Wafer clamping device and wafer clamping method

Abstract

The invention provides a wafer clamping device and a wafer clamping method. According to the device, a plurality of first rotating pieces are arranged on a base; the plurality of clamping pieces are respectively arranged on the plurality of first rotating pieces and are used for clamping wafers; the second rotating piece and the base are coaxially arranged, and the second rotating piece is in transmission connection with the first rotating piece; the driving motor is used for driving the base and the second rotating piece to rotate relatively so as to drive the first rotating piece to rotate around the rotating shaft of the first rotating piece and enable the clamping piece to rotate along with the first rotating piece to be located at any position between the closing position and the opening position; the elastic piece is provided with a first end and a second end, the first end is fixedly connected with the base, the second end is fixedly connected with the second rotating piece, and the elastic piece is used for applying resilience force between the base and the second rotating piece; when the clamping piece is rotated to the opening position, the limiting piece is used for preventing the base and the second rotating piece from rotating relatively under the action of resilience force of the elastic piece, so that the clamping piece is kept at the opening position.

Description

Technical Field

[0001] The present application mainly relates to the field of semiconductor technology, and in particular to a wafer clamping device and a wafer clamping method. Background Art

[0002] In a wafer processing chamber, a wafer clamping device (or chuck) is generally used to clamp the wafer and drive the wafer to rotate for various processes. In order to clamp the wafer, a number of clamps are usually set on the circumference of the chuck, and the driving mechanism drives the clamps to open, and the robot places the wafer between the clamps. In the following scenarios, the driving mechanism needs to keep the clamps in an open state: (1) When placing the wafer, the robot needs to be debugged so that the robot can accurately place the wafer between the clamps; (2) Due to process requirements, the clamps need to be kept open when the machine is in the idle state. According to the current wafer clamping machine, in order to maintain the clamp in the open state, the drive motor needs to continuously output a large torque, which consumes a large amount of energy. Summary of the invention

[0003] The technical problem to be solved by the present application is to provide a wafer clamping device and a wafer clamping method that save energy.

[0004] To solve the above technical problems, the first aspect of the present application provides a wafer clamping device, comprising: a base, a driving motor, a plurality of first rotating members, a plurality of clamping members, a second rotating member, a limiting member and an elastic member, wherein the plurality of first rotating members are arranged on the base; the plurality of clamping members are respectively arranged on the plurality of first rotating members for clamping wafers; the second rotating member is coaxially arranged with the base, and the second rotating member is transmission-connected with the first rotating member; the driving motor is used to drive the base and the second rotating member to rotate relative to each other, so as to drive the first rotating member to rotate around its own rotating axis, and to make the clamping member rotate with the first rotating member to be in any position between the closed position and the open position; the elastic member has a first end and a second end, the first end is fixedly connected to the base, and the second end is fixedly connected to the second rotating member, so as to apply a rebound force between the base and the second rotating member; wherein, when the clamping member is rotated to the open position, the limiting member is used to prevent the base and the second rotating member from rotating relative to each other under the rebound force of the elastic member, so as to keep the clamping member in the open position.

[0005] The first aspect of the present application provides a wafer clamping method, which is applied to the wafer clamping device as described above, including: the driving motor drives the base to rotate along a first direction relative to the second rotating member, so as to drive the first rotating member to rotate around its own rotation axis, so that the clamping member is rotated to an open position; the limit member is used to prevent the base from rotating along a second direction relative to the second rotating member, so that the clamping member is maintained in the open position, wherein the second direction is opposite to the first direction; and the driving motor is turned off.

[0006] The wafer clamping device of the present application can maintain the balance of force when clamping the wafer by setting an elastic member to apply a rebound force between the base and the second rotating member, and also set a limiter to prevent the base and the second rotating member from rotating relative to each other under the rebound force of the elastic member. At this time, the drive motor can be turned off, and the clamping member can be maintained in the open position without consuming the energy of the drive motor. The wafer clamping method of the present application also helps to save energy. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The accompanying drawings are included to provide a further understanding of the present application. They are included and constitute a part of the present application. The accompanying drawings illustrate embodiments of the present application and together with the present specification serve to explain the principles of the present application. In the accompanying drawings:

[0008] Figure 1 is a front view of a wafer clamping device according to an embodiment of the present application;

[0009] Figure 2 yes Figure 1 A top view of the wafer clamping device of the illustrated embodiment when no wafer is clamped;

[0010] Figure 3 yes Figure 2 a top view of the illustrated embodiment;

[0011] Figure 4 is along Figure 3 A cross-sectional side view of the JOJ line in FIG.

[0012] Figure 5 is an exemplary flow chart of a wafer clamping method according to an embodiment of the present application;

[0013] Figure 6A-6C It is a schematic diagram of the process of a wafer clamping device executing a wafer clamping method according to an embodiment of the present application. DETAILED DESCRIPTION

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of the present application. For ordinary technicians in this field, the present application can also be applied to other similar scenarios based on these drawings without creative work. Unless it is obvious from the language environment or otherwise explained, the same reference numerals in the figures represent the same structure or operation.

[0015] As shown in this application, unless the context clearly indicates an exception, the words "a", "an", "a kind" and / or "the" do not refer to the singular, but also include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0016] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant field may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so that once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0017] In the description of the present application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present application; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0018] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0019] In addition, it should be noted that the use of words such as "first" and "second" to define components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above words have no special meaning and cannot be understood as limiting the scope of protection of this application. In addition, although the terms used in this application are selected from well-known and commonly used terms, some terms mentioned in the specification of this application may be selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant parts of the description of this article. In addition, it is required to understand this application not only by the actual terms used, but also by the meaning implied by each term.

[0020] Flowcharts are used in the present application to illustrate the operations performed by the system according to the embodiments of the present application. It should be understood that the preceding or following operations are not necessarily performed accurately in order. On the contrary, various steps may be processed in reverse order or simultaneously. At the same time, other operations may be added to these processes, or one or more operations may be removed from these processes.

[0021] The wafer clamping device and wafer clamping method of the present application can be applied to various wafer processing chambers.

[0022] Figure 1 It is a front view of a wafer clamping device according to an embodiment of the present application. Figure 2 yes Figure 1 A top view of the wafer clamping device of the embodiment shown when the wafer is not clamped. Figure 1 and Figure 2 As shown, the wafer clamping device 100 of this embodiment includes a base 110 , a driving motor (not shown), a first rotating member 120 , a clamping member 130 , a second rotating member 140 , a limiting member and an elastic member 150 .

[0023] like Figure 2As shown, a plurality of first rotating members 120 are arranged on the circumference of the base 110. Specifically, Figure 2 6 first rotating members 120 are shown in the figure, which are evenly spaced and arranged on the circumference of the base 110. The first rotating member 120 can rotate around its own rotation axis. A clamping member 130 is arranged on each first rotating member 120, and the plurality of clamping members 130 are used to clamp the wafer. When the first rotating member 120 rotates, the clamping member 130 can follow the first rotating member 120 to rotate and be in any position between the closed position and the open position.

[0024] In some embodiments, Figure 2 As shown, the clamping member 130 specifically includes a clamping column 131 and an eccentric cylinder 132. The clamping column 131 is coaxial with the first rotating member 120, and the eccentric cylinder 132 is eccentrically arranged on the upper surface of the clamping column 131. Figure 1 As shown, the wafer W is placed on the upper surface of the clamping column 131 and is supported by the upper surface of the clamping column 131. At the same time, when the first rotating member 120 rotates, the eccentric cylinder 132 can rotate toward or away from the center of the wafer W, thereby changing the diameter of the circle surrounded by the multiple eccentric cylinders 132. Rotating the eccentric cylinder 132 away from the center of the wafer W is called opening the clamp, and rotating the eccentric cylinder 132 toward the center of the wafer W is called closing the clamp. The angle at which the multiple clamps 130 are opened can be set to be suitable for the placement of the wafer W, and the position of the clamp 130 at this time is called the open position. When the wafer is not clamped, the position of the multiple clamps 130 is called the closed position. When the wafer is clamped, the position of the multiple clamps 130 is called the clamping position. In the clamping position, the diameter of the circle surrounded by the multiple eccentric cylinders 132 is between the closed position and the open position.

[0025] like Figure 2 As shown, the second rotating member 140 is coaxially arranged with the base 110, and the first rotating member 120 is transmission-connected with the second rotating member 140. Figure 2 As shown, the second rotating member 140 can be specifically implemented as a large gear whose outer ring has gear teeth. The large gear is coaxial with the base 110, and the diameter of the large gear is slightly smaller than the diameter of the base 110. The first rotating member 120 is arranged on the base 110, for example, it can be fixedly connected to the bottom of the base 110, and the first rotating member 120 can rotate around its own rotation axis. The diameter of the first rotating member 120 is smaller than the distance between the outer periphery of the large gear and the outer periphery of the base 110. The first rotating member 120 can be specifically implemented as a small gear, whose outer ring also has gear teeth, and the gear teeth of the large gear and the gear teeth of the small gear match and can be meshed for transmission. Therefore, when the driving motor drives the base 110 and the second rotating member 140 to rotate relative to each other, it will drive the first rotating member 120 to rotate. It should be noted that although Figure 2The outer ring of the large gear is shown to have gear teeth. In other embodiments, only the outer ring of the large gear that matches the first rotating member 120 may have gear teeth, and the remaining part may not have gear teeth. The first rotating member 120 and the second rotating member 140 may also be connected in a transmission manner in other ways, such as using a multi-section movable connecting rod, etc., and are not limited to Figure 2 The gears shown are meshing transmission connections.

[0026] This application does not limit the arrangement and position of the drive motor. Figure 1 The wafer clamping device 100 further includes a rotating shaft 201 disposed below the base 110 and connected to the base 110. The driving motor can be installed in the rotating shaft 201 or externally connected to the wafer clamping device 100.

[0027] Figure 3 yes Figure 2 A top view of the embodiment shown, combined with Figure 2 and Figure 3 As shown, the wafer clamping device 100 of this embodiment further includes an elastic member 150 having a first end 151 and a second end 152, wherein the first end 151 is fixedly connected to the base 110, and the second end 152 is fixedly connected to the second rotating member 140, for applying a rebound force between the base 110 and the second rotating member 140. When clamping a wafer, there is a certain thrust between the edge of the wafer and the clamping member 130, and the pulling force generated by the elastic member 150 is balanced with the thrust, so that the wafer is in a clamped state.

[0028] like Figures 1 to 3 As shown, the limiting member includes a first limiting member 210, which is used to prevent the base 110 from rotating. In this embodiment, the first limiting member 210 is specifically implemented as a limiting rod, which is telescopically arranged on a fixed seat 202. The base 110 is provided with a first limiting hole 211. When the first limiting member 210 extends into the first limiting hole 211, it is used to prevent the base 110 from rotating. Specifically, the first limiting hole 211 is a waist-shaped hole, and its curvature is consistent with the circumference of the base 110. Figure 2 As shown, the first limiting member 210 abuts against one end of the first limiting hole 211 , indicating that the base 110 is in a blocked state.

[0029] Combination Figures 1 to 3In this embodiment, the limiting member also includes a second limiting member 220, which is used to prevent the second rotating member 140 from rotating. The second limiting member 220 is telescopically arranged on the fixed seat 202, and a second limiting hole 221 is arranged on the base 110. When the second limiting member 220 extends into the second limiting hole 221, it is used to prevent the second rotating member 140 from rotating. The second limiting hole 221 is a waist-shaped hole, and its curvature is consistent with the circumference of the base 110. The first limiting member 210 and the second limiting member 220 can be arranged on the same fixed seat 202, or they can be arranged separately. The fixed seat 202 is set independently of the rotating shaft 201, and its position is fixed, for example, it is set below the base 110.

[0030] In some embodiments, the stopper may include only the first stopper 210, or only the second stopper 220. The present application does not limit the number and position of the first stopper 210 and the second stopper 220. Figure 2 and Figure 3 In the illustrated embodiment, two first stoppers 210 and two second stoppers 220 are included, which are symmetrically arranged along a certain circumference of the base 110 .

[0031] Figure 4 is along Figure 3 The cross-sectional side view of the JOJ line in FIG. Figure 4 As shown, the base 110 includes a lower base 111, and the second rotating member 140 is located in the space above the lower base 111 and can rotate relative to the lower base 111. At the same time, the extension length of the first limit member 210 is less than the extension length of the second limit member 220. The present application does not limit the extension method of the first limit member 210 and the second limit member 220. In some embodiments, as Figure 1 and Figure 4 As shown, telescopic cylinders 203 and 204 are used to control the first limit member 210 and the second limit member 220 to extend and retract in the vertical direction respectively.

[0032] It should be noted that the driving motor of the present application is used to drive the base 110 and the second rotating member 140 to rotate relative to each other, including three situations: first, the base 110 is stationary, and the second rotating member 140 is driven to rotate; second, the second rotating member 140 is stationary, and the base 110 is driven to rotate; third, the base 110 and the second rotating member 140 are driven to rotate in two opposite directions respectively.

[0033] like Figure 4As shown, the center of the lower base 111 has a central axis 112 protruding upward. The central axis 112 is connected to the rotating shaft 201, and the driving motor can drive the central axis 112 to rotate by driving the rotating shaft 201 to rotate. In some embodiments, the central axis 112 is fixedly connected to the lower base 111 or integrally formed, and the second rotating member 140 is rotatably connected to the central axis 112. Based on this arrangement, when performing a wafer processing process, the driving motor only drives the central axis 112 and the lower base 111 to rotate together, and the second rotating member 140 rotates synchronously with the lower base 111 under the action of the elastic member 150. When the process stops and the clamping member 130 needs to be opened, the second limit member 220 is used to prevent the second rotating member 140 from rotating, and the driving motor drives the lower base 111 to rotate so that the clamping member 130 is opened.

[0034] In other embodiments, the central axis 112 is connected to the rotating axis 201, the central axis 112 is rotatably connected to the lower base 111, and the central axis 112 is fixedly connected to or integrally formed with the second rotating member 140. Based on this configuration, when performing a wafer processing process, the driving motor only drives the central axis 112 and the second rotating member 140 to rotate, and the lower base 111 rotates synchronously with the second rotating member 140 under the action of the elastic member 150. When the process stops and the clamping member 130 needs to be opened, the first limit member 210 is used to prevent the lower base 111 from rotating, and the driving motor drives the second rotating member 140 to rotate, so that the clamping member 130 is opened.

[0035] According to the wafer clamping device 100 of the present application, the process of maintaining the clamping member 130 in the open state is as follows:

[0036] In one embodiment, the second stopper 220 is used to keep the second rotating member 140 stationary, the base 110 is driven by the driving motor to rotate in the clockwise direction, the base 110 and the second rotating member 140 rotate relative to each other, and the plurality of first rotating members 120 rotate with the base 110, and rotate themselves due to the transmission relationship with the second rotating member 140, that is, rotate in the clockwise direction, so that the plurality of clamping members 130 are opened and in the open position, at this time, the elastic member 150 is stretched, and the elastic member 150 applies a rebound force between the base 110 and the second rotating member 140, so that the base 110 tends to rotate counterclockwise. At this time, the first stopper 210 is controlled to extend into the first stopper hole 211 to prevent the base 110 from rotating counterclockwise, and then the driving motor is turned off, so that the wafer clamping device can be kept in the state where the clamping member 130 is opened.

[0037] In another embodiment, the first stopper 210 is used to keep the base 110 stationary, and the second rotating member 140 is driven by the driving motor to rotate in the counterclockwise direction. The base 110 and the second rotating member 140 rotate relative to each other, and the plurality of first rotating members 120 are driven by the second rotating member 140 to rotate, that is, rotate in the clockwise direction, so that the plurality of clamping members 130 are opened and in the open position. At this time, the elastic member 150 is stretched, and the elastic member 150 applies a rebound force between the base 110 and the second rotating member 140, so that the second rotating member 140 has a tendency to rotate clockwise. At this time, the second stopper 220 is controlled to extend into the second stopper hole 221 to prevent the second rotating member 140 from rotating clockwise, and then the driving motor is turned off, so that the wafer clamping device can be kept in the state where the clamping member 130 is opened.

[0038] The wafer clamping device 100 of the present application can prevent the relative rotation of the base 110 and the second rotating member 140 under the action of the rebound force of the elastic member by setting a limit member, and maintain the clamping member 130 in the open position. At this time, the drive motor can be turned off without consuming the energy of the drive motor.

[0039] In some embodiments, Figure 2 and Figure 3 As shown, the second rotating member 140 also includes a plurality of spokes 310 extending in the radial direction. Specifically, the second rotating member 140 includes an inner ring 301 and an outer ring 302, which are connected by the spokes 310. The outer ring 302 has gear teeth on its outer circumference. The first end 151 of the elastic member 150 can be set at any position on the base 110, for example, on the upper surface of the lower base 111. In this way, when the base 110 rotates, the first end 151 will be driven to move. The second end 152 of the elastic member 150 is specifically arranged on the spokes 310. When the second rotating member 140 rotates, the second end 152 will also be driven to move. Figure 2 and Figure 3 The figure is only an example. In other embodiments, the second rotating member 140 does not include spokes but other frame structures. Then, the second end 152 of the elastic member 150 can be set at any position on the frame structure.

[0040] like Figure 2 and Figure 3 As shown, in some embodiments, the plurality of spokes 310 include a limiting spoke 311. When the second rotating member 140 rotates, the limiting spoke 311 is used to be stopped by the second limiting member 220 to stop the second rotating member 140 from rotating. Figure 2 and Figure 3There are two limiting spokes 311, which are symmetrically distributed in the center. Each limiting spoke 113 is used to contact a second limiting member 220 to prevent the second rotating member 140 from rotating. It should be noted that in some embodiments, only one second limiting member 220 and one limiting spoke 311 can also prevent the second rotating member 140 from rotating.

[0041] It should be noted that in other embodiments, the second position-limiting member 220 may also be implemented in other embodiments. For example, the second rotating member 140 does not include the spokes 310, but includes some other structures, such as any frame structure, and a stopper is set at any position of the second rotating member 140 as a position-limiting matching member. During the wafer processing process, the stopper does not affect the normal rotation of the second rotating member 140. When necessary, the second position-limiting member 220 is extended and contacts the stopper, thereby preventing the second rotating member 140 from rotating.

[0042] Combination Figure 2 and Figure 3 In some embodiments, the wafer clamping device 100 of the present application further includes a hard stopper 160, which is disposed on the base 110 and is used to limit the relative position between the base 110 and the second rotating member 140. For example, the hard stopper 160 is a stopper column disposed on the upper surface of the lower base 111. When the base 110 and the second rotating member 140 move relative to each other, the hard stopper 160 is used to limit the position between the two. Figure 3 As shown, the hard stopper 160 can prevent the second rotating member 140 from further rotating in the counterclockwise direction or prevent the base 110 from rotating in the clockwise direction by contacting the stopper spoke 311, wherein the hard stopper 160 is arranged corresponding to the stopper spoke 311. In some embodiments, the hard stoppers are arranged in groups, such as the hard stoppers 160 and 161 are a group, wherein the hard stopper 161 is used to prevent the second rotating member 140 from further rotating in the clockwise direction or prevent the base 110 from rotating in the counterclockwise direction.

[0043] Figure 5 This is an exemplary flow chart of a wafer clamping method according to an embodiment of the present application. The wafer clamping method according to this embodiment is implemented on the basis of the wafer clamping device 100 described above. Therefore, the description of the wafer clamping device 100 described above can be used to describe this method, and the same content will not be expanded. Figure 5 The wafer clamping method of this embodiment includes the following steps:

[0044] Step S510: The driving motor drives the base 110 to rotate along the first direction relative to the second rotating member 140, so as to drive the first rotating member 120 to rotate around its own rotating axis, so that the clamping member 130 is rotated to the open position;

[0045] Step S520: using a limit member to prevent the base 110 from rotating relative to the second rotating member 140 in a second direction, so that the clamping member 130 remains in the open position, wherein the second direction is opposite to the first direction;

[0046] Step S530: Turn off the driving motor.

[0047] The following combination Figure 6A-6C The above steps S510 to S530 and the method are described below.

[0048] It should be noted that before step S510, the wafer clamping device may be in a stationary state, with the clamping member 130 in a closed position, or it may be in a rotating state during the wafer processing process, with the clamping member 130 in a clamped position. After the previous process is completed or before the next process begins, the clamping member 130 needs to be opened to remove the wafer or place the wafer. At this time, the base 110 is rotated to the initial position, i.e., the HOME position, as shown in FIG. Fig. 6A shown.

[0049] This embodiment is described by taking the driving object of the driving motor as the base 110 as an example. The embodiment in which the driving motor drives the second rotating member 140 to rotate relative to the base 110 can be inferred on this basis and will not be described in detail.

[0050] exist Fig. 6A In the initial position shown, the second stopper 220 can extend into the second stopper hole 221 on the base 110, thereby preventing the second rotating member 140 from rotating. Assuming that the first direction is clockwise, the driving motor drives the base 110 to rotate in the clockwise direction. At this time, since the second rotating member 140 is restricted from rotating, the first rotating member 120 rotates and drives the clamping member 130 to rotate, so that the clamping member 130 moves from the first direction to the second direction. Fig. 6A Rotate the position shown to Figure 6B Shown in open position. Reference Fig. 6A , the eccentric cylinder 132 is closer to the outer peripheral gear of the second rotating member 140, Figure 6B In FIG. 1 , the eccentric cylinder 132 is further away from the outer peripheral gear of the second rotating member 140 , indicating that the clamping member 130 is opened.

[0051] like Figure 6B As shown, in step S520, for example, the first limiting member 210 is controlled by the cylinder 203 to extend and enter the first limiting hole 211 to prevent the base 110 from rotating, specifically, to prevent the base 110 from rotating in the second direction, that is, rotating counterclockwise, so that the clamping member 130 remains in the open position.

[0052] In step S530, since the clamping member 130 is held in the open position by the first stop member 210, the drive motor is turned off, thereby saving power consumption. At this time, the wafer can be placed or removed, or the machine can be placed in a standby state for a period of time, which is not limited by the present application.

[0053] In some embodiments, the wafer clamping method further comprises:

[0054] Step S540: when the clamping member 130 does not need to be kept in the open position any more, the blocking effect of the limiting member is eliminated;

[0055] Step S550 : The base 110 rotates along the second direction relative to the second rotating member 140 , and drives the first rotating member 120 to rotate, so that the clamping member 130 rotates from the open position to the clamping position for clamping the wafer, or rotates to the closed position.

[0056] In step S540, when the wafer W has been placed on the clamping member 130, or the wafer W has been removed from the clamping member 130, or the standby state can be ended, the first limiting member 210 is controlled to retract by the cylinder 203 so that it withdraws from the first limiting hole 211, so that the base 110 can rotate relative to the second rotating member 140.

[0057] It should be noted that in some embodiments, in step S540, the drive motor is still in the off state. Since the effect of the first limit member 210 disappears, the base 110 naturally rotates back under the pulling force of the elastic member 150, for example, rotates to the left, thereby driving the first rotating member 120 to rotate and causing the clamping member 130 to rotate back from the open position.

[0058] In some embodiments, in step S550 , the base 110 rotates naturally, driving the first rotating member 120 to rotate so that the clamping member 130 rotates from the open position to the clamping position for clamping the wafer, or rotates to the closed position. Figure 6C The figure shows the state when the clamping member 130 is rotated to the clamping position, and the eccentric cylinder 132 contacts the contour of the wafer W.

[0059] In other embodiments, when the clamping member 130 does not need to continue to remain in the open position, it also includes: starting the drive motor, using the drive motor to drive the base 110 to rotate, controlling the rotation speed of the base 110 to prevent the base 110 from rotating too fast and the clamping member 130 from having an instantaneous excessive clamping force, thereby damaging the wafer.

[0060] It should be noted that the step of starting the driving motor may be performed before or after lowering the first limiting member 210 .

[0061] If the wafer W is placed after the drive motor is turned off in step S530, then in step S550, the clamping member 130 is rotated to the clamping position to clamp the wafer W. Thereafter, the process further includes: eliminating the blocking effect of the second stopper 220 on the second rotating member 140, and the drive motor drives the base 110 to rotate to perform the wafer process.

[0062] The basic concepts have been described above. Obviously, for those skilled in the art, the above application disclosure is only an example and does not constitute a limitation of the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements and amendments to the present application. Such modifications, improvements and amendments are suggested in the present application, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of the present application.

[0063] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0064] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus help understand one or more embodiments of the invention, in the above description of the embodiments of this application, multiple features are sometimes combined into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

[0065] In some embodiments, numbers describing the number of components and attributes are used. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise specified, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in this application are approximate values, which may change according to the required characteristics of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining the digits. Although the numerical domains and parameters used to confirm the breadth of the range in some embodiments of the present application are approximate values, in specific embodiments, the setting of such numerical values ​​is as accurate as possible within the feasible range.

Claims

1. A wafer clamping device, characterized in that: include: A base, a driving motor, a plurality of first rotating members, a plurality of clamping members, a second rotating member, a limiting member and an elastic member, wherein: A plurality of the first rotating members are arranged on the base; The plurality of clamping members are respectively arranged on the plurality of the first rotating members, and are used for clamping the wafer; The second rotating member is coaxially arranged with the base, and the second rotating member is transmission-connected with the first rotating member; The driving motor is used to drive the base and the second rotating member to rotate relative to each other, so as to drive the first rotating member to rotate around its own rotating axis, and to make the clamping member rotate along with the first rotating member to be in any position between the closed position and the open position; The elastic member has a first end and a second end, the first end is fixedly connected to the base, and the second end is fixedly connected to the second rotating member, for applying a rebound force between the base and the second rotating member; Wherein, when the clamping member is rotated to the open position, the limiting member is used to prevent the base and the second rotating member from rotating relative to each other under the action of the rebound force of the elastic member, so that the clamping member is maintained in the open position.

2. The wafer clamping device according to claim 1, characterized in that: The limiting member includes a first limiting member, which is telescopically arranged on a fixed seat. A first limiting hole is arranged on the base, and when the first limiting member extends into the first limiting hole, it is used to prevent the base from rotating.

3. The wafer clamping device according to claim 2, characterized in that: The limiting member includes a second limiting member, which is telescopically arranged on a fixed seat. A second limiting hole is arranged on the base, and when the second limiting member extends into the second limiting hole, it is used to prevent the second rotating member from rotating.

4. The wafer clamping device according to claim 3, characterized in that: The length of the first limiting member is smaller than the length of the second limiting member.

5. The wafer clamping device according to claim 3, characterized in that: The second rotating member includes a plurality of spokes extending in the radial direction, and the second end of the elastic member is arranged on the spokes.

6. The wafer holding device according to claim 5, characterized in that: The plurality of spokes include limiting spokes, and the limiting spokes are used to be stopped by the second limiting member to stop the second rotating member from rotating.

7. The wafer holding device according to claim 1, characterized in that: Also includes: A hard limiter is arranged on the base and is used to limit the relative position between the base and the second rotating member.

8. A wafer clamping method, applied to the wafer clamping device according to any one of claims 1 to 7, characterized in that: include: The driving motor drives the base to rotate relative to the second rotating member along a first direction, so as to drive the first rotating member to rotate around its own rotating axis, so that the clamping member is rotated to an open position; The limiting member is used to prevent the base from rotating relative to the second rotating member in a second direction, so that the clamping member is maintained in the open position, wherein the second direction is opposite to the first direction; Turn off the drive motor.

9. The wafer clamping method according to claim 8, characterized in that: Also includes: When the clamping member does not need to be kept in the open position any more, the blocking effect of the limiting member is eliminated; The base rotates relative to the second rotating member along the second direction, and drives the first rotating member to rotate at the same time, so that the clamping member rotates from the open position to the clamping position for clamping the wafer, or rotates to the closed position.

10. The wafer clamping method according to claim 9, characterized in that: When the clamping member does not need to continue to be maintained at the open position, the method further includes: starting the driving motor.

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