Wafer adsorption device, wafer adsorption method and detection equipment

Abstract

The embodiment of the invention provides a wafer adsorption device, a wafer adsorption method and detection equipment, and the wafer adsorption device comprises a mechanical arm main body; the connecting arm is connected with the mechanical arm main body, and the connecting arm comprises a first fork tooth and a second fork tooth; at least two first adsorption pads are arranged at the tail end of the first fork tooth; the heightening structure is arranged at the tail end of the second fork tooth, and at least one second adsorption pad is arranged on the heightening structure; the first adsorption pad and the second adsorption pad are used for fixing a wafer through vacuum adsorption. According to the technical scheme provided by the embodiment of the invention, the success rate of adsorbing the wafer by the wafer adsorption device can be improved, so that the wafer can be safely taken and placed.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor manufacturing technology, and specifically to a wafer adsorption device, a wafer adsorption method and a detection device. Background Art

[0002] With the development of integrated circuit chip technology, the integrated circuits inside the wafer are becoming more and more dense, and the stacked layers are getting higher and higher, resulting in increasing wafer warpage. Correspondingly, there are increasingly higher requirements for the ability of the wafer suction device to pick up and place the warped wafer. For example, a wafer suction device that realizes wafer picking and placing based on vacuum suction.

[0003] Therefore, in this context, how to provide a technical solution to improve the success rate of wafer adsorption by the wafer adsorption device so as to safely take and place the wafer has become a technical problem that technical personnel in this field urgently need to solve. Summary of the invention

[0004] In view of this, an embodiment of the present invention provides a wafer adsorption device, a wafer adsorption method and a detection device to improve the success rate of the wafer adsorption device in adsorbing the wafer so as to safely take and place the wafer.

[0005] To achieve the above objectives, the embodiments of the present invention provide the following technical solutions.

[0006] In a first aspect, an embodiment of the present invention provides a wafer adsorption device, comprising:

[0007] The main body of the robotic arm;

[0008] A connecting arm connected to the robot arm body, the connecting arm comprising a first fork tine and a second fork tine; at least two first adsorption pads are arranged at the end of the first fork tine;

[0009] A heightening structure, disposed at the end of the second fork tine, and at least one second adsorption pad is disposed on the heightening structure;

[0010] The first adsorption pad and the second adsorption pad are used to fix the wafer by vacuum adsorption.

[0011] In a second aspect, an embodiment of the present invention provides a wafer adsorption method, which is applied to the wafer adsorption device described in the first aspect, comprising:

[0012] Provide wafers;

[0013] The wafer is adsorbed by using the connecting arm of the wafer adsorption device through the first adsorption pad and the second adsorption pad on the first fork tine and the second fork tine of the connecting arm.

[0014] In a third aspect, an embodiment of the present invention provides a detection device, including: a wafer adsorption device as described in the first aspect.

[0015] A wafer adsorption device provided by an embodiment of the present invention includes: a robotic arm main body; a connecting arm connected to the robotic arm main body, the connecting arm including a first fork tine and a second fork tine; at least two first adsorption pads are arranged at the end of the first fork tine; an enhanced structure is arranged at the end of the second fork tine, and at least one second adsorption pad is arranged on the enhanced structure; the first adsorption pad and the second adsorption pad are used to fix the wafer by vacuum adsorption.

[0016] It can be seen that the technical solution provided by the embodiment of the present invention can increase the height of the second adsorption pad disposed thereon from the main body of the robotic arm due to the addition of a heightening structure at the end of the second fork of the connecting arm. On the basis of the original structure of the connecting arm, an heightening structure is added to extend the height of the second adsorption pad, so that when the wafer is adsorbed by the wafer adsorption device, the back of the warped wafer can completely fit the second adsorption pad and the first adsorption pad, increasing the contact area and pressure distribution between the first adsorption pad, the second adsorption pad and the back of the wafer, and improving the adsorption strength, so that the wafer can be safely grasped. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0018] Figure 1 is a structural schematic diagram of a wafer adsorption device provided by an embodiment of the present invention;

[0019] Figure 2 It is a schematic diagram of a commonly used wafer adsorption device;

[0020] Figure 3 It is a schematic diagram of a process of a wafer adsorption method provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] Wafer suction device is a technology used to fix and hold wafers in the semiconductor manufacturing process, which is crucial to ensure chip production efficiency and product quality. Wafer suction device needs to accurately fix the wafer for etching, deposition or photolithography processes. Common wafer suction devices include mechanical vacuum suction type wafer suction device, electrostatic suction (Electrostatic Chuck, ESC) type wafer suction device and Bernoulli chuck type wafer suction device.

[0023] Among them, the wafer adsorption device of mechanical vacuum adsorption creates a negative pressure environment through a vacuum pump and uses the suction force generated in the vacuum area to stably adsorb the wafer. The advantages of this method include high reliability, strong versatility, and relatively simple maintenance. However, it also has potential damage risks, especially for fragile or ultra-thin wafers.

[0024] The wafer adsorption device of electrostatic adsorption generates an electric field by applying voltage to the electrode under the adsorption surface, thereby generating an electrostatic attraction between the wafer and the adsorption surface. This adsorption method does not require physical contact with the wafer, reducing the risk of mechanical damage and contamination. Electrostatic adsorption can precisely control the adsorption force to adapt to different applications and process requirements.

[0025] The Bernoulli chuck type wafer adsorption device is designed based on the Bernoulli principle. The wafer is attracted to the robot arm (Chuck) and suspended above the airflow through the low pressure area generated by the high-speed airflow on the wafer surface. This method can reduce the physical contact between the wafer adsorption device and the wafer, reducing the risk of mechanical damage and contamination. The Bernoulli chuck can work stably in various temperature and chemical environments, but the cost is high and the requirements for wafer flatness are also high.

[0026] However, with the development of integrated circuit chip technology, the integrated circuits inside the wafer are becoming more and more dense, and the stacked layers are getting higher and higher, resulting in increasing wafer warpage. When the wafer adsorption device grabs a wafer with a large bow, the back of the wafer cannot be fully attached, resulting in failure to grab the wafer.

[0027] In order to solve the above technical problems, an embodiment of the present invention provides a wafer adsorption device, which is used to improve the success rate of the wafer adsorption device in adsorbing wafers, so as to safely take and place wafers.

[0028] Please refer to Figure 1 , Figure 1 It is a structural schematic diagram of a wafer adsorption device provided in an embodiment of the present invention.

[0029] like Figure 1 The wafer adsorption device 1 comprises:

[0030] A robot arm body 11;

[0031] The connecting arm 12 is connected to the main body 11 of the robotic arm. The connecting arm 12 includes a first fork tooth 121 and a second fork tooth 122. At least two first adsorption pads 131 are provided at the end of the first fork tooth 121;

[0032] The heightening structure 13 is provided at the end of the second fork tooth 122. At least one second adsorption pad 132 is provided on the heightening structure 13;

[0033] The first adsorption pad 131 and the second adsorption pad 132 are used to fix the wafer by vacuum adsorption.

[0034] The heightening structure 13 can increase the height H' of the second adsorption pad 132 from the main body 11 of the robotic arm, so as to change the contact area and pressure distribution between the second adsorption pad 132 and the first adsorption pad 131 and the back surface of the wafer, thereby possibly improving the adsorption force.

[0035] For the convenience of reflecting the structural characteristics of the wafer adsorption device improved in the embodiment of the present invention, please refer to Figure 2 , Figure 2 which is a schematic structural diagram of a commonly used wafer adsorption device.

[0036] As Figure 2 shown, it can be seen that the position of the second adsorption pad 132 provided on the second fork tooth 122 is relatively low. Therefore, when facing a warped wafer, since the height H of the second adsorption pad 132 is relatively low (H < H'), the contact area between the first adsorption pad 131, the second adsorption pad 132 and the back surface of the wafer is relatively small, so that the adsorption force is relatively small. As a result, when the wafer adsorption device moves the wafer after adsorbing the wafer, the wafer may fall off, or when the wafer adsorption device 1 grabs the wafer, the wafer may fall off.

[0037] Therefore, in the embodiment of the present invention, without changing the height of the second fork tooth 122, a heightening structure 13 is added to arrange the second adsorption pad 132 on the heightening structure 13, so as to increase the height of the second adsorption pad 132, and further increase the contact area between the first adsorption pad 131, the second adsorption pad 132 and the back surface of the wafer, increase the adsorption force, and ensure the safe adsorption of the wafer.

[0038] The preparation material and structural characteristics of the heightening structure 13 can be the same as those of the second fork tooth 122, so as to facilitate the manufacture of the heightening structure 13 and the use of the second adsorption pad 132.

[0039] It can be seen that the technical solution provided by the embodiment of the present invention can increase the height of the second adsorption pad 132 arranged on the increasing structure 13 from the robot arm body 11 because the increasing structure 13 is added to the end of the second fork tine 122 of the connecting arm 12. On the basis of the original structure of the connecting arm 12, the increasing structure 13 is added to extend the height of the second adsorption pad 132, so that when the wafer adsorption device 1 is used to adsorb the wafer, the back of the warped wafer can completely fit the second adsorption pad 132 and the first adsorption pad 131, increase the contact area and pressure distribution between the first adsorption pad 131, the second adsorption pad 132 and the back of the wafer, and improve the adsorption strength, so that the wafer can be safely grasped.

[0040] In order to increase the height of the second adsorption pad 132, in one embodiment, the height of the second adsorption pad 132 far from the end of the second fork tooth 122 among each of the second adsorption pads 132 and the distance from the robot arm body 11 tends to be closer to the height of the first adsorption pad 131 close to the end of the first fork tooth 121 among each of the first adsorption pads 131 and the distance from the robot arm body 11.

[0041] That is, the height of the height-increasing structure 13 can make the second adsorption pad 132 be disposed at the same position as the first adsorption pad 131 close to the end of the first fork tine 121 .

[0042] Further, in some embodiments, Figure 1 As shown, the setting position of the first adsorption pad 131 close to the end of the first fork tine 121 and the setting position of the second adsorption pad 132 far from the end of the second fork tine 122 are located on the same horizontal line L.

[0043] The height of the second adsorption pad 132 is maximized, so that the contact area between the first adsorption pad 131, the second adsorption pad 132 and the back side of the wafer can be further increased, thereby increasing the adsorption strength and achieving safe placement of the wafer.

[0044] In order to realize the wafer adsorption function of the wafer adsorption device, in one embodiment, the wafer adsorption device 1 may further include:

[0045] A vacuum pipe is disposed inside the first adsorption pad and the second adsorption pad, and is used to provide a vacuum environment so that the first adsorption pad and the second adsorption pad adsorb the wafer;

[0046] A vacuum hole is provided on the first adsorption pad and the second adsorption pad and is communicated with the vacuum pipe.

[0047] The first adsorption pad (PAD) and the second adsorption pad are provided with vacuum holes, and the first adsorption pad and the second adsorption pad are in direct contact with the back side of the wafer. The vacuum holes can be connected to a vacuum pipe, and the air between the first adsorption pad and the second adsorption pad and the wafer is extracted by a vacuum pump to form a low-pressure area, thereby generating an adsorption force, so that the back side of the wafer can be stably fixed on the first adsorption pad and the second adsorption pad. In this way, the wafer remains stable during transportation and processing, while reducing physical damage to the wafer.

[0048] In order to facilitate fixing the first adsorption pad and the second adsorption pad, in one embodiment, the wafer adsorption device 1 further includes:

[0049] A fixing device is used to fix the first adsorption pad to the end of the first fork tine.

[0050] Exemplarily, the fixing device may be a screw.

[0051] In order to ensure the sealing of the vacuum environment, in one embodiment, the wafer adsorption device 1 further includes:

[0052] The sealing ring is located at the edge of the first adsorption pad and the second adsorption pad.

[0053] The sealing ring is arranged at the edge of the first adsorption pad and the second adsorption pad to ensure the sealing between the wafer and the first adsorption pad and the second adsorption pad when the wafer is adsorbed, to prevent air leakage, and thus to ensure the effect of vacuum adsorption.

[0054] Of course, in other embodiments, the sealing ring can also be located at the connection between the first adsorption pad and the second adsorption pad and the first fork and the increased structure to ensure that during the wafer transportation process, the connection between the first adsorption pad and the second adsorption pad and the first fork and the second fork (this is due to the connection design of the increased structure and the second fork) is sealed to prevent the wafer from being contaminated during transportation.

[0055] To ensure that the first adsorption pad and the second adsorption pad have good adsorption force, in one embodiment, the material of the first adsorption pad and the second adsorption pad is silica gel material.

[0056] Of course, in other embodiments, the materials of the first adsorption pad and the second adsorption pad may also be:

[0057] Polyurethane: has excellent elasticity and abrasion resistance and can be used in applications such as sealing and insulation.

[0058] Chloroprene: Also known as chloroprene rubber (Neoprene), it is oil and cold resistant and suitable for some sealing and waterproofing applications.

[0059] Polypropylene: A chemical-resistant, lightweight, high-temperature plastic suitable for some industrial applications.

[0060] Fluororubber: It has excellent chemical corrosion resistance and is often used in high temperature and highly corrosive environments.

[0061] Polysulfide rubber: It has good oil and solvent resistance and can replace silicone in some sealing and insulation applications.

[0062] Nitrile rubber: has good oil resistance and is suitable for many sealing and vibration absorption applications.

[0063] Acrylates: Suitable for use in some construction sealants and adhesives.

[0064] Fluorocarbon rubber: has excellent high temperature and oil resistance, suitable for high temperature sealing.

[0065] The selection of the material of the first adsorption pad and the second adsorption pad depends on the specific application requirements, performance requirements and cost considerations. For example, if high temperature resistance and chemical corrosion resistance are required, fluororubber or fluorocarbon rubber may be selected. If the application requires good elasticity and wear resistance, polyurethane may be a suitable choice.

[0066] In order to make the wafer adsorption device have a better adsorption effect, in one embodiment, the number of the first adsorption pads is 2, the number of the second adsorption pads is 1, and the distribution shape of the first adsorption pads and the second adsorption pads is triangular.

[0067] The triangular distribution shape of the first adsorption pad and the second adsorption pad has many advantages in the wafer adsorption device 1, such as improving stability, evenly distributing adsorption force, adapting to the warpage of the wafer surface, improving adsorption effect, and avoiding damage to the wafer.

[0068] To enhance the flexible design of the first adsorption pad and the second adsorption pad, in one embodiment, the first adsorption pad and the second adsorption pad are circular, elliptical or polygonal in shape.

[0069] The embodiment of the present invention also provides a wafer adsorption method, which uses the wafer adsorption device provided in the above embodiment to complete the adsorption of the wafer. Figure 3 , Figure 3 It is a schematic diagram of a process of a wafer adsorption method provided by an embodiment of the present invention.

[0070] like Figure 3 As shown, the method comprises the following steps:

[0071] Step S100, providing a wafer.

[0072] Step S101 , using the connecting arm of the wafer adsorption device to adsorb the wafer via the first adsorption pad and the second adsorption pad on the first fork tine and the second fork tine of the connecting arm.

[0073] It can be seen that the technical solution provided by the embodiment of the present invention is that in the wafer adsorption device, a heightening structure is added at the end of the second fork of the connecting arm, so that the height of the second adsorption pad arranged thereon from the main body of the mechanical arm can be increased. Thus, on the basis of the original structure of the connecting arm, a heightening structure is added to extend the height of the second adsorption pad, and then when the wafer is adsorbed by the wafer adsorption device, the back of the warped wafer can completely fit the second adsorption pad and the first adsorption pad, increasing the contact area and pressure distribution between the first adsorption pad, the second adsorption pad and the back of the wafer, and improving the adsorption strength, so that the wafer can be safely grasped.

[0074] The embodiment of the present invention further provides a detection device to ensure the stable progress of the semiconductor manufacturing process based on the reliable and stable operation of the wafer adsorption device provided by the above-mentioned embodiment.

[0075] The detection equipment comprises:

[0076] A wafer adsorption device as described in any of the aforementioned embodiments.

[0077] It can be seen that the technical solution provided by the embodiment of the present invention, because in the wafer adsorption device, a heightening structure is added to the end of the second fork of the connecting arm, so that the height of the second adsorption pad arranged on the heightening structure from the main body of the mechanical arm can be increased. On the basis of the original structure of the connecting arm, a heightening structure is added to extend the height of the second adsorption pad, so that when the wafer adsorption device is used to adsorb the wafer, the back of the warped wafer can completely fit the second adsorption pad and the first adsorption pad, increase the contact area and pressure distribution between the first adsorption pad, the second adsorption pad and the back of the wafer, and improve the adsorption strength, so that the wafer can be safely grasped; thereby ensuring the stable operation of the detection equipment.

[0078] The above describes multiple implementation schemes provided by the embodiments of the present invention. The various optional methods introduced in the implementation schemes can be combined and cross-referenced with each other without conflict, thereby extending a variety of possible implementation schemes, which can all be considered as implementation schemes disclosed and open in the embodiments of the present invention.

[0079] Although the embodiments of the present invention are disclosed above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A wafer adsorption device, characterized in that: include: The main body of the robotic arm; A connecting arm connected to the robot arm body, the connecting arm comprising a first fork tine and a second fork tine; at least two first adsorption pads are arranged at the end of the first fork tine; A heightening structure, disposed at the end of the second fork tine, and at least one second adsorption pad is disposed on the heightening structure; The first adsorption pad and the second adsorption pad are used to fix the wafer by vacuum adsorption.

2. The wafer adsorption device according to claim 1, characterized in that: The height of the second adsorption pad far from the end of the second fork tooth in each of the second adsorption pads from the robot arm body tends to be close to the height of the first adsorption pad close to the end of the first fork tooth in each of the first adsorption pads from the robot arm body.

3. The wafer adsorption device according to claim 2, characterized in that: Also includes: A vacuum pipe is disposed inside the first adsorption pad and the second adsorption pad, and is used to provide a vacuum environment so that the first adsorption pad and the second adsorption pad adsorb the wafer; A vacuum hole is provided on the first adsorption pad and the second adsorption pad and is communicated with the vacuum pipe.

4. The wafer adsorption device according to claim 3, characterized in that: Also includes: A fixing device is used to fix the first adsorption pad to the end of the first fork tine.

5. The wafer adsorption device according to claim 4, characterized in that: The fixing device is a screw.

6. The wafer adsorption device according to claim 5, characterized in that: Also includes: The sealing ring is located at the edge of the first adsorption pad and the second adsorption pad.

7. The wafer adsorption device according to any one of claims 1 to 6, characterized in that: The first adsorption pad and the second adsorption pad are made of silica gel material.

8. The wafer adsorption device according to any one of claims 2 to 6, characterized in that: The setting position of the first adsorption pad close to the end of the first fork tine and the setting position of the second adsorption pad far from the end of the second fork tine are located on the same horizontal line.

9. The wafer adsorption device according to claim 8, characterized in that: The number of the first adsorption pads is 2, the number of the second adsorption pads is 1, and the distribution shape of the first adsorption pads and the second adsorption pads is triangular.

10. The wafer adsorption device according to claim 8, characterized in that: The first adsorption pad and the second adsorption pad are in a circular, elliptical or polygonal shape.

11. A wafer adsorption method, characterized in that: The wafer adsorption device according to any one of claims 1 to 10 comprises: Provide wafers; The wafer is adsorbed by using the connecting arm of the wafer adsorption device through the first adsorption pad and the second adsorption pad on the first fork tine and the second fork tine of the connecting arm.

12. A detection device, characterized in that: include: A wafer adsorption device as described in any one of claims 1 to 10.

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