process of switching the power supply state from the power supply part, in order to avoid the influence of the magnetic field formed in the second coil controlled in the wireless power supply mode on the moving action of the substrate conveying module, the following control is performed: according to the rotational movement of the substrate conveying module around the vertical axis, the first coil used for the wireless power supply mode is switched from the first coil configured to extend in a direction close to the magnet of the substrate conveying module to the first coil configured to extend in a direction away from the magnet.

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