Chip assembly, printed circuit board and manufacturing method thereof

Abstract

The invention relates to a chip assembly, a printed circuit board and a manufacturing method thereof. The chip assembly is used for being embedded into the printed circuit board. The chip assembly comprises a base and a chip structure, wherein the base is provided with a first surface in a first direction and an accommodating groove formed by inwards sinking the first surface; the chip structure is located in the containing groove and provided with a second surface and a third surface which are oppositely arranged in the first direction, and the third surface is located on the side, away from the groove bottom face of the containing groove, of the second surface. The first surface is located on the side, away from the groove bottom face, of the third surface. According to the embodiment of the invention, the chip assembly can improve the stability of connection with other structures in the printed circuit, and guarantees the working reliability of the printed circuit board.

Description

Technical Field

[0001] The present application relates to the field of electronic manufacturing technology, and in particular to a chip assembly, a printed circuit board and a manufacturing method thereof. Background Art

[0002] Printed Circuit Board (PCB) plays a vital role in electronic devices. Printed circuit boards can provide certain electrical connections and mechanical support for related electronic devices.

[0003] The chip is the core of the circuit board. The chip integrates a large number of electronic components and circuits, and can complete complex calculations and data processing. In the related technology, some chips are connected to the inside of the printed circuit board by plugging to achieve the conduction between the chip and the rest of the structure inside the printed circuit board. In actual use, problems such as unstable conduction lines and poor data transmission effects often occur. Summary of the invention

[0004] The chip assembly, printed circuit board and manufacturing method thereof provided in the embodiments of the present application can improve the stability of the connection between the chip assembly and other structures in the printed circuit, and ensure the reliability of the operation of the printed circuit board.

[0005] In a first aspect, an embodiment of the present application provides a chip assembly for embedding into a printed circuit board, the chip assembly comprising:

[0006] A base having a first surface in a first direction and a receiving groove formed by the first surface being recessed inwardly;

[0007] a chip structure located in the receiving groove, wherein the second surface and the third surface of the chip structure are arranged opposite to each other in the first direction, and the third surface is located on a side of the second surface away from the groove bottom surface of the receiving groove;

[0008] The first surface is located on a side of the third surface facing away from the groove bottom surface.

[0009] In some embodiments, the chip assembly further includes a protective layer, the protective layer is located on a side of the chip structure away from the bottom surface of the groove, the protective layer has a fourth surface and a fifth surface arranged opposite to each other in the first direction, and the fifth surface is located on a side of the fourth surface away from the chip structure;

[0010] The first surface is located on a side of the fifth surface facing away from the groove bottom surface.

[0011] In some embodiments, the side wall of the protective layer ring in the first direction is spaced apart from the side wall of the receiving groove;

[0012] And / or, the side wall of the chip structure ring in the first direction is disposed in contact with the side wall of the accommodating groove.

[0013] In some embodiments, the peripheral side wall of the base ring in the first direction is recessed inward to form a plurality of recesses, and the plurality of recesses all penetrate the base along the first direction and are spaced apart around the base in the first direction.

[0014] In some embodiments, the base includes a conductive material, a portion of the chip structure is conductively connected to the second surface, and the base and a portion of the chip structure are conductively connected to the second surface.

[0015] In a second aspect, an embodiment of the present application provides a printed circuit board, comprising:

[0016] The chip assembly;

[0017] A connecting structure, part of which is located inside the receiving groove along the first direction and connected to the chip component.

[0018] In some embodiments, an insulating structure wrapping the chip assembly is further included, and a portion of the insulating structure is located inside the receiving groove along the first direction.

[0019] In some embodiments, the connection structure includes a plurality of connection portions arranged at intervals, projections of the plurality of connection portions in the first direction are all located inside a projection of the chip component in the first direction, and part of the insulation structure is located between adjacent connection portions.

[0020] In some embodiments, the chip structure in the chip assembly includes a first pole, and the third surface includes a first sub-surface that is conductively connected to the first pole;

[0021] The printed circuit board comprises a first conductive circuit located along the first direction on the chip structure away from the bottom surface of the groove, and the first conductive circuit is conductively connected to the first sub-surface through the connecting structure;

[0022] The insulating structure includes a first insulating layer located on the side of the connecting structure away from the chip component along the first direction, the first insulating layer is located on the peripheral side of the first conductive line ring in the first direction, and one end of the first conductive line away from the first pole protrudes from the first insulating layer along the first direction.

[0023] In some embodiments, the chip structure in the chip assembly includes a second pole, the second surface includes a second sub-surface conductively connected to the second pole, the base includes a conductive material, and the base is conductively connected to the second sub-surface;

[0024] The printed circuit board includes a second conductive circuit connected to the base, the second conductive circuit includes a transition portion connected to the base and a conductive portion connected to the transition portion, the transition portion is located on a side of the base away from the connecting structure along the first direction, the projection of the chip component in the first direction is inside the projection of the transition portion in the first direction, and the conductive portion is located on the peripheral side of the chip component ring in the first direction.

[0025] In some embodiments, the chip assembly includes a first chip unit and a second chip unit that are spaced apart, the first chip unit includes a first pole and a second pole, and the second chip unit includes a third pole and a fourth pole;

[0026] The printed circuit board comprises a first conductive circuit connected to the first pole, a second conductive circuit connected to the second pole, a third conductive circuit connected to the third pole, and a fourth conductive circuit connected to the fourth pole;

[0027] The first conductive circuit is conductively connected to the fourth conductive circuit inside the insulating structure.

[0028] In a third aspect, an embodiment of the present application provides a method for manufacturing a printed circuit board, comprising:

[0029] Providing a chip assembly, wherein the chip assembly is the above-mentioned chip assembly;

[0030] A connection structure is formed on one side of the chip component along a first direction, and a portion of the connection structure is located inside the receiving groove along the first direction and connected to the chip component.

[0031] In some embodiments, after providing the chip assembly and before forming a connection structure on one side of the chip assembly along the first direction, the method further includes:

[0032] An insulating structure is formed to wrap the chip component, wherein the insulating structure includes a connecting hole, and the connecting structure is connected to the chip component through the connecting hole.

[0033] The chip assembly provided in the embodiment of the present application is used to be embedded in the printed circuit board, and the chip assembly is produced and integrally formed with the rest of the structure of the printed circuit board as a basic unit. In the produced printed circuit board, the chip assembly is completely inside the printed circuit board, and the rest of the structure in the printed circuit is used to form a certain protection for the chip assembly to ensure the reliability of the chip assembly. At the same time, the stability of the connection between the chip assembly and the rest of the structure in the printed circuit can be improved to ensure the reliability of the printed circuit board. In the production process of the printed circuit board, the base supports and fixes the chip structure and provides certain protection. When the chip structure is located inside the receiving groove, the base can provide certain protection to the chip structure on the circumferential side of the chip structure ring in the first direction; at the same time, the first surface on the base is located on the side of the third surface on the chip structure away from the bottom surface of the groove, and the bottom surface of the groove of the receiving groove protects the chip structure in the first direction, and the first surface can also protect the chip structure in the first direction, and the chip structure can be connected to the rest of the structure at the notch of the receiving groove. Based on the good protective effect of the base on the chip structure, the probability of damage to the chip structure during the production process of the printed circuit board can be reduced, thereby improving the production success rate of the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0035] Figure 1 A first exploded structural schematic diagram of a chip assembly provided in some embodiments of the present application;

[0036] Figure 2 A second exploded structural schematic diagram of a chip assembly provided in some embodiments of the present application;

[0037] Figure 3 A schematic diagram of a top view structure of a chip assembly provided in some embodiments of the present application;

[0038] Figure 4 A schematic cross-sectional structural diagram of a chip assembly provided in some embodiments of the present application;

[0039] Figure 5 A schematic diagram of the matching relationship between a chip assembly and a transfer part in a printed circuit board provided in some embodiments of the present application;

[0040] Figure 6 A schematic diagram of a first structure forming process of a printed circuit board provided in some embodiments of the present application;

[0041] Figure 7 A schematic diagram of a second structure forming process of a printed circuit board provided in some embodiments of the present application;

[0042] Figure 8 A schematic diagram of a third structure forming process of a printed circuit board provided in some embodiments of the present application;

[0043] Fig. 9 A schematic diagram of a fourth structure forming process of a printed circuit board provided in some embodiments of the present application;

[0044] Fig.10 A schematic diagram of a fifth structure forming process of a printed circuit board provided in some embodiments of the present application;

[0045] Fig.11 A schematic diagram of a sixth structure forming process of a printed circuit board provided in some embodiments of the present application;

[0046] Fig.12 A schematic diagram of a seventh structure forming process of a printed circuit board provided in some embodiments of the present application;

[0047] Fig.13 A first schematic flow chart of a method for manufacturing a printed circuit board provided in some embodiments of the present application;

[0048] Fig.14 A second schematic flow chart of a method for manufacturing a printed circuit board provided in some embodiments of the present application;

[0049] Fig.15 A schematic diagram of an isometric structure of a tray structure and a chip assembly in a method for manufacturing a printed circuit board provided in some embodiments of the present application;

[0050] Fig.16 A schematic diagram of an exploded structure of a tray structure and a chip assembly in a method for manufacturing a printed circuit board provided in some embodiments of the present application;

[0051] Fig.17 A schematic side view of a tray structure and a chip assembly in a method for manufacturing a printed circuit board provided in some embodiments of the present application.

[0052] Marking Description:

[0053] 100, chip assembly; 101, first chip unit; 102, second chip unit;

[0054] 10. base; 11. receiving groove; 12. recess; 13. insulating part;

[0055] 20. Chip structure; 21. First pole; 22. Second pole; 23. Third pole;

[0056] 30. protective layer; 31. first protective member; 32. second protective member; 33. third protective member;

[0057] M1, first surface; M2, second surface; M3, third surface; M4, fourth surface; M5, fifth surface;

[0058] H1, first welding layer; H2, second welding layer;

[0059] 200. Printed circuit board;

[0060] 40. connection structure; 41. connection part;

[0061] 50, insulation structure; 51, first insulation layer; 511, second connection hole; 52, second insulation layer; 521, communication hole; 533, first connection hole; 53, third insulation layer;

[0062] 61, first conductor layer; 611, first separation hole; 62, second conductor layer; 621, second separation hole;

[0063] L1, first conducting line;

[0064] L2, second conducting line; L21, switching portion; L211, intermittent hole; L22, conducting portion;

[0065] L3, third conducting line;

[0066] G1, tray structure; G11, groove; G12, notch;

[0067] H3, the third welding layer;

[0068] X, first direction.

[0069] In the drawings, the same reference numerals are used for the same components. The drawings are not drawn to scale. DETAILED DESCRIPTION

[0070] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0071] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0072] The printed circuit board 200 (Printed Circuit Board, PCB) plays a vital role in electronic devices. The printed circuit board 200 can provide certain electrical connections and mechanical supports for related electronic devices.

[0073] The chip is the core of the circuit board. The chip integrates a large number of electronic components and circuits, and can complete complex calculations and data processing. In the related art, some chips are connected to the inside of the printed circuit board 200 by plugging, so as to achieve the conduction between the chip and the rest of the structure inside the printed circuit board 200. In actual use, problems such as instability of the conduction line and poor data transmission effect often occur.

[0074] In view of this, first of all, please refer to Figures 1 to 4 , the embodiment of the present application provides a chip assembly 100 for embedding into a printed circuit board 200. The chip assembly 100 includes a base 10 and a chip structure 20, wherein the base 10 has a first surface M1 and a receiving groove 11 formed by the first surface M1 being recessed inwardly in a first direction X. The chip structure 20 is located inside the receiving groove 11, and the chip structure 20 has a second surface M2 and a third surface M3 that are arranged opposite to each other in the first direction X, wherein the third surface M3 is located on the side of the second surface M2 away from the bottom surface of the receiving groove 11. Among them, the first surface M1 is located on the side of the third surface M3 away from the bottom surface of the groove.

[0075] The chip assembly 100 provided in the embodiment of the present application is used to be embedded in the printed circuit board 200. It can be understood that in the production process of the printed circuit board 200, the chip assembly 100 is produced and integrally formed together with the remaining structures of the printed circuit board 200 as a basic unit. In the produced printed circuit board 200, the chip assembly 100 is completely inside the printed circuit board 200. In this way, the remaining structures in the printed circuit can be used to form a certain protection for the chip assembly 100 to ensure the reliability of the operation of the chip assembly 100. At the same time, the chip assembly 100 is produced and integrally formed together with the remaining structures in the printed circuit, which can improve the stability of the connection between the chip assembly 100 and the remaining structures in the printed circuit, and ensure the reliability of the operation of the printed circuit board 200.

[0076] Specifically, the chip assembly 100 includes a base 10 and a chip structure 20 connected to the base 10. The chip structure 20, as the core structure of the chip assembly 100, can complete complex calculations and data processing. The base 10 supports and fixes the chip structure 20 and plays a certain protective role on the chip structure 20.

[0077] The base 10 has a first surface M1 and a receiving groove 11 formed by the first surface M1 being recessed inwardly in the first direction X, and the chip structure 20 is located inside the receiving groove 11. When the chip structure 20 is located inside the receiving groove 11, the base 10 can provide a certain degree of protection to the chip structure 20 on the upper side of the chip structure 20 in the first direction X. At the same time, the provision of the receiving groove 11 can also fix the relative position of the chip structure 20 on the base 10, thereby reducing the probability of a significant deviation in the relative position between the chip structure 20 and the base 10.

[0078] Furthermore, the chip structure 20 has a second surface M2 and a third surface M3 that are arranged opposite to each other in the first direction X. When the chip structure 20 is inside the containing material, the second surface M2 faces the bottom surface of the containing groove 11, the third surface M3 is located on the side of the second surface M2 away from the bottom surface of the groove, and the first surface M1 is located on the side of the third surface M3 away from the bottom surface of the groove. In other words, the chip structure 20 is completely inside the containing groove 11 as a whole, and the bottom surface of the containing groove 11 protects the chip structure 20 in the first direction X. At the same time, the first surface M1 can also protect the chip structure 20 in the first direction X. The chip structure 20 can be connected to the remaining structures at the notch of the containing groove 11.

[0079] During the production process of the printed circuit board 200, it is inevitable that a squeezing force will be generated on the chip assembly 100 in the first direction X. In the first direction X, the first surface M1 on the base 10 is located on the side of the third surface M3 on the chip structure 20 away from the bottom surface of the groove. When squeezing occurs, since the groove depth of the receiving groove 11 is greater than the dimension of the chip structure 20 in the first direction X, the base 10 will first be subjected to the squeezing force, and the squeezing force is borne by the strength of the base 10 itself. The third surface M3 of the chip structure 20 is located inside the receiving groove 11, that is, the first surface M1 and the third surface M3 are not at the same height. When the first surface M1 is subjected to the squeezing force, there is a gap between the third surface M3 and the first surface M1, and the squeezing force is difficult to be transmitted to the third surface M3. Even if there is some structure inside the third surface M3 projected in the first direction X to squeeze the third surface M3, the first surface M1 can share part of the squeezing force, and the base 10 can play a good protective role on the chip structure 20, reduce the probability of damage to the chip structure 20 during the production process of the printed circuit board 200, and improve the production success rate of the printed circuit board 200.

[0080] In summary, the chip assembly 100 provided in the embodiment of the present application is used to be embedded in the printed circuit board 200, and the chip assembly 100 is produced and integrally formed together with the remaining structures of the printed circuit board 200 as a basic unit. In the produced printed circuit board 200, the chip assembly 100 is completely inside the printed circuit board 200, and the remaining structures in the printed circuit are used to form a certain protection for the chip assembly 100 to ensure the reliability of the operation of the chip assembly 100. At the same time, it can also improve the stability of the connection between the chip assembly 100 and the remaining structures in the printed circuit, and ensure the reliability of the operation of the printed circuit board 200. During the production process of the printed circuit board 200, the base 10 supports, fixes and protects the chip structure 20 to a certain extent. When the chip structure 20 is located inside the receiving groove 11, the base 10 can provide certain protection to the chip structure 20 on the upper side of the chip structure 20 in the first direction X; at the same time, the first surface M1 on the base 10 is located on the side of the third surface M3 on the chip structure 20 away from the bottom surface of the groove, and the bottom surface of the groove of the receiving groove 11 protects the chip structure 20 in the first direction X, and the first surface M1 can also protect the chip structure 20 in the first direction X. The chip structure 20 can be connected to the remaining structures at the notch of the receiving groove 11. Based on the good protection of the base 10 on the chip structure 20, the probability of damage to the chip structure 20 during the production process of the printed circuit board 200 can be reduced, thereby improving the production success rate of the printed circuit board 200.

[0081] In some embodiments, the chip assembly 100 further includes a protective layer 30, the protective layer 30 is located on the side of the chip structure 20 away from the bottom surface of the groove, the protective layer 30 has a fourth surface M4 and a fifth surface M5 arranged opposite to each other in the first direction X, and the fifth surface M5 is located on the side of the fourth surface M4 away from the chip structure 20. The first surface M1 is located on the side of the fifth surface M5 away from the bottom surface of the groove.

[0082] The chip structure 20 can be connected to the remaining structures at the notch of the receiving groove 11. Similarly, the remaining structures can also generate a certain extrusion force on the chip structure 20 at the notch of the receiving groove 11. In order to further protect the chip structure 20, the chip assembly 100 also includes a protective layer 30. The protective layer 30 is arranged on the side of the chip structure 20 away from the bottom surface of the groove. The protective layer 30 can protect the chip structure 20 at the notch of the receiving groove 11, and buffer the extrusion of the chip structure 20 generated by the remaining structures at the notch of the receiving groove 11 to reduce the probability of the extrusion force directly acting on the chip structure 20, thereby improving the degree of protection of the chip structure 20.

[0083] Furthermore, the protective layer 30 is also completely inside the receiving groove 11, that is, the protective layer 30 has a fourth surface M4 and a fifth surface M5 that are arranged opposite to each other in the first direction X, the fifth surface M5 is located on the side of the fourth surface M4 away from the chip structure 20, and the first surface M1 is located on the side of the fifth surface M5 away from the bottom surface of the groove. When an extrusion force occurs, since the groove depth of the receiving groove 11 is greater than the sum of the dimensions of the chip structure 20 in the first direction X and the dimensions of the protective layer 30 in the first direction X, the base 10 will first be subjected to the extrusion force, and the extrusion force is borne by the strength of the base 10 itself. The above process is similar to the effect of the chip structure 20 being inside the receiving groove 11, and will not be repeated here. The base 10 is used to produce a certain protective effect on the protective layer 30, thereby further protecting the chip structure 20.

[0084] In some embodiments, the protection layer 30 is disposed between the sidewalls of the first direction X and the sidewalls of the receiving groove 11 . And / or, the chip structure 20 is disposed in contact with the sidewalls of the first direction X and the sidewalls of the receiving groove 11 .

[0085] When the protective layer 30 is in the receiving groove 11, a gap is formed between the sidewall of the protective layer 30 and the sidewall of the receiving groove 11, so that a concave structure can be formed on the first surface M1 side of the base 10 in the chip assembly 100, thereby increasing the roughness of the first surface M1 side of the base 10 in the chip assembly 100, and facilitating the connection between the chip assembly 100 and the remaining structures in the printed circuit board 200. At the same time, the gap formed between the sidewall of the protective layer 30 and the sidewall of the receiving groove 11 also facilitates the placement of the protective layer 30 in the receiving groove 11, thereby facilitating the connection between the protective layer 30 and the chip structure 20.

[0086] When the chip structure 20 is in the receiving groove 11, the side walls of the chip structure 20 are abutted against the side walls of the receiving groove 11, thereby improving the position stability of the chip structure 20 in the receiving groove 11 and reducing the probability of the chip structure 20 being offset relative to the base 10 during the actual production process.

[0087] In some embodiments, the chip structure 20 includes a substrate and a first pole 21 and a second pole 22 spaced apart on the substrate, the substrate is connected to the bottom wall of the receiving groove 11, the substrate abuts against the groove side wall of the receiving groove 11, and the first pole 21 and the second pole 22 are both spaced apart from the groove side wall of the receiving groove 11. The protective layer 30 includes a first protective member 31 and a second protective member 32, the first protective member 31 is connected to the first pole 21, the projection of the first protective member 31 in the first direction X covers the projection of the first pole 21 in the first direction X, the projection of the second protective member 32 in the first direction X covers the projection of the second pole 22 in the first direction X, and the first protective member 31 and the second protective member 32 are spaced apart. The first protective member 31 and the second protective member 32 are both spaced apart from the groove side wall of the receiving groove 11. Optionally, the chip structure 20 also includes a third pole 23 spaced apart from the first pole 21 and the second pole 22, and the protective layer 30 also includes a third protective member 33 corresponding to the third pole 23.

[0088] For the chip structure 20, it itself is not all made of conductive materials. The substrate of the chip structure 20 is an insulating material, and the first pole 21 and the second pole 22 are conductive materials. The first pole 21 and the second pole 22 are spaced apart on the substrate so that a relatively independent path is formed between the first pole 21 and the second pole 22. The first pole 21 and the second pole 22 are more susceptible to damage than the substrate. Therefore, the protective layer 30 is set to a first protective member 31 and a second protective member 32 corresponding to the chip structure 20. The first protective member 31 corresponds to the first pole 21 and protects the first pole 21, and the second protective member 32 corresponds to the second pole 22 and protects the second pole 22. In order to ensure the relative independence between the paths of the first pole 21 and the second pole 22, the first protective member 31 and the second protective member 32 are spaced apart to reduce the probability of a short circuit between the first pole 21 and the second pole 22.

[0089] At the same time, considering that the chip structure 20 is also arranged in contact with the base 10, the first member is spaced apart from the side wall of the groove of the second pole 22 to ensure the relative independence between the first pole 21 and the second pole 22. Further, on the basis of the mutual spacing between the first guarantee member and the second protection member 32, the first guarantee member is spaced apart from the side wall of the groove of the receiving groove 11, and the second protection member 32 is also spaced apart from the side wall of the groove of the receiving groove to further ensure the relative independence between the first pole 21 and the second pole 22.

[0090] In some embodiments, in order to improve the insulation reliability between the chip structure 20 and the base 10, an insulating portion 13 is formed on the groove sidewall ring of the receiving groove 11 in the first direction X, and the size of the insulating portion 13 in the first direction X is equal to the size of the groove sidewall of the receiving groove 11 in the first direction X, and the substrate is in contact with the insulating portion 13. The substrate itself is an insulating material, and the insulating portion 13 is also an insulating material, which can further reduce the probability of the chip structure 20 being short-circuited by conduction on the groove sidewall of the receiving groove 11. At the same time, the size of the insulating portion 13 in the first direction X is equal to the size of the groove sidewall of the receiving groove 11 in the first direction X, and the insulating portion 13 can be formed between the protective layer 30 and the groove sidewall of the receiving groove 11, reducing the probability of conduction between the protective layer 30 and the groove sidewall of the receiving groove 11.

[0091] In some embodiments, the base 10 includes a conductive material, a portion of the chip structure 20 is connected to the second surface M2, and the base 10 is connected to a portion of the chip structure 20 on the second surface M2. Through the above configuration, a portion of the chip structure 20 is connected to the base 10 at the second surface M2, and the corresponding electrode on the chip structure 20 can be connected to the remaining structure from the base 10, so that the chip structure 20 is connected to the remaining structure at the notch of the receiving groove 11 through the protective layer 30, and can also be connected to the remaining structure on the base 10, thereby expanding the conduction angle and area between the chip structure 20 and the remaining structure, and facilitating the production and molding of the printed circuit board 200.

[0092] In some embodiments, the base 10 and the protective layer 30 are both made of conductive materials. While the base 10 and the protective layer 30 provide all-round protection for the chip structure 20, they can be connected to the corresponding electrodes on the chip structure 20 by using their own conductive properties, so as to facilitate the connection between the chip structure 20 and other structures. Exemplarily, the base 10 and the protective layer 30 are both made of copper.

[0093] Optionally, the chip structure 20 is connected to the bottom surface of the receiving groove 11 by a first flux, the first flux is a conductor material, and a first welding layer H1 is formed between the chip structure 20 and the bottom surface of the receiving groove 11, and the first welding layer H1 is an integral structure. The protective layer 30 is connected to the chip structure 20 by a first flux, and a second welding layer H2 is formed between the protective layer 30 and the chip structure 20. The second welding layer H2 and the corresponding settings on the protective layer 30 and the chip structure 20 are separate structures.

[0094] In some embodiments, the peripheral sidewall of the base 10 in the first direction X is recessed inward to form a plurality of recesses 12, and the plurality of recesses 12 are arranged through the base 10 along the first direction X, and the plurality of recesses 12 are arranged at intervals in the first direction X. The provision of the recesses 12 can improve the roughness of the peripheral sidewall of the base 10, facilitate the connection between the base 10 and the remaining structures, and thus improve the position stability of the base 10 inside the printed circuit board 200.

[0095] Second, as Figures 5 to 12 As shown, an embodiment of the present application provides a printed circuit board 200 , including the above-mentioned chip assembly 100 and a connection structure 40 , wherein a portion of the connection structure 40 is located inside the receiving groove 11 along the first direction X and is connected to the chip assembly 100 .

[0096] In the printed circuit board 200 provided in the embodiment of the present application, the chip assembly 100 is located inside the printed circuit board 200. The chip structure 20 is located inside the receiving groove 11 on the base 10, and the connecting structure 40 connects the chip structure 20 to the outside of the receiving groove 11 to achieve the connection between the chip structure 20 and the remaining structures. Specifically, the connecting structure 40 is set to a conductive material, and the projection of the connecting structure 40 in the first direction X is inside the projection of the chip structure 20 in the first direction X, and the connecting structure 40 extends in a straight line along the first direction X.

[0097] In some embodiments, the printed circuit board 200 further includes an insulating structure 50 that wraps the chip assembly 100, and a portion of the insulating structure 50 is located inside the receiving groove 11 along the first direction X. The provision of the insulating structure 50 can provide protection and insulation around the chip assembly 100. At the same time, a portion of the insulating structure 50 is located inside the receiving groove 11 and on the side of the protective layer 30 away from the chip structure 20, which can provide a certain degree of protection for the chip structure 20 and reduce the damage to the chip structure 20 caused by the extrusion force along the first direction X.

[0098] In some embodiments, the connection structure 40 includes a plurality of spaced connection portions 41 , the projections of the plurality of connection portions 41 in the first direction X are all located inside the projection of the chip assembly 100 in the first direction X, and a portion of the insulation structure 50 is located between adjacent connection portions 41 .

[0099] The connection structure 40 is configured as a plurality of connection parts 41. On the one hand, it can reduce the material usage of the connection structure 40 and reduce the production cost of the printed circuit board 200. On the other hand, the intersection of multiple small-area connection parts 41 with a large-area connection structure 40 can improve the stability of the electrical signal connection and better control the connection position on the chip component 100, thereby reducing the probability of short circuit caused by connection error.

[0100] Furthermore, part of the insulating structure 50 is located between adjacent connecting parts 41, which can ensure the independence of adjacent connecting parts 41 and improve the position stability of the connecting parts 41; on the other hand, the alternating arrangement of the connecting parts 41 and the insulating structure 50 can enable the insulating structure 50 to withstand a certain extrusion force. Generally speaking, the insulating structure 50 has greater elasticity when intersecting the conductive structure, which can reduce the impact of the extrusion force on the chip assembly 100. In some embodiments, the connecting structure 40 is set to copper material, and the insulating structure 50 is set to integrated circuit prepreg material. The performance and reliability of the printed circuit board 200 are guaranteed by the combination of different fiber-reinforced materials and resin matrices. For example, the insulating structure 50 can be set to polypropylene material.

[0101] In some embodiments, the chip structure 20 in the chip assembly 100 includes a first pole 21, and the third surface M3 includes a first sub-surface that is conductive with the first pole 21. The printed circuit board 200 includes a first conductive line L1 that is located on the chip structure 20 away from the bottom surface of the groove along the first direction X, and the first conductive line L1 is conductive with the first sub-surface through the connection structure 40. The insulating structure 50 includes a first insulating layer 51 that is located on the side of the connection structure 40 away from the chip assembly 100 along the first direction X, and the first insulating layer 51 is located on the circumferential side of the first conductive line L1 ring in the first direction X, and one end of the first conductive line L1 away from the first pole 21 protrudes from the first insulating layer 51 along the first direction X.

[0102] The first pole 21 and the first conductive line L1 are connected by one side of the slot of the receiving slot 11, the first conductive line L1 is connected to the connection structure 40, and a first insulating layer 51 is formed around the first conductive line L1 in the first direction X. The first insulating layer 51 makes the first conductive line L1 form an independent conductive line. In order to facilitate the connection between the printed circuit board 200 and the remaining structures, one end of the first conductive line L1 away from the first pole 21 is protruded from the first insulating layer 51 along the first direction X, and the remaining structures can connect the part of the first conductive line L1 protruding from the first insulating layer 51 to the first pole 21 on the chip structure 20 to realize data transmission.

[0103] In some embodiments, the chip structure 20 in the chip assembly 100 includes a second pole 22, the second surface M2 includes a second sub-surface that is conductive with the second pole 22, the base 10 includes a conductive material, and the base 10 is conductive with the second sub-surface. The printed circuit board 200 includes a second conductive line L2 that is conductive with the base 10, the second conductive line L2 includes a transition portion L21 that is conductive with the base 10 and a conductive portion L22 that is conductive with the transition portion L21, the transition portion L21 is located at a side of the base 10 that is away from the connection structure 40 along the first direction X, the projection of the chip assembly 100 in the first direction X is located inside the projection of the transition portion L21 in the first direction X, and the conductive portion L22 is located at the peripheral side of the chip assembly 100 in the first direction X.

[0104] The second pole 22 and the second conductive line L2 are connected from one side of the bottom of the accommodating groove 11, and the second conductive line L2 is connected to the base 10. The second conductive line L2 includes a transition portion L21 located on the side of the base 10 away from the connection structure 40 along the first direction X, and a conductive part L22 located on the circumferential side of the base 10 in the first direction X and connected to the transition portion L21. Part of the conductive part L22 passes through the first insulating layer 51. Through the arrangement of the transition portion L21 and the conductive part L22, the second conductive line L2 and the first conductive line L1 can be led out from the same side along the first direction X, so as to facilitate the connection between the printed circuit board 200 and other structures.

[0105] Furthermore, the projection of the chip assembly 100 in the first direction X is inside the projection of the adapter L21 in the first direction X, that is, part of the adapter L21 is outside the chip assembly 100, which can facilitate the connection of the conductive portion L22. At the same time, the adapter L21 can also dissipate the heat generated during the operation of the chip assembly 100 to reduce the concentration and intensity of the heat generated during the operation of the chip assembly 100.

[0106] In some embodiments, the insulating structure 50 includes a second insulating layer 52 and a third insulating layer 53, the second insulating layer 52 is arranged on the peripheral side of the conductive portion L22 in the first direction X and the peripheral side of the chip assembly 100 in the first direction X, the third insulating layer 53 is connected to the side of the adapter L21 away from the chip assembly 100 along the first direction X, and the first insulating layer 51, the second insulating layer 52 and the third insulating layer 53 make the conductive portion L22 and the adapter L21 form an independent conductive line. In order to facilitate the connection between the printed circuit board 200 and the remaining structures, one end of the conductive portion L22 away from the adapter L21 is protruded from the first insulating layer 51 along the first direction X, and the remaining structures can connect the portion of the conductive portion L22 protruding from the first insulating layer 51 to the second pole 22 on the chip structure 20 to achieve data transmission.

[0107] In some embodiments, the chip structure 20 in the chip assembly 100 includes a third pole 23, and the third surface M3 includes a third sub-surface that is conductive with the third pole 23. The printed circuit board 200 includes a third conductive line L3 that is located away from the bottom surface of the groove of the chip structure 20 along the first direction X, and the third conductive line L3 is conductive with the first sub-surface through the connection structure 40. The third conductive line L3 is relatively independently arranged with the first conductive line L1, and the connection structure 40 includes a plurality of spaced connection parts 41, some of the connection parts 41 are connected with the first conductive line L1, and some of the connection parts 41 are connected with the third conductive line L3. The third conductive line L3 passes through the first insulating layer 51, and the first insulating layer 51 forms two opposite paths with the first conductive line L1 and the third conductive line L3. One end of the third conductive line L3 away from the third pole 23 protrudes from the first insulating layer 51 along the first direction X.

[0108] In some embodiments, the chip assembly 100 includes a first chip unit 101 and a second chip unit 102 that are spaced apart. The first chip unit 101 includes a first pole 21 and a second pole 22, and the second chip unit 102 includes a third pole 23 and a fourth pole. The printed circuit board 200 includes a first conductive line L1 that is conductive to the first pole 21, a second conductive line L2 that is conductive to the second pole 22, a third conductive line L3 that is conductive to the third pole 23, and a fourth conductive line that is conductive to the fourth pole. The first conductive line L1 and the fourth conductive line are conductive inside the insulating structure 50, thereby forming a desired circuit conductive structure. Among them, the first chip unit 101 and the second chip unit 102 can be completely the same chip unit, or they can be different chip units, and the actual settings are set according to requirements.

[0109] Thirdly, Figures 5 to 17 As shown, the embodiment of the present application provides a method for manufacturing a printed circuit board 200, wherein the printed circuit board 200 is the printed circuit board 200 described in the second aspect of the embodiment of the present application, and the manufacturing method includes:

[0110] S10, providing a chip assembly 100, wherein the chip assembly 100 is the chip assembly 100 described in the first aspect of the embodiment of the present application;

[0111] S20 , forming a connection structure 40 on one side of the chip assembly 100 along the first direction X, and a portion of the connection structure 40 is located inside the receiving groove 11 along the first direction X and connected to the chip assembly 100 .

[0112] Among them, in S10, providing chip components 100, the tray structure G1 can be used to mass-produce multiple chip components 100. The tray structure G1 is provided with grooves G11 corresponding to the chip components 100 one by one. When the chip components 100 are in the grooves G11, part of the chip components 100 protrude from the tray structure G1 along the first direction X, so that the clamping device can take the chip components 100 out of the grooves G11.

[0113] Furthermore, in S10, providing chip assemblies 100, after the chip assemblies 100 are batch-produced using the tray structure, batch tests are performed on the produced chip assemblies 100. In order to ensure the efficiency of batch testing of chip assemblies 100, a notch G12 is provided on the tray structure G1, and the direction of the notch G12 is on the same side as the direction of the corresponding electrode on the chip assembly 100, so as to ensure that the corresponding electrodes of multiple chip assemblies 100 on the tray structure G1 are in the same direction, thereby improving the efficiency of batch testing of chip assemblies 100.

[0114] In some embodiments, after providing the chip assembly 100 at S10, and before forming the connection structure 40 on one side of the chip assembly 100 along the first direction X at S20, the method further includes: S100, connecting the chip assembly 100 to the transfer portion L21. The chip assembly 100 is welded to the transfer portion L21 by a second flux, the second flux is a conductor material, a third welding layer H3 is formed between the chip assembly 100 and the transfer portion L21, and the melting point of the first flux when the chip structure 20 is connected to the base 10 is higher than the melting point of the second flux, so as to reduce the influence on the connection stability between the chip structure 20 and the base 10 when the chip assembly 100 is welded to the transfer portion L21.

[0115] In some embodiments, after S100, the chip assembly 100 is connected to the transfer portion L21, before S20, the connection structure 40 is formed on one side of the chip assembly 100 along the first direction X, the method further includes: S110, forming a second insulating layer 52 wrapping the chip assembly 100, the second insulating layer 52 includes a connecting hole 521, and the connecting structure 40 is connected to the chip assembly 100 through the connecting hole 521. The above-mentioned insulating structure 50 is the second insulating layer 52 in the overall insulating structure 50 inside the printed circuit board 200, the second insulating layer 52 is connected to the transfer portion L21 by lamination, and the second insulating layer 52 is wrapped around the chip assembly 100. The connecting hole 521 is formed by etching on the second insulating layer 52, and the connecting structure 40 is disposed inside the connecting hole 521 by deposition and connected to the chip assembly 100.

[0116] In some embodiments, in S110, a second insulating layer 52 is formed to wrap the chip component 100, and the second insulating layer 52 includes a connecting hole 521. The connecting structure 40 is connected to the chip component 100 through the connecting hole 521. There are multiple connecting holes 521, and the connecting structure 40 includes multiple connecting parts 41. The connecting parts 41 and the connecting holes 521 are arranged one by one.

[0117] In some embodiments, in S100, the chip assembly 100 is connected to the transfer portion L21, and the chip assembly 100 includes a first chip unit 101 and a second chip unit 102 that are spaced apart. After S100, the chip assembly 100 is connected to the transfer portion L21, a second insulating layer 52 that wraps the chip assembly 100 is formed at S110, and the second insulating layer 52 includes a connecting hole 521. Before the connection structure 40 is connected to the chip assembly 100 through the connecting hole 521, an intermittent hole L211 is etched on the transfer portion L21, and the projection of the intermittent hole L211 in the first direction X is between the projection of the first chip unit 101 in the first direction X and the projection of the second chip unit 102 in the first direction X.

[0118] In some embodiments, at S110, a second insulating layer 52 is formed to wrap the chip assembly 100, the second insulating layer 52 includes a connecting hole 521, the connecting structure 40 is connected to the chip assembly 100 through the connecting hole 521, the second insulating layer 52 also includes a first connecting hole 533, and a portion of the conductive portion L22 is connected to the transition portion L21 through the first connecting hole 533. The first connecting hole 533 is formed by etching on the second insulating layer 52, and the portion of the conductive portion L22 is disposed inside the first connecting hole 533 by deposition and connected to the transition portion L21.

[0119] In some embodiments, after S110, a second insulating layer 52 wrapping the chip component 100 is formed, the second insulating layer 52 includes a connecting hole 521, and the connecting structure 40 is connected to the chip component 100 through the connecting hole 521, it also includes S120, forming a third insulating layer 53 on the side of the transition portion L21 away from the chip component 100, and the third insulating layer 53 is connected to the transition portion L21 by lamination.

[0120] In some embodiments, after forming the connection structure 40 on one side of the chip assembly 100 along the first direction X at S20, the process further includes connecting the first conductor layer 61 to the connection structure 40 at S30, forming a first separation hole 611 on the first conductor layer 61, and the first separation hole 611 divides the first conductor layer 61 into a portion of the first conductive line L1, a portion of the second conductive line L2, and a portion of the third conductive line L3 in the first direction X. The first conductor layer 61 is connected to the connection structure 40 by lamination, and the first separation hole 611 is formed by etching.

[0121] In some embodiments, the first chip unit 101 and the second chip unit 102 are spaced apart on the transition portion L21 , and the first conductor layer 61 connects the corresponding electrodes of the first chip unit 101 and the second chip unit 102 to form a desired circuit structure.

[0122] In some embodiments, after S30, connecting the first conductor layer 61 to the connecting structure 40 and forming the first separation hole 611 on the first conductor layer 61, it also includes: S40, laminating the first insulating layer 51 inside the first separation hole 611, and the size of the first insulating layer 51 in the first direction X is larger than the size of the first separation hole 611 in the first direction X, so as to ensure that the first insulating layer 51 completely fills the first separation hole 611.

[0123] In some embodiments, after S40, laminating the first insulating layer 51 inside the first separation hole 611, the method further includes: S50, forming a plurality of second connection holes 511 on the first insulating layer 51, and the conductor structure is inside the second connection holes 511. The second connection holes 511 are formed on the first insulating layer 51 by etching, and the conductor structure is filled inside the second connection holes 511 by deposition. Among the plurality of second connection holes 511, some second connection holes 511 correspond to the first conductive line L1, some second connection holes 511 correspond to the second conductive line L2, and some third connection holes correspond to the third conductive line L3. The conductor structure forms part of the first conductive line L1, part of the second conductive line L2, and part of the third conductive line L3.

[0124] In some embodiments, after forming a plurality of second connection holes 511 on the first insulating layer 51 and the conductor structure is inside the second connection holes 511 at S50, the method further includes: connecting the second conductor layer 62 to the first insulating layer 51, forming second separation holes 621 on the second conductor layer 62, and the second separation holes 621 divide the second conductor layer 62 into a portion of the first conductive line L1, a portion of the second conductive line L2, and a portion of the third conductive line L3 in the first direction X. The second conductor layer 62 is connected to the first insulating layer 51 by lamination, and the second separation holes 621 are formed by etching.

[0125] Although the present invention has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced by equivalents without departing from the scope of the present invention. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A chip assembly for embedding into a printed circuit board, characterized in that: The chip assembly comprises: A base having a first surface in a first direction and a receiving groove formed by the first surface being recessed inwardly; a chip structure located in the receiving groove, wherein the second surface and the third surface of the chip structure are arranged opposite to each other in the first direction, and the third surface is located on a side of the second surface away from the groove bottom surface of the receiving groove; The first surface is located on a side of the third surface facing away from the groove bottom surface.

2. The chip assembly according to claim 1, characterized in that: The chip assembly further includes a protective layer, the protective layer is located on a side of the chip structure away from the bottom surface of the groove, the protective layer has a fourth surface and a fifth surface arranged opposite to each other in the first direction, and the fifth surface is located on a side of the fourth surface away from the chip structure; The first surface is located on a side of the fifth surface facing away from the groove bottom surface.

3. The chip assembly according to claim 2, characterized in that: The side wall of the protective layer ring in the first direction is spaced apart from the side wall of the accommodating groove; And / or, the side wall of the chip structure ring in the first direction is disposed in contact with the side wall of the accommodating groove.

4. The chip assembly according to claim 1, characterized in that: The peripheral side wall of the base ring in the first direction is inwardly recessed to form a plurality of recesses, and the plurality of recesses all penetrate the base along the first direction and are arranged at intervals around the base in the first direction.

5. The chip assembly according to claim 1, characterized in that: The base includes a conductive material, a portion of the chip structure is conductively connected to the second surface, and the base and a portion of the chip structure are conductively connected to the second surface.

6. A printed circuit board, characterized in that: include: The chip assembly according to any one of claims 1 to 5; A connecting structure, part of which is located inside the receiving groove along the first direction and connected to the chip component.

7. The printed circuit board according to claim 6, characterized in that: It also includes an insulating structure that wraps the chip assembly, and a portion of the insulating structure is located inside the receiving groove along the first direction.

8. The printed circuit board according to claim 7, characterized in that: The connection structure includes a plurality of connection parts arranged at intervals, the projections of the plurality of connection parts in the first direction are all located inside the projection of the chip component in the first direction, and part of the insulation structure is located between adjacent connection parts.

9. The printed circuit board according to claim 7, characterized in that: The chip structure in the chip assembly includes a first pole, and the third surface includes a first sub-surface that is conductive with the first pole; The printed circuit board comprises a first conductive circuit located along the first direction on the chip structure away from the bottom surface of the groove, and the first conductive circuit is conductively connected to the first sub-surface through the connecting structure; The insulating structure includes a first insulating layer located on the side of the connecting structure away from the chip component along the first direction, the first insulating layer is located on the peripheral side of the first conductive line ring in the first direction, and one end of the first conductive line away from the first pole protrudes from the first insulating layer along the first direction.

10. The printed circuit board according to claim 6, characterized in that: The chip structure in the chip assembly includes a second pole, the second surface includes a second sub-surface that is conductively connected to the second pole, the base includes a conductive material, and the base is conductively connected to the second sub-surface; The printed circuit board includes a second conductive circuit connected to the base, the second conductive circuit includes a transition portion connected to the base and a conductive portion connected to the transition portion, the transition portion is located on a side of the base away from the connecting structure along the first direction, the projection of the chip component in the first direction is inside the projection of the transition portion in the first direction, and the conductive portion is located on the peripheral side of the chip component ring in the first direction.

11. The printed circuit board according to claim 6, characterized in that: The chip assembly comprises a first chip unit and a second chip unit which are spaced apart from each other, wherein the first chip unit comprises a first pole and a second pole, and the second chip unit comprises a third pole and a fourth pole; The printed circuit board comprises a first conductive circuit connected to the first pole, a second conductive circuit connected to the second pole, a third conductive circuit connected to the third pole, and a fourth conductive circuit connected to the fourth pole; The first conducting circuit is conductively connected to the fourth conducting circuit inside the insulating structure.

12. A method for manufacturing a printed circuit board, characterized in that: include: Providing a chip assembly, wherein the chip assembly is the chip assembly according to any one of claims 1 to 5; A connection structure is formed on one side of the chip component along a first direction, and a portion of the connection structure is located inside the receiving groove along the first direction and connected to the chip component.

13. The printed circuit board according to claim 12, characterized in that: After providing the chip assembly and before forming a connection structure on one side of the chip assembly along the first direction, the method further includes: An insulating structure is formed to wrap the chip component, wherein the insulating structure includes a connecting hole, and the connecting structure is connected to the chip component through the connecting hole.

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