Motion platform applied to large substrate, semiconductor equipment and image acquisition method

Abstract

The invention relates to the technical field of semiconductors, and provides a motion platform applied to a large substrate, semiconductor equipment and an image acquisition method, the motion platform applied to the large substrate comprises a rotating seat, a first adsorption assembly, a second adsorption assembly, a base and a rotation driving assembly; the rotating seat is installed on the base in the mode that the rotating seat can rotate with the central axis of the rotating seat as the center. The first adsorption assembly is arranged on the base in a lifting manner; the second adsorption assembly is arranged on the rotating seat and is provided with a through hole through which a part of the first adsorption assembly can penetrate when the first adsorption assembly is lifted; the first adsorption assembly penetrates through the through hole when rising and retreats from the through hole when falling. Through the configuration, the motion platform not only has the function of adsorbing a wafer or a substrate, but also can rotate at a large angle, and can meet the requirement of the off-axis area-array camera for full-coverage image acquisition of the substrate or the wafer on the premise of ensuring that the size of the motion platform is kept small.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a motion platform applied to a large substrate, a semiconductor device and an image acquisition method. Background Art

[0002] In semiconductor processing technology, motion platforms are used in various equipment such as lithography equipment and defect detection equipment. Motion platforms are mainly used to adsorb wafers and adjust the precision of wafers.

[0003] Different equipment has different requirements for the freedom of motion of the motion platform. Taking defect detection equipment as an example, for smaller substrates or wafers, the existing detection method is usually to collect images through a coaxial camera. The coaxial camera is coaxially arranged with the suction cup of the motion platform. At this time, the substrate or wafer can be completely covered by the viewing angle of a coaxial camera. For larger substrates or wafers, such as 12-inch wafers or large rectangular substrates, the viewing angle of a single coaxial camera cannot fully cover the substrate or wafer, and there is a visual blind spot at the edge of the substrate or wafer. In order to avoid the visual blind spot, the existing technical means is usually to add an off-axis camera. The off-axis camera is eccentrically arranged relative to the suction cup of the motion platform, and is used to collect images at the edge of the substrate or wafer. If the images of all edge positions of the substrate or wafer are to be collected, multiple off-axis cameras need to be arranged along the circumference, and the spatial layout is relatively complex, and it is easy to cause the overall cost of the motion platform to be high and the machine size to be large.

[0004] Therefore, the present invention requires a motion platform that can carry large-size wafers or substrates. The motion platform not only has the function of adsorbing wafers or substrates, but can also drive the wafers or substrates to rotate at a large angle. It can ensure that the size of the motion platform remains small while configuring an off-axis area array camera to capture full-coverage images of the substrate or wafer. Summary of the invention

[0005] The invention provides a motion platform, semiconductor equipment and image acquisition method for large substrates. The motion platform not only has the function of adsorbing wafers or substrates, but also can drive the wafers or substrates to rotate at a large angle. Under the premise of ensuring that the size of the motion platform remains small, an off-axis area array camera can be configured to meet the requirements of full-coverage image acquisition of the substrate or wafer range.

[0006] In the present invention, the motion platform applied to the large substrate comprises: a rotating seat, a first adsorption component, a second adsorption component, a base and a rotation driving component;

[0007] The rotating seat is mounted on the base in a manner that it can rotate along its own central axis, and the central axis of the rotating seat extends vertically;

[0008] The first adsorption component is arranged on the base for lifting; the second adsorption component is arranged on the rotating seat, and the second adsorption component is provided with a through hole for a part of the first adsorption component to pass through when the first adsorption component is raised; when the first adsorption component is raised, at least a part of it passes through the through hole for adsorbing the object to be adsorbed, and when the first adsorption component is lowered, it exits the through hole and is used to transfer the object to be adsorbed to the second adsorption component, and the second adsorption component is used to carry and adsorb the object to be adsorbed transferred thereto;

[0009] The rotation driving assembly is arranged on the base and is used to drive the rotating seat to rotate around its own central axis.

[0010] Optionally, the motion platform applied to the large substrate further comprises a vertical support assembly, wherein the vertical support assembly is arranged on the base and is used to provide an upward force to the rotating seat in a non-contact manner.

[0011] Optionally, the first adsorption assembly comprises at least two rows of suction nozzles arranged in parallel, and the at least two rows of suction nozzles are respectively used to adsorb two opposite edges of a rectangular object to be adsorbed.

[0012] Optionally, each row of the suction nozzles is arranged on one radial side of the rotating base.

[0013] Optionally, the first adsorption assembly further includes an adsorption base, and each of the adsorption nozzles is disposed on the adsorption base. The adsorption base is lifted and lowered on the base to drive each of the adsorption nozzles to rise and fall synchronously.

[0014] Optionally, a mounting hole for mounting the rotating seat is provided in the middle of the adsorption base, the rotating seat is conformably mounted in the mounting hole, and the rotating seat is rotationally matched with the adsorption base.

[0015] Optionally, the adsorption base is a rectangular plate structure, and the suction nozzles are arranged in two rows and are respectively parallel to two opposite edges of the adsorption base.

[0016] Optionally, the motion platform applied to the large substrate further comprises a gravity compensation mechanism, and the gravity compensation mechanism is arranged on the base to provide an upward force to the adsorption base.

[0017] Optionally, the second adsorption assembly includes a suction cup, which is arranged on the rotating seat, and the upper end of the suction cup has an adsorption area for carrying and adsorbing the part to be adsorbed.

[0018] Optionally, the adsorption area is rectangular.

[0019] Optionally, when the adsorption base is a rectangular plate structure, each side of the adsorption area is respectively arranged parallel to each side of the adsorption base.

[0020] Optionally, when the first adsorption assembly includes at least two rows of suction nozzles arranged in parallel, the two rows of suction nozzles are parallel to an opposite side of the adsorption area.

[0021] Optionally, the rotation drive assembly includes a rotation drive member, an adapter member and a movable connecting member, the rotation drive member is used to drive the adapter member to rotate, and the adapter member is connected to the rotating seat through the movable connecting member.

[0022] Optionally, a first installation cavity is vertically opened on the rotating seat, and at least a portion of the adapter is disposed in the first installation cavity.

[0023] Optionally, the motion platform applied to the large substrate further comprises a vertical support component, wherein the vertical support component is arranged on the base, and the vertical support component is at least used to provide an upward force for the rotating seat in a non-contact manner.

[0024] Optionally, a second installation cavity is vertically arranged on the vertical support assembly, and at least a portion of the rotation drive assembly is installed in the second installation cavity.

[0025] Optionally, the rotation angle of the rotating seat is not less than 360°.

[0026] Optionally, the motion platform applied to the large substrate also includes a coaxial camera and an off-axis camera, the coaxial camera and the off-axis camera are used to capture images of the parts to be adsorbed on the second adsorption component, the coaxial camera is arranged above the second adsorption component, and the coaxial camera is arranged coaxially with the rotating seat, the off-axis camera is arranged above the second adsorption component, and the off-axis camera is arranged eccentrically relative to the rotating seat.

[0027] Optionally, the motion platform applied to the large substrate further comprises an angle detection component, and the angle detection component is used to detect the rotation angle of the rotating seat.

[0028] Optionally, the motion platform applied to the large substrate further includes a vertical limiting mechanism, and the vertical limiting mechanism is used to limit the lifting stroke of the first adsorption component.

[0029] The present invention further provides a semiconductor device, wherein the semiconductor device is equipped with the above-mentioned motion platform applied to a large substrate.

[0030] The present invention also provides an image acquisition method, comprising the following steps:

[0031] S1: The first adsorption component rises and extends through the through hole of the second adsorption component to adsorb the object to be adsorbed;

[0032] S2: the first adsorption component is lowered to place the object to be adsorbed on the second adsorption component, the second adsorption component is used to carry and adsorb the object to be adsorbed thereon, and the first adsorption component is lowered outside the through hole;

[0033] S3: The second adsorption component rotates, and the rotation center axis of the second adsorption component extends vertically, and an off-axis camera eccentrically arranged above the second adsorption component collects an image at the edge of the object to be adsorbed.

[0034] Optionally, the following steps are further included between step S2 and step S3:

[0035] Use a coaxial camera coaxially arranged above the second adsorption component to capture images, and determine whether the viewing angle of the coaxial camera completely covers the part to be adsorbed; if the part to be adsorbed is completely covered, the process ends after the coaxial camera captures the image; if the part to be adsorbed is not completely covered, execute step S3.

[0036] In summary, the motion platform applied to a large substrate includes: a rotating seat, a first adsorption component, a second adsorption component, a base and a rotating drive component; the rotating seat is installed on the base in a manner that it can rotate along its own central axis; the first adsorption component is arranged on the base for lifting and lowering; the second adsorption component is arranged on the rotating seat, and the second adsorption component is provided with a through hole for a part of the first adsorption component to pass through when the first adsorption component is raised; when the first adsorption component is raised, at least a part of it passes through the through hole for adsorbing the part to be adsorbed, and when the first adsorption component is lowered, it withdraws from the through hole and is used to transfer the part to be adsorbed to the second adsorption component, and the second adsorption component is used to carry and adsorb the part to be adsorbed transferred thereto; the rotating drive component is arranged on the base for driving the rotating seat to rotate around its own central axis.

[0037] With such configuration, when the first adsorption component is raised, a part of it is lifted through the through hole to be used for handing over and adsorbing the part to be adsorbed, and then the first adsorption component is lowered, so that the suction nozzle 21 is lowered and exits the through hole, and the part to be adsorbed can be handed over to the second adsorption component and adsorbed by the second adsorption component. At this time, the second adsorption component will not be interfered by the first adsorption component during its rotation, so the second adsorption component can rotate freely to meet the image acquisition requirements of the off-axis camera. This structure can meet the image acquisition requirements of large-sized substrates or wafers through a coaxial camera and an off-axis camera. It does not need to set up multiple off-axis cameras around the second adsorption component. It can ensure that the size of the motion platform remains small, and configure the off-axis array camera to fully cover the image acquisition requirements of the substrate or wafer range. The entire motion platform achieves compatibility with the expanded off-axis camera within a smaller stroke and size range, thereby increasing the upper limit of the image acquisition lens magnification. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 This is a schematic diagram of the overall structure of a large base motion platform according to the first embodiment of the present invention;

[0039] Figure 2 This is a schematic structural diagram of the first adsorption component of the large substrate motion platform of the first embodiment of the present invention being raised;

[0040] Figure 3 It is a schematic structural diagram of lowering the first adsorption component of the moving platform of the large substrate in the first embodiment of the present invention;

[0041] Figure 4 It is a schematic diagram of the partial structure of the motion platform of the large base in the first embodiment of the present invention;

[0042] Figure 5 This is a schematic diagram of the warping adsorption structure of the motion platform of the large substrate according to the first embodiment of the present invention;

[0043] Figure 6 This is an image acquisition flow chart of Embodiment 1 of the present invention;

[0044] Figure 7 This is a schematic structural diagram of an adsorption assembly of a motion platform applied to a large substrate according to a second embodiment of the present invention;

[0045] Figure 8 It is a schematic diagram of the structure of the adsorption component of the motion platform applied to a large substrate according to the third embodiment of the present invention.

[0046] The reference numerals are as follows:

[0047] 10-rotating seat; 11-first installation cavity;

[0048] 20-first adsorption assembly; 21-suction nozzle; 22-adsorption base; 221-mounting hole; 23-suction column; 24-vertical guide rail; 25-vertical motor;

[0049] 30-second adsorption assembly; 301-through hole; 31-suction cup; 32-pneumatic slip ring;

[0050] 40-base;

[0051] 50-rotation drive assembly; 51-rotation drive member; 52-bearing; 53-adapter; 54-mover connector; 55-circumferential fixing seat; 551-second mounting cavity;

[0052] 60-vertical support assembly;

[0053] 70-angle detection component; 71-circumferential grating ruler;

[0054] 80-vertical limit mechanism; 81-vertical mechanical lower limit member; 82-vertical mechanical upper limit member; 83-vertical grating ruler;

[0055] 90- marble base; 91- X-direction guide rail; 92- Y-direction guide rail; 93- first Y-direction motor; 94- second Y-direction motor; 95- reaction force outward introduction mechanism; 96- lateral air flotation; 97- air foot;

[0056] 100-parts to be adsorbed;

[0057] 110- gravity compensation mechanism; 111- magnetic spring mover; 112- magnetic spring stator; 113- fixed adapter;

[0058] a-The central axis of the rotating seat. DETAILED DESCRIPTION

[0059] As used in the invention, the singular forms "one", "a", and "the" include plural objects, the term "or" is usually used to include the meaning of "and / or", the term "several" is usually used to include the meaning of "at least one", and the term "at least two" is usually used to include the meaning of "two or more". In addition, the terms "first", "second", and "third" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", and "third" can explicitly or implicitly include one or at least two of the features. In addition, as used in the invention, "installed", "connected", "connected", and one element "set" to another element should be understood in a broad sense, usually only indicating that there is a connection, coupling, matching or transmission relationship between the two elements, and the connection, coupling, matching or transmission between the two elements can be direct or indirect through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element can be in any orientation such as inside, outside, above, below or on one side of another element, unless the content clearly indicates otherwise. For those skilled in the art, the specific meanings of the above terms in the invention can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used with respect to the exemplary embodiments as they are shown in the figures, with the upward or upper direction toward the top of the corresponding figure, and the downward or lower direction toward the bottom of the corresponding figure.

[0060] The present invention proposes a motion platform for a large substrate, in which a first adsorption component 20 is used as a handover structure for an object to be adsorbed 100. The first adsorption component 20 is lifted and lowered to hand over the object to be adsorbed 100 to a second adsorption component 30. The second adsorption component 30 is used as a wafer carrier to carry the object to be adsorbed 100 and adsorb and fix the object to be adsorbed 100. The first adsorption component 20 can be lowered to below the second adsorption component 30, so that the second adsorption component 30 can rotate over a large range with the rotating seat 10 to facilitate image acquisition.

[0061] In the following embodiments, the first direction Z, the second direction X and the third direction Y are perpendicular to each other; wherein the second direction X and the third direction Y are two horizontal directions perpendicular to each other, the first direction Z corresponds to the vertical direction, the radial direction and the axial direction are based on the rotating seat 10, and the axial direction of the rotating seat 10 is parallel to the first direction Z.

[0062] Embodiment 1:

[0063] The motion platform applied to a large substrate comprises: a rotating seat 10, a first adsorption assembly 20, a second adsorption assembly 30, a base 40 and a rotation driving assembly 50;

[0064] like Figure 1 The figure shows the coarse motion structure of the motion platform; it is mainly used to drive the rotating seat 10, the first adsorption component 20, the second adsorption component 30, the base 40 and the rotating drive component 50 to move long strokes in the first direction Z, the second direction X and the third direction Y.

[0065] The motion platform also includes a marble base 90 and components such as an X-guide rail 91 and a Y-guide rail 92. The second adsorption assembly 30 has the function of a wafer stage, which realizes the movement of the base 40 and other components installed thereon along the second direction X and the third direction Y through the X-guide rail 91 and the Y-guide rail 92.

[0066] The Y-direction guide rail 92 and the first Y-direction motor 93 and the second Y-direction motor 94 are arranged on the marble base 90, the Y-direction guide rail 92 extends along the third direction Y, and the Y-direction guide rail 92 is a heavy axis, wherein the X-direction guide rail 91 is arranged on the Y-direction guide rail 92 so as to be movable along the third direction Y, and the first Y-direction motor 93 and the second Y-direction motor 94 are respectively used to drive the two ends of the X-direction guide rail 91, so that the X-direction guide rail 91 can step along the third direction Y. The Y-direction guide rail 92 adopts two reaction force external introduction mechanisms 95 to introduce the Y-direction impact to the outside world, and the Y-direction movement of the X-direction guide rail 91 can be realized through the flexible bilateral driving of the first Y-direction motor 93 and the second Y-direction motor 94.

[0067] The X-direction guide rail 91 extends along the second direction X, wherein the base 40 is arranged on the X-direction guide rail 91 and can be driven by the X-direction motor to move in a long-stroke stepping motion along the second direction X; the X-direction is a light axis, guided by the lateral air float 96, driven by a linear motor and coordinated with the air foot 97 in the middle position to drive the base 40 to move within the stroke range on the marble base 90.

[0068] In addition, a vertical rough motion structure may be added to drive the base 40 and other components mounted thereon to perform long-stroke motion in the first direction Z.

[0069] In order to facilitate the detection of the moving position of the rotating seat 10, the first adsorption component 20, the second adsorption component 30, the base 40 and the rotating drive component 50 as a whole along the second direction X and the third direction Y, a displacement detection mechanism can also be provided on the marble base 90 in this embodiment to obtain the real-time position.

[0070] Please continue to refer to Figure 2 As shown, it is the micro-motion structure of the motion platform;

[0071] The rotating seat 10 is installed on the base 40 in a manner of being rotatable along its own central axis a; the base 40 is a flat plate structure.

[0072] The first adsorption component 20 is arranged on the base 40 for lifting; the second adsorption component 30 is arranged on the rotating seat 10, and the second adsorption component 30 is provided with a through hole 301 for a part of the first adsorption component 20 to pass through when the first adsorption component 20 is raised; when the first adsorption component 20 is raised, at least a part of it passes through the through hole 301 for adsorbing the object to be adsorbed 100, and when the first adsorption component 20 is lowered, it exits the through hole 301 and is used to transfer the object to be adsorbed 100 to the second adsorption component 30, and the second adsorption component 30 is used to carry and adsorb the object to be adsorbed transferred thereto;

[0073] The rotation driving assembly 50 is disposed on the base 40 and is used to drive the rotating base 10 to rotate around its central axis a.

[0074] The first adsorption component 20 serves as a junction structure of the object to be adsorbed 100, wherein the object to be adsorbed 100 is a substrate or a wafer. The first adsorption component 20 includes a plurality of suction nozzles 21 and a suction base 22, wherein the upper end of the suction nozzle 21 serves as its adsorption end, and each of the suction nozzles 21 is arranged on the adsorption base 22, and the adsorption base 22 is raised and lowered on the base 40 to drive each of the suction nozzles 21 to rise and fall synchronously.

[0075] The suction nozzle 21 can absorb the object to be adsorbed 100 by electrostatic adsorption or vacuum adsorption. In the present embodiment, the suction nozzle 21 adopts the method of vacuum adsorption, wherein the suction nozzle 21 is preferably made of elastic material, and the suction nozzle made of elastic material is particularly suitable for auxiliary adsorption of warped wafers or substrates. In addition, the first adsorption component 20 also includes a suction column 23, which extends along the first direction Z. The suction column 23 is a hollow tubular structure, and its inner cavity serves as an airway. The upper end of the suction column 23 is connected to the suction nozzle 21, and the lower end of the suction column 23 is connected to the adsorption base 22. An airway is provided in the adsorption base 22 and is connected to the inner cavity of the suction column 23. The airway on the adsorption base 22 is connected to the external vacuum device, which is used to evacuate so that a negative pressure environment is formed at the adsorption end of the suction nozzle 21.

[0076] The suction nozzle 21 can be disposed on the base 40 in a manner of being raised and lowered along the first direction Z along with the suction base 22 . The first direction Z is parallel to the central axis a of the rotating base 10 .

[0077] The first adsorption component 20 is located below the second adsorption component 30. A through hole 301 is provided on the second adsorption component 30 along the first direction Z for the suction nozzle 21 to pass through when it is raised or lowered. When the adsorption base 22 is raised along the first direction Z, the suction nozzle 21 is lifted upward through the through hole 301 to receive and adsorb the object 100 to be adsorbed. Then the adsorption base 22 is lowered along the first direction Z, so that the suction nozzle 21 is lowered and exits the through hole 301 downward. At this time, the rotation of the second adsorption component 30 will not be interfered by the suction nozzle 21. Therefore, the second adsorption component 30 can rotate freely to meet the image acquisition requirements of the off-axis camera.

[0078] The middle part of the adsorption base 22 has a mounting hole 221 for mounting the rotating base 10. The rotating base 10 is conformably mounted in the mounting hole 221, and the rotating base 10 is rotatably matched with the adsorption base 22. The outer contour of the rotating base 10 is a cylindrical structure, the mounting hole 221 is a circular hole structure, the outer wall of the rotating base 10 conformably fits the inner wall of the mounting hole 221, the rotating base 10 can rotate relative to the adsorption base 22, and the adsorption base 22 can vertically move up and down relative to the rotating base 10.

[0079] In this embodiment, the adsorption base 22 is a rectangular plate structure, the normal direction of the adsorption base 22 is the vertical direction, and the suction nozzles 21 are arranged in two rows and are respectively parallel to the two opposite edges of the adsorption base 22. This arrangement facilitates the installation of the suction nozzles 21, and also facilitates the positioning of the rectangular large-sized adsorbed parts 100, and is suitable for the adsorption of the rectangular large-sized adsorbed parts 100.

[0080] Please continue to refer to Figure 2As shown, the first adsorption assembly 20 further includes a vertical guide rail 24 and a vertical motor 25. The vertical guide rail 24 is disposed on the base 40 and extends along the first direction Z. The adsorption base 22 can be raised and lowered along the first direction Z and is disposed on the vertical guide rail 24. The vertical motor 25 is disposed on the base 40 and is used to drive the adsorption base 22 to move up and down along the vertical guide rail 24. The number and installation position of the vertical guide rail 24 and the vertical motor 25 can be adaptively adjusted based on actual use requirements.

[0081] Please continue to refer to Figure 2 As shown, the motion platform applied to the large substrate also includes a vertical limiting mechanism 80, and the vertical limiting mechanism 80 is used to limit the lifting stroke of the first adsorption component 20. The vertical limiting mechanism 80 includes a vertical mechanical lower limiting member 81, a vertical mechanical upper limiting member 82, and a vertical grating ruler 83. The vertical mechanical lower limiting member 81 is arranged on the base 40 and is located below the adsorption base 22. The vertical mechanical upper limiting member 82 is arranged on the base 40 and a part of it is located above the adsorption base 22. The vertical mechanical lower limiting member 81 and the vertical mechanical upper limiting member 82 can be limiting blocks that limit their lifting stroke by interfering with the adsorption base 22. The vertical grating ruler 83 is arranged on the base 40 and faces the adsorption base 22 along the first direction Z to measure its lifting position. In addition, in the process of lifting and lowering the adsorption base 22, in order to prevent rigid collision between the adsorption base 22 and the vertical mechanical lower limiter 81 and the vertical mechanical upper limiter 82, in this embodiment, a vertical buffer pad can be provided on the vertical mechanical lower limiter 81 and the vertical mechanical upper limiter 82 to effectively protect the adsorption base 22. The vertical limit mechanism 80 can accurately limit the lifting stroke of the first adsorption assembly 20, thereby ensuring the vertical positioning accuracy of the first adsorption assembly 20 during the process of handing over wafers or substrates.

[0082] Please continue to refer to Figure 2 As shown, the motion platform applied to the large substrate also includes a gravity compensation mechanism 110, which is arranged on the base 40 to provide an upward force to the adsorption base 22. The gravity compensation mechanism 110 can adopt hydraulic cylinder compensation, air flotation compensation, cylinder compensation or other known compensation methods. In this embodiment, the gravity compensation mechanism 110 is a plurality of compensation cylinders supported on the adsorption base 22, so as to improve the stability of the operation of the first adsorption component 20, and reduce the energy consumption generated during the upward acceleration of the first adsorption component 20, which helps to prevent the first adsorption component 20 from falling in the event of a sudden power outage.

[0083] Please continue to refer to Figure 2As shown, the second adsorption component 30 includes a suction cup 31, the bottom of which is fixedly arranged at the upper end of the rotating seat 10, and the upper end of the suction cup 31 has an adsorption area for carrying and adsorbing the part to be adsorbed 100. The suction cup 31 can also be adsorbed by electrostatic adsorption or vacuum adsorption. In this embodiment, vacuum adsorption is adopted, and the upper end surface array of the suction cup 31 is provided with adsorption grooves or adsorption holes to form an adsorption area. On the one hand, the rotating seat 10 is used to drive the suction cup 31 to rotate, and on the other hand, it is also used as a suction cup seat to supply air to the suction cup 31, wherein an airway is arranged in the rotating seat 10, and the airway is connected to the adsorption groove or adsorption hole on the upper surface of the suction cup 31. The rotating seat 10 is a circular ring structure, and a pneumatic slip ring 32 is also arranged in the rotating seat 10, wherein the pneumatic slip ring 32 has a stator and a mover, and its mover is coaxial with the rotating seat 10 and transmission matched, and an airway is arranged in its mover and is connected to the airway of the rotating seat 10. Therefore, during the rotation process, the mover of the pneumatic slip ring 32 rotates synchronously with the rotating seat 10, and the pipes connecting the airways of the two will not be entangled. The airway of the pneumatic slip ring 32 is connected to the external vacuum equipment, so a negative pressure environment can be formed in the adsorption area on the upper surface of the suction cup 31 to achieve the purpose of vacuum adsorption; the pneumatic slip ring 32 can adopt the existing structure, which will not be repeated here.

[0084] Please continue to refer to Figure 2 As shown, in this embodiment, the rotation drive assembly 50 includes a rotation drive member 51, a bearing 52, an adapter 53 and a movable connecting member 54, wherein the bearing 52 is preferably a cross roller bearing, the rotation drive member 51 is preferably a motor, and the adapter 53 is an adapter flange. The adapter 53 is rotatably matched with the base 40 through the bearing 52. The movable connecting member 54 is connected between the adapter 53 and the rotating seat 10, and the movable connecting member 54 is annular and is coaxially arranged with the adapter 53 and the rotating seat 10. The rotation drive member 51 drives the adapter 53 and the movable connecting member 54 to rotate together around the central axis a, and transmits the rotational motion to the rotating seat 10 to drive the rotating seat 10 to rotate.

[0085] A cylindrical first installation cavity 11 is provided in the middle of the rotating seat 10 along the direction of the rotating axis, and at least a part of the adapter 53 is arranged in the first installation cavity 11. The first installation cavity 11 is vertically penetrated in the rotating seat 10, and the first installation cavity 11 is a stepped hole structure, and its large diameter end is connected to the upper end of the rotating seat 10. The upper end surface of the rotating seat 10 is directly connected to the second adsorption component 30 (specifically connected to the suction cup 31), the upper end of the adapter 53 is connected to the shoulder of the first installation cavity 11 through the movable connecting member 54, and the lower end of the adapter 53 is supported on the bearing 52. In addition, the pneumatic slip ring 32 is also arranged in the first installation cavity 11.

[0086] Please continue to refer to Figure 2As shown, the rotation drive assembly 50 also includes a circumferential fixed seat 55, which is annular, so a second installation cavity 551 is vertically arranged on the circumferential fixed seat 55, and the circumferential fixed seat 55 is fixed on the base 40. The rotation drive member 51, the bearing 52 and a part of the adapter 53 are located in the circumferential fixed seat 55 to improve the compactness of the structure and help improve the assembly accuracy. The rotating seat 10 is located above the circumferential fixed seat 55 and has a gap with the circumferential fixed seat 55. Of course, in the actual installation structure, in order to ensure the assembly stability and mutual limiting relationship of the assembly of each component, it is also necessary to add components such as a rotating shaft and a bearing seat, which will not be repeated here.

[0087] Please continue to refer to Figure 2 As shown, in this embodiment, the motion platform applied to the large substrate further includes an angle detection component 70 , and the angle detection component 70 is used to detect the rotation angle of the rotating base 10 .

[0088] The angle detection component 70 may be a circumferential grating ruler 71, wherein the circumferential grating ruler 71 may be arranged on the base 40 or on the rotating seat 10 to detect the angular displacement of the rotating seat 10. In addition, the angle detection component 70 may also include a rotation limit sensor, which is arranged on the base 40, and the rotation limit sensor is used to receive the angular displacement detected by the 71, and to limit the rotation angle of the rotating seat 10. The angle detection component 70 can be used to detect the rotation angle of the rotating seat 10, and the rotation angle is obtained in real time to detect whether the rotation angle meets the requirements of the off-axis camera image acquisition. In addition, the angle detection component 70 can also limit the rotation angle of the rotating seat 10, for example, limiting the rotation angle of the rotating seat 10 to 360°, so as to ensure that the off-axis camera can perform complete image acquisition of the edge position of the adsorbed part 100 located on the suction cup 31.

[0089] The purpose of the rotation of the rotating seat 10 is to ensure that the part to be adsorbed 100 located on the suction cup 31 can be rotated at a large angle to meet the image acquisition requirements of the off-axis camera. Therefore, the rotation angle of the rotating seat 10 is not less than 360°, that is, at least one rotation to ensure that the off-axis camera can perform a complete image capture of the edge of the part to be adsorbed 100 located on the suction cup 31.

[0090] In addition, during the image acquisition process, a camera needs to be used, so the motion platform applied to the large substrate also includes a coaxial camera and an off-axis camera (not shown in the figure). The coaxial camera and the off-axis camera are used to acquire images of the part to be adsorbed 100 located on the second adsorption component 30. The coaxial camera is arranged above the second adsorption component 30, and the coaxial camera is coaxially arranged with the rotating seat 10. The coaxial arrangement here means that the viewing angle center of the coaxial camera coincides with the central axis of the rotating seat 10 itself; the off-axis camera is arranged above the second adsorption component 30, and the off-axis camera is eccentrically arranged relative to the rotating seat 10. Similarly, the eccentric arrangement here means that the viewing angle center of the off-axis camera does not coincide with the central axis of the rotating seat 10 itself. Its viewing angle center can be parallel to the central axis of the rotating seat 10 itself or at an angle. It is generally preferred that the viewing angle center of the off-axis camera is parallel to the central axis of the rotating seat 10 itself.

[0091] The image acquisition requirements can be met by one coaxial camera and one off-axis camera, and there is no need to set up multiple off-axis cameras around the suction cup 21. Under the premise of ensuring that the size of the motion platform remains small, the configuration of the off-axis area array camera can also meet the requirements of full coverage shooting of the substrate or wafer range. The entire motion platform achieves compatibility with the expanded off-axis camera within a smaller range of travel and size, thereby increasing the upper limit of the image acquisition lens magnification.

[0092] Please continue to refer to Figure 2 and Figure 3 As shown, Figure 2 The first adsorption assembly 20 is raised so that the suction nozzle 21 and a part of the suction column 23 pass upward through the through hole 301, and the plurality of suction nozzles 21 are used to connect and adsorb the object 100 to be adsorbed. Figure 3 As shown, the first adsorption component 20 is lowered so that the attached part 100 to be adsorbed is naturally placed on the upper surface of the suction cup 31. At this time, the first adsorption component 20 can pull the attached part 100 downward to make the attached part 100 fit with the upper surface of the suction cup 31, thereby improving the warping phenomenon of the attached part 100. Then, the adsorption area on the upper surface of the suction cup 31 completes the adsorption of the part 100 to be adsorbed. When the adsorption of the suction cup 31 is completed, the vacuuming of the suction nozzle 21 is stopped, so that the suction nozzle 21 is naturally separated from the part 100 to be adsorbed. The first adsorption component 20 continues to be lowered and withdraws from the through hole 301, so that the suction nozzle 21 is lower than the lower surface of the suction cup 31. At this time, the rotation of the suction cup 31 will not interfere with the first adsorption component 20, so the suction cup 31 can rotate freely based on its image acquisition requirements.

[0093] Please refer to Figure 4As shown, the first adsorption component 20 includes at least two rows of suction nozzles 21 arranged in parallel, and at least two rows of the suction nozzles 21 are used to adsorb the two opposite edges of the rectangular adsorbed part 100. The two opposite edges here refer to the edge position of the adsorption surface (generally the lower surface) of the adsorbed part 100 close to one of its opposite sides. When the suction nozzle 21 adsorbs the substrate, due to the large size and thickness of the substrate, the edge will often be warped during the processing, and it is difficult to adsorb the edge of the substrate flat by conventional adsorption methods. In the present invention, the first adsorption component 20 can assist the second adsorption component 30 to complete the adsorption of the warped substrate. Each row of the suction nozzles 21 is arranged on one radial side of the rotating seat 10. When the suction cup 31 of the second adsorption component 30 is adsorbed on the adsorbed part 100, it is ensured that the center of the adsorbed part 100 coincides with the rotation center axis of the rotating seat 10. Then, each row of the suction nozzles 21 is located on one radial side of the rotating seat 10, which can ensure that the suction nozzles 21 are used to adsorb the positions of the adsorbed part 100 away from the center on both sides thereof, so as to be suitable for the adsorption of large-sized adsorbed parts 100.

[0094] Please refer to Figure 5 As shown, in this embodiment, the first adsorption component 20 includes two rows of suction nozzles 21, and each row includes four suction nozzles 21. The suction nozzles 21 are adsorbed on the lower surface of the part to be adsorbed 100, and the two rows of suction nozzles 21 are respectively adsorbed on the lower surface of the part to be adsorbed 100 near its left and right edges, and each row of suction nozzles 21 is parallel to the left and right edges of the part to be adsorbed 100. At this time, during the descent of the first adsorption component 20, when the part to be adsorbed 100 is placed on the suction cup 31, the two rows of suction nozzles 21 apply downward pressure to the left and right edges of the part to be adsorbed 100, so that the warped portion of the edge of the part to be adsorbed 100 is attached to the upper surface of the suction cup 31 to remain flat, and the warped portion of the edge of the part to be adsorbed 100 is adsorbed flatly on the suction cup 31.

[0095] In other alternative embodiments, the first adsorption component 20 may be provided with more rows of suction nozzles 21 , and the number of suction nozzles 21 in each row may be adaptively adjusted based on actual adsorption requirements, for example, two, three or more suction nozzles 21 may be provided in each row.

[0096] Furthermore, the adsorption area at the upper end of the suction cup 31 is rectangular. The upper end surface of the suction cup 31 can be set to a rectangle, and its upper end surface as a whole serves as the adsorption area. The shape of the upper end surface of the suction cup 31 is adapted to the shape of the adsorbed part to be adsorbed or slightly larger than the size of the adsorbed part. Its adsorption area is dedicated to adsorbing larger rectangular substrates, such as 600×600mm or 510×515mm substrates. In this embodiment, the two rows of suction nozzles 21 are parallel to an opposite side of the adsorption area of ​​the upper end surface of the suction cup 31. If the upper end surface of the suction cup 31 is used as the adsorption area as a whole, the two rows of suction nozzles 21 are parallel to an opposite side of the upper end surface of the suction cup 31. Of course, in other implementations, if the suction cup 31 is set in four rows, the four rows of suction cups 31 can be respectively parallel to the four sides of the adsorption area, so that the four rows of suction cups 31 adsorb the four edge positions of the substrate respectively.

[0097] The adsorption base 22 is a rectangular plate structure, and the sides of the adsorption area are respectively arranged parallel to the sides of the adsorption base 22. When adsorbing a large rectangular substrate, it is ensured that the four sides of the substrate are respectively parallel to the four sides of the adsorption area. At this time, the four sides of the substrate are also naturally parallel to the four sides of the adsorption base 22, and then the two rows of suction nozzles 21 are naturally parallel to the two opposite sides of the substrate, so as to achieve the purpose of adsorbing the large rectangular substrate.

[0098] In this embodiment, a semiconductor device is provided, wherein the semiconductor device is equipped with the above-mentioned motion platform applied to a large substrate. The semiconductor device may be a photolithography device, a defect detection device or other semiconductor devices that require a motion platform.

[0099] Please refer to Figure 6 As shown, in this embodiment, an image acquisition method is also provided, comprising the following steps:

[0100] S1: The first adsorption component 20 rises and extends through the through hole of the second adsorption component 30 to adsorb the object to be adsorbed;

[0101] S2: The first adsorption component 20 is lowered to place the object to be adsorbed 100 on the second adsorption component 30. The second adsorption component 30 is used to carry and adsorb the object to be adsorbed thereon. The first adsorption component 20 is lowered outside the through hole. The first adsorption component 20 has a handover function, one of which is used to hand over the part to be adsorbed to the upper end surface of the suction cup 31 of the second adsorption component 30. When the part to be adsorbed is placed on the second adsorption component 30, it should be ensured that the center of the part to be adsorbed passes through the rotation center axis of the second adsorption component 30, that is, the center axis a of the rotating seat 10. In addition, the first adsorption component 20 also has the function of auxiliary warping adsorption. During the descent of the first adsorption component 20, when the part to be adsorbed contacts the upper surface of the suction cup 31 of the second adsorption component 30, the first adsorption component 20 can apply a downward pulling force to the part to be adsorbed so that the warped part is flattened by the upper end of the second adsorption component 30. After the adsorption part is flatly attached to the upper surface of the suction cup 31, the suction cup 31 adsorbs the part to be adsorbed, and then the first adsorption component 20 releases the adsorption of the part to be adsorbed, and the first adsorption component 20 continues to be lowered and retreated to the outside of the through hole;

[0102] S3: The second adsorption component 30 rotates, and the rotation center axis of the second adsorption component 30 extends vertically, and the image of the edge of the adsorption object 100 is collected by an off-axis camera eccentrically arranged above the second adsorption component 30. The second adsorption component 30 rotates at a large angle, and its rotation angle should be at least 360° to ensure that the edge position of the adsorption object can be completely imaged.

[0103] Step S2-1 is also included between step S2 and step S3:

[0104] S2-1: Use a coaxial camera coaxially arranged above the second adsorption component 30 to capture images. The center of the viewing angle of the coaxial camera is directly opposite to the center of the part to be adsorbed. When the size of the part to be adsorbed is small, the viewing angle of the coaxial camera can completely cover the entire part to be adsorbed. When the size of the part to be adsorbed is large, the viewing angle of the coaxial camera cannot completely cover the entire part to be adsorbed. Therefore, it is necessary to determine whether the viewing angle of the coaxial camera completely covers the part to be adsorbed 100; if the part to be adsorbed 100 is completely covered, there is no blind spot in the viewing angle, and the image is captured by the coaxial camera and the process ends. If the part to be adsorbed 100 is not completely covered, there is a blind spot in the viewing angle, and an off-axis camera needs to be connected, then execute step S3. This judgment is used to determine whether the coaxial camera needs to be connected. When the coaxial camera needs to be connected, the rotating seat 10 needs to be adaptively rotated to adjust the posture of the part to be adsorbed.

[0105] Embodiment 2

[0106] The difference between this embodiment and the first embodiment lies in the difference in the gravity compensation mechanism 110 .

[0107] Please refer to Figure 7 As shown, in this embodiment, the gravity compensation mechanism 110 uses magnetic force to compensate the gravity of the adsorption base 22. The gravity compensation mechanism 110 includes a magnetic spring mover 111, a magnetic spring stator 112 and a fixed adapter 113, wherein the fixed adapter 113 is installed on the base 40, the magnetic spring stator 112 is installed on the fixed adapter 113, the magnetic spring mover 111 can move along the first direction Z to cooperate with the magnetic spring stator 112, and the magnetic spring stator 112 drives the magnetic spring mover 111 along the first direction Z to provide an upward force for the adsorption base 22. The gravity compensation mechanism 110 of this structure uses magnetic compensation, which does not require the introduction of positive pressure gas, and can avoid particle contamination caused by the introduction of gas.

[0108] Embodiment 3

[0109] The difference between this embodiment and the first embodiment lies in the addition of a vertical support assembly 60 .

[0110] In this embodiment, the vertical support assembly 60 also substantially serves as the circumferential fixing seat 55 .

[0111] In this embodiment, the movable connecting member 54 is preferably a leaf spring structure, which ensures that the rotating seat 10 can float slightly in the vertical direction.

[0112] Please refer to Figure 8 As shown, the vertical support assembly 60 in this embodiment is similar in structure to the circumferential fixing seat 55 in the first embodiment. The difference is that the vertical support assembly 60 is arranged on the base 40 to provide an upward force to the rotating seat 10 at least in a non-contact manner.

[0113] like Figure 8 As shown, the vertical support assembly 60 is arranged on the base 40 and is located below the rotating seat 10. The vertical support assembly 60 can be an air-floating support. There is a small gap between the upper end of the vertical support assembly 60 and the lower end of the rotating seat 10. Positive pressure gas can be introduced into the gap to provide non-contact upward supporting force for the rotating seat 10 by increasing the air pressure.

[0114] In addition, the vertical support assembly 60 can also be used to provide a downward force for the rotating base 10, and the upward force and the downward force can be applied separately or simultaneously.

[0115] When the vertical support assembly 60 is an air-floating support, its upper end surface is used as an action end to provide an action force for the rotating seat 10. A first action portion and a second action portion may be provided on the upper end surface of the vertical support assembly 60, and a plurality of the first action portion and the second action portion may be provided, and the first action portion and the second action portion are alternately arranged along the circumferential direction on the action end. The first action portion may include a first air hole opened on the upper end surface of the vertical support assembly 60, and the first air hole is used to pass gas to form a positive pressure environment. The second action portion may include a second air hole opened on the upper end surface of the vertical support assembly 60, and the second air hole is used to suck out gas to form a negative pressure environment.

[0116] When the upward force is applied alone, the gas can be introduced through the single first air hole;

[0117] When the upward force and the downward force are applied simultaneously, the first air hole is used to let in gas, and the second air hole sucks out gas, the downward force should be smaller than the upward force. At this time, the rotating seat 10 as a whole is still subjected to the upward comprehensive force to ensure that the rotating seat 10 does not contact the vertical support assembly 60;

[0118] When a downward force is applied alone, the gas can be sucked out through the second air hole alone.

[0119] Since the movable connecting member 54 is a leaf spring structure, it is ensured that the rotating seat 10 can slightly float in the vertical direction. Therefore, when the rotating seat 10 is subjected to an upward comprehensive force as a whole, and the force is greater than the vertical load of the rotating seat 10, the rotating seat 10 can move slightly upward vertically to ensure that the rotating seat 10 and the vertical support assembly 60 maintain a small gap; when the rotating seat 10 is subjected to a downward comprehensive force as a whole, the rotating seat 10 contacts the vertical support assembly 60, which can prevent the rotating seat 10 from rotating, which is conducive to the locking of the rotating seat 10.

[0120] When the upward force and the downward force are applied at the same time, the upward force is used to compensate for its gravity to reduce the force acting on the bearing, which is beneficial to improve the stability of the rotating seat 10 during rotation and extend the service life of the bearing; the downward force can increase the rigidity of the wafer stage assembly and further ensure the stability of the rotating seat 10.

[0121] When the downward force acts on the rotating seat 10 alone, the rotating seat 10 can be adsorbed and locked, so that the rotating seat 10 can be mechanically locked at any rotation angle. At the same time, it can also ensure that when the equipment is powered off or the power is abnormally cut off, the rotating seat 10 can be quickly shut down to eliminate safety hazards.

[0122] The vertical support assembly 60 can be a magnetic support, which can be a pair of same-sex magnetic suctions, one magnetic suction is connected to the bottom of the rotating seat 10, and the other magnetic suction is connected to the top of the circumferential fixed seat 55. The repulsive magnetic force generated by the two provides a non-contact upward support force for the rotating seat 10.

[0123] The vertical action component 60 may include, for example, a first magnetic attraction and a second magnetic attraction, one of which is arranged at the lower end of the rotating seat 10, and the other is arranged at the base 20, at least one of the first magnetic attraction and the second magnetic attraction has a changeable magnetic pole, and the first magnetic attraction and the second magnetic attraction are arranged vertically opposite each other.

[0124] The first magnetic attraction and the second magnetic attraction can be arranged in multiple groups along the circumference of the rotating seat 10, and are arranged one by one. By changing the magnetic poles of several of the second magnetic attractions, preferably, the arrangement of several second magnetic attractions is arranged with different magnetic poles at intervals. A part of the second magnetic attraction is the same as the magnetic pole of the corresponding first magnetic attraction, which is used to provide an upward magnetic attraction force for the rotating seat 10, wherein the upward magnetic attraction force is used to compensate for its gravity to reduce the force acting on the bearing, which is beneficial to improve the stability of the wafer stage assembly during rotation and extend the service life of the bearing; another part of the second magnetic attraction is opposite to the magnetic pole of the corresponding first magnetic attraction, which is used to provide a downward magnetic attraction force for the rotating seat 10, and the downward magnetic attraction force can improve the rigidity of the wafer stage assembly and further ensure the stability of the wafer stage. In addition, it should be ensured that the upward magnetic attraction force is greater than the downward magnetic attraction force, so that the vertical action component 60 provides an upward force to the rotating seat 10 in a non-contact manner.

[0125] The vertical acting component 60 provides both upward magnetic attraction and downward magnetic attraction for the rotating seat 10. In addition, the magnetic attraction of the first magnetic attraction and the second magnetic attraction can be adjusted so that the magnetic attraction of the two is the same, and the upward magnetic attraction is provided alone to compensate for the gravity of the rotating seat 10.

[0126] When the equipment is in an abnormal situation, the vertical action component 60 can provide a downward magnetic attraction force to the rotating seat 10 alone. At this time, the magnetic poles of all the second magnetic attraction can be adjusted to be opposite to the magnetic poles of the first magnetic attraction, or part of the second magnetic attraction can be powered off, and the magnetic poles of the other part of the second magnetic attraction can be adjusted to be opposite to the magnetic poles of the first magnetic attraction. At this time, the vertical action component 60 provides a downward magnetic attraction force to the rotating seat 10 alone, and the rotating seat 10 moves slightly vertically downward, so that the first magnetic attraction is adsorbed on the second magnetic attraction, and the rotating seat 10 is locked on the base 20.

[0127] In addition, the vertical support assembly 60 can also be arranged above the rotating seat. At this time, the lower end of the vertical support assembly 60 serves as the action end, which can provide a force for the upper end of the rotating seat. At this time, an upward force is provided by magnetic attraction, and a downward force is provided by magnetic repulsion, or an upward force is provided by a negative pressure environment, and a downward force is provided by a pressurized environment. The force application principle is similar to the above and will not be elaborated here.

[0128] Embodiment 4

[0129] The difference between this embodiment and the first embodiment is that the synchronization of the lifting and lowering of each suction nozzle 21 in the first suction assembly 20 is different.

[0130] In the first embodiment, each suction nozzle 21 is disposed on the suction base 22 and rises and falls synchronously with the suction base 22 .

[0131] In this embodiment, each suction nozzle 21 is individually configured with a lifting drive mechanism, for example, each suction nozzle 21 is respectively configured with a lifting motor, so that each suction nozzle 21 can be lifted and lowered individually. At this time, a part of the suction nozzles 21 can be flexibly selected to be lifted and lowered, and regional auxiliary adsorption control can be implemented for substrates with different degrees of warping.

[0132] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0133] The above description is only a description of the preferred embodiments of the invention, and is not intended to limit the scope of the invention. Any changes or modifications made by a person of ordinary skill in the art based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A motion platform for a large substrate, characterized in that: include: A rotating seat, a first adsorption assembly, a second adsorption assembly, a base, and a rotating drive assembly; The rotating seat is mounted on the base in a manner that it can rotate along its own central axis, and the central axis of the rotating seat extends vertically; The first adsorption component is arranged on the base for lifting; the second adsorption component is arranged on the rotating seat, and the second adsorption component is provided with a through hole for a part of the first adsorption component to pass through when the first adsorption component is raised; when the first adsorption component is raised, at least a part of it passes through the through hole for adsorbing the object to be adsorbed, and when the first adsorption component is lowered, it exits the through hole and is used to transfer the object to be adsorbed to the second adsorption component, and the second adsorption component is used to carry and adsorb the object to be adsorbed transferred thereto; The rotation driving assembly is arranged on the base and is used to drive the rotating seat to rotate around its own central axis.

2. The motion platform for a large substrate as claimed in claim 1, characterized in that: The motion platform applied to the large substrate further comprises a vertical support assembly, which is arranged on the base and used to provide an upward force for the rotating seat in a non-contact manner.

3. The motion platform for a large substrate as claimed in claim 1, characterized in that: The first adsorption assembly comprises at least two rows of suction nozzles arranged in parallel, and the at least two rows of suction nozzles are respectively used to adsorb two opposite edges of a rectangular object to be adsorbed.

4. The motion platform for a large substrate as claimed in claim 3, characterized in that: Each row of the suction nozzles is arranged on one radial side of the rotating base.

5. The motion platform for a large substrate as claimed in claim 3, characterized in that: The first adsorption assembly also includes an adsorption base, and each of the adsorption nozzles is arranged on the adsorption base. The adsorption base is arranged on the base for lifting and lowering to drive each of the adsorption nozzles to rise and fall synchronously.

6. The motion platform for a large substrate as claimed in claim 5, characterized in that: The middle part of the adsorption base is provided with an installation hole for installing the rotating seat, the rotating seat is conformably installed in the installation hole, and the rotating seat is rotationally matched with the adsorption base.

7. The motion platform for a large substrate as claimed in claim 5, characterized in that: The adsorption base is in a rectangular plate structure, and the adsorption nozzles are arranged in two rows and are respectively parallel to two opposite edges of the adsorption base.

8. The motion platform applied to a large substrate as claimed in claim 5, characterized in that: The motion platform applied to the large substrate further comprises a gravity compensation mechanism, which is arranged on the base and used to provide an upward force to the adsorption base.

9. The motion platform for a large substrate according to any one of claims 1 to 8, characterized in that: The second adsorption assembly includes a suction cup, which is arranged on the rotating seat. The upper end of the suction cup has an adsorption area for carrying and adsorbing the object to be adsorbed.

10. The motion platform applied to a large substrate as claimed in claim 9, characterized in that: The adsorption area is rectangular.

11. The motion platform for a large substrate as claimed in claim 9, characterized in that: When the adsorption base is in a rectangular plate structure, each side of the adsorption area is arranged parallel to each side of the adsorption base.

12. The motion platform applied to a large substrate as claimed in claim 10, characterized in that: When the first adsorption assembly includes at least two rows of adsorption nozzles arranged in parallel, the two rows of adsorption nozzles are parallel to an opposite side of the adsorption area.

13. The motion platform for a large substrate according to any one of claims 1 to 8, characterized in that: The rotation drive assembly includes a rotation drive member, an adapter member and a movable connecting member. The rotation drive member is used to drive the adapter member to rotate. The adapter member is connected to the rotating seat through the movable connecting member.

14. The motion platform for a large substrate as claimed in claim 13, characterized in that: A first installation cavity is vertically opened on the rotating seat, and at least a part of the adapter is arranged in the first installation cavity.

15. The motion platform applied to a large substrate as claimed in claim 1, characterized in that: The motion platform applied to the large substrate further comprises a vertical support component, which is arranged on the base and is at least used to provide an upward force for the rotating seat in a non-contact manner.

16. The motion platform applied to a large substrate as claimed in claim 15, characterized in that: A second installation cavity is vertically arranged on the vertical support assembly, and at least a portion of the rotation drive assembly is installed in the second installation cavity.

17. The motion platform for a large substrate as claimed in claim 1, characterized in that: The rotation angle of the rotating seat is not less than 360°.

18. The motion platform applied to a large substrate as claimed in claim 1, characterized in that: The motion platform applied to the large substrate also includes a coaxial camera and an off-axis camera, and the coaxial camera and the off-axis camera are used to capture images of the part to be adsorbed on the second adsorption component. The coaxial camera is arranged above the second adsorption component, and the coaxial camera is arranged coaxially with the rotating seat. The off-axis camera is arranged above the second adsorption component, and the off-axis camera is eccentrically arranged relative to the rotating seat.

19. The motion platform for a large substrate as claimed in claim 1, characterized in that: The motion platform applied to the large substrate further comprises an angle detection component, and the angle detection component is used to detect the rotation angle of the rotating seat.

20. The motion platform applied to a large substrate as claimed in claim 1, characterized in that: The motion platform applied to the large substrate further comprises a vertical limiting mechanism, and the vertical limiting mechanism is used to limit the lifting stroke of the first adsorption component.

21. A semiconductor device, characterized in that: The semiconductor device is equipped with a motion platform applied to a large substrate as described in any one of claims 1 to 20.

22. An image acquisition method, characterized in that: The following steps are involved: S1: The first adsorption component rises and extends through the through hole of the second adsorption component to adsorb the object to be adsorbed; S2: the first adsorption component is lowered to place the object to be adsorbed on the second adsorption component, the second adsorption component is used to carry and adsorb the object to be adsorbed thereon, and the first adsorption component is lowered outside the through hole; S3: The second adsorption component rotates, and the rotation center axis of the second adsorption component extends vertically, and an off-axis camera eccentrically arranged above the second adsorption component collects an image at the edge of the object to be adsorbed.

23. The image acquisition method according to claim 22, characterized in that: The following steps are also included between step S2 and step S3: Use a coaxial camera coaxially arranged above the second adsorption component to capture images, and determine whether the viewing angle of the coaxial camera completely covers the part to be adsorbed; if the part to be adsorbed is completely covered, the process ends after the coaxial camera captures the image; if the part to be adsorbed is not completely covered, execute step S3.

Images