A crystal oscillator and its production device

Abstract

The present invention discloses a crystal oscillator and its production device, including a housing, a base and a crystal wafer. An installation foot for installing the crystal wafer is provided on the base; a welding part that is wire-bonded to the crystal wafer is provided on the installation foot; the welding part is a tin-silver alloy, which is composed of 95.5 - 96.5% tin, 2.5 - 3.5% silver and 0.4 - 0.7% copper; the outer surface of the welding part is coated with a soldering flux; a pin that contacts the welding part is penetrated through the base; after the pin is heated, the end of the pin that contacts the welding part can melt the welding part to be connected to the lead, and the melted alloy material flows into the matching part of the pin and the base to complete the sealing; the present invention provides a crystal oscillator and its production device; a sealing groove is provided on the base of the crystal oscillator to improve the sealing performance of the crystal oscillator, and vacuum suction is carried out through the perforation of the pin to improve the vacuum degree inside the crystal oscillator.

Description

Technical Field

[0001] The present invention relates to the technical field of crystal oscillators and their production equipment, and in particular to a crystal oscillator and its production device. Background Art

[0002] A crystal oscillator, full name Crystal Oscillator, is an electronic component that uses the piezoelectric effect of a quartz crystal to generate a stable frequency signal. Quartz crystal oscillators are widely used in electronic circuits, especially in situations where a high-precision and high-stability frequency source is required.

[0003] In a crystal oscillator, the fixing method of the quartz crystal usually needs to ensure that the crystal can vibrate freely and is not affected by external mechanical stress. And to protect the quartz crystal from the influence of the external environment, such as humidity, dust, etc., the crystal oscillator is usually sealed in an airtight housing. This housing is usually a metal can, and the inside is in a vacuum state.

[0004] The existing quartz crystal of the crystal oscillator has poor internal sealing performance. Usually, the direct bonding method of materials makes the housing adhere to the base, and a vacuum device is used to make the inside form a vacuum. This method has a cumbersome process and is extremely likely to leave some air inside during the manufacturing process, thus affecting the use accuracy of the crystal oscillator.

[0005] In addition, the leads of the existing crystal oscillator are usually connected to the base before the housing is encapsulated. During the subsequent encapsulation process or operation process, the pins are inclined and deformed, and the lengths of both sides of the leads are inconsistent due to the welding process or the tooling accuracy not meeting the standard, affecting the quality of the finished crystal oscillator. Summary of the Invention

[0006] In view of the deficiencies in the prior art, the present invention provides a crystal oscillator and its production device. Through this device, the pins can be combined with the base after being heated, and vacuum suction and sealant injection are carried out inside the housing to improve the sealing quality of the crystal oscillator.

[0007] To solve the above technical problems, the present invention is solved by the following technical solutions: A crystal oscillator includes a housing, a base, and a crystal chip.

[0008] In the above solution, preferably, the base is provided with mounting feet for mounting the crystal chip;

[0009] The mounting feet are provided with welding parts that are wire-bonded to the crystal chip;

[0010] The welding part is a tin-silver alloy, which is composed of 95.5 - 96.5% tin, 2.5 - 3.5% silver, and 0.4 - 0.7% copper;

[0011] The outer surface of the welding part is coated with a soldering flux;

[0012] Pins passing through the base and contacting the welding part are provided;

[0013] After the pins are heated, the end of the pins contacting the welding part can melt the welding part to connect with the lead wire, and the melted alloy material flows into the joint between the pins and the base to complete the sealing.

[0014] In the above solution, preferably, the base includes a boss matching with the outer shell, and a sealing groove matching with the outer shell is arranged on the boss.

[0015] In the above solution, preferably, an injection hole connected to the sealing groove and capable of injecting sealant into it is provided on the base.

[0016] In the above solution, preferably, a pin hole is provided on the base, an annular groove is arranged in the pin hole, and the annular groove is connected to the sealing groove through a connecting hole.

[0017] In the above solution, preferably, a production device for a crystal oscillator includes a clamping part for clamping the base and a conveying unit for conveying the pins;

[0018] The conveying unit includes a guiding seat for guiding the pins and a conveyor for conveying the pins;

[0019] A heating part for heating the pins is arranged on the guiding seat;

[0020] An injection tube matching with the injection hole is arranged on the clamping part, and the injection tube is connected to an injection pump to inject sealant into the injection hole.

[0021] In the above solution, preferably, a guiding hole matching with the pins is arranged on the guiding seat, a first suction hole connected to the guiding hole is arranged on the guiding seat, and the first suction hole is connected to a vacuum pump.

[0022] In the above solution, preferably, one end of the guiding seat abuts against the base, and a cutting unit is arranged at the other end;

[0023] The cutting unit includes a cutting knife and a tool holder, a compression cavity for the tool holder to move is arranged in the guiding seat, and a first spring is arranged between the tool holder and the compression cavity;

[0024] The compression cavity is connected to the vacuum pump through a second suction hole.

[0025] In the above solution, preferably, a cooling groove is arranged on the guiding seat, and the cooling groove is connected to a cooling pump.

[0026] In the above solution, preferably, a second spring is arranged between the injection tube and the clamping part.

[0027] In the above solution, preferably, a sealing ring matching with the pin is provided on the guiding seat.

[0028] The beneficial effects of the present invention are as follows: The present invention provides a crystal oscillator and its production device; a sealing groove is provided at the base of the crystal oscillator to improve the sealing performance of the crystal oscillator, and vacuum suction is performed through the perforation of the pin to improve the vacuum degree inside the crystal oscillator;

[0029] In addition, by heating the pin and performing hot melting connection with the welding part on the mounting foot, the connection integrity between the pin and the mounting foot is improved. At the same time, the hot-melted welding part after pin welding can block the perforation of the pin on the base, improve the sealing performance of the base, and perform guiding cutting on the pin to improve the straightness of the overall pins of the finished crystal oscillator. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic exploded view of the crystal oscillator of the present invention.

[0031] Figure 2 It is a schematic three-dimensional structure view of the base of the crystal oscillator of the present invention.

[0032] Figure 3 It is a schematic cross-sectional view of the base of the crystal oscillator of the present invention.

[0033] Figure 4 It is a front view of the production device of the crystal oscillator of the present invention.

[0034] Figure 5 For the present invention Figure 4 Schematic diagram of the partial enlarged structure at A in. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0035] The present invention will be further described in detail below in conjunction with the drawings and specific embodiments:

[0036] Embodiment 1: Refer to Figures 1 - 5 .

[0037] A crystal oscillator includes a housing 1, a base 2 and a crystal wafer 3. Mounting feet 4 are symmetrically arranged on both sides of the base 2. The mounting feet 4 and the base 2 are fixed integrally. The crystal wafer 3 is fixed to the upper ends of the mounting feet 4.

[0038] The base 2 includes a boss 201. The mounting feet 4 are fixed on the upper end surface of the boss 201. A welding part 401 protruding outward is provided on one side of the mounting foot 4 close to the boss 201 and far from the neutral plane of the base 2. The electrodes on the crystal wafer 3 are connected to the welding part 401 by wire bonding.

[0039] The welding part 401 includes a support leg fixedly connected to the mounting leg 4. The support leg is wire-bonded to the electrode lead of the crystal chip 3. After wire-bonding, the outside thereof is coated with a welding material, which is made of tin-silver alloy. Specifically, the composition ratio of the tin-silver alloy is: 95.5 - 96.5% tin, 2.5 - 3.5% silver, and 0.4 - 0.7% copper.

[0040] The outer surface of the welding part 401 is coated with a soldering flux, and the material of the soldering flux can be rosin, etc. The base 2 is provided with a pin hole 204, and a pin 5 can be inserted therein; as Figure 1 shown, the pin 5 passes through the pin hole 204 from bottom to top and abuts against the lower end surface of the welding part 401. After the pin 5 is heated to a high temperature, the end in contact with the welding part 401 can melt the welding part 401 into a fluid state. Subsequently, the welding material of the welding part 401 flows to the end of the pin 5. Part of it welds and fixes the pin 5 and the support leg of the welding part 401, and the other part flows along the outer wall of the pin 5 to the position where the pin 5 contacts the pin hole 204 to block the pin hole 204. The soldering flux on the surface of the welding part 401 can improve the deoxidation function of the pin surface. At the same time, the silver-based welding material can improve the fluidity of the melted welding material.

[0041] The boss 201 is provided with a sealing groove 202 that cooperates with the housing 1. On both sides of the lower end surface of the base 2, injection holes 203 that are symmetrically arranged and communicate with the sealing groove 202 and can inject sealant into it are provided. An annular groove 205 is provided in the pin hole 204, and the annular groove 205 communicates with the sealing groove 202 through a connection hole 206; after the housing 1 is sleeved on the boss 201, the inner wall of the housing 1 fits with the sealing groove 202. Subsequently, the sealant can be filled into the sealing groove 202 and the annular groove 205 through the injection hole 203 to achieve sealing between the housing 1 and the base 2 and between the pin 5 and the pin hole 204.

[0042] A production device for a crystal oscillator, specifically a production device that assembles the housing 1 and the base 2 in the crystal oscillator, then inserts the pin 5 into the housing 1 through the pin hole 204, and then performs hot-melt welding on the pin 5 and the welding part 401 and injects glue into the sealing groove 202.

[0043] The production device includes a clamping member 6 for clamping the base 2 and a conveying unit 7 for conveying the pin 5. The conveying unit 7 includes a guiding seat 701 for guiding the pin 5 and a conveyor 702 for conveying the pin 5. The conveyor 702 includes symmetrically arranged guiding wheels. A driving motor is arranged on any one of the guiding wheels. The pin 5 is conveyed and straightened after passing through the gap between the guiding wheels, and then the end of the pin 5 enters the guiding seat 701.

[0044] During use, first pre - install the crystal chip 3 on the mounting feet 4 of the base 2, and bond the electrodes of the crystal chip 3 to the pins on the mounting feet 4 by wire bonding. Subsequently, wrap the welding part 401 around the pins and coat the outer surface with a soldering flux; then sleeve the housing 1 onto the boss 201 to complete the pre - installation.

[0045] The clamping member 6 is a pneumatic chuck. After clamping both ends of the base 2, it is displaced to the upper end of the guide seat 701, so that the lower end surface of the base 2 abuts against the upper end surface of the guide seat 701, as Figure 4 shown; the guide seat 701 is provided with a guide hole 705 for guiding the pin 5. After the base 2 is clamped and displaced by the clamping member 6, the pin hole 204 and the guide hole 705 are in a concentric state; after the pin 5 is conveyed by the conveying unit, its upper end enters the pin hole 204 in the base 2 through the guide hole 705, and then its upper end abuts against the lower end surface of the welding part 401.

[0046] On the side wall of the guide seat 701 close to one end of the base 2, there is a heating element 703 that cooperates with the guide hole 705. Specifically, the heating element 703 can abut against the wall of the pin 5 in the guide hole 705. After the heating element 703 contacts the pin 5, it can heat the pin 5. The preferred heating temperature is 3 - 500 °C. After the pin 5 is heated, the end of it placed inside the housing 1 conducts the high temperature to the welding part 401, melting the welding part 401 to complete the welding connection between the pin 5 and the bracket of the welding part 401. At the same time, part of the molten liquid flows into the pin hole 204 to fill the gap between the pin 5 and the pin hole 204.

[0047] The guide seat 701 is provided with a first suction hole 706 connected to the guide hole 705. The first suction hole 706 is connected to a vacuum pump. While the pin 5 is being heated, the inner cavity of the housing 1 is suctioned through the gap between the guide hole 705 and the pin 5 by the first suction hole 706 to make it vacuum inside.

[0048] One end of the guide seat 701 abuts against the base 2, and the other end is provided with a cutting unit 8 for cutting the pin 5; specifically, the cutting unit 8 includes a cutter 801 and a tool holder 802. The guide seat 701 is provided with a compression cavity 803 for the tool holder 802 to move, as Figure 5 shown. The tool holder 802 is slidably arranged in the compression cavity 803, and a first spring 804 is arranged between the tool holder 802 and the compression cavity 803; in the initial state, the preferred gap between the tip of the cutter 801 and the outer wall of the pin 5 is 0.1 - 0.5 mm. At this time, the first spring 804 is in a free - extended state, that is, the pin 5 does not contact the cutter 801 during transmission.

[0049] The compression chamber 803 is connected to a vacuum pump through a second suction hole 805. When the vacuum pump operates, the inside of the crystal oscillator is sucked through the first suction hole 706, and at the same time, a negative pressure is formed in the compression chamber 803 through the second suction hole 805. At this time, the tool holder 802 compresses the first spring 804 to move the cutting tool 801 away from the pin 5 for energy storage. After the vacuum pump stops working, the suction force of the second suction hole 805 disappears. At this time, the cutting tool 801 impacts the pin 5 under the elastic force of the first spring 804 to cut off the pin 5.

[0050] An injection tube 704 matching the injection hole 203 is provided on the clamping member 6. The injection tube 704 is connected to an injection pump to inject sealant into the injection hole 203. A second spring 709 is provided between the injection tube 704 and the clamping member 6. After the clamping member 6 clamps the base 2, the injection tube 704 abuts against the injection hole 203, and the end of the injection tube 704 is tightly combined with the injection hole 203 through the second spring 709. After the injection tube 704 injects the sealant through the injection hole 203, the sealant fills the seal groove 202 and the annular groove 205 to seal the entire crystal oscillator.

[0051] A cooling groove 707 is provided on the guide seat 701. The cooling groove 707 is arranged below the cutting tool 801. The cooling groove 707 is connected to a cooling pump 708 to cool the part of the pin 5 below the cutting tool 801 through the cooling groove 707, so as not to affect the subsequent transmission of the pin; at the same time, a sealing ring 710 matching the pin 5 is provided at the lower end of the guide seat 701. The sealing ring 710 is arranged in the guide hole 705 to improve the sealing performance between the guide seat 701 and the pin 5.

[0052] In addition, a sealing gasket is provided at one end of the guide seat 701 close to the base 2 to further enhance the overall sealing performance of the entire guide seat 701.

[0053] In this embodiment, the electrical components in the above pump element and the conveying unit can all be automatically controlled through a PLC controller.

[0054] A production method using the production device of a crystal oscillator as described above:

[0055] S1: The clamping member 6 clamps the pre-loaded crystal oscillator to the upper end surface of the guide seat 701, so that the lower end surface of the base 2 fits with the upper end surface of the guide seat 701. At this time, the injection tube 704 on the clamping member 6 cooperates with the injection hole 203;

[0056] S2: The conveyor 702 is started to input the pin 5 into the base 2 through the guide hole 705. After the upper end of the pin 5 abuts against the lower end surface of the welding part 401, the conveyor 702 stops;

[0057] S3: Subsequently, the heating element 703 heats the pin 5. After the pin 5 is heated, its upper end melts the welding portion 401. After the welding portion 401 melts, the pin 5 is welded to the bracket within the welding portion 401, and meanwhile, the gap between the pin 5 and the pin hole 204 is blocked.

[0058] S4: While the action in S3 is taking place, the cooling pump 708 operates to cool the pins near the lower end within the guide base 701, preventing heat from being conducted to the subsequent pins. Meanwhile, the vacuum pump is started to suck the air within the housing 1 through the first suction hole 706 and suck the compression chamber 803 through the second suction hole 805, causing the cutting blade 801 to store energy.

[0059] S5: After the pin 5 is welded to the welding portion within the crystal oscillator, the heating element 703 stops heating. Subsequently, the injection tube 704 injects the sealant into the injection hole 203. The sealant fills the seal groove 202 and the annular groove 205 while under vacuum suction, achieving the sealing of the entire crystal oscillator.

[0060] S6: Subsequently, the vacuum pump stops working. The cutting blade 801 synchronously cuts off the two side pins 5 under the elastic force of the first spring 804, and the clamping member 6 pulls out the cut pins from within the guide base 701, completing the production of the crystal oscillator.

[0061] Embodiment 2: This embodiment further improves the ratio of the welding materials in the welding portion 401 in Embodiment 1. Specifically, the tin-silver alloy of the welding portion 401 is composed of 96% tin, 3.5% silver, and 0.5% copper, and the thickness of the flux coated on its outer surface is 0.03 - 0.07 mm, which can be adjusted adaptively according to the size of the crystal oscillator.

[0062] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A crystal oscillator, comprising a housing (1), a base (2) and a crystal wafer (3), characterized in that: The base (2) is provided with mounting feet (4) for mounting the crystal chip (3); The mounting feet (4) are provided with welding parts (401) which are wire-bonded to the crystal chip (3); The welding part (401) is a tin-silver alloy, which consists of 95.5 - 96.5% tin, 2.5 - 3.5% silver and 0.4 - 0.7% copper; The outer surface of the welding part (401) is coated with a soldering flux; The base (2) is penetrated with pins (5) which are in contact with the welding part (401); After the pins (5) are heated, the end in contact with the welding part (401) can cause the welding part (401) to melt and bond with the lead wire, and the melted alloy material flows into the mating part of the pin (5) and the base (2) to complete the sealing; The base (2) includes a boss (201) which mates with the outer shell (1), and a sealing groove (202) which is provided on the boss (201) and mates with the outer shell (1); The base (2) is provided with an injection hole (203) which is connected to the sealing groove (202) and can inject sealing glue into it; The base (2) is provided with a pin hole (204), an annular groove (205) is arranged in the pin hole (204), and the annular groove (205) is connected to the sealing groove (202) through a connection hole (206).

2. The production device of a crystal oscillator according to claim 1, wherein: It includes a clamping part (6) for clamping the base (2) and a conveying unit (7) for conveying the pins (5); The conveying unit includes a guiding seat (701) for guiding the pins (5) and a conveyor (702) for conveying the pins (5); The guiding seat (701) is provided with a heating part (703) for heating the pins (5); The clamping part (6) is provided with an injection tube (704) which mates with the injection hole (203), and the injection tube (704) is connected to an injection pump to inject sealing glue into the injection hole (203).

3. The production device of a crystal oscillator according to claim 2, wherein: The guiding seat (701) is provided with a guiding hole (705) which mates with the pin (5), a first suction hole (706) which is connected to the guiding hole (705) is arranged on the guiding seat (701), and the first suction hole (706) is connected to a vacuum pump.

4. The production device of a crystal oscillator according to claim 2, characterized in that: One end of the guiding seat (701) abuts against the base (2), and a cutting unit (8) is arranged at the other end; The cutting unit (8) includes a cutting knife (801) and a tool holder (802), a compression cavity (803) for the tool holder (802) to move is arranged in the guiding seat (701), and a first spring (804) is arranged between the tool holder (802) and the compression cavity (803); The compression cavity (803) is connected to the vacuum pump through a second suction hole (805).

5. The production device of a crystal oscillator according to claim 2, characterized in that: The guiding seat (701) is provided with a cooling groove (707), and the cooling groove (707) is connected to a cooling pump (708).

6. The production device of a crystal oscillator according to claim 2, characterized in that: A second spring (709) is arranged between the injection tube (704) and the clamping part (6).

7. The production device of a crystal oscillator according to claim 2, characterized in that: The guiding seat (701) is provided with a sealing ring (710) which mates with the pin (5).

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