SMD quartz crystal resonator processing method

Abstract

The invention provides an SMD (Surface Mounted Device) quartz crystal resonator processing method, which comprises the following steps of: adsorbing and fixing a resonator whole plate through a resonator adsorption mold, dividing the resonator whole plate into resonator units by a cutting machine, adsorbing and fixing the resonator units by an adsorption plate, adsorbing and fixing a cover plate whole plate through a cover plate adsorption mold, and dividing the cover plate whole plate into cover plate units by the cutting machine. The cover plate unit is adsorbed and fixed by the adsorption seat, the periphery of the resonator unit is coated with solder paste, the resonator adsorption mold and the cover plate adsorption mold are closed, so that the cover plate unit covers the resonator unit, and then the cover plate unit is welded and fixed on the resonator unit through cooperation of a laser welding technology and the solder paste on the periphery of the resonator unit. According to the SMD quartz crystal resonator, the resonator whole plate and the cover plate whole plate are firstly segmented, the resonator unit and the cover plate unit obtained through segmentation are fixed through the adsorption mold, then the resonator unit and the cover plate unit are fixed through the laser welding technology, and the quality of the SMD quartz crystal resonator is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of resonators, and in particular relates to a method for processing an SMD quartz crystal resonator. Background Art

[0002] SSMD quartz crystal resonators are commonly used electronic devices, and their use is increasing with the development of digital technology. SMD quartz crystal resonators, also known as quartz crystal oscillators, are made by cutting and polarizing quartz crystals. Quartz crystals have a piezoelectric effect, that is, when external force is applied to a quartz crystal, a voltage is generated, and vice versa. This property enables quartz crystals to be used as oscillators.

[0003] The existing SMD quartz crystal resonator processing methods are generally divided into single-piece processing and whole-board processing, which differ in the order of segmentation. The single-piece processing method: segment the whole resonator board into resonator units, segment the whole cover board into cover units, and then fix and weld the cover units on the resonator units; the whole-board processing method: fix and weld the whole cover board on the whole resonator board, and then segment the welded whole board into SMD quartz crystal resonators. The production efficiency of the whole-board processing method is much higher than that of the single-piece processing method, but the existing whole-board processing method is easy to cause the welding of the cover unit and the resonator unit to loosen during cutting, affecting the quality of the SMD quartz crystal resonator. Summary of the invention

[0004] The object of the present invention is to provide a method for processing an SMD quartz crystal resonator to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a method for processing an SMD quartz crystal resonator, providing a resonator whole plate and a cover plate whole plate, the resonator whole plate includes a plurality of resonator units, the cover plate whole plate includes a plurality of cover plate units, including: S1: placing the resonator whole plate on a resonator adsorption mold, the resonator adsorption mold adsorbs and fixes the resonator whole plate through negative pressure, the resonator adsorption mold is provided with an adsorption plate, and the resonator unit corresponds to the position of the adsorption plate;

[0006] S2: using a cutting machine to divide the resonator units on the whole resonator plate into individual independent units, and the resonator units are adsorbed and fixed by the adsorption plate;

[0007] S3: placing the entire cover plate on a cover plate adsorption mold, wherein the cover plate adsorption mold adsorbs and fixes the entire cover plate by negative pressure, wherein the cover plate adsorption mold is provided with an adsorption seat, and the cover plate unit corresponds to the position of the adsorption seat;

[0008] S4: using a cutting machine to divide the cover plate units on the entire cover plate into individual independent units, and the cover plate units are adsorbed and fixed by the adsorption plate;

[0009] S5: using an air gun to clean foreign matter on the resonator unit and the cover unit;

[0010] S6: Apply solder paste on the periphery of the resonator unit, bring the cover adsorption mold close to the resonator adsorption mold, so that the cover unit covers the corresponding resonator unit, the cover adsorption mold stops the adsorption effect, separates the adsorption seat from the cover unit, removes the cover adsorption mold, uses laser welding technology to cooperate with the solder paste on the periphery of the resonator unit, and welds the cover unit to the resonator unit to obtain an SMD quartz crystal resonator.

[0011] Preferably, the resonator adsorption mold is provided with a negative pressure chamber, the top of the negative pressure chamber is sealed with an upper cover, the upper cover is fixedly installed with an electrical connector, the negative pressure chamber is fixedly installed with a circuit board, the circuit board is electrically connected to the electrical connector through a flexible flat cable, the circuit board is fixedly installed with a test terminal, the adsorption plate is fixedly installed with the test terminal through an insulating sleeve, and the test terminal is electrically connected to the pin of the resonator unit through the test terminal, and S6 also includes: the controller is electrically connected to the test terminal connected to the circuit board through the electrical connector to detect the quality of the resonator unit.

[0012] Preferably, the adsorption plate is installed with 4 test terminals, and the controller sets a code for each resonator unit on the adsorption plate, and the coding structure is: the resonator whole plate number, matrix coordinate X, matrix coordinate Y, resonator good or bad state, resonator frequency, and the code is stored in the database, and the waste processing device removes the damaged resonator according to the matrix coordinate X, matrix coordinate Y and resonator good or bad state of the code.

[0013] Preferably, the resonator adsorption mold is provided with a positioning detection target, and the cover plate adsorption mold is fixedly installed with a CCD camera, and the S6 also includes: during the process of the resonator adsorption mold and the cover plate adsorption mold, the controller photographs the positioning detection target through the CCD camera, and calculates the position offset value of the resonator adsorption mold and the cover plate adsorption mold, and aligns and closes the resonator adsorption mold and the cover plate adsorption mold through a fine-tuning mechanism.

[0014] Preferably, the adsorption plate is provided with a first adsorption hole, and a first soft rubber ring is fixedly installed on the adsorption plate, and the first adsorption hole is located on the inner side of the first soft rubber ring. S2 also includes: the resonator unit and the first soft rubber ring form a chamber, and the first adsorption hole draws air from the chamber so that the resonator unit is adsorbed and fixed on the adsorption plate.

[0015] Preferably, the adsorption seat is provided with a second adsorption hole, and a second soft rubber ring is fixedly installed on the adsorption seat, and the second adsorption hole is located on the inner side of the second soft rubber ring. The S4 also includes: the cover unit and the second soft rubber ring form a chamber, and the second adsorption hole draws air from the chamber, so that the cover unit is adsorbed and fixed on the adsorption seat.

[0016] Preferably, S5 also includes: the cover plate adsorption mold moves the cover plate unit into the paint pool, the cover plate adsorption mold slowly rotates and swings once, the cover plate adsorption mold lifts the cover plate unit, drains it, dries it, places the dried cover plate unit on a grinder, and grinds off the paint on the soldering part at the bottom of the cover plate unit.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The present invention uses a resonator adsorption mold to adsorb and fix the entire resonator plate. The adsorption plate of the resonator adsorption mold corresponds to the position of the resonator unit of the entire resonator plate. The entire resonator plate is divided into resonator units by a cutting machine. The resonator units are adsorbed and fixed by the adsorption plate. The cover plate adsorption mold adsorbs and fixes the entire cover plate. The adsorption seat of the cover plate adsorption mold corresponds to the position of the cover plate unit of the entire cover plate. The cover plate is divided into cover plate units by a cutting machine. The cover plate units are adsorbed and fixed by the adsorption seat. An air gun is used to clean foreign matter on the resonator unit and the cover plate unit. The periphery of the resonator unit is coated with solder paste, the resonator adsorption mold and the cover plate adsorption mold are molded together, so that the cover plate unit is covered on the resonator unit, and then the cover plate unit is welded and fixed on the resonator unit through a laser welding process in combination with the solder paste on the periphery of the resonator unit to complete the SMD quartz crystal resonator processing. The present invention first divides the resonator whole plate and the cover plate whole plate, and fixes the divided resonator unit and the cover plate unit through an adsorption mold, and then fixes the resonator unit and the cover plate unit through a laser welding process, thereby improving the quality of the SMD quartz crystal resonator. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is the first viewing angle structural view of the resonator adsorption mold of the present invention.

[0020] Figure 2 This is a second viewing angle structural view of the resonator adsorption mold of the present invention.

[0021] Figure 3 It is an exploded structural view of the resonator adsorption mold of the present invention.

[0022] Figure 4 It is a structural view of the adsorption plate 6 of the present invention.

[0023] Figure 5 This is the first viewing angle structural view of the cover plate adsorption mold of the present invention.

[0024] Figure 6 This is a second viewing angle structural view of the cover plate adsorption mold of the present invention.

[0025] Figure 7 It is a structural view of the state in which the resonator adsorption mold of the present invention adsorbs and fixes the entire resonator plate.

[0026] Figure 8 It is a structural view of the state in which the resonator adsorption mold of the present invention adsorbs and fixes the resonator unit.

[0027] Fig. 9 It is a structural view of the state in which the cover plate adsorption mold of the present invention adsorbs and fixes the entire cover plate.

[0028] Fig.10 It is a state structural view of the cover plate adsorption mold of the present invention adsorbing and fixing the cover plate unit.

[0029] Markings in the figure: resonator whole plate 1, cover plate whole plate 2, resonator unit 3, cover plate unit 4, resonator adsorption mold 5, adsorption plate 6, cover plate adsorption mold 7, adsorption seat 8, negative pressure chamber 9, upper cover 10, electrical connector 11, circuit board 12, soft flat cable 13, test terminal 14, insulating sleeve 15, positioning detection target 16, CCD camera 17, first adsorption hole 18, first soft rubber ring 19, second adsorption hole 20, second soft rubber ring 21. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] Embodiment 1:

[0032] like Figure 1-Figure 10As shown, the present invention provides a SMD quartz crystal resonator processing method, providing a resonator whole plate 1 and a cover plate whole plate 2, the resonator whole plate 1 includes a plurality of resonator units 3, the cover plate whole plate 2 includes a plurality of cover plate units 4, including: S1: placing the resonator whole plate 1 on a resonator adsorption mold 5, the resonator adsorption mold 5 adsorbs and fixes the resonator whole plate 1 by negative pressure, the resonator adsorption mold 5 is provided with an adsorption plate 6, and the resonator unit 3 corresponds to the adsorption plate 6 in position; S2: using a cutting machine to divide the resonator unit 3 on the resonator whole plate 1 into single independent units, the resonator unit 3 is adsorbed and fixed by the adsorption plate 6; S3: placing the cover plate whole plate 2 on the cover plate adsorption mold 7, the cover plate adsorption mold 7 adsorbs and fixes the cover plate whole plate 2 by negative pressure, and the cover plate adsorption mold 7 adsorbs and fixes the cover plate whole plate 2 by negative pressure. The plate adsorption mold 7 is provided with an adsorption seat 8, and the cover unit 4 corresponds to the adsorption seat 8; S4: Use a cutting machine to divide the cover unit 4 on the cover plate 2 into single independent units, and the cover unit 4 is adsorbed and fixed by the adsorption plate 6; S5: Use an air gun to clean foreign matter on the resonator unit 3 and the cover unit 4; S6: Apply solder paste on the periphery of the resonator unit 3, and bring the cover adsorption mold 7 close to the resonator adsorption mold 5 so that the cover unit 4 covers the corresponding resonator unit 3, and the cover adsorption mold 7 stops the adsorption effect, so that the adsorption seat 8 is separated from the cover unit 4, and the cover adsorption mold 7 is removed, and the laser welding process is used in conjunction with the solder paste on the periphery of the resonator unit 3 to weld and fix the cover unit 4 on the resonator unit 3 to obtain an SMD quartz crystal resonator. The resonator adsorption mold 5 is provided with a negative pressure chamber 9, and a cover 10 is sealed on the top of the negative pressure chamber 9, and an electrical connector 11 is fixedly installed on the cover 10, and a circuit board 12 is fixedly installed on the negative pressure chamber 9, and the circuit board 12 is electrically connected to the electrical connector 11 through a flexible flat cable 13, and a test terminal 14 is fixedly installed on the circuit board 12, and the test terminal 14 is fixedly installed on the adsorption plate 6 through an insulating sleeve 15, and the test terminal 14 is electrically connected to the pin of the resonator unit 3 through the test terminal 14, and S6 also includes: the controller is electrically connected to the test terminal 14 connected to the circuit board 12 through the electrical connector 11, and the quality of the resonator unit 3 is detected. The adsorption plate 6 is installed with 4 test terminals 14, and the controller sets a code for each resonator unit 3 on the adsorption plate 6, and the coding structure is: resonator whole board number, matrix coordinate X, matrix coordinate Y, resonator good or bad state, resonator frequency, and the code is stored in the database, and the waste processing device removes the damaged resonator according to the matrix coordinate X, matrix coordinate Y and resonator good or bad state of the code. The resonator adsorption mold 5 is provided with a positioning detection target 16, and the cover plate adsorption mold 7 is fixedly installed with a CCD camera 17. S6 also includes: during the process of the resonator adsorption mold 5 and the cover plate adsorption mold 7, the controller shoots the positioning detection target 16 through the CCD camera 17, and calculates the position offset value of the resonator adsorption mold 5 and the cover plate adsorption mold 7, and aligns the resonator adsorption mold 5 and the cover plate adsorption mold 7 through the fine-tuning mechanism.The adsorption plate 6 is provided with a first adsorption hole 18, and the adsorption plate 6 is fixedly installed with a first soft rubber ring 19, and the first adsorption hole 18 is located inside the first soft rubber ring 19. S2 also includes: the resonator unit 3 and the first soft rubber ring 19 form a chamber, and the first adsorption hole 18 sucks the air in the chamber, so that the resonator unit 3 is adsorbed and fixed on the adsorption plate 6. The adsorption seat 8 is provided with a second adsorption hole 20, and the adsorption seat 8 is fixedly installed with a second soft rubber ring 21, and the second adsorption hole 20 is located inside the second soft rubber ring 21. S4 also includes: the cover unit 4 and the second soft rubber ring 21 form a chamber, and the second adsorption hole 20 sucks the air in the chamber, so that the cover unit 4 is adsorbed and fixed on the adsorption seat 8. S5 also includes: the cover adsorption mold 7 moves the cover unit 4 into the paint pool, the cover adsorption mold 7 slowly rotates and swings once, and the cover adsorption mold 7 lifts the cover unit 4, drains it, and dries it. The dried cover unit 4 is placed on a grinder to grind off the paint on the soldering part at the bottom of the cover unit 4.

[0033] Through the above technical scheme, the present invention adsorbs and fixes the resonator whole plate 1 through the resonator adsorption mold 5, the adsorption plate 6 of the resonator adsorption mold 5 corresponds to the position of the resonator unit 3 of the resonator whole plate 1, the resonator whole plate 1 is divided into resonator units 3 by a cutting machine, the resonator unit 3 is adsorbed and fixed by the adsorption plate 6, the cover plate adsorption mold 7 adsorbs and fixes the cover plate whole plate 2, the adsorption seat 8 of the cover plate adsorption mold 7 corresponds to the position of the cover plate unit 4 of the cover plate whole plate 2, the cover plate whole plate 2 is divided into the cover plate unit 4 by a cutting machine, the cover plate unit 4 is adsorbed and fixed by the adsorption seat 8, and the resonator unit 3 and the cover plate unit 4 are cleaned by an air gun. The foreign matter on the resonator unit 3 is removed, solder paste is applied to the periphery of the resonator unit 3, the resonator adsorption mold 5 and the cover plate adsorption mold 7 are molded together, so that the cover plate unit 4 is covered on the resonator unit 3, and then the cover plate unit 4 is welded and fixed to the resonator unit 3 through a laser welding process in combination with the solder paste on the periphery of the resonator unit 3, thereby completing the SMD quartz crystal resonator processing. The present invention first divides the resonator whole plate 1 and the cover plate whole plate 2, and fixes the divided resonator unit 3 and the cover plate unit 4 through an adsorption mold, and then fixes the resonator unit 3 and the cover plate unit 4 through a laser welding process, thereby improving the quality of the SMD quartz crystal resonator.

[0034] Embodiment 2:

[0035] like Figure 1-Figure 10 As shown, the processing method of the present invention first provides a resonator whole plate 1 including a plurality of resonator units 3 and a cover plate whole plate 2 including a plurality of cover plate units 4 .

[0036] The whole resonator plate 1 is placed on a special resonator adsorption mold 5. The resonator adsorption mold 5 is provided with an adsorption plate 6, and the position of the adsorption plate 6 corresponds to the resonator unit 3. The resonator adsorption mold 5 can adsorb and fix the whole resonator plate 1 through negative pressure to ensure that the resonator unit 3 remains stable during the subsequent processing. This step is the key to ensure processing accuracy and efficiency. If the resonator unit 3 moves, it will cause processing failure or product defects.

[0037] The resonator unit 3 on the resonator whole plate 1 is cut into individual independent units along the predetermined cutting line using a cutting machine. During this process, the adsorption plate 6 continuously adsorbs and fixes the resonator unit 3 to prevent it from moving during the cutting process. After the cutting is completed, the resonator unit 3 is still firmly fixed by the adsorption plate 6, ready for the next step of processing.

[0038] Then, the whole cover plate 2 is placed on the cover plate adsorption mold 7. The cover plate adsorption mold 7 also adsorbs and fixes the whole cover plate 2 by negative pressure, and the cover plate adsorption mold is provided with an adsorption seat 8 corresponding to the position of the cover plate unit 4. The cover plate unit 4 on the whole cover plate 2 is divided into single independent units by a cutting machine, and the adsorption seat 8 keeps the cover plate unit 4 stable during the cutting process.

[0039] After cutting is completed, use an air gun to clean the resonator unit 3 and the cover unit 4 to remove foreign matter and debris generated during the cutting process to prevent residual foreign matter from affecting the strength and stability of welding, and to prevent foreign matter from being encapsulated into the SMD quartz crystal resonator and affecting the quality of the product.

[0040] Solder paste is applied to the cleaned periphery of the resonator unit 3 for welding the cover unit 4 .

[0041] The cover plate adsorption mold 7 is brought close to the resonator adsorption mold 5, so that the cover plate unit 4 is accurately covered on the corresponding resonator unit 3. Subsequently, the cover plate adsorption mold 7 stops the adsorption action, so that the adsorption seat 8 is separated from the cover plate unit 4, and the cover plate adsorption mold 7 is removed. This step requires precise control to ensure that the alignment of the cover plate unit 4 and the resonator unit 3 is accurate.

[0042] Finally, the cover unit 4 is welded and fixed to the resonator unit 3 by using the laser welding process in combination with the solder paste on the periphery of the resonator unit 3. Laser welding has the characteristics of high precision and high efficiency, which can ensure the uniformity and firmness of the welding points, thereby improving the quality of the SMD quartz crystal resonator.

[0043] Through the above steps, the SMD quartz crystal resonator processing method of the present invention realizes first splitting the resonator whole plate 1 and the cover plate whole plate 2, and fixing the split resonator unit 3 and the cover plate unit 4 by an adsorption mold, and then fixing the resonator unit 3 and the cover plate unit 4 by a laser welding process. This method not only improves production efficiency, prevents the welding of the resonator unit 3 and the cover plate unit 4 from loosening, but also improves the quality of the SMD quartz crystal resonator.

[0044] In the processing of the SMD quartz crystal resonator of the present invention, in order to ensure the quality of the resonator unit 3, the resonator adsorption mold 5 is designed to include a negative pressure chamber 9, and a top cover 10 is sealed and installed on the top of the negative pressure chamber 9. The upper cover 10 is fixedly installed with an electrical connector 11, and a circuit board 12 is fixedly installed in the negative pressure chamber 9. The circuit board 12 is electrically connected to the electrical connector 11 through a flexible flat cable 13. Such a design allows the circuit board 12 to communicate and transmit data with an external controller or other electronic devices. A test terminal 14 is fixedly installed on the circuit board 12, and the test terminal 14 is fixed on the adsorption plate 6 through an insulating sleeve 15. The function of the test terminal 14 is to be electrically connected to the pin of the resonator unit 3, so as to realize the electrical performance test of the resonator unit 3. The controller is electrically connected to the test terminal 14 on the circuit board 12 through the electrical connector 11 to perform quality inspection of the resonator unit 3. In this process, the controller sends a test signal to the test terminal 14, and the test terminal 14 transmits the signal to the pin of the resonator unit 3. The response signal of the resonator unit 3 is returned to the controller through the test terminal 14 and the circuit board 12. The controller analyzes the performance of the resonator unit 3 according to the received response signal, including key parameters such as frequency stability, resonant frequency range, and power consumption. If the performance parameters of the resonator unit 3 meet the preset standards, the resonator unit 3 is considered qualified; if the standards are not met, the controller will mark the resonator unit 3 for subsequent processing or elimination.

[0045] In the processing of SMD quartz crystal resonators, in order to accurately track the quality and position information of each resonator unit 3, a test terminal 14 is installed on the adsorption board 6 for connecting the pins of the resonator unit 3, and the controller is convenient for testing. The controller assigns a code to each resonator unit 3 on the adsorption board 6, which contains multiple key information, including the number of the resonator whole board 1, the matrix coordinates X and Y, the resonator good or bad state, and the resonator frequency. The design of the coding structure is to provide a unique identifier for each resonator unit 3 for tracking and quality control throughout the production process. The resonator whole board 1 number is used to identify the batch or production board to which the resonator unit 3 belongs, and the matrix coordinates X and Y accurately specify the position of the resonator unit 3 on the whole board. The resonator good or bad state is a binary value (0 and 1) used to indicate whether the resonator unit 3 has passed the quality inspection, 0 for good products, and 1 for defective or bad products. If the resonator unit 3 fails the test, the state will be marked as "1", otherwise the state will be marked as "0", and the waste disposal device will perform corresponding processing according to the resonator good or bad state. The resonator frequency is a numerical value that records the actual operating frequency of the resonator unit 3, which is essential to ensure that the performance of the resonator unit 3 meets the predetermined technical specifications. The controller stores these codes in a database, which acts as a central storage system to record detailed information on all resonator units 3. When a damaged resonator is detected, the scrap handling device identifies and removes the damaged resonator units 3 based on the matrix coordinates X, Y in the code and the good or bad state of the resonator. This automated process not only improves production efficiency, but also reduces manual intervention and reduces product quality issues caused by human errors. Through this coding and database system, each resonator unit 3 in the production process can be accurately tracked and managed.

[0046] In the processing of the SMD quartz crystal resonator of the present invention, the resonator adsorption mold 5 is provided with a positioning detection target 16, which is a specific pattern or mark for machine vision system recognition. A CCD camera 17 is fixedly installed on the cover adsorption mold 7, which is a camera device capable of providing high-definition images, and is used to capture the image of the positioning detection target 16. When the resonator adsorption mold 5 and the cover adsorption mold 7 are close to the mold closing process, the controller starts the CCD camera 17 to shoot the positioning detection target 16. The image captured by the CCD camera 17 is then transmitted to the controller, which analyzes these images using an image processing algorithm and calculates the relative position offset value between the resonator adsorption mold 5 and the cover adsorption mold 7. This calculation process involves accurate identification and comparison of the positioning detection target 16, as well as accurate measurement of the mold position. According to the calculated position offset value, the controller fine-tunes the resonator adsorption mold 5 or the cover adsorption mold 7 through a fine-tuning mechanism to achieve accurate alignment of the two. The fine-tuning mechanism includes a precision servo motor and a transmission system, which can achieve accurate position adjustment. This fine-tuning process is automated and can quickly respond to the controller's instructions to ensure that the mold's alignment accuracy reaches the micron level. During the fine-tuning process, the controller will continuously monitor the image captured by the CCD camera 17 to ensure the alignment of the mold. Once it is detected that the mold has been accurately aligned, the controller will issue a mold closing instruction to complete the mold closing of the resonator adsorption mold 5 and the cover plate adsorption mold 7. The automation and precise control of this process greatly improves processing efficiency and product consistency. Through this precise positioning detection and fine-tuning mechanism, the processing method of the SMD quartz crystal resonator can achieve high-efficiency and high-quality production.

[0047] In the processing of the SMD quartz crystal resonator of the present invention, in order to improve the adsorption and fixing stability of the resonator unit 3 and the cover unit 4, the adsorption plate 6 is provided with a first adsorption hole 18 and a first soft rubber ring 19 is installed, and the adsorption seat 8 is provided with a second adsorption hole 20 and a second soft rubber ring 21 is installed. The first adsorption hole 18 of the adsorption plate 6 is arranged on the inner side of the first soft rubber ring 19. When the resonator unit 3 is placed on the adsorption plate 6, the first soft rubber ring 19 and the resonator unit 3 form a closed chamber together. The air in the chamber is sucked through the first adsorption hole 18 to generate negative pressure, so that the resonator unit 3 is firmly adsorbed and fixed on the adsorption plate 6. This negative pressure adsorption mechanism greatly improves the stability of the resonator unit 3 during the cutting process and prevents displacement caused by the impact force of cutting. Similarly, the adsorption seat 8 is provided with a second adsorption hole 20, and the second adsorption hole 20 is located on the inner side of the second soft rubber ring 21. When the cover unit 4 is placed on the adsorption seat 8, the second soft rubber ring 21 forms a chamber with the cover unit 4. The air in the chamber is sucked through the second adsorption holes 20 to generate negative pressure, so that the cover unit 4 is firmly adsorbed on the adsorption seat 8. This design also improves the stability of the cover unit 4 during the cutting process and prevents displacement during cutting.

[0048] In the processing flow of the SMD quartz crystal resonator, the cut surface of the cover unit 4 is painted. First, the cover adsorption mold 7 moves the cover unit 4 into the paint pool. This process requires precise control to ensure that the paint can be evenly coated on the surface of the cover unit 4. The design of the paint pool allows the cover adsorption mold 7 to move smoothly therein to facilitate the uniform distribution of the paint. Then, the cover adsorption mold 7 slowly rotates and swings once, and this action allows the paint to form a uniform coating on the surface of the cover unit 4. The speed and amplitude of the rotation and swinging need to be precisely controlled to avoid the paint coating being too thick or too thin, affecting the subsequent welding effect. After the coating is completed, the cover adsorption mold 7 lifts the cover unit 4 to drain the excess paint. Subsequently, the cover unit 4 is placed in a drying device for drying. After the drying is completed, the cover unit 4 is placed on a grinder. The function of the grinder is to remove the paint from the soldering part at the bottom of the cover unit 4. Prevent the paint from affecting the soldering effect.

[0049] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0050] The above description is only used to illustrate the technical solution of the present invention rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the present invention by ordinary technicians in this field should be included in the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. A method for processing an SMD quartz crystal resonator, providing a resonator full plate and a cover full plate, wherein the resonator full plate includes a plurality of resonator units, and the cover full plate includes a plurality of cover units, characterized in that: include: S1: placing the entire resonator plate on a resonator adsorption mold, wherein the resonator adsorption mold adsorbs and fixes the entire resonator plate through negative pressure, wherein the resonator adsorption mold is provided with an adsorption plate, and the resonator unit corresponds to the position of the adsorption plate; S2: using a cutting machine to divide the resonator units on the whole resonator plate into individual independent units, and the resonator units are adsorbed and fixed by the adsorption plate; S3: placing the entire cover plate on a cover plate adsorption mold, wherein the cover plate adsorption mold adsorbs and fixes the entire cover plate by negative pressure, wherein the cover plate adsorption mold is provided with an adsorption seat, and the cover plate unit corresponds to the position of the adsorption seat; S4: using a cutting machine to divide the cover plate units on the entire cover plate into individual independent units, and the cover plate units are adsorbed and fixed by the adsorption plate; S5: using an air gun to clean foreign matter on the resonator unit and the cover unit; S6: Apply solder paste on the periphery of the resonator unit, bring the cover adsorption mold close to the resonator adsorption mold, so that the cover unit covers the corresponding resonator unit, the cover adsorption mold stops the adsorption effect, separates the adsorption seat from the cover unit, removes the cover adsorption mold, uses laser welding technology to cooperate with the solder paste on the periphery of the resonator unit, and welds the cover unit to the resonator unit to obtain an SMD quartz crystal resonator.

2. A SMD quartz crystal resonator processing method according to claim 1, characterized in that: The resonator adsorption mold is provided with a negative pressure chamber, a top cover is sealedly installed on the top of the negative pressure chamber, an electrical connector is fixedly installed on the top cover, a circuit board is fixedly installed on the negative pressure chamber, the circuit board is electrically connected to the electrical connector through a flexible flat cable, a test terminal is fixedly installed on the circuit board, the test terminal is fixedly installed on the adsorption plate through an insulating sleeve, and the test terminal is electrically connected to the pin of the resonator unit, and S6 also includes: the controller is electrically connected to the test terminal connected to the circuit board through the electrical connector to detect the quality of the resonator unit.

3. A method for processing a SMD quartz crystal resonator according to claim 2, characterized in that: The adsorption plate is equipped with 4 test terminals, and the controller sets a code for each resonator unit on the adsorption plate. The coding structure is: the resonator whole plate number, matrix coordinate X, matrix coordinate Y, the resonator good or bad state, and the resonator frequency. The code is stored in the database, and the waste processing device removes the damaged resonator according to the matrix coordinate X, matrix coordinate Y and the resonator good or bad state of the code.

4. A SMD quartz crystal resonator processing method according to claim 1, characterized in that: The resonator adsorption mold is provided with a positioning detection target, and the cover plate adsorption mold is fixedly installed with a CCD camera. The S6 also includes: during the process of the resonator adsorption mold and the cover plate adsorption mold, the controller photographs the positioning detection target through the CCD camera, and calculates the position offset value of the resonator adsorption mold and the cover plate adsorption mold, and aligns and closes the resonator adsorption mold and the cover plate adsorption mold through a fine-tuning mechanism.

5. The SMD quartz crystal resonator processing method according to claim 1, characterized in that: The adsorption plate is provided with a first adsorption hole, and a first soft rubber ring is fixedly installed on the adsorption plate. The first adsorption hole is located on the inner side of the first soft rubber ring. S2 also includes: the resonator unit and the first soft rubber ring form a chamber, and the first adsorption hole draws air from the chamber so that the resonator unit is adsorbed and fixed on the adsorption plate.

6. The SMD quartz crystal resonator processing method according to claim 1, characterized in that: The adsorption seat is provided with a second adsorption hole, and a second soft rubber ring is fixedly installed on the adsorption seat. The second adsorption hole is located on the inner side of the second soft rubber ring. S4 also includes: the cover unit and the second soft rubber ring form a chamber, and the second adsorption hole sucks the air in the chamber, so that the cover unit is adsorbed and fixed on the adsorption seat.

7. The SMD quartz crystal resonator processing method according to claim 1, characterized in that: The S5 also includes: the cover plate adsorption mold moves the cover plate unit into the paint pool, the cover plate adsorption mold slowly rotates and swings once, the cover plate adsorption mold lifts the cover plate unit, drains it, dries it, places the dried cover plate unit on a grinder, and grinds off the paint on the soldering part at the bottom of the cover plate unit.

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