Circuit board, manufacturing method thereof, light bar comprising circuit board, backlight module and display screen

Abstract

The invention provides a circuit board and a manufacturing method thereof, a light bar comprising the circuit board, a backlight module and a display screen, and the circuit board comprises a base material, a circuit layer and a light diffusion layer. The substrate has a circuit region and a light scattering region relative to the circuit region. The circuit layer is located on the circuit area of the substrate. The light scattering layer is located on the light scattering area of the base material. The top surface of the astigmatism layer is provided with a plurality of astigmatism structures.

Description

Technical Field

[0001] The present invention relates to a circuit board and a manufacturing method thereof, a light bar including the same, a backlight module including the same and a display screen including the same, and in particular to a circuit board with a light diffusion structure and a manufacturing method thereof, a light bar including the same, a backlight module including the same and a display screen including the same Background Art

[0002] Since the liquid crystal in the LCD screen does not emit light itself, a backlight module is usually added to provide the light source required for display. The backlight module is generally composed of a light bar and a light guide plate, wherein the light bar is composed of a light-emitting component set on a long strip circuit board. The quality of the light source often affects the quality of the LCD screen. Therefore, how to make the light source have better quality through the components, members or structures therein is indeed a research topic. Summary of the invention

[0003] The present invention is directed to a circuit board and a manufacturing method thereof, a light bar including the circuit board, a backlight module including the circuit board and a display screen including the circuit board, which can have better light source quality in application.

[0004] According to an embodiment of the present invention, a circuit board includes a substrate, a circuit layer and a light scattering layer. The substrate has a circuit area and a light scattering area relative to the circuit area. The circuit layer is located on the circuit area of ​​the substrate. The light scattering layer is located on the light scattering area of ​​the substrate. A plurality of light scattering structures are provided on the top surface of the light scattering layer.

[0005] According to an embodiment of the present invention, the plurality of light scattering structures are arranged in a plurality of rows along the first direction, and the plurality of light scattering structures in two adjacent rows in the plurality of rows are staggered with each other.

[0006] According to an embodiment of the present invention, the circuit layer and the light diffusion layer are arranged along the second direction, and the first direction is not parallel to the second direction.

[0007] According to an embodiment of the present invention, there is a first distance between the top of the light scattering layer and the substrate, there is a second distance between the top of the circuit layer and the substrate, and the first distance is greater than the second distance.

[0008] According to an embodiment of the present invention, the light bar comprises the aforementioned circuit board and a light emitting component. The light emitting component is located on the circuit layer.

[0009] According to an embodiment of the present invention, the backlight module includes the aforementioned light bar and a light guide plate. The light guide plate is at least partially disposed on the substrate.

[0010] According to an embodiment of the present invention, at least part of the light scattering structure in the light scattering layer is located between the light emitting component and the light guide plate.

[0011] According to an embodiment of the present invention, the plurality of light scattering structures are arranged in a plurality of rows along the first direction, and the arrangement direction between the light guide plate and the light emitting element is not parallel to the first direction.

[0012] According to an embodiment of the present invention, a display screen includes the aforementioned backlight module.

[0013] According to an embodiment of the present invention, a method for manufacturing a circuit board includes the following steps: providing a substrate having a circuit area and a light scattering area relative to the circuit area; forming a circuit layer on the circuit area of ​​the substrate; and forming a light scattering layer having multiple light scattering structures on the top surface of the light scattering area of ​​the substrate by transfer, embossing or spray printing.

[0014] Based on the above, since the circuit board of the present invention includes a light diffusion layer, and the top surface of the light diffusion layer has a plurality of light diffusion structures, if the circuit board is used as a light emitting device (such as a light bar including the circuit board, a backlight module including the circuit board, and a display screen including the circuit board), the light emitting device can have a better light source quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figures 1A to 1D is a partial cross-sectional schematic diagram of a manufacturing process of a circuit board according to a first embodiment of the present invention;

[0016] FIG. 2A to FIG. 2C is a partial cross-sectional schematic diagram of a manufacturing process of a circuit board according to a second embodiment of the present invention;

[0017] FIG. 3A to FIG. 3B is a partial cross-sectional schematic diagram of a manufacturing process of a circuit board according to a third embodiment of the present invention;

[0018] Figure 4 is a partial top view schematic diagram of a circuit board according to an embodiment of the present invention;

[0019] Figure 5A is a partial cross-sectional schematic diagram of a backlight module according to an embodiment of the present invention;

[0020] Figure 5B is a partial top view schematic diagram of a backlight module according to an embodiment of the present invention;

[0021] Figure 6 It is a partial exploded schematic diagram of a display screen according to an embodiment of the present invention.

[0022] Description of reference numerals:

[0023] 100, 200, 300: circuit boards;

[0024] 130: base material;

[0025] 132: Circuit area;

[0026] 131: astigmatism area;

[0027] 120: circuit layer;

[0028] 118: material layer;

[0029] 118a: District 1;

[0030] 118b: Second zone;

[0031] 110, 210, 310: diffuse light layer;

[0032] 111, 211, 311, 11, 11A, 11B, 11C, 11D: astigmatism structure;

[0033] 280: diaphragm;

[0034] 218: Material layer;

[0035] 287: Adhesion layer;

[0036] 288: substrate layer;

[0037] 318: Material;

[0038] 400: light bar;

[0039] 430: conductive terminal;

[0040] 440: Light emitting component;

[0041] 500: backlight module;

[0042] 550: light guide plate;

[0043] 600: display screen;

[0044] 661, 662: membrane or component;

[0045] 91: transfer;

[0046] 92: embossed parts;

[0047] 93: Printed parts;

[0048] 94: Cured parts;

[0049] L1: first distance;

[0050] L2: second distance;

[0051] D1: first direction;

[0052] D2: second direction;

[0053] D3: third direction;

[0054] X, Y, Z: direction. DETAILED DESCRIPTION

[0055] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0056] The present invention will be described more fully below with reference to the accompanying drawings of the present embodiment. However, the present invention may also be embodied in various different forms and should not be limited to the embodiments described herein. The thickness of the layers and regions in the accompanying drawings will be exaggerated for clarity. The same or similar marks represent the same or similar components, and the following paragraphs will not be repeated one by one. In addition, the directional terms mentioned in the embodiments, such as: up, down, top or bottom, etc., are only with reference to the directions of the attached drawings. Therefore, unless otherwise specified, the directional terms used are used to illustrate and not to limit the present invention. In addition, in order to clearly indicate the directional relationship between different drawings, the Cartesian coordinate system (i.e., the XYZ rectangular coordinate system) is used to represent the corresponding directions in some of the illustrations, but the present invention is not limited to this.

[0057] Figures 1A to 1D It is a partial cross-sectional schematic diagram of a manufacturing process of a circuit board according to the first embodiment of the present invention.

[0058] Please refer to Figure 1A , providing a substrate 130. The substrate 130 may have a circuit area 132 and a light diffusion area 131. The light diffusion area 131 is opposite to the circuit area 132. In one embodiment, the substrate 130 may be a full-surface sheet substrate. For example, the substrate 130 may include a polyimide (PI) film.

[0059] Please refer to Figure 1A , forming a circuit layer 120 on the circuit region 132 of the substrate 130. In one embodiment, the circuit layer 120 can be formed by a suitable patterning method (such as photolithography, but not limited to). The present invention does not impose any restrictions on the layout design of the circuit layer 120, as long as the formed circuit can be electrically connected to the subsequent light-emitting component 440. Figure 1A In FIG. 1 and other drawings, detailed wiring of the circuit layer 120 is not shown in detail.

[0060] In one embodiment, the structure including the substrate 130 and the circuit layer 120 may be referred to as a single-sided board.

[0061] In an embodiment not shown, the substrate 130 may have another corresponding circuit layer on the other side relative to the circuit layer 120. The corresponding circuits in the two circuit layers (one of which may be the circuit layer 120) located on the opposite sides of the substrate 130 may be electrically connected via an appropriate method (e.g., conductive vias penetrating the substrate 130). In an embodiment, the structure including the substrate 130 and the two circuit layers located on the opposite sides thereof may be referred to as a double-sided board.

[0062] Please continue to refer to Figure 1A , a material layer 118 is formed on the light scattering region 131 of the substrate 130 .

[0063] In one embodiment, the material layer 118 may be formed on the substrate 130 by coating.

[0064] In one embodiment, the material layer 118 may be in a glue, paste or paint state.

[0065] In one embodiment, the material of the material layer 118 may include a polymer. The aforementioned polymer may include, but is not limited to: acrylic resin, silicone resin, epoxy resin, polyurethane resin, or a mixture thereof. In one embodiment, the material of the material layer 118 may also include a suitable reflective material. The aforementioned reflective material may include, but is not limited to: titanium dioxide particles, zinc oxide particles, or a mixture thereof.

[0066] In one embodiment, the material of the material layer 118 may be the same as or similar to the solder mask ink.

[0067] Please refer to Figure 1A to Figure 1B , the material layer 118 can be left to stand, blown, illuminated, heated or other suitable methods to have a first area 118a with a higher curing rate and a second area 118b with a lower curing rate. The second area 118b is substantially located between the first area 118a and the substrate 130. It is worth noting that Figure 1B The first area 118a and the second area 118b are marked in different ways for the sake of simplicity. In actual examples, there may not be a clear separation or a clear interface between the first area 118a and the second area 118b. In addition, although the curing rate of the first area 118a is higher than that of the second area 118b, the first area 118a is still not fully cured.

[0068] Please refer to Figure 1B to Figure 1CFor example, the first region 118a may be subjected to pressure by the transfer member 91 to form a concave-convex structure corresponding to the transfer member 91 on the first region 118a that is not completely cured.

[0069] Please refer to Figure 1C to Figure 1D The material layer 118 (indicated by Figure 1C ) is cured to form a light-scattering layer 110 having a light-scattering structure 111 (indicated by Figure 1D ). In addition, for the sake of brevity, Figure 1D Or other similar drawings, not all the astigmatism structures are marked one by one.

[0070] In one embodiment, the material layer 118 having a concave-convex structure may be firstly separated from the transfer member 91; then, a suitable curing method is performed to form the light-scattering layer 110 having the light-scattering structure 111. In one embodiment, the material layer 118 having a concave-convex structure may be firstly cured in a suitable manner to form the light-scattering layer 110 having the light-scattering structure 111; then, the cured material layer 118 (i.e., the light-scattering layer 110) is separated from the transfer member 91.

[0071] It is worth noting that when the transfer member 91 applies pressure to the first area 118a, since the first area 118a is not fully cured, the corresponding concave-convex structure can be easily formed. In addition, since the first area 118a has a higher curing rate and the corresponding viscosity may be lower, when the transfer member 91 is separated, it is less likely to produce sticky film (such as: part of the residual glue sticking to the transfer member 91). In this way, the light-scattering structure 111 can have a better appearance.

[0072] In one embodiment, the color of the light diffusion layer 110 may be light color, close to white, or white.

[0073] After the above-mentioned manufacturing process, the manufacturing of the circuit board 100 of this embodiment can be substantially completed.

[0074] The circuit board 100 includes a substrate 130, a circuit layer 120, and a light scattering layer 110. The substrate 130 has a circuit area 132 and a light scattering area 131 opposite to the circuit area 132. The circuit layer 120 is located on the circuit area 132 of the substrate 130. The light scattering layer 110 is located on the light scattering area 131 of the substrate 130. A plurality of light scattering structures 111 are provided on the top surface of the light scattering layer 110.

[0075] In one embodiment, the circuit layer 120 may have a thickness of about 13 micrometers (μm) to 25 micrometers; for example, about 20 micrometers.

[0076] In one embodiment, a first distance L1 is provided between the top of the light diffusion layer 110 and the substrate 130 , a second distance L2 is provided between the top of the circuit layer 120 and the substrate 130 , and the first distance L1 is greater than the second distance L2 .

[0077] In one embodiment, the light scattering layer 110 may have a thickness of about 15±7 micrometers to 30±7 micrometers, for example, about 25±7 micrometers. In one embodiment, the height difference between the highest point and the lowest point of the light scattering structure 111 may be about 5 micrometers to 15 micrometers.

[0078] In one embodiment, the shape of the light-scattering structure 111 may be the same as or similar to a cone or a frustum, for example, the same as or similar to a quadrangular pyramid or a quadrangular frustum. A cross section of the light-scattering structure 111 may be triangular or trapezoidal.

[0079] FIG. 2A to FIG. 2C It is a partial cross-sectional schematic diagram of a manufacturing process of a circuit board according to the second embodiment of the present invention.

[0080] Please refer to Figure 2A , similar to Figure 1A In the manner shown, a substrate 130 is provided and a circuit layer 120 is formed on a circuit region 132 of the substrate 130 .

[0081] Please continue to refer to Figure 2A , and a film is disposed on the light scattering area 131 of the substrate 130 .

[0082] In one embodiment, the membrane 280 may include a coverlay.

[0083] In one embodiment, the film 280 may include a corresponding material layer 218 , an adhesive layer 287 , and a substrate layer 288 . The film 280 may be adhered to the light scattering region 131 of the substrate 130 via the adhesive layer 287 .

[0084] Please refer to FIG. 2A to FIG. 2B The corresponding concave-convex structure can be formed on the film 280 by embossing. For example, the material layer 218 can be pressed by the embossing member 92 to form a concave-convex structure corresponding to the embossing member 92, so as to form the light-scattering layer 210 having the light-scattering structure 211.

[0085] Please refer to Figure 2B to Figure 2C After forming the light-scattering layer 210 having the light-scattering structure 211 , the stamping member 92 may be separated.

[0086] After the above-mentioned manufacturing process, the manufacturing of the circuit board 200 of this embodiment can be substantially completed.

[0087] The circuit board 200 includes a substrate 130, a circuit layer 120, and a light scattering layer 210. The light scattering layer 210 is located on the light scattering region 131 of the substrate 130. The light scattering layer 210 has a plurality of light scattering structures 211 on its top surface.

[0088] In this embodiment, the circuit board 200 may further include an adhesive layer 287 . The light diffusion layer 210 may be directly or indirectly fixed on the light diffusion region 131 of the substrate 130 via the adhesive layer 287 .

[0089] FIG. 3A to FIG. 3B It is a partial cross-sectional schematic diagram of a manufacturing process of a circuit board according to the third embodiment of the present invention.

[0090] Please refer to Figure 3A , similar to Figure 1A In the manner shown, a substrate 130 is provided and a circuit layer 120 is formed on a circuit region 132 of the substrate 130 .

[0091] Please continue to refer to FIG. 3A to FIG. 3B The light scattering layer 110 having the light scattering structure 111 may be formed by inkjet printing.

[0092] For example, Figure 3A As shown, a suitable material (such as a polymer or a corresponding reflective material) 318 can be printed on the light-scattering area 131 of the substrate 130 via a three-dimensional (3D) printing piece or other suitable printing piece 93. In addition, the printed material 318 can be cured via a curing piece (such as a UV curing lamp or other suitable lighting piece) 94 or other suitable methods, so as to Figure 3B As shown, a light scattering layer 310 having a light scattering structure 311 is formed.

[0093] After the above-mentioned manufacturing process, the manufacturing of the circuit board 300 of this embodiment can be substantially completed.

[0094] The circuit board 300 includes a substrate 130, a circuit layer 120, and a light scattering layer 310. The light scattering layer 310 is located on the light scattering region 131 of the substrate 130. The light scattering layer 310 has a plurality of light scattering structures 311 on its top surface.

[0095] Figure 4 is a partial top view of a circuit board according to an embodiment of the present invention. It is worth noting that Figure 4 It can be corresponding to Figure 1D A top view of a plurality of light scattering structures 111 on the top surface of the light scattering layer 110; or, Figure 4 It can be corresponding to Figure 2CA top view of a plurality of light scattering structures 211 on the top surface of the light scattering layer 210; or, Figure 4 It can be corresponding to Figure 3B FIG. 1 is a top view of a plurality of light scattering structures 311 on the top surface of the light scattering layer 310 in FIG.

[0096] Please refer to Figure 4 The shape of the light-scattering structure 11 may be the same as or similar to a quadrangular pyramid (e.g., a regular quadrangular pyramid). The solid line may be the lower point of the light-scattering structure 11, and the intersection of the two dotted lines (e.g., P1; not marked one by one) may be the higher point of the light-scattering structure 11.

[0097] Please continue to refer to Figure 4 The plurality of light scattering structures 11 are arranged in a plurality of rows along the first direction D1, and the light scattering structures 11 in two adjacent rows in the plurality of rows are staggered with each other.

[0098] by Figure 4 For example, a single light scattering structure 11A and a single light scattering structure 11B adjacent to each other are located in the first row. A single light scattering structure 11C and a single light scattering structure 11D adjacent to each other are located in the second row. Figure 4 As shown in FIG. 1 , the appearances of the light-scattering structures 11A, 11B, 11C and 11D are substantially identical. The first row is adjacent to the second row. In the first direction D1, the light-scattering structures 11A and 11B are substantially completely overlapped. In the first direction D1, the light-scattering structures 11C and 11D are substantially completely overlapped. In the third direction D3 perpendicular to the first direction D1, the light-scattering structures 11A and 11C adjacent to each other partially overlap, the light-scattering structures 11A and 11D adjacent to each other partially overlap, and the light-scattering structures 11B and 11D adjacent to each other partially overlap.

[0099] The circuit layer 120 and the light diffusion layer 110 are arranged along the second direction D2, and the first direction D1 is not parallel to the second direction D2. In one embodiment, the angle between the first direction D1 and the second direction D2 can be about 30° to 60°; for example, 45°. In this embodiment, the second direction D2 can be parallel to the X direction.

[0100] By configuring the light-scattering structure 11 as described above, it is possible to make the light scattering caused by the lateral light more uniform.

[0101] Figure 5A It is a partial cross-sectional schematic diagram of a backlight module according to an embodiment of the present invention. Figure 5B It is a partial top view schematic diagram of a backlight module according to an embodiment of the present invention.

[0102] It is worth noting that Figure 5A and Figure 5B In the embodiment, the circuit board 100 used is the circuit board 100 of the first embodiment as an example. In other embodiments not shown, the circuit board 100 of the second embodiment or the circuit board 100 of the third embodiment may also be used.

[0103] Please refer to Figure 5A and Figure 5B , the corresponding light emitting component 440 can be arranged on the circuit layer 120. The light emitting component 440 can be electrically connected to the corresponding circuit (such as a connection pad) in the circuit layer 120 via an appropriate conductive terminal 430. The light emitting component 440 and the circuit board 100 can form a light bar 400. In other words, the light bar 400 can include the light emitting component 440 and the circuit board 100.

[0104] Please continue to refer to Figure 5A and Figure 5B , the light guide plate 550 may be at least partially disposed on the substrate 130. The light guide plate 550 and the light bar 400 may constitute a backlight module 500. That is, the backlight module 500 may include the light guide plate 550 and the light bar 400. Figure 5B As shown, the light guide plate 550 and the light emitting element 440 are substantially arranged along the second direction D2.

[0105] At least part of the light scattering structure 111 in the light scattering layer 110 is located between the light emitting component 440 and the light guide plate 550. In this way, if the light emitted from the light emitting component 440 is not directly emitted to the light guide plate 550, it can at least be emitted into the light guide plate 550 via the light scattering structure 111 (or; further other structures or components). Figure 4 or Figure 5B The astigmatism is less concentrated in one area and is more evenly distributed.

[0106] In one embodiment, the light diffusion layer 110 may also serve as a reflector under the light guide plate 550. In one embodiment, the reflectivity of the light diffusion layer 110 may be greater than or equal to 80%; preferably greater than or equal to 90%; more preferably greater than or equal to 95%.

[0107] Figure 6 FIG. 6 is a partial exploded schematic diagram of a display screen 600 according to an embodiment of the present invention.

[0108] In this embodiment, the display screen 600 may include a backlight module 500 .

[0109] In this embodiment, the display screen 600 may further include one or more film layers or components 661 above the backlight module 500. Figure 6Only four film layers or components 661 are schematically shown in the figure, but the number, size, shape or use of the film layers or components 661 is not limited to this in the present invention, as long as they can be directly or indirectly applied to display. The film layers or components 661 may include but are not limited to: a diffusion film, a brightness enhancement film, a liquid crystal layer, a driving circuit layer, a filter layer, an adhesive layer, a protective layer, etc.

[0110] In this embodiment, the display screen 600 may further include one or more film layers or components 662 above the backlight module 500. Figure 6 Only one film layer or component 662 is schematically shown in the figure, but the present invention is not limited to the number, size, shape or purpose of the film layer or component 662, as long as it can be directly or indirectly applied to display. The film layer or component 662 may include but is not limited to: a reflective layer, an adhesive layer, a protective layer, etc.

[0111] In this embodiment, one of the display screens 600 may be a touch display screen.

[0112] In summary, since the circuit board of the present invention includes a light diffusion layer and the top surface of the light diffusion layer has a plurality of light diffusion structures, if the circuit board is used as a light emitting device (such as a light bar including the circuit board, a backlight module including the circuit board, and a display screen including the circuit board), the light emitting device can have a better light source quality.

[0113] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A circuit board, characterized in that: include: A substrate having a circuit area and a light scattering area relative to the circuit area; A circuit layer, located on the circuit area of ​​the substrate; as well as The light scattering layer is located on the light scattering area of ​​the substrate, wherein a plurality of light scattering structures are provided on the top surface of the light scattering layer.

2. The circuit board according to claim 1, characterized in that: The plurality of light scattering structures are arranged in a plurality of rows along the first direction, and the plurality of light scattering structures in two adjacent rows of the plurality of rows are staggered with each other.

3. The circuit board according to claim 2, characterized in that: The circuit layer and the light scattering layer are arranged along a second direction, and the first direction is not parallel to the second direction.

4. The circuit board according to claim 1, characterized in that: There is a first distance between the top of the light scattering layer and the substrate, there is a second distance between the top of the circuit layer and the substrate, and the first distance is greater than the second distance.

5. A light bar, characterized in that: include: The circuit board according to claim 1; as well as The light-emitting component is located on the circuit layer.

6. A backlight module, characterized in that: include: The light strip according to claim 5; as well as The light guide plate is at least partially disposed on the substrate.

7. The backlight module according to claim 6, characterized in that: At least part of the light scattering structure in the light scattering layer is located between the light emitting component and the light guide plate.

8. The backlight module according to claim 6, characterized in that: The plurality of light scattering structures are arranged in a plurality of rows along a first direction, and a configuration direction between the light guide plate and the light emitting component is not parallel to the first direction.

9. A display screen, characterized in that: include: The backlight module as claimed in claim 6.

10. A method for manufacturing a circuit board, characterized in that: include: Providing a substrate having a circuit area and a light scattering area relative to the circuit area; forming a circuit layer on the circuit area of ​​the substrate; as well as A light scattering layer having a plurality of light scattering structures on the top surface is formed on the light scattering area of ​​the substrate by transfer, embossing or spray printing.

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