Silicon wafer automatic transmission control method and system

Abstract

The invention provides a silicon wafer automatic transmission control method and system, and relates to the technical field of silicon wafer transmission, and the method comprises the steps: pre-configuring a mapping relation between a station on each CV transmission line and a station on a support plate; the control module receives a sheet sending instruction and analyzes the sheet sending instruction to obtain sheet sending parameters; the sheet distributing mechanism automatically moves to corresponding stations on the CV transmission lines for sheet distributing according to the sheet distributing parameters; after sheet distribution is completed, air cylinders on all the CV transmission lines work so as to lift all the stations; and the silicon wafers are sucked to the corresponding stations of the carrier plate from the CV transmission line, so that the problems that the efficiency is relatively low and the silicon wafers are easy to damage when the silicon wafers are conveyed by manual operation in the prior art are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer transmission, and in particular to a silicon wafer automatic transmission control method and system. Background Art

[0002] With the rapid rise of the new energy photovoltaic solar industry and the widespread increase in application scenarios, in order to achieve better solar energy conversion efficiency for solar cells and extend the service life of solar cells, it is necessary to control the process of silicon wafers, such as chemical reaction, physical deposition, etching, cleaning and other steps.

[0003] Chemical vapor deposition is a relatively important process in solar cell production. The cells need to be placed on a fixed carrier and placed in dedicated process equipment for surface coating. Currently, they need to be placed one by one on the corresponding workstation on the carrier manually using special tools. The cell has very high requirements for surface cleanliness. Manual loading and unloading of cells is very inefficient and the placement accuracy is difficult to guarantee, resulting in very high fragmentation and rejection rates. Summary of the Invention

[0004] In order to overcome the above technical defects, the purpose of the present invention is to provide a method and system for automatic silicon wafer transmission control to solve the problem that the existing manual operation for silicon wafer transmission is low in efficiency and easy to damage the silicon wafer.

[0005] The present invention discloses a silicon wafer automatic transmission control method, comprising:

[0006] Pre-configure the mapping relationship between each CV transmission line station and the station on the carrier board;

[0007] The control module receives a chip launch instruction and parses the chip launch instruction to obtain chip launch parameters;

[0008] The chip launching mechanism moves autonomously to the corresponding station on each CV transmission line according to the chip launching parameters to launch the chip;

[0009] After the film is released, the cylinders on each CV transmission line work to lift each workstation;

[0010] Each workstation is sucked to move the silicon wafer from the CV transmission line to the corresponding workstation on the carrier.

[0011] Preferably, the number of workstations per row on each CV transmission line is configured to correspond to the number of workstations per row on the carrier board;

[0012] The number of stations per column on each CV transmission line is a factor of the number of stations per column on the carrier board.

[0013] Preferably, two parallel CV transmission lines are configured, including a first CV transmission line and a second CV transmission line;

[0014] There are 2 rows and 8 columns of workstations on each CV transmission line.

[0015] There are 8 rows and 8 columns of workstations configured on the carrier board;

[0016] For any carrier plate, the plate-discharging mechanism performs two plate-discharging operations and then replaces the plate.

[0017] Preferably, the chip launching mechanism launches chips on any and only one CV transmission line according to the chip launching parameters.

[0018] Preferably, a plurality of tags associated with different modes are pre-configured, each mode having predetermined transmission parameters;

[0019] Capture the tags selected by the user, and autonomously generate the release instructions and send them to the control module.

[0020] Preferably, before sucking the film at each workstation, each workstation is monitored to see whether it has completed the lifting operation.

[0021] Preferably, before each workstation sucks the wafer, the monitoring equipment corresponding to each workstation on the CV transmission line is used to monitor the silicon wafer position data in real time and feed it back to the control module. The control module verifies the position of each silicon wafer based on the fed-back data and the wafer sending parameters.

[0022] The present invention further provides a silicon wafer automatic transmission control system, which executes any of the above-mentioned automatic transmission control methods, including:

[0023] At least one CV transmission line and carrier board for transferring silicon wafers;

[0024] The control module is used to pre-configure the mapping relationship between each CV transmission line station and the station on the carrier board; receive the chip launch instruction, and parse the chip launch instruction to obtain the chip launch parameters;

[0025] The chip launching mechanism is used to receive the chip launching parameters from the control module and autonomously move to the corresponding station on each CV transmission line to launch the chip;

[0026] The driving mechanism is used to control the operation of each cylinder to lift each workstation;

[0027] The transfer mechanism is used to move the silicon wafer from the CV transmission line to the corresponding station on the carrier.

[0028] Preferably, the control module further includes:

[0029] A configuration submodule is used to configure the mapping relationship between each CV transmission line station and the station on the carrier; and / or pre-configure multiple tags associated with different modes, each mode having predetermined chip release parameters;

[0030] And / or, an interactive submodule, used to capture user operations to autonomously generate release instructions.

[0031] Preferably, it also includes monitoring equipment corresponding to each station on the CV transmission line to monitor the real-time position data of the silicon wafer and feed it back to the control module.

[0032] Compared with the existing technology, the above technical solution has the following beneficial effects:

[0033] The present application discloses a method and system for controlling automatic silicon wafer transmission. The control module receives a wafer transmission instruction and generates wafer transmission parameters. The wafer transmission mechanism transmits wafers along each CV transmission line according to the wafer transmission parameters. After the wafer transmission at the corresponding workstation is completed, the wafer is lifted up and then sucked in to be transmitted to a carrier. The workstations on the CV transmission line correspond to the workstations on the carrier, thereby realizing an automatic process of silicon wafer transmission and unmanned transmission, thereby solving the problem of low efficiency and easy damage to silicon wafers in existing manual operation for silicon wafer transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a flow chart of the method in Embodiment 1 of a method and system for automatic silicon wafer transmission control according to the present invention;

[0035] Figure 2 This is a schematic diagram of the control flow in Embodiment 1 of a method and system for controlling automatic silicon wafer transmission according to the present invention;

[0036] Figure 3 Schematic diagram of the hardware structure of the CV transmission line in Embodiment 1 and Embodiment 2 of a silicon wafer automatic transmission control method and system according to the present invention;

[0037] Figure 4 This is a module diagram of a second embodiment of a silicon wafer automatic transmission control method and system according to the present invention.

[0038] Reference numerals:

[0039] 6-Silicon wafer automatic transmission control system; 61-Control module; 611-Configuration submodule; 621-Interaction submodule; 62-CV transmission line; 63-Carrier board; 64-Wafer launching mechanism; 65-Drive mechanism; 66-Transfer mechanism; 67-Monitoring equipment. DETAILED DESCRIPTION

[0040] The advantages of the present invention are further described below with reference to the accompanying drawings and specific embodiments.

[0041] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0042] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0043] It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining."

[0044] In the description of the present invention, it should be understood that the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0045] In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal communication between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0046] In the following description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present invention and have no specific meaning. Therefore, "module" and "component" can be used interchangeably.

[0047] Example 1: This embodiment provides a method for controlling automatic silicon wafer transmission, aiming to realize unmanned wafer placement and unmanned silicon wafer transmission in process flow, thereby being applicable to silicon wafer production and manufacturing scenarios, improving work efficiency and reducing the risk of human damage during silicon wafer transmission. Specifically, as an explanation, in the silicon wafer process processing scenario, silicon wafers need to be arranged on a carrier, but in order to meet process requirements, not every workstation on the carrier corresponds to a silicon wafer (the placement position and number of silicon wafers need to be adjusted according to the process), and there may be a situation where some silicon wafers are placed and some are idle. Therefore, most of the existing methods rely on manual arrangement, while the method of this embodiment realizes autonomous silicon wafer arrangement and transmission. For details, please refer to Figure 1 ,include:

[0048] S10: pre-configure the mapping relationship between each CV transmission line station and the station on the carrier board;

[0049] In this embodiment, the purpose is to realize that the silicon wafer is transferred from the wafer launching mechanism to the carrier through the CV transmission line, and then enters the process chamber through the carrier for process operation. Several workstations are arranged on any CV transmission line and the carrier. It can be understood that the workstation is used to carry silicon wafers, and each workstation can carry one silicon wafer.

[0050] As an explanation, the CV (chemical vapor deposition) transmission line is an automatic production equipment that can move silicon wafers from a wafer launching mechanism to a carrier. Its application helps to improve the automation level of silicon wafer production, reduce manual operations, and improve production efficiency and quality. The wafer launching mechanism can be arranged along the CV transmission line and can be moved to any workstation on it to send the silicon wafer to a certain workstation.

[0051] Based on the above, since there are several workstations arranged on the CV transmission line and the carrier, in order to realize automatic transmission and reduce the inaccurate delivery position of silicon wafers after transmission, the mapping relationship of the workstations is pre-configured. Specifically, the number of workstations in each row on each CV transmission line corresponds to the number of workstations in each row on the carrier; the number of workstations in each column on each CV transmission line is a factor of the number of workstations in each column on the carrier.

[0052] That is to say, any station in each row of the CV transmission line (such as the i-th station) corresponds to any station in each row of the carrier (such as the i-th station), and the number of stations in each column of the CV transmission line is set to be a factor of the number of stations in each row of the carrier, that is, the total number of columns on the carrier / the total number of columns on the CV transmission line can be obtained as an integer, which is the number of transmissions. Therefore, after n transmissions, each column on the CV transmission line can also correspond to each column on the carrier.

[0053] Specifically, based on the above, as an example, Figure 3As shown, two parallel CV transmission lines are configured, including a first CV transmission line and a second CV transmission line; each CV transmission line is configured with 8*2 workstations; and the carrier is configured with 8*8 workstations. For any carrier, the wafer launching mechanism performs two wafer launches before replacing the wafer. In this embodiment, two CV transmission lines are configured, corresponding to four columns on the carrier. For example, during the first wafer launch, the first CV transmission line transmits to the eight workstations in the first and second rows of the carrier, and the second CV transmission line transmits to the eight workstations in the third and fourth rows of the carrier. During the second wafer launch, the first CV transmission line transmits to the eight workstations in the fifth and sixth rows of the carrier, and the second CV transmission line transmits to the eight workstations in the seventh and eighth rows of the carrier, with each row and each workstation starting at the same position.

[0054] S20: The control module receives a chip release instruction and parses the instruction to obtain chip release parameters.

[0055] In this embodiment, the wafer launching parameters include the number of wafers launched and the wafer launching position. The wafer launching mechanism moves to the corresponding workstation on the CV transmission line according to the wafer launching position. The wafer launching parameters are generated according to the arrangement of silicon wafers on the carrier board according to the process requirements. Based on the wafer launching parameters, the arrangement of silicon wafers on the CV transmission line can be determined to be transmitted to the corresponding position on the carrier board.

[0056] It is understandable that the above-mentioned chip sending instructions can be configured and issued at the user end (server), or can be autonomously generated by capturing user operations. The parsing of the chip sending instructions can be achieved through technologies such as semantic recognition and parameter extraction.

[0057] Specifically, in this embodiment, multiple tags associated with different modes can be optionally pre-configured, each with predetermined chip launch parameters. The tag selected by the user is captured, and a chip launch instruction is autonomously generated and sent to the control module. For example, a button (activated to trigger the selected tag) is associated with 12 chip launch modes. When the user presses this button on the user side, the instruction is autonomously triggered and sent to the control module, autonomously generating the corresponding chip launch parameters. The 12 silicon chips can be pre-set, for example, in the middle of the first CV transmission line. Different modes (and thus corresponding chip launch parameters) can be autonomously added or adjusted according to actual scenarios.

[0058] S30: The chip launching mechanism autonomously moves to the corresponding station on each CV transmission line according to the chip launching parameters to launch the chip;

[0059] In this embodiment, if the wafer launching mechanism moves along the CV transmission line, it can be moved to the corresponding workstation for autonomous wafer launching, thereby moving the silicon wafer to the corresponding workstation on the CV transmission line without manual operation.

[0060] As described above, multiple CV transmission lines can be set up, so that wafers can be launched for a certain CV transmission line, or for each workstation on multiple CV transmission lines. A wafer launching mechanism can be set up corresponding to each CV transmission line and controlled by the above-mentioned control module, or a wafer launching mechanism can be set up, which can be moved to each workstation of each CV transmission line.

[0061] Optionally, the chip-issuing mechanism may be configured to send chips on any and only one CV transmission line according to the chip-issuing parameters. That is, based on the above, in this embodiment, it may be configured to send chips only on the first CV transmission line or only on the second CV transmission line (e.g. Figure 2 As shown), when the process requires that rows 12 and 56 of the carrier have silicon wafers, but rows 34 and 78 do not have silicon wafers, it is only necessary to issue the wafers on the first CV transmission line. It should be noted that at this time, it is only necessary to wait on the first CV transmission line (CV1) for the silicon wafer (process wafer) to be in place before executing the following lifting, while the second CV transmission line does not issue the wafer and can directly execute the following lifting. Optionally, the second CV transmission line can also be directly controlled to be in a non-working state.

[0062] S40: After the film is released, the cylinders on each CV transmission line work to lift each station;

[0063] In this embodiment, the purpose of the lifting process is to facilitate wafer suction and transfer to the carrier in the following steps, achieving unmanned automated operation. Preferably, a corresponding cylinder is provided for each station to perform lifting operations separately, thereby reducing the risk of wafer movement during the lifting process, resulting in inaccurate positioning or damage to the wafer. The control module can also be used for batch management, such as lifting stations with wafers first, followed by those without, to improve work efficiency.

[0064] S50: Each workstation is sucked to move the silicon wafer from the CV transmission line to the corresponding workstation on the carrier.

[0065] In this embodiment, silicon wafers are transferred by suction, eliminating the need for manual operation and reducing the risk of damage to the wafers. As previously mentioned, the various workstations on the CV transfer line correspond to the various workstations on the carrier board, allowing them to be moved to various positions on the carrier board for subsequent process plate cavity processing. Process plate cavity processing primarily refers to the processing and manufacturing technology used to carry out and control the chambers used in chemical reactions, physical deposition, etching, cleaning, and other steps during the semiconductor manufacturing process.

[0066] In a preferred embodiment, before sucking the wafers at each workstation, each workstation is monitored to complete the lifting, that is, the working status of the cylinder or the position of the workstation can be monitored to ensure that each workstation is lifted before sucking the wafers, so as to reduce the situation of silicon wafers being missed and improve the safety and accuracy of the automatic transmission process.

[0067] In a preferred embodiment, before each workstation sucks the wafer, a monitoring device corresponding to each workstation on the CV transmission line is used to monitor the position data of the silicon wafer in real time and feed it back to the control module. The control module verifies the position of each silicon wafer based on the fed-back data and the wafer release parameters. Specifically, the monitoring device may include but is not limited to a sensor, an image monitoring device, etc. The monitoring device is used to determine the distribution of silicon wafers on the CV transmission line, which corresponds to the distribution of silicon wafers on the carrier. The data is then compared with the wafer release parameters and verified. If they are consistent, the above process is correct and the wafer can be directly sucked and transferred to the carrier. If they are inconsistent, it may be an operational error of the wafer release mechanism or a failure in the lifting process, and troubleshooting or feedback for manual maintenance is required. The establishment of this verification process can improve the safety of the automatic operation process.

[0068] In this embodiment, based on the above, the control module receives the wafer launching instruction and generates the wafer launching parameters. The wafer launching mechanism launches the wafer along each CV transmission line according to the wafer launching parameters. After the wafer launching at the corresponding workstation is completed, the wafer is lifted up and then sucked up to be transferred to the carrier. The workstations on the CV transmission line correspond to the workstations on the carrier, thereby realizing the automatic process of silicon wafer transmission and unmanned (loading / unloading) transmission without manual intervention. Only instructions need to be sent and configured.

[0069] Embodiment 2: This embodiment also provides a silicon wafer automatic transmission control system 6, which executes the automatic transmission control method described in any one of the above embodiments. Figure 4 ,include:

[0070] At least one CV transmission line 62 and carrier 63 are used for the transmission of silicon wafers; in this embodiment, they are used to realize the automatic transmission of silicon wafers from the wafer launching mechanism 64 - CV transmission line 62 - carrier 64.

[0071] The control module 61 is used to pre-configure the mapping relationship between each workstation on the CV transmission line and the workstation on the carrier; receive a chip launch instruction, parse the chip launch instruction to obtain chip launch parameters; to achieve an unmanned transmission process, configure a one-to-one correspondence between the workstations on the CV transmission line and the workstations on the carrier, determine whether to launch a chip at each workstation based on the chip launch parameters, and then transmit the chip to the carrier for subsequent process operations. The specific configuration is described in the above embodiment one.

[0072] The wafer launching mechanism 64 is used to receive the wafer launching parameters from the control module and autonomously move to the corresponding workstations on each CV transmission line to launch the wafers. In addition, the wafer launching mechanism in this embodiment includes a guide rail arranged along the CV transmission line. The wafer launching mechanism can move on the guide rail to the workstation on the CV transmission line where the silicon wafers need to be arranged to perform the wafer launching operation. The specific distribution of the silicon wafers is determined according to the wafer launching parameters.

[0073] The driving mechanism 65 is used to control the operation of each cylinder to lift each workstation; specifically, the driving mechanism provides kinetic energy for the CV transmission line, including but not limited to lifting and resetting each workstation, etc. As described in Example 1, the control module can control the driving mechanism to manage each cylinder in batches to improve control efficiency.

[0074] The transfer mechanism 66 is used to move the silicon wafer from the CV transmission line to the corresponding workstation on the carrier. Specifically, in this embodiment, the movement of the silicon wafer is achieved by sucking the wafer. Therefore, the transfer mechanism can be applied to a robotic arm with suction, or other existing equipment that can move autonomously to suck the wafer, and can be arranged according to the actual scenario and moving distance.

[0075] In the system of this embodiment, for the convenience of operation, as an example, multiple CV transmission lines can be arranged in parallel (such as the above example, two CV transmission lines are arranged), and each CV transmission line is arranged with 8 (columns) * 2 (rows) stations, that is, 2 rows are arranged, with 8 stations in each row, and 8 stations in each row are arranged along a straight line to form a long strip transmission structure, thereby saving space. Corresponding to the carrier board of 8*8 stations, the film-issuing mechanism can move back and forth in the direction of each row of stations of the CV transmission line, and the transfer mechanism is arranged above the CV transmission line and corresponds to each station to absorb the film and transfer it to the carrier board, so that the subsequent class can enter the process board cavity for process operation

[0076] In a preferred embodiment, the control module 61 further includes:

[0077] Configuration submodule 611 is used to configure the mapping between each CV transmission line station and the substrate station; and / or pre-configure multiple tags associated with different modes, each with predetermined wafer release parameters. In other words, this configuration submodule can define the correspondence between the CV transmission line and the substrate during the transmission process, thereby achieving autonomous or unmanned precision transmission. Multiple modes can also be pre-configured, so that only user input is required to trigger wafer transfer, improving work efficiency and adapting to different scenarios.

[0078] And / or, the interaction submodule 612 is used to capture user operations to autonomously generate chip release instructions. In this embodiment, it can receive instructions issued by the user terminal and interact with the user terminal to configure / autonomously generate instructions based on user operations, thereby making adjustments according to different process requirements.

[0079] In a preferred embodiment, it may also include monitoring equipment 67 corresponding to each workstation on the CV transmission line to monitor the real-time silicon wafer position data and feed it back to the control module. The monitoring equipment is set to realize real-time monitoring of the automatic transmission process and improve the safety of the unmanned transmission process. Whether it is to check the silicon wafer position or monitor abnormal conditions during the transmission process, it can be achieved through the monitoring equipment. Specifically, the monitoring equipment may include but is not limited to the above-mentioned sensors, image / video monitoring equipment, etc.

[0080] In this embodiment, it can be understood that the system is applied to silicon wafer transmission in the battery cell preparation scenario, and can also be connected to other equipment or devices / modules to optimize the automatic transmission process, improve work efficiency or safety, and will not affect the use of the above-mentioned modules, so as to increase the wide application applicability.

[0081] It should be noted that the embodiments of the present invention have better practicability and do not impose any form of limitation on the present invention. Any technician familiar with the field may use the technical content disclosed above to change or modify it into an equivalent effective embodiment. However, any modification or equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A silicon wafer automatic transmission control method, characterized in that: include: Pre-configure the mapping relationship between each CV transmission line station and the station on the carrier board; The control module receives a chip launching instruction and parses the chip launching instruction to obtain chip launching parameters; The chip launching mechanism autonomously moves to the corresponding station on each CV transmission line to launch the chip according to the chip launching parameters; After the film is released, the cylinders on each CV transmission line work to lift each station; Each workstation is sucked to move the silicon wafer from the CV transmission line to the corresponding workstation on the carrier.

2. The automatic transmission control method according to claim 1, characterized in that: Configure the number of workstations per row on each CV transmission line to correspond to the number of workstations per row on the carrier board; The number of stations per column on each CV transmission line is configured to be a factor of the number of stations per column on the carrier board.

3. The automatic transmission control method according to claim 1, characterized in that: configuring two parallel CV transmission lines, including a first CV transmission line and a second CV transmission line; There are 2 rows and 8 columns of workstations configured on each CV transmission line; There are 8 rows and 8 columns of workstations configured on the carrier board; For any carrier plate, the film-issuing mechanism is replaced after executing two film-issuing operations.

4. The automatic transmission control method according to claim 1, characterized in that: The chip launching mechanism launches chips on any and only one CV transmission line according to the chip launching parameters.

5. The automatic transmission control method according to claim 1, characterized in that: Pre-configure multiple tags associated with different modes, each mode having predetermined transmission parameters; Capture the tags selected by the user, and autonomously generate the release instructions and send them to the control module.

6. The automatic transmission control method according to claim 1, characterized in that: Before sucking the film at each workstation, monitor each workstation to complete the lifting.

7. The automatic transmission control method according to claim 1, characterized in that: Before each workstation sucks the wafer, the monitoring equipment corresponding to each workstation on the CV transmission line is used to monitor the silicon wafer position data in real time and feed it back to the control module. The control module verifies the position of each silicon wafer based on the fedback data and wafer sending parameters.

8. A silicon wafer automatic transmission control system, characterized in that: The automatic transmission control method according to any one of claims 1 to 7 comprises: At least one CV transmission line and carrier for transferring silicon wafers; A control module is used to pre-configure the mapping relationship between the workstations on each CV transmission line and the workstations on the carrier; receive a chip launch instruction, and parse the chip launch instruction to obtain chip launch parameters; The chip launching mechanism is used to receive the chip launching parameters from the control module and autonomously move to the corresponding station on each CV transmission line to launch the chip; A driving mechanism, used to control the operation of each cylinder to lift each workstation; The transfer mechanism is used to move the silicon wafer from the CV transmission line to the corresponding station of the carrier.

9. The automatic transmission control system according to claim 8, characterized in that: The control module also includes: A configuration submodule is used to configure the mapping relationship between each CV transmission line station and the station on the carrier; and / or, pre-configure a plurality of tags associated with different modes, each mode having a predetermined chip release parameter; And / or, an interactive submodule, used to capture user operations to autonomously generate release instructions.

10. The automatic transmission control system according to claim 8, characterized in that: It also includes monitoring equipment corresponding to each workstation on the CV transmission line to monitor the real-time position data of the silicon wafer and feed it back to the control module.

Images