Method for producing circuit arrangement of electric machine, power semiconductor module of circuit arrangement, and corresponding circuit arrangement

Abstract

The invention relates to a method for producing a circuit arrangement for an electric machine, comprising at least one power input that can be connected to an electrical energy store, at least one power semiconductor arranged in a power semiconductor module, and at least one power output that can be connected to an excitation coil of the electric machine, the power input is electrically connected to a first power connection of the power semiconductor module via an intermediate circuit of the circuit arrangement, and the power output is electrically connected to a second power connection of the power semiconductor module via a control board of the circuit arrangement, the second power connection being designed as at least one contact pin protruding beyond the power semiconductor module, the contact pin is pressed into the contact notch of the control board. The first power connection is designed in a planar manner on the power semiconductor module and is electrically and mechanically connected to a bus bar of an intermediate circuit capacitor of the intermediate circuit. The invention also relates to a power semiconductor module for a circuit arrangement of an electric machine and to a corresponding circuit arrangement.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a circuit device for an electric motor, wherein the circuit device has at least one power input that can be connected to an electric energy storage device, at least one power semiconductor arranged in a power semiconductor module, and at least one power output that can be connected to an excitation coil of the electric motor, wherein the power input is electrically connected to a first power connection of the power semiconductor module via an intermediate circuit of the circuit device, and the power output is electrically connected to a second power connection of the power semiconductor module via a control board of the circuit device, wherein the second power connection is designed as at least one contact pin protruding from the power semiconductor module, which contact pin is pressed into a contact notch of the control board. The present invention also relates to a power semiconductor module for a circuit device for an electric motor and a corresponding circuit device. Background Art

[0002] In the prior art, for example, document DE 10 2019 132 685 A1 is known. This document relates to a circuit arrangement comprising an excitation circuit and a converter circuit, wherein the converter circuit is arranged on a first carrier element and comprises an intermediate circuit capacitor arranged on the DC side of the converter circuit, wherein the intermediate circuit capacitor has at least one connection, wherein the excitation circuit is arranged on a second carrier element, wherein the excitation circuit is connected to the intermediate circuit capacitor by directly connecting the second carrier element to at least one connection of the intermediate circuit capacitor. Summary of the invention

[0003] The object of the present invention is to specify a method for producing a circuit arrangement which, compared to the prior art, has the advantage that in particular a more reliable and more efficient connection of a power semiconductor module to an intermediate circuit is possible.

[0004] According to the invention, this object is achieved by a method for producing a circuit arrangement of an electric machine having the features of claim 1. It is provided that the first power connection is formed flat on the power semiconductor module and is electrically and mechanically connected to a busbar of an intermediate circuit capacitor of the intermediate circuit.

[0005] Advantageous embodiments of the invention with suitable improvements are given in the dependent claims. It should be pointed out that the exemplary embodiments described in the description are not restrictive; on the contrary, any modifications of the features disclosed in the description, claims and drawings are possible.

[0006] The circuit arrangement is used to provide an excitation voltage for an excitation coil of an electric motor. The electric motor is preferably a component of a motor vehicle power plant and is used to provide a drive torque intended to drive the motor vehicle. For this purpose, the electric motor is used to convert electrical energy at least temporarily into mechanical energy. In this case, the electrical energy is taken, for example, from an electrical energy storage device, which can also be referred to as a power battery. Preferably, the electric motor can be electrically connected to the electrical energy storage device via the circuit arrangement, or can be connected to the electrical energy storage device via the circuit arrangement.

[0007] In order to provide the drive torque, a rotating field is at least temporarily generated by the electric machine. This is done by at least one converter / inverter, which is electrically connected to the stator winding of the electric machine to provide an AC voltage for the stator winding of the electric machine. The converter is preferably in the form of a multi-phase converter, in particular a three-phase converter. Accordingly, the electric machine is a multi-phase machine, in particular a three-phase machine.

[0008] In addition to the rotating field, the electric machine also generates an excitation field. For this purpose, the electric machine has an excitation coil, which is provided, for example, as a corresponding rotor winding of the electric machine. During operation of the electric machine, the excitation field rotates synchronously with the rotating field. The electric machine is therefore a separately excited synchronous machine.

[0009] The excitation voltage for generating the excitation field of the motor is generated by a DC voltage provided by an electric energy storage device. This is done with the aid of a circuit device having a power input connected or connectable to the electric energy storage device and a power output connected or connectable to the excitation coil. In other words, the circuit device is connected or connectable to the electric energy storage device on the input side and is connected or connectable to the excitation coil on the output side. For example, the power input of the circuit device comprises a first power input connected or connectable to a first pole of the electric energy storage device and a second power input connected or connectable to a second pole of the electric energy storage device. The power output, for example, comprises a first power output connected or connectable to a first pole of the excitation coil and a second power output connected or connectable to a second pole of the excitation coil.

[0010] The circuit arrangement has an intermediate circuit on the input side. The intermediate circuit has an intermediate circuit capacitor, which is provided for smoothing the DC voltage provided at the power input. The intermediate circuit capacitor is connected in parallel with the power input. In particular, a first pole of the intermediate circuit capacitor is electrically connected to the first power input, and a second pole of the intermediate circuit capacitor is electrically connected to the second power input. The intermediate circuit capacitor provides an intermediate circuit voltage applied to the pole of the intermediate circuit capacitor.

[0011] The excitation voltage is generated from the intermediate circuit voltage present at the intermediate circuit capacitor. To this end, the circuit arrangement has at least one power semiconductor arranged in a power semiconductor module. The power semiconductor module has a first power connection and a second power connection, which are electrically connected to each other via the power semiconductor arranged in the power semiconductor module. The first power connection of the power semiconductor module is connected to the intermediate circuit of the circuit arrangement. In this regard, the first power connection is electrically connected to the power input of the circuit arrangement via the intermediate circuit.

[0012] The power semiconductor module is designed to convert the intermediate circuit voltage present on the first power connection into an excitation voltage and to provide the excitation voltage to the second power connection. The power semiconductor module is in particular embodied as a DC voltage converter. For example, the power semiconductor module comprises at least two transistors and at least two freewheeling diodes, which together form a DC voltage converter. Particularly preferably, the power semiconductor module is embodied as a two-quadrant controller. The second power connection of the power semiconductor module is electrically connected to the power output of the circuit arrangement. In this regard, the excitation voltage generated by means of the power semiconductor module is provided at the power output.

[0013] In addition to the power semiconductor module, the circuit arrangement preferably includes the converter already explained above, which is used to provide an AC voltage to generate a rotating field. In this case, the converter is preferably also electrically connected to the intermediate circuit. Therefore, the circuit arrangement preferably generates an excitation voltage for generating an excitation field and an AC voltage for generating a rotating field from the intermediate circuit voltage. This is done with the aid of power semiconductor modules and converters. In order to provide the AC voltage, the circuit arrangement preferably has other power outputs that are connected to the converter on the output side.

[0014] The circuit arrangement also has a control board. The control board is used to control the circuit arrangement, in particular to control the power semiconductor module and / or the converter. The power semiconductor module is fixed to the control board. This should be understood as: the power semiconductor module and the control board are mechanically and electrically connected to each other. The connection between the power semiconductor module and the control board is completed at least via the second power connection part of the power semiconductor module. The second power connection part is presented as at least one contact pin protruding from the power semiconductor module.

[0015] The control board has a contact notch into which the contact pin of the second power connection is pressed. The contact notch of the control board is connected to the power output of the circuit device via at least one conductor path of the control board. In this regard, the second power connection is electrically connected to the power output of the circuit device via the control board.

[0016] During production of the circuit arrangement, the control board and the power semiconductor module are connected to each other by pressing contact pins into contact recesses in the control board. Thus, an electrical connection between the second power connection and the conductor track and a mechanical connection between the power semiconductor module and the control board are simultaneously established. The contact recess is provided, for example, as a hole in the control board, the inner wall of which is designed to be electrically conductive and is connected to the conductor track.

[0017] The contact pins protrude from the power semiconductor module at the outer wall of the power semiconductor module. For press-in, the control board and the outer wall of the power semiconductor module are arranged parallel to each other so that the longitudinal center axis of the contact pin and the longitudinal center axis of the contact recess are aligned with each other. Then, the control board and the power semiconductor module are moved toward each other using a corresponding press-in force, wherein the contact pins are pushed into the contact recess and pressed therein.

[0018] The contact pins and the contact recesses are designed in such a way that, after being pressed in, the contact pins are held in the contact recesses in a force-locking or clamping manner. Thus, the control board and the power semiconductor module are electrically and mechanically connected to one another by pressing in. It should be noted that the mechanical connection does not necessarily have to be effected exclusively via the second power connection. Instead, the power semiconductor module can have correspondingly further contact pins pressed into the control board and / or a screw connection can be provided for fixing the power semiconductor module.

[0019] It can now be provided that the first power connection of the power semiconductor module is also designed as at least one contact pin protruding from the power semiconductor module and that the contact pin is connected to the control board by pressing in. In this case, the electrical connection of the power semiconductor module to the intermediate circuit or the intermediate circuit capacitor is realized via the control board. Accordingly, for example, a screw connection or other connection method of the control board to the intermediate circuit capacitor is provided. This is not only associated with higher material and manufacturing costs, but also leads to or increases the leakage inductance occurring on the input side, so that corresponding filtering measures are required to minimize the leakage inductance.

[0020] Alternatively, the invention provides that the first power connection is formed in a planar manner on the power semiconductor module. This enables the power semiconductor module to be connected, in particular directly connected, to the intermediate circuit capacitor, bypassing the control board. In addition, the intermediate circuit capacitor has a busbar, which is connected to the first power connection formed in a planar manner to connect the intermediate circuit. The busbar is understood to be a current busbar, in particular formed in a planar manner, via which the intermediate circuit capacitor is connected to the power semiconductor module and the converter. In other words, the power semiconductor module and the converter are preferably connected to the same busbar of the intermediate circuit capacitor.

[0021] Busbars are usually used to establish electrical connections designed for high current intensity or high power. Therefore, busbars are used to connect to power semiconductor modules designed to transmit high power. Here, corresponding planarly constructed connections are usually provided on the input side and on the output side for connection to the busbar. However, the present invention provides that only the first power connection of the power semiconductor module for connection to the busbar is constructed in a planar manner, while the second power connection is constructed as at least one contact pin.

[0022] The first power connection has at least one, in particular flat, contact surface which is designed to be in contact with a busbar of the intermediate circuit capacitor. The power semiconductor module is electrically and mechanically connected to the busbar of the intermediate circuit capacitor by connecting the busbar to the first power connection at the contact surface.

[0023] Preferably, the first power connection has at least two contact surfaces arranged at a distance from each other, which are each provided to be connected to a first pole and a second pole of the intermediate circuit capacitor. Accordingly, the first pole and the second pole of the intermediate circuit capacitor are preferably each designed as a busbar.

[0024] The first power connection of the power semiconductor module is therefore not connected to the power input of the circuit arrangement via the control board. Instead, the first power connection is electrically connected to the intermediate circuit capacitor, bypassing the control board. In particular, the first power connection of the power semiconductor module is directly connected to a busbar of the intermediate circuit capacitor, bypassing the control board.

[0025] The invention is based on the recognition that connecting a power semiconductor module to an intermediate circuit capacitor via a busbar has advantages over a connection via a control board. As a result, the control board can be made correspondingly more cost-effective. The conventionally provided screw connection of the control board to the intermediate circuit capacitor or other connection methods are not necessary or eliminated. In addition, the leakage inductance occurring on the input side is minimized and filtering measures required in the case of a connection via a control board are avoided. Overall, the invention provides a more efficient and more reliable circuit arrangement, in particular a more efficient and more reliable connection of a power semiconductor module to an intermediate circuit capacitor.

[0026] A further development of the invention provides that the power semiconductor module is fastened to a heat sink of the circuit arrangement before the first power connection is connected to the busbars of the intermediate circuit capacitor. The heat sink is preferably a component of a frame carrying the circuit arrangement or is fastened to such a frame.

[0027] The cooling body is designed to remove the heat generated by the power semiconductor module. The power semiconductor module is fixed to the cooling body in such a way that it abuts against the cooling body in a planar manner. Preferably, the power semiconductor module abuts against the cooling body with a side opposite to the first power connection part and / or the second power connection part. For example, the first power connection part and / or the second power connection part are arranged on the upper side of the power semiconductor module so that the lower side of the power semiconductor module abuts against the cooling body. This enables particularly efficient heat dissipation of the heat generated by the power semiconductor module.

[0028] A further development of the invention provides that the power semiconductor module is fixed to the cooling body by surface sintering and / or by surface soldering. Preferably, the power semiconductor module rests with its underside against the cooling body, as already indicated above.

[0029] The underside is preferably designed to be flat. It is now provided that the underside of the power semiconductor module is fixed to the cooling body. This is done accordingly by surface sintering and / or by surface soldering. In particular, no screw connection is provided to fix the power semiconductor module to the cooling body. Instead, the power semiconductor module is fixed directly to the cooling body by sintering or soldering. This achieves particularly reliable fixing.

[0030] A refinement of the invention provides that the first power connection is electrically and mechanically connected to a busbar of an intermediate circuit capacitor by welding. The intermediate circuit capacitor is preferably arranged adjacent to the heat sink, for example, on a frame that carries the circuit arrangement. The intermediate circuit capacitor is preferably arranged such that the busbar of the intermediate circuit capacitor is in contact with the first power connection after the power semiconductor module is fixed to the heat sink.

[0031] After the power semiconductor module is fixed to the cooling body, the first power connection is connected to the busbar. For this purpose, the first power connection is welded to the busbar, whereby the first power connection is electrically and mechanically connected to the busbar. Alternatively, it is provided that the first power connection and the busbar are connected to each other by a screw connection. After the connection, the first power connection is directly connected to the busbar. As a result, a particularly reliable electrical connection is established between the power semiconductor module and the intermediate circuit capacitor.

[0032] According to a further development of the present invention, after the power semiconductor module is fixed on the heat sink, the control board is connected to the power semiconductor module by pressing at least one contact pin into a contact notch of the control board. It has been mentioned above that the power semiconductor module is connected to the control board by pressing in the contact pin.

[0033] Preferably, the power semiconductor module is connected to the control board only after the first power connection is connected to the busbar of the intermediate circuit capacitor. In other words, the power semiconductor module is first fixed to the heat sink. Subsequently, the first power connection is connected to the busbar. Subsequently, the second power connection is connected to the control board by pressing the contact pin into the contact notch, and the control board is thus fixed to the power semiconductor module. This ensures that the first power connection is not covered by the control board when it is connected to the busbar.

[0034] Alternatively, it is provided that the power semiconductor module is first fixed to the heat sink and then the control board is fixed to the power semiconductor module. In this case, the first power connection is connected to the busbar after the control board has been fixed. The control board is preferably designed in such a way that it does not cover the first power connection. For example, the control board has a corresponding recess for this purpose, through which the first power connection can be accessed for connecting the busbar after the control board has been fixed.

[0035] The present invention also relates to a power semiconductor module for a circuit arrangement of an electric machine, in particular a power semiconductor module for a circuit arrangement produced by a method according to an embodiment within the scope of the present invention, wherein the power semiconductor module has a first power connection and a second power connection, the first power connection and the second power connection being electrically connected to each other via a power semiconductor arranged in the power semiconductor module, wherein the second power connection is designed as at least one contact pin protruding from the power semiconductor module. It is provided that the first power connection is formed flat on the power semiconductor module.

[0036] The advantages of this design of a power semiconductor module and a circuit arrangement and a corresponding method have been pointed out. The power semiconductor module and the circuit arrangement and the production method for the semiconductor module and the circuit arrangement can be improved according to the embodiments within the scope of the description, so that reference is made to these embodiments in this regard.

[0037] A development of the invention provides that the first power connection and the second power connection are formed on a flat outer wall of the power semiconductor module. The flat outer wall is preferably a component of a housing of the power semiconductor module.

[0038] Preferably, the first power connection and the second power connection are arranged on the same outer wall of the power semiconductor module. The outer wall is, for example, the upper side of the power semiconductor module. The lower side of the power semiconductor module opposite the upper side is designed for fixing to a heat sink.

[0039] Particularly preferably, the first power connection and the second power connection are arranged on opposite sides of the same outer wall. In particular, the first power connection is arranged such that, after the power semiconductor module is fastened to the heat sink, it is present on the side of the outer wall facing the intermediate circuit capacitor. Correspondingly, the second power connection is arranged such that it is present on the side of the outer wall facing away from the intermediate circuit capacitor. This enables a particularly efficient connection of the power semiconductor module to the intermediate circuit capacitor, since the distance between the first power connection and the intermediate circuit capacitor is minimized.

[0040] Additionally or alternatively, it is provided that the first power connection protrudes at least partially beyond the outer wall on the side facing the intermediate circuit capacitor. This facilitates the connection of the first power connection to a busbar of the intermediate circuit capacitor.

[0041] According to a further development of the present invention, the first power connection part is sunk into a notch of a flat outer wall. The first power connection part is formed flatly on a flat outer wall, in particular on the upper side, of the power semiconductor module. The outer wall is correspondingly provided with a notch, into which the first power connection part is sunk.

[0042] The recess extends through the outer wall and is open laterally. The recess is designed such that a busbar of the intermediate circuit capacitor can engage with the recess at least partially, wherein the busbar is in contact with the first power connection. In particular, the depth of the recess is dimensioned perpendicular to the outer wall such that after being connected to the first power connection, the busbar does not protrude beyond the outer wall in a direction perpendicular to the outer wall. This provides a particularly compact arrangement.

[0043] A development of the invention provides that at least one further contact pin is provided on the flat outer wall, which is connected to a control connection of a power semiconductor. The control connection serves to control a power semiconductor arranged in the power semiconductor module. The contact pin protrudes beyond the power semiconductor module.

[0044] The control connection and the contact pin connected to the control connection are preferably arranged between the first power connection and the second power connection on the flat outer wall.

[0045] The control board accordingly has further contact recesses into which the contact pins of the control connection are pressed after the control board is connected to the power semiconductor module. This enables a particularly compact design of the control board.

[0046] The invention also relates to a circuit arrangement for an electric machine, in particular a circuit arrangement according to an embodiment within the scope of the description, wherein the circuit arrangement has at least one power input that can be connected to an electric energy storage device, at least one power semiconductor arranged in a power semiconductor module and at least one power output that can be connected to an excitation coil of the electric machine, wherein the power input is electrically connected to a first power connection of the power semiconductor module via an intermediate circuit of the circuit arrangement, and the power output is electrically connected to a second power connection of the power semiconductor module via a control board of the circuit arrangement, wherein the second power connection is formed as at least one contact pin protruding from the power semiconductor module and pressed into a contact recess of the control board. It is provided that the first power connection is formed flatly on the power semiconductor module and is electrically and mechanically connected to a busbar of an intermediate circuit capacitor of the intermediate circuit.

[0047] The advantages of this design of the circuit arrangement and the corresponding power semiconductor module have already been pointed out. The circuit arrangement and the power semiconductor module can be further developed according to the embodiments within the scope of the description, so that reference is made to these embodiments in this regard.

[0048] The features and feature combinations described in the specification, especially the features and feature combinations described in the following description of the figures and / or shown in the figures, can be used not only in the corresponding specified combination, but also in other combinations or alone, without departing from the scope of the present invention. Therefore, embodiments that are not explicitly shown or explained in the specification and / or the figures, but are obtained or can be derived from the feature combinations formed by the described embodiments, are also considered to be covered by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] The invention is further explained below with reference to the embodiments shown in the drawings, but without limiting the invention.

[0050] in:

[0051] Figure 1 A schematic diagram of a power semiconductor module of a circuit arrangement for an electric machine is shown,

[0052] Figure 2 A schematic diagram of a circuit arrangement for an electric machine is shown. DETAILED DESCRIPTION

[0053] Figure 1A power semiconductor module 1 is shown for a circuit arrangement 2 of an electric machine (not shown in detail). The power semiconductor module 1 has a first power connection 3 and a second power connection 4, which are electrically connected to one another via a power semiconductor (not shown in detail). The power semiconductor module 1 is preferably a DC voltage converter, by means of which an input voltage applied to the first power connection 3 is converted into an output voltage present at the second power connection 4.

[0054] The first power connection 3 and the second power connection 4 are formed on a flat outer wall 5 of the power semiconductor module 1. The first power connection 3 is formed flat on the power semiconductor module 1. In the example shown, the first power connection 3 has two contact surfaces arranged at a distance from each other, between which the input voltage is applied.

[0055] The second power connection 4 is a plurality of contact pins protruding from the power semiconductor module 1. In the example shown, the second power connection 4 has four contact pins, wherein the output voltage is present between respective two of the four contact pins.

[0056] The two power connections 3, 4 are arranged on opposite sides of the outer wall 5. A control connection 6 is provided between the power connections 3 and 4, which is a plurality of contact pins protruding from the power semiconductor module 1. The control connection 6 serves to control the power semiconductors arranged in the power semiconductor module 1. In the example shown, the control connection 6 has a total of six contact pins.

[0057] Figure 2 A circuit arrangement 2 for an electric machine (not shown in detail) is shown. The circuit arrangement 2 comprises a power semiconductor module 1, an intermediate circuit capacitor 7 and a converter 8. A power input (not shown in detail) of the circuit arrangement 2 can be connected to an electrical energy store.

[0058] The power input is connected to an intermediate circuit capacitor 7, which has a plurality of busbars 9 for connection to the power semiconductor module 1 and the converter 8. Preferably, the circuit arrangement 2 comprises a plurality of converters 8, wherein only one converter 8 is shown here. The intermediate circuit capacitor 7 provides an intermediate circuit voltage via the busbars 9, which serves as an input voltage for the power semiconductor module 1 and the converter 8. By way of example, the intermediate circuit capacitor 7 has at least two busbars 9, each of which is connected to one pole of the intermediate circuit capacitor 7.

[0059] The power semiconductor module 1 is fixed with its bottom side to a heat sink 10 of the circuit arrangement 1. The top side of the power semiconductor module 1 is connected to a control board 11. The power semiconductor module 1 is therefore covered by the control board 11 and is therefore only shown with dashed lines.

[0060] The contact pins of the second power connection 4 and the contact pins of the control connection 6 of the power semiconductor module 1 are electrically and mechanically connected to the control board 11 by being pressed into corresponding contact recesses of the control board 11 .

[0061] On the other hand, the first power connection 3 of the power semiconductor module 1 is electrically and mechanically connected to the busbar 9 of the intermediate circuit capacitor 7 while bypassing the control board 11. In this case, the busbar 9 engages in a recess present in the outer wall 5 of the power semiconductor module 1, into which the connection surface of the first power connection 3 is recessed.

[0062] The control board 11 can be connected to the excitation coil of the motor via a power output (not shown in detail) of the circuit arrangement 1. By means of the power semiconductor module 2, an excitation voltage for the excitation coil of the motor is provided at the power output from the intermediate circuit voltage applied to the first power connection 3.

[0063] To produce the circuit arrangement 2, firstly the underside of the power semiconductor module 1 is fastened to the heat sink 10. This is done by surface sintering and / or surface soldering.

[0064] After the power semiconductor module 1 has been fixed to the heat sink 10 , the busbar 9 of the intermediate circuit capacitor 7 is electrically and mechanically connected to the contact surface of the first power connection 3 of the power semiconductor module 1 by welding.

[0065] Subsequently, the control board 11 is connected to the power semiconductor module 1 by pressing in the contact pins of the second power connection 4 and the contact pins of the control connection 6 .

[0066] Alternatively, after the power semiconductor module 1 has been fixed to the heat sink, the control board is first connected to the power semiconductor module 1 by pressing contact pins in. Subsequently, the first power connection 3 of the power semiconductor module 1 is electrically and mechanically connected to the busbar 9 of the intermediate circuit capacitor 7 .

[0067] List of reference numerals:

[0068] 1 Power semiconductor module

[0069] 2 Circuit Devices

[0070] 3 First power connection

[0071] 4 Second power connection

[0072] 5 outer wall

[0073] 6 Control connection

[0074] 7 Intermediate circuit capacitor

[0075] 8 Converter

[0076] 9 Busbar

[0077] 10 cooling body

[0078] 11 Control Panel

Claims

1. A method for producing a circuit arrangement (2) for an electric machine, wherein: The circuit device (2) comprises at least one power input part which can be connected to an electric energy storage device, at least one power semiconductor arranged in a power semiconductor module (1) and at least one power output part which can be connected to an excitation coil of the motor, wherein the power input part is electrically connected to a first power input part (3) of the power semiconductor module (1) via an intermediate circuit of the circuit device (2), and the power output part is electrically connected to a second power connection part (4) of the power semiconductor module (1) via a control board (11) of the circuit device (2), wherein the second power connection part (4) is designed as at least one contact pin protruding from the power semiconductor module (1) and pressed into a contact notch of the control board (11), characterized in that the first power connection part (3) is designed in a planar manner on the power semiconductor module (1) and is electrically and mechanically connected to a bus bar (9) of an intermediate circuit capacitor (7) of the intermediate circuit.

2. The method according to claim 1, characterized in that Before the first power connection (3) is connected to a busbar (9) of an intermediate circuit capacitor (7), a power semiconductor module (1) is fastened to a cooling body (10) of a circuit arrangement (2).

3. The method according to any one of the preceding claims, characterized in that The power semiconductor module (1) is fixed on the cooling body (10) by surface sintering and / or surface brazing.

4. The method according to any one of the preceding claims, characterized in that The first power connection (3) is electrically and mechanically connected to a busbar (9) of an intermediate circuit capacitor (7) by welding.

5. The method according to any one of the preceding claims, characterized in that After the power semiconductor module (1) is fixed on the cooling body (10), the control board (11) is connected to the power semiconductor module (1) by pressing at least one contact pin into a contact notch of the control board (11).

6. A power semiconductor module (1) for a circuit arrangement (2) for an electric machine, in particular for a circuit arrangement (2) produced by a method according to one or more of the preceding claims, wherein: A power semiconductor module (1) comprises a first power connection part (3) and a second power connection part (4), wherein the first power connection part and the second power connection part are electrically connected to each other via a power semiconductor arranged in the power semiconductor module (1), wherein the second power connection part (4) is designed as at least one contact pin protruding from the power semiconductor module (1), and is characterized in that the first power connection part (3) is designed in a planar manner on the power semiconductor (1).

7. The power semiconductor module (1) according to claim 6, characterized in that The first power connection (3) is formed on a flat outer wall (5) of the power semiconductor module (1).

8. The power semiconductor module (1) according to claim 6 or 7, characterized in that: The first power connection (3) is sunk into a recess in the flat outer wall (5).

9. The power semiconductor module (1) according to any one of claims 6 to 8, characterized in that At least one further contact pin which is connected to a control connection (6) of a power semiconductor is arranged on the flat outer wall (5).

10. A circuit arrangement (2) for an electric machine, in particular comprising a power semiconductor module (1) according to any one of claims 6 to 9, wherein: The circuit device (2) comprises at least one power input part which can be connected to an electric energy storage device, at least one power semiconductor arranged in a power semiconductor module (1) and at least one power output part which can be connected to an excitation coil of an electric motor, wherein the power input part is electrically connected to a first power connection part (3) of the power semiconductor module (1) via an intermediate circuit of the circuit device (2), and the power output part is electrically connected to a second power connection part (4) of the power semiconductor module (1) via a control board (11) of the circuit device (2), wherein the second power connection part (4) is designed as at least one contact pin protruding from the power semiconductor module (1) and pressed into a contact notch of the control board (11), and is characterized in that the first power connection part (3) is formed in a planar manner on the power semiconductor module (1) and is electrically and mechanically connected to a bus bar (9) of an intermediate circuit capacitor (7) of the intermediate circuit.

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